JP2014070277A5 - - Google Patents
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- JP2014070277A5 JP2014070277A5 JP2012230319A JP2012230319A JP2014070277A5 JP 2014070277 A5 JP2014070277 A5 JP 2014070277A5 JP 2012230319 A JP2012230319 A JP 2012230319A JP 2012230319 A JP2012230319 A JP 2012230319A JP 2014070277 A5 JP2014070277 A5 JP 2014070277A5
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- JP
- Japan
- Prior art keywords
- wire
- cutting
- etching
- alloy
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000531 Co alloy Inorganic materials 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 231100000078 corrosive Toxicity 0.000 claims description 5
- 231100001010 corrosive Toxicity 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000004881 precipitation hardening Methods 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims 3
- 229910052803 cobalt Inorganic materials 0.000 claims 3
- 239000012535 impurity Substances 0.000 claims 2
- 229910052748 manganese Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 238000005296 abrasive Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Description
また、請求項5に係る発明は、その表面粗さRaが0.01〜0.5μmとしたものである。The invention according to claim 5, in which the surface roughness Ra of that has a 0.01~0.5μ m.
更に請求項6に係る発明は、前記請求項1乃至5のいずれか記載のCo合金細線でなるカット用ワイヤーで、ワークの無機脆性材料を任意切断面で溶断カットするにあたり、
前記ワークとカット用ワイヤーとの接触界面に、該ワークを腐食エッチング現象によって腐食溶解する腐食性溶液を介在させるとともに、該腐食溶解が前記カット用ワイヤーが接する前記接触界面でのみ生じるように、該カット用ワイヤーを所定温度に通電加熱しながら、一定の切込み速度と走行速度で連続的にカットすることを特徴とする、無機脆性材料のカット方法である。Furthermore, the invention according to claim 6 is a cutting wire made of the Co alloy thin wire according to any one of claims 1 to 5 , and when cutting an inorganic brittle material of a workpiece at an arbitrary cut surface,
The corrosive solution that corrodes and dissolves the workpiece by a corrosive etching phenomenon is interposed in the contact interface between the workpiece and the cutting wire, and the corrosive dissolution occurs only at the contact interface that contacts the cutting wire. An inorganic brittle material cutting method characterized by continuously cutting at a predetermined cutting speed and traveling speed while energizing and heating a cutting wire at a predetermined temperature.
【0016】
【発明の効果】
これら組成のCo合金は、例えば通常のステンレス鋼線等に比して冷間加工性に優れ、またその加工後の析出硬化処理によって大幅な機械的特性の向上が図れることから、例えば数十μm程度の微細線材にまで細径化可能で、かつ十分な強度維持と耐食性、及び本発明に好適する通電特性を備え好ましい。従って、Co合金を用いた本発明のエッチングカット用ワイヤーによれば、従来のようなその切断界面に砥粒を介在させることなく、またワイヤーには比較的緩い張力付加で切断カットができることから、実質的な切断ロスの軽減が図れる。 [0016]
【Effect of the invention】
Co alloys having these compositions are excellent in cold workability compared to, for example, ordinary stainless steel wires, and can improve mechanical characteristics significantly by precipitation hardening after the processing, for example, several tens of μm. It is preferable that the diameter can be reduced to a fine wire of a certain level, and sufficient strength maintenance and corrosion resistance are provided, as well as energization characteristics suitable for the present invention. Therefore, according to the etching cut wire of the present invention using a Co alloy, the abrasive can be cut with a relatively loose tension without interposing abrasive grains at the cutting interface as in the prior art, Substantial cutting loss can be reduced.
Claims (6)
該金属線材は、質量%で、Ni:12.0〜20.0%、Cr:12.0〜25.0%、Co:35〜60%を含有するCo合金で構成され、線径0.2mm未満で耐力1500〜2200N/mm2の高強度特性とともに、
JIS−G0577に基づく孔食電位(V’c10):0.60〜0.75Vと、80〜110μΩ・cmの電気抵抗率(但し、室温環境中)を備える前記Co合金の細線(Co合金細線)でなることを特徴とするエッチングカット用ワイヤー。A cutting wire made of a thin metal wire for chemically fusing and cutting inorganic brittle materials by corrosive etching,
The metal wire is composed of a Co alloy containing Ni: 12.0 to 20.0%, Cr: 12.0 to 25.0%, and Co: 35 to 60% in terms of mass%, and the wire diameter is 0.00. Along with the high strength properties of less than 2mm and proof strength 1500-2200N / mm2,
Pitting corrosion potential (V'c10) based on JIS-G0577: 0.60 to 0.75 V, and an electrical resistivity of 80 to 110 μΩ · cm (provided in a room temperature environment) (Co alloy fine wire) Etching cut wire, characterized by comprising:
前記ワークとカット用ワイヤーとの接触界面に、該ワークを腐食エッチング現象によって腐食溶解する腐食性溶液を介在させるとともに、該腐食溶解が前記カット用ワイヤーが A corrosive solution that corrodes and dissolves the workpiece by a corrosion etching phenomenon is interposed at the contact interface between the workpiece and the cutting wire. 接する前記接触界面でのみ生じるように、該カット用ワイヤーを所定温度に通電加熱しながら、一定の切込み速度と走行速度で連続的にカットすることを特徴とする、無機脆性材料のカット方法。A method for cutting an inorganic brittle material, characterized in that the cutting wire is continuously cut at a constant cutting speed and a traveling speed while being electrically heated to a predetermined temperature so as to occur only at the contact interface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012230319A JP2014070277A (en) | 2012-09-27 | 2012-09-27 | Wire for etching cut, and cutting method of inorganic brittle material using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012230319A JP2014070277A (en) | 2012-09-27 | 2012-09-27 | Wire for etching cut, and cutting method of inorganic brittle material using the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016159754A Division JP2017008420A (en) | 2016-07-28 | 2016-07-28 | Manufacturing method of wire for etching cut and cutting method of inorganic brittle material using wire for etching cut obtained by the method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014070277A JP2014070277A (en) | 2014-04-21 |
JP2014070277A5 true JP2014070277A5 (en) | 2015-11-05 |
Family
ID=50745770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012230319A Pending JP2014070277A (en) | 2012-09-27 | 2012-09-27 | Wire for etching cut, and cutting method of inorganic brittle material using the same |
Country Status (1)
Country | Link |
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JP (1) | JP2014070277A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111485138B (en) * | 2020-04-23 | 2021-07-23 | 中国科学院金属研究所 | Preparation method of cold-processed cobalt-based alloy rod wire |
CN112342441A (en) * | 2020-11-07 | 2021-02-09 | 南京聚力化工机械有限公司 | High-wear-resistance alloy material and preparation method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3915770A (en) * | 1974-12-16 | 1975-10-28 | Ibm | Method and apparatus for thermo-chemically slicing crystal boules |
US4343662A (en) * | 1981-03-31 | 1982-08-10 | Atlantic Richfield Company | Manufacturing semiconductor wafer devices by simultaneous slicing and etching |
JP2003291056A (en) * | 2002-04-01 | 2003-10-14 | Sumitomo Mitsubishi Silicon Corp | Wire cutting method for any object, cutting wire, and manufacturing method for wire |
JP4840571B2 (en) * | 2005-12-16 | 2011-12-21 | 日本精線株式会社 | Fine metal strip for reinforcing resin material, resin molded product and medical product using the strip |
JP2007196329A (en) * | 2006-01-26 | 2007-08-09 | Nippon Seisen Co Ltd | Wire tool |
JP4829626B2 (en) * | 2006-01-31 | 2011-12-07 | 日本精線株式会社 | Saw wire and manufacturing method thereof |
-
2012
- 2012-09-27 JP JP2012230319A patent/JP2014070277A/en active Pending
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