KR101250211B1 - Bending measurement system and its method - Google Patents

Abstract

PURPOSE: A bending measuring device and a method for controlling the same are provided to provide the bending extent of a structure using simple thermocouple by easily measuring and calculating the same, thereby improving the accuracy of an equipment necessary for a sensor installed on the top of the structure. CONSTITUTION: A bending measuring device comprises a temperature measuring unit and a control unit(200). The temperature measuring unit includes a first thermocouple and second thermocouple which are arranged in the two faces facing each other and measures the temperature of the two faces on a real-time basis. The control unit calculates the inclination of a top plate of the structure using a coefficient of the thermal expansion of a material and the temperature of the two faces measured by the temperature measuring unit. [Reference numerals] (200) Control unit; (300) Display unit;

Description

Bending measuring device and control method of structure {BENDING MEASUREMENT SYSTEM AND ITS METHOD}

The present invention relates to a device for measuring warpage of a structure and a control method thereof, which calculates a compensation value of a device required for a sensor or a battle by measuring a degree of warpage of a structure in which a sensor or a battle required device is installed.

In general, in order to secure visibility, sensors or equipment necessary for combat are installed on top of structures such as ships and buildings. In addition, by measuring the degree of inclination of the structure, and through the arrangement to compensate the measurement value to the sensor and the equipment necessary for the battle to ensure the accuracy of the sensor and the equipment necessary for the battle. This arrangement usually takes months.

On the other hand, common materials expand when they receive heat and contract when they lose heat. Structures also warp when exposed to sunlight or heat, and this warp varies depending on the direction and amount of sunlight several times a day.

Thermal warpage cannot be compensated for by arranging, and it is inevitable by real time measurement.

Conventionally, in order to measure the deflection of the structure 10, a specific object or mark 1 is attached to the outer wall of the structure 10, and the position of the attached object or mark 1 is measured by the laser measuring instrument 2 and the error thereof is measured. The method of estimating the degree of warpage of the structure 10 was calculated by calculating.

However, while the conventional technique uses the laser measuring device 2 to measure the degree of warpage of the structure 10, the accuracy is high, but the price of the device is very expensive and there is a possibility of malfunction caused by external contaminants, thereby preventing malfunction. There is a drawback to having to provide additional facilities for.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-mentioned problems, and an object of the present invention is as follows.

First, the present invention is to provide a device for measuring the warpage of the structure and the control method thereof that can more easily measure the degree of bending of the structure.

Second, the present invention is to provide a device for measuring the warpage of the structure and the control method thereof that can improve the accuracy of the sensor and the equipment necessary for the battle is installed on the structure.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the warpage measuring device of the structure of the present invention may include a temperature measuring unit and a control unit.

The temperature measuring part may include a first thermocouple and a second thermocouple.

The first thermocouple and the second thermocouple may be provided on surfaces facing each other of a structure in which a sensor or equipment necessary for battle is installed on the upper surface thereof, so that the temperatures of the two surfaces facing each other may be measured in real time.

The controller may calculate the inclination of the upper plate of the structure by using the temperature of the surface facing each other measured by the temperature measuring unit and the thermal expansion coefficient for the material of the structure.

The controller may calculate the inclination of the upper plate of the structure by using a difference between the deformed heights of the facing surfaces provided with the temperature measuring part of the structure.

In addition, the control unit may calculate the compensation value of the sensor or the equipment required for the battle is installed on the upper portion of the structure using the slope of the upper plate of the structure to provide to the sensor or the equipment necessary for the battle in real time.

The temperature measuring part may further include a third thermocouple and a fourth thermocouple.

The third thermocouple and the fourth thermocouple may be provided to face each other on the other side of the structure except for the surface provided with the first thermocouple and the second thermocouple.

In addition, the warpage measuring device of the structure of the present invention may further include a display unit for outputting the inclination of the top plate of the structure and the sensor or the compensation value of the equipment necessary for combat measured by the control unit.

On the other hand, the control method of the apparatus for measuring the warpage of the structure of the present invention may include a temperature measuring step and a tilt calculation step.

The temperature measuring step may be made to measure the temperature of the surface facing each other with the first thermocouple and the second thermocouple provided on the surface facing each other of the structure in which the sensor or equipment necessary for the battle is installed on the top.

The tilt calculation step may be performed to calculate the slope of the upper plate of the structure using the temperature of the mutually opposite surfaces measured by the first and second thermocouples and the coefficient of thermal expansion of the material of the structure.

At this time, the step of calculating the slope may be made to calculate the inclination of the upper plate of the structure by using the difference of the modified height of the surface facing each other provided with the first thermocouple and the second thermocouple.

In addition, when the third thermocouple and the fourth thermocouple are further provided in the structure, the gradient calculation step may include a difference between a height of the deformed height of the surface on which the first thermocouple and the second thermocouple are provided, and the third thermocouple and the third thermocouple. 4 may be configured to calculate the inclination of the upper plate of the structure using the difference in the height of the deformation of the surface provided with the thermocouple.

In addition, the control method of the apparatus for measuring the warpage of the structure of the present invention by calculating the compensation value of the sensor or equipment necessary for the battle is installed on top of the structure using the slope of the top of the structure to the sensor or equipment necessary for the battle in real time It may further include a compensation calculation step to provide.

The effects of the present invention will be described below.

According to the warpage measuring apparatus and control method thereof of the structure of the present invention by using a simple thermocouple to measure and calculate the degree of warpage of the structure more easily, it is possible to improve the accuracy of the sensor installed on the top of the structure and equipment necessary for battle have.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

The above summary as well as the detailed description of the preferred embodiments of the present application described below will be better understood when read in connection with the accompanying drawings. Preferred embodiments are shown in the drawings for the purpose of illustrating the invention. However, it should be understood that the present application is not limited to the precise arrangements and instrumentalities shown.
1 is a view showing a device for measuring the degree of bending of the structure using a conventional laser measuring device;
FIG. 2 is a view illustrating a device for measuring warpage of a structure according to an embodiment of the present invention applied to a hexahedral structure; FIG.
Figure 3 is a view of applying a device for measuring the bending of the structure according to an embodiment of the present invention in a cylindrical structure;
Figure 4 is a view of applying a device for measuring the bending of the structure according to another embodiment of the present invention to the cube-shaped structure; And
Figure 5 is a schematic block diagram showing a control method of the apparatus for measuring warpage of the structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In describing the present embodiment, the same designations and the same reference numerals are used for the same components, and further description thereof will be omitted.

FIG. 2 is a view illustrating a device for measuring warpage of a structure according to an embodiment of the present invention applied to a hexahedral structure.

Hereinafter, a configuration of a warpage measuring apparatus of a structure according to an embodiment of the present invention will be described with reference to FIG. 2.

As shown in FIG. 2, the apparatus for measuring warpage of a structure according to an exemplary embodiment of the present disclosure may include a temperature measuring unit and a controller 200.

The temperature measuring unit includes a first thermocouple 110 and a second thermocouple 120 provided on opposite surfaces of the structure 10 on which a sensor or a device necessary for battle is installed on the upper surface of two walls facing each other. Can be measured in real time.

The controller 200 may calculate the inclination of the upper plate of the structure 10 by using the thermal expansion coefficients for the materials of the structure 10 and the surfaces of the facing surfaces measured by the temperature measuring unit.

Although the shape of the structure 10 may be various, in one embodiment of the present invention, as shown in FIG. 2, the first thermocouple 110 and the second thermocouple may face each other on the surfaces 10. An example in which 120 is provided will be described.

For the convenience of description, a surface on which the first thermocouple 110 is provided will be referred to as a first surface and a surface on which the second thermocouple 120 is provided a second surface.

When the structure 10 is made of a hexahedron, the first thermocouple 110 and the second thermocouple 120 may be installed on side surfaces of the structure 10 facing each other, that is, the first and second surfaces.

Since the first and second faces face opposite directions, the amount of sunlight received by the first and second faces is different, and therefore the amount of heat applied to the first and second faces may also be different. have.

On the other hand, general materials have a property of expanding when subjected to heat, and shrinking when taken away. Therefore, the surface where a relatively large amount of heat is applied will have a large amount of change, and the surface where a small amount of heat is applied will be a small amount of change.

Accordingly, the top plate of the structure 10 may be inclined toward a relatively less expanded surface by receiving less heat from the expanded surface.

In this embodiment, it is assumed that the first face is a face facing the sun.

Thus, the amount of change in the first surface is greater than the amount of change in the second surface, so that the top plate of the structure 10 can be inclined in the direction from the first surface to the second surface.

The controller 200 may obtain the inclination of the upper plate of the structure 10 by using the above principle.

, 구조물(10)을 이루는 재질의 열팽창계수를

라 할 때, 제 1 면의 초기 높이(

) 및 제 1 면의 온도와 열팽창계수를 이용하여, 제어부(200)는 다음의 <식 1>과 같이 제 1 면의 변화된 높이(

)를 계산할 수 있다.For example, the temperature of the first surface measured by the first thermocouple 110 is measured.

, The coefficient of thermal expansion of the material constituting the structure (10)

, The initial height of the first side (

) And the temperature and coefficient of thermal expansion of the first surface, the control unit 200 changes the height of the first surface (

) Can be calculated.

<Formula 1>

, 구조물(10)을 이루는 재질의 열팽창계수를

라 할 때, 제 2 면의 초기 높이(

) 및 제 2 면의 온도와 열팽창계수를 이용하여 다음의 <식 2>와 같이 제 2 면의 변화된 높이(

)를 계산할 수 있다.In addition, the controller 200 may measure the temperature of the second surface measured by the second thermocouple 120.

, The coefficient of thermal expansion of the material constituting the structure (10)

, The initial height of the second side (

) And the changed height of the second surface by using the temperature and coefficient of thermal expansion of the second surface

) Can be calculated.

<Formula 2>

)는 지면에 고정되어 변하지 않으므로, 제어부(200)는 <식 3>과 같이 제 1 면의 변화된 높이(

)와 제 2 면의 변화된 높이(

)의 차를 상판의 너비(

)로 나눈 값, 즉 상판의 기울기

을 계산할 수 있다.And, the width of the bottom plate (

) Is fixed to the ground and does not change, so that the controller 200 changes the height of the first surface (

) And the changed height of the second side (

Difference between the width of the top plate

Divided by), i.e. the slope of the top plate

Can be calculated.

<Formula 3>

In addition, the controller 200 may calculate a compensation degree of a sensor installed in the upper portion of the structure 10 or equipment necessary for battle using the inclination of the upper plate of the structure 10. In addition, the calculated value may be provided to a sensor or equipment necessary for battle in real time.

Therefore, the inclination of the upper plate may be calculated in a simple manner by using the temperatures of the surfaces facing each other measured by the first thermocouple 110 and the second thermocouple 120. In addition, it is possible to expect high accuracy of the sensor and the equipment necessary for the battle by providing a compensation value in real time to the sensor and the equipment necessary for the battle is installed on the top of the structure (10).

FIG. 3 is a view illustrating a device for measuring warpage of a structure according to an embodiment of the present invention to a cylindrical structure 10.

As shown in FIG. 3, the above-described processes may be equally applied to the case where the structure 10 has a cylindrical shape.

)의 길이가 일정하므로, 제어부(200)는 다음의 <식 4>와 같이 제 1 면의 변화된 높이(

)와 제 2 면의 변화된 높이(

)의 차를 상판의 지름(

)으로 나눈 값, 즉 상반의 기울기

을 계산할 수 있다.For example, when the structure 10 is formed in a cylindrical shape, the lower plate is fixed to the ground to have a diameter (

) Has a constant length, so that the controller 200 changes the height (1) of the first surface as shown in Equation 4 below.

) And the changed height of the second side (

) Of the top plate diameter (

Divided by), i.e. the slope of the upper half

Can be calculated.

<Equation 4>

However, the shape of the structure 10 to which the warpage measuring device of the present embodiment is applied is not limited to a hexahedron and a cylinder, and the warpage measuring device of the present embodiment may be applied to a structure 10 of various shapes including a hexahedron and a cylinder. have.

4 is a view illustrating a device for measuring warpage of a structure according to another embodiment of the present invention to a structure 10 having a hexahedron shape.

As shown in FIG. 4, according to the warpage measuring apparatus of a structure according to another embodiment of the present invention, the temperature measuring unit may further include a third thermocouple 130 and a fourth thermocouple 140.

The third and fourth thermocouples 130 and 140 are respectively disposed on other opposite surfaces of the structure 10 except for the first and second surfaces on which the first and second thermocouples 110 and 120 are provided. It may be provided.

Hereinafter, for convenience of description, the surface provided with the second thermocouple 120 will be referred to as a third surface and the surface provided with the fourth thermocouple 140 will be referred to as a fourth surface.

And, it is assumed that the third side receives a larger amount of sunlight than the fourth side.

) 및 제 4 면의 변화된 높이(

)는 상술한 제 1 면의 변화된 높이(

) 및 제 2 면의 변화된 높이(

)를 구하는 식과 같이 구할 수 있다.At this time, the changed height of the third surface (

) And the changed height of the fourth side (

) Is the varying height (

) And the changed height of the second side (

) Can be found as

, 구조물(10) 상판의 세로 너비를

라 할 때, 하판은 지면에 고정되어 하판의 가로너비인

과 하판의 세로너비인

가 일정하므로, 상판의 가로 너비(

) 방향의 기울기

과 상판의 세로 너비(

)방향의 기울기

는 하판의 가로 및 세로와 관계 없이 다음의 <식 5> 및 <식 6>과 같이 계산될 수 있다.In addition, the horizontal width of the top of the structure 10

, The vertical width of the top of the structure (10)

In this case, the bottom plate is fixed to the ground,

The vertical width of the bottom and bottom

Is constant, so the horizontal width of the top plate (

Inclination)

The vertical width of the

Inclination of direction

May be calculated as in the following <Equation 5> and <Equation 6> irrespective of the width and length of the lower plate.

&Lt; EMI ID =

&Lt; EMI ID =

Therefore, as in an embodiment of the present invention, it is possible to expect a higher accuracy than calculating the compensation value of the sensor or the equipment necessary for the battle in the width direction of the top plate of the structure (10).

In addition, in the present embodiment has been described as an example that the bending measuring device is applied to the hexahedral structure 10, but is not limited to this, the bending measuring apparatus of the present invention is applied to the structure 10 of various shapes as well as hexahedron. Can be.

On the other hand, the warpage measuring device of the structure of the present invention may be further provided with a display unit 300. The display unit 300 may output a compensation degree of a sensor or equipment necessary for a battle calculated using the inclination and inclination of the top plate of the structure 10 measured by the control unit 200.

As described above, a preferred embodiment according to the present invention has been described. Hereinafter, a control method according to each embodiment of the warpage measuring apparatus of the present invention will be described with reference to FIG. 5.

Figure 5 is a schematic block diagram showing a control method of the apparatus for measuring warpage of the structure of the present invention.

The control method of the apparatus for measuring warpage of the structure of the present invention may include a temperature measuring step and a tilt calculation step.

In the temperature measuring step, the temperature of the surfaces facing each other may be measured by the first thermocouple 110 and the second thermocouple 120.

In the slope calculation step, the slope of the top plate of the structure 10 may be calculated using the thermal expansion coefficients of the materials of the structure 10 and the temperatures of the surfaces facing each other measured by the first and second thermocouples 110 and 120. Can be.

)와 제 2 열전대(120)가 구비된 제 2 면의 변형된 높이(

)의 차를 이용하여 구조물(10) 상판의 기울기

을 계산할 수 있다.At this time, in the tilt calculation step, as described above, the deformed height of the first surface on which the first thermocouple 110 is provided (

) And the deformed height of the second surface with the second thermocouple 120 (

Tilt of the top of the structure 10 using the difference of

Can be calculated.

및

를 계산하도록 이루어질 수 있다.When the third thermocouple 130 and the fourth thermocouple 140 are further provided in the structure 10, the gradient calculation step may include the difference between the third height and the third surface of the first and second surfaces, as described above. Slope of the top plate of the structure 10 using the difference in the modified height of the fourth side

And

It can be made to calculate.

In addition, the control method of the apparatus for measuring the warpage of the structure of the present invention by calculating the compensation value of the sensor or the equipment required for the battle is installed on the upper portion of the structure 10 by using the inclination of the top plate of the structure 10 It may further include a compensation calculation step for providing the necessary equipment in real time.

On the other hand, the slope calculated in the tilt calculation step and the compensation value calculated in the compensation calculation step may be transmitted to the display unit 300 and output.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is obvious to them. Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.

: 제 1 면의 초기 높이

: 제 2 면의 초기 높이

: 제 3 면의 초기 높이

: 제 4 면의 초기 높이

: 제 1 면의 변형된 높이

: 제 2 면의 변형된 높이

: 제 3 면의 변형된 높이

: 제 4 면의 변형된 높이

: 육면체 구조물 상판의 너비

: 원기둥 구조물 상판의 지름1: Mark 2: Laser measuring instrument
10: structure 110: first thermocouple
120: second thermocouple 130: third thermocouple
140: fourth thermocouple 200: control unit
300: display unit

: Initial height of the first side

: Initial height of the second side

: Initial height of the third side

: Initial height of the fourth side

: Deformed height of the first face

: Deformed height of the second face

: Deformed height of the third face

: Deformed height of the fourth side

: Width of the top plate of cube

: Diameter of columnar column

Claims (9)

A temperature measuring part including a first thermocouple and a second thermocouple configured to face each other in real time to measure the temperatures of two opposite surfaces of a structure in which a sensor or a device necessary for battle is installed on an upper portion thereof; And
A control unit for calculating the inclination of the upper plate of the structure using the temperature of the mutually measured surfaces measured by the temperature measuring unit and the thermal expansion coefficient of the material of the structure;
Device for measuring warpage of a structure comprising a. The method of claim 1,
The control unit,
The apparatus of claim 1, wherein the slope of the upper plate of the structure is calculated by using a difference between the deformed heights of the facing surfaces provided with the temperature measuring part of the structure. The method of claim 1,
The control unit,
Using the inclination of the upper plate of the structure calculates the compensation value of the sensor or the equipment required for the battle to calculate the compensation value of the structure provided in real time to the sensor or equipment necessary for the battle. The method of claim 1,
The temperature measuring unit includes:
And a third thermocouple and a fourth thermocouple, which are provided to face each other on the other side of the structure except the surface on which the first thermocouple and the second thermocouple are provided. The method of claim 1,
And a display unit configured to output a tilt value of the upper plate of the structure measured by the controller and a compensation value of a sensor or equipment necessary for battle. A temperature measuring step of measuring a temperature of surfaces facing each other with a first thermocouple and a second thermocouple provided on surfaces facing each other of a structure in which a sensor or a device necessary for battle is installed on an upper portion thereof; And
An inclination calculation step of calculating the inclination of the upper plate of the structure by using the thermal expansion coefficients of the materials of the structure and the temperature of the surfaces facing each other measured by the first thermocouple and the second thermocouple;
Control method of the warpage measuring device of the structure comprising a. The method according to claim 6,
The tilt calculation step is a control method of the apparatus for measuring the warpage of the structure made to calculate the inclination of the upper plate of the structure by using the difference in the height of the deformation of the opposing surfaces provided with the first thermocouple and the second thermocouple. The method according to claim 6,
The structure is further provided with a third thermocouple and a fourth thermocouple,
The tilt calculation step may be performed by using the difference between the height of the deformed height of the surface provided with the first and second thermocouples and the height of the deformed height of the surface provided with the third and fourth thermocouples. Control method of the device for measuring the bending of the structure made to calculate the slope of the. The method according to claim 6,
Compensation measurement of the structure further comprises a compensation calculation step of calculating the compensation value of the sensor or the equipment required for the battle is installed on top of the structure using the inclination of the top of the structure and providing the sensor or equipment necessary for the battle in real time Control method of the device.

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