1356744 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種雷射加工裝置，特別是有關於一 種利用震波擾動雷射加工部位之碎屑並配合流體的流動而 排除之雷射加工裝置。 【先前技術】 請參照圖1A所繪示先前技術之應用雷射加工蝕除的 裝置示意圖。其係世界知識產權組織（WIPO)公開號之W0 2005/120763號專利案則揭示一種蝕除的方法和裝置，包括 在雷射加工的工作區域中設置一碎片排出模組10，以氣體 流動的方式將碎屑排出該工作區域。 另外，請參閱圖1B所繪示先前技術之雷射加工裝置示 意圖。其係美國專利公開號US 2007/0145026專利案揭示 一種雷射加工裝置及使用此裝置的雷射加工方法，該裝置 具有一雷射光對加工件進彳于雷射加工，以及一渦流產生機 構設置於該雷射光路與加工件之工作區域上，在雷射加工 時，將流體導入該渦流產生機構，以使流體產生渦流方式 將雷射加工之碎屑排出。 上述兩種雷射加工裝置可用於一般加工件之加工表面 的雷射加工碎屑清除，惟對於高深寬比的雷射鑽孔的除屑 能力效果有限。 【發明内容】 本發明之技術手段在於提供一種雷射加工裝置，係適 用π;、對一丄一力口丄囬4丁宙削刀口丄TF呆，丹宙别刀口丄 1356744 裝置包含：一雷射產生模組.，係可輸出一雷射光且可重塑 雷射光而形成一雷射光斑照射於加工面；一流體流動模 組，係使其流動之流體在該加工面之受該雷射光斑照射區 域通過；一震波產生模組，係產生通過該工件的震波，以 形成震幅；以及一控制模組，係電性連接雷射產生模組、 流體流動模組與震波產生模組，以控制流體流動模組之作 動及雷射光與震波的觸發時程。 本發明之另一技術手段在於提供一種雷射加工方法， $ 適於對一工件加工面進行雷射加工，雷射加工方法包含下 列步驟：啟動一流體流動模組，以輸出流體至加工面；進 行雷射加工，將一雷射產生模組輸出之雷射光斑照射於加 工面；以及進行震波擾動，以一震波產生模組觸發震波， 以對工件進行擾動，將雷射加工產生之碎屑自加工面底部 移出，並由流體排除。 ' 【實施方式】 本發明所要解的問題在於提供一種雷射加工裝置，以 鲁擾動加工件的方式將累積在加工區域内的加工碎屑移出， : 以利流動之流體排除。而本發明之特點係在於可同步移除 : 雷射加工碎屑，提高加工效率，並可進行高深比（5:1或以 上）之微孔洞與微通道之雷射微細加工。 茲配合實施例及圖示說明如下： 請參照圖2所繪示本發明之雷射加工裝置實施例之系 統示意圖。其中適用於對一工件20加工面21進行雷射加 工，該雷射加工裝置包含：一雷射產生模組30，雷射產生 1356744 模組30係包含一雷射產生器31及一光學系統32，該雷射 產生器31係輸出雷射光，該光學系統32係設置於該雷射 光之光路上，並可對該雷.射光進行擴束、聚焦或整形等適 合的雷射光斑33來照射在該加工面21，以進行雷射加工； 一流體流動模組40，係使其流動之流體接觸該加工面之受 該雷射光斑照射區域，該流體流動模組之流體係可為液 體、氣體或液氣複合式流體，且該流體流動模組之作用方 式係為吹式、吸式或吹吸複合式；一震波產生模組50，係 使產生一震波通過該工件；以及一控制模組60，係分別電 性連接該雷射產生模組30、流體流動模組40及震波產生 模組50，以控制該流體流動模組40之作動時機，以及觸 發雷射產生模組30之雷射光與震波產生模組50之震波的 時程。 上述實施例之該震波產生模組50原則上係可為無錐 管的實施方式，利用震波產生模組50所產生的震盪波經空 氣介質傳遞到工件20，但為了使震盪波的能量不致四處發 散，震波產生模組50亦可包含一向工件20 —側延伸之錐 管51，該錐管51末端之一大徑管口係抵止於該工件20之 該加工面21的背面22並將該工件20真空吸附或以膠合或 是以機械方式固持，以與該工件20緊密接觸，使震波有效 傳遞至該工件20，並將有效震動區域擴充至被大徑管口涵 蓋的區域。該錐管51的大徑管口對工件20的覆蓋區域係 涵蓋該加工面21之上述的雷射加工加工區域。 續請參照圖3所繪示本發明之雷射加工方法實施例之 流程圖，並同時參照圖2之系統示意圖。其雷射加工方法， 1356744 適於對一工件20之一加工面21進行雷射加工，該雷射加 工方法包含： 啟動-流體錢模組40,用以輪出—流體至該加工面 21(步驟S〗00)，藉由該流動之流體對雷射加工所產生的碎 屑進行排除； 進行雷射加工’將1射產生模組3G輪出的—雷射光 斑33照射於該加工面21(步驟Su〇)，以進行雷射加工； 以及 進行震波擾動，以一震波產生模組5〇觸發一震波，以 對該工件20進行擾動，將該雷射加工產生之碎屑p自該加 工面21的底部移出至高處，並由該流體流動模組進行排除 (步驟 S120)。 上述實施例之工件20材料係可為金屬材料或複合材 料等可撓式或不可撓式的材料’例如：矽(silicon)材、玻璃 材料、金屬材料、高分子材料或壓電材料等。 續請參照圖4A〜4C所繪示本發明之雷射加工方法之雷 射震波不同步實施例之雷射產生模組、震波產生模組以及 流體流動模組的時序圖，並配合著對應上圖的圖5A係圖 4A之雷射加工時啟動雷射產生模組ST1之動作示意圖；圖 5B係圖4B之啟動震波產生模組ST2之動作示意圖；圖5C 係圖4C之啟動流體流動模组之作動示意圖。上述實 施例中，該進行雷射加工步驟（步驟S110)與該進行震波擾 動步驟（步驟S120)係進行於不同時序，且上述之兩步驟係 首先進行進行雷射加工步驟’其過程中雷射光斑33會在工 件20之加工面21的加工部位產生碎屑P，在停止激發雷 7 1356744 射後，再進行震波擾動步驟，將加工位置底部的碎屑P向 上帶出，上述兩步驟互相錯開，但在進行上述兩步驟的整 個過程中，流體流動模組40係全程啟動著，以便應用流體 F排出由震波擾動步驟所帶出的碎屑P。 續請參照圖6A〜6C所繪示本發明之雷射加工方法之雷 射震波同步實施例之雷射產生模組、震波產生模組以及流 體流動模組的時序圖，及圖7A繪示雷射加工時啟動雷射 產生模組ST1與啟動震波產生模組ST2之動作示意圖；圖 7B繪示在圖7A動作之後的啟動流體流動模組ST3之作動 示意圖。本實施例中，進行雷射加工步驟（步驟S110)與進 行震波擾動步驟（步驟S120)係可進行於相同時序之中，即 在進行雷射加工步驟過程中，雷射產生模組激發雷射產生 雷射光斑33時，同步以震波產生模組50觸發震波，使得 在工件2(Γ之加工面21的加工部位產生碎屑P後，隨即被 震波向上帶出，並由流體流動模組40之流體F排除。當然， 上述整個過程_，流體流動模組40同樣係全程啟動，以便 隨時排除碎屑Ρ。 上述實施例中，該雷射產生模組30係以一雷射產生器 31脈衝輸出一雷射光，並應用一光學系統32係對該雷射. 光進行擴束、聚焦或整形，以形成該雷射光斑。 上述實施例中，該雷射光波長為100 nm至20 μπι。該 震波產生模組之震波頻率為IK Hz至1Μ Hz。 綜上所述，乃僅記載本發明為呈現解決問題所採用的 技術手段之實施方式或實施例之一而已，並非用來限定本 發明專利實施之範圍。即凡與本發明專利申請範圍文義相 1356744 ' 符，或依本發明專利範圍所做的均等變化與修飾，皆為本 發明專利範圍所涵蓋。 、-- 【圖式簡單說明】 圖1A繪示先前技術之應用雷射加工蝕除的裝置示意圖； . 圖1B繪示先前技術之雷射加工裝置示意圖； 圖2繪示本發明之雷射加工裝置實施例之系統示意圖； 圖3繪示本發明之雷射加工方法實施例之流程圖； 圖4A繪示本發明之雷射加工方法之雷射震波不同步實施 ® 彳狀雷射產生模組的時序圖； 圖4B繪示本發明之雷射加工方法之雷射震波不同步實施 例之震波產生模組的時序圖； 圖4C繪示本發明之雷射加工方法之雷射震波不同步實施 例之流體流動模組的時序圖； -圖5A繪示圖4A中的雷射產生模組冬雷射加工示意圖； 圖5B繪示圖4B中震波產生模組之作動示意圖； 圖5C繪示圖4C中流體流動模組之作動示意圖； ® 圖6A繪示本發明之雷射加工方法之雷射震波同步實施例 ' 之雷射產生模組的時序圖； ' 圖6B繪示本發明之雷射加工方法之雷射震波同步實施例 之震波產生模組的時序圖； 圖6C繪示本發明之雷射加工方法之雷射震波同步實施例 之流體流動模組的時序圖； 圖7A繪示圖6A、圖6B中的雷射產生模組之雷射加工及 震波產生模組作動示意圖；以及 1356744 圖7B繪示圖6C中流體流動模組之作動示意圖。1356744 VI. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus, and more particularly to a laser processing which utilizes a seismic wave to disturb debris of a laser processing portion and is excluded from the flow of the fluid. Device. [Prior Art] Please refer to FIG. 1A for a schematic diagram of a prior art application for laser etching. A method and apparatus for etching is disclosed in the World Intellectual Property Organization (WIPO) Publication No. WO 2005/120763, which includes a debris discharge module 10 disposed in a laser processing work area, which is gas-flowed. The way to remove debris from the work area. In addition, please refer to the schematic of the prior art laser processing apparatus illustrated in FIG. 1B. U.S. Patent Publication No. US 2007/0145026 discloses a laser processing apparatus and a laser processing method using the same, the apparatus having a laser beam for processing a workpiece into a laser processing, and a vortex generating mechanism In the working area of the laser beam path and the workpiece, during the laser processing, the fluid is introduced into the vortex generating mechanism to cause the fluid to vortex to discharge the laser processed debris. The above two types of laser processing devices can be used for laser processing debris removal on the machined surface of a general machined part, but have limited effect on the chip removing capability of high aspect ratio laser drilling. SUMMARY OF THE INVENTION The technical means of the present invention is to provide a laser processing apparatus, which is applicable to π; and to 丄 力 4 4 4 4 4 , , , , , , , , , , , , , , , , , 356 356 356 356 356 356 356 356 356 356 356 356 356 356 356 a radiation generating module, which can output a laser light and reshape the laser light to form a laser spot to illuminate the processing surface; a fluid flow module is configured such that the fluid flowing therethrough is subjected to the laser at the processing surface The spot illumination area passes through; a seismic wave generating module generates a seismic wave passing through the workpiece to form an amplitude; and a control module electrically connects the laser generating module, the fluid flow module and the seismic wave generating module, To control the actuation of the fluid flow module and the triggering time of the laser and seismic waves. Another technical means of the present invention is to provide a laser processing method, which is suitable for performing laser processing on a workpiece processing surface. The laser processing method comprises the steps of: starting a fluid flow module to output a fluid to a processing surface; Performing laser processing, irradiating a laser spot outputted by a laser generating module onto the processing surface; and performing seismic wave disturbance to trigger a seismic wave by a seismic wave generating module to disturb the workpiece and to generate debris generated by the laser processing Removed from the bottom of the machined surface and removed by fluid. [Embodiment] The problem to be solved by the present invention is to provide a laser processing apparatus for removing machining debris accumulated in a processing area by means of a rough disturbing workpiece: to facilitate fluid flow. The present invention is characterized in that it can be simultaneously removed: laser processing debris, improved processing efficiency, and laser micro-machining of micro-holes and micro-channels with a high aspect ratio (5:1 or more). The embodiment and the illustration are as follows: Please refer to Fig. 2 for a schematic diagram of the system of the laser processing apparatus of the present invention. It is suitable for performing laser processing on a workpiece 20 processing surface 21, the laser processing apparatus includes: a laser generating module 30, and laser generating 1356744. The module 30 includes a laser generator 31 and an optical system 32. The laser generator 31 outputs laser light, and the optical system 32 is disposed on the optical path of the laser light, and can irradiate the laser beam with a suitable laser spot 33 such as beam expanding, focusing or shaping. The processing surface 21 is used for laser processing; a fluid flow module 40 is configured such that a flowing fluid contacts the processing surface of the processing area, and the flow system of the fluid flow module can be liquid or gas. Or a liquid-gas composite fluid, and the fluid flow module functions as a blow, suction or blow-up composite; a shock wave generating module 50 is configured to generate a shock wave through the workpiece; and a control module 60. The laser generating module 30, the fluid flow module 40, and the seismic wave generating module 50 are electrically connected to control the timing of the fluid flow module 40 and the laser light of the laser generating module 30. Shock wave generation mode The time course of the group 50 seismic wave. The shock wave generating module 50 of the above embodiment may be an embodiment without a taper tube. The oscillating wave generated by the shock wave generating module 50 is transmitted to the workpiece 20 through the air medium, but the energy of the oscillating wave is not caused. The divergence, the shock wave generating module 50 can also include a tapered tube 51 extending to the side of the workpiece 20, and one of the large diameter nozzles of the end of the tapered tube 51 abuts against the back surface 22 of the working surface 21 of the workpiece 20 and The workpiece 20 is vacuum adsorbed or glued or mechanically held in close contact with the workpiece 20 to effectively transmit seismic waves to the workpiece 20 and expand the effective vibration region to the area covered by the large diameter nozzle. The large diameter nozzle of the tapered tube 51 covers the laser processing region of the processing surface 21 with respect to the covering area of the workpiece 20. Continuing to refer to FIG. 3, a flow chart of an embodiment of the laser processing method of the present invention is shown, and reference is made to the system diagram of FIG. The laser processing method, 1356744, is suitable for performing laser processing on a processing surface 21 of a workpiece 20, the laser processing method comprising: a start-fluid money module 40 for taking out a fluid to the processing surface 21 ( Step S 00), the debris generated by the laser processing is excluded by the flowing fluid; laser processing is performed, and the laser spot 33 that is rotated by the firing module 3G is irradiated onto the processing surface 21 (Step Su〇) to perform laser processing; and performing seismic wave disturbance, triggering a seismic wave by a seismic wave generating module 5〇 to perturb the workpiece 20, and the debris p generated by the laser processing is processed from the laser processing The bottom of the face 21 is moved out to the height and is removed by the fluid flow module (step S120). The material of the workpiece 20 of the above embodiment may be a flexible or inflexible material such as a metal material or a composite material, such as a silicon material, a glass material, a metal material, a polymer material, or a piezoelectric material. Continuing to refer to FIG. 4A to FIG. 4C, the timing diagrams of the laser generating module, the seismic wave generating module and the fluid flow module of the laser seismic unsynchronized embodiment of the laser processing method of the present invention are illustrated, and the corresponding timing is matched. FIG. 5A is a schematic diagram of the operation of starting the laser generating module ST1 during the laser processing of FIG. 4A; FIG. 5B is a schematic diagram of the action of the starting seismic wave generating module ST2 of FIG. 4B; FIG. 5C is the starting fluid flow module of FIG. Schematic diagram of the action. In the above embodiment, the performing the laser processing step (step S110) and the performing the seismic wave perturbation step (step S120) are performed at different timings, and the two steps are first performing the laser processing step 'the laser during the process The spot 33 generates debris P at the processing portion of the processing surface 21 of the workpiece 20. After the excitation of the lightning beam 7 1356744 is stopped, the seismic wave perturbation step is performed to take up the debris P at the bottom of the processing position, and the above two steps are staggered. However, during the entire process of performing the above two steps, the fluid flow module 40 is activated all the way to apply the fluid F to discharge the debris P carried by the seismic disturbance step. Continuing to refer to FIGS. 6A to 6C, the timing diagrams of the laser generating module, the seismic wave generating module, and the fluid flow module of the laser seismic synchronization embodiment of the laser processing method of the present invention are shown, and FIG. 7A shows the mine. The action diagram of starting the laser generating module ST1 and the starting seismic wave generating module ST2 during the shooting process; FIG. 7B is a schematic diagram showing the actuating of the starting fluid flow module ST3 after the action of FIG. 7A. In this embodiment, the laser processing step (step S110) and the seismic wave perturbation step (step S120) are performed in the same timing, that is, during the laser processing step, the laser generating module excites the laser. When the laser spot 33 is generated, the shock wave is generated by the shock wave generating module 50, so that after the workpiece P is generated in the processed portion of the workpiece 2, the shock wave is immediately taken up, and the fluid flow module 40 is taken up by the fluid flow module 40. The fluid F is excluded. Of course, the entire process _, the fluid flow module 40 is also fully activated to eliminate debris crumbs at any time. In the above embodiment, the laser generating module 30 is pulsed by a laser generator 31. A laser light is output, and an optical system 32 is used to expand, focus or shape the laser light to form the laser spot. In the above embodiment, the laser light has a wavelength of 100 nm to 20 μm. The shock wave generating module has a seismic wave frequency of IK Hz to 1 Hz. In summary, only one embodiment or embodiment of the technical means for solving the problem is described, and is not intended to limit the present invention. The scope of the invention patents, that is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention, or the scope of the invention, are covered by the scope of the invention. 1A is a schematic view of a prior art laser processing apparatus; FIG. 1B is a schematic diagram of a prior art laser processing apparatus; FIG. 2 is a schematic diagram of a system of a laser processing apparatus according to the present invention; 3 is a flow chart of an embodiment of a laser processing method of the present invention; FIG. 4A is a timing chart of a laser shock wave asynchronous implementation of a laser processing method of the present invention; FIG. 4C is a timing diagram showing a seismic wave generating module of the laser seismic unsynchronized embodiment of the laser processing method of the present invention; FIG. 4C is a view showing a fluid flow module of the laser seismic unsynchronized embodiment of the laser processing method of the present invention; FIG. 5A is a schematic diagram showing the operation of the laser generating module in FIG. 4A; FIG. 5B is a schematic view showing the operation of the seismic generating module in FIG. 4B; FIG. 6A is a timing diagram of a laser generating module of a laser seismic synchronization embodiment of the laser processing method of the present invention; FIG. 6B illustrates a laser shock wave synchronization of the laser processing method of the present invention. FIG. 6C is a timing diagram of a fluid flow module of a laser seismic synchronization embodiment of the laser processing method of the present invention; FIG. 7A is a view of the mine of FIG. 6A and FIG. Schematic diagram of laser processing and seismic generation module actuation of the firing module; and 1356744 FIG. 7B is a schematic diagram of the operation of the fluid flow module of FIG. 6C.
【主要元件符號說明】 10 碎片排出模組 11 雷射光 12 渴流產生機構 20 工件 21 力σ工面 22 背面 30 雷射產生模組 31 雷射產生器 32 光學系統 33 雷射光斑 40 流體流動模組 50 震波產生模組 51 錐管 60 控制模組 F 流體 P 碎屑 ST1 啟動雷射產生模組 ST2 啟動震波產生模組 ST3 啟動流體流動模組[Main component symbol description] 10 Debris discharge module 11 Laser light 12 Thirsty flow generation mechanism 20 Workpiece 21 Force σ working surface 22 Back surface 30 Laser generation module 31 Laser generator 32 Optical system 33 Laser spot 40 Fluid flow module 50 Shock wave generation module 51 Cone tube 60 Control module F Fluid P Debris ST1 Start laser generation module ST2 Start shock wave generation module ST3 Start fluid flow module