JP2014084512A5 - - Google Patents

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Publication number
JP2014084512A5
JP2014084512A5 JP2012235994A JP2012235994A JP2014084512A5 JP 2014084512 A5 JP2014084512 A5 JP 2014084512A5 JP 2012235994 A JP2012235994 A JP 2012235994A JP 2012235994 A JP2012235994 A JP 2012235994A JP 2014084512 A5 JP2014084512 A5 JP 2014084512A5
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JP
Japan
Prior art keywords
copper
titanium
lens
spring member
titanium copper
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JP2012235994A
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Japanese (ja)
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JP2014084512A (en
JP6192916B2 (en
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Priority claimed from JP2012235994A external-priority patent/JP6192916B2/en
Priority to JP2012235994A priority Critical patent/JP6192916B2/en
Priority to TW102123147A priority patent/TWI475117B/en
Priority to PCT/JP2013/068260 priority patent/WO2014064969A1/en
Priority to CN201380055740.9A priority patent/CN104755642B/en
Priority to KR1020157009690A priority patent/KR101695115B1/en
Publication of JP2014084512A publication Critical patent/JP2014084512A/en
Publication of JP2014084512A5 publication Critical patent/JP2014084512A5/ja
Publication of JP6192916B2 publication Critical patent/JP6192916B2/en
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Description

本発明に係るチタン銅の一実施形態においては、0.2%耐力が1100MPa以上である。

In one embodiment of the titanium copper according to the present invention , 0 . The 2% proof stress is 1100 MPa or more.

Claims (6)

Tiを2.0〜4.0質量%含有し、第三元素としてFe、Co、Mg、Si、Ni、Cr、Zr、Mo、V、Nb、Mn、B、及びPからなる群から選択された1種以上を合計で0〜0.5質量%含有し、残部が銅及び不可避的不純物からなり、EBSD測定における結晶方位解析において、KAM値が1.5〜3.0であるチタン銅。   It contains 2.0 to 4.0% by mass of Ti, and is selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P as the third element. 1 to 0.5 mass% in total, the balance being copper and unavoidable impurities, titanium copper having a KAM value of 1.5 to 3.0 in the crystal orientation analysis in EBSD measurement. .2%耐力が1100MPa以上である請求項1に記載のチタン銅。 0 . Titanium copper according to claim 1, wherein the 2% proof stress is 1100 MPa or more. 請求項1又は2に記載のチタン銅を備えた伸銅品。   A rolled copper product comprising the titanium-copper according to claim 1 or 2. 請求項1又は2に記載のチタン銅を備えた電子部品。   The electronic component provided with the titanium copper of Claim 1 or 2. 電子機器部品がオートフォーカスカメラモジュールである請求項4に記載の電子部品。   The electronic component according to claim 4, wherein the electronic device component is an autofocus camera module. レンズと、このレンズを光軸方向の初期位置に弾性付勢するばね部材と、このばね部材の付勢力に抗する電磁力を生起して前記レンズを光軸方向へ駆動可能な電磁駆動手段を備え、前記ばね部材が請求項1又は2に記載のチタン銅であるオートフォーカスカメラモジュール。   A lens, a spring member that elastically biases the lens to an initial position in the optical axis direction, and an electromagnetic drive means that can drive the lens in the optical axis direction by generating an electromagnetic force that resists the biasing force of the spring member An autofocus camera module, wherein the spring member is titanium copper according to claim 1.
JP2012235994A 2012-10-25 2012-10-25 High strength titanium copper Active JP6192916B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012235994A JP6192916B2 (en) 2012-10-25 2012-10-25 High strength titanium copper
TW102123147A TWI475117B (en) 2012-10-25 2013-06-28 High strength titanium and copper
KR1020157009690A KR101695115B1 (en) 2012-10-25 2013-07-03 High-strength titanium-copper alloy
CN201380055740.9A CN104755642B (en) 2012-10-25 2013-07-03 High-strength titanium-copper alloy
PCT/JP2013/068260 WO2014064969A1 (en) 2012-10-25 2013-07-03 High-strength titanium-copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012235994A JP6192916B2 (en) 2012-10-25 2012-10-25 High strength titanium copper

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016092736A Division JP2016172929A (en) 2016-05-02 2016-05-02 High-strength titanium-copper

Publications (3)

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JP2014084512A JP2014084512A (en) 2014-05-12
JP2014084512A5 true JP2014084512A5 (en) 2014-11-13
JP6192916B2 JP6192916B2 (en) 2017-09-06

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JP2012235994A Active JP6192916B2 (en) 2012-10-25 2012-10-25 High strength titanium copper

Country Status (5)

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JP (1) JP6192916B2 (en)
KR (1) KR101695115B1 (en)
CN (1) CN104755642B (en)
TW (1) TWI475117B (en)
WO (1) WO2014064969A1 (en)

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JP5718436B1 (en) * 2013-11-18 2015-05-13 Jx日鉱日石金属株式会社 Titanium copper for electronic parts
JP5718443B1 (en) * 2013-12-27 2015-05-13 Jx日鉱日石金属株式会社 Titanium copper for electronic parts
CN104278171B (en) * 2014-09-16 2016-09-07 中南大学 A kind of CuTi series elastic copper alloy and preparation method thereof
JP6080823B2 (en) * 2014-09-19 2017-02-15 Jx金属株式会社 Titanium copper for electronic parts
JP6080822B2 (en) * 2014-09-19 2017-02-15 Jx金属株式会社 Titanium copper for electronic parts and manufacturing method thereof
JP6391618B2 (en) * 2016-03-24 2018-09-19 Jx金属株式会社 Titanium copper foil and manufacturing method thereof
JP6494681B2 (en) * 2017-03-27 2019-04-03 Jx金属株式会社 Copper alloy and electronic parts for electronic materials
JP6609590B2 (en) 2017-03-30 2019-11-20 Jx金属株式会社 High-strength titanium copper strip and foil having a layered structure
JP6609589B2 (en) * 2017-03-30 2019-11-20 Jx金属株式会社 High-strength titanium copper strip and foil having a layered structure
JP6745859B2 (en) * 2018-11-09 2020-08-26 Jx金属株式会社 Titanium copper foil, copper products, electronic device parts and autofocus camera modules
CN113802026B (en) * 2021-09-18 2022-06-14 宁波博威合金板带有限公司 Titanium bronze strip and preparation method thereof

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JP4025632B2 (en) 2002-11-29 2007-12-26 日鉱金属株式会社 Copper alloy
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JP4451336B2 (en) 2005-03-23 2010-04-14 日鉱金属株式会社 Titanium copper and method for producing the same
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JP6192917B2 (en) * 2012-10-25 2017-09-06 Jx金属株式会社 High strength titanium copper

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