JP2014053230A - Lead member for nonaqueous electrolyte power storage device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a lead member for a nonaqueous electrolyte power storage device using aluminum or aluminum alloy as a lead conductor to be used as not only for a positive electrode but also for a negative electrode.SOLUTION: A lead member 4 is formed by pasting an insulation film 5 on both conductor surfaces so as to protrude from both sides of the conductor width in an intermediate region of a flat conductor 4a made of aluminum or aluminum alloy. Then, the flat conductor 4a has a portion where a conductive plating 4b is applied to the whole surface of a conductive portion III exposed into at least a nonaqueous electrolyte power storage device of conductive portions I, III exposed without pasting of the insulation film 5, and a portion where the plating 4b is not applied to a part 4c of a conductive portion II (intermediate region) to which the insulation film 5 is pasted.

Description

  The present invention relates to a lead member for a non-aqueous electrolyte electricity storage device and a method for manufacturing the same.

  For example, non-aqueous electrolyte batteries such as lithium ion batteries are used as power sources for small electronic devices. This non-aqueous electrolyte battery has a structure in which a positive electrode plate, a negative electrode plate, and an electrolytic solution are accommodated in an enclosure made of a multilayer film, and lead members connected to the positive electrode plate and the negative electrode plate are sealed and taken out to the outside. Things are known. As the multilayer film forming the encapsulant, a highly hermetic multilayer film in which a metal foil layer made of a metal such as aluminum is sandwiched between the innermost layer film and the outermost layer film is used.

The lead member for the positive electrode is preferably a material that does not melt at a high potential, and aluminum, titanium, or an alloy of these metals is used.
For example, Patent Document 1 discloses a lead member using aluminum as a lead conductor. The lead member is nickel-plated on the conductor portion that is the outside of the nonaqueous electrolyte electricity storage device. This is because when connecting a plurality of non-aqueous electrolyte electricity storage devices in series to a negative electrode lead member that is connected to the negative electrode lead member, or for monitoring the voltage of the electricity storage device. This is because when connecting lead wires, aluminum is difficult to solder and it is difficult to connect the two by soldering.

On the other hand, when a lead member using aluminum as a lead conductor as described in Patent Document 1 is used for a negative electrode of a non-aqueous electrolyte battery such as a lithium ion battery, components such as lithium in the electrolytic solution are caused by overcharging. It precipitates and the shape of the lead member changes.
Therefore, the lead member for the negative electrode is preferably made of a material that hardly forms an alloy with lithium and is difficult to dissolve at a relatively high potential, and nickel, copper, or an alloy of these metals is used.

JP 2011-181300 A

  As described above, when the lead member described in Patent Document 1 is used for a negative electrode of a non-aqueous electrolyte battery such as a lithium ion battery, components such as lithium in the electrolytic solution are precipitated due to overcharge, and the shape of the lead member Therefore, it is necessary to use copper, nickel or the like as the lead conductor as the lead member.

  The present invention has been made in view of the actual situation as described above, and its purpose is not only for the positive electrode but also for the negative electrode in a lead member for a non-aqueous electrolyte electricity storage device using aluminum or an aluminum alloy as a lead conductor. And a manufacturing method for efficiently manufacturing such a lead member.

  The lead member for a nonaqueous electrolyte electricity storage device according to the present invention is formed by bonding insulating films on both sides of a conductor so as to protrude from both sides of the conductor width in an intermediate region of a flat conductor made of aluminum or an aluminum alloy. And, the present invention, the flat conductor is subjected to conductive plating on the entire surface of the conductor portion exposed in the non-aqueous electrolyte electricity storage device among the conductor portions exposed without the insulating film being affixed, And it has the part which the said plating is not given to a part of conductor part to which the said insulating film is bonded together.

  Here, it is preferable that the portion not plated is on the main surface of the flat conductor and / or the portion not plated is on the side surface of the flat conductor. The plating is preferably nickel plating.

  The manufacturing method according to the present invention includes a lead member for a nonaqueous electrolyte electricity storage device in which an insulating film is bonded to both sides of a conductor so as to protrude from both sides of the conductor width in an intermediate region of a flat conductor made of aluminum or an aluminum alloy. It is a manufacturing method to manufacture, a plating step of conducting conductive plating on a conductor including at least the flat conductor, and a bonding step of attaching an insulating film to both sides of the flat conductor so as to protrude from both sides of the conductor width And having. Then, the plating step is performed by removing the flat conductor from the entire conductive portion exposed in the non-aqueous electrolyte electricity storage device and the intermediate region except for a portion of the conductive portion exposed without the insulating film. In the bonding step, an insulating film is bonded to the flat conductor from both sides of the conductor so as to cover a portion where the plating is not performed.

Here, the plating is preferably performed by applying an electrode to the main surface of the flat conductor.
Alternatively, a plurality of the flat conductors are connected to each other by mounting legs by punching a plurality of portions of a predetermined shape of a strip-shaped conductor made of aluminum or aluminum alloy, and then plating the strip-shaped conductor in the plating step, and then By cutting the part of the mounting foot, a flat conductor plated on the entire surface excluding the cut surface is generated, and the above bonding process is performed so that the cut surface is covered with the insulating film. Are preferably bonded together.

  According to the lead member for a non-aqueous electrolyte electricity storage device according to the present invention, an insulating film is bonded to aluminum or an aluminum alloy from both sides, and conductive plating is applied to the aluminum or aluminum alloy in a region other than the region where the insulating film is bonded. Thus, it can be used not only for the positive electrode but also for the negative electrode. Further, the use of aluminum or an aluminum alloy makes the lead member lightweight. Moreover, according to the manufacturing method which concerns on this invention, such a lead member can be manufactured efficiently.

It is the schematic which shows one structural example of the lead member which concerns on this invention, and the nonaqueous electrolyte electrical storage device using the lead member. It is a figure which shows one structural example of the lead member which concerns on this invention. It is a figure for demonstrating an example of the manufacturing method which manufactures the lead member of FIG. It is a figure which shows the other structural example of the lead member which concerns on this invention. It is a figure which shows the other structural example of the lead member which concerns on this invention. It is a figure for demonstrating an example of the manufacturing method which manufactures the lead member of FIG. It is a figure for demonstrating the other example of the manufacturing method which manufactures the lead member of FIG. It is a figure for demonstrating the other example of the manufacturing method which manufactures the lead member which concerns on this invention.

The lead member according to the present invention is used for a non-aqueous electrolyte electricity storage device and is also called a tab lead.
Hereinafter, an outline of a lead member according to the present invention and a nonaqueous electrolyte electricity storage device using the lead member will be described with reference to the drawings.

  First, the configuration example shown in FIGS. 1 and 2 will be described. FIG. 1A is an external view showing a nonaqueous electrolyte battery as an example of a nonaqueous electrolyte electricity storage device, and FIG. 1B is a cross-sectional view showing a sealed state of a lead member on the negative electrode side. FIG. 2A is a top view showing a configuration example of the lead member according to the present invention, and is a top view of the lead member in FIG. 2B is a vertical sectional view of the intermediate region of the lead member of FIG. 2A, and FIG. 2C is a horizontal sectional view of the intermediate region of the lead member of FIG. 2A. 1 and 2, 1 is a non-aqueous electrolyte battery, 2 is an enclosure, 3 is a lead member on the positive electrode side, 4 is a lead member on the negative electrode side, 5 and 6 are insulating films (insulating resin films), and 7 is a seal. , 8 is an electrode plate lead, and 9 is solder.

  The non-aqueous electrolyte electricity storage device is not limited to the non-aqueous electrolyte battery 1 and may be a capacitor such as an electric double layer capacitor (EDLC) or a lithium ion capacitor. Examples of the nonaqueous electrolyte battery 1 include a lithium ion battery.

  The nonaqueous electrolyte battery 1 is a lead member in which a laminated electrode group in which a positive electrode plate and a negative electrode plate are laminated via a separator and an electrolytic solution are housed in an enclosure 2 and connected to the positive electrode plate as shown in FIG. 3. The lead member 4 connected to the negative electrode plate is taken out in a state of being hermetically sealed from the seal portion 7 of the enclosure 2 via insulating films 5 and 6, respectively.

  The enclosure 2 serves as an outer case of the nonaqueous electrolyte battery 1 and is sealed, for example, by sealing the sealing portion 7 around the two multilayered films in a rectangular shape by heat welding. Each of the lead members 3 and 4 is formed by previously bonding insulating films 5 and 6 by heat welding. The insulating film 5 and 6 and the multilayer film of the encapsulant 2 are heat-sealed, thereby the lead member 3. , 4 and the multilayer film are sealed.

  Here, the enclosure 2 is formed of a multilayer film including a metal foil, and the multilayer film is formed by bonding resin films on at least both surfaces of the metal foil. For example, as shown in FIG. 1B, the enclosure 2 is formed by laminating an innermost layer film 2a, a metal foil layer 2b, and an outermost layer film 2c. For the innermost layer film 2a, a polyolefin resin (eg, maleic anhydride-modified low-density polyethylene or polypropylene) is used as a material suitable for preventing the electrolyte solution from being leaked from the seal portion 7 without being dissolved by the electrolyte solution. The metal foil layer 2b is made of a metal foil such as aluminum, copper, or stainless steel, and enhances the sealing performance against the electrolytic solution. The outermost layer film 2c is for protecting the thin metal foil layer 2b, and is formed of polyethylene terephthalate (PET) or the like.

Next, the lead member 4 according to the present invention will be described.
The lead member 4 has a lead conductor and an insulating film 6. As shown in FIGS. 2A to 2C, this lead conductor is obtained by applying a plating 4b to a flat conductor 4a, and the present invention has a main feature in a region where the plating 4b is applied as will be described later. .
The flat conductor 4a used as the lead conductor of the lead member 4 is made of aluminum or an aluminum alloy (for example, titanium aluminum alloy), and is a conductor obtained by cutting a thin conductive foil having a thickness of, for example, about 0.05 mm to 0.50 mm into a rectangular shape. is there. In addition, although titanium or a titanium alloy can be applied as the flat conductor 4a, the cost increases.

  For example, as shown in FIG. 1B, the insulating film 6 includes an inner layer 6a adhered or welded to both surfaces of a lead conductor (a flat conductor 4a plated 4b) of a lead member 4 connected to the negative electrode plate. The outer layer 6b to be fused with the enclosure 2 can be formed of two layers. The inner layer 6a is adhered to the lead conductor by heating and melting to form a good hermetic seal at the conductor interface. The outer layer 6b has a higher melting point than that of the inner layer 6a, and retains its shape so as not to melt when sealed with the lead conductor. Then, by sealing the outer layer 6b and the enclosure 2 at the time of sealing with the enclosure 2, the metal foil layer 2b and the lead conductor in the enclosure 2 can be prevented from being electrically short-circuited.

  As shown in FIGS. 2A to 2C, the lead member 4 is formed by bonding insulating films 6 on both sides of a conductor so as to protrude from both sides of the conductor width in an intermediate region of the flat conductor 4a. Here, the intermediate region may be in the vicinity of the center of the flat conductor 4a, and at a position where the insulating film 6 and the flat conductor 4a protrude from both the inside and outside of the seal portion 7 by sealing with the encapsulant 2. I just need it. The flat conductor 4a is plated 4b before the insulating film 6 is bonded.

  The width of the insulating film 6 is wider than the width of the lead conductor, the insulating film 6 protrudes on both sides of the lead conductor, and the insulating films 6 are bonded to each other at that portion, and the length of the insulating film 6 (perpendicular to the width). The length in the direction is shorter than the length of the lead conductor. Therefore, the insulating film 6 is not affixed to both ends in the length direction of the lead conductor.

  As shown in FIG. 2B, the lead conductor is composed of a conductor portion I exposed on the upper side of the insulating film 6, a portion II covered with the insulating film 6, and a conductor exposed on the lower side of the insulating film 6. It has three regions, part III. The upper conductor portion I is a portion that serves as a terminal for electrical connection with an external device, and the lower conductor portion III is connected to the electrode plate lead 8 in the nonaqueous electrolyte battery, and is connected to the electrolytic solution. The part to be immersed. The intermediate covered portion II is a portion where the lead conductor is hermetically sealed.

  In this way, the flat conductor 4a is provided with the conductive plating 4b on the entire surface of the conductor portions I and III that are separated from each other by the insulating film 6 and exposed from both sides. Furthermore, as a main feature of the present invention, the flat conductor 4a has a portion in which the plating 4b is not applied to a portion 4c of the conductor portion II (intermediate region) to which the insulating film 6 is bonded. That is, the flat conductor 4a is plated 4b except for a part 4c of the intermediate region. The part 4c becomes a non-plating region. In other words, the portion of the flat conductor 4a where the insulating film 6 is not attached is plated on the entire surface, and the portion where the insulating film 6 is attached on one side (one main surface) of the flat conductor 4a. Has a non-plated region 4c. In FIG. 2, the non-plated region 4c is illustrated as an ellipse, but the shape of the non-plated region 4c may be any shape.

  The layer of the plating 4b is formed of a conductive material so that electrical connection between the batteries in the conductor portion I, solder connection for electrical connection for monitoring and testing can be performed. Thereby, electrical connection with low resistance can be easily performed.

  Furthermore, the layer of the plating 4b is formed of a metal having a smaller ionization tendency than at least aluminum or an aluminum alloy as the flat conductor 4a so that the lead member 4 can be used for the negative electrode. And the non-plating area | region 4c is contained in the conductor part II, and is covered with the insulating film 6, and the part to which the insulating film 6 shown by the conductor parts I and III is not affixed is plated 4b on the whole surface . Therefore, even if the lead member 4 is applied to the negative electrode material of a lithium ion battery using cobalt or manganese, the lithium does not precipitate on the lead member 4 and thus the battery performance is not deteriorated.

  Examples of the metal include nickel, tin, and zinc, but it is preferable to employ nickel or tin as compared to zinc from the viewpoint of ionization tendency. Thus, the plating 4b is preferably nickel plating or tin plating.

  The lead member 4 has been described above. The positive lead member 3 has the same configuration as the negative lead member 4 and is formed on both sides of the conductor so as to protrude from both sides of the conductor width to the intermediate region of the flat conductor. The insulating film 5 is bonded together. Thus, the lead member described as the lead member 4 can also be used for the positive electrode. This is because this lead member is a member in which aluminum or an aluminum alloy is mainly a lead conductor and does not melt even at a high potential. The insulating film 5 has the same configuration as the insulating film 6.

  As described above, the lead member according to the present invention is used for the positive electrode by laminating an insulating film to both sides of aluminum or an aluminum alloy, and applying conductive plating to the aluminum or aluminum alloy outside the region where the insulating film is laminated. It can be used not only for negative electrodes. Furthermore, the weight of the lead member can be reduced by reducing the specific gravity from 8.9 to 2.7 using aluminum as compared with the conventional negative electrode lead member using copper, and the cost of the material can be reduced. The same effect can be obtained even when an aluminum alloy is used.

Next, a manufacturing method for manufacturing the lead member as described above will be described.
The manufacturing method according to the present invention is to manufacture a lead member in which an insulating film is bonded from both sides of a conductor in a middle region of a flat conductor made of aluminum or aluminum alloy so as to protrude from both sides of the conductor width. A plating step and a bonding step.
The plating step is a step of conducting conductive plating on a conductor including at least a flat conductor. The bonding step is a step of bonding an insulating film to the flat conductor from both sides of the conductor so as to protrude from both sides of the conductor width.

As a main feature of the manufacturing method for manufacturing the lead member as described above, the plating step is performed so that the flat conductor is plated on the entire surface excluding a part of the intermediate region, and the bonding is performed. In the process, an insulating film is bonded to both sides of the flat conductor so as to cover a portion where the plating is not performed. The insulating films protruding from both sides of the conductor width are bonded together with the insulating films.
The lead member manufactured by such a manufacturing method can be used not only for the positive electrode but also for the negative electrode because conductive plating is applied to aluminum or an aluminum alloy outside the region where the insulating film is bonded.

Specifically, an example of a manufacturing method for manufacturing the lead member 4 of FIG. 2 will be described with reference to FIG.
First, the strip-shaped conductor is cut with a predetermined width dimension, or the conductor is punched to produce individual pieces of the flat conductor 4a. Examples of the strip-shaped conductor include an aluminum plate hoop material. The hoop material is a material obtained by winding a strip-shaped plate material (aluminum plate) into a roll shape.

  In the plating step, as shown in FIG. 3A, the electrode E is applied to one main surface of the flat conductor 4a, and the entire flat conductor 4a is immersed in a plating solution to perform electroplating. The portion where the electrode E is in contact (the power feeding portion) does not have the plating 4b but becomes the non-plating region 4c, and the aluminum or aluminum alloy remains exposed. In other words, the electrode E is a region included in an intermediate region (a portion closer to the center) in the vertical width direction of the flat conductor 4a, and is applied to a region that becomes the non-plating region 4c.

  As a result, as shown in FIG. 3B, individual pieces of lead conductors in which the main surface and side surfaces of the flat conductor 4a are plated with the non-plated region 4c left are produced. In addition, it is not restricted to the example of the manufacturing method demonstrated here, A zincate process (chemical conversion process) may be given to the whole surface of the flat conductor 4a as a pretreatment of a plating process, and a copper plating is also plated before nickel and tin. It may be applied, or surface treatment such as discoloration prevention treatment or chromate-free treatment may be applied after the plating treatment.

  Then, a bonding process is performed. More specifically, as shown in FIG. 3C, such a flat conductor 4a covers the non-plated region 4c, which is a portion where the plating 4b is not applied, and projects from both sides of the conductor width. Then, the insulating film 6 is bonded from both sides of the conductor. Thereby, the lead member 4 is completed. Here, since the insulating film 6 is stuck to the non-plating area | region 4c, aluminum does not contact with electrolyte solution and it is not necessary to plate separately.

  As described above, in this manufacturing method, the portion where the electrode is not plated is simply provided by including the position where the electrode is applied later in the region covered by the insulating film 6 (the intermediate region on the main surface of the flat conductor 4a). There is no need to go through complicated processes such as plating. Further, the amount of plating can be reduced by an amount corresponding to the non-plating region 4c as compared with the case where the entire surface is plated. As described above, according to the manufacturing method of the present invention, a lead member that can be used for a negative electrode can be efficiently manufactured.

  The lead member 4 and other lead members according to the present invention can be plated by using a plating method other than electroplating, such as electroless plating, but the manufacturing method illustrated in FIG. It can be applied only to plating methods that perform plating.

Next, another configuration example of the lead member according to the present invention will be described with reference to FIG. 4A is a top view of the lead member, FIG. 4B is a vertical sectional view of the intermediate region of the lead member, and FIG. 4C is a horizontal sectional view of the intermediate region of the lead member.
In the configuration example of FIGS. 1 and 2, the non-plated region 4c is on one main surface (flat surface) of the flat conductor 4a, whereas in the configuration example of FIG. 4, the non-plated region 4c is both main surfaces. On top (ie on both sides). The lead member 4 in the configuration example of FIG. 4 can be manufactured by employing a manufacturing method similar to the method described in FIG. 3 and plating the entire region to be the non-plating region 4c.

  As shown in FIGS. 4A and 4C, in this configuration example, rectangular non-plating regions 4c are provided on both surfaces, and all the side surfaces are plated 4b. As described above, the side surface connected to the region shown here may also be a non-plated region. In this case, a manufacturing method different from the manufacturing method similar to the method described in FIG. 3 may be employed. That is, it is also possible to employ a manufacturing method in which one end and the other end of a flat conductor are sequentially attached to a plating tank and plated, and an insulating film is bonded from both sides of the conductor so as to cover an intermediate area where plating is not performed. In the case of this manufacturing method, compared with the example described in FIGS. 2 and 3, the step of providing the non-plating region is not indispensable in the plating step. Although it takes time and effort, the amount of plating can be reduced as compared with the case where the entire surface is plated.

Next, another configuration example of the lead member according to the present invention will be described with reference to FIG. 5A is a top view of the lead member, FIG. 5B is a vertical sectional view of the intermediate region of the lead member, and FIG. 5C is a horizontal sectional view of the intermediate region of the lead member.
In the configuration example of FIG. 2 and the configuration example of FIG. 4, the non-plated region 4c is on one or both main surfaces of the flat conductor 4a, whereas the lead member 4 in the configuration example of FIG. ), Protrusions are provided at both ends in the intermediate region of the flat conductor 4a, and the side surfaces (substantially linear surfaces) of the protrusions are non-plated regions 4c as shown in FIG. 5C.

  The protruding portion may protrude slightly, or may be formed only at one end (that is, only one non-plated region 4c). Needless to say, as described as a modification of the configuration example of FIG. 4, one or both side surfaces of the intermediate region of the flat conductor 4 a may be simply used as the non-plated region 4 c without providing the protrusions. As described above, the non-plated region 4c may be provided on the side surface (surface substantially linear) of the flat conductor 4a.

  The lead member 4 in the configuration example of FIG. 5 is also plated by attaching an electrode to a region (side surface) that becomes the non-plating region 4c with respect to the flat conductor 4a by employing the same manufacturing method as the method described in FIG. However, it is preferable to employ the manufacturing method described below with reference to FIGS.

First, an example of a manufacturing method for manufacturing the lead member of FIG. 5 will be described with reference to FIG.
As shown in FIG. 6 (A), the strip-shaped conductor 21 is pulled out from the hoop material 20 in which the strip-shaped conductor (long aluminum strip or aluminum alloy strip) 21 serving as the base material of the flat conductor 4a is wound in a roll shape, A plurality of punched portions 22 having a predetermined shape are punched. The punching portion 22 may be H-shaped. In this example, the punched portion 22 has a U-shape only at the extreme end, and the rest is continuously H-shaped. In the example of FIG. 6, punching is performed in such a shape that the longitudinal direction of the strip conductor 21 is the length direction of the lead member 4.

  By such a punching process, as shown in FIG. 6B, a plurality of flat conductors 4a and runner (mounting foot) portions 24 remain on the strip-shaped conductor 21, and the plurality of flat conductors 4a are connected by the mounting feet. It will be in the state. Here, the portion between the H-shape and the H-shape is a portion that connects the square flat conductor (the portion that becomes the flat conductor 4a) to the outer frame in a runner shape, and a plurality of square pieces are connected to the outer frame. .

  Further, in the plating step, as shown in FIG. 6B, the both surfaces of the remaining portion that is sequentially sent to the electrolytic plating tank in that state are continuously plated. After the plating process, the mounting foot portion 24 is cut (cut) with a blade or the like. The cut line is indicated by a one-dot chain line in FIG. The plating 23 is applied to the entire surface except the cut surface of the flat conductor 4a. By performing such a process while winding the outer frame portion cut by the mounting foot portion 24, as shown in FIG. 6C, plating 23 (4b) is applied to the entire surface excluding the cut surface. Individual flat conductor pieces can be produced continuously. The cut surface is exposed to the original material of the strip-shaped conductor 21 (aluminum or aluminum alloy) and becomes a non-plated region 4c.

  Then, the bonding process mentioned above is performed. More specifically, as shown in FIG. 6D, a non-plated region 4c (that is, a cut surface) that is not plated 4b is formed on the flat conductor 4a shown in FIG. 6C. The insulating film 6 is bonded from both sides of the conductor so as to cover and project from both sides of the conductor width. Thereby, the lead member 4 is completed. Since the insulating film 6 is affixed to a portion where the original material (aluminum or aluminum alloy) of the strip-shaped conductor 21 is exposed, the aluminum or aluminum alloy does not come into contact with the electrolytic solution, and there is no need to separately plate the cut surface.

  Such a manufacturing method manufactures a lead member that can be used as a negative electrode by simply putting a plating treatment between the punching and final cutting of the flat conductor 4a (in particular, there is no need for further plating on the cut surface). Can be said to be an efficient manufacturing method. The flat conductor 4a obtained by punching has fewer burrs than the flat conductor obtained by slitting the conductor original plate. Moreover, the punching part 22 can be punched with a metal mold | die, and this can improve the stability of the dimension of a finished product. Moreover, in this manufacturing method, since the part (attachment leg part 24) which cuts out the piece of a flat conductor from the strip | belt-shaped conductor 21 is small, the metal foreign material which comes out when cutting out a flat conductor from a strip | belt-shaped conductor can be decreased.

Next, another example of the manufacturing method for manufacturing the lead member 4 of FIG. 5 will be described with reference to FIG. The manufacturing method shown in FIG. 7 is different from the manufacturing method shown in FIG.
As shown in FIG. 7A, the strip-shaped conductor 31 is pulled out from a hoop material 30 in which the strip-shaped conductor 31 serving as the base material of the flat conductor 4a is wound in a roll shape, and a plurality of punched portions 32 having a predetermined shape are punched. As shown in the drawing, the punched portion 32 has a shape in which L-shaped regions are continuous in the vertical direction. In the example of FIG. 7, punching is performed in such a shape that the longitudinal direction of the strip-shaped conductor 31 is the width direction of the lead member 4.

  By such a punching process, a plurality of flat conductors 4a and their attachment leg portions remain on the belt-like conductor 31. Here, the portion between the upper L-shape and the lower L-shape is a portion that connects the square flat conductor (the portion that becomes the flat conductor 4a) to the outer frame in a runner shape, and a plurality of square pieces are connected to the outer frame. Shape.

  Further, in the plating step, as shown in FIG. 7B, the strip-shaped conductors 31 are sequentially fed into the electrolytic plating tank in a state where a plurality of flat conductors 4a are connected by attachment feet, and are continuously applied to both surfaces of the remaining portion. Plate on. After the plating process, the mounting foot portion is cut with a blade or the like. The cut line is indicated by an alternate long and short dash line in FIG. 7B and corresponds to the horizontal width of the flat conductor 4a. The plating 33 is applied to the entire surface (main surface and side surfaces) excluding the cut surface of the flat conductor 4a.

By cutting the mounting leg portion of the strip-shaped conductor 31, as shown in FIG. 7 (C), individual pieces of the flat conductor with the plating 33 (4b) applied to the entire surface excluding the cut surface are continuously produced. it can. The cut surface is exposed to the original material of the strip-shaped conductor 31 (aluminum or aluminum alloy) and becomes a non-plated region 4c.
Thereafter, a bonding process is executed in the same manner as described with reference to FIGS. 6C and 6D, whereby the lead member 4 as shown in FIG. 7D is completed.

  Moreover, in the above example, although the example which has the side surface and the end surface of the part (here conductor part I) which goes out of a battery or an electrical storage device was given, the side surface and / or end surface of the conductor part I were plated. There is no need.

A lead member having such a configuration example and a manufacturing method thereof will be described with reference to FIG. The manufacturing method of FIG. 8 is different from the manufacturing method of FIG.
As shown in FIG. 8A, the strip-shaped conductor 41 is pulled out from a hoop material 40 in which a strip-shaped conductor 41 serving as a base of a flat conductor is wound in a roll shape, and a plurality of punched portions 42 having a predetermined shape are punched. The punching portion 42 has a U-shape (a shape excluding one side of a square) as illustrated. In the example of FIG. 8, punching is performed in such a shape that the longitudinal direction of the strip conductor 41 is the length direction of the lead member 4. By such a punching process, a plurality of flat conductors and their attachment leg portions remain on the belt-like conductor 41.

  Further, in the plating step, as shown in FIG. 8B, the strip conductors 41 are sequentially fed to the electrolytic plating tank in a state where a plurality of flat conductors are connected by the attachment feet, and continuously on both surfaces of the remaining portion. Plating. After the plating process, the mounting foot portion is cut with a blade or the like. The cut line is indicated by a one-dot chain line in FIG. 8B and corresponds to the width of the flat conductor. The plating 43 is applied to the entire surface (main surface and side surfaces) excluding the cut surface of the flat conductor.

  By cutting the mounting leg portion of the strip-shaped conductor 41, as shown in FIG. 8C, individual pieces of flat conductors with plating 43 (4b) applied to the entire surface excluding the cut surface are continuously produced. it can. This cut surface is exposed to the original material of the strip-shaped conductor 41 (aluminum or aluminum alloy) and becomes a non-plated region 4c.

  Thereafter, the bonding step is performed in the same manner as the method described with reference to FIGS. More specifically, with respect to the flat conductor shown in FIG. 8C, as shown in FIG. 8D, one portion of the non-plated region 4c (that is, the cut surface) which is a portion where the plating 4b is not applied. The insulating film 6 is bonded from both sides of the conductor so as to cover the portion and project from both sides of the conductor width. Thereby, the lead member 4 as shown in FIG. 8D is completed.

  By pasting the insulating film 6 on the exposed part of the original strip conductor 41 (aluminum or aluminum alloy) and arranging the remaining exposed part to be on the outside of the nonaqueous electrolyte battery 1 in FIG. Aluminum or aluminum alloy does not come into contact with the electrolytic solution, and there is no need to separately plate the cut surface. That is, the manufactured lead member 4 has the cut surface (the one with the non-plated region 4c) arranged outside the non-aqueous electrolyte battery 1 in FIG. 1 (that is, the conductor portion I) and the opposite side inside. By arranging (that is, the conductor portion III), it can be used as a lead member for a negative electrode.

  As described above, the plating step in the manufacturing method according to the present invention includes the flat conductor, the entire conductor portion exposed in the non-aqueous electrolyte device among the conductor portions exposed without the insulating film, the intermediate region, and the non-water. What is necessary is just to make it apply | coat to the whole surface except a part among the parts arrange | positioned outside the electrolyte device.

  In the example of the manufacturing method described with reference to FIGS. 6 to 8, plating may be performed by applying an electrode to the main surface of the flat conductor as in the method described with reference to FIG. The portion and the cut surface become a non-plated region.

DESCRIPTION OF SYMBOLS 1 ... Nonaqueous electrolyte battery, 2 ... Inclusion body, 2a ... Innermost layer film, 2b ... Metal foil layer, 2c ... Outermost layer film, 3 ... Lead member (positive electrode side), 4 ... Lead member (negative electrode side), 4a, DESCRIPTION OF SYMBOLS 11 ... Flat conductor, 4b, 12, 23, 33 ... Plating, 4c ... Non-plating area | region, 5, 6 ... Insulating film, 6a ... Inner layer, 6b ... Outer layer, 7 ... Seal part, 8 ... Electrode plate lead, 9 ... solder, 20, 30 ... hoop material, 21, 31 ... strip conductors, 22, 32 ... punched portions.

Claims (7)

A lead member for a non-aqueous electrolyte electricity storage device in which an insulating film is bonded to both sides of a conductor so as to protrude from both sides of the conductor width in an intermediate region of a flat conductor made of aluminum or an aluminum alloy,
The flat conductor is subjected to conductive plating on at least the entire surface of the conductor portion exposed in the non-aqueous electrolyte electricity storage device among the exposed conductor portions to which the insulating film is not attached, and the insulating film A lead member for a non-aqueous electrolyte electricity storage device, characterized in that a part of the conductor part to be bonded has a part not plated.   The lead member for a nonaqueous electrolyte electricity storage device according to claim 1, wherein the portion not plated is on a main surface of the flat conductor.   The lead member for a nonaqueous electrolyte electricity storage device according to claim 1, wherein the portion not plated is on a side surface of the flat conductor.   The lead member for a nonaqueous electrolyte electricity storage device according to any one of claims 1 to 3, wherein the plating is nickel plating. A manufacturing method for manufacturing a lead member for a non-aqueous electrolyte electricity storage device in which an insulating film is bonded to both sides of a conductor so as to protrude from both sides of the conductor width in an intermediate region of a flat conductor made of aluminum or an aluminum alloy,
A plating step of conducting conductive plating on a conductor including at least the flat conductor, and a bonding step of attaching an insulating film to both sides of the conductor so as to protrude from both sides of the conductor width to the flat conductor,
In the plating step, the flat conductor is an entire surface excluding at least a part of the conductor part exposed in the non-aqueous electrolyte electricity storage device and a part of the intermediate region of the conductor part exposed without the insulating film being pasted. And so that the plating is applied,
The method of manufacturing a lead member for a nonaqueous electrolyte electricity storage device, wherein the bonding step includes bonding an insulating film from both sides of the flat conductor so as to cover a portion where the plating is not performed.   6. The method of manufacturing a lead member for a nonaqueous electrolyte electricity storage device according to claim 5, wherein the plating is performed by applying an electrode to a main surface of the flat conductor. A plurality of the flat conductors are connected by mounting feet by punching a plurality of portions of the predetermined shape of a strip conductor made of aluminum or aluminum alloy, and the strip conductor is plated in the plating step,
Next, by cutting the portion of the mounting foot, to produce the flat conductor that has been plated on the entire surface excluding the cut surface,
The said bonding process bonds the said insulating film so that the said cut surface may be covered with the said insulating film, The lead member for nonaqueous electrolyte electrical storage devices of Claim 5 or 6 characterized by the above-mentioned. Production method.

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