JP6511271B2 - Substrate unit and electrochemical cell unit - Google Patents

Description

  The present invention relates to a substrate unit and an electrochemical cell unit provided with the substrate unit.

Non-aqueous electrolyte secondary batteries such as lithium ion batteries and electrochemical cell units such as electric double layer capacitors are used as power supplies for various devices.
The electrochemical cell unit includes an electrochemical cell that stores a charge, a protective circuit board connected to the electrochemical cell, and the like. The protective circuit board limits the function of the electrochemical cell by detecting a large current during charging and a large current during discharging while suppressing charging and overdischarging of the electrochemical cell.

The protective circuit board may have, for example, a size of about 10 mm on one side. For this reason, positioning of the conducting wire with respect to a protection circuit board was not easy, and it had to carry out soldering of conducting wire manually.
On the other hand, in order to improve the production efficiency and the reliability of the electrochemical cell unit, automation of soldering of a lead to a protective circuit board has been considered.

  For example, Patent Document 1 proposes a technique in which a long hole is formed in a substrate, and a conductive wire is inserted into the long hole to weld the core wire of the conductive wire to the circuit pattern of the substrate. In the technique described in Patent Document 1, it is supposed that the operation is easy and automation is easy because a plurality of conducting wires are passed through the elongated hole in a bundle state. Further, it is supposed that all the leads can be heated and pressure-welded at one time since the tip portions of the plurality of leads follow the circuit pattern.

Registered utility model No. 3038053

However, in the technique described in Patent Document 1, since the conducting wire is inserted into the long hole formed in the substrate, the conducting wire is raised in the thickness direction of the substrate. For this reason, there is a problem that it is not suitable for the wiring technology for a protective circuit board which is required to be thin.
In addition, Patent Document 1 does not disclose a technique for reliably positioning the core wire of the conducting wire with respect to the circuit pattern. For this reason, there is a problem that the bonding of the lead to the protective circuit board by soldering or ultrasonic bonding can not be automated.

  Therefore, the present invention has been made in view of the above circumstances, and it is possible to easily position the conducting wire with respect to the substrate, and to automate the bonding of the conducting wire to the substrate by soldering or ultrasonic bonding. It is an object of the present invention to provide an unit and an electrochemical cell unit provided with the substrate unit.

In order to solve the above-mentioned subject, a substrate unit of the present invention is a substrate unit provided with a lead which exposed a core from insulation coating, and a substrate which has a pair of electrode pads to which a core of the lead is connected. The substrate is formed to have a back surface and a peripheral edge cut out, and a pair of a lead wire receiving portion for receiving the end of the insulating coating and a positive electrode tab and a negative electrode tab of the electrochemical cell. And a land, wherein the lead wire is characterized in that the insulation coating is accommodated in the lead wire accommodation portion.
According to the present invention, since the conducting wire is held by the conducting wire accommodating portion, the conducting wire can be reliably positioned with respect to the substrate. Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated.

Further, the substrate unit of the present invention is characterized in that the conducting wire is accommodated along the depth direction of the conducting wire accommodation portion, and the end face of the insulating coating abuts on the back surface of the conducting wire accommodation portion.
According to the present invention, since the conducting wire is held by the conducting wire accommodating portion and the end face of the insulating coating abuts on the back surface of the conducting wire accommodating portion, the conducting wire can be more reliably positioned in the depth direction of the conducting wire accommodating portion . Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated. Furthermore, since the conducting wire is accommodated along the depth direction of the conducting wire accommodation portion, the substrate unit can be thinned.

Further, the substrate unit of the present invention is characterized in that the conductor containing portion is formed so that the notch width gradually increases from the peripheral edge toward the back surface.
According to the present invention, since the back surface becomes long, the back surface can be easily formed flat. Further, in the case of forming the lead wire accommodating portion by press working or cutting with a luteter or the like, the inner side surface and the back surface of the lead wire accommodation portion can be formed in an arc shape, so between the inner side surface and the back surface It is possible to prevent the occurrence of cracks and the like. Furthermore, since the lead wire accommodating portion is narrowed at the peripheral edge side of the substrate, the lead wire can be positioned more accurately.

Further, the substrate unit of the present invention is characterized in that the wire housing portion includes an engagement protrusion which protrudes from an inner side surface and engages with the insulating coating.
According to the present invention, since the engagement projection contacts the insulating coating of the lead, the lead can be prevented from being separated from the lead containing portion.

In addition, it is characterized in that it is provided with a wire fixing resin which is filled in the wire containing portion to fix the wire.
According to the present invention, since the conductive wire fixing resin causes the conductive wire to be fixed to the conductive wire storage portion, the conductive wire can be reliably prevented from being detached from the conductive wire storage portion, and the conductive wire can be firmly fixed to the substrate. In addition, since the wire fixing resin is filled in the wire housing portion, it is possible to make the substrate unit thinner without raising the wire fixing resin than the substrate.

Further, the lead wire accommodating portion is characterized by having a bottom surface formed in a thickness direction of the substrate.
According to the present invention, the conductive wire can be positioned in the thickness direction of the substrate by bringing the insulating coating into contact with the bottom surface. Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated. Moreover, it can prevent that the conducting-wire adhering resin with which the conducting-wire accommodating part was filled comes around to the back side of a board | substrate.

Further, the lead wire accommodating portion is characterized in that a positioning projection formed on a substrate holding jig on which the substrate is placed is fitted.
According to the present invention, the substrate can be reliably positioned with respect to the substrate holding jig at the time of bonding work of the lead wire to the substrate by soldering, ultrasonic bonding or the like. Further, the conductive wire can be positioned in the thickness direction of the substrate by bringing the conductive wire into contact with the positioning projection of the substrate holding jig. Thus, the soldering of the leads to the substrate can be automated. Moreover, it can prevent that the conducting-wire adhering resin with which the conducting-wire accommodating part was filled wraps around to the back side of a board | substrate more than necessary.

Further, the core wire and the substrate are connected by ultrasonic bonding.
According to the present invention, since the auxiliary material is not used, the core wire and the substrate can be connected reliably, and the substrate unit can be thinned without the connection portion rising more than necessary.

Moreover, the electrochemical cell unit of the present invention is characterized in that the diameter of the conducting wire is 0.08 mm to 0.41 mm.
According to the present invention, the positioning of the lead of the small substrate unit and the substrate can be reliably performed. Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated.

The electrochemical cell unit of the present invention is characterized by comprising the substrate unit of the present invention.
According to the present invention, the bonding of the lead wire to the substrate by soldering, ultrasonic bonding or the like is automated, so that the occurrence of defects such as connection failure is reduced. In addition, cost reduction can be achieved by improving the efficiency of assembly work.

  According to the present invention, since the conducting wire is held by the conducting wire accommodating portion and the end face of the insulation coating is accommodated in the conducting wire accommodating portion, the conducting wire can be reliably positioned with respect to the substrate. Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated.

It is a figure showing a schematic structure of an electrochemical cell unit concerning a first embodiment of the present invention. It is a schematic diagram which shows the board | substrate unit which concerns on 1st embodiment of this invention. It is a schematic diagram which shows a board | substrate and a board | substrate holding jig. It is a schematic diagram which shows the board | substrate unit which concerns on 2nd embodiment of this invention. It is a schematic diagram which shows the board | substrate unit which concerns on 3rd embodiment of this invention. It is a schematic diagram which shows the board | substrate unit which concerns on 4th embodiment of this invention. It is a schematic diagram which shows the board | substrate unit which concerns on 5th embodiment of this invention.

First Embodiment
Hereinafter, a first embodiment of the present invention will be described using the drawings.
FIG. 1 is a view showing a schematic configuration of the electrochemical cell unit 1 according to the first embodiment of the present invention, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a side view.
As shown in FIG. 1, the electrochemical cell unit 1 mainly includes an electrochemical cell 11 and a substrate unit 2.

The electrochemical cell 11 is, for example, a so-called lithium ion battery including an electrode body 13 including a positive electrode and a negative electrode, and an exterior body 19 for housing the electrode body 13.
The electrode body 13 has a substantially rectangular shape in plan view. The electrode body 13 includes positive and negative electrodes (not shown) stacked or wound on one another via a separator (not shown). The positive electrode and the negative electrode are in contact with a non-aqueous electrolyte such as, for example, an electrolytic solution or a solid electrolyte.

The positive electrode of the electrode body 13 is obtained by, for example, attaching a positive electrode active material to a current collector such as a metal foil. The positive electrode active material is, for example, a composite oxide containing lithium and a transition metal such as lithium cobaltate, lithium titanate, lithium manganate and the like.
The negative electrode of the electrode body 13 is obtained by, for example, attaching a negative electrode active material to a current collector such as a metal foil. The negative electrode active material is, for example, silicon, silicon oxide, graphite, hard carbon, lithium titanate, LiAl or the like.
The separator has the property of transmitting lithium ions. The separator includes, for example, any one of a resin porous film, a glass non-woven fabric, a resin non-woven fabric, or a combination thereof.
The electrode body 13 accumulates (charges) electric charge or discharges (discharges) electric charge when lithium ions move from one of the positive electrode and the negative electrode to the other.

  The exterior body 19 is formed by bending a sheet having a substantially rectangular shape in plan view so as to wrap the electrode body 13. The exterior body 19 is, for example, a laminate film having a metal foil and a resin layer laminated on the metal foil. The metal foil is formed using, for example, a metal material that blocks moisture and oxygen, such as aluminum and stainless steel. The resin layer on the inner surface is formed using, for example, a thermoplastic resin such as polyethylene, polypropylene, an ionomer, or an ethylene-propylene copolymer resin. The resin layer on the outer surface is formed using, for example, a thermoplastic resin such as polyamide. The electrode body 13 is sealed by the exterior body 19.

The substrate unit 2 is disposed to the side of the electrochemical cell 11, and mainly includes a substrate 20, a positive electrode tab 15, a negative electrode tab 16, a positive electrode lead 40A, and a negative electrode lead 40B.
The substrate 20 is a glass epoxy substrate made of, for example, an epoxy resin containing glass, and is formed in a substantially rectangular shape in plan view.
The substrate 20 is disposed along the major surface 12 of the electrochemical cell 11 on one side in the thickness direction of the electrochemical cell 11.
A wiring pattern (not shown) is disposed on the first major surface 21 of the major surface of the substrate 20 facing in the same direction as the major surface 12 of the electrochemical cell 11. The wiring pattern is formed by depositing a metal material such as copper (Cu), for example.

A plurality of electronic elements 23 are mounted on the first major surface 21 of the substrate 20. The electronic element 23 is, for example, an IC in which a switching circuit such as a resistor or a transistor is packaged.
The electronic element 23 and the wiring pattern form a protective circuit. The protection circuit controls charge and discharge of the electrochemical cell 11 to prevent overcharge and overdischarge, and electrically shuts off the electrochemical cell 11 from an external device when an overcurrent occurs.

The first major surface 21 is provided with a pair of electrode pads 24A and 24B. The electrode pads 24A, 24B are formed by depositing a metal material such as copper (Cu), for example, and are formed simultaneously with the wiring pattern.
The core wires of the positive electrode lead 40A and the negative electrode lead 40B are electrically and mechanically connected to the electrode pads 24A and 24B, respectively. The positive electrode lead 40A and the negative electrode lead 40B are leads for electrically connecting the electrochemical cell unit 1 to an external device.

  A pair of lands 27 is formed on the first major surface 21. The positive electrode tab 15 and the negative electrode tab 16 are joined to the pair of lands 27 by, for example, resistance welding. The lands 27 are formed by laminating on the wiring pattern.

The positive electrode tab 15 is formed in an elongated flat plate shape, for example, by a material whose main component is aluminum (Al). The negative electrode tab 16 is formed in an elongated flat plate shape, for example, by a material containing nickel (Ni) as a main component.
The positive electrode tab 15 is electrically and mechanically connected to the positive electrode of the electrode body 13. The negative electrode tab 16 is electrically and mechanically connected to the negative electrode of the electrode body 13. The positive electrode tab 15 and the negative electrode tab 16 extend from the electrode body 13 of the electrochemical cell 11.

  The positive electrode tab 15 and the negative electrode tab 16 respectively extend toward the substrate unit 2 from the side surface of the electrode body 13. The tip portions 15 a and 16 a of the positive electrode tab 15 and the negative electrode tab 16 are resistance-welded to the lands 27.

FIG. 2 is a schematic view showing the substrate unit 2 according to the first embodiment of the present invention, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a side sectional view; c) is a front view.
The substrate unit 2 includes a substrate 20, a positive electrode lead 40A, a negative electrode lead 40B, and the like.
Hereinafter, the positive electrode conductor 40A and the negative electrode conductor 40B will be simply referred to as the conductor 40A and the conductor 40B.

The substrate 20 is a flat plate-like member formed in a substantially rectangular shape in plan view. Electrode pads 24A and 24B are disposed on the first major surface 21 of the substrate 20 in the vicinity of the peripheral edge 20f.
Conductor receiving portions 30A and 30B are provided on the peripheral edge 20f of the substrate 20. The conductor containing portions 30A and 30B are each formed so as to cut out the peripheral edge 20f of the substrate 20 in a rectangular shape. The conductor containing portions 30A and 30B penetrate the substrate 20 in the thickness direction.

The wire housing portion 30A is formed to face the electrode pad 24A from the peripheral edge 20f. The wire housing portion 30B is formed to be directed from the peripheral edge 20f to the electrode pad 24B.
Each of the wire housings 30A and 30B has a pair of inner side surfaces 31 and a back surface 32. The pair of inner side surfaces 31 are orthogonal to the peripheral edge 20 f and face each other. The distance between the inner side surfaces 31 (notch width) is set to be slightly larger than the outer diameter of the conducting wire 40A, 40B. Specifically, it is 1.1 to 2.0 times the outer diameter of the conducting wire 40A, 40B. The length in the depth direction of the inner side surface 31 is arbitrarily set according to the positions of the electrode pads 24A and 24B.
The back surface 32 is orthogonal to the pair of inner surfaces 31 respectively. That is, the back surface 32 is formed parallel to the peripheral edge 20 f. The back surface 32 is disposed at a position close to the electrode pads 24A and 24B in plan view. Thereby, conducting wire accommodating parts 30A and 30B are formed in rectangular shape by plane view. The back surface 32 may be disposed at a position coinciding with the periphery of the electrode pads 24A and 24B in plan view.

  The conductors 40A and 40B are conductors for electrically connecting the substrate 20 to an external device. The conducting wires 40A and 40B are respectively composed of a core 42 made of a low-efficiency metal such as copper and an insulating coating 43 covering the core 42. For the insulating coating 43, an insulating material such as rubber or vinyl is used, for example. The insulation coating 43 is peeled off at each end 41 of the conducting wire 40A, 40B, and the core wire 42 is exposed.

The ends 41 of the conductors 40A and 40B are accommodated in the conductor accommodating portions 30A and 30B of the substrate 20, respectively. The end portion 41 is accommodated along the depth direction with respect to the wire accommodating portions 30A and 30B.
Specifically, the insulation coating 43 of the end portion 41 of the positive electrode conductor 40A is accommodated in the conductor containing portion 30A. In the negative electrode conductor 40B, the insulation coating 43 of the end 41 is accommodated in the conductor accommodation portion 30B. In addition, the end face 43t of the insulating coating 43 of the conducting wire 40A, 40B abuts on the back surface 32 of the conducting wire accommodation portions 30A, 30B, respectively.
The core wires 42 of the conductive wires 40A and 40B are disposed in close contact with the electrode pads 24A and 24B of the first major surface 21 of the substrate 20. The respective core wires 42 are joined to the electrode pads 24A and 24B of the first main surface 21 by soldering, ultrasonic bonding or the like. In the present embodiment, the case of soldering is described.

When the end portions 41 of the conductors 40A and 40B are accommodated in the conductor containing portions 30A and 30B, the insulating coatings 43 are disposed between the inner side surfaces 31 respectively. Further, the end face 43t of the insulating coating 43 abuts on the back surface 32 of the wire housings 30A and 30B.
Therefore, the lead wires 40A and 40B are prevented from rolling and shifting along the first major surface 21. Further, the lead wires 40A and 40B are prevented from being displaced in the longitudinal direction along the first major surface 21. Therefore, the movement of the conductors 40A and 40B relative to the substrate 20 is suppressed.
As described above, in the substrate unit 2 of the present embodiment, the lead portions 40A and 40B are positioned with respect to the substrate 20 by the end portions 41 of the lead wires 40A and 40B being accommodated in the conductor containing portions 30A and 30B. Therefore, when soldering each core wire 42 to electrode pad 24A, 24B, an automatic soldering device (not shown) can be used.

The conductive wire fixing resin 35 for fixing the conductive wires 40A and 40B to the substrate 20 is filled in the conductive wire accommodating portions 30A and 30B. For example, a thermoplastic plastic such as ethylene vinyl acetate is used for the conductive wire fixing resin 35. The wire fixing resin 35 is disposed only in the wire storage portions 30A and 30B.
The wire fixing resin 35 is disposed without covering the insulating coating 43. Conventionally, the thickness (height) of the substrate unit 2 may increase because the insulating coating 43 of the conducting wires 40A and 40B closely disposed on the first major surface 21 is covered with the conducting wire fixing resin 35.
On the other hand, in the substrate unit 2, since the conductive wire fixing resin 35 is disposed only in the conductive wire storage portions 30A and 30B and the conductive wires 40A and 40B are fixed, the conductive wire bonding resin 35 is contained in the conductive wire storage portions 30A and 30B. At the same time as filling, the wire fixing resin 35 can be disposed without covering the insulating coating 43. Therefore, thinning of the substrate unit 2 can be achieved.

FIG. 3 is a schematic view showing the substrate 20 and the substrate holding jig 50, wherein FIG. 3 (a) is a plan view and FIG. 3 (b) is a front view. In FIG. 3, the conducting wires 40A and 40B are illustrated by two-dot chain lines.
In order to automate the soldering of the conductors 40A and 40B (core 42) to the substrate 20 (electrode pads 24A and 24B), the positioning of the conductors 40A and 40B with respect to the substrate 20 is necessary. Furthermore, positioning of the substrate 20 with respect to an automatic soldering apparatus (not shown) is also required.
Therefore, as shown in FIG. 3, the substrate 20 is placed on the substrate holding jig 50 to prevent positional deviation of the substrate 20. Hereinafter, the substrate holding jig 50 and the positioning of the substrate 20 and the substrate holding jig 50 will be described in detail.

The substrate holding jig 50 is a rectangular flat plate member or the like, and includes a base 51, a plurality of positioning pins 52, and a plurality of positioning protrusions 53.
The base 51 is a member on which the substrate 20 is placed. The substrate 20 is placed on the base 51 in a state where the second major surface 22 is in close contact with the base 51.
The positioning pins 52 are four shafts in close contact with the recesses 29 formed at the four corners of the substrate 20. The positioning pin 52 is erected perpendicularly to the base 51.
The positioning protrusion 53 is a portion that protrudes from the base 51 and is fitted into the wire housing portions 30A and 30B formed on the substrate 20.
The height (thickness) of the positioning protrusion 53 is set, for example, equal to the length obtained by subtracting the radius of the conducting wire 40A, 40B (insulation 43) from the thickness of the substrate 20. Thus, the lead wires 40A and 40B are arranged such that the core 42 matches the position (height) of the first major surface 21 when the end portions 41 are stored in the wire storage portions 30A and 30B, respectively.

Arc shaped recesses 29 corresponding to the positioning pins 52 are formed in advance at four corners of the substrate 20. In addition, the conductor containing portions 30A and 30B are formed in advance on the substrate 20.
Therefore, when the substrate 20 is placed on the substrate holding jig 50, the four positioning pins 52 are in close contact (fitted) with the recessed portions 29 of the substrate 20, respectively. Further, at this time, the positioning protrusion 53 is fitted into the wire housings 30A and 30B. Thereby, the substrate 20 is accurately positioned with respect to the substrate holding jig 50. That is, the substrate 20 is positioned relative to the automatic soldering apparatus (not shown).

  The positioning protrusion 53 positions the conducting wires 40A and 40B in the thickness direction of the substrate 20 when the conducting wires 40A and 40B are arranged in the conducting wire accommodating portions 30A and 30B. As described above, by using the positioning protrusions 53, the core wires 42 of the conducting wires 40A and 40B can be made to coincide with the position (height) of the first major surface 21. Therefore, the soldering of the conductors 40A and 40B to the substrate 20 can be automated. Furthermore, when the wire fixing resin 35 is filled in the wire housing portions 30A and 30B, the wire fixing resin 35 can be prevented from coming around the second main surface 22.

As described above, in the substrate unit 2, the conducting wires 40A and 40B are accommodated and held in the conducting wire accommodating portions 30A and 30B. For this reason, the movement of the conductors 40A and 40B with respect to the substrate 20 is suppressed. That is, the conductive wires 40A and 40B are reliably positioned with respect to the substrate 20.
Therefore, according to the present embodiment, the soldering of the leads 40A and 40B to the substrate 20 can be automated.
Furthermore, the end face 43t of the insulating coating 43 abuts on the back surface 32 of the wire housings 30A and 30B. For this reason, the conducting wires 40A and 40B are more reliably positioned in the depth direction of the conducting wire accommodating portion of the substrate 20. Moreover, since the conducting wire 40A, 40B (insulation coating 43) is accommodated along the depth direction with respect to the conducting wire accommodation portions 30A, 30B, the substrate unit 2 can be thinned.

  Further, according to the present embodiment, since the conductive wire fixing resin 35 fixes the conductive wires 40A and 40B to the conductive wire storage portions 30A and 30B, the conductive wires 40A and 40B can be reliably prevented from being separated from the conductive wire storage portions 30A and 30B. In addition, the conductors 40A and 40B can be firmly fixed to the substrate 20. In addition, since the conductive wire fixing resin 35 is filled in the conductive wire accommodating portions 30A and 30B, the substrate unit 2 can be thinned without the conductive wire fixing resin 35 rising from the substrate 20.

  In addition, since the positioning projections 53 formed on the substrate holding jig 50 on which the substrate 20 is placed are fitted in the conductor containing portions 30A and 30B, the soldering operation of the conductors 40A and 40B to the substrate 20 is performed. The substrate 20 can be reliably positioned with respect to the substrate holding jig 50. Further, by bringing the conducting wires 40A and 40B into contact with the positioning protrusions 53 of the substrate holding jig 50, the conducting wires 40A and 40B can be positioned in the thickness direction of the substrate 20. Therefore, the soldering of the conductors 40A and 40B to the substrate 20 can be automated. In addition, the wire fixing resin 35 filled in the wire housing portions 30A and 30B can be prevented from coming around the back side of the substrate 20.

  Further, in the electrochemical cell unit 1, the soldering of the conducting wires 40A and 40B to the substrate 20 is automated, so that the occurrence of problems such as connection failure can be reduced and high reliability can be ensured. In addition, since the manufacturing cost can be reduced by improving the efficiency of the assembly operation, the price reduction of the electrochemical cell unit 1 can be realized.

(Other embodiments)
Subsequently, a substrate unit according to another embodiment will be described.
In the substrate unit 2 of the first embodiment, the lead wire accommodating portions 30A and 30B are formed in a rectangular shape in a plan view (see FIG. 1A). On the other hand, the shape of the wire housings 30A and 30B is not limited to the first embodiment, and may be a shape as in each embodiment described below. In the following, detailed description of the same components as in the first embodiment will be omitted.

Second Embodiment
FIG. 4 is a schematic view showing a substrate unit 102 according to a second embodiment of the present invention. In FIG. 4, the conducting wires 40A and 40B are illustrated by two-dot chain lines.
As shown in FIG. 4, in the substrate unit 102 of the second embodiment, the wire housing portions 130A and 130B are provided on the peripheral edge 20 f of the substrate 20. The conductor containing portions 130A and 130B are formed so as to cut out the peripheral edge 20f of the substrate 20 in a substantially rectangular shape. The conductor containing portions 130A and 130B penetrate the substrate 20 in the thickness direction.

Each of the wire housings 130A and 130B has a pair of inner side surfaces 131 and a back surface 132.
The pair of inner side surfaces 131 intersect with the peripheral edge 20 f, respectively, and the distance (notch width) between the inner side surfaces 131 is gradually increased from the peripheral edge 20 f toward the back surface 132. The distance between the inner side surfaces 131 is set to be slightly larger than the outer diameter of the conducting wire 40A, 40B in the vicinity of the peripheral edge 20f. Specifically, the notch width is 1.1 to 2.0 times the wire diameter if it is near the peripheral edge 20f, and the notch width is 1.1 for the vicinity of the peripheral edge 20f if it is near the back surface 132. It is preferable because the position of the conductor can be made more reliable if it is ~ 2.0 times. The back surface 132 is formed parallel to the peripheral edge 20 f.
The pair of inner side surfaces 131 and the back surface 132 are formed to be connected in an arc shape. The distance between the inner side surfaces 131 is set to be larger as it approaches the back surface 132.

  According to the second embodiment, since the lead wire accommodating portions 130A and 130B are formed such that the notch width gradually increases from the peripheral edge 20f toward the back surface 132, the back surface 132 becomes longer and the back surface 132 becomes flat. It becomes easy to form. Further, in the case of forming the wire housings 130A and 130B by press working or cutting with a luteter or the like, the inner side surface 131 and the back surface 132 of the wire housings 130A and 130B can be formed in an arc shape. It is possible to prevent the occurrence of a crack or the like between the inner surface 131 and the back surface 132. Furthermore, in the lead wire accommodating portions 130A and 130B, the side of the peripheral edge 20f of the substrate 20 is narrowed, so positioning of the lead wires 40A and 40B can be performed more accurately.

Third Embodiment
FIG. 5 is a schematic view showing a substrate unit 202 according to a third embodiment of the present invention.
As shown in FIG. 5, the board | substrate unit 202 of 3rd embodiment is provided with conducting-wire accommodating part 230A, 230B in the periphery 20f of the board | substrate 20. As shown in FIG. The conductor containing portions 230A and 230B are formed so as to cut out the peripheral edge 20f of the substrate 20 in a substantially rectangular shape. The conductor containing portions 230A and 230B penetrate the substrate 20 in the thickness direction.

Conductor housing portions 230A and 230B have a pair of inner side surfaces 231 and back surfaces 232, respectively.
A plurality of engaging protrusions 235 are provided on the pair of inner side surfaces 231, respectively. The plurality of engaging protrusions 235 are formed in a triangular shape in plan view along the inner side surface 231. The plurality of engagement protrusions 235 engage with the insulation coating 43 of the leads 40A and 40B to inhibit movement of the leads 40A and 40B.

  The distance between the inner side surfaces 231 is set to be slightly smaller than the outer diameter of the conducting wire 40A, 40B. Specifically, the shortest distance between the opposing engaging protrusions 235 is set to be slightly smaller than the outer diameter of the conducting wire 40A, 40B. The shortest distance between the engaging protrusions 235 is 0.7 to 1.0 times the wire diameter. For this reason, when the conducting wires 40A and 40B are accommodated in the conducting wire accommodating portions 230A and 230B, the plurality of engagement protrusions 235 press the insulating coating 43 and hold the insulating coating 43. As a result, the movement of the conductors 40A and 40B is suppressed, so that the soldering of the conductors 40A and 40B to the substrate 20 can be automated.

Fourth Embodiment
FIG. 6 is a schematic view showing a substrate unit 302 according to a fourth embodiment of the present invention, wherein FIG. 6 (a) is a plan view and FIG. 6 (b) is a side view.
As shown in FIG. 6, in the substrate unit 302 according to the fourth embodiment, the wire housings 330A and 330B are provided on the peripheral edge 20f of the substrate 20. The conductor containing portions 330A and 330B are formed so as to cut out the peripheral edge 20f of the substrate 20 in a substantially rectangular shape. The conductor containing portions 330A and 330B are formed so as to cut out only the first major surface 21 without penetrating the substrate 20 in the thickness direction.

The wire housings 330A and 330B have a pair of inner side surfaces 331, a back surface 332 and a bottom surface 333 respectively.
The pair of inner side surfaces 331 are orthogonal to the peripheral edge 20 f and face each other. The back surface 332 is orthogonal to the pair of inner surfaces 331 respectively. That is, the back surface 332 is formed parallel to the peripheral edge 20 f.
The bottom surface 333 is formed parallel to the first major surface 21 and the second major surface 22.
The distance from the first major surface 21 to the bottom surface 333 (the depths of the wire housings 330A and 330B) is set to be equal to the radius of the wires 40A and 40B (insulation 43). Thus, the lead wires 40A and 40B are arranged such that the core 42 matches the position (height) of the first major surface 21 when the end portions 41 are stored in the wire storage portions 330A and 330B, respectively.

  The bottom surface 333 positions the conductors 40A and 40B in the thickness direction of the substrate 20 when the conductors 40A and 40B are disposed in the conductor containing portions 330A and 330B. The core wire 42 can be made to coincide with the position (height) of the first major surface 21 by placing the conducting wires 40A and 40B (insulation 43) on the bottom surface 333.

  According to the fourth embodiment, since the conductor containing portions 330A and 330B have the bottom surface 333 formed in the thickness direction of the substrate 20, the substrate is covered by bringing the insulating coating 43 of the conductors 40A and 40B into contact with the bottom surface 333. The conductors 40A and 40B can be positioned in the thickness direction of 20. Therefore, the soldering of the conductors 40A and 40B to the substrate 20 can be automated. In addition, the wire fixing resin 35 filled in the wire housing portions 330A and 330B can be prevented from coming around the back side of the substrate 20.

(Fifth embodiment)
FIG. 7 is an explanatory view of a substrate 20 and a substrate holding jig 150 according to the fifth embodiment.
As shown in FIG. 7, in the substrate 20 of the fifth embodiment, the conductor containing portions 430 </ b> A and 430 </ b> B are recessed in an arc shape in plan view. Further, recessed portions 129 and 129 are formed in a circular arc shape in plan view at positions facing the wire containing portions 430A and 430B. The conductor containing portions 430A and 430B and the recesses 129 and 129 are formed in the same shape.
The substrate holding jig 150 is provided at positions corresponding to the four corner positioning jigs 152 provided at the positions corresponding to the squares of the substrate 20 and the wire accommodating portions 430A, 430B and the recesses 129, 129. And four projections 153.

The corner positioning jig 152 is formed in an L shape in plan view, and has corners at positions corresponding to the corners of the substrate 20. When the corner of the substrate 20 abuts the corner of the corner positioning jig 152, the substrate 20 is positioned. Also, four projections 153 may be used for positioning.
Further, the protrusion 153 is formed such that the curvature of the circumferential surface is substantially the same as the curvatures of the conductor containing portions 430A, 430B and the recesses 129, 129. In the case where the positioning of the substrate 20 is made more accurately by arranging the projections 153 in the wire containing portions 430A, 430B and the recessed portions 129, 129, and when the wire containing portions 430A, 430B are filled with the wire fixing resin. In addition, it is possible that the conductive resin adheres to the periphery of the insulating coating 43 of the conductive wires 40A and 40B, thereby strengthening the connection between the substrate 20 and the conductive wires 40A and 40B.

According to the fifth embodiment, the substrate 20 can be positioned with high accuracy as in the first embodiment. That is, the substrate 20 is positioned relative to the automatic soldering apparatus (not shown). Therefore, the soldering of the conductors 40A and 40B to the substrate 20 can be automated.
The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the present invention.

  In each of the above-described embodiments, the case has been described in which one conductor 40A or 40B is accommodated in each of the conductor housings 30A, 30B (130A, 130B, 230A, 230B, 330A, 330B, 430A, 430B). Not limited to this. Therefore, for example, a plurality of conducting wires 40A and 40B may be accommodated in one conducting wire storage unit 30A (130A, 230A, 330A, 430A). In this case, the plurality of conductive wires are arranged in a line along the back surface 32 (132, 232, 332, 432).

The present invention is not limited to the case in which four positioning pins 52 are closely attached (fitted) to the four recesses 29 formed in the substrate 20. For example, even in the case where two positioning pins 52 are in close contact (fit) with two recesses 29 in the diagonal direction, the substrate 20 is positioned.
Further, two positioning pins 52 may be brought into close contact with two recesses 29 provided in the peripheral edge 20 f opposite to the peripheral edge 20 f provided with the conductor containing portions 30 A and 30 B among the four recesses 29. In other words, the substrate 20 may be held so as not to move when the conductive wires 40A and 40B (end faces 43t of the insulating coating 43) are pressed against the back surface 32 of the conductive wire housings 30A and 30B.

In each of the above-described embodiments, the conducting wires 40A and 40B have a diameter of 0.24 mm, and a small substrate unit is a target. The diameter of the conductive wires 40A and 40B is about 0.08 to 0.41 mm, but the effect of the present invention can be obtained, but 0.08 to 0.32 mm is more preferable. Thereby, positioning of the conducting wire of a small board | substrate unit and a board | substrate can be implemented reliably. Therefore, bonding of the lead to the substrate by soldering or ultrasonic bonding can be automated.
Moreover, in each embodiment mentioned above, although joining to core wire 42 and electrode pad 24A, 24B is performed by soldering, it is also possible by ultrasonic bonding. In this case, the core wires 42 of the conductive wires 40A and 40B are disposed in close contact with the electrode pads 24A and 24B of the first major surface 21 of the substrate 20.

Furthermore, in the case of ultrasonic bonding, the surfaces of the electrode pads 24A and 24B may be plated in advance to prevent oxidation. As a material of plating, tin, nickel, or their alloys are preferable. In the case of nickel plating, it is more preferable to include phosphorus in the plating composition. In order to include phosphorus in plating, it is preferable to use electroless plating using a reducing agent containing phosphorus in combination. In this case, for example, when hypophosphorous acid is used as the phosphorus compound, the concentration is preferably 1 wt% to 15 wt% with respect to the plating solution. In the plating layer, the crystallite size is preferably 10 μm or less, more preferably 0.1 μm or less, and still more preferably 0.02 μm or less. The bonding strength can be increased by making the crystallite small and amorphous in this manner.
In the case of ultrasonic bonding, since no auxiliary material is used, the core wire and the substrate can be securely connected, and the substrate unit can be thinned without the connection portion being raised more than necessary.

It is good also as a form which combined each embodiment mentioned above arbitrarily. Therefore, for example, by combining the third embodiment and the fourth embodiment, the wire housing portion is formed in the thickness direction of the substrate while being provided with the engaging projection that protrudes from the inner side surface and engages with the insulating coating. It may have a bottom surface.
In addition, without departing from the spirit of the present invention, it is possible to replace components in the above-described embodiment with known components as appropriate.

DESCRIPTION OF SYMBOLS 1 ... Electrochemical cell unit 2 ... Board | substrate unit 20 ... Board | substrate 20f ... Peripheral edge 30A, 30B ... Lead wire accommodating part 31 ... Inner side 32 ... Back surface 35 ... Lead wire Fixing resin 40A ... positive electrode lead (lead) 40B ... negative electrode lead (lead) 41 ... end part 42 ... core 43 ... insulation coating 43t ... end face 50 ... substrate holding jig 53: Positioning projection 102: Substrate unit 130A, 130B: Conducting wire storage portion 131: Inner side surface 132: Back surface 202: Substrate unit 230A, 230B: Conducting wire storage portion 231 ... the inner surface 232 ... inner surface 235 ... engaging projection 302 ... substrate units 330A, 330B ... wire accommodating portion 331 ... inner surface 332 ... inner surface 333 .. · Bottom surface 430A, 430B · · · Conducting wire housing portion 432 · · · back surface

Claims (9)

A substrate unit comprising a conductive wire having a core wire exposed from an insulating coating, and a substrate having a pair of electrode pads to which the core wire of the conductive wire is connected,
The substrate is formed to have a back surface and a peripheral edge cut out, and a lead wire accommodating portion for receiving the end of the insulating coating, and a pair of lands connected to the positive electrode tab and the negative electrode tab of the electrochemical cell , And
The substrate unit, wherein the conducting wire is accommodated along the depth direction of the conducting wire accommodation portion, and an end face of the insulating coating abuts on the back surface of the conducting wire accommodation portion. The substrate unit according to claim 1, wherein
The substrate unit, wherein the lead wire accommodating portion is formed such that a notch width gradually increases from the peripheral edge toward the back surface. The substrate unit according to any one of claims 1 or 2 , wherein
The substrate unit, wherein the lead wire accommodating portion includes an engagement protrusion which protrudes from an inner side surface and engages with the insulating coating. The substrate unit according to any one of claims 1 to 3 , wherein
A substrate unit comprising a wire fixing resin filled in the wire containing portion to fix the wire. The substrate unit according to any one of claims 1 to 4 , wherein
A substrate unit characterized in that the lead containing portion has a bottom surface formed in the thickness direction of the substrate. The substrate unit according to any one of claims 1 to 4 , wherein
A board unit characterized in that a positioning projection formed on a board holding jig on which the board is placed fits into the lead wire accommodating portion. The substrate unit according to any one of claims 1 to 6 , wherein
The substrate unit, wherein the core wire and the electrode pad are connected by ultrasonic bonding. The substrate unit according to any one of claims 1 to 7 , wherein
A substrate unit characterized in that the diameter of the conducting wire is 0.08 mm to 0.41 mm. An electrochemical cell unit comprising the substrate unit according to any one of claims 1 to 8 .

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