JP2014048054A - Bump electrode inspection method and bump electrode inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably measure electrical characteristics of a plurality of inspection objects.SOLUTION: A bump electrode inspection method comprises: a first measurement step of, for one part of a plurality of inspection objects, measuring electrical characteristics of the inspection objects in such a state that a bump electrode 12 is in contact with a contactor 112 at its predetermined first position while pressing the inspection target against an inspection circuit board; and a second measurement step of, for another part of the plurality of inspection objects, measuring electrical characteristics of the inspection objects in such a state that the bump electrode 12 is in contact with the contactor 112 at its second position of which at least one part does not overlap with the first position of the contactor 112, while pressing the inspection object against the inspection circuit board.

Description

  The present invention relates to a bump electrode inspection method and a bump electrode inspection apparatus.

  Japanese Patent Laid-Open No. 2001-298059 (Patent Document 1) is a prior art document disclosing an inspection probe substrate for inspecting a semiconductor chip.

  An inspection probe substrate described in Japanese Patent Laid-Open No. 2001-298059 (Patent Document 1) is electrically connected to an insulating substrate, a predetermined wiring pattern formed on the substrate, and the wiring pattern. And a metal protrusion that is in contact with an external terminal of the semiconductor device or the electronic device. The metal protrusions are composed of a plurality of protrusions provided at a pitch smaller than the diameter of the external terminals based on a predetermined arrangement rule.

JP 2001-298059 A

  When sequentially inspecting a plurality of inspection objects using one inspection circuit board, accumulation of dirt or wear occurs on the metal protrusions of the inspection circuit board, and the inspection object is stably inspected. May not be possible.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a bump electrode inspection method and a bump electrode inspection apparatus that can stably measure electrical characteristics of a plurality of inspection objects.

  In the bump electrode inspection method according to the present invention, the electrical characteristics of a plurality of inspection objects having bump electrodes are sequentially measured using an inspection circuit board having a contact made of a metal protrusion abutting against the bump electrodes. This is a bump electrode inspection method. In the bump electrode inspection method, the inspection object is in a state in which the inspection object and the inspection circuit board are pressed while the bump electrode is brought into contact with a predetermined first position of the contact in a part of the plurality of inspection objects. A first measurement step for measuring the electrical characteristics of the contact, and a second position of the contact that does not overlap at least partially with the first position of the contact in the other part of the plurality of inspection objects after the first measurement step And a second measurement step of measuring the electrical characteristics of the inspection object in a state where the inspection object and the inspection circuit board are pressed while the bump electrode is in contact with.

  In one form of this invention, after the measured value of the electrical property of a test object shows an abnormal value continuously for a predetermined number of times in a 1st measurement process, it transfers to a 2nd measurement process.

  In one form of this invention, after the external appearance of a contactor is image | photographed with an imaging device in a 1st measurement process, and the shape or color in the 1st position of a contactor changes beyond a predetermined range, it is in a 2nd measurement process. Transition.

  In one form of this invention, a contactor consists of several metal protrusions extended in parallel mutually. In the first measurement step, the bump electrode is brought into contact with the first position of two metal protrusions adjacent to each other. In the second measurement step, the bump electrode is brought into contact with a second position which is located on a straight line passing through the first position and extending in the extending direction of the metal protrusion.

  In one form of this invention, a contactor consists of three or more metal protrusions extended in parallel with each other. In the first measurement step, the bump electrode is brought into contact with the first position of two metal protrusions adjacent to each other. In the second measurement step, a second position between one of the two metal protrusions and a metal protrusion adjacent to the other of the two metal protrusions and opposite to the other of the two metal protrusions. A bump electrode is brought into contact with.

  The bump electrode inspection apparatus according to the present invention is a bump electrode inspection apparatus for a plurality of inspection objects having bump electrodes. The bump electrode inspection apparatus performs alignment so that the inspection circuit board having a contact made of a metal protrusion that contacts the bump electrode and the bump electrode of the inspection object and the contact of the inspection circuit board contact each other. Alignment means. Further, the bump electrode inspection device is a state in which the inspection object and the inspection circuit board are pressed, and a pressing means for pressing the inspection object and the inspection circuit board in a state where the bump electrode and the contact are in contact with each other. And measuring means for measuring the electrical characteristics of the inspection object. Further, the bump electrode inspection apparatus abuts the bump electrode at a predetermined first position of the contact in a part of the plurality of inspection objects, and in the other part of the plurality of inspection objects, Control means for controlling the positioning means so as to bring the bump electrode into contact with the second position of the contact that does not overlap at least partially with the first position of the contact.

  In one aspect of the present invention, the control means, when the measured value of the electrical property of the inspection object measured by bringing the bump electrode into contact with the first position of the contact shows an abnormal value for a predetermined number of times, The positioning means is controlled so that the bump electrode is brought into contact with the second position of the contact.

  In one embodiment of the present invention, the bump electrode inspection device further includes an imaging device for imaging the appearance of the contact. The control means is a positioning means for bringing the bump electrode into contact with the second position of the contact when the change of the shape or color of the contact at the first position exceeding the predetermined range is confirmed by photographing by the photographing device. To control.

  In one embodiment of the present invention, the bump electrode inspection device is composed of a plurality of metal protrusions whose contacts extend in parallel to each other. The control means controls the alignment means so that the bump electrodes are brought into contact with the first positions of two adjacent metal protrusions in a part of the plurality of inspection objects. In another part of the plurality of inspection objects, alignment means is provided so that the bump electrode is brought into contact with a second position passing through the first position and located on a straight line extending in the extending direction of the metal protrusion. Control.

  In one form of this invention, a contactor consists of three or more metal protrusions extended in parallel with each other. The control means controls the alignment means so that the bump electrodes are brought into contact with the first positions of two adjacent metal protrusions in a part of the plurality of inspection objects. In another part of the plurality of inspection objects, one of the two metal protrusions and a metal protrusion positioned adjacent to the other of the two metal protrusions and opposite to the other of the two metal protrusions. The positioning means is controlled so that the bump electrode is brought into contact with the second position with the protrusion.

  According to the present invention, the electrical characteristics of a plurality of inspection objects can be stably measured.

It is a perspective view which shows the structure of the bump electrode inspection apparatus which concerns on Embodiment 1 of this invention. It is a side view which shows the state by which a test target object and the circuit board for a test | inspection are pressed mutually. It is a top view which shows the state which made the bump electrode contact | abut to the 1st position of a contact, and pressed the test target object and the circuit board for a test | inspection. It is the figure which looked at the state of FIG. 3 from IV direction. It is a top view which shows the state which made the bump electrode contact | abut to the 2nd position of a contact, and pressed the test target object and the circuit board for a test | inspection. It is a perspective view which shows the state which changes the contact position of a bump electrode and a contact based on the measurement result of a measuring device in the modification of the embodiment. In the bump electrode inspection apparatus which concerns on Embodiment 2 of this invention, it is a perspective view which shows the state which changes the contact position of a bump electrode and a contactor based on the imaging | photography result of an imaging device. It is a perspective view which shows the state which changes the contact position of a bump electrode and a contact in the bump electrode test | inspection apparatus which concerns on Embodiment 3 of this invention. In the same embodiment, it is a top view which shows the state which made the bump electrode contact | abut to the 1st position of a contact, and pressed the test target object and the circuit board for a test | inspection.

  Hereinafter, a bump electrode inspection method and a bump electrode inspection apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a bump electrode inspection apparatus according to Embodiment 1 of the present invention. As shown in FIG. 1, the bump electrode inspection apparatus 1 according to Embodiment 1 of the present invention sequentially inspects the electrical characteristics of a plurality of inspection objects 10 having bump electrodes 12 on one main surface of a substrate 11. It is.

  The inspection object 10 is an electric device or an electronic component. Alternatively, the inspection object 10 is an aggregate such as a semiconductor wafer on which a plurality of elements are formed.

  Bump electrodes 12 made of solder are formed on the lower surface of the substrate 11. In the present embodiment, the base material 11 has a substantially rectangular outer shape in plan view, but the outer shape of the base material 11 in plan view is not limited to this, and may be various shapes such as a circle or an ellipse. .

  Four bump electrodes 12 are formed on the inspection object 10, but the number of bump electrodes 12 is not limited to this and may be one or more. In the present embodiment, the four bump electrodes 12 are positioned so as to be point-symmetric with respect to the center of the lower surface of the substrate 11.

  The bump electrode inspection apparatus 1 includes a mounting table 120, a measurement apparatus 160, a connection line 140, an inspection circuit board 110, and an inspection object transfer apparatus 130.

  The inspection circuit board 110 is mounted on the upper surface of the mounting table 120. In the present embodiment, the mounting table 120 has a rectangular parallelepiped outer shape. A measuring device 160 that is connected to the inspection circuit board 110 by a connection line 140 made of a copper wire or the like and measures the electrical characteristics of the inspection circuit board 110 is disposed on the side of the mounting table 120. The electrical characteristics include, for example, an electrical resistance value or an output signal with respect to an input signal.

  Above the mounting table 120, an inspection object transfer device 130 including a beam part 131 and a grip part 132 extending downward from both ends of the beam part 131 is disposed. The inspection object conveyance device 130 includes a drive unit (not shown) and is movable in the vertical direction and the horizontal direction.

  Further, the inspection object transfer device 130 can press the inspection object 10 against the inspection circuit board 110 by descending in the direction indicated by the arrow 190 in a state where the inspection object 10 is held by the holding unit 132. . Further, the inspection object transfer device 130 is movable in a direction indicated by an arrow 191 in a plane parallel to the upper surface of the mounting table 120. Note that the method of holding the inspection target 10 is not limited to gripping, and for example, the inspection target 10 may be sucked and held by a suction nozzle.

  A control device 180 that controls the operation of the inspection object conveyance device 130 is connected to the inspection object conveyance device 130.

  The inspection circuit board 110 according to the present embodiment includes an insulating substrate 111, a contact 112 made of metal protrusions 112a and 112b formed on one main surface of the insulating substrate 111, and an insulating substrate 111. It includes a coaxial connector 113 formed on a side surface and a signal line (not shown) that electrically connects the contact 112 and the coaxial connector 113.

  In this embodiment, the insulating substrate 111 has a substantially rectangular outer shape in plan view. However, the outer shape of the insulating substrate 111 in plan view is not limited to this, and may be various shapes such as a circle or an ellipse. It's okay.

  Four contacts 112 including two protrusions 112a and 112b are formed on the upper surface of an insulating substrate 111 made of an insulating material such as polyimide. Eight protrusions 112a and 112b are formed on the inspection circuit board 110. However, the number of protrusions is not limited to this, and the number of bump electrodes 12 formed on the inspection object 10 and the contact 112 are arranged. It is determined corresponding to the number of protrusions to be formed.

  The contact 112 faces the center point of the upper surface of the insulating substrate 111 and the center point of the lower surface of the base material 11 with the main surface of the circuit board 110 for inspection and the main surface of the inspection object 10 facing each other. When they are formed, they are positioned so as to correspond to the formation positions of the bump electrodes 12.

  The protrusions 112a and 112b are erected at a substantially right angle from the upper surface of the insulating substrate 111, and are formed so that the upper surface is flat. The protrusions 112a and 112b are made of a highly conductive metal, and are made of a metal or an alloy such as gold, silver, platinum, rhodium, palladium, copper, or nickel.

  The two protrusions 112a and 112b included in the contact 112 extend in a direction orthogonal to the side surface of the insulating substrate 111 on which the coaxial connector 113 is provided, and face each other at a predetermined interval. The length of the two protrusions 112a and 112b in the extending direction is equal to or larger than the diameter of the bump electrode 12.

  The signal line is formed by patterning a conductive material such as a copper foil provided on the insulating substrate 111.

  Hereinafter, a bump electrode inspection method by the bump electrode inspection apparatus 1 according to the present embodiment will be described.

  As shown in FIG. 1, in a state where the inspection circuit board 110 is placed on the mounting table 120, the inspection object 10 is held by the inspection object transfer device 130 so as to face the inspection circuit board 110.

  At this time, the bump electrode 12 of the inspection object 10 and the contact 112 of the inspection circuit board 110 are aligned so as to contact each other. In the present embodiment, the inspection object conveyance device 130 constitutes an alignment means.

  When the inspection object conveying device 130 is lowered in the direction indicated by the arrow 190, the bump electrode 12 and the contact 112 come into contact with each other.

  Further, the inspection object transfer device 130 is lowered in the direction indicated by the arrow 190 to press the inspection object 10 and the inspection circuit board 110 in a state where the bump electrode 12 and the contact 112 are in contact with each other.

  FIG. 2 is a side view showing a state in which the inspection object and the inspection circuit board are pressed against each other. As shown in FIG. 2, when the inspection object transfer device 130 is lowered, the inspection object 10 receives a pressing force 192 from the main surface opposite to the main surface on which the bump electrodes 12 are formed.

  Since the inspection circuit board 110 is placed on the mounting table 120, the inspection object 10 is pressed against the inspection circuit board 110 by the pressing force 192. In the present embodiment, the inspection object conveyance device 130 constitutes a pressing unit. By pressing the inspection object 10 and the inspection circuit board 110 while the bump electrode 12 and the contact 112 are in contact with each other, the oxide film adhering to the surface of the bump electrode 12 is slid with the contact 112. A so-called self-cleaning effect that peels off by movement can be obtained.

  The measuring device 160 that is a measuring unit measures the electrical characteristics of the inspection object 10 while the inspection object 10 and the inspection circuit board 110 are pressed. After the measurement of the electrical characteristics is completed, the inspection object transfer device 130 is raised and holds the inspection object 10 and the inspection circuit board 110 facing each other.

  As described above, when the electrical characteristics of the plurality of inspection objects 10 are sequentially measured, accumulation or wear of dirt gradually occurs on the protrusions 112a and 112b of the circuit board 110 for inspection. The contamination is generated, for example, when oxide on the surface of the bump electrode 12 adheres to the upper surfaces of the protrusions 112a and 112b. When the accumulation or wear of dirt on the protrusions 112a and 112b proceeds, the inspection of the inspection object 10 cannot be performed stably.

  Thus, in the present embodiment, the control device 180 controls the inspection object conveyance device 130 to change the contact position between the bump electrode 12 and the contact 112. Specifically, the bump electrode 12 is brought into contact with the first position of the contact 112 in a part of the plurality of inspection objects 10, and the contact is made in the other part of the plurality of inspection objects 10. The bump electrode 12 is brought into contact with the second position of the child 112. The second position is a position that does not overlap at least partly with the first position.

  FIG. 3 is a plan view showing a state in which the bump electrode is brought into contact with the first position of the contact so that the inspection object and the inspection circuit board are pressed. FIG. 4 is a view of the state of FIG. 3 as viewed from the IV direction. In FIG. 3, only one bump electrode and one contact are shown.

  As shown in FIGS. 3 and 4, the control device 180 which is a control means is in a predetermined first position on the end side in the extending direction of the contact 112 in a part of the plurality of inspection objects 10. The inspection object transfer device 130 is controlled so that the bump electrode 12 is brought into contact therewith.

  When the inspection object 10 and the inspection circuit board 110 are pressed in this state, the protrusion 112a and the bump electrode 12 are in contact with each other in the contact area 112c, and the protrusion 112b and the bump electrode 12 are in contact with each other in the contact area 112d. .

At this time, the length L of the contact regions 112c and 112d in the extending direction of the contact 112 is (D ² −W) where D is the diameter of the bump electrode 12 and W is the distance between the protrusion 112a and the protrusion 112b. ² ) ^1/2 .

  FIG. 5 is a plan view showing a state where the bump electrode is brought into contact with the second position of the contact so that the inspection object and the inspection circuit board are pressed. As shown in FIG. 5, when wear occurs in the first position of the contact 112, a consumable part 112e appears in the protrusion 112a, and a consumable part 112f appears in the protrusion 112b. The bump electrode 12 cannot be stably brought into contact with the first position of the contact 112 thus worn. For this reason, the inspection of the inspection object 10 cannot be performed stably with the bump electrode 12 in contact with the first position of the contact 112.

  Therefore, as described above, in the bump electrode inspection apparatus 1 according to the present embodiment, the control object 180 moves the inspection object transfer apparatus 130 in the direction indicated by the arrow 191 in FIG. The contact position with is changed.

  As shown in FIG. 5, the control device 180 is positioned on a straight line that passes through the first position and extends in the extending direction of the protrusions 112 a and 112 b in the other part of the plurality of inspection objects 10. The inspection object transfer device 130 is controlled so that the bump electrode 12 is brought into contact with the second position.

  When the inspection object 10 and the inspection circuit board 110 are pressed in this state, the protrusion 112a and the bump electrode 12 are in contact with each other in the contact area 112g, and the protrusion 112b and the bump electrode 12 are in contact with each other in the contact area 112h. .

In the present embodiment, the first position and the second position of the contact 112 are adjacent to each other and do not overlap. That is, the pitch P between the center 12a of the bump electrode 12 in contact with the first position of the contact 112 and the center 12b of the bump electrode 12 in contact with the second position of the contact 112 is The distance L is equal to (D ² −W ² ) ^1/2 . In this case, the contactor 112 can be most effectively used.

  In this way, the bump electrode 12 is brought into contact with the second position that does not overlap the first position of the contact 112 that has been worn by measuring the electrical characteristics of some of the plurality of inspection objects 10. By measuring the electrical characteristics of the other part of the inspection object 10, the electrical characteristics of the plurality of inspection objects 10 can be stably measured.

In order to make this possible, the length in the extending direction of the two protrusions 112a and 112b of the present embodiment is set to 2L (= 2 (D ² −W ² ) ^1/2 ) or more.

  In the present embodiment, the first position and the second position of the contact 112 are not overlapped, but the first position and the second position may partially overlap each other. Even in this case, a part of the second position of the contact 112 that does not overlap the first position and the bump electrode 12 come into contact with each other, so that the electrical characteristics of the other part of the plurality of inspection objects 10 are obtained. Can be measured stably. However, the more the portion where the first position and the second position do not overlap, the more the electrical characteristics of the other part of the plurality of inspection objects 10 can be measured more stably.

  In the present embodiment, the relationship between the number of contacts between the contact 112 and the bump electrode 12 and the accumulation state of dirt or the progress of wear in the contact 112 is obtained in advance by experiments, and the contact 112 and the bump electrode 12 The contact position between the bump electrode 12 and the contact 112 is changed when the number of contacts reaches a predetermined number determined based on the experimental results.

  In this way, by changing the contact position between the bump electrode 12 and the contact 112, it is possible to suppress the accumulation of dirt at a specific position of the contact 112 and reduce the cleaning frequency of the circuit board 110 for inspection. be able to. In addition, the frequency of replacement of the inspection circuit board 110 due to wear of the contact 112 can be reduced.

  That is, by dividing the contact 112 in the extending direction of the contact 112 and using each of them, the contact 112 can be used over the entire extending direction of the contact 112, and the circuit board 110 for inspection is effectively used. it can.

  In the present embodiment, the inspection object transport apparatus 130 serves as both the alignment means and the pressing means. However, an apparatus different from the inspection object transport apparatus 130 may be provided as the pressing means. Further, the contact position between the bump electrode 12 and the contact 112 may be changed twice or more.

  Furthermore, the measurement value of the electrical property of the inspection object 10 measured by bringing the bump electrode 12 into contact with the first position of the contact 112 when the contact position of the bump electrode 12 and the contact 112 is changed is a predetermined number of times. It is good also as the time of showing an abnormal value continuously.

  FIG. 6 is a perspective view showing a state in which the contact position between the bump electrode and the contact is changed based on the measurement result of the measurement device in the modification of the present embodiment.

  When the measured value of the electrical property of the inspection object 10 measured by bringing the bump electrode 12 into contact with the first position of the contact 112 shows an abnormal value continuously for a predetermined number of times, the inspection object whose electrical property is truly abnormal Since the object 10 rarely continues for a predetermined number of times, the control device 180 determines that the accumulation or wear of dirt has progressed at the first position of the contact 112 and, as shown in FIG. The transport device 130 is moved in the direction indicated by the arrow 191. As a result, the bump electrode 12 comes into contact with the second position of the contact 112.

  The predetermined number of times is set based on past inspection records of the inspection object 10. The abnormal value is, for example, a value exceeding the range of ± 3σ (σ: standard deviation) with respect to the median value of the electrical characteristics of the past inspection record.

  Even in this case, the electrical characteristics of the plurality of inspection objects 10 can be stably measured.

  Hereinafter, a bump electrode inspection method and a bump electrode inspection system according to Embodiment 2 of the present invention will be described.

  The bump electrode inspection apparatus according to the present embodiment is different from the bump electrode inspection apparatus 1 according to the first embodiment only in that the imaging apparatus is provided. Therefore, the description of the same configuration as the bump electrode inspection apparatus 1 according to the first embodiment is repeated. Absent.

(Embodiment 2)
FIG. 7 is a perspective view illustrating a state in which the contact position between the bump electrode and the contact is changed based on the imaging result of the imaging apparatus in the bump electrode inspection apparatus according to Embodiment 2 of the present invention.

  As shown in FIG. 7, the bump electrode inspection device according to the second embodiment of the present invention includes an imaging device including a camera 30 and an monitor 40 that captures the appearance of the contact 112.

  When dirt accumulates on the contact 112, the color of the upper surfaces of the protrusions 112a and 112b changes. That is, the color of the clean part and the part where dirt is accumulated are different. Further, when the contact 112 is worn, the shapes of the protrusions 112a and 112b change.

  Therefore, in the present embodiment, when the control device 180 confirms a change beyond the predetermined range of the shape or color at the first position of the contact 112 by photographing with the photographing device, the control device 180 moves the inspection object conveying device 130 to the arrow. It is moved in the direction indicated by 191. As a result, the bump electrode 12 comes into contact with the second position of the contact 112. The predetermined range is previously determined by experiment. That is, it is confirmed by an experiment how much it becomes impossible to measure the electrical characteristics of the inspection object 10 when the color or shape changes.

  Also in this embodiment, the electrical characteristics of the plurality of inspection objects 10 can be stably measured.

  Hereinafter, a bump electrode inspection method and a bump electrode inspection system according to Embodiment 3 of the present invention will be described.

  Since the bump electrode inspection apparatus according to the present embodiment is different from the bump electrode inspection apparatus 1 according to the first embodiment only in the configuration of the contact, the description of the same configuration as the bump electrode inspection apparatus 1 according to the first embodiment will not be repeated. .

(Embodiment 3)
FIG. 8 is a perspective view showing a state in which the contact position between the bump electrode and the contact is changed in the bump electrode inspection apparatus according to Embodiment 3 of the present invention.

  As shown in FIG. 8, in the bump electrode inspection apparatus according to Embodiment 3 of the present invention, the inspection circuit board 210 includes an insulating substrate 211 and a contact formed on one main surface of the insulating substrate 211. 212.

  The contact 212 includes three metal protrusions 212a, 212b, and 212c that extend in parallel to each other. In the present embodiment, the contact 212 is composed of three protrusions. However, the present invention is not limited to this, and the contact may be composed of three or more protrusions.

  FIG. 9 is a plan view showing a state in which the bump electrode is brought into contact with the first position of the contact and the inspection object and the inspection circuit board are pressed in the present embodiment.

  As shown in FIG. 9, the control device 180 inspects the bump electrode 12 so that the bump electrode 12 is brought into contact with the first positions of the two adjacent metal protrusions 212 a and 212 b in a part of the plurality of inspection objects 10. The object conveyance device 130 is controlled.

  When the inspection object 10 and the inspection circuit board 210 are pressed in this state, the protrusion 212a and the bump electrode 12 are in contact with each other in the contact area 212d, and the protrusion 212b and the bump electrode 12 are in contact with each other in the contact area 212e. .

  In another part of the plurality of inspection objects 10, the control device 180 is opposite to the other 212 a of the two metal protrusions and the other 212 a of the two metal protrusions. The inspection object conveying device 130 is controlled so that the bump electrode 12 is brought into contact with the second position with the metal protrusion 212c located at the position. Specifically, the control device 180 moves the inspection object transport device 130 in the direction indicated by the arrow 193 in FIG.

  When the inspection object 10 and the inspection circuit board 210 are pressed in this state, the protrusion 212b and the bump electrode 12 are in contact with each other in the contact area 212f, and the protrusion 212c and the bump electrode 12 are in contact with each other in the contact area 212g. .

  In the present embodiment, the first position and the second position of the contact 212 are adjacent to each other and do not overlap. The pitch P ′ between the center 12a of the bump electrode 12 in contact with the first position of the contact 212 and the center 12c of the bump electrode 12 in contact with the second position of the contact 212 is a protrusion. It is equal to the pitch Pt of 212a, 212b, 212c. The diameter D of the bump electrode 12 is smaller than the pitch Pt.

  Also in this embodiment, the electrical characteristics of the plurality of inspection objects 10 can be stably measured. Further, the length of the contact 212 in the extending direction can be shortened as compared with the first embodiment.

  Note that the control device 180 may be able to move the inspection object transport device 130 in the directions indicated by the arrows 191 and 193 in FIG. In this case, the contact position between the bump electrode 12 and the contact 212 is changed a plurality of times, and the three protrusions 212a, 212b, and 212c are divided and used in the extending direction, respectively. The circuit board 210 can be used over the entire extending direction 212, and the inspection circuit board 210 can be used more effectively.

  It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Bump electrode inspection apparatus, 10 Inspection object, 11 Base material, 12 Bump electrode, 12a, 12b, 12c Center, 30 Camera, 40 Monitor, 110,210 Inspection circuit board, 111,211 Insulating board, 112,212 Contact, 112a, 112b, 212a, 212b, 212c Protrusion, 112c, 112d, 112g, 112h, 212d, 212e, 212f, 212g Contact area, 112e, 112f Consumable part, 113 Coaxial connector, 120 Mounting table, 130 Inspection object Conveying device, 131 beam portion, 132 gripping portion, 140 connecting line, 160 measuring device, 180 control device, 192 pressing force.

Claims (10)

A bump electrode inspection method for sequentially measuring electrical characteristics of a plurality of inspection objects having bump electrodes using an inspection circuit board having a contact made of a metal protrusion abutting against the bump electrodes,
In a part of the plurality of inspection objects, the inspection object is pressed with the inspection object and the circuit board for inspection being in contact with the bump electrode at a predetermined first position of the contact. A first measurement step for measuring the electrical characteristics of
After the first measurement step, the bump electrode is brought into contact with the second position of the contact that does not overlap at least partially with the first position of the contact in the other part of the plurality of inspection objects. A bump electrode inspection method comprising: a second measurement step of measuring an electrical property of the inspection object in a state where the inspection object and the inspection circuit board are pressed while being pressed.   2. The bump electrode inspection method according to claim 1, wherein after the measured value of the electrical property of the inspection object shows an abnormal value continuously for a predetermined number of times in the first measurement step, the process proceeds to the second measurement step.   In the first measurement step, the external appearance of the contact is photographed with a photographing device, and after the shape or color at the first position of the contact changes beyond a predetermined range, the process proceeds to the second measurement step. The bump electrode inspection method according to claim 1. The contact consists of a plurality of metal protrusions extending in parallel with each other,
In the first measurement step, the bump electrode is brought into contact with the first position of the two metal protrusions adjacent to each other,
The said 2nd measurement process WHEREIN: The said bump electrode is contact | abutted to the said 2nd position located on the straight line which passes along the said 1st position and extends in the extension direction of the said metal protrusion. The bump electrode inspection method according to any one of the above. The contactor comprises three or more metal protrusions extending in parallel with each other;
In the first measurement step, the bump electrode is brought into contact with the first position of the two metal protrusions adjacent to each other,
In the second measuring step, the one of the two metal protrusions and the metal protrusion adjacent to the other of the two metal protrusions and opposite to the other of the two metal protrusions. The bump electrode inspection method according to claim 1, wherein the bump electrode is brought into contact with the second position. A bump electrode inspection apparatus for a plurality of inspection objects having bump electrodes,
An inspection circuit board having a contact made of a metal protrusion abutting against the bump electrode;
Alignment means for aligning the bump electrode of the inspection object and the contact of the circuit board for inspection;
A pressing means for pressing the inspection object and the circuit board for inspection in a state where the bump electrode and the contact are in contact with each other;
Measuring means for measuring electrical characteristics of the inspection object in a state where the inspection object and the inspection circuit board are pressed;
The bump electrode is brought into contact with a predetermined first position of the contact in a part of the plurality of inspection objects, and the contact of the contact is formed in the other part of the plurality of inspection objects. A bump electrode inspection apparatus comprising: control means for controlling the alignment means so that the bump electrode is brought into contact with a second position of the contact that does not overlap at least partially with the first position.   When the measured value of the electrical property of the inspection object measured by bringing the bump electrode into contact with the first position of the contact shows an abnormal value continuously a predetermined number of times, the control means The bump electrode inspection apparatus according to claim 6, wherein the positioning means is controlled to bring the bump electrode into contact with the second position. It further comprises a photographing device for photographing the appearance of the contact,
The control means applies the bump electrode to the second position of the contact when the change of the shape or color of the contact at the first position exceeding a predetermined range is confirmed by photographing with the photographing device. The bump electrode inspection apparatus according to claim 6, wherein the positioning unit is controlled so as to contact the bump electrode. The contact consists of a plurality of metal protrusions extending in parallel with each other,
The control means controls the positioning means so that the bump electrode is brought into contact with the first position of two metal protrusions adjacent to each other in a part of the plurality of inspection objects, In another part of the plurality of inspection objects, the bump electrode is brought into contact with the second position which is located on a straight line passing through the first position and extending in the extending direction of the metal protrusion. The bump electrode inspection apparatus according to claim 6, wherein the alignment unit is controlled. The contactor comprises three or more metal protrusions extending in parallel with each other;
The control means controls the positioning means so that the bump electrode is brought into contact with the first position of two metal protrusions adjacent to each other in a part of the plurality of inspection objects, In another part of the plurality of inspection objects, the metal is located on one side of the two metal projections and adjacent to the other of the two metal projections on the opposite side. The bump electrode inspection apparatus according to claim 6, wherein the positioning means is controlled to bring the bump electrode into contact with the second position with respect to the protrusion.

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