JP2014048057A - Plate thickness measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce deterioration in plate thickness measuring accuracy induced by thermal expansion.SOLUTION: To provide a plate thickness measuring apparatus comprising: a first structure (101) extending linearly in a first direction from one end to the other end; a second structure (102) extending linearly in parallel to the first direction from one end to the other end; a third structure (103) extending linearly in parallel to the first direction from one end to the other end; a first supporting part (106a) to which one end of the first structure and one end of the second structure are fixed to the same face and shifting in parallel to the first direction; a second supporting part (106b) to which the other end of the first structure and one end of the third structure are fixed to the same face and shifting in parallel to the first direction; a first sensor (104a) fixed to the second structure; and a second sensor (104b) fixed to the third structure and opposing the first sensor in the first direction.

Description

  The present invention relates to an apparatus for measuring a plate thickness.

  Patent document 1 measures the temperature of each part of the measuring instrument in order to prevent the deterioration of accuracy due to temperature change, corrects the output value obtained from the plate thickness measurement device based on the result, and heat caused by temperature change. Disclosed is an invention that does not change the measured value even if it is affected by expansion. Patent document 2 discloses the invention which prevents the thermal expansion of a frame body by covering the frame body which comprises a plate | board thickness measuring apparatus with a heat insulating material. Patent document 3 discloses the invention which reduces the influence on the measured value accompanying thermal expansion by forming a plate | board thickness measuring apparatus using a raw material with a small coefficient of thermal expansion.

JP-A-5-223526 JP 2010-236954 A JP-A-10-38551

  Patent Document 1 requires a temperature sensor for correcting thermal expansion of a plate thickness measuring instrument and a highly functional arithmetic device. Patent Document 2 requires a heat insulating material, a cooling device, and the like for preventing a temperature change of the plate thickness measuring device in addition to the frame body constituting the plate thickness measuring device. Patent Document 3 requires a special material having a low thermal expansion coefficient, such as an INVER material, as a material for the plate thickness measuring instrument.

  Thickness measuring instrument with a simpler device configuration than any of the inventions disclosed in any of the patent documents, without using a heat insulating material or a special material having a low coefficient of thermal expansion, while reducing manufacturing costs. A plate thickness measuring apparatus that can reduce deterioration in plate thickness measurement accuracy due to thermal expansion of the plate is desired.

  According to a first aspect of the present invention, a first structure extends linearly in a first direction from one end to the other end, and from one end to the other end. A second structure extending linearly in parallel with the first direction, and a third structure extending linearly in parallel with the first direction from one end to the other end And a first support portion in which one end of the first structure and one end of the second structure are fixed on the same surface, and the heat of the first and second structures A second support in which the first support portion that moves parallel to the first direction by expansion, the other end portion of the first structure body, and one end portion of the third structure body are fixed on the same surface. A second support unit that moves parallel to the first direction due to thermal expansion of the first and third structures; a first sensor attached to the second structure; Structure of 3 The second sensor is attached and is opposed to the first sensor along the first direction. Even if thermal expansion occurs in the first to third structures due to a temperature change, the first and second sensors This is a plate thickness measuring device in which the distance between the two sensors is kept constant.

  In the second aspect of the present invention, in addition to the first aspect, the first structure has a first thermal expansion coefficient α, and the second and third structures have a second thermal expansion coefficient β. A distance Ls between the first and second sensors, a length L1 extending linearly of the first structure, a length L2 extending linearly of the second structure, and a second The length L3 extending linearly of the structure 3 has a relationship of Ls = L1− (L2 + L3), and the change ΔLs of the temperature T of the distance Ls is ΔLs = {L1 * α− (L2 + L3) * β} * ΔT = 0.

  In the third aspect of the present invention, in addition to the second aspect, the first thermal expansion coefficient α is smaller than the second thermal expansion coefficient β, and the lengths L1, L2, and L3 are L1 = Ls * ( β / (β−α)) and L2 + L3 = Ls * (α / (β−α)).

  The object of the present invention is a simple apparatus configuration, which is due to the thermal expansion of the thickness measuring instrument while further reducing the manufacturing cost without using a heat insulating material or a special material having a low thermal expansion coefficient. Provided is a plate thickness measuring device capable of reducing deterioration of plate thickness measurement accuracy.

  The plate thickness measuring device according to the present invention has a simple device configuration with a reduced manufacturing cost, and the distance between the sensors is constant even if thermal expansion occurs in each structure as a frame due to a temperature change. Kept. As a result, the thickness measuring apparatus according to the present invention makes it possible to measure the thickness without an error due to a temperature change or with the error reduced.

It is a mimetic diagram showing the board thickness measuring device concerning a 1st embodiment of the present invention. It is a schematic diagram which shows the plate | board thickness measuring apparatus which concerns on 2nd Embodiment of this invention. It is a schematic diagram which shows the plate | board thickness measuring apparatus which concerns on 3rd Embodiment of this invention. It is a schematic diagram which shows the plate | board thickness measuring apparatus which concerns on 4th Embodiment of this invention. It is a schematic diagram which shows the plate | board thickness measuring apparatus which concerns on 5th Embodiment of this invention. It is a schematic diagram which shows the plate | board thickness measuring apparatus which concerns on 6th Embodiment of this invention.

  Hereinafter, exemplary embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, dimensions, materials, shapes, relative positions of components, and the like described in the following embodiments are arbitrary, and can be changed according to the structure of the apparatus to which the present invention is applied or various conditions. Further, unless otherwise specified, the scope of the present invention is not limited to the form specifically described in the embodiments described below. In the drawings described below, components having the same function are denoted by the same reference numerals, and repeated description thereof may be omitted.

[First embodiment]
(Thickness measuring apparatus 100)
FIG. 1 is a schematic view showing a plate thickness measuring apparatus 100 according to the first embodiment of the present invention. Here, in the present invention, in order to focus on the length of each structure in the plate thickness direction of the plate to be measured, FIG. 1 is viewed from the direction perpendicular to that direction, that is, from the side of the plate thickness measuring apparatus 100. It is a schematic diagram. The same applies to FIGS.

  The plate thickness measuring apparatus 100 includes a first structure 101, a second structure 102, a third structure 103, a first sensor 104a, a second sensor 104b, and a first support unit. 106 a, a second support portion 106 b, a base 107, and a control device 108.

  The first structure body 101 is a member as a frame that has one end portion and the other end portion and extends linearly from one end portion toward the other end portion. The second structure 102 has one end and the other end, and is parallel to the first structure 101 extending linearly from one end to the other end. It is a member as a frame extending linearly. The third structure 103 has one end and the other end, and is parallel to the first structure 101 extending linearly from one end to the other end. It is a member as a frame extending linearly.

  The first structure body 101, the second structure body 102, and the third structure body 103 have lengths L1, L2, and L3, respectively, in a direction extending linearly. The direction in which the first structure 101, the second structure 102, and the third structure 103 extend in a straight line is the thickness of the plate 109 when the plate 109 is arranged as shown in FIG. Match the direction. Hereinafter, the length of the structure means the length of the structure in the linearly extending direction (hereinafter referred to as “first direction” as appropriate).

The first structure 101 has a shape of a rectangular parallelepiped, a cylinder, a bar, etc., and is formed of a material having a thermal expansion coefficient α at room temperature. The second and third structures 102 and 103 have shapes such as a rectangular parallelepiped, a cylinder, and a rod, and are formed from a material having a thermal expansion coefficient β at room temperature. For example, the first structure is made of iron (thermal expansion coefficient α = 12.1 × 10 ⁻⁶ (K ⁻¹ )), and the second and third structures 102 and 103 are made of aluminum (thermal expansion coefficient β = 23). .5 × 10 ⁻⁶ (K ⁻¹ )).

  In the present embodiment, the material is not limited to these materials, and any material such as copper, titanium, silicon, silver, glass, plastic, wood, stone, or the like may be used. In the present embodiment, the first structure 101 may include a single material or a plurality of materials, and any material having a thermal expansion coefficient α as a whole is used. May be. Similarly, the second and third structures 102 and 103 may include a single material or a plurality of materials, and any one having a thermal expansion coefficient β as a whole can be used. It may be used.

  The first sensor 104a is attached to the second structure 102 so that the other end of the second structure 102 and the sensing surface thereof coincide with each other. The second sensor 104b is attached to the third structure 103 so that the other end of the third structure 103 and the sensing surface thereof coincide with each other. Further, the first and second sensors 104a and 104b face each other along the first direction.

  The first and second sensors 104a and 104b are laser sensors and measure the distance to the plate surface of the plate 109 to be measured by the triangulation method. For example, the first sensor 104a applies the laser beam 105a to the plate surface of the plate 109 on the first sensor 104a side, and measures the distance from the first sensor 104a to the plate surface based on the reflected light. To do. The second sensor 104b applies the laser beam 105b to the plate surface of the plate 109 on the second sensor 104b side, and measures the distance from the second sensor 104b to the plate surface based on the reflected light.

  In addition, the sensor of this embodiment is not limited to a laser sensor, What is necessary is just a sensor which outputs the distance information to a sensor which can measure the distance to a target object, or a target object. For example, a measure that mechanically measures the distance to the object or an image processing sensor that measures the distance to the object by image processing may be used.

  The first support part 106a is a flat member, although not limited thereto. The first support portion 106a fixes one end of the first structure 101 and one end of the second structure 102 on the same surface, and the first and second structures 101, 102 are fixed. Due to the thermal expansion, the first and second structures 101 and 102 extending linearly move in parallel (that is, parallel to the first direction).

  The second support portion 106b is a flat member, although not limited thereto. The second support portion 106b fixes the other end portion of the first structure body 101 and one end portion of the third structure body 103 on the same surface, and the first and third structure bodies 101, 103 are fixed. Due to the thermal expansion, the first and third structures 101 and 103 extending linearly move in parallel (that is, in parallel with the first direction).

  In the plate thickness measuring apparatus 100 described in FIG. 1, the height position (one-dimensional position in the first direction) of one end of the first structure 101 and one end of the second structure 102 is used. ) Is the same in the first support portion 106a, and the height positions of the other end portion of the first structure body 101 and one end portion of the third structure body 103 are the same in the second support portion 106b. The same.

  Since the first support portion 106a is only fixed to one end portion of the first structure body 101 and one end portion of the second structure body 102, the first structure due to the temperature change. The body 101 and the second structure 102 are in a movable state that moves in parallel with the first direction as the thermal expansion occurs.

  Since the second support portion 106b is only fixed to the other end portion of the first structure body 101 and one end portion of the third structure body 103, the first structure resulting from the temperature change. The body 101 and the third structure 103 are in a movable state that moves in parallel with the first direction as the thermal expansion occurs.

  The base 107 supports the first structure 101 at at least one point, and is installed on the floor, the ground, the base of the plate thickness measuring apparatus 100, or the like and does not move.

  The control device 108 is a normal computer including a processor, a memory, and the like, and controls the first and second sensors 104a and 104b. Based on the measured values from the first and second sensors 104a and 104b, the control device 108 stores the parameters of the plate thickness measuring device 100 that have been stored (the lengths of the first to third structures, their lengths). The plate thickness of the plate 109 to be measured can be calculated based on the thermal expansion coefficient and the like, and the result can be output to a monitor or the like. The plate 109 to be measured is supported by a support structure (not shown), and any plate may be used.

(Plate thickness measuring principle of plate thickness measuring apparatus 100)
The plate thickness measuring apparatus 100 according to the present embodiment measures the respective distances from the first and second sensors 104a and 104b facing each other and arranged so as to sandwich the plate 109 to be measured to the plate surface of the plate 109. Then, the thickness t is measured from the result.

  The distance Ls between the first sensor 104a and the second sensor 104b, the distance Ls1 from the first sensor 104a to the plate surface of the plate 109 on the first sensor 104a side, the second from the second sensor 104b The distance Ls2 to the plate surface of the plate 109 on the sensor 104b side and the plate thickness t of the plate 109 have a relationship of t = Ls−Ls1−Ls2. Ls can be arbitrarily determined when the plate thickness measuring apparatus 100 is designed, and is known. Therefore, the thickness L of the plate 109 can be obtained by obtaining the distance Ls1 by the first sensor 104a and obtaining the distance Ls2 by the second sensor 104b.

  When thermal expansion occurs in the first structure 101 due to the temperature change, the first structure 101 has the first support portion 106a in the upper part of FIG. 1 and the second support portion 106b in FIG. Move down. That is, the first sensor 104a attached to the second and third structures 102 and 103 fixed to the first and second support portions 106a and 106b is stretched by the thermal expansion of the first structure 101. An attempt is made to increase the distance Ls between the first sensor 104b and the second sensor 104b.

  At the same time, when thermal expansion occurs in the second and third structures 102 and 103 due to the temperature change, the second structure 102 moves the first sensor 104a downward in FIG. The structure 103 moves the second sensor 104b upward in FIG. That is, the expansion due to the thermal expansion of the second and third structures 102 and 103 is caused between the first sensor 104a and the second sensor 104b attached to the second and third structures 102 and 103. An attempt is made to reduce the distance Ls. As a result, the increase in the distance Ls due to the thermal expansion of the first structure 101 is offset by the decrease in the distance Ls due to the thermal expansion of the second and third structures 102 and 103. Therefore, the distance Ls between the first sensor 104a and the second sensor 104b is kept constant.

  In this embodiment, the thermal expansion coefficient α of the first structure 101 is smaller than the thermal expansion coefficient β of the second and third structures 102 and 103 (that is, α <β). In the plate thickness measuring apparatus 100 according to the present embodiment, the length L1 of the first structure 101 and the sum of the length L2 of the second structure 102 and the length L3 of the third structure 103 are: It is preferable to have a structure designed so that L1 = Ls * β / (β−α) and L2 + L3 = Ls * α / (β−α), respectively. In the present embodiment and the following embodiments, L1 and L2 + L3 are not limited to this.

When there is a temperature change ΔT, the change amount ΔLs of the distance Ls = L1− (L2 + L3) between the first sensor 104a and the second sensor 104b is
ΔLs = L1 * α * ΔT− (L2 * β * ΔT + L3 * β * ΔT)
= {L1 * α- (L2 + L3) * β} * ΔT
It is. Therefore, in order to set ΔLs to 0, L1, L2, and L3 may be designed so that {L1 * α− (L2 + L3) * β} is 0.

Here, since L1 = L2 + Ls + L3,
L1 * α− (L2 + L3) * β = 0
→ (L2 + Ls + L3) * α- (L2 + L3) * β = 0
→ (L2 + L3) = Ls * α / (β-α) and L1 = Ls * β / (β-α)
And the above design value. However, α <β.

  By configuring the plate thickness measuring apparatus 100 in this way, even if thermal expansion occurs in the first to third structures 101 to 103 due to temperature changes, the first sensor 104a and the second sensor 104b. The distance Ls between is kept constant. As a result, the plate thickness measuring apparatus 100 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low thermal expansion coefficient. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

[Second Embodiment]
(Thickness measuring apparatus 200)
FIG. 2 is a schematic view showing a plate thickness measuring apparatus 200 according to the second embodiment of the present invention. The plate thickness measuring apparatus 200 is substantially the same as the plate thickness measuring apparatus 100 according to the first embodiment, but the other end of the first structure 101 and the second sensor 104b are fixed to the base 107, and the first 3 in that the third structure 103 and the second support 106b are not provided.

  Since the first support portion 106a is only fixed to one end portion of the first structure body 101 and one end portion of the second structure body 102, the first structure due to the temperature change. The body 101 and the second structural body 102 are in a movable state that moves along the first direction with thermal expansion. On the other hand, the other end of the first structure 101 and the second sensor 104b are attached to the base 107, and do not move regardless of temperature changes.

(Plate thickness measurement principle of plate thickness measuring apparatus 200)
The plate thickness measuring principle of the plate thickness measuring apparatus 200 according to the present embodiment is substantially the same as the plate thickness measuring principle of the plate thickness measuring apparatus 100 according to the first embodiment.

  The distance Ls between the first sensor 104a and the second sensor 104b, the distance Ls1 from the first sensor 104a to the plate surface of the plate 109 on the first sensor 104a side, the second from the second sensor 104b The distance Ls2 to the plate surface of the plate 109 on the sensor 104b side and the plate thickness t of the plate 109 have a relationship of t = Ls−Ls1−Ls2. Ls can be arbitrarily determined when the plate thickness measuring apparatus 200 is designed, and is known. Therefore, the thickness L of the plate 109 can be obtained by obtaining the distance Ls1 by the first sensor 104a and obtaining the distance Ls2 by the second sensor 104b.

  When thermal expansion occurs in the first structure 101 due to the temperature change, the first structure 101 moves the first support portion 106a upward in FIG. That is, the expansion due to thermal expansion of the first structure 101 is between the first sensor 104a attached to the second structure 102 fixed to the first support portion 106a and the second sensor 104b. To increase the distance Ls.

  At the same time, when thermal expansion occurs in the second structure 102 due to the temperature change, the second structure 102 moves the first sensor 104a downward in FIG. That is, the expansion due to the thermal expansion of the second structure 102 tends to reduce the distance Ls between the first sensor 104a and the second sensor 104b attached to the second structure 102. As a result, the increase in the distance Ls due to the thermal expansion of the first structure 101 is offset by the decrease in the distance Ls due to the thermal expansion of the second structure 102. Therefore, the distance Ls between the first sensor 104a and the second sensor 104b is kept constant.

  In the present embodiment, the thermal expansion coefficient α of the first structure 101 is smaller than the thermal expansion coefficient β of the second structure 102 (that is, α <β). In the plate thickness measuring apparatus 200 according to this embodiment, the length L1 of the first structure 101 and the length L2 of the second structure 102 are L1 = Ls * β / (β−α), respectively. , L2 = Ls * α / (β−α) is preferable. In the present embodiment and the following embodiments, L1 and L2 + L3 are not limited to this.

When there is a temperature change ΔT, the change amount ΔLs of the distance Ls = L1−L2 between the first sensor 104a and the second sensor 104b is:
ΔLs = L1 * α * ΔT−L2 * β * ΔT
= (L1 * α-L2 * β) * ΔT
It is. Therefore, in order to set ΔLs to 0, L1 and L2 may be designed so that {L1 * α−L2 * β} is 0.

Here, since L1 = Ls + L2,
L1 * α−L2 * β = 0
→ (Ls + L2) * α−L2 * β = 0
→ L2 = Ls * α / (β-α) and L1 = Ls * β / (β-α)
And the above design value.

  By configuring the plate thickness measuring apparatus 200 in this way, even if thermal expansion occurs in the first and second structures 101 and 102 due to a temperature change, the first sensor 104a and the second sensor 104b. The distance Ls between is kept constant. As a result, the plate thickness measuring apparatus 200 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low thermal expansion coefficient. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

[Third Embodiment]
(Thickness measuring device 300)
FIG. 3 is a schematic diagram showing a plate thickness measuring apparatus 300 according to the third embodiment of the present invention. The plate thickness measuring apparatus 300 is substantially the same as the plate thickness measuring apparatus 100 according to the first embodiment, but includes a first sensor attachment portion 301a having one end fixed to the second structure 102, and a first sensor mounting portion 301a. A plurality of first sensors 104a attached to one sensor attachment portion 301a, a second sensor attachment portion 301b having one end fixed to the third structure 103, and a second sensor attachment portion 301b. And a second plurality of sensors 104b attached to the device.

  The first and second sensor attachment portions 301a and 301b have shapes such as a flat plate shape and a rod shape, and extend in a linear shape of the first to third structures 101 to 103 (first direction). It is a member that extends in a straight line perpendicular to. Each of the first plurality of sensors 104a and each of the second plurality of sensors 104b are arranged to face each other along the first direction.

  Since the plate thickness measuring apparatus 300 includes a plurality of sensors 104a and 104b, plate thicknesses at many points on the plate 109 to be measured can be measured at a time.

(Plate thickness measuring principle of plate thickness measuring apparatus 300)
The plate thickness measuring principle of the plate thickness measuring apparatus 300 according to the present embodiment is substantially the same as the plate thickness measuring principle of the plate thickness measuring apparatus 100 according to the first embodiment. Therefore, detailed description is omitted.

  The linearly extending direction of the first and second sensor mounting portions 301a and 301b is perpendicular to the linearly extending direction (first direction) of the first to third structures 101 to 103. It is. Therefore, the expansion due to the thermal expansion of the first and second sensor attachment portions 301 and 301b due to the temperature change occurs in a direction perpendicular to the first direction. Therefore, the expansion due to the thermal expansion of the first and second sensor mounting portions 301 and 301b does not affect the distance Ls between the first and second plurality of sensors 104a and 104b.

  By configuring the plate thickness measuring apparatus 300 in this manner, even if thermal expansion occurs in the first to third structures 101 to 103 due to temperature changes, the plurality of first sensors 104a and the plurality of first sensors The distance Ls between the two sensors 104b is kept constant. As a result, the plate thickness measuring apparatus 300 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low thermal expansion coefficient. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

[Fourth Embodiment]
(Thickness measuring device 400)
FIG. 4 is a schematic view showing a plate thickness measuring apparatus 400 according to the fourth embodiment of the present invention. The plate thickness measuring device 400 is substantially the same as the plate thickness measuring device 300 according to the third embodiment, but the first and second sensor mounting portions to which the first and second plurality of sensors 104a and 104b are mounted. A structure similar to that of the plate thickness measuring apparatus 100 according to the first embodiment is further provided so as to sandwich and fix 301a and 301b.

  That is, the thickness measuring apparatus 400 includes, in addition to the structure of the thickness measuring apparatus 300 according to the third embodiment, the fourth structure 401, the fifth structure 402, the sixth structure 406, A third support portion 406a and a fourth support portion 406b are further provided.

  The fourth structure 401 has one end and the other end, and is parallel to the linearly extending direction (first direction) of the first to third structures 101 to 103. A member as a frame extending linearly from one end to the other end. The fifth structure 402 has one end and the other end, and is parallel to the fourth structure 401 extending linearly from one end to the other end. It is a member as a frame extending linearly. The sixth structure 403 has one end and the other end, and is parallel to the fourth structure 401 extending linearly from one end to the other end. It is a member as a frame extending linearly.

  The fifth structure 402 includes the first sensor such that the direction extending linearly of the fifth structure 402 is perpendicular to the direction extending linearly of the first sensor attachment portion 301a. The other end of the attachment portion 301a is fixed. The sixth structure 403 includes the second sensor so that the linearly extending direction of the sixth structural body 403 and the linearly extending direction of the second sensor attachment portion 301b are perpendicular to each other. The other end of the attachment portion 301b is fixed.

  The fourth structure body 401, the fifth structure body 402, and the sixth structure body 403 have lengths L1, L2, and L3, respectively, in a direction extending linearly. The direction in which the fourth structure 401, the fifth structure 402, and the sixth structure 403 extend linearly is the thickness of the plate 109 when the plate 109 is arranged as shown in FIG. Match the direction.

The fourth structure 401 has a shape such as a rectangular parallelepiped, a cylinder, or a rod, and is formed of a material having a thermal expansion coefficient α at room temperature. The fifth and sixth structures 402 and 403 have shapes such as a rectangular parallelepiped, a cylinder, and a rod, and are formed of a material having a thermal expansion coefficient β at room temperature. For example, the fourth structure is made of iron (thermal expansion coefficient α = 12.1 × 10 ⁻⁶ (K ⁻¹ )), and the fifth and sixth structures 102 and 103 are made of aluminum (thermal expansion coefficient β = 23). .5 × 10 ⁻⁶ (K ⁻¹ )).

  In the present embodiment, the material is not limited to these materials, and any material such as copper, titanium, silicon, silver, glass, plastic, wood, stone, or the like may be used. In the present embodiment, the fourth structure 401 may include a single material or a plurality of materials, and any material having a thermal expansion coefficient α as a whole is used. May be. Similarly, the fifth and sixth structures 402 and 403 may include a single material or a plurality of materials, and any one having a thermal expansion coefficient β as a whole can be used. It may be used.

  The first plurality of sensors 104a are attached to the first sensor attachment portion 301a so that the other ends of the second and fifth structures 102 and 402 coincide with their sensing surfaces. The second plurality of sensors 104b are attached to the second sensor attachment portion 301b so that the other ends of the third and sixth structures 103 and 403 coincide with their sensing surfaces. In addition, each of the first plurality of sensors 104a and each of the second plurality of sensors 104b oppose each other along the first direction.

  The first and second plurality of sensors 104a and 104b are laser sensors, and measure the distance to the plate surface of the plate 109 to be measured by the triangulation method. For example, the first plurality of sensors 104a applies the laser beam 105a to a plurality of measurement points on the plate surface of the plate 109 on the first plurality of sensors 104a side, and the first plurality of sensors 104a are based on the reflected light. The distance from the sensor 104a to a plurality of measurement points on the plate surface is measured. The second plurality of sensors 104b applies the laser beam 105b to a plurality of measurement points on the plate surface of the plate 109 on the second plurality of sensors 104b side, and based on the reflected light, the second plurality of sensors 104b. Measure the distance from a plurality of measurement points on the plate surface.

  The first and second plurality of sensors 104a and 104b of the present embodiment are not limited to laser sensors, but sensors that can measure the distance to the object or sensors that output distance information to the object. If it is. For example, a measure that mechanically measures the distance to the object or an image processing sensor that measures the distance to the object by image processing may be used.

  The third support part 406a is a flat member, although not limited thereto. The third support portion 406 a fixes one end portion of the fourth structure body 401 and one end portion of the fifth structure body 402 on the same surface, and the fourth and fifth structure bodies 401 and 402. Due to the thermal expansion, the fourth and fifth structures 401 and 402 extending linearly move in parallel (that is, parallel to the first direction). Although the 4th support part 406b is not limited, it is a flat member.

  The fourth support portion 406b fixes the other end portion of the fourth structure body 401 and the one end portion of the sixth structure body 403 on the same surface, and the fourth and sixth structure bodies 401 and 403 are fixed. Due to the thermal expansion, the fourth and sixth structures 401 and 403 extending linearly move in parallel (that is, in parallel with the first direction).

  In the plate thickness measuring apparatus 400 shown in FIG. 4, the height position (one-dimensional position in the first direction) of one end of the fourth structure 401 and one end of the fifth structure 402 is used. ) Is the same in the third support portion 406a, and the height positions of the other end portion of the fourth structure body 401 and the one end portion of the sixth structure body 403 are the same in the fourth support portion 406b. The same.

  Since the third support portion 406a is only fixed to one end portion of the fourth structure body 401 and one end portion of the fifth structure body 402, the fourth structure is caused by a temperature change. The body 401 and the fifth structure 402 are in a movable state in which they move in parallel with the first direction with thermal expansion.

  Since the fourth support portion 406b is only fixed to the other end portion of the fourth structure 401 and one end portion of the sixth structure 403, the fourth structure resulting from the temperature change is used. The body 401 and the sixth structure 403 are in a movable state that moves in parallel with the first direction with thermal expansion.

  The base 107 supports the first and fourth structures 101 and 401 at at least one point, and is installed on the floor, the ground, the base of the plate thickness measuring device 400, or the like and does not move.

(Plate thickness measuring principle of plate thickness measuring device 400)
The plate thickness measuring principle of the plate thickness measuring apparatus 400 according to the present embodiment is substantially the same as the plate thickness measuring principle of the plate thickness measuring apparatuses 100 and 300 according to the first and third embodiments. Therefore, detailed description is omitted.

  The plate thickness measuring device 400 can measure the plate thickness at many points of the plate 109 to be measured at a time. In addition, since the first and second sensor mounting portions 301a and 301b are fixed from both sides by the second and third structures 102 and 103 and the fifth and sixth structures 402 and 403, the first and The second sensor attachment portions 301a and 301b are more stable, and as a result, the inter-sensor distance Ls is kept more constant.

  By configuring the plate thickness measuring device 400 in this way, even if thermal expansion occurs in the first to sixth structures 101 to 103 and 401 to 403 due to a temperature change, the first plurality of sensors 104a. And a distance Ls between the second plurality of sensors 104b is kept constant. As a result, the thickness measuring device 400 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low thermal expansion coefficient. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

[Fifth Embodiment]
(Thickness measuring device 500)
FIG. 5 is a schematic view showing a plate thickness measuring apparatus 500 according to the fifth embodiment of the present invention. The plate thickness measuring apparatus 500 is substantially the same as the plate thickness measuring apparatus 200 according to the second embodiment, but uses only one first sensor 104a, and the seventh structure 501 is fixed on the base 107. The second support portion 106b is not used.

  The seventh structure 501 includes a rectangular parallelepiped, a polygonal column, a cylinder, and the like including a first surface 501a that contacts the base 107 and a second surface 501b that faces the first surface and places the plate 109 to be measured. A member having a shape. The seventh structure 501 is a length between the first surface 501a and the second surface 501b in the direction (first direction) extending linearly of the first and second structures 101, 102. (Height) L3.

  In addition, the seventh structure 501 has a thermal expansion coefficient β at room temperature, like the second structure 102. In the present embodiment, the seventh structure may include a single material or a plurality of materials, and any material having a thermal expansion coefficient β as a whole can be used. Also good.

(Plate thickness measuring principle of plate thickness measuring device 500)
The plate thickness measuring principle of the plate thickness measuring apparatus 500 according to the present embodiment is substantially the same as the plate thickness measuring principle of the plate thickness measuring apparatus 200 according to the second embodiment.

  The plate 109 to be measured is arranged on the seventh structure 501 and the plate thickness t of the plate 109 is measured. The plate thickness measuring apparatus 500 according to the present embodiment measures the distance Ls1 from the first sensor 104a to the plate surface of the plate 109, and measures the plate thickness t from the result.

  The distance Ls between the first sensor 104a and the second surface 501b of the seventh structure 501 on which the plate 109 is disposed, the plate surface of the plate 109 on the first sensor 104a side from the first sensor 104a. And the thickness t of the plate 109 have a relationship of t = Ls−Ls1. Ls can be arbitrarily determined at the time of designing the plate thickness measuring apparatus 500 and is known. Therefore, the plate thickness t of the plate 109 can be obtained by obtaining the distance Ls1 by the first sensor 104a.

  When thermal expansion occurs in the first structure 101 due to the temperature change, the first structure 101 moves the first support portion 106a upward in FIG. That is, the expansion of the first structure 101 due to thermal expansion is caused by the first sensor 104a attached to the second structure 102 fixed to the first support portion 106a and the seventh structure 501. The distance Ls between the second surface 501b is increased.

  At the same time, when thermal expansion occurs in the second and seventh structures 102 and 501 due to the temperature change, the second structure 102 moves the first sensor 104a downward in FIG. The structure 501 moves the plate 109 to be measured stacked on the second surface 501b upward in FIG. That is, the expansion due to the thermal expansion of the second and seventh structures 102 and 501 is caused between the first sensor 104a attached to the second structure 102 and the second surface 501b of the seventh structure 501. An attempt is made to reduce the distance Ls. As a result, the increase in the distance Ls due to the thermal expansion of the first structure 101 is offset by the decrease in the distance Ls due to the thermal expansion of the second and seventh structures 102 and 501. Therefore, the distance Ls between the first sensor 104a and the second surface 501b of the seventh structure 501 is kept constant.

  In the present embodiment, the thermal expansion coefficient α of the first structure 101 is smaller than the thermal expansion coefficient β of the second and seventh structures 102 and 501 (that is, α <β). The plate thickness measuring apparatus 500 according to the present embodiment includes a length L1 of the first structure 101 extending in a linear shape, a length L2 of the second structure 102 extending in a linear shape, And the height of the seventh structure 501 (the length of the seventh structure 501 between the first surface 501a and the second surface 501b) L3 is L1 = Ls * β / ( [beta]-[alpha]), L2 + L3 = Ls * [alpha] / ([beta]-[alpha]).

When there is a temperature change ΔT, the change amount ΔLs of Ls = L1− (L2 + L3) is
ΔLs = L1 * α * ΔT− (L2 * β * ΔT + L3 * β * ΔT)
= {L1 * α- (L2 + L3) * β} * ΔT
It is. Therefore, in order to set ΔLs to 0, L1, L2, and L3 may be designed so that {L1 * α− (L2 + L3) * β} is 0.

Here, since L1 = L2 + Ls + L3,
L1 * α− (L2 + L3) * β = 0
→ (L2 + Ls + L3) * α- (L2 + L3) * β = 0
→ (L2 + L3) = Ls * α / (β−α) (where α <β)
→ L1 = Ls * β / (β-α) and L2 + L3 = Ls * α / (β-α)
And the above design value.

  By configuring the plate thickness measuring apparatus 500 in this way, even if thermal expansion occurs in the first and second structures 101 and 102 and the seventh structure 501 due to temperature changes, the first sensor The distance Ls between 104a and the second surface 501b on which the plate 109 of the seventh structure 501 is placed is kept constant. As a result, the thickness measuring apparatus 500 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low coefficient of thermal expansion. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

[Sixth Embodiment]
(Thickness measuring device 600)
FIG. 6 is a schematic view showing a plate thickness measuring apparatus 600 according to the sixth embodiment of the present invention. The plate thickness measuring apparatus 600 is substantially the same as the plate thickness measuring apparatus 100 according to the first embodiment, but the eighth structure 601, the ninth structure 602, and the tenth structure 603 are made of different materials. It differs in that it is formed.

  The plate thickness measuring apparatus 600 includes an eighth structure 601, a ninth structure 602, a tenth structure 603, a first sensor 104 a, a second sensor 104 b, and a first support unit. 106 a, a second support portion 106 b, a base 107, and a control device 108.

  The eighth structure 601 is a member as a frame that has one end and the other end and extends linearly from one end to the other end. The ninth structure 602 has one end and the other end, and is parallel to the eighth structure 601 extending linearly from one end to the other end. It is a member as a frame extending linearly. The tenth structure 603 has one end and the other end, and is parallel to the eighth structure 601 extending linearly from one end to the other end. It is a member as a frame extending linearly.

  The eighth structure body 601, the ninth structure body 602, and the tenth structure body 603 each have lengths L1, L2, and L3 in the direction extending linearly. The direction in which the eighth structure 601, the ninth structure 602, and the tenth structure 603 extend linearly is the thickness of the plate 109 when the plate 109 is arranged as shown in FIG. Match the direction.

The eighth structural body 601 has a shape such as a rectangular parallelepiped, a cylinder, or a rod, and is formed from a material having a thermal expansion coefficient α at room temperature. The ninth structure 602 has a shape such as a rectangular parallelepiped, a cylinder, or a rod, and is formed of a material having a thermal expansion coefficient β at room temperature. The tenth structure 603 has a shape such as a rectangular parallelepiped, a cylinder, or a rod, and is formed of a material having a thermal expansion coefficient γ at room temperature. For example, the eighth structure 601 is iron (thermal expansion coefficient α = 12.1 × 10 ⁻⁶ (K ⁻¹ )), and the ninth structure 602 is aluminum (thermal expansion coefficient β = 23.5 × 10 ⁻⁶ ( K ⁻¹ )), the third structure 603 is titanium (thermal expansion coefficient γ = 8.6 × 10 ⁻⁶ (K ⁻¹ )).

  In the present embodiment, the material is not limited to these materials, and any material such as copper, silicon, silver, glass, plastic, wood, stone, or the like may be used. In the present embodiment, the eighth structure 601 may include a single material or a plurality of materials, and any material having a thermal expansion coefficient α as a whole is used. May be. Similarly, the ninth and tenth structures 602 and 603 may include a single material or a plurality of materials, and any of them may have thermal expansion coefficients β and γ as a whole. May be used.

  The first sensor 104a is attached to the ninth structure 602 so that the other end of the ninth structure 602 and the sensing surface thereof coincide with each other. The second sensor 104b is attached to the tenth structure 603 so that the other end of the tenth structure 603 and its sensing surface coincide. Further, the first and second sensors 104a and 104b face each other along the first direction.

  The first support part 106a is a flat member, although not limited thereto. The first support portion 106a fixes one end of the eighth structure 601 and one end of the ninth structure 602 on the same surface, and the eighth and ninth structures 601 and 602 are fixed. Due to the thermal expansion of the first and second structures 601 and 602 extending linearly, the first and second structures 601 and 602 move in parallel (that is, in parallel with the first direction).

  The second support portion 106b is a flat member, although not limited thereto. The second support portion 106b fixes the other end of the eighth structure 601 and one end of the tenth structure 603 on the same surface, and the eighth and tenth structures 601 and 603. As a result of the thermal expansion, the eighth and tenth structures 601 and 603 extending linearly move in parallel (that is, in parallel with the first direction).

  In the plate thickness measuring apparatus 600 illustrated in FIG. 6, the height position (one-dimensional position in the first direction) of one end of the eighth structure 601 and one end of the ninth structure 602 is used. ) Are the same in the first support portion 106a, and the height positions of the other end portion of the eighth structure 601 and the one end portion of the tenth structure 603 are the same in the second support portion 106b. The same.

  Since the first support portion 106a is only fixed to one end portion of the eighth structure 601 and one end portion of the ninth structure 602, the eighth structure resulting from the temperature change is used. The body 601 and the ninth structure 602 are in a movable state that moves in parallel with the first direction as the thermal expansion occurs.

  Since the second support portion 106b is only fixed to the other end portion of the eighth structure 601 and one end portion of the tenth structure 603, the eighth structure is caused by a temperature change. The body 601 and the tenth structure 603 are in a movable state that moves in parallel with the first direction with thermal expansion.

  The base 107 supports the eighth structure 601 at least at one point, and is installed on the floor, the ground, the base of the plate thickness measuring apparatus 600, and the like and does not move.

(Plate thickness measuring principle of plate thickness measuring apparatus 600)
The plate thickness measuring apparatus 600 according to the present embodiment measures the respective distances from the first and second sensors 104a, 104b arranged so as to sandwich the plate 109 to be measured to the plate surface of the plate 109, The plate thickness t is measured from the result.

  The distance Ls between the first and second sensors 104a and 104b, the distance Ls1 from the first sensor 104a to the plate surface of the plate 109 on the first sensor 104a side, and the second from the second sensor 104b. The distance Ls2 to the plate surface of the plate 109 on the sensor 104b side and the plate thickness t of the plate 109 have a relationship of t = Ls−Ls1−Ls2. Ls can be arbitrarily determined when the plate thickness measuring apparatus 600 is designed, and is known. Therefore, the thickness L of the plate 109 can be obtained by obtaining the distance Ls1 by the first sensor 104a and obtaining the distance Ls2 by the second sensor 104b.

  When thermal expansion occurs in the eighth structure 601 due to the temperature change, the eighth structure 601 has the first support portion 106a in the upper part of FIG. 6 and the second support portion 106b in FIG. Move down. That is, the expansion due to the thermal expansion of the eighth structure 601 is caused by the first sensor 104a attached to the ninth and tenth structures 602 and 603 fixed to the first and second support portions 106a and 106b. An attempt is made to increase the distance Ls between the first sensor 104b and the second sensor 104b.

  At the same time, when thermal expansion occurs in the ninth and tenth structures 602 and 603 due to the temperature change, the ninth structure 602 moves the first sensor 104a downward in FIG. The structure 603 moves the second sensor 104b upward in FIG. That is, the expansion due to the thermal expansion of the ninth and tenth structures 602 and 603 is caused between the first sensor 104a and the second sensor 104b attached to the ninth and tenth structures 602 and 603. An attempt is made to reduce the distance Ls. As a result, the increase in the distance Ls due to the thermal expansion of the eighth structure 601 is offset by the decrease in the distance Ls due to the thermal expansion of the ninth and tenth structures 602 and 603. Therefore, the distance Ls between the first sensor 104a and the second sensor 104b is kept constant.

  In the present embodiment, the relationship between the thermal expansion coefficient α of the eighth structure 601 and the thermal expansion coefficient β of the ninth structure 602 and the thermal expansion coefficient γ of the tenth structure 603 is arbitrary.

When there is a temperature change ΔT, the change amount ΔLs of the distance Ls = L1− (L2 + L3) between the first sensor 104a and the second sensor 104b is
ΔLs = L1 * α * ΔT− (L2 * β * ΔT + L3 * γ * ΔT)
= {L1 * α- (L2 * β + L3 * γ)} * ΔT
It is. Therefore, in order to set ΔLs to 0, it is sufficient that {L1 * α− (L2 * β + L3 * γ)} is 0.

  Therefore, if the materials of the eighth to tenth structures 601 to 603 are selected and the respective lengths are designed so that {L1 * α− (L2 * β + L3 * γ)} becomes 0, The plate thickness t can be measured without error without being affected by thermal expansion.

For example, the eighth structure 601 is iron (thermal expansion coefficient α = 12.1 × 10 ⁻⁶ (K ⁻¹ ) at room temperature), and the ninth structure 602 is aluminum (thermal expansion coefficient β = 23.5 × 10 ⁻ at room temperature). ⁶ (K ⁻¹ )), when the tenth structure 603 is made of titanium (thermal expansion coefficient γ = 8.6 × 10 ⁻⁶ (K ⁻¹ ) at room temperature), the length of the eighth structure 601 L1 (m), length L2 (m) of the ninth structure body 602, and length L3 (m) of the tenth structure body 603 are {L1 * α− (L2 * β + L3 * γ)} = 0 It can be designed with any set of (L1, L2, L3) that satisfies the above.

  By configuring the plate thickness measuring apparatus 600 in this way, even if thermal expansion occurs in the eighth to tenth structures 601 to 603 due to a temperature change, the first sensor 104a and the second sensor 104b. The distance Ls between is kept constant. As a result, the plate thickness measuring apparatus 600 according to the present embodiment reduces the manufacturing cost without using a high-performance arithmetic device that corrects the influence of thermal expansion, a heat insulating material, or a special material having a low thermal expansion coefficient. However, the thickness t can be measured without error without being affected by thermal expansion with a simple apparatus configuration.

100: plate thickness measuring device, 101: first structure, 102: second structure, 103: third structure, 104a, 104b: first and second sensors, 105a, 105b: laser light, 106a, 106b: first and second support portions, 107: base, 108: control device, 109: plate to be measured

Claims (8)

A first structure extending linearly in a first direction from one end to the other end;
A second structure extending linearly in parallel with the first direction from one end to the other end;
A third structure extending linearly from one end toward the other end in parallel with the first direction;
One end of the first structure and one end of the second structure are fixed on the same surface, and are the first support portion of the first and second structures. A first support that moves parallel to the first direction by thermal expansion;
A second supporting portion in which the other end of the first structure and one end of the third structure are fixed on the same surface, the first and third structures being A second support that moves in parallel with the first direction by thermal expansion;
A first sensor attached to the second structure;
A second sensor attached to the third structure and facing the first sensor along the first direction;
A plate thickness measuring apparatus in which the distance between the first and second sensors is kept constant even if thermal expansion occurs in the first to third structures due to a temperature change. The first structure has a first coefficient of thermal expansion α;
The second and third structures have a second coefficient of thermal expansion β;
The distance Ls between the first and second sensors, the length L1 extending linearly of the first structure, the length L2 extending linearly of the second structure, and the first The length L3 extending linearly of the structure 3 has a relationship of Ls = L1− (L2 + L3),
2. The plate thickness measuring device according to claim 1, wherein a change ΔLs of the temperature T of the distance Ls has a relationship of ΔLs = {L1 * α− (L2 + L3) * β} * ΔT = 0. The first thermal expansion coefficient α is smaller than the second thermal expansion coefficient β,
The plate length according to claim 2, wherein the lengths L1, L2, and L3 have a relationship of L1 = Ls * (β / (β-α)) and L2 + L3 = Ls * (α / (β-α)). measuring device. A first sensor mounting portion extending linearly from one end toward the other end in a direction perpendicular to the first direction and having one end fixed to the second structure; ,
A second sensor attachment portion extending linearly from one end portion to the other end portion in a direction perpendicular to the first direction, and having one end portion fixed to the third structure; ,
A third sensor attached to the first sensor attachment;
A fourth sensor attached to the second sensor attachment portion and facing the third sensor along the first direction;
Even if thermal expansion occurs in the first to third structures due to temperature changes, the distance between the first and second sensors and the distance between the third and fourth sensors are kept constant. The plate thickness measuring apparatus according to any one of claims 1 to 3, wherein A fourth structure extending linearly in the first direction from one end to the other end;
A fifth structure extending linearly in parallel with the first direction from one end to the other end, and fixing the other end of the first sensor mounting portion;
A sixth structure extending linearly in parallel with the first direction from one end to the other end, and fixing the other end of the second sensor mounting portion;
One end of the fourth structure and one end of the fifth structure are fixed on the same surface, and are third support portions, and the fourth structure and the fifth structure A third support that moves parallel to the first direction by thermal expansion;
The other end portion of the fourth structure and the one end portion of the sixth structure are fixed to the same surface, and are a fourth support portion, and the fourth structure and the sixth structure A fourth support that moves in parallel with the first direction due to thermal expansion;
Even if thermal expansion occurs in the first to sixth structures due to temperature changes, the distance between the first and second sensors and the distance between the third and fourth sensors are kept constant. The thickness measuring apparatus according to claim 4, wherein The first structure has a first coefficient of thermal expansion α;
The second structure has a second coefficient of thermal expansion β;
The third structure has a third coefficient of thermal expansion γ;
The distance Ls between the first and second sensors, the length L1 extending linearly of the first structure, the length L2 extending linearly of the second structure, and the first The length L3 extending linearly of the structure 3 has a relationship of Ls = L1− (L2 + L3),
2. The plate thickness measuring apparatus according to claim 1, wherein a change ΔLs of the temperature T of the distance Ls has a relationship of ΔLs = {L1 * α− (L2 * β + L3 * γ)} * ΔT = 0. Base and
A first structure that extends linearly in a first direction from one end to the other end, and whose one end is fixed to the base;
A second structure extending linearly in parallel with the first direction from one end to the other end;
The other end of the first structure and the one end of the second structure are fixed on the same surface, and are the first support part, the first structure and the second structure. A first support that moves parallel to the first direction by thermal expansion;
A first sensor attached to the second structure;
A second sensor attached to the base and facing the first sensor along the first direction;
The first structure has a first coefficient of thermal expansion α;
The second structure has a second coefficient of thermal expansion β;
The distance Ls between the first and second sensors, the length L1 extending linearly of the first structure, and the length L2 extending linearly of the second structure are Ls. = L1-L2
The change ΔLs of the temperature T of the distance Ls has a relationship of ΔLs = (L1 * α−L2 * β) * ΔT = 0,
A plate thickness measuring apparatus in which the distance Ls between the first and second sensors is kept constant even if thermal expansion occurs in the first and second structures due to a temperature change. Base and
A first structure that extends linearly in a first direction from one end to the other end, and whose one end is fixed to the base;
A second structure extending linearly in parallel with the first direction from one end to the other end;
A third structure fixed to the base, comprising a first surface contacting the base and a second surface on which a plate to be measured is placed opposite the first surface; A structure,
The other end of the first structure and the one end of the second structure are fixed on the same surface, and are the first support part, the first structure and the second structure. A first support that moves parallel to the first direction by thermal expansion;
Comprising a first sensor attached to the second structure;
The first structure has a first coefficient of thermal expansion α;
The second structure has a second coefficient of thermal expansion β;
The third structure has a third coefficient of thermal expansion γ;
The distance Ls between the first surface of the first sensor and the third structure, the length L1 extending linearly of the first structure, and the linear length of the second structure. The existing length L2 and the length L3 between the first and second surfaces of the third structure have a relationship of Ls = L1− (L2 + L3),
The change ΔLs of the temperature T of the distance Ls has a relationship of ΔLs = {L1 * α− (L2 * β + L3 * γ)} * ΔT = 0,
Even if thermal expansion occurs in the first to third structures due to temperature changes, the distance Ls between the first sensor and the second surface of the third structure is kept constant. , Plate thickness measuring device.

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