JP2014044189A - Probe and probe card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To finely control a probe tip moving distance in a scrub direction in an LSI inspection having a multi-pin and narrow-pitch pad arrangement.SOLUTION: A probe structure body is formed by a spring structure part formed on a resin film by finely processing metal foil stuck to the resin film, a probe part including vertical probe parts extended from one end of the spring structure part in a vertical direction, a conduction part connected to the other end of the spring structure, and a body part including a conductor dummy part or an insulation dummy part electrically insulated from the conduction part. The probe structure further includes one or more inclined beams having an optional angle from a horizontal direction and configured so that an approximately center part of the first vertical probe part becomes one end and a part of the body part becomes the other end, and approximately center parts of the n-th vertical probe part and the (n+1)th vertical probe part are mutually connected by the one or more horizontal beams.

Description

  The present invention relates to a probe used for circuit inspection of a plurality of semiconductor chips formed on a semiconductor wafer in a manufacturing process of an electronic device such as an LSI, and a probe card using the probe, and more particularly to the probe card. The present invention relates to a probe for bringing a vertical probe into contact with a circuit terminal (pad) and simultaneously measuring electrical continuity of a plurality of semiconductor chips, and a probe card using the probe.

  With the advancement of semiconductor technology, the degree of integration of electronic devices is improved, the area occupied by circuit wiring also increases in each semiconductor chip formed on a semiconductor wafer, so the number of pads on each semiconductor chip also increases, Along with this, miniaturization of the pad arrangement or high density has been promoted by reducing the pad area, the pad pitch and the like.

  At present, as an LSI having a narrow pitch pad and having a large number of pins, there is an LSI used for driving a liquid crystal panel (hereinafter referred to as an LCD driver LSI), for example, and an LSI having a pad pitch of 25 μm or less and a pad number exceeding 500. Has been developed. Furthermore, the pads can be arranged in a multi-pin configuration by arranging only two sides, four sides, four sides, and one or more of them in a zigzag pattern depending on the circuit scale. There are things etc.

  On the other hand, in logic LSIs and the like, there are many pads arranged in a lattice pattern, and there is a tendency to further narrow the pitch in the future. Furthermore, a SiP (System in Package) type LSI in which logic and memory are three-dimensionally stacked has been developed, and the demand for inspecting a lattice-shaped narrow pitch pad at the wafer level is increasing.

  In terms of probe cards, probe cards used for semiconductor circuit inspection require higher probe array density in order to cope with an increase in the number of pads on a semiconductor chip, a reduction in pad area, and a reduction in pad pitch. Has been. At the same time, with the concentration of wiring around the narrow-pitch probe array portion, the wiring board (circuit inspection apparatus side) must be densely wired, which is a factor in increasing the cost of the wiring board. Furthermore, probe cards with excellent high-frequency characteristics are required due to high-speed signals due to high density and high functionality of semiconductor chips.

  In order to cope with such a large number of pins and a narrow pitch, the present inventors have disclosed in Japanese Patent Application Laid-Open No. 2007-225581 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2007-27909 (Patent Document 2). A probe or a probe assembly composed of a film-like probe having a plurality of probe functions is proposed.

  Moreover, in patent document 2, the probe structure which provided the electrically conductive part connected with the probe on the same resin film, and the insulating dummy part by filling the metal conductor dummy part electrically independent from these, or an insulating resin material Has proposed. Further, in Patent Document 2, a probe assembly is formed by using a resin film to which a copper alloy foil is bonded, and etching the copper alloy foil to form a conductive portion including a probe and a terminal portion on the resin film. A plurality of probes with a resin film are stacked, and the terminal portion is formed on each resin film so that the arrangement positions thereof are shifted at a rough pitch when the probes with a resin film are stacked. As a result, it is possible to connect to the wiring board at a somewhat rough pitch even in the vicinity of the probe assembly, and there is a certain effect that it contributes to the reduction in the number of wiring board layers used in the probe card and the simplification of wiring. ing.

  As for the reduction in the number of layers of the wiring board, a plurality of wiring boards are formed in the probe assembly as in the configuration disclosed in Japanese Patent Laid-Open No. 2010-054487 (Patent Document 3), and the nth layer wiring is formed. There has been proposed a configuration in which a land array group formed at one end of a substrate is brought into contact with an output terminal group of the nth row of the probe assembly. As a result, adjacent terminals can be directly connected to a land provided on another layer of the wiring board, which contributes to a reduction in the number of wiring board layers and simplification of wiring.

  Japanese Patent Laid-Open No. 2007-225581   JP 2007-279209 A   JP 2010-054487 A

  However, according to the conventional examples shown in Patent Document 1 and Patent Document 2, it is necessary to reduce the thickness of the copper foil or the width of the vertical probe portion when the pad interval is further narrowed. is there. Moreover, in order to avoid the convergence of the adjacent spring structure part, it is necessary to lengthen the beam length of the vertical probe part. For this reason, bending deformation, buckling deformation, etc. easily occur in the in-plane direction, and there arises a problem that the probe tip position and the scrub amount vary.

  Further, according to the conventional examples shown in Patent Document 2 and Patent Document 3, since it is necessary to lengthen the pattern from the probe tip to the connection terminal to the wiring board, the area required for connection with the wiring board becomes large, There arises a problem that high frequency characteristics deteriorate due to delays caused by variations in pattern length.

  The present invention has been made to solve the above problems, and its first object is to perform batch inspection when a plurality of very narrow pitch grid array pads or complex peripheral array pad type LSIs are adjacent to each other. A probe card capable of controlling the position of the probe tip and the amount of scrub with high accuracy in a compatible probe card is provided.

  A second object of the present invention is to provide a probe card that can reduce the area required for connection with a wiring board by reducing variations in pattern length from the probe tip to the terminal.

  A third object of the present invention is to provide a probe card that is less likely to cause delay in a high-frequency signal, has high density, and is excellent in high-frequency characteristics.

  According to the present invention, a resin film to which a metal foil is bonded is used to finely process the metal foil, and a spring structure portion and a vertical probe portion that extends vertically from one end of the spring structure portion on the resin film are provided. In the probe structure formed by the probe portion including the conductive portion connected to the other end of the spring structure portion and the main body portion including the conductor dummy portion or the insulating dummy portion electrically insulated from the conductive portion, The vertical probe tip portion has an inclined beam having an arbitrary angle with respect to the horizontal direction, with the central portion of the vertical probe portion as one end and a part of the main body portion as the other end. The operation can be controlled finely.

  Further, according to the present invention, at least one portion between the inclined beam and the vertical probe portion or between the inclined beam and the main body portion has an approximately same thickness as the metal foil. It is characterized by being connected via a wire, and therefore has the effect of maintaining mechanical strength while maintaining electrical insulation.

  Further, according to the present invention, in the probe structure in which two or more pairs of the probe part and the conductive part are arranged on one resin film, a substantially central part of the first vertical probe part is one end, One or more inclined beams having an arbitrary angle with respect to the horizontal direction, with a part of the main body as the other end, and a substantially central portion of the nth vertical probe portion and the (n + 1) th vertical probe portion Since one or a plurality of horizontal beams are connected to each other, it is possible to finely control the X-direction operation of all the vertical probe tips on the resin film in which a plurality of probes are installed in parallel. Has an effect.

  In addition, the present invention regularly includes a plurality of probe assemblies in which a plurality of probes including a vertical probe, a connection terminal connected to a wiring board, and a plurality of probes including a pattern connecting the vertical probe and the connection terminal are arranged on the same plane. The probe assembly and the wiring board composed of a plurality of layers are connected to each other by connecting the connection terminal and a pad (connection land) formed at one end of the wiring board. In the probe card for performing the above, the connection terminal is arranged in a direction substantially perpendicular to the vertical probe. Since the connection terminal has means for arranging the connection terminal in a direction substantially perpendicular to the vertical probe, it is possible to reduce variations in pattern length.

  Moreover, you may have a means to arrange | position the said several terminal substantially right and left equally on the same plane. According to this, it is possible to make the wiring to the wiring board uniform. Furthermore, when the wiring board is a double-sided flexible flat cable, the structure of the wiring board becomes easy.

  In addition, one terminal of the first probe assembly is connected to a connection land installed on the upper surface or the lower surface of the double-sided flexible flat cable, and the terminals of the adjacent second probe assembly are the same. Since it has means for connecting to the connection land installed on the other side of the wiring, it can be wired evenly on the wiring board having a relatively large pad pitch, and the wiring connection density can be improved. .

  In the present invention, the terminal includes a means for generating a spring force in the Z direction, contacting the land with a repulsive force of the spring and not being restrained in the plane direction (XY direction). Connection with the terminal becomes simple. Further, the probe constituting the probe assembly uses a resin film to which a copper alloy foil is bonded, and finely processes the copper alloy foil to form a conductive portion including a probe and a terminal portion on the resin film. Therefore, the probe assembly can be configured with a narrow pitch. Furthermore, since the conductor dummy part electrically insulated from the probe has means for installing in the same plane as the probe, the strength can be maintained.

  According to the probe of the present invention, the position of the probe tip and the amount of scrub can be controlled with high accuracy, and the position between a plurality of probes can be kept constant. In addition, it is possible to provide a probe card with high probe contact reliability for inspection of LSIs having complicated peripheral arrangement pads and the like.

  Also, according to the probe card of the present invention, in the probe assembly having a plurality of adjacent probes on the same surface, the terminal mainly has means for arranging in a substantially right angle direction with respect to the vertical probe. It is possible to reduce the variation in pattern length, thereby reducing the area required for connection with the substrate and reducing the delay in the high-frequency signal. It is possible to provide a probe card.

  It is explanatory drawing which shows the basic structure of the probe assembly which is the 1st Embodiment of this invention.   It is a figure explaining the structure of the probe which is the 1st Embodiment of this invention.   It is a figure explaining operation | movement of the probe which is the 1st Embodiment of this invention.   It is a figure explaining operation | movement of the probe which is the 1st Embodiment of this invention.   It is a figure explaining the structure of the probe which is the 2nd Embodiment of this invention.   It is a figure explaining operation | movement of the probe which is the 2nd Embodiment of this invention.   It is a figure explaining the structure of the probe which is the 3rd Embodiment of this invention.   It is a figure explaining operation | movement of the probe which is the 3rd Embodiment of this invention.   It is a figure explaining operation | movement of the probe which is the 3rd Embodiment of this invention.   It is a figure explaining a part of operation | movement of the probe which is the 3rd Embodiment of this invention.   It is explanatory drawing which shows the basic structure of the probe assembly which is the 4th Embodiment of this invention.   It is a figure explaining the structure of the probe which is the 4th Embodiment of this invention.   It is a figure explaining an example of the connection part of the connection terminal and wiring board in the 4th Embodiment of this invention.   It is a figure explaining the other example of the connection part of the connection terminal and wiring board in the 4th Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view for explaining the structure of a probe assembly which is the basis of an embodiment of the present invention. In FIG. 1, reference numeral 100 denotes a probe structure constituting a basic element of the probe assembly 5. The first probe unit 110 includes a vertical probe unit 111 and a spring structure unit 112, a vertical probe unit 121 and a spring structure unit. The second probe unit 120 configured by 122 and the third probe unit 130 configured by the vertical probe unit 131 and the spring structure unit 132 are disposed on the resin film 50.

  The tip portions 113, 123, 133 of the vertical probe portions 111, 121, 131 are finely processed so as to come into contact with the pads 11 of the LSI to be inspected. The other end of the spring structure 112 is connected to a connection terminal 115 connected to the pad 31 of the wiring board 3 through the conductive portion 114. Similarly, the other end of the vertical probe portion 121 is connected to the connection terminal 125 through the conductive portion 124, and the other end of the vertical probe portion 131 is connected to the connection terminal 135 through the conductive portion 134. Only the distal end portions of the vertical probe portions 111, 121, 131 and the distal end portions of the connection terminals 115, 125, 135 slightly protrude out of the resin film 50.

  On the other hand, on the resin film 50, conductor dummy portions 151 to 154 that are electrically separated from the probe portions 110, 120, 130, the conductive portions 114, 124, 134 and the connection terminals 115, 125, 135 are installed. Thus, the mechanical strength of the probe structure 100 is maintained. The probe parts 110, 120, 130, the conductive parts 114, 124, 134, the connection terminals 115, 125, 135, and the conductor dummy parts 151-154 are adhered to the surface of the resin film 50 by a method such as adhesion or vapor deposition. The formed metal foil, for example, a copper alloy foil (for example, BeCu foil) 60 is simultaneously formed by fine processing by laser processing or etching. Furthermore, between the conductive portions 114, 124, and 134 and the conductor dummy portions 151 to 154, an insulating resin (for example, polyimide resin) is filled with the same thickness as the copper alloy foil, and then thermally cured. Insulating dummy portions 155 to 158 are provided, which makes it possible to maintain mechanical strength while maintaining electrical insulation between the conductive portion and the conductor dummy portion. In the above configuration, a portion that does not cause deformation other than the probe portions 110, 120, and 130 that cause a probe operation by the spring structure is referred to as a main body portion 150. In addition, as said metal foil, copper (not alloy) foil, aluminum foil, gold foil, silver foil, etc. can be used.

  The example of FIG. 1 shows a probe structure 100 in which a plurality of probes (three in this embodiment) that are in contact with a plurality of pads on one straight line of the chip 1 are formed on the same resin film. A plurality of probe structures 101 to 100 + n having different X-direction positions of the probe portions 110, 120, and 130 and the connection terminals 115, 125, and 135, and the shapes of the conductor dummy portions and the insulating dummy portions associated therewith, By arranging with the set pitch P, it is possible to make contact with all the pad arrays on the target chip. In addition, the probe assembly 5 is slightly more than the cross-sectional shape of the vertical probe portions 111, 121, 131 in order to guarantee the positional accuracy of the tips 113, 123, 133 of the vertical probe portions 111, 121, 131. A probe guide plate 20 made of an insulating resin or the like having a probe guide hole 21 having a large hole shape is installed, and the tips of the vertical probe portions 111, 121, 131 are inserted into all the guide holes 21. Thereby, the probe tip position in the Y direction can be maintained with high accuracy. In this specification, the “X” direction represents, for example, the longitudinal direction (left-right direction in FIG. 1) of the resin film 50 constituting the probe structure 100 shown in FIG. The “Y” direction represents, for example, a direction perpendicular to the surface of the resin film 50 shown in FIG. 1 (direction perpendicular to the paper surface of FIG. 1). The “Z” direction (described later) represents the short direction (vertical direction in FIG. 1) of the resin film 50 shown in FIG. 1, which is perpendicular to both the X direction and the Y direction. Then, by setting coordinate axes extending in the X, Y, and Z directions, X, Y, and Z three-dimensional orthogonal coordinates are formed. In the drawings other than FIG. 1, the X, Y, and Z directions indicate directions corresponding to FIG.

(First embodiment)
A first embodiment of a probe structure according to the present invention will be described with reference to FIG. FIG. 2 is an enlarged view of the vicinity of the first probe portion 110 of the probe structure 100 shown in FIG. As shown in FIG. 2, an angle θ1 ° with respect to the horizontal direction is set with the central portion of the vertical probe portion 111 as one end and a part of the main body portion (conductor dummy portion 151 in this embodiment) as the other end. An inclined beam 140 is provided. Further, the copper alloy foil between the inclined beam 140 and the vertical probe portion 111 or between the inclined beam 140 and the main body portion 150 is excluded in advance, and the insulation has a thickness substantially equal to the copper alloy foil. By providing insulating dummy portions 141 and 142 by filling and curing a resin material, electrical insulation is ensured while maintaining mechanical strength between the inclined beam 140 and the vertical probe portion 111 or the main body portion 150. To do.

１１１の先端部のＸ方向変位を０に近づけることができる。この動作原理により、狭ピッチかつ小面積のパッドに精度良く接触することが可能となる。The operation of the probe structure having the above configuration will be described with reference to FIGS. FIG. 3 is a diagram illustrating the basic operation of the probe unit 110. As shown in FIG. 3A, the spring structure 112 has a curved width 41 having a beam width w of 60 μm, for example, and a curvature radius Rp = 0.25 mm, for example. The first arm portion 43 connected to the support portion 44 corresponding to the boundary portion with the conductor portion 114 via 41 has an arm length L1 of 0.87 mm, for example, α1 = 35.3 ° with respect to the horizontal direction. On the other hand, the second arm part 42 connected to the vertical probe part 111 is installed with an arm length L2 of 0.42 mm and an angle α2 = 35.3 ° with respect to the horizontal direction, and The X-direction distance d between the central axis of the vertical probe portion 111 and the central axis of the support portion 44 is, for example, 0.4 mm. Next, as shown in FIG. 3B, when the pad 11 is lowered or the support portion 44 is raised for inspection, the tip 113 of the vertical probe portion 111 and the surface of the pad 11 come into contact with each other, and the −Z direction. As a result, the bending portion 41 is spring-deformed, a bending moment M1 is generated in the first arm portion 43, and rotation is generated in the left direction. On the other hand, the bending moment M2 in the reverse direction is generated in the second arm portion 42, and the right arm rotates. At this time, the rotation

The X-direction displacement of the tip of 111 can be brought close to zero. With this operating principle, it is possible to accurately contact a pad with a small pitch and a small area.

法は、図３の例示に限定するものではなく、各パラメータ、すなわち、バネ構造部梁幅ｗ、第１及び第２のアーム長Ｌ１及びＬ２、水平方向に対する角度α１及びα２、湾曲部の曲率半径Ｒｐ、垂直プローブ部１１１の中心軸と支持部４４の中心軸とのＸ方向距離ｄ等を有限要素法等によりあらかじめ選択することが可能である。

The method is not limited to the example shown in FIG. 3, and each parameter, that is, the spring structure beam width w, the first and second arm lengths L1 and L2, the angles α1 and α2 with respect to the horizontal direction, and the curvature of the curved portion. The radius Rp, the distance d in the X direction between the central axis of the vertical probe portion 111 and the central axis of the support portion 44 can be selected in advance by the finite element method or the like.

傾斜梁１４０の水平方向に対する傾きを予め反時計方向にθ１を有する位置としたものである。同様に傾斜梁１４０を長さＬ３のカンチレバーと看做すと計算上約（１／３）×Ｌ３の位置を中心として回転し、

このように初期角度θ１の設定により、前記傾斜梁１４０の先端部のＸ方向移動量を決定することができる。Next, a vertical probe operation when an inclined beam is connected to the vertical probe portion having the above-described operation will be described with reference to FIG. 4 (a) and 4 (b) show that when the inclined beam 140 (including the insulating dummy portions 141 and 142) alone is loaded with a load f in the -Z direction at multiple ends with the connection portion 143 with the main body portion 150 as a fulcrum. FIG. 4A shows the initial position where the inclination of the inclined beam 140 with respect to the horizontal direction is approximately 0 °. If the inclined beam 140 is regarded as a cantilever having a length L3, it is calculated to rotate around a position of about (1/3) × L3, and accordingly, the inclined beam 140

The inclination of the inclined beam 140 with respect to the horizontal direction is previously set to a position having θ1 in the counterclockwise direction. Similarly, if the inclined beam 140 is regarded as a cantilever having a length L3, the rotation is about the position of about (1/3) × L3 in calculation,

Thus, by setting the initial angle θ1, the amount of movement in the X direction of the tip of the inclined beam 140 can be determined.

FIG. 4C is a diagram illustrating an operation of the vertical probe unit 111 when the inclined beam 140 is connected to the vertical probe unit 111. As shown in FIG. 4C, the tip 113 of the vertical probe 111 contacts the pad 11 to cause spring deformation, and as the vertical probe 111 moves relatively in the −Z direction, The inclined beam 140 (including the insulating dummy portions 141 and 142) rotates in the clockwise direction with the connection portion 143 with the main body portion 150 as a fulcrum. At this time, since the inclined beam 140 has an angle θ1 in advance, the vertical probe is moved along with the rotational movement.

  In the above embodiment, the operation in the spring structure portion is designed in advance so that the vertical probe portion 111 does not cause an operation in the X direction, and the amount of movement in the X direction is determined by the angle θ1 of the inclined beam 140. However, the present invention is not limited to this embodiment, and the amount of movement of the vertical probe unit 111 in the X direction is made as close to zero as possible by canceling out the operation of the spring structure 112 and the rotation of the inclined beam 140. It is also possible.

  According to the embodiment described above, it is possible to realize a probe structure capable of finely controlling the amount of movement of the vertical probe unit 111 in the X direction, that is, the amount of scrub. For this reason, even when the vertical probe portion 111 is designed to have a relatively long beam length, the operation of the probe tip portion can be controlled with high accuracy according to the present invention.

(Second Embodiment)
Next, a second embodiment of the probe structure according to the present invention will be described with reference to FIG. In the second embodiment, in addition to the first embodiment described with reference to FIGS. 2 to 4, a plurality of vertical probe portions are connected by horizontal beams. The configuration and operation will be described below.

  In FIG. 5, the inclined beam 160 having an angle θ2 with respect to the horizontal direction, with one side being a substantially central portion of the vertical probe portion 111 and a portion (conductor dummy portion 151 in this embodiment) of the main body portion being the other end. Is provided. Further, the copper alloy foil between the inclined beam 160 and the vertical probe part 111 or between the inclined beam 160 and the main body part 150 is excluded in advance, and the insulation has a thickness approximately equal to the copper alloy foil. By providing insulating dummy portions 161 and 162 by filling and curing a resin material, electrical insulation can be achieved while maintaining mechanical strength between the inclined beam 160 and the vertical probe portion 111 or the main body portion 150. Secure.

  On the other hand, between the vertical probe part 111 in the first probe part 110 and the approximate center part of the vertical probe part 121 in the second probe part 120, and in the vertical probe part 121 and the third probe part 130, the vertical probe part. A horizontal beam 170 and 180 are connected to a substantially central portion of 131. The copper alloy foil between the horizontal beam 170 and the vertical probe portions 111 and 121 and between the horizontal beam 180 and the vertical probe portions 121 and 131 is excluded in advance, and the thickness is approximately equal to the copper alloy foil. Insulating dummy parts 171, 172, 181 and 182 are provided by filling and curing the insulating resin material having mechanical strength between the horizontal beams 170 and 180 and the vertical probe parts 111, 121 and 131. Ensure electrical insulation while holding.

ローブ部１１１に生じた＋Ｘ方向の移動は、前記水平梁１７０により前記垂直プローブ１２１に伝達され、前記垂直プローブ先端部１２３

より前記垂直プローブ１３１にも伝達され、前記垂直プローブ先端部

The vertical probe operation in the above configuration will be described with reference to FIG. As shown in FIG. 6, the tips 112, 122, 132 of the vertical probe portions 111, 121, 131 come into contact with the pads to cause spring deformation, and the vertical probe portions 111, 121, 131 are relatively -Z. As it moves in the direction, the inclined beam 160 rotates in the clockwise direction with the connection part 163 with the main body part 150 as a fulcrum. At this time, since the inclined beam 160 has an angle θ2 in advance, the connection with the vertical probe is pushed in the + X direction with the rotational movement.

The movement in the + X direction generated in the lobe portion 111 is transmitted to the vertical probe 121 by the horizontal beam 170, and the vertical probe tip portion 123 is transmitted.

Transmitted to the vertical probe 131, and the vertical probe tip.

  With the configuration of the embodiment described above, when a plurality of probes are provided on the same resin film, the amount of movement in the X direction of the vertical probe tip, that is, the scrub amount can be finely controlled with respect to all probes. A probe structure can be realized.

(Third embodiment)
Next, a third embodiment of the probe structure according to the present invention will be described with reference to FIG. In FIG. 7, reference numeral 200 denotes a probe structure that forms a basic element of the probe assembly 5. The first probe unit 210 includes a vertical probe unit 211 and a spring structure unit 212, a vertical probe unit 221, and a spring structure unit. The second probe unit 220 configured by 222, and the third probe unit 230 configured by the vertical probe unit 231 and the spring structure unit 232 are disposed on the resin film 50. In this embodiment, the spring structures 212, 222, and 232 are substantially horizontal beams, that is, they form a cantilever structure. The tip portions 213, 223, and 233 of the vertical probe portions 211, 221, and 231 are finely processed to come into contact with the pads of the LSI to be inspected. Further, the other end of the vertical probe portion 211 is connected to a connection terminal 215 connected to the pad 31 of the wiring board 3 through the conductive portion 214. Similarly, the other end of the vertical probe portion 221 is connected to the connection terminal 225 through the conductive portion 224, and the other end of the vertical probe portion 231 is connected to the connection terminal 235 through the conductive portion 234. Only the distal end portions of the vertical probe portions 211, 221, and 231 and the distal end portions of the connection terminals 215, 225, and 235 protrude slightly from the resin film 50.

  On the other hand, conductor dummy portions 251 to 254 that are electrically separated from the probe portions 210, 220, 230, the conductive portions 214, 224, 234 and the connection terminals 215, 225, 235 are installed on the resin film 50. Thus, the mechanical strength of the probe structure 200 is maintained. The probe parts 210, 220, 230, the conductive parts 214, 224, 234, the connection terminals 215, 225, 235, and the conductor dummy parts 251 to 254 are copper alloy foil (for example, BeCu foil) bonded on the resin film 50. 60 are simultaneously formed by fine processing by laser processing or etching. Further, an insulating resin (for example, polyimide resin) is filled between the conductive portions 214, 224, and 234 and the conductor dummy portions 251 to 254 at approximately the same thickness as the copper alloy foil 60, and is thermally cured. Accordingly, it is possible to provide the insulating dummy portions 255 to 258, and thereby to maintain the strength while maintaining the electrical insulation between the conductive portion and the conductor dummy portion. In the above configuration, a portion that does not cause deformation other than the probe portions 211, 221, and 231 that cause a probe operation by the spring structure is referred to as a main body portion 250.

  The example of FIG. 7 shows a probe structure 200 in which a plurality of probes (three in this embodiment) that are in contact with a plurality of pads on one straight line of the chip 1 are formed on the same resin film. In FIG. 7, two parallel horizontal beams 261 and 262 are provided with a substantially central portion of the vertical probe portion 211 as one end and a part of the main body portion (conductor dummy portion 251 in this embodiment) as the other end. Further, the copper alloy foil between the horizontal beams 261 and 262 and the vertical probe portion 211 or between the horizontal beams 261 and 262 and the main body portion 250 is excluded in advance, and the thickness is approximately equal to the copper alloy foil. An insulating resin material having a thickness is filled and cured to provide insulating dummy portions 263 to 266, thereby maintaining the mechanical strength between the horizontal beams 261 and 262 and the vertical probe portion 211 or the main body portion 250. While ensuring electrical insulation.

  On the other hand, between the vertical probe portion 211 in the first probe portion 210 and the approximate center portion of the vertical probe portion 221 in the second probe portion 220 and the vertical probe portion in the vertical probe portion 221 and the third probe portion 230. Similarly, two parallel horizontal beams 271, 272, 281, and 282 are connected between the central portion of H.231. The copper alloy foil between the horizontal beams 271 and 272 and the vertical probe portions 211 and 221 and between the horizontal beams 281 and 282 and the vertical probe portions 221 and 231 is excluded in advance, and the copper alloy foil is roughly Insulating dummy parts 273 to 276 and 283 to 286 are provided by filling and curing an insulating resin material having an equal thickness, thereby providing the horizontal beams 271, 272 and 281, 282 and the vertical probe parts 211, 221, 231. Electrical insulation is ensured while maintaining the mechanical strength between the two.

る。The vertical probe operation in the above configuration will be described with reference to FIGS. FIG. 8A illustrates the operation of the probe unit 210 as a cantilever structure. In FIG. 8A, the vertical probe portion 211 attached to the distal end portion of the spring structure portion 212 having a length L3 is perpendicularly opposed to the upper surface of a pad portion such as a semiconductor chip and the other end. Is attached to a support portion 45 corresponding to the boundary portion of the conductor portion 214 and is in a substantially horizontal state. Next, when the pad portion 11 is lowered or the support portion 45 is raised for inspection, the tip 213 of the vertical probe portion 211 and the surface of the pad portion 11 come into contact with each other, and a load f is applied in the −Z direction. As a cantilever of L4, it rotates about the position of about (1/3) × L4 in calculation, and the tip portion 2 of the vertical probe portion 211 is rotated accordingly.

The

（ｂ）は、前記水平梁２６１、２６２が初期位置として水平であるときを示し、荷重ｆの負荷により、垂直プローブ部２１１のＸ方向移動

６１、２６２が予め水平方向に対し、反時計方向にθ３の角度を有した状態を初期位置としたもので、荷重ｆの負荷により、垂直プローブ

期角度θ３の設定により、前記水平梁２６１、２６２によるリンク構造における垂直プローブ部２１１のＸ方向移動量を決定することができる。On the other hand, as shown in FIGS. 8B and 8C, a link structure is configured by a part of the vertical probe portion 211, the two parallel horizontal beams 261 and 262, and the support portion 46 in the main body portion 250. According to this link structure, even if a contact load f in the same vertical direction as that in FIG. 8A is applied to the vertical probe portion 211, the link probe structure 211

(B) shows when the horizontal beams 261 and 262 are horizontal as an initial position, and the vertical probe unit 211 is moved in the X direction by the load f.

61 and 262 are in the initial position in the state of having an angle of θ3 counterclockwise with respect to the horizontal direction.

The amount of movement in the X direction of the vertical probe portion 211 in the link structure using the horizontal beams 261 and 262 can be determined by setting the initial angle θ3.

に生じた変位量は、前記水平梁２７１、２７２により前記垂直プロー

３の距離を微小移動する。同様に、前記水平梁２８１、２８２により前記垂直プローブ部２３１にも伝達され、前記垂直プローブ部２３１

直プローブの変位量は、プローブ部２１０、２２０、２３０及び水平梁２６１、２６２、２７１、２７２、２８１、２８２の各梁長、梁幅、又は初期角度をパラメータとすることにより選択可能である。The spring structure according to this embodiment can be regarded as a composite of the operations described in FIGS. 8 (a), (b), and (c). As shown in FIG. 9, the tip portions 213, 223, 233 of the vertical probe portions 211, 221, 231 come into contact with the pad 11 to cause spring deformation, and the vertical probe portions 211, 221, 231 are relatively − Along with the movement in the Z direction, the amount of displacement of the tip portion 213 of the vertical probe 211 is caused by the rotation operation associated with the cantilever operation using the spring structure portion 212 as a horizontal beam and the two parallel horizontal beams 261 and 262. + X direction as a combined displacement with parallel spring action

The amount of displacement generated in the vertical probe is caused by the horizontal beams 271 and 272.

3 is moved minutely. Similarly, the vertical probe unit 231 is also transmitted to the vertical probe unit 231 by the horizontal beams 281 and 282.

The displacement amount of the straight probe can be selected by using the beam lengths, beam widths, or initial angles of the probe units 210, 220, 230 and the horizontal beams 261, 262, 271, 272, 281, 282 as parameters.

り、前記バネ構造部２１２による応力の影響を小さくできる。したがって、前記垂直プローブ部２１１の変形が小さくなり、水平方向の移動がより正確に実施することが可能となる。Further, in order to more accurately perform the movement of the vertical probe portions 211, 221, and 231 in the X direction, the vertical probe portion 211 and the spring structure portion 212, the vertical probe portion 221 and the spring structure portion 222, the vertical Minute spring structure portions 216, 226, and 236 are provided between the probe portion 231 and the spring structure portion 232. FIG. 10 illustrates the operation of the micro spring structure. The micro spring portion 216 has a spring structure having a relatively large spring constant in the Z direction and a relatively small spring constant in the X direction. For this reason, since the force is transmitted from the spring structure 212 to the vertical probe 211, the spring structure 212 has a spring function as a cantilever. On the other hand, the vertical probe portion 211 moves in the −Z direction according to the load f. However, since the X-direction spring constant of the minute spring structure portion 216 is relatively small, the vertical probe portion 211 of the spring structure portion 212. The end face near the connection part is the vertical probe

Thus, the influence of stress by the spring structure 212 can be reduced. Therefore, the deformation of the vertical probe unit 211 is reduced, and the horizontal movement can be performed more accurately.

  With the configuration of the embodiment described above, when a plurality of probes are provided on the same resin film, the X-direction position and the amount of movement (that is, the scrub amount) of the tip of the vertical probe portion are finely controlled for all probes. A possible probe structure can be realized. Moreover, by making the spring structure part a cantilever structure, the X-direction pitch of the vertical probe tip part can be set smaller.

(Fourth embodiment)
Next, a fourth embodiment of the probe structure according to the present invention will be described with reference to FIGS. FIG. 11 is a perspective view of a basic structure of a probe assembly and a probe card (representing a configuration including the wiring board) according to the fourth embodiment of the present invention as seen from the front side. FIG. 12 is a front view of a basic structure of a probe assembly and a probe card according to the fourth embodiment of the present invention. The configuration of the probe assembly according to the fourth embodiment is basically the same as that of the probe assembly 5 according to the first embodiment shown in FIG. The difference from the probe assembly 5 according to the first embodiment is that the elastic deformation portion (spring structure portion) of the probe portion has an inclined linear beam structure, and the wiring board is located on the side of the probe assembly. Assembling a plurality of probe structures, which are arranged at positions (left and right positions), the wiring board connection terminals on the probe side extend substantially outward in the horizontal direction (arranged at a substantially right angle to the vertical probe) The support rod for constituting the probe assembly is attached.

  That is, in FIG. 11, reference numeral 300 denotes one of the probe structures constituting the basic element of the probe assembly 301. The probe structure 300 has a plate-like structure as a whole with the resin film 302 as a base material, and the first probe section 310, the second probe section 320, and other plural structures having the same structure on the surface thereof. .. (In this embodiment, a total of seven probe parts) are arranged. The first probe section 310 includes a vertical probe section 311 extending in the vertical direction, a spring structure section 312 extending from the base end section of the vertical probe section 311 so as to be inclined downward and outward from the plate surface, and a distal end of the spring structure section 312. A conductive portion 314 that extends downward in the vertical direction and extends in the substantially horizontal direction toward the outside of the plate surface of the probe structure 300, and a connection terminal 315 that is provided at the tip of the conductive portion 314 and extends in the substantially horizontal direction. Composed. The second probe unit 320 has a structure similar to that of the first probe unit 310, and is inclined vertically downward from the base end portion of the vertical probe unit 321 and the vertical probe unit 321 to the plate surface. A spring structure portion 322 that extends, a conductive portion 324 that extends vertically downward from the end of the spring structure portion 322, and that extends in a substantially horizontal direction toward the outside of the plate surface of the probe structure 300, and a tip of the conductive portion 324 The connection terminal 325 is provided and extends substantially in the horizontal direction.

  When viewed from the whole probe structure 300, the vertical probe portion 321 of the second probe portion 320 is disposed closer to the center side than the vertical probe portion 311 of the first probe portion 310, so that the spring of the second probe portion 320 is arranged. The structure portion 322 is disposed below the spring structure portion 312 of the first probe portion 310. In addition, the vertically extending portion of the conductive portion 324 of the second probe portion 320 is disposed closer to the center side than the vertically extending portion of the conductive portion 314 of the first probe portion 310, and the first probe The horizontal extension of the conductive portion 324 of the second probe unit 320 is formed to extend to a lower level than the vertical extension of the conductive unit 314 of the portion 310, and the conductive portion 314 of the first probe unit 310 has a horizontal extension. The connection terminal 325 of the 2nd probe part 320 is arrange | positioned below the connection terminal 315 of the 1st probe part 310 by this below the horizontal direction extension part. By forming the two probe parts 310 and 320 into the above-described arrangement relationship, a plurality of probe parts are arranged on the same surface without structural and electrical interference.

  The probe units 330 and 340 also have the same configuration as the probe units 310 and 320. The probe unit 330 includes a vertical probe unit 331, a spring structure unit 332, a conductive unit 316, and a connection terminal 317, while the probe unit 340 includes , A vertical probe portion 341, a spring structure portion 342, a conductive portion 326, and a connection terminal 327. The arrangement relationship between the probe 330 and the probe unit 340 is set in the same manner as the arrangement relationship between the probe 310 and the probe unit 320. Thereby, about one probe structure 300, a plurality of connecting terminals are roughly on the same plane as seen between connecting terminals 315, 325,... And connecting terminals 317, 327,. It is the structure arrange | positioned equally right and left. The probe assembly 301 is formed by stacking a plurality of probe structures 300 having the above-described configuration in a stacked manner in the front-rear direction, that is, the Y direction of the XY orthogonal coordinate system with a predetermined gap.

  On both the left and right sides of the probe assembly 301, a plurality of wiring boards are arranged in a stacked manner in the vertical direction with a predetermined gap, that is, in the Z direction of the XY orthogonal coordinate system. In FIG. 11, wiring boards 360, 370,... (Four wiring boards in this embodiment) are arranged on the left side of the probe assembly 301, while wiring boards 380,. 390... (Four wiring boards in this embodiment) are arranged. In this embodiment, a flexible flat cable is used for the wiring boards 360, 370, 380, 390,..., And conductive wiring patterns 304 and 306 are formed on one or both sides of the front and back. Connection lands, that is, pads 305 and 307 are formed at the tips of these wiring patterns 304 and 306. More specifically, a wiring pattern 304 is formed on the upper surface (front surface) of the wiring substrates 360, 370, 380, 390,..., And a pad 305 that is a connection land is formed at the tip of the wiring pattern 304. Is formed. Further, a wiring pattern 306 is formed on the lower surface (back surface) of the wiring boards 360, 370, 380, 390,..., And a pad 307 serving as a connection land is formed at the tip of the wiring pattern 306. For the wiring boards 360, 370, 380, 390,..., For example, a plastic board board other than the flexible flat cable may be used. A spacer 348 is provided between the adjacent wiring boards 360, 370, 380, 390,... For keeping the distance between the boards constant.

  A support bar 303 is attached to a substantially central portion of the front surface of the probe assembly 301 so as to penetrate through the plurality of probe structures 300 stacked in a stacked manner. The support bar 303 is for defining the arrangement relationship of the plurality of probe structures 300.

  The tip portions 313 and 323 of the vertical probe portions 311 and 321 are finely processed to come into contact with the pads 351 of the LSI chip 350 to be inspected. Further, regarding the probe portion 310, the conductive portion 314 extends from the other end of the spring structure portion 312 to reach the connection terminal 315 connected to the pad 305 of the wiring board 360. Similarly, regarding the probe part 320, the conductive part 324 extends from the other end of the vertical probe part 321 to reach a connection terminal 325 connected to the pad 305 of the wiring board 370. The same applies to the other probe units 330 and 340. Only the distal end portions of the vertical probe portions 311 and 321 and the distal end portions of the connection terminals 315 and 325 slightly protrude outside the side portions of the resin film 302. In the fourth embodiment, the tip portions of the vertical probe portions 311 and 321 protrude upward, while the tip portions of the connection terminals 315 and 325 protrude leftward from the side portions of the resin film 302. Further, the tip ends of the connection terminals 316 and 326 of the probe portions 330 and 340 connected to the pads 305 of the wiring boards 380 and 390 protrude from the side portions of the resin film 302 to the right. Therefore, in the fourth embodiment, a configuration is realized in which the wiring board connection terminal on the probe side extends substantially outward in the horizontal direction (arranged so as to extend substantially perpendicular to the vertical probe portions 311 and 321). Has been. Further, the tip ends of the connection terminals 315 and 325 are formed so as to be elastically deformable, and come into contact with the pads 305 of the wiring boards 380 and 390 by elastic force.

On the other hand, on the resin film 302, the conductors electrically separated from the probe parts 310, 320,..., The conductive parts 314, 324,. Dummy portions 352 and 353 and insulating dummy portions 354 and 355 are installed to maintain the mechanical strength of the probe structure 300. The probe parts 310, 320, ..., the conductive parts 314, 324, ..., the connection terminals 315, 325, ..., the conductor dummy parts 352, 353, and the insulating dummy parts 354, 355 are resin films. Probe portions 310 and 320 are obtained by finely processing a metal foil, such as a copper alloy foil (for example, BeCu foil) 60, which is provided on the surface 302 by a method such as adhesion or vapor deposition, by laser processing or etching. ,... Further, between the conductive portions 314, 324,... And the insulating dummy portions 354, 355, an insulating resin (for example, polyimide resin) is filled with approximately the same thickness as the copper alloy foil, and thermosetting is performed. In this way, the insulating dummy portions 354 and 355 are provided, which makes it possible to maintain mechanical strength while maintaining electrical insulation between the conductive portion and the conductor dummy portion.
In the above configuration, the main body portion 358 that does not cause deformation other than the probe portions 310, 320,... In addition, as said metal foil, copper (not alloy) foil, aluminum foil, gold foil, silver foil, etc. can be used.

  Further, in the fourth embodiment, a plurality of vertical probe portions 311, 321,... Are connected by horizontal beams 345, 349,. That is, in FIG. 11 and FIG. 12, the horizontal central portion of the vertical probe portion 311 is one end, and a part (conductor dummy portion 352 in this embodiment) of the main body portion 358 is the other end. A beam 345 is provided. The beam 345 may be an inclined beam having an angle θ2 (which is a very small angle). Further, the copper alloy foil between the horizontal beam 345 and the vertical probe portion 311 or between the horizontal beam 345 and the main body portion 358 is excluded in advance, and the insulation has a thickness substantially equal to the copper alloy foil. By providing the insulating dummy portions 346 and 347 by filling and curing the resin material, electrical insulation is maintained while maintaining the mechanical strength between the horizontal beam 345 and the vertical probe portion 311 or the main body portion 358. Secure. The function of the horizontal beam 345 is the same as that of the inclined beam described in the second embodiment.

  Next, the operation of the fourth embodiment will be described. 11 and FIG. 12, one connection terminal (for example, 315) of the probe portions 310, 320,... Located on the left side of the probe structure 300 is provided on the upper surface of the corresponding uppermost wiring board 360. The connection land or pad 305 installed is connected, and the other connection terminals (for example, 325) are connected to the connection land or pad 305 installed on the upper surface of the corresponding second-stage wiring board 370. Similarly, the other connection terminals (third and fourth stages) are also connected to connection lands or pads 305 installed on the upper surfaces of the corresponding wiring boards (third and fourth stages), respectively. As described above, all the connection terminals 315, 325,... Are connected to connection lands, that is, pads 305 installed on the upper surfaces of the corresponding wiring boards 360, 370,. On the other hand, when viewing the connection terminals 317, 327,... Of the probe units 330, 340,... Located on the right side of the probe structure 300, one connection terminal (for example, 317) is the uppermost corresponding one. The connection lands or pads 307 installed on the lower surface of the wiring board 380 are connected, and the other connection terminals (for example, 327) are connected to the connection lands or pads 307 installed on the lower surface of the corresponding second-stage wiring board 390. Connected. Similarly, the other connection terminals (third and fourth stages) are also connected to connection lands or pads 307 installed on the lower surfaces of the corresponding wiring boards (third and fourth stages). As described above, all the connection terminals 317, 327,... Are connected to connection lands, that is, pads 307 installed on the lower surfaces of the corresponding wiring boards 380, 390,. As described above, various signals can be output to the wiring boards 360, 370, 380, 390,... By changing the contact surfaces of the connection terminals 315, 325, 317, 327,.

  FIG. 13 is a diagram showing an example different from the signal output method described above. In this case, one connection terminal (for example, 315) of the first probe assembly is connected to a corresponding connection land or pad 305 installed on the upper surface of the wiring board 360 corresponding thereto, and the first probe assembly is connected to the first probe assembly. One connection terminal (for example, 328) of the adjacent second probe assembly is connected to a connection land or pad 307 installed on the lower surface of the same wiring board 360. In this case, the first probe assembly is, for example, a probe assembly provided in the probe structure 300, and the second probe assembly is another probe structure located next to the probe structure 300. The probe assembly provided in (for example, indicated by reference numeral 300a in FIG. 11). The connection terminals 315 and 328 are formed in a twist structure, and a dimension between a twist portion (projecting downward) of the connection terminal 315 and a twist portion (protruding upward) of the connection terminal 328. H is set somewhat smaller than the thickness dimension D of the wiring board 360. Therefore, when the wiring board 360 is moved in the direction indicated by the arrow S from the state shown in FIG. 13A, the connection terminals 315 and 328 are deformed (elastically deformed) as shown in FIG. 13B. The wiring board 360 is received and connected to the pads 305 and 307 and bonded and held by the elastic force acting in the vertical direction (Z direction). The connection terminals 315 and 328 and the wiring board 360 are configured and set so as not to be constrained in the plane direction (XY direction). For this reason, the connection between the wiring board and the terminal is simplified.

  FIG. 14 is a partial plan view showing a connection mode between another connection terminal and a wiring board. In this example, the connection terminal 318 extends from the first probe assembly provided in the probe structure 300, and the connection terminal 319 extends from the second probe assembly provided in the probe structure 300a. Yes. The tips of the connection terminals 318 and 319 are formed in a rod shape, and a coupling recess 329 is formed as a connection land on the wiring board 360 side. Then, the rod-shaped tips of the connection terminals 318 and 319 are fitted into and coupled to the coupling recess 329 of the wiring board 360 to realize electrical connection. In addition, this coupling | bond part may be made detachable or may be fixedly coupled by soldering or the like.

  The probe structure of the present invention enables more accurate control of the probe tip position and tip movement in the X direction, so that in the future, logic LSIs, LCD driver LSIs, and the like that will be increasingly multi-pin and narrow pitched. The present invention provides a probe card that can realize a reliable probe contact in a probe assembly corresponding to the inspection of a rectangular array pad or a complicated peripheral array pad, and can greatly contribute to the development of the semiconductor industry.

  Further, since the probe card of the present invention mainly has means for arranging the terminals in a direction substantially perpendicular to the vertical probe, it is possible to reduce variation in pattern length, thereby The area required for the connection can be reduced, and a delay or the like in the high-frequency signal is less likely to occur. Therefore, there is an advantage that the probe card has high density and excellent high-frequency characteristics.

DESCRIPTION OF SYMBOLS 1 Chip 3 Wiring board 5 Probe assembly 11 Pad 20 Probe guide board 21 Probe guide hole 31 Pad 41 Curved part 42 2nd arm part 43 1st arm part 44 Support part 50 Resin film 60 Copper alloy foil 100, 101- 100 + n, 200 Probe structure 110, 120, 130, 210, 220, 230 Probe part 111, 121, 131, 211, 221, 231 Vertical probe part 112, 122, 132, 212, 222, 232 Spring structure part 113, 123 133, 213, 223, 233 Probe tip 114, 124, 134, 214, 224, 234 Conductive part 115, 125, 135, 215, 225, 235 Connection terminal 216, 226, 236 Micro spring structure 140, 160 Inclined Beams 141, 142, 61,162 Insulation dummy part 143,163 Connection part 150,250 Body part 151-154,251-254 Conductor dummy part 155-158,255-258 Insulation dummy part 170,180 Horizontal beam 261,262,271,272,281 , 282 Horizontal beam 171,172,181,182 Insulating dummy part 263-266, 273-276, 283-286 Insulating dummy part

Claims (18)

Fine processing the metal foil using a resin film to which a metal foil is bonded, a probe part including a spring structure part on the resin film and a vertical probe part extending vertically from one end of the spring structure part, and In a probe structure formed by a conductive part connected to the other end of the spring structure part and a main body part including a conductor dummy part or an insulating dummy part electrically insulated from the conductive part,
A probe having an inclined beam having an arbitrary angle with respect to a horizontal direction, with a substantially central portion of the vertical probe portion as one end and a part of the main body portion as the other end.   At least one location between the inclined rod and the vertical probe portion or between the inclined beam and the main body portion is connected via an insulator having substantially the same thickness as the metal foil. The probe according to claim 1. Two or more sets of the probe part and the conductive part are arranged on one resin film,
One or more inclined beams having an arbitrary angle with respect to the horizontal direction, with the substantially central portion of the first vertical probe portion as one end and a part of the main body portion as the other end, and the nth 2. The probe according to claim 1, wherein one or a plurality of horizontal beams are connected between the vertical probe portion and the substantially central portion of the (n + 1) th vertical probe portion.   At least one location between the inclined beam and the first vertical probe portion or between the inclined beam and the main body portion is connected via an insulator having substantially the same thickness as the metal foil. The probe according to claim 3, wherein   A part or all of the horizontal beam connecting between the nth vertical probe portion and the (n + 1) th vertical probe is an insulator having substantially the same thickness as the metal foil. The probe according to claim 3 or 4.   The probe according to claim 1 or 3, wherein the spring structure portion is a substantially horizontal beam and forms a cantilever structure with the vertical probe portion.   The micro-spring structure portion having a spring structure having a relatively large spring constant in the Z direction and a relatively small spring constant in the X direction is provided between the vertical probe portion and the spring structure portion. 6. The probe according to 6.   The probe according to claim 1 or 3, wherein an angle of the inclined beam with respect to a horizontal direction is approximately 0 degrees.   The probe according to claim 1 or 3, wherein a width of the inclined beam or the horizontal beam changes continuously or discontinuously in a longitudinal direction. A probe assembly in which a plurality of probe assemblies in which a plurality of probes including a pattern connecting a vertical probe, a wiring board, and a pattern connecting the vertical probe and the terminal are arranged on the same plane are regularly arranged; It consists of a wiring board composed of multiple layers,
In the probe card for connecting the terminal and a connection land formed at one end of the wiring board and conducting the probe and the wiring board,
The probe card, wherein the terminals are arranged in a direction substantially perpendicular to the vertical probe. The probe card according to claim 10, wherein the plurality of terminals are arranged substantially horizontally on the same plane. The probe card according to claim 10, wherein the wiring board is a double-sided flexible flat cable. One of the terminals is connected to a connection land installed on the upper surface of the double-sided flexible flat cable, and the other terminal is connected to a connection land installed on the lower surface of the double-sided flexible flat cable. The probe card according to 10 or 11. One terminal of the first probe assembly is connected to a connection land provided on the upper surface or the lower surface of the double-sided flexible flat cable, and the other terminal of the double-sided flexible flat cable having the same terminal of the second probe assembly is the same. The probe card according to claim 10, wherein the probe card is connected to a connection land installed on the surface. The probe card according to claim 10, wherein the terminal generates a spring force in the Z direction, contacts the connection land with a repulsive force of a spring, and is not constrained in a plane direction (XY direction). The probe constituting the probe assembly is formed by using a resin film to which a copper alloy foil is bonded and finely processing the copper alloy foil to form a conductive portion including a probe and a terminal portion on the resin film. The probe card according to claim 10. (Conductor dummy part)
A conductor dummy portion that is electrically insulated from the probe is installed in the same plane as the probe, and at least between the probe and the conductor dummy portion, a height that is substantially the same as that of the probe or the conductor dummy portion. The probe card according to claim 10, further comprising an insulating dummy portion filled therein. The probe card according to claim 17, wherein an insulating resin is coated on surfaces of the probe and the conductor dummy portion.

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