JP2014056403A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent failure in program update.SOLUTION: The substrate processing apparatus includes an operation part having an operation screen, a mounting part for mounting a recording medium, and control means. The control means executes a start program to determine a state of a control unit when a device for installation is mounted in the mounting part; ends the start program when a previous version is installed and the operation screen is displayed; displays a message on the operation screen to urge the end of the start program when the device for installation is mounted to a wrong control unit; displays an installation confirmation screen when installation is required; and stores an installation program in a predetermined storage part of the control unit when prosecution of the installation is selected.

Description

  The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor substrate or a glass substrate.

    A substrate processing apparatus for processing a substrate such as a silicon wafer has a controller including a CPU, a memory, and a storage device such as an HDD. The storage device stores a program for causing the substrate processing apparatus to realize various functions. The program is read from the storage device to the memory and executed by the CPU.

  The program is updated (versioned up) regularly or irregularly for reasons such as function expansion of the substrate processing apparatus or bug handling. Conventionally, updating system programs requires complicated screen operations such as parameter backup, restoration, system shutdown, and installation screen operations. Refer to detailed procedure manuals to prevent program update failures. There was a need to update the program.

  The present invention has been made from the above-described background, and provides a substrate processing apparatus that can be easily updated by a controller in the substrate processing apparatus.

In order to achieve the above object, a substrate processing apparatus according to the present invention includes an operation unit including an operation screen for creating or editing a file for processing a substrate,
A mounting unit for mounting a recording medium for writing data generated when the file is executed, and a control unit that is connected to each of the operation unit and the mounting unit and controls to execute the file. In the substrate processing apparatus, when the installation device is mounted on the mounting unit, the control unit executes a startup program to determine the state of the control unit, the previous version is installed, and the operation If the screen is being displayed, the startup program is terminated, and if the installation device is attached to the wrong control unit, a message is displayed on the operation screen, prompting the termination of the startup program, If necessary, display the installation confirmation screen and select Continue Installation. A substrate processing apparatus, characterized in that to save Lumpur program in a predetermined storage portion of the control unit.

  According to the substrate processing apparatus of the present invention, it is possible to simply update the system in the controller by simply selecting an update from the displayed screen without going through a complicated procedure.

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. It is sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is a block diagram which shows an example of a structure centering on the control means of the substrate processing apparatus which concerns on embodiment of this invention. It is a figure which illustrates the operation screen displayed initially in the main display screen of the substrate processing apparatus which concerns on embodiment of this invention. It is a figure which shows the example of a display in the case of an installation process. It is a figure which shows the example of a display in the case of a version upgrade process. It is a flow chart of version upgrade.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 shows a substrate processing apparatus 10 using a perspective view. FIG. 2 shows the substrate processing apparatus 10 using a side perspective view.
The substrate processing apparatus 10 processes a wafer 200 made of silicon or the like used as a substrate.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 10 uses a hoop (substrate container; hereinafter referred to as a pod) 110 used as a wafer carrier that stores a wafer 200. Further, the substrate processing apparatus 10 includes a substrate processing apparatus main body 111.

  A front maintenance port 103 used as an opening provided so that maintenance can be performed is established in the front front portion of the front wall 111a of the substrate processing apparatus main body 111, and a front maintenance door 104 for opening and closing the front maintenance port 103 is built. It is attached. Although not shown, a sub operation device as a sub operation unit is installed in the vicinity of the upper front maintenance door 104. The main operation device 16 as the main operation unit is disposed in the vicinity of the maintenance door on the back side.

A pod loading / unloading port (substrate container loading / unloading port) 112 is established on the front wall 111a of the substrate processing apparatus body 111 so as to communicate with the inside and outside of the substrate processing apparatus body 111. The pod loading / unloading port 112 is a front shutter. It is opened and closed by (substrate container carry-in / out opening / closing mechanism) 113.
A load port (substrate container delivery table) 114 is installed in front of the front side of the pod loading / unloading port 112, and the load port 114 is configured so that the pod 110 is placed and aligned. The pod 110 is loaded onto the load port 114 by an in-process transfer device (not shown) and unloaded from the load port 114.

  A rotary pod shelf (substrate container mounting shelf) 105 is installed in an upper portion of the substrate processing apparatus main body 111 in a substantially central portion in the front-rear direction. The rotary pod shelf 105 stores a plurality of pods 110. Is configured to do. In other words, the rotary pod shelf 105 is vertically arranged and intermittently rotated in a horizontal plane, and a plurality of shelf boards (supported by a substrate container) that are radially supported by the support 116 at each of the upper, middle, and lower positions. And a plurality of shelf plates 117 are configured to hold the pods 110 in a state where a plurality of pods 110 are respectively placed.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the substrate processing apparatus main body 111, and the pod transfer device 118 holds the pod 110. A pod elevator (substrate container lifting mechanism) 118a that can be lifted and lowered and a pod transport mechanism (substrate container transport mechanism) 118b as a transport mechanism are configured. The pod transport device 118 includes a pod elevator 118a and a pod transport mechanism 118b. The pod 110 is transported between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121.

  A sub-housing 119 is constructed over the rear end at a lower portion of the substrate processing apparatus main body 111 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages. A pair of pod openers 121 and 121 are installed at the wafer loading / unloading ports 120 and 120 at the upper and lower stages, respectively. The pod opener 121 includes mounting bases 122 and 122 on which the pod 110 is placed, and cap attaching / detaching mechanisms (lid attaching / detaching mechanisms) 123 and 123 for attaching and detaching caps (lids) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  The sub-housing 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the pod transfer device 118 and the rotary pod shelf 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124, and the wafer transfer mechanism 125 rotates the wafer 200 in the horizontal direction or can move the wafer 200 in the horizontal direction. A substrate transfer device) 125a and a wafer transfer device elevator (substrate transfer device lifting mechanism) 125b for moving the wafer transfer device 125a up and down. As schematically shown in FIG. 2, the wafer transfer apparatus elevator 125b is installed between the right end of the pressure-resistant substrate processing apparatus main body 111 and the right end of the front area of the transfer chamber 124 of the sub-housing 119. . By the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the tweezer (substrate holder) 125c of the wafer transfer device 125a is used as a placement portion for the wafer 200 with respect to the boat (substrate holder) 217. The wafer 200 is loaded (charged) and unloaded (discharged).

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147.

As schematically shown in FIG. 1, a boat elevator (substrate holding) for raising and lowering the boat 217 between the right end portion of the pressure-resistant substrate processing apparatus main body 111 and the standby portion 126 right end portion of the sub casing 119. (Elevating mechanism) 115 is installed. A seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a connecting tool connected to a lifting platform of the boat elevator 115, and the seal cap 219 supports the boat 217 vertically, and a lower end of the processing furnace 202. It is comprised so that a part can be obstruct | occluded.
The boat 217 includes a plurality of holding members, and is configured to hold a plurality of (for example, about 50 to 125) wafers 200 horizontally in a state where the centers are aligned in the vertical direction. Has been.

  Further, as schematically shown in FIG. 1, a clean atmosphere or inert gas is provided at the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. A clean unit 134 composed of a supply fan and a dust-proof filter is installed to supply clean air 133, and a wafer circle is not shown between the wafer transfer device 125a and the clean unit 134. A notch aligning device is installed as a substrate aligning device for aligning positions in the circumferential direction.

  The clean air 133 blown out from the clean unit 134 is circulated to the notch aligner / wafer transfer device 125a and the boat 217 in the standby unit 126, and then sucked in by a duct (not shown) to be external to the substrate processing apparatus main body 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134, and is again blown into the transfer chamber 124 by the clean unit 134.

Next, the operation of the substrate processing apparatus 10 of the present invention will be described.
As shown in FIGS. 1 and 2, when the pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113, and the pod 110 above the load port 114 serves as a pod transfer device. 118 is carried into the substrate processing apparatus main body 111 from the pod loading / unloading port 112.

  The loaded pod 110 is automatically transported and delivered by the pod transport device 118 to the designated shelf 117 of the rotary pod shelf 105, temporarily stored, and then one pod opener from the shelf 117. After being transferred to 121 and delivered and temporarily stored, it is transferred from the shelf 117 to one of the pod openers 121 and transferred to the mounting table 122 or directly transferred to the pod opener 121 and mounted. It is transferred to the mounting table 122. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133. For example, the transfer chamber 124 is filled with nitrogen gas as clean air 133, so that the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the substrate processing apparatus main body 111 (atmosphere). .

The pod 110 mounted on the mounting table 122 has its opening-side end face pressed against the opening edge of the wafer loading / unloading port 120 on the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. The wafer loading / unloading port is opened.
When the pod 110 is opened by the pod opener 121, the wafer 200 is picked up from the pod 110 by the tweezer 125c of the wafer transfer device 125a through the wafer loading / unloading port, aligned with the notch alignment device (not shown), and then transferred to the transfer chamber. It is carried into standby unit 126 behind 124 and loaded (charged) into boat 217. The wafer transfer device 125 a that has delivered the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer into the boat 217.

  During the loading operation of the wafer into the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 receives another pod from the rotary pod shelf 105. 110 is transferred and transferred by the pod transfer device 118, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafers 200 is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202.
After the processing, the wafer 200 and the pod 110 are discharged to the outside of the casing in the reverse order of the above-described procedure, except for the wafer alignment process in a notch alignment apparatus (not shown).

Next, with reference to FIG. 3, a hardware configuration centering on the main controller 14 in the substrate processing apparatus 10 will be described.
As shown in FIG. 3, a transfer control unit 230 and a process control unit 232 are provided in the substrate processing apparatus main body 111 of the substrate processing apparatus 10 together with the main controller 14 and the switching hub 15. The transfer control unit 230 and the process control unit 232 may be provided outside the substrate processing apparatus main body 111 instead of being provided in the substrate processing apparatus main body 111.

A main controller 14 as a main control unit is connected to a main operation device 16 as a main operation unit using, for example, a video cable 20. Instead of connecting the main controller 14 and the main operation device 16 using the video cable 20, the main controller 14 and the main operation device 16 may be connected via the communication network 40.
The main controller 14 is connected to an external operation device (not shown) via, for example, the communication network 40. For this reason, the external operating device can be arranged at a position separated from the substrate processing apparatus 10. For example, even when the substrate processing apparatus 10 is installed in a clean room, the external operation apparatus can be arranged in an office outside the clean room.
For example, an OS corresponding to a USB port is installed in the main controller 14, and an external storage device (for example, a USB flash memory) corresponding to the USB port can be inserted into the substrate processing apparatus 10.

The main operating device 16 is disposed in the vicinity of the substrate processing apparatus 10 (or the processing furnace 202 and the substrate processing apparatus main body 111). The main operating device 16 is fixed to the substrate processing apparatus 10 as a unit so as to be mounted on the substrate processing apparatus main body 111 as in this embodiment.
Here, the main operation device 16 is arranged in the vicinity of the substrate processing apparatus 10 (or the processing furnace 202 and the substrate processing apparatus main body 111) means that the main operation device 16 is in a position where the operator can confirm the state of the substrate processing apparatus 10. It means that the device 16 is arranged. For example, it is installed in a clean room where the substrate processing apparatus main body 111 is installed.
The main operating device 16 has a main display device 18. The main display device 18 is, for example, a liquid crystal display panel, and an operation screen for operating the substrate processing apparatus 10 is displayed on the main display device 18. Information generated in the substrate processing apparatus 10 can be displayed via the operation screen, and the displayed information can be output to a USB flash memory or the like inserted in the substrate processing apparatus 10.

  The sub operation device 50 includes a sub display device 52. Similar to the main display device 18, the sub display device 52 is, for example, a liquid crystal display panel, and an operation screen for operating the substrate processing apparatus 10 is displayed on the sub display device 52. The operation screen displayed on the sub display device 52 has the same function as the operation screen displayed on the main display device 18. Therefore, information generated in the substrate processing apparatus 10 is displayed, and this information can be output to a USB flash memory or the like inserted into the substrate processing apparatus 10.

The transport control unit 230 has a transport system controller 234 made of, for example, a CPU, and the process control unit 232 has a process system controller 236 made of, for example, a CPU.
The transport system controller 234 and the process system controller 236 are connected to the main controller 14 via the switching hub 15.
Further, the main controller 14 is provided with a port 13 as an attachment / detachment unit for attaching and detaching a USB flash memory or the like as a recording medium as an external storage device.

  Further, as shown in FIG. 3, a main display control unit 240 used for controlling the display of the main display device 18 is provided in the main operation device 16. The main display control unit 240 is connected to the main controller 14 using, for example, the video cable 20.

  As shown in FIG. 3, a sub display control unit 242 used for controlling the display of the sub display device 52 is provided in the sub operation device 50. The sub display control unit 242 is not limited to the illustrated form, and may be connected to the main controller 14 via the communication network 40.

FIG. 4 is an example of an operation screen that is initially displayed on the main display device 18 and the sub display device 52.
Here, the operation screen includes a title panel 61, an information panel 62, a navigation panel 63, and a command panel (not shown).
The title panel 61 is at the top of the operation screen and corresponds to the upper area of the information panel 62 and a command panel (not shown). The title panel 61 is always displayed. For example, when online communication is performed, the communication status with the host controller, date, time, login button, logout button, and error message are displayed. In addition, in order to improve operation efficiency, it is also possible to display items other than these arbitrarily.
The information panel 62 displays one or more information or graphic screens in each functional area. In the information panel 62, graphics and other display objects are arranged in order to perform necessary control or monitoring. Note that it is possible to display a plurality of information at a time as appropriate on the information panel 62 in the functional area.

The navigation panel 63 corresponds to an area where various navigation buttons are arranged at the bottom of the operation screen. A character label is attached to the navigation button, and its function can be displayed as an image (icon). When a dialog box is displayed on the screen when a warning or caution is notified, the dialog box is displayed so as not to overlap the navigation panel 63. Furthermore, it is possible for a user to immediately operate and access various information. The navigation panel 63 is also provided with buttons for accessing information for reliably performing operations for safety of the device. For example, an alarm button for confirming an alarm, a warning, and an event log acquired at the present time and accessing information for canceling the alarm and the warning are arranged.
A button displayed with a broken line on the navigation panel 63 means that the button cannot be pressed (invalid). Each button is disabled or enabled depending on the contents of the operation screen and the user's action. For example, when the user inserts a USB flash memory into the substrate processing apparatus 10, the removal button 65 as a confirmation unit for performing confirmation for removing the device is enabled, and the user can remove the USB flash memory from the substrate processing apparatus 10. When the memory is removed, the removal button 65 is disabled. By providing the detach button 65 on the navigation panel 63, it is possible to prompt the operator to press the detach button 65 with certainty. Therefore, particularly in the USB flash memory, it is possible to avoid data corruption and influence on the OS of the main controller 14.

  As described above, the embodiment of the present invention is characterized in that the removal button 65 is provided as a confirmation unit for confirming when the device attached to the port 13 is removed from the navigation panel 63. Here, the device is a generic term including not only an external storage medium such as a USB flash memory but also output means such as a printer and input means such as a keyboard and a mouse.

Specific examples of the present invention will be described below.
The installation CD for upgrading as a recording medium is inserted into the CD drive of ports 13 and 12 of the operation control unit from the installation CD. The program in the inserted installation CD is started up and automatically started, and the version of the currently installed program is compared with the version of the program in the inserted installation CD. As a result of comparing the programs, if the installed program is an old version and the screen is being displayed (that is, the substrate processing apparatus is executing substrate processing), the automatically started program is terminated and the substrate is It waits as it is until the processing is completed.
If the control unit in which the installation CD for upgrading is inserted is wrong (a different type of unit), the message shown in FIG. 5- (a) is displayed. After supporting YES from the operator, the program is terminated.
In cases other than the above, an installation confirmation screen shown in FIG. Here, when the installation is to be continued, the installer is copied from the installation CD to the local drive in the control unit, and after starting the installer, the installation CD is automatically ejected.

(2) Installation operation from the display screen (installation operation by searching within the network)
If an old version of the program is installed and the screen is being displayed, the display shown in FIG. 6A is performed and the update button is pressed. When the update button is pressed by the operator, the screen program searches for a folder with a specific name (eg, SystemInstaller) from a local CD drive or a predefined network drive. When a folder is found, if there is an installer in the folder, an installation confirmation screen (FIG. 6B) is displayed. When installation is selected, the installer is copied to the local drive together with the folder, and this installer is started.

(3) Execution of Installation The execution of installation will be described using the flow shown in FIG. When an existing program is installed (YES in S101), the installer first deletes the automatic startup setting (S102) and restarts (reboots) the control unit in order to completely stop the operating system. (S103). After restarting, the installation is continued and the existing program is deleted (S105). At this time, the parameter file created by the system should not be deleted. After deleting the existing program, a new program is arranged (S106, S107), and automatic startup is set again. At this time, do not overwrite the parameter file. Next, the control unit is restarted again (S108), and the system automatically operates with a new program (S110) to complete the installation.

  In the present invention, the substrate processing apparatus 10 is configured as, for example, a semiconductor manufacturing apparatus that performs a manufacturing method of a semiconductor device (IC). However, not only the semiconductor manufacturing apparatus but also a glass substrate such as an LCD device is processed. The present invention can also be applied to an apparatus that performs the above.

Examples of the film forming process performed in the substrate processing apparatus 10 include CVD, PVD, ALD, Epi, other processes for forming an oxide film and a nitride film, and processes for forming a film containing a metal. Further, annealing treatment, oxidation treatment, diffusion treatment or the like may be performed.
In the present embodiment, the substrate processing apparatus is described as the vertical processing apparatus 10, but the present invention can also be applied to a single-wafer apparatus. Further, an etching apparatus, an exposure apparatus, a lithography apparatus, a coating apparatus, The present invention can be similarly applied to a molding apparatus, a developing apparatus, a dicing apparatus, a wire bonding apparatus, an inspection apparatus, and the like.

  Further, a group management apparatus (management server) that is connected to a plurality of substrate processing apparatuses 10 via a communication line and manages the states of the plurality of substrate processing apparatuses 10, and a substrate process including such a substrate processing apparatus and a group management apparatus It can also be applied to the system. The group management apparatus does not have to be arranged on the same floor (clean room) as the substrate processing apparatus, and may be arranged in a LAN connected to the office, for example. In the group management device, it is not necessary to integrate the storage unit (database), the control unit, the operation unit, and the display unit, and each unit may be separated, and the data in the database arranged in the clean room can be remotely You may comprise so that operation (for example, installation work etc.) on the operation screen by the terminal device arrange | positioned in an office can be performed.

The above-mentioned program is recorded on a computer-readable storage medium such as a computer-readable hard disk, flexible disk, or compact disk, and is installed in the system control unit from the storage medium. It may be what was done.

  The present invention is characterized by the matters described in the claims, but further includes the following items.

[Appendix 1]
A method for updating a program for processing a board, including a step of inserting an installation program for upgrading into a drive of a control unit, a step in which the program in the inserted installation program starts up and automatically starts, The process of comparing the version of the installed program with the version of the installed installation program and the program is compared. As a result of comparing the programs, if the installed program is an old version and the screen is displayed, it will start automatically. If the installation confirmation screen is displayed when the installation confirmation screen is displayed and the installation confirmation screen is selected, the installer will load the installer in the local control unit in the control unit. After starting the process of copying the drive, the installer automatically program update method of a substrate processing apparatus having a step of discharging the installation program.
[Appendix 2]
A program that operates on a computer of a control device that controls the substrate processing apparatus in order to cause the substrate processing apparatus to execute the program update method according to attachment 1.
[Appendix 3]
A readable computer storage medium storing the program according to attachment 2.

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 14 Main controller 16 Main operation apparatus 18 Main display apparatus 50 Sub operation apparatus 52 Sub display apparatus 200 Wafer 202 Processing chamber 240 Main display control part 242 Sub display control part

Claims (1)

An operation unit having an operation screen for creating or editing a file for processing a substrate;
A mounting unit for mounting a recording medium for writing data generated when the file is executed;
A substrate processing apparatus comprising: a control unit that is connected to each of the operation unit and the mounting unit and controls to execute the file;
When the installation device is attached to the attachment unit, the control means executes a start program to determine the state of the control unit, and if the previous version is installed and the operation screen is being displayed , Quit the start program, if the installation device is attached to the wrong control unit, display a message on the operation screen, prompt the end of the start program,
When installation is required, an installation confirmation screen is displayed, and when installation is to be continued, an installation program is stored in a predetermined storage unit of the control unit.

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