JP2014053251A - Organic el device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL device in which a light-emitting region can be expanded, while ensuring the strength of a power supply member.SOLUTION: An organic EL device has a hard resin layer 10 surrounding a region including a light-emitting region 30. Wires 87, 88 are buried in the hard resin layer 10, and power is supplied to power supply regions 31, 32 externally via the buried wires 87, 88. Furthermore, a conductive base material 80 having electrical conductivity is provided on a second electrode layer 6. The conductive base material 80 and the power supply regions 31, 32 are connected electrically via the wires 87, 88, and power is supplied externally via the conductive base material 80 on the projection plane of the light-emitting region 30.

Description

  The present invention relates to an organic EL (Electro Luminescence) device.

  In recent years, organic EL devices have attracted attention as a lighting device that can replace incandescent lamps and fluorescent lamps, and many studies have been made.

Here, the organic EL device is obtained by laminating an organic EL element on a base material such as a glass substrate or a transparent resin film.
In addition, the organic EL element has two or more light-transmitting electrodes facing each other, and a light emitting layer made of an organic compound is laminated between the electrodes. The organic EL device emits light by the energy of recombination of electrically excited electrons and holes.
Since the organic EL device is a self-luminous device, a high-contrast image can be obtained when used as a display material. In addition, light of various wavelengths can be emitted by appropriately selecting the material of the light emitting layer. Further, since the thickness is extremely thin compared to incandescent lamps and fluorescent lamps, and the light is emitted in a planar shape, there are few restrictions on the installation location.

  An organic EL device has a sealing structure that blocks an organic EL element from an external atmosphere by covering the organic EL element with a sealing member in order to prevent moisture and oxygen (hereinafter also referred to as water) from entering the organic EL element. It has. By this sealing structure, generation of non-light emitting points called dark spots is suppressed.

  By the way, in order to make use of the feature of the organic EL device called surface emission, it is preferable to secure the area of the light emitting region that actually emits light as much as possible. When a power supply region that contributes to power supply to the light emitting region and the light emitting region is formed on the same base material, the area of the power supply region on the base material increases as the area of the light emitting region on the base material increases. Becomes smaller.

Therefore, as a measure for enlarging the light emitting region, a structure as in Patent Document 1 can be considered.
In the light emitting module (organic EL device) of Patent Document 1, the power supply terminal located in the light emitting region and the power supply electrode (electrode) located in the power supply region are electrically connected to the support (sealing member) by an electric connection member (power supply member). Connected on the back side. That is, it is considered that the light emitting region can be enlarged by reducing the area of the power feeding region by moving the linear power feeding member from the power feeding region to the light emitting region.

JP 2011-119239 A

However, although the organic EL device of the cited document 1 can enlarge the area of the light emitting region, since the power feeding member is linear, the strength is small and there is a risk of disconnection due to external factors.
Moreover, the electrode and the power supply member are joined by ultrasonic bonding, and all of the power supply member is exposed. For this reason, when a copper wire or the like is used for the power supply member, the surface of the power supply member may be oxidized. When the power supply member is oxidized, the flow of current is hindered, and in some cases, there is a possibility that the power supply member is disconnected and cannot supply power.

  Therefore, the present invention solves the above-described problems, and provides an organic EL device capable of expanding a light emitting region while ensuring the strength of a power feeding member.

  Invention of Claim 1 for solving an above-mentioned subject is provided with the section structure which has a layered product provided with the 1st electrode layer, the organic luminescent layer, and the 2nd electrode layer in order on a substrate, In the organic EL device in which there is a light emitting region that actually emits light and a power feeding region to which a power feeding member is connected when the substrate is viewed in plan view, the organic EL device includes a hard wall portion that surrounds the region including the light emitting region, At least a part of the power feeding member is buried in the hard wall, and power is fed from the outside to the power feeding region through the buried power feeding member. Further, the electric conductivity is provided on the second electrode layer. The conductive substrate and the power supply region are electrically connected via the power supply member, and in the light emitting region, via the conductive substrate. An organic EL device is characterized in that power is supplied from the outside.

  The term “conductive substrate” as used herein refers to a substrate having a current conduction path, for example, not only a substrate having a mounting portion such as a printed circuit board (PWB) but also a simple conductive material such as a copper foil. The base material which has only property is also included.

  According to the configuration of the present invention, at least a part of the power feeding member is buried in the hard wall portion, and power is fed from the outside to the power feeding region through the buried power feeding member. That is, a part of the power supply member is covered with the hard wall portion, and has a function as a pseudo potting seal. For this reason, it is difficult for noise to enter during power feeding. For example, even if the power supply member has a low strength such as a wire or a foil, since the strength of a part of the power supply member is reinforced by the hard wall portion, it is difficult to break or break due to an external factor. Furthermore, even in the case of a metal power supply member, for example, surface oxidation can be prevented.

  Moreover, according to the structure of this invention, it has the electroconductive base material which has electroconductivity on the 2nd electrode layer, The said electroconductive base material and the said electric power feeding area | region are electrically connected via the said electric power feeding member. In the light emitting region, when connected in plan view, power is supplied from the outside through a conductive base material. That is, since the conductive base material is provided at a position opposite to the light extraction side of the light emitting region, the conductive base material is unlikely to obstruct power supply and may look good. Moreover, the installation area of an electroconductive base material can be ensured. Furthermore, the area of the power supply region can be reduced, and the light emission area can be increased at the same time.

  Invention of Claim 2 has the sealing layer which seals all or one part of a laminated body, a soft contact bonding layer exists on the said sealing layer, and a soft contact bonding layer is the said light emission area | region. 2. The organic EL device according to claim 1, wherein the organic EL device is located on a projection surface, and a conductive base material is bonded by the soft adhesive layer.

  According to the structure of this invention, a soft contact bonding layer is located in the said light emission area | region. That is, it is possible to relieve stress due to a shape change such as thermal expansion of the laminate in the light emitting region.

  The invention according to claim 3 is the organic EL device according to claim 1 or 2, wherein the hard wall portion is formed along the edge of the substrate.

  According to the structure of this invention, since the rigidity of the edge of a base material improves, even if a base material has a softness | flexibility, it is easy to maintain a shape.

  According to a fourth aspect of the present invention, in the organic EL device according to any one of the first to third aspects, the power supply member is disposed so as to extend from the power supply region to the light emitting region.

  According to the configuration of the present invention, since the power feeding member is disposed across the light emitting region from the power feeding region, the area of the power feeding region can be reduced. That is, it is possible to increase the ratio of the light emitting region on the base material.

  The invention according to claim 5 is characterized in that the hard wall portion is formed of a hard resin having an insulating property and covers a part of the conductive base material. An organic EL device according to any one of the above.

  According to the structure of this invention, the hard wall part has covered a part of electroconductive base material. That is, the conductive base material and the laminate are integrated by the hard wall portion. Therefore, the position of the conductive substrate can be fixed at a desired position.

  6. The organic EL device according to claim 1, wherein the power feeding member is a bonding wire (Claim 6).

  The invention according to claim 7 is the organic EL device according to any one of claims 1 to 6, wherein the power feeding member is entirely buried in the hard wall portion.

  According to the configuration of the present invention, since the power supply member is entirely embedded in the hard wall portion, the strength of the power supply member can be reinforced. In addition, noise is hard to enter.

  According to the organic EL device of the present invention, since the power supply member is buried, the strength of the power supply member can be reinforced, and since it is electrically connected to the outside in the light emitting region, the area of the power supply region is reduced. Can do.

It is the perspective view which observed the organic EL device concerning a 1st embodiment of the present invention from the back side. It is a partially broken perspective view of the organic EL device of FIG. It is AA sectional drawing of the organic electroluminescent apparatus of FIG. It is BB sectional drawing of the organic electroluminescent apparatus of FIG. 2A and 2B are explanatory diagrams of the organic EL device of FIG. 1, in which FIG. 1A is a plan view viewed from a conductive base material side, and FIG. 1B is a plan view viewed from a substrate side. For easy understanding, the hard resin layer is omitted. It is explanatory drawing of each process until it forms the 1st inorganic sealing layer of the organic EL apparatus of FIG. 1, (a)-(g) is a top view in each procedure. It is explanatory drawing of the process of forming the soft resin layer of the organic EL apparatus of FIG. 1, (a)-(c) represents each process. It is explanatory drawing to the process of forming the hard resin layer of the organic EL apparatus of FIG. 1, (d)-(f) represents each process. FIG. 9 is a conceptual diagram of the organic EL device in the state of FIG.

  The present invention relates to an organic EL device. FIG. 1 shows an organic EL device 1 according to the first embodiment of the present invention. Hereinafter, the vertical positional relationship will be described based on the posture of FIG. 1 unless otherwise specified. That is, the light extraction side when the organic EL device 1 is turned on is on the bottom.

  In the organic EL device 1 of the present embodiment, an organic EL element 12 is laminated on a substrate 2 (base material) having translucency as shown in FIG. 2, and an inorganic sealing layer 7 (sealing) is further formed thereon. Stop layer), soft resin layer 8, hard resin layer 10 (hard wall portion), and conductive substrate 80. The organic EL element 12 is formed from the first electrode layer 3, the functional layer 5, and the second electrode layer 6.

The organic EL device 1 includes a light emitting region 30 that actually emits light during driving and a non-light emitting region 29 that does not emit light around the light emitting region 30 as shown in FIGS.
The non-light emitting region 29 is formed of power feeding regions 31 and 32 that feed power to the organic EL element 12 in the light emitting region 30 and sealing regions 33 and 34 that contribute to sealing of the organic EL element 12 in the light emitting region 30. Yes.

  The light emitting region 30 is a portion where the first electrode layer 3, the functional layer 5, and the second electrode layer 6 are overlapped as shown in FIGS. The light emitting region 30 is located in the center of the length direction l and the width direction w (direction orthogonal to the length direction l) as shown in FIGS. 3 and 4, and is a non-light emitting region so as to surround the light emitting region 30. 29 is located. Specifically, the power feeding regions 31 and 32 are located on both outer sides in the length direction l of the light emitting region 30 as shown in FIG. 3, and the sealing regions 33 and 34 are arranged as shown in FIG. Are located on both outer sides in the width direction w. That is, the power feeding regions 31 and 32 are arranged along the opposite side as shown in FIG. 5B, and the sealing regions 33 and 34 are arranged along two sides other than the opposite side.

  In the power feeding regions 31 and 32, the first electrode layer 3 and the conductive layers 85 and 86 are directly stacked as shown in FIG. 3, and the conductive layers 85 and 86 supply electricity supplied from the outside to the organic EL element 12. Functions as a power feeding unit.

  In the organic EL device 1 of the present embodiment, the hard resin layer 10 covers the periphery of the light emitting region 30 to form a wall as shown in FIG. 2, and part or all of the wires 87 and 88 are in the hard resin layer 10. Is buried. And it has the characteristics that the conductive layers 85 and 86 and the electroconductive base material 80 are connected via the said wires 87 and 88. FIG. Hereinafter, based on this feature, first, the positional relationship of each component will be described, and the properties of each component will be described later.

As described above, the organic EL device 1 includes the first electrode layer 3, the functional layer 5, and the second electrode layer 6 stacked in this order on the substrate 2 as shown in FIG. In addition, the inorganic sealing layer 7, the soft resin layer 8, and the conductive substrate 80 are laminated in this order.
Further, in a part of the power feeding regions 31 and 32, conductive layers 85 and 86 are stacked on the first electrode layer 3, and the hard resin layer 10 is stacked thereon. The conductive layers 85 and 86 and the conductive substrate 80 are connected by wires 87 and 88.

  The hard resin layer 10 fixes the conductive substrate 80 so that the conductive substrate 80 is not separated from the organic EL element 12 side. That is, the hard resin layer 10 covers a part of the conductive base material 80, encloses the edge of the conductive base material 80, and surrounds the region including the light emitting region 30 as shown in FIG. Is forming. In the present embodiment, the hard resin layer 10 is formed on the non-light emitting region 29 as shown in FIGS.

  The hard resin layer 10 covers most of the wires 87 and 88 as shown in FIG. In other words, most of the wires 87 and 88 are embedded in the hard resin layer 10. In the present embodiment, the entire wires 87 and 88 are buried in the hard resin layer 10. That is, the wires 87 and 88 are not exposed to the outside.

When attention is paid to the relationship between the conductive layers 85 and 86 and the conductive substrate 80, the conductive layers 85 and 86 located in the power feeding regions 31 and 32 and the conductive located mainly on the projection surface in the member thickness direction of the light emitting region 30. The conductive substrate 80 is connected by wires 87 and 88.
That is, one end of the wires 87 and 88 is connected to the conductive layers 85 and 86 through exposed regions 97 and 98 exposed from the inorganic sealing layer 7 as shown in FIG. The other end is connected to the conductive substrate 80 by a covering region 99 covered by the inorganic sealing layer 7.
In other words, one end of the wire 87 is connected to the conductive layer 85 in the power feeding region 31, and the other end is connected to the conductive base material 80 in the light emitting region 30. That is, the wire 87 is attached across the light emitting region 30 from the power feeding region 31. One end of the wire 88 is connected to the conductive layer 86 in the power supply region 32, and the other end is connected to the conductive substrate 80 in the power supply region 32. The wires 87 and 88 are not in contact with the inorganic sealing layer 7 and the soft resin layer 8 as shown in FIG.

  The soft resin layer 8 is laminated on the inorganic sealing layer 7 as shown in FIGS. 3 and 4 so as to cover at least the entire projection surface of the light emitting region 30 in the member thickness direction. The soft resin layer 8 extends to the entire second electrode layer 6 in the length direction l as shown in FIG. The soft resin layer 8 spreads in a planar shape and covers most of the inorganic sealing layer 7.

  The conductive substrate 80 is a foil-like or plate-like member, and three layers of a first conductive foil 81, an insulating sheet 82, and a second conductive foil 83 are laminated in order from the substrate 2 side as shown in FIG. Is formed.

As shown in FIG. 1, the conductive substrate 80 has a connection portion 90 that can be electrically connected to an external power source in the center in a plan view. Specifically, the first connection hole 91 is formed in the insulating sheet 82, and the second connection hole 92 is formed in the second conductive foil 83. The first conductive foil 81 is exposed from the first connection hole 91, and the first conductive foil 81 and the insulating sheet 82 are exposed from the second connection hole 92. The insulating sheet 82 has an annular shape surrounding a part of the first conductive foil 81 and functions as a safety zone when energized.
The first connection hole 91 and the second connection hole 92 both have a circular opening as shown in FIG. 1 and have different opening diameters. The opening diameter of the first connection hole 91 is smaller than the opening diameter of the second connection hole 92 and both are concentric. That is, both the first connection hole 91 and the second connection hole 92 form a continuous communication hole, and the second conductive layer is formed by inserting a power supply terminal 93 electrically connected to an external power source into the communication hole. The first conductive foil 81 can be connected from the foil 83 side.
As described above, the conductive substrate 80 connects one pole (for example, positive electrode) of the power supply terminal 93 that is electrically connected to the external power source to the first conductive foil 81, and connects the other pole ( For example, it is possible to connect the negative electrode) to the second conductive foil 83.

The material of the 1st conductive foil 81 and the 2nd conductive foil 83 will not be specifically limited if it has electroconductivity, Copper foil, aluminum foil, silver foil, gold foil, platinum foil, etc. are employable.
The material of the insulating sheet 82 is not particularly limited as long as it has insulating properties, but from the viewpoint of high sealing properties, polyethylene terephthalate (PET), polyvinylidene chloride (PVDC), and polytetrafluoroethylene (PTFE). ) Is preferable.

When the eyes are moved to the wires 87 and 88, the wires 87 and 88 are both linear members and are so-called bonding wires. The diameters of the wires 87 and 88 are 15 μm or more and 100 μm or less, and preferably 50 μm or more and 100 μm or less.
Although the material of the wires 87 and 88 will not be specifically limited if it has electrical conductivity, For example, a copper wire, a silver wire, a gold wire, an aluminum wire etc. are employable.

  Moving to the conductive layers 85 and 86 located in the power supply regions 31 and 32, the conductive layers 85 and 86 are layers made of a material having higher electrical conductivity than the first electrode layer 3. As a material of the conductive layers 85 and 86, for example, when a transparent conductive oxide is used as the first electrode layer 3, a metal can be used, particularly gold, silver, copper, aluminum, platinum, and the like. Is preferred. In the present embodiment, the second electrode layer 6 is formed of the same material as that of the second electrode layer 6 and is formed simultaneously with the formation of the second electrode layer 6 as will be described later.

  The conductive layer 85 is connected to the first conductive foil 81 of the conductive base member 80 through the wire 87 as shown in FIG. That is, the wire 87 is connected across a plurality of regions of the power feeding region 31 and the light emitting region 30. Similarly, the conductive layer 86 is connected to the second conductive foil 83 of the conductive base material 80 via the wire 88.

As shown in FIG. 3, the first electrode layer 3 has a first electrode layer separation groove 15 extending in parallel with one side in the vicinity of one side in the length direction l (longitudinal direction in the drawing). Yes. The first electrode layer separation groove 15 is a groove that divides the first electrode layer 3 into two regions, and is a groove that separates the light emitting region 30 and the power feeding region 32.
The second electrode layer 6 and the first electrode layer 3 are in contact with each other outside the first electrode layer separation groove 15 (on the side opposite to the light emitting region 30), and further outside the conductive layer 86 and the first electrode layer. 3 is in contact.
That is, there is a conductive layer separation groove 78 between the second electrode layer 6 constituting the organic EL element 12 and the conductive layer 86, and the inorganic sealing layer 7 enters the conductive layer separation groove 78.
On the other hand, there is also a conductive layer separation groove 77 between the second electrode layer 6 and the conductive layer 85 constituting the organic EL element 12 located on the opposite side, and the inorganic sealing layer 7 is formed in the conductive layer separation groove 77. It has entered.

As shown in FIGS. 5A and 5B, the inorganic sealing layer 7 is formed on at least the entire surface of the light emitting region 30 and further reaches a part of the power feeding regions 31 and 32.
Specifically, the inorganic sealing layer 7 partially protrudes outward from the conductive layer separation groove 77 and the conductive layer separation groove 78 as shown in FIG. 3 and covers a part of the conductive layers 86 and 87. Yes. The inorganic sealing layer 7 covers the end surface of the second electrode layer 6.

  Next, physical properties and the like of each constituent member constituting the organic EL device 1 will be described. In addition, about the physical property which overlaps with said description, it abbreviate | omits.

The board | substrate 2 has translucency and insulation. The material of the substrate 2 is not particularly limited, and is appropriately selected from, for example, a flexible film substrate or a plastic substrate. In particular, a glass substrate or a transparent film substrate is preferable in terms of transparency and good workability.
The substrate 2 has a planar shape. Specifically, it is polygonal or circular, and is preferably square. In this embodiment, a rectangular glass substrate is employed.

The material of the first electrode layer 3 is not particularly limited as long as it is transparent and has conductivity. For example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation Transparent conductive oxides such as tin (SnO ₂ ) and zinc oxide (ZnO) are employed. ITO or IZO, which has high transparency, is particularly preferable in that light generated from the light emitting layer in the functional layer 5 can be effectively extracted. In this embodiment, ITO is adopted.

  The functional layer 5 is a layer provided between the first electrode layer 3 and the second electrode layer 6 and having at least one light emitting layer. The functional layer 5 is composed of a plurality of layers mainly made of organic compounds. The functional layer 5 can be formed of a known material such as a low molecular dye material or a conjugated polymer material used in a general organic EL device. In addition, the functional layer 5 may have a multilayer structure including a plurality of layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.

The material of the 2nd electrode layer 6 is not specifically limited, For example, metals, such as silver (Ag) and aluminum (Al), are mentioned. The second electrode layer 6 of this embodiment is made of Al. These materials are preferably deposited by sputtering or vacuum evaporation.
In addition, the electrical conductivity and thermal conductivity of the second electrode layer 6 are larger than those of the first electrode layer 3. In other words, the second electrode layer 6 has higher electrical conductivity and thermal conductivity than the first electrode layer 3.

The material of the inorganic sealing layer 7 is not particularly limited as long as it has insulating properties and sealing properties, but one or more elements selected from oxygen, carbon, and nitrogen, and silicon It is preferably formed of a silicon alloy composed of an element, and silicon nitride or silicon oxide containing a bond such as Si—O, Si—N, Si—H, or N—H, and an oxynitride that is an intermediate solid solution of both. Particularly preferred is silicon.
The inorganic sealing layer 7 is preferably a layer in which compressive stress is generated in a direction away from the organic EL element 12 under predetermined conditions.
Here, the “predetermined condition” refers to a case where a pressing force generated due to thermal expansion of the organic EL element 12 is received.

In this embodiment, an inorganic sealing layer having a multilayer structure is used.
Specifically, the inorganic sealing layer 7 includes a first inorganic sealing layer 50 formed by a dry method from the organic EL element 12 side as shown in FIG. 3 and a second inorganic sealing layer formed by a wet method. 51 are laminated in this order.
The first inorganic sealing layer 50 is a layer formed by chemical vapor deposition, and more specifically, a layer formed by plasma CVD using silane gas, ammonia gas, or the like as a raw material. Since the 1st inorganic sealing layer 50 can be formed into a film continuously in the formation process of the organic EL element 12 in an atmosphere with a low moisture content in the manufacturing process of the organic EL device 1 as will be described later. Film formation can be performed without exposure, and the occurrence of initial dark spots immediately after use can be reduced.

The second inorganic sealing layer 51 is a layer formed through a chemical reaction after applying a liquid or gel material. The second inorganic sealing layer 51 is made of dense silica. More specifically, the second inorganic sealing layer 51 is preferably made of a polysilazane derivative. In the case where the second inorganic sealing layer 51 is formed by silica conversion using a polysilazane derivative, weight increase occurs during silica conversion, and volume shrinkage is small. In addition, there is an advantage that cracks can be prevented from being generated sufficiently at a temperature that can be withstood by the resin during silica conversion (solidification).
Here, the polysilazane derivative is a polymer having a silicon-nitrogen bond, such as SiO ₂ , Si ₃ N _{4 made of} Si—N, Si—H, N—H, etc., and a ceramic such as an intermediate solid solution SiOxNy of both. It is a precursor polymer. The polysilazane derivative also includes a derivative in which a hydrogen part bonded to Si is partially substituted with an alkyl group or the like.
Among the polysilazane derivatives, perhydropolysilazane in which all side chains are hydrogen, and derivatives in which a hydrogen part bonded to silicon is partially substituted with a methyl group are particularly preferable.

  Moreover, it is preferable to apply and use this polysilazane derivative in the solution state melt | dissolved in the organic solvent. As the organic solvent to be dissolved, hydrocarbon solvents such as aliphatic hydrocarbons, alicyclic hydrocarbons and aromatic hydrocarbons, ethers such as halogenated hydrocarbon solvents, aliphatic ethers and alicyclic ethers can be used. .

  The second inorganic sealing layer 51 is formed by laminating a material different from that of the first inorganic sealing layer 50 as the sealing layer. Generation of dark spots can be prevented, and the expansion of the generated dark spots can be suppressed.

The average thickness of the inorganic sealing layer 7 is preferably 1 μm to 10 μm, and more preferably 2 μm to 5 μm.
The thickness of the first inorganic sealing layer 50 that bears a part of the inorganic sealing layer 7 is preferably 0.5 μm to 5 μm, and more preferably 1 μm to 2 μm.
The thickness of the second inorganic sealing layer 51 that bears a part of the inorganic sealing layer 7 is preferably 0.5 μm to 5 μm, and more preferably 1 μm to 3 μm.

The soft resin layer 8 is a layer that has flexibility and undergoes plastic deformation or elastic deformation under a predetermined condition. In the present embodiment, when the soft resin layer 8 receives a compressive stress of the inorganic sealing layer 7 or the like, the soft resin layer 8 can be plastically deformed with almost no resistance to the stress. The shore hardness of the soft resin layer 8 according to JIS K 6253 is such that the Shore hardness is preferably A30 or more and A70 or less, more preferably A30 or more and A65 or less, and A45 or more and A63 or less. Further preferred.
When the shore hardness of the soft resin layer 8 is larger than A70, the rigidity of the soft resin layer 8 is too large to sufficiently absorb swelling and impact.
The flexural modulus of the soft resin layer 8 is preferably 3 MPa or more and 30 MPa or less, more preferably 3 MPa or more and 25 MPa or less, and particularly preferably 3.9 MPa or more and 23 MPa or less.

Specific materials for the soft resin layer 8 include acrylic rubber (ACM), ethylene propylene rubber (EPM, EPDM), silicone rubber (Q), butyl rubber (IIR), styrene-butadiene rubber (SBR), and butadiene rubber (BR). ), Fluoro rubber (FKM), nitrile rubber (NBR), isoprene rubber (IR), urethane rubber (U), chlorosulfonated polyethylene (CSM), epichlorohydrin rubber (CO, ECO), chloroprene rubber (CR), etc. One or more materials selected from acrylic rubber-based resins, ethylene-propylene rubber-based resins, silicone rubber-based resins, and butyl rubber-based resins can be used, although they have a certain water vapor barrier property and are available at low cost. In particular, butyl rubber, which is easily available as a film, is preferable. System resin is more preferable.
Moreover, the soft resin layer 8 of this embodiment has adhesiveness, and a plurality of members can be bonded to each other. Specifically, the soft resin layer 8 of the present embodiment is a sheet-like or plate-like member, and the surface is subjected to adhesive processing.

  The thickness of the soft resin layer 8 is set so that a portion corresponding to a local short-circuit defect (electrically short-circuited) of the organic EL element 12 swells to become a local open defect (electrically open-circuit). From the viewpoint of preventing the light itself from being turned off, and from the viewpoint of taking advantage of the thinness of the organic EL device while sufficiently absorbing shock, it is preferably 2 μm or more and 1000 μm or less, and is 10 μm or more and 200 μm or less. More preferably, it is 20 μm or more and 100 μm or less.

The hard resin layer 10 is made of a hard material having higher rigidity than the soft resin layer 8. Specifically, the shore hardness (and the approximate value of the corresponding flexural modulus) of the hard resin layer 10 according to JIS K 6253 is preferably Shore A80 or higher, that is, Shore D30 or higher (25 MPa or higher). From the viewpoint of providing a highly reliable organic EL device, Shore D55 or more (250 MPa or more), Shore D95 or less (6000 MPa or less) is more preferable, Shore D80 or more (1500 MPa or more), Shore D90 or less (4000 MPa or less). More preferably.
Moreover, the hard resin layer 10 of this embodiment has waterproofness and adhesiveness (adhesiveness), and a plurality of members can be bonded to each other. Specifically, the hard resin layer 10 of the present embodiment is formed by solidifying a solution or gel fluid.
As a specific material of the hard resin layer 10, for example, an epoxy resin adhesive can be employed. In this embodiment, an epoxy resin adhesive is used.
The hard wall portion according to the present invention composed of such a hard resin layer 10 supports the conductive base material 80 according to the present invention with sufficient strength, and sufficiently allows moisture to enter the organic EL element 12. The frame region that becomes the non-light-emitting region 29 in which the bonding wires 87 and 88 (feeding members) according to the present invention are reinforced with sufficient strength, the oxidation is prevented, and the hard wall portion exists is provided. From the viewpoint of narrowing, the width (hard wall thickness) D1, D2 of the hard resin layer 10 in the direction parallel to the surface of the substrate 2 shown in FIG. 1 is preferably 0.05 mm or more and 10 mm or less, It is more preferably 0.1 mm or more and 5 mm or less, and further preferably 0.5 mm or more and 2 mm or less.

Next, a method for manufacturing the organic EL device 1 according to this embodiment will be described.
The organic EL device 1 is manufactured by forming a film using a vacuum vapor deposition device and a CVD device (not shown), and patterning using a patterning device (not shown), in this embodiment, a laser scribing device.

First, the organic EL element formation process which laminates | stacks the organic EL element 12 is performed.
Specifically, first, the first electrode layer 3 is formed on a part or all of the substrate 2 by sputtering or CVD (FIGS. 6A to 6B).
At this time, in the present embodiment, the first electrode layer 3 is disposed in the vicinity of the long side (side extending in the length direction) and the short side (side orthogonal to the long side and extending in the width direction) of the substrate 2. Are not laminated.

Thereafter, the first electrode layer separation groove 15 is formed on the substrate on which the first electrode layer 3 is formed by a laser scribing device (FIGS. 6B to 6C).
At this time, the first electrode layer separation groove 15 is formed in parallel to the short side of the substrate 2 and extends over the entire width direction.
The first electrode layer separation groove 15 is formed at a boundary portion between the power feeding region 32 and the light emitting region 30 when the organic EL device 1 is formed. That is, the first electrode layer separation groove 15 divides the first electrode layer 3 into two regions in the length direction.

Next, when the organic EL device is completed, a portion corresponding to the entire power supply region 31 and a portion corresponding to a part of the power supply region 32 are concealed with a mask, and an electron injection layer, an electron transport layer, a light emitting layer, A hole transport layer, a hole injection layer, and the like are sequentially stacked to form the functional layer 5 (FIGS. 6C to 6D).
At this time, the functional layer 5 is laminated in the first electrode layer separation groove 15, the functional layer 5 is filled in the first electrode layer separation groove 15, and the functional layer 5 is laminated on most of the substrate.

Thereafter, the second electrode layer 6 is formed on almost the entire surface of the substrate on which the functional layer 5 is formed by using a vacuum vapor deposition apparatus (FIGS. 6D to 6E).
At this time, the second electrode layer 6 is laminated at the portion hidden by the mask (the portion where the functional layer 5 is not covered), and the first electrode layer 3 and the second electrode layer 6 (conductive layers 85 and 86). Are fixed in contact with each other, and the first electrode layer 3 and the second electrode layer 6 (conductive layers 85 and 86) are electrically connected.

Thereafter, conductive layer separation grooves 77 and 78 are formed on the substrate on which the second electrode layer 6 is formed by a laser scribing device (FIGS. 6E to 6F).
At this time, the conductive layer separation grooves 77 and 78 are formed in parallel with the first electrode layer separation groove 15 and are outside the region where the functional layer 5 is laminated, and the second electrode layer 6 is laminated. Formed in the region. The conductive layer separation groove 77 is formed at a boundary portion between the power feeding region 31 and the light emitting region 30 when the organic EL device 1 is formed. The conductive layer separation groove 78 is formed outside the boundary portion between the light emitting region 30 and the power feeding region 32 (on the power feeding region 32 side) when the organic EL device 1 is formed.
The above is the organic EL element forming step.

Then, the inorganic sealing layer lamination process which forms the inorganic sealing layer 7 is performed.
First, a part of the substrate is covered with a mask, and the first inorganic sealing layer 50 is formed by a CVD apparatus (FIGS. 6 (f) to 6 (g)).
At this time, the first inorganic sealing layer 50 covers at least the second electrode layer 6 in the light emitting region 30, and further extends onto the projection surface in the member thickness direction of the conductive layer separation grooves 77 and 78. That is, the first inorganic sealing layer 50 is stacked and filled in the conductive layer separation grooves 77 and 78. Therefore, a sufficient sealing function can be ensured.
Furthermore, the first inorganic sealing layer 50 of the present embodiment extends beyond the conductive layer separation grooves 77 and 78 in the length direction l as shown in FIG. 3, and in the width direction w as shown in FIG. It reaches to the vicinity of the long side of the substrate. That is, the first inorganic sealing layer 50 is formed on part of the conductive layers 85 and 86. Therefore, the heat transfer property and the sealing property can be further improved.

Thereafter, the first inorganic sealing layer 50 is taken out from the CVD apparatus, and the raw material of the second inorganic sealing layer 51 is applied to form the second inorganic sealing layer 51, whereby the inorganic sealing layer 7 is formed. Is done.
At this time, the second inorganic sealing layer 51 covers the entire surface of the first inorganic sealing layer 50.
Thus, the 2nd inorganic sealing layer 51 is laminated | stacked on the 1st inorganic sealing layer 50, and the inorganic sealing layer 7 is formed.

Then, the electroconductive base material adhesion process which adheres the electroconductive base material 80 to the inorganic sealing layer 7 formed by the above-mentioned procedure is performed.
In the conductive substrate bonding step, the soft resin layer 8 is formed and the conductive substrate 80 is bonded to the inorganic sealing layer 7.
Specifically, the soft resin layer 8 is bonded onto the inorganic sealing layer 7 with a vacuum laminator (FIGS. 7A to 7B).
At this time, when the soft resin layer 8 is formed, an insulating separator coated on both surfaces of the soft resin layer 8 is used. At the time of bonding, the separator on one side of the soft resin layer 8 is peeled off, and the peeled surface is bonded onto the inorganic sealing layer 7.
In this bonded state, the soft resin layer 8 covers the entire light emitting region 30 and further extends to a part of the power feeding region 32 in the length direction l as shown in FIG. The grooves 77 and 78 are not reached. That is, the outer side of the conductive layer separation grooves 77 and 78 is not covered with the soft resin layer 8 and the inorganic sealing layer 7 is exposed. In other words, on the inorganic sealing layer 7, a portion where the soft resin layer 8 is exposed and a portion covered with the soft resin layer 8 are mixed as shown in FIGS. 3 and 4, and the portion covered with the soft resin layer 8. Is located at the center in the width direction and the length direction.

  Thereafter, the separator on the surface opposite to the peeling surface is peeled off, and the conductive substrate 80 is placed and bonded with a vacuum laminator (FIGS. 7C and 8D).

  At this time, the conductive substrate 80 covers the entire surface of the soft resin layer 8 and is integrated with the inorganic sealing layer 7 by the adhesive function of the soft resin layer 8. That is, the conductive substrate 80 indirectly covers the entire surface of the organic EL element 12 in the light emitting region 30.

Thereafter, the conductive substrate 80 and the conductive layers 85 and 86 are connected by wire bonding (FIG. 8E).
Specifically, as shown in FIG. 5A, the vicinity of one side of the conductive substrate 80 and the conductive layer 85 are bonded with a plurality of wires 87. The conductive substrate 86 is bonded to the vicinity of the opposite side of the one side of the conductive substrate 80 with a plurality of wires 88.
At this time, the wire 87 passes over the vertical projection surface of the conductive layer separation groove 77 as shown in FIG. 3, and the wire 88 passes over the vertical projection surface of the conductive layer separation groove 78. Yes. Since the conductive layers 85 and 86 and the conductive substrate 80 are connected by the plurality of wires 87 and 88, the connection strength is high, and the conductive layers 85 and 86 are difficult to peel off against the pulling of the wires 87 and 88. Therefore, it is highly reliable.

Subsequently, the raw material of the hard resin layer 10 is applied to the substrate by the dispenser 70 to form the hard resin layer 10 (FIG. 8F).
At this time, a part of the conductive substrate 80 is buried in the hard resin layer 10. That is, the conductive substrate 80 is fixed by the soft resin layer 8 and the hard resin layer 10 both having adhesiveness.
Further, the hard resin layer 10 is formed by being applied across the conductive base material 80 and the conductive layers 85 and 86 in the length direction as shown in FIG. 3, and is conductive in the width direction as shown in FIG. The base material 80 and the first electrode layer 3 are applied and formed.
Most of the conductive substrate 80 located in the light emitting region 30 is not covered with the hard resin layer 10 as shown in FIG. That is, an opening through which the conductive substrate 80 is exposed is formed. The opening shape is substantially rectangular, and the area of the opening is slightly larger than the area of the light emitting region 30. The area of the opening is 90% or more and 98% or less of the formation area of the conductive substrate 80, and is preferably 95% or more and 98% or less.
The wires 87 and 88 are hardened while being buried in the hard resin layer 10. That is, it is a pseudo potting seal.

  In this way, the conductive substrate bonding step is completed, and the organic EL device 1 is completed.

  According to the organic EL device 1 of the present embodiment, since the wires 87 and 88 are covered with the hard resin layer 10, the strength of the wires 87 and 88 can be supplemented by the hardness of the hard resin layer 10. The wires 87 and 88 are difficult to break. In addition, since the plurality of wires 87 and 88 are covered with the common hard resin layer 10 and the hard resin layer 10 has a spread in the side direction, it is difficult to be affected by external force and to be disconnected.

  In the above-described embodiment, the case where a rectangular glass substrate is used as the substrate 2 has been described. However, the present invention is not limited to this and may be a square shape.

1 Organic EL device 2 Substrate (base material)
3 First electrode layer 5 Functional layer (organic light emitting layer)
6 Second electrode layer 7 Inorganic sealing layer (sealing layer)
8 Soft resin layer (soft adhesive layer)
10 Hard resin layer (hard wall)
11 Moisture-proof member 12 Organic EL element (laminate)
30 Light emitting area 31, 32 Power feeding area 80 Conductive base material 87,88 Wire (bonding wire)

Claims (7)

A light emitting region that has a cross-sectional structure including a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer in order on the base material, and that actually emits light when the base material is viewed in plan view. In an organic EL device having a power feeding region to which a power feeding member is connected,
It has a hard wall portion surrounding the region including the light emitting region, and at least a part of the power supply member is buried in the hard wall portion,
Power is supplied to the power supply region from the outside through the buried power supply member,
Furthermore, it has a conductive substrate having electrical conductivity on the second electrode layer,
The organic base material is electrically connected to the power supply region via the power supply member, and is electrically fed from the outside through the conductive base material in the light emitting region. EL device. It has a sealing layer that seals all or part of the laminate,
A soft adhesive layer exists on the sealing layer,
The soft adhesive layer is located on the projection surface of the light emitting region,
The organic EL device according to claim 1, wherein the conductive base material is adhered by the soft adhesive layer.   The organic EL device according to claim 1, wherein a hard wall portion is formed along the edge of the base material.   The organic EL device according to claim 1, wherein the power supply member is disposed so as to extend from the power supply region to the light emitting region. The hard wall portion is formed of a hard resin having insulating properties,
The organic EL device according to claim 1, wherein a part of the conductive base material is covered.   The organic EL device according to claim 1, wherein the power supply member is a bonding wire.   The organic EL device according to any one of claims 1 to 6, wherein the power supply member is entirely buried in the hard wall portion.

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