JP2014070277A5 - - Google Patents

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JP2014070277A5
JP2014070277A5 JP2012230319A JP2012230319A JP2014070277A5 JP 2014070277 A5 JP2014070277 A5 JP 2014070277A5 JP 2012230319 A JP2012230319 A JP 2012230319A JP 2012230319 A JP2012230319 A JP 2012230319A JP 2014070277 A5 JP2014070277 A5 JP 2014070277A5
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Prior art keywords
wire
cutting
etching
alloy
cut
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Pending
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JP2012230319A
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JP2014070277A (en
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Description

また、請求項5に係る発明は、その表面粗さRaが0.01〜0.5μmとしたものである。The invention according to claim 5, in which the surface roughness Ra of that has a 0.01~0.5μ m.

更に請求項に係る発明は、前記請求項1乃至のいずれか記載のCo合金細線でなるカット用ワイヤーで、ワークの無機脆性材料を任意切断面で溶断カットするにあたり、
前記ワークとカット用ワイヤーとの接触界面に、該ワークを腐食エッチング現象によって腐食溶解する腐食性溶液を介在させるとともに、該腐食溶解が前記カット用ワイヤーが接する前記接触界面でのみ生じるように、該カット用ワイヤーを所定温度に通電加熱しながら、一定の切込み速度と走行速度で連続的にカットすることを特徴とする、無機脆性材料のカット方法である。
Furthermore, the invention according to claim 6 is a cutting wire made of the Co alloy thin wire according to any one of claims 1 to 5 , and when cutting an inorganic brittle material of a workpiece at an arbitrary cut surface,
The corrosive solution that corrodes and dissolves the workpiece by a corrosive etching phenomenon is interposed in the contact interface between the workpiece and the cutting wire, and the corrosive dissolution occurs only at the contact interface that contacts the cutting wire. An inorganic brittle material cutting method characterized by continuously cutting at a predetermined cutting speed and traveling speed while energizing and heating a cutting wire at a predetermined temperature.

【0016】
【発明の効果】
これら組成のCo合金は、例えば通常のステンレス鋼線等に比して冷間加工性に優れ、またその加工後の析出硬化処理によって大幅な機械的特性の向上が図れることから、例えば数十μm程度の微細線材にまで細径化可能で、かつ十分な強度維持と耐食性、及び本発明に好適する通電特性を備え好ましい。従って、Co合金を用いた本発明のエッチングカット用ワイヤーによれば、従来のようなその切断界面に砥粒を介在させることなく、またワイヤーには比較的緩い張力付加で切断カットができることから、実質的な切断ロスの軽減が図れる。
[0016]
【Effect of the invention】
Co alloys having these compositions are excellent in cold workability compared to, for example, ordinary stainless steel wires, and can improve mechanical characteristics significantly by precipitation hardening after the processing, for example, several tens of μm. It is preferable that the diameter can be reduced to a fine wire of a certain level, and sufficient strength maintenance and corrosion resistance are provided, as well as energization characteristics suitable for the present invention. Therefore, according to the etching cut wire of the present invention using a Co alloy, the abrasive can be cut with a relatively loose tension without interposing abrasive grains at the cutting interface as in the prior art, Substantial cutting loss can be reduced.

Claims (6)

無機性脆性材料を腐食エッチングで化学的に溶断カットする為の細径金属線材でなるカット用ワイヤーであって、
該金属線材は、質量%で、Ni:12.0〜20.0%、Cr:12.0〜25.0%、Co:35〜60%を含有するCo合金で構成され、線径0.2mm未満で耐力1500〜2200N/mm2の高強度特性とともに、
JIS−G0577に基づく孔食電位(V’c10):0.60〜0.75Vと、80〜110μΩ・cmの電気抵抗率(但し、室温環境中)を備える前記Co合金の細線(Co合金細線)でなることを特徴とするエッチングカット用ワイヤー。
A cutting wire made of a thin metal wire for chemically fusing and cutting inorganic brittle materials by corrosive etching,
The metal wire is composed of a Co alloy containing Ni: 12.0 to 20.0%, Cr: 12.0 to 25.0%, and Co: 35 to 60% in terms of mass%, and the wire diameter is 0.00. Along with the high strength properties of less than 2mm and proof strength 1500-2200N / mm2,
Pitting corrosion potential (V'c10) based on JIS-G0577: 0.60 to 0.75 V, and an electrical resistivity of 80 to 110 μΩ · cm (provided in a room temperature environment) (Co alloy fine wire) Etching cut wire, characterized by comprising:
Co合金細線の電気抵抗率は、95〜105μΩ・cmである請求項1に記載のエッチングカット用ワイヤー。  The wire for etching cut according to claim 1, wherein the electrical resistivity of the Co alloy fine wire is 95 to 105 µΩ · cm. Co合金細線は、質量%でC:≦0.30%,Si:≦2.0%,Mn:≦2.0%,Ni:14.0〜20.0%,Cr:15.0〜25.0%,Mo:2.0〜10.0%,Co:40.0〜55.0%を含み、残部Fe及び不可避不純物からなる析出硬化型の前記Co合金でなることを特徴とする請求項1又は2に記載のエッチングカット用ワイヤー。  Co alloy fine wire is C: ≦ 0.30%, Si: ≦ 2.0%, Mn: ≦ 2.0%, Ni: 14.0-20.0%, Cr: 15.0-25 in mass%. 0.0%, Mo: 2.0 to 10.0%, Co: 40.0 to 55.0%, and the precipitation-hardening type Co alloy consisting of the remaining Fe and inevitable impurities. Item 3. An etching cut wire according to Item 1 or 2. Co合金細線は、質量%でC:0.08〜0.20%,Si:≦1.0%,Mn:≦2.0%,Ni:14.0〜18.5%,Cr:19.0〜25.0%,Mo:4.0〜8.0%,およびCo:40.0〜55.0%と、更にAl:0.1〜4.0%,Ti:0.10〜2.5%,Nb:0.01〜1.0%及びW:0.50〜5.0%のいずれか1種以上を含み、残部Fe及び不可避不純物からなる析出硬化型の前記Co合金であることを特徴とする請求項1又は3に記載のエッチングカット用ワイヤー。  Co alloy fine wire is C: 0.08-0.20%, Si: ≦ 1.0%, Mn: ≦ 2.0%, Ni: 14.0-18.5%, Cr: 19. 0-25.0%, Mo: 4.0-8.0%, and Co: 40.0-55.0%, and Al: 0.1-4.0%, Ti: 0.10-2 0.5%, Nb: 0.01 to 1.0%, and W: 0.50 to 5.0%, and the precipitation-hardening type Co alloy composed of the remaining Fe and inevitable impurities. The wire for etching cut according to claim 1 or 3, wherein その表面粗さRaが0.01〜0.5μmである請求項1〜4のいずれかに記載のエッチングカット用ワイヤー。The surface roughness Ra is 0.01-0.5 micrometer, The wire for etching cuts in any one of Claims 1-4. 前記請求項1乃至5のいずれか記載のCo合金細線でなるカット用ワイヤーで、ワークの無機脆性材料を任意切断面で溶断カットするにあたり、In cutting wire made of Co alloy thin wire according to any one of claims 1 to 5, when cutting the frangible inorganic brittle material of the workpiece at an arbitrary cut surface,
前記ワークとカット用ワイヤーとの接触界面に、該ワークを腐食エッチング現象によって腐食溶解する腐食性溶液を介在させるとともに、該腐食溶解が前記カット用ワイヤーが  A corrosive solution that corrodes and dissolves the workpiece by a corrosion etching phenomenon is interposed at the contact interface between the workpiece and the cutting wire. 接する前記接触界面でのみ生じるように、該カット用ワイヤーを所定温度に通電加熱しながら、一定の切込み速度と走行速度で連続的にカットすることを特徴とする、無機脆性材料のカット方法。A method for cutting an inorganic brittle material, characterized in that the cutting wire is continuously cut at a constant cutting speed and a traveling speed while being electrically heated to a predetermined temperature so as to occur only at the contact interface.
JP2012230319A 2012-09-27 2012-09-27 Wire for etching cut, and cutting method of inorganic brittle material using the same Pending JP2014070277A (en)

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CN111485138B (en) * 2020-04-23 2021-07-23 中国科学院金属研究所 Preparation method of cold-processed cobalt-based alloy rod wire
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US3915770A (en) * 1974-12-16 1975-10-28 Ibm Method and apparatus for thermo-chemically slicing crystal boules
US4343662A (en) * 1981-03-31 1982-08-10 Atlantic Richfield Company Manufacturing semiconductor wafer devices by simultaneous slicing and etching
JP2003291056A (en) * 2002-04-01 2003-10-14 Sumitomo Mitsubishi Silicon Corp Wire cutting method for any object, cutting wire, and manufacturing method for wire
JP4840571B2 (en) * 2005-12-16 2011-12-21 日本精線株式会社 Fine metal strip for reinforcing resin material, resin molded product and medical product using the strip
JP2007196329A (en) * 2006-01-26 2007-08-09 Nippon Seisen Co Ltd Wire tool
JP4829626B2 (en) * 2006-01-31 2011-12-07 日本精線株式会社 Saw wire and manufacturing method thereof

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