JP2014073522A - Laser beam machining apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which can highly efficiently perform laser beam machining by eliminating debris generated during laser beam machining.SOLUTION: Pulsed light oscillated by a laser oscillator 3 is condensed by a condenser lens 5 to a workpiece. A pair of electrodes 6, 7 supply an optical path L between the condenser lens 5 and the workpiece 2 with explosion energy due to spark and eliminates debris generated from the workpiece 2 during laser beam machining from the optical path L. Thus, the workpiece 2 is irradiated with the pulsed light which is oscillated by the laser oscillator 3 and is not absorbed by the debris.

Description

  The present invention relates to a laser processing apparatus.

2. Description of the Related Art Conventionally, there has been known a laser processing apparatus that irradiates a workpiece with laser light and processes fine grooves or fine holes. In laser processing, processing scattered matter (hereinafter referred to as “debris”) is generated from the workpiece by laser ablation when the workpiece is irradiated with laser light.
The laser processing apparatus described in Patent Document 1 generates a swirl flow by assist gas around a processing point at which a workpiece is irradiated with laser light, and sucks debris generated during laser processing together with the assist gas to a nozzle. Yes. At this time, the liquid debris having a relatively large mass moves to the outside of the swirling flow due to the centrifugal force and is excluded from the optical path of the laser beam.

JP 2004-337947 A

By the way, when the pulse width of the laser beam used in the laser processing apparatus is set to an ultrashort pulse of, for example, 10 picoseconds or less, debris generated at the time of laser processing becomes powder with small particles and moves at high speed. In this case, in the technique described in Patent Document 1, it is difficult to suck the debris into the nozzle because the energy of the air that sucks the debris is smaller than the energy that the debris moves. When debris that has not been collected by the nozzle is present on the optical path of the laser light, the debris absorbs the energy of the laser light, resulting in a problem that the processing efficiency is lowered.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing apparatus that can eliminate debris generated during laser processing and perform laser processing with high efficiency.

The present invention provides a laser processing apparatus for performing processing by irradiating a workpiece with light oscillated from a laser oscillator, supplying energy by condensing or sparking to an optical path between a condenser lens and the workpiece, Debris generated from the workpiece during laser processing is excluded from the optical path.
Explosion energy due to light collection or sparks causes air expansion and eliminates debris from the optical path. Thereby, the light oscillated from the laser oscillator is irradiated onto the workpiece without being absorbed by the debris. Therefore, the energy loss of the light oscillated from the laser oscillator is reduced, and the processing efficiency of laser processing can be increased.

It is a block diagram of the laser processing apparatus by 1st Embodiment of this invention. It is a graph which shows the relationship between the pulsed light of a laser oscillator, and the spark of an electrode. It is a block diagram of the laser processing apparatus by 2nd Embodiment of this invention. It is a block diagram of the laser processing apparatus by 3rd Embodiment of this invention. It is the principal part enlarged view seen from the V direction of FIG. It is a block diagram of the laser processing apparatus by 4th Embodiment of this invention. It is a graph which shows the relationship between the pulsed light of a 1st laser oscillator, and the pulsed light of a 2nd laser oscillator. It is a block diagram of the laser processing apparatus by 5th Embodiment of this invention. It is a block diagram of the laser processing apparatus by 6th Embodiment of this invention. It is a block diagram of the laser processing apparatus by 7th Embodiment of this invention. It is a principal part enlarged view of the XI-XI line of FIG. It is a block diagram of the laser processing apparatus by 8th Embodiment of this invention. It is a block diagram of the laser processing apparatus by a reference form. It is a principal part enlarged view of the XIV-XIV line | wire of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
A first embodiment of the present invention is shown in FIGS. The laser processing apparatus 1 according to the present embodiment irradiates a workpiece 2 such as a metal or a semiconductor with laser light, and processes a minute groove or a minute hole in the workpiece 2 by laser ablation.

As shown in FIG. 1, the laser processing apparatus 1 includes a laser oscillator 3, a mirror 4, a condenser lens 5, a pair of electrodes 6, 7, a switch 8, and the like.
The laser oscillator 3 oscillates ultrashort pulse light having a pulse width of 10 picoseconds or less. The light oscillated by the laser oscillator 3 is reflected by the mirror 4 and irradiated toward the workpiece 2 placed on the mounting table 9.
A condensing lens 5 provided between the mirror 4 and the workpiece 2 condenses the light oscillated by the laser oscillator 3 on the processing point 10 of the workpiece 2. At the processing point 10 of the workpiece 2, as the plasma is generated, surface constituent materials are explosively released as molecules, atoms, clusters, and the like. Thereby, for example, fine grooves or fine holes having a diameter of several tens to several hundreds of μm are processed at the processing point 10 of the workpiece 2. During this laser processing, powdery debris with small particles is generated from the processing point 10 of the workpiece 2.

The pair of electrodes 6 and 7 are provided so as to spark on or around the optical path between the condenser lens and the workpiece 2. Here, “around the optical path” means a range in which the explosion energy generated by the spark can be supplied to the optical path. In FIG. 1, the optical path of the pulsed light oscillated by the laser oscillator 3 is indicated by a symbol L.
When the switch 8 electrically connected to the electrodes 6 and 7 is turned on, a voltage is applied from the power source 11 to the electrodes 6 and 7, and a spark is generated between the electrodes. As indicated by an arrow A, debris is removed from the optical path by the explosion energy of the spark, that is, the expansion and impact force of air. The spark between the electrodes is preferably performed in the vicinity of the processing point 10 of the workpiece 2.
In the first embodiment, the electrodes 6, 7, the switch 8, and the power source 11 constitute “exclusion means” described in the claims.

The control means 12 is composed of a computer or the like, and controls the irradiation of the pulsed light from the laser oscillator 3 and the on / off of the switch 8 of the electrodes 6 and 7 to be synchronized.
As shown in FIG. 2, the control means 12 turns on the switch 8 of the electrodes 6 and 7 when the laser oscillator 3 is not irradiating pulse light. Thereby, a spark is generated between the electrodes, and the explosion energy is supplied to the optical path of the pulsed light.
On the other hand, the control means 12 turns off the switch 8 of the electrodes 6 and 7 when the laser oscillator 3 is emitting pulsed light. Thereby, the spark between electrodes disappears.

A method for processing the workpiece 2 by the laser processing apparatus 1 will be described.
The workpiece 2 is placed on the mounting table 9, and pulsed light is oscillated from the laser oscillator 3. The pulsed light is reflected by the mirror 4 and condensed by the condenser lens 5 on the processing point 10 of the workpiece 2. Thereby, laser processing is performed on the processing point 10 of the workpiece 2 and debris is scattered from the processing point 10.

When the laser oscillator 3 is not emitting pulsed light, the control means 12 turns on the switch 8 of the electrodes 6 and 7. Then, a spark is generated between the electrodes, and debris is excluded from the optical path as indicated by an arrow A by the explosion energy.
Next, when the laser oscillator 3 emits pulse light, the control means 12 turns off the switch 8 of the electrodes 6 and 7. At this time, the workpiece 2 is directly irradiated with the pulsed light without the presence of debris on the optical path of the pulsed light.
Pulsed light is intermittently applied to the workpiece 2 from the laser oscillator 3, and fine grooves or fine holes are formed at the processing points 10 of the workpiece 2.

The first embodiment has the following operational effects.
(1) In the first embodiment, the explosion energy by the spark is supplied to the optical path of the pulsed light oscillated from the laser oscillator 3, and debris is excluded from the optical path. As a result, the light oscillated by the laser oscillator 3 is irradiated to the workpiece 2 without being absorbed by the debris. Therefore, the energy loss of the light irradiated to the workpiece 2 from the laser oscillator 3 is reduced, and the processing efficiency of laser processing can be increased.

(2) The first embodiment has a pair of electrodes 6 and 7 that spark on or around the optical path. Thereby, debris can be excluded from an optical path by supplying the explosion energy by a spark, ie, the expansion and impact force of air, to an optical path.

(3) In the first embodiment, the control means 12 synchronizes the pulsed light oscillated by the laser oscillator 3 and the on / off of the switch 8 of the electrodes 6, 7. As a result, the pulsed light emitted from the laser oscillator 3 is stopped, and debris is removed from the optical path by the spark until the next pulsed light is emitted. Therefore, when the laser oscillator 3 oscillates pulsed light, the workpiece 2 can be irradiated with the pulsed light with high efficiency without the presence of debris on the optical path.
Further, the processing efficiency of laser processing can be increased without buffering the pulsed light used for laser processing and the spark.

(Second Embodiment)
A second embodiment of the present invention is shown in FIG. Hereinafter, in the plurality of embodiments, substantially the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.
In 2nd Embodiment, the laser processing apparatus is provided with the container 13 as an atmospheric | air pressure storage means. The container 13 is provided between the condenser lens 5 and the workpiece 2. The container 13 has a transmission part 14 that can transmit the pulsed light emitted from the laser oscillator 3. The container 13 is provided with an opening 15 on the workpiece 2 side. The container 13 is sealed except for the opening, and can store high-pressure air inside thereof.
The pair of electrodes 6 and 7 are attached to the opening 15 of the atmospheric pressure storage means.

Also in the second embodiment, the control means 12 controls the pulsed light irradiation of the laser oscillator 3 and the on / off of the switch 8 of the electrodes 6 and 7 to be synchronized.
In the second embodiment, at the start of laser processing, the air pressure inside the container 13 is increased by the explosion energy of the spark generated between the electrodes. During this time, the amount of debris that enters the inside of the container 13 is negligibly small.

When the atmospheric pressure inside the container 13 increases, the pressure generated by the explosion energy due to the spark propagates from the inside of the container 13 to the outside. Therefore, debris generated from the workpiece 2 is excluded from the optical path due to a pressure difference between the inside and the outside of the container 13 as indicated by an arrow B.
In the second embodiment, by providing the container 13 on the optical path of the pulsed light oscillated by the laser oscillator 3, it is possible to eliminate debris on the optical path inside and outside the container 13. Therefore, the workpiece 2 can be irradiated with pulsed light oscillated by the laser oscillator 3 with high efficiency.

(Third embodiment)
A third embodiment of the present invention is shown in FIGS. In the third embodiment, the laser processing apparatus includes four pairs of one pair of electrodes.
A pair of electrodes 6, 7 provided to spark on or around the optical path between the condenser lens 5 and the workpiece 2 is referred to as a first electrode set 6, 7.
The electrodes arranged so as to move away from the optical path in one direction are referred to as second electrode set 16, 17, third electrode set 18, 19, and fourth electrode set 20, 21 in this order.
The first to fourth electrode sets are connected to power supplies 11, 22, 23, 24 and switches 8, 25, 26, 27, respectively.
The second electrode sets 16, 17, the power source 22 and the switch 25 constitute “second exclusion means” described in the claims.
The control means 12 controls the irradiation of the pulsed light from the laser oscillator 3 and the on / off of the switches of the first to fourth electrode sets in synchronization.

During laser processing, the pulsed light oscillated from the laser oscillator 3 is focused on the processing point 10 of the workpiece 2. At this time, the control means 12 turns off the switches of the first electrode sets 6 and 7.
When the laser oscillator 3 is not radiating pulsed light, the control means 12 turns on the switches of the first electrode sets 6 and 7. Then, debris is excluded from the optical path by the explosion energy of the sparks of the first electrode sets 6 and 7. The debris excluded from the optical path moves farther than the second electrode sets 16 and 17.

Subsequently, the control means 12 turns on the switches of the second electrode sets 16 and 17. Then, the debris removed from the optical path due to the spark explosion energy of the second electrode set 16, 17 moves further away from the position. In this way, when the control means 12 turns on the switches of the third electrode sets 18 and 19 and the fourth electrode sets 20 and 21 in order, the debris moves far from the optical path as indicated by an arrow C.
Therefore, when the laser oscillator 3 next irradiates the pulsed light, the workpiece 2 is directly irradiated with the pulsed light without the presence of debris on the optical path of the pulsed light.

In the third embodiment, the debris excluded from the optical path by the sparks of the first electrode sets 6 and 7 moves further away from the optical path by the sparks of the second to fourth electrode sets. Therefore, debris once removed from the optical path can be prevented from returning to the optical path again.
In the third embodiment, the laser processing apparatus only needs to include two or more electrode sets.
Further, in the configuration of the third embodiment, when the workpiece 2 is moved and the workpiece 2 is linearly processed, the moving direction is viewed from the first electrode sets 6 and 7 as indicated by an arrow D. It is preferable to move to the opposite side of the second electrode set 16,17.

(Fourth embodiment)
A fourth embodiment of the present invention is shown in FIGS. In the fourth embodiment, the laser processing apparatus does not include a pair of electrodes and a switch. Instead, the laser processing apparatus includes a second laser oscillator 30, a second condenser lens 31, a shielding plate 28, and the like.
In 4th Embodiment, the 2nd laser oscillator 30 and the 2nd condensing lens 31 comprise the "exclusion means" as described in a claim.
In the fourth embodiment, the laser oscillator 3 that irradiates the workpiece 2 with pulsed light is referred to as a first laser oscillator 3.

The light oscillated by the second laser oscillator 30 is condensed by the second condenser lens 31 around or around the optical path of the pulsed light oscillated by the first laser oscillator 3.
Here, “around the optical path” refers to a range in which the explosion energy by condensing can be supplied to the optical path of the pulsed light oscillated by the first laser oscillator 3.
When the light oscillated by the second laser oscillator 30 is condensed, as shown by an arrow E, the optical path of the pulsed light oscillated by the first laser oscillator 3 due to the explosion energy, that is, the expansion and impact force of the air. Debris is removed from The light oscillated by the second laser oscillator 30 is preferably collected in the vicinity of the processing point 10 of the workpiece 2.
The light oscillated by the second laser oscillator 30 is collected and then irradiated on the shielding plate 28.

The control unit 12 controls the pulsed light irradiation of the first laser oscillator 3 and the pulsed light irradiation of the second laser oscillator 30 to be synchronized.
As shown in FIG. 7, the control means 12 causes the second laser oscillator 30 to emit pulsed light when the first laser oscillator 3 is not irradiated with pulsed light. As a result, the explosion energy generated by condensing the pulsed light from the second laser oscillator 30 is supplied to the optical path of the pulsed light from the first laser oscillator 3.
On the other hand, the control means 12 stops the irradiation of the pulsed light of the second laser oscillator 30 when the first laser oscillator 3 is irradiating the pulsed light.

(1) In the fourth embodiment, explosion energy generated by the collection of the pulsed light from the second laser oscillator 30 is supplied to the optical path of the pulsed light oscillated from the first laser oscillator 3, and debris is eliminated from the optical path. Thereby, the light oscillated by the first laser oscillator 3 is irradiated to the workpiece 2 without being absorbed by the debris. Therefore, the energy loss of the light irradiated to the workpiece 2 from the first laser oscillator 3 is reduced, and the processing efficiency of laser processing can be increased.

(2) In the fourth embodiment, the pulse light of the second laser oscillator 30 is collected on or around the optical path of the pulse light of the first laser oscillator 3. Thereby, debris can be excluded from the optical path by supplying the explosion energy due to the condensing to the optical path of the pulsed light of the first laser oscillator 3.

(3) In the fourth embodiment, the control means 12 synchronizes the pulsed light oscillated by the first laser oscillator 3 and the pulsed light oscillated by the second laser oscillator 30. Thereby, the pulsed light oscillated from the first laser oscillator 3 is stopped, and debris is excluded from the optical path during the time until the next pulsed light is transmitted. Therefore, when the first laser oscillator 3 irradiates the pulsed light, the workpiece 2 can be efficiently irradiated with the pulsed light without the presence of debris on the optical path.

(Fifth embodiment)
A fifth embodiment of the present invention is shown in FIG. In the fifth embodiment, the laser processing apparatus includes a beam sampler 32 serving as a spectroscopic mirror, a second condenser lens 31, and a delay unit 33. In the fifth embodiment, the beam sampler 32, the second condenser lens 31, and the delay unit 33 constitute an “exclusion unit” recited in the claims.
The beam sampler 32 is provided in the optical path between the laser oscillator 3 and the condenser lens 5, reflects a part of the light oscillated by the laser oscillator 3, and transmits the remaining light. In FIG. 8, the optical path of the light reflected by the beam sampler 32 is indicated by a symbol L2.
The reflected light reflected by the beam sampler 32 passes through the delay means 33, is reflected by the second mirror 29, passes through the collimator 34, and then passes through the beam sampler 32 by the second condenser lens 31. Alternatively, the light is collected around the optical path. As shown by the arrow F, debris is excluded from the optical path by the explosion energy by the collection of the reflected light, that is, the expansion and impact force of the air.

  The delay means 33 is composed of a plurality of mirrors, and makes the light travel distance longer. The delay means 33 delays the time until the reflected light reflected by the beam sampler 32 reaches a position where it is collected. For this reason, when the workpiece 2 is irradiated with the pulsed light transmitted through the beam sampler 32, the reflected light reflected by the beam sampler 32 is not condensed. On the other hand, when the pulsed light transmitted through the beam sampler 32 is not irradiated on the workpiece 2, the reflected light reflected by the beam sampler 32 is collected. This timing is the same as that shown in FIG. 7 of the fourth embodiment.

  In the fifth embodiment, one laser oscillator 3 can eliminate laser processing and debris. Furthermore, the control means 12 for synchronizing the two laser oscillators installed in the fourth embodiment can be eliminated. Therefore, the manufacturing cost of the laser processing apparatus can be reduced.

(Sixth embodiment)
A sixth embodiment of the present invention is shown in FIG. In the sixth embodiment, the laser processing apparatus includes a container 13 as an atmospheric pressure storage unit. The container 13 includes a first transmission portion 14 that can transmit the pulsed light transmitted from the laser oscillator 3 through the beam sampler 32. In addition, the container 13 includes a second transmission portion 35 that can transmit the reflected light reflected by the beam sampler 32 from the laser oscillator 3. The container 13 is provided with an opening 15 on the workpiece 2 side, and other than the opening is sealed.

In the sixth embodiment, the reflected light reflected by the beam sampler 32 passes through the second transmission part 35 and is condensed inside the container 13 during laser processing. Therefore, the atmospheric pressure inside the container 13 is increased by the explosion energy generated by this light collection.
When the air pressure inside the container 13 becomes high, the pressure generated by the explosion energy due to the condensed light propagates from the inside of the container 13 to the outside. Therefore, as shown by an arrow G, debris generated from the workpiece 2 is excluded from the optical path due to a pressure difference between the inside and the outside of the container 13.
In the sixth embodiment, by providing the container 13 on the optical path of the pulsed light oscillated by the laser oscillator 3, it is possible to eliminate debris on the optical path inside and outside the container 13. Therefore, it is possible to irradiate the workpiece 2 with the pulsed light that is oscillated by the laser oscillator 3 and transmitted through the beam sampler 32 with high efficiency.

(Seventh embodiment)
A seventh embodiment of the present invention is shown in FIGS. In the seventh embodiment, the laser processing apparatus includes a water flow generator 36 and a water flow recovery device 37 as debris recovery means.
The water flow generator 36 creates a water flow 38 around the processing point 10 of the workpiece 2, and the water flow recovery device 37 recovers the water flowed by the water flow generator 36.

As shown in FIG. 11, the water flow 38 created by the water flow generator 36 has two arcs when the workpiece 2 is viewed from above. Electrodes 6 and 7 are provided between the arc-shaped water streams 38. The debris generated by the laser processing is excluded from the optical path by the explosion energy caused by the spark between the electrodes. The debris moves as indicated by an arrow H, enters the water flow created by the water flow generator 36, and is collected by the water flow collector 37 together with the water flow.
In the seventh embodiment, the debris excluded from the optical path is recovered with a liquid. Therefore, debris once removed from the optical path can be prevented from returning to the optical path again.
In the seventh embodiment, instead of sparking by the electrodes 6 and 7, debris may be excluded from the optical path by using explosion energy by condensing.

(Eighth embodiment)
FIG. 12 shows an eighth embodiment of the present invention. In the eighth embodiment, the laser processing apparatus performs laser processing on a rod-shaped workpiece 39 such as a wire.
In this case, the water flow generator 36 can create a water flow 38 from the processing point 10 of the workpiece 39 to the mounting table 9 side from the condenser lens 5 side. Therefore, the debris removed from the optical path by the spark between the electrodes is reliably recovered by the water flow 38 created by the water flow generator 36. Therefore, debris once removed from the optical path can be prevented from returning to the optical path again.

(Reference form)
A reference embodiment of the present invention is shown in FIGS. In the reference embodiment, the laser processing apparatus includes the water flow generator 36 and the water flow recovery device 37, but does not include means for sparking or condensing the light path of the pulsed light oscillated by the laser oscillator 3. As shown in FIG. 14, the water flow created by the water flow generator 36 is a circle surrounding the processing point as seen from above.
Also in this configuration, the debris scattered from the workpiece 39 by the laser processing moves as indicated by the arrow I and is collected in the water flow 38 created by the water flow generator 36. Therefore, it is possible to reduce the amount of debris existing on the optical path of the pulsed light oscillated by the laser oscillator 3. Therefore, the energy loss of the light irradiated to the workpiece 39 from the laser oscillator 3 is reduced, and the processing efficiency of laser processing can be increased.

(Other embodiments)
In the above-described embodiment, sparking or condensing is performed at one place on the optical path of the pulsed light oscillated by the laser oscillator 3 or in the vicinity thereof. On the other hand, in other embodiments, sparking or condensing may be performed at a plurality of locations on the optical path of the pulsed light or at a plurality of locations in the vicinity thereof. Further, a plurality of times of discharging or condensing may be performed while the pulse light of the laser oscillator 3 is not irradiated.

In the third embodiment described above, the laser processing apparatus includes a plurality of sets of electrodes as the second exclusion unit. On the other hand, in another embodiment, the laser processing apparatus may be configured to include a plurality of sets of the second laser oscillator 30 and the second condenser lens 31 as second exclusion means.
As described above, the present invention is not limited to the above-described embodiment, and can be implemented in various forms within the scope of the invention in addition to combining the plurality of embodiments.

DESCRIPTION OF SYMBOLS 1 ... Laser processing apparatus 2 ... Work piece 3 ... Laser oscillator 5 ... Condensing lens 6, 7 ... Electrode (exclusion means)
8 ... Switch (exclusion means)
11 ・ ・ ・ Power supply (exclusion means)
30 ... Second laser oscillator (exclusion means)
31 ... Second condenser lens (exclusion means)
32 ... Beam sampler (spectral mirror, exclusion means)

Claims (10)

In the laser processing apparatus (1) for performing laser processing by irradiating light on the workpiece (2),
A laser oscillator (3) for oscillating pulsed light;
A condenser lens (5) for condensing the light oscillated by the laser oscillator onto the workpiece;
Exclusion means (6, 6) for supplying energy by condensing or sparking to the optical path (L) between the condensing lens and the workpiece and for eliminating debris generated from the workpiece during laser processing from the optical path 7, 8, 11, 30, 31, 32, 33).   The exclusion means (6, 7, 8, 11) generates a spark on or around the optical path between the condensing lens and the workpiece, and supplies explosive energy due to the spark to the optical path. The laser processing apparatus according to claim 1.   The exclusion means (30, 31, 32, 33) collects light on or around the optical path between the condensing lens and the workpiece, and supplies explosion energy by condensing to the optical path. The laser processing apparatus according to claim 1. The exclusion means (30, 31)
A second laser oscillator (30) for oscillating pulsed light;
The second condensing lens (31) for condensing the pulsed light oscillated from the second laser oscillator on or around the optical path of the light oscillated from the laser oscillator. The laser processing apparatus as described. The exclusion means (31, 32, 33)
A spectroscopic mirror (32) that transmits a part of the light oscillated from the laser oscillator and reflects the remaining light between the laser oscillator and the condenser lens;
A second condenser lens (31) for condensing the reflected light reflected by the spectroscopic mirror on the optical path of the light transmitted through the spectroscopic mirror;
The laser processing apparatus according to claim 3, further comprising delay means (33) capable of delaying a time for the reflected light reflected by the spectroscopic mirror to reach a position where the light is collected.   The control means (12) which can synchronize the pulsed light which the said laser oscillator oscillates, and the energy supply by the condensing or spark of the said exclusion means is provided. The laser processing apparatus according to item. The control means includes
When the laser oscillator is not radiating pulsed light, supply energy by condensing or sparking from the exclusion means to the optical path of the pulsed light of the laser oscillator,
7. The laser processing according to claim 6, wherein when the laser oscillator irradiates pulse light, energy supply by condensing or sparking from the exclusion means to the optical path of the pulse light of the laser oscillator is stopped. apparatus.   It has a transmission part (14) that transmits light emitted from the laser oscillator and an opening part (15) that opens toward the workpiece, and is expanded by the energy of the condensing or sparking of the exclusion means. The laser processing apparatus according to any one of claims 1 to 7, further comprising an atmospheric pressure storage means (13) capable of storing the performed air.   After the exclusion means generates or collects a spark, it is possible to supply energy from the spark to a position farther from the optical path than the spark position by the exclusion means or the light collection position, and to move the debris further outside the optical path The laser processing apparatus according to any one of claims 1 to 7, further comprising a second excluding means (16, 17, 22, 25).   The laser processing apparatus according to any one of claims 1 to 9, further comprising a debris collection unit (36, 37) for flowing a liquid in a vicinity of a position where the workpiece is irradiated with light.

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