JP2014036197A - Seal structure for through hole and wiring body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a seal structure for a through hole in which a side edge portion of a wiring member is surely filled with an adhesive to prevent the generation of a void and a required waterproof performance can be ensured and which can be formed at low cost.SOLUTION: A seal structure for a through hole 43 into which a wiring member is inserted comprises: a cover member 11 which covers the through hole and holds the wiring member between a casing and the cover member; a first adhesive layer 13a provided closer to the casing so as to surround the through hole; a second adhesive layer 13b provided in the cover member so as to oppose the first adhesive layer; and a wiring member 21 of which the side part in at least a portion held between the casing and the cover member is formed stepwise. The periphery of the wiring member is sealed through the first adhesive layer and the second adhesive layer and the cover member is adhered to the casing.

Description

  The present invention relates to a seal structure for a through hole. Specifically, the present invention relates to a seal structure of a through hole that is provided in a casing of an electronic device and into which a wiring member is inserted.

  In order to seal a through-hole through which a wiring member is inserted in a casing of an electronic device such as a portable terminal with waterproofness, an FPC integrated gasket as described in Patent Document 1 is known. However, the FPC-integrated gasket is difficult to be disposed in a small gap such as a slide portion in a slide-type portable terminal or the like because the height of the entire gasket is increased. Further, the gasket is molded by a mold, and there is a problem that versatility is low and manufacturing cost is increased.

  In order to eliminate the inconvenience, as described in Patent Document 2, a lid member provided so as to cover the through-hole, and surrounding the through-hole in an annular shape, the lid member, the wiring member, and the housing There has been proposed a seal structure that includes an adhesive layer that adheres to each other.

Registered Utility Model No. 3127071 JP 2010-62285 A

  In the seal structure described in Patent Document 2, a flat wiring member is sandwiched between a housing outer surface around the through hole and a lid member provided so as to cover the through hole, Sealing is performed so that the periphery is surrounded by an adhesive layer that adheres the outer surface of the housing and the lid member.

  The adhesive layer for sealing the wiring member is composed of a first adhesive layer provided on the housing side and a second adhesive layer provided on the lid member, and these adhesive layers are composed of the wiring member. The seal structure is formed by closely adhering them to each other.

  However, since the side edge portion of the wiring member has a required thickness, an adhesive is applied to the side edge portion of the wiring member when the first adhesive layer and the second adhesive layer are joined. It is difficult to fill, and voids along the side edge are likely to occur. If the gap is present, moisture easily enters the inside of the housing through the gap, and sufficient waterproofness cannot be ensured.

  The invention of the present application solves the above-described conventional problems, and since the side edge portion of the wiring member can be reliably filled with an adhesive, there is no gap and a through-hole seal structure that can ensure the required waterproof performance. The issue is to provide.

  The invention of the present application is a seal structure of a through hole that is provided in a housing of an electronic device and through which a wiring member is inserted, and covers the through hole and surrounds the through hole with a lid member that sandwiches the wiring member A first adhesive layer provided on the housing side; a second adhesive layer provided on the lid member so as to face the first adhesive layer; at least the housing and the lid A wiring member in which a side portion of the portion sandwiched between the members is formed in a stepped shape, and the periphery of the wiring member is interposed through the first adhesive layer and the second adhesive layer. In addition to being sealed, the lid member is configured to be bonded to the casing.

  In this invention, since the side part of the said wiring member is formed in the step shape, the said adhesive agent is pinched | interposed into the said stepped surface by pinching the adhesive layer arrange | positioned on the both sides | surfaces of the said wiring member. By deforming or flowing, the side edge portion of the wiring member can be reliably filled. As a result, no gap is generated along the side edge of the wiring member, and the periphery of the wiring member can be reliably sealed to prevent entry of water or the like from the through hole. The form of the wiring member is not limited. For example, a flat wiring member can be employed.

  The stepped portion can be provided over the entire length of the wiring member, but it is sufficient that the stepped portion is provided at least in a portion sandwiched between the casing and the lid member.

  Further, the stepped form is not particularly limited. For example, a stepped shape with one step can be adopted, and a stepped shape with two or more steps can also be adopted. Further, the width of the step portion is not particularly limited.

  In order to reliably fill the adhesive layer without causing a gap in the side portion of the wiring member, the total of the first adhesive layer and the second adhesive layer arranged with the wiring member interposed therebetween. The thickness is preferably set larger than the thickness of the side edge portion of the wiring member.

  Accordingly, the adhesive layer can be deformed or flowed in accordance with the thickness of the side edge portion of the wiring member, and the adhesive can be filled around the wiring member without a gap. Therefore, the periphery including the side edge portion of the wiring member can be reliably sealed.

  The first adhesive layer can be provided on the outer surface of the casing around the through hole to constitute the seal structure according to the present invention. In this case, when the through hole is sealed with the lid member, the adhesive layer is sandwiched between the lid member and the outer surface of the housing, and the adhesive is filled around the wiring member.

  In addition, a frame-shaped member surrounding the through-hole is provided between the first adhesive layer and the housing, and a third adhesive layer for bonding the frame-shaped member around the through-hole is provided. be able to. In this case, the wiring member is sealed between the lid member and the frame-shaped member via the first adhesive layer and the second adhesive layer. By adopting the above configuration, the lid member and the frame-like member are attached in advance to a predetermined position of the wiring member, and when the wiring member is inserted into the through hole, the frame-like member is The frame-shaped member is bonded to the outer surface of the casing around the through hole through a third adhesive layer provided on the surface opposite to the surface on which the first adhesive layer is provided to form a seal structure it can.

  That is, a frame-shaped member that can be adhered to surround the periphery of the through hole, a lid member that is formed so as to cover the frame-shaped member, a first adhesive layer provided on the frame-shaped member, A second adhesive layer provided on the lid member so as to face the first adhesive layer, and the wiring member is formed by the first adhesive layer and the second adhesive layer. While sealing the periphery, the lid member and the frame-shaped member are attached to a predetermined part of the wiring body via the first adhesive layer and the second adhesive layer. Can be configured. If the said structure is employ | adopted, after sealing the said wiring member separately between a cover member and a frame-shaped member, it becomes possible to attach to a housing | casing through a 3rd adhesive bond layer. Thereby, a highly reliable seal structure can be constituted.

  The material which comprises the said 1st adhesive bond layer and the 2nd adhesive bond layer will not be specifically limited if the circumference | surroundings of a wiring member can be sealed. In order to ensure sealing performance, it is preferable to form the first adhesive layer and the second adhesive layer from the same material. For example, the first adhesive layer and the second adhesive layer can be formed from a thermosetting resin. Moreover, a thermosetting resin and a thermoplastic resin can be mixed and a repairable adhesive agent can also be employ | adopted.

  As said thermosetting resin, 1 or 2 or more resin chosen from thermosetting resins, such as an epoxy resin, a phenol resin, an acrylic resin, a urethane resin, an alkyd resin, and an unsaturated polyester resin, is employable. The adhesive layer may be formed by mixing the thermosetting resin with one or more resins selected from thermoplastic resins such as polyvinyl alcohol resin, acrylic resin, phenoxy resin, and urethane resin. it can. When the above resin material is used, a hot press process is applied to apply the required temperature and pressure to deform or flow the adhesive layer and fill the periphery including the side of the wiring member formed in a stepped shape. can do.

  Furthermore, the first adhesive layer and the second adhesive layer can be formed from a waterproof adhesive tape. In this case, the waterproof pressure-sensitive adhesive tape can be deformed or flowed by applying a required pressure to fill the periphery including the side portion of the wiring member formed in the stepped shape.

  The form and material of the wiring member are not particularly limited. For example, an insulating base formed from polyimide resin, a wiring layer laminated on the insulating base and having a wiring pattern formed thereon, and an insulating coating layer laminated so as to cover the wiring layer The printed wiring board provided can be adopted. A wiring member in which an electromagnetic shield layer is laminated on the insulating coating layer can be employed. As the printed wiring board, a rigid printed wiring board or a flexible printed wiring board can be adopted. Moreover, the single-sided printed wiring board in which the said wiring pattern was formed in one side of an insulating base material, and the double-sided printed wiring board in which the said wiring pattern was formed in both surfaces of an insulating base material are employable. Furthermore, it can be applied to a wire harness or the like.

  The method for forming the side portion of the wiring member in a stepped shape is not particularly limited. For example, when a printed wiring board is employed as the wiring member, the stepped side portion can be formed by cutting out the vicinity of the edge of the insulating coating layer covering the wiring layer of the wiring member. Further, the stepped side portion can be formed by cutting out the vicinity of the edge portion of the electromagnetic shield layer laminated on the insulating coating layer.

  Further, the stepped shape can be provided only on one side of the wiring member, or can be provided on both sides of the wiring member. In order to reliably fill the periphery of the wiring member with the adhesive, it is preferable to provide a contrasting stepped shape on both the front and back surfaces of the wiring member.

  Moreover, the stepped shape of a different form can also be formed in the both sides of the said wiring member, and the stepped shape of the same form can also be provided. In order to reliably fill the periphery of the wiring member with the adhesive, it is preferable to set the stepped shape on both sides of the wiring member to be the same. Further, the number of steps to be provided is not particularly limited, and can be set according to the configuration and thickness of the wiring member.

  The materials constituting the lid member and the frame member are not particularly limited. For example, a plate-like or sheet-like lid member and frame-like member formed from glass epoxy resin, epoxy resin, acrylic resin, polyimide resin, polyurethane resin, or the like can be employed.

  In the sealing structure of the through-hole through which the wiring member is inserted, the side edge portion of the wiring member can be reliably filled with the adhesive, so that no gap is generated and high sealing performance can be ensured.

1 is an overall perspective view of a mobile terminal to which a seal structure according to the present invention is applied. It is a figure which shows the cross-section of the slide part of the portable terminal shown in FIG. It is a top view which shows the state which inserted the wiring member in the through-hole shown in FIG. It is a top view which shows the state which adhere | attached the cover member on the through-hole shown in FIG. It is sectional drawing which follows the VV line in FIG. It is sectional drawing which follows the VI-VI line in FIG. It is a figure which shows 2nd Embodiment which concerns on this invention, and is sectional drawing which shows the state just before adhere | attaching the cover member attached to the wiring member and the frame-shaped member to the through-hole of a housing | casing. In FIG. 7, it is sectional drawing which shows the state which adhere | attached the cover member and the frame-shaped member on the housing | casing. It is a principal part expanded sectional view in alignment with the IX-IX line in FIG.

  Embodiments of the present invention will be specifically described below with reference to the drawings. In the following embodiments, the present invention is applied to a seal structure of a slide type mobile phone which is a mobile terminal.

  The portable terminal 1 includes a display unit 3 for displaying various types of information, an input unit 4, and a slide unit 8. The display unit 3 is provided with a display device 6 using a liquid crystal display panel, a speaker, and the like. The input unit 4 is provided with input keys and a microphone. The slide unit 8 is configured by slidingly fitting an outer frame 8a provided on the display unit 3 side and an inner frame 8b provided on the input unit 4 side.

  As shown in FIG. 2, the display unit 3 is provided with a display unit casing 31 and a display unit substrate 35 as main members. The display unit substrate 35 includes a circuit or the like for sending a display signal to the display device 6. The display unit housing 31 includes a first housing 31a and a second housing 31b that are connected to each other. The first casing 31a is formed with a through hole 33 in which a seal structure is formed in the present invention.

  The input unit 4 is provided with an input unit housing 41 and an input key substrate 45 as main members. The input key board 45 includes a circuit for controlling a signal sent from the input key. The input unit housing 41 includes a first housing 41a and a second housing 41b that are connected to each other. And the through-hole 43 in which the seal structure based on this invention is formed is formed in the said 1st housing | casing 41a.

  A wiring member 21 for connecting the input key substrate 45 and the display unit substrate 35 is provided through the slide unit 8. The wiring member 21 in the present embodiment employs a flexible printed wiring board, and harness portions 25 a and 25 b are provided at both ends of the wiring member 21 to constitute the wiring body 20. Each harness part 25a, 25b is connected to each board | substrate 35, 45, and is comprised so that transmission / reception of a signal can be performed.

  Hereinafter, the seal structure 15a provided in the through hole 43 formed in the first housing 41a of the input unit 4 will be described. The seal structure 15b provided in the through hole 33 formed in the first housing 31a of the display unit 3 is configured in the same manner.

  3 to 6 show a seal structure 15a according to the first embodiment of the present invention.

  FIG. 3 is a plan view showing a state where the first adhesive layer 13a is provided on the outer peripheral surface of the through hole 43 and the wiring member 21 is inserted.

  As shown in FIG. 3, in the seal structure 15a according to the first embodiment, the first adhesive layer 13a is provided so as to surround the rectangular through-hole 43 formed in the first housing 41a, and After inserting the wiring member 21 into the through hole 43, as shown in FIGS. 4 and 5, the lid member 11 is provided with the first adhesive layer 13a and the second adhesive layer 13b provided on the lid member 11. It is constituted by adhering so as to close the through-hole 43 through the gap. The wiring member 21 is sealed between the lid member 11 and the outer surface of the first housing 41a so as to be surrounded by the first adhesive layer 13a and the second adhesive layer 13b. . The first adhesive layer 13a and the second adhesive layer 13b according to the present embodiment are formed from a waterproof adhesive tape.

  In the present embodiment, as shown in FIG. 6, both sides of the portion of the wiring member 21 sandwiched between the lid member 11 and the outer surface of the first housing 41a are formed in a stepped shape.

  The wiring member 21 includes an insulating base material 22a, a wiring layer on which a circuit pattern is formed, and an insulating coating layer 22b formed so as to cover the wiring layer. In this embodiment, the double-sided flexible printed wiring board 21 provided with the wiring layer on both sides is employed, and the wiring layer and the insulating coating layer 22b are formed on both sides of the insulating base material 22, respectively. Yes. Since the circuit pattern is not formed in the vicinity of the side portion of the wiring member 21, the wiring layer is omitted in FIG.

  In the present embodiment, both sides of the wiring member 21 are formed by cutting out the vicinity of the edge of the insulating layer 22b with a predetermined width in a portion sandwiched between the first adhesive layer 13a and the second adhesive layer 13b. Is provided with a stepped shape.

  As shown in FIG. 3, a first adhesive layer 13 a surrounding the periphery of the through hole 43 is provided, and the wiring member 21 is extended from the inner side of the through hole 43, and the wiring member 21 and the first The lid member 11 provided with the second adhesive layer 13b is attached and laminated so as to overlap the adhesive layer 13a. In the present embodiment, a waterproof adhesive tape is employed for the adhesive layers 13a and 13b, and the first adhesive layer 13a and the second adhesive layer 13b are secured in order to ensure a sealing property between the first adhesive layer 13a and the second adhesive layer 13b. The adhesive is filled around the wiring member 21 by applying a pressure that allows the adhesive layer 13a and the second adhesive 13b to flow or be deformed.

  In the present embodiment, as shown in FIG. 6, since the side portion of the wiring member 21 is formed in a stepped shape, the thickness of the side edge portion of the wiring member 21 is set smaller than the thickness of the central portion. Can do. The total thickness of the first adhesive layer 13 a and the second adhesive layer 13 b is set larger than the thickness of the side edge portion of the wiring member 21. In this embodiment, since the side edge portion is composed of an insulating base material, the total thickness of the first adhesive layer 13a and the second adhesive layer 13b is the insulating base material. It is set to be larger than the thickness. When the first adhesive layer 13a and the second adhesive layer 13b that are overlapped with each other are sandwiched between the outer surface of the lid member 11 and the housing 43, the adhesive layers 13a and 13b are deformed. Or it can be made to flow and the side part formed in the step shape can be filled reliably. For this reason, the circumference | surroundings of the said wiring member 21 can be sealed reliably.

  Thus, no gap is formed in the vicinity of the bonding surface of the adhesive layers 13a and 13b along the side edge of the wiring member 21, and a reliable seal structure can be configured. In addition, in this embodiment, a reliable seal structure can be configured with the total thickness of the wiring member 21, the lid member 11, and the adhesive layers 13a and 13b. For this reason, even if it is a case where the clearance gap provided with a sealing structure like a slide type form terminal is small, the sealing structure of the through-hole which exhibits a reliable sealing effect can be obtained. Moreover, since the member to be molded is not included, the seal structure can be formed at a low cost.

  7 to 9 show a second embodiment of the present invention.

  The through-hole seal structure 215 according to the second embodiment has a lid member 211 attached in advance to a predetermined part of the wiring member 211, and the lid member 211 and the wiring member 221 are provided in the casing 241. It is configured so that it can be attached to the hole 243.

  As shown in FIG. 7, the seal structure 215 according to the second embodiment is laminated so as to cover the frame-shaped member 250 and the frame-shaped member 250 that can be bonded so as to surround the periphery of the through hole 243. A lid member 211, a first adhesive layer 213a provided on the frame-like member 250, and a second adhesive layer provided on the lid member 211 so as to face the first adhesive layer 213a 213b and a third adhesive layer 260 provided on the surface of the frame member opposite to the side on which the first adhesive layer 213a is provided. The periphery of the wiring member 221 is sealed by the first adhesive layer 213a and the second adhesive layer 213b, and the lid member 211 and the frame-like member 250 are connected to the first adhesive agent. A wiring body 220 attached to a predetermined part of the wiring member 221 is configured through the layer 213a and the second adhesive layer 213b.

  By bonding the frame-like member 250 so as to surround and surround the periphery of the through hole 243 via the third adhesive layer 260, the through hole 243 is formed as shown in FIG. Sealed.

  As shown in FIG. 9, the wiring member 221 according to the second embodiment includes an insulating substrate 222a, a wiring layer on which a circuit pattern is formed, and an insulating coating layer formed so as to cover the wiring layer. 222b and an electromagnetic shield layer 222c formed on the insulating coating layer 222b. Also in the present embodiment, a double-sided flexible printed wiring board in which the wiring layer, the insulating coating layer 222b, and the electromagnetic shield layer 222c are provided on both surfaces is employed as the wiring member 221. Since the circuit pattern is not formed in the vicinity of the side portion of the wiring member 221 as in the first embodiment, the wiring layer is omitted in FIGS.

  By cutting out the vicinity of the side edge portions of the insulating coating layer 222b and the electromagnetic shield layer 222c, a flexible printed wiring board 221 having a stepped side portion is formed.

  When the above configuration is adopted, the wiring member 221 can be securely attached between the lid member 211 and the frame-like member 250 and then attached to the housing 241a, so that a highly reliable seal structure can be configured. .

  In addition, since the lid member 211 and the frame-like member 250 can be attached to the wiring member 221, it is possible to reduce the assembly process of the electronic device.

  In the second embodiment, since the first adhesive layer 213a and the second adhesive layer 213b are sandwiched between the lid member 211 and the frame member 250, the first adhesive layer 213a and the second adhesive layer 213b are employed. One adhesive layer 213a and the second adhesive layer 213b can be formed from an adhesive made of a thermosetting resin. The wiring member 221 can be sealed by heating and compression between the frame-shaped member 250 and the lid member 211. Thereby, not only high sealing performance can be ensured, but also a strong sealing structure 215 can be configured.

  On the other hand, as the third adhesive layer 260, by adopting a waterproof adhesive tape including a release tape, a seal structure that can be easily assembled can be configured.

  The scope of the present invention is not limited to the embodiment described above. The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined not by the above-mentioned meaning but by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

  A seal structure that can reliably seal the through-hole through which the wiring member is inserted and can be formed at low cost can be provided.

11 Lid member 13a First adhesive layer 13b Second adhesive layer 15a Seal structure 21 Wiring member 41a First housing (housing)
43 Through hole

Claims (10)

A seal structure of a through hole that is provided in a housing of an electronic device and through which a wiring member is inserted,
A lid member that covers the through hole and sandwiches the wiring member;
A first adhesive layer provided on the housing side so as to surround the through hole;
A second adhesive layer provided on the lid member so as to face the first adhesive layer;
A wiring member in which at least a side portion of the portion sandwiched between the housing and the lid member is formed in a stepped shape;
A through hole sealing structure in which the periphery of the wiring member is sealed via the first adhesive layer and the second adhesive layer, and the lid member is bonded to the housing.   2. The through hole sealing structure according to claim 1, wherein a total thickness of the first adhesive layer and the second adhesive layer is set larger than a thickness of a side edge portion of the wiring member.   The through-hole sealing structure according to claim 1, wherein the first adhesive layer is provided on an outer surface of the housing around the through-hole. A frame-shaped member surrounding the through hole is provided between the first adhesive layer and the housing, and a third adhesive layer for bonding the frame-shaped member around the through hole is provided.
The wiring member is sealed between the lid member and the frame-shaped member via the first adhesive layer and the second adhesive layer. The through-hole seal structure described. 5. The through hole sealing structure according to claim 1, wherein the first adhesive layer and the second adhesive layer are formed of a thermosetting resin. 6. .
  The through-hole sealing structure according to any one of claims 1 to 4, wherein the first adhesive layer and the second adhesive layer are formed of a waterproof adhesive tape.   The through hole sealing structure according to claim 4, wherein the third adhesive layer is formed of a waterproof adhesive tape.   The said wiring member is a printed wiring board, The said stepped side part is formed by notching the edge vicinity vicinity of the insulating coating layer which covers the circuit layer of the said wiring member. Item 8. The through hole seal structure according to any one of Items 7 to 9.   The said wiring member is a printed wiring board, The said stepped side part is formed by notching the edge vicinity vicinity of the electromagnetic shielding layer laminated | stacked on the said wiring member. 9. The through hole seal structure according to any one of items 8 to 9. A wiring body that includes a wiring member that is inserted into a through hole provided in a housing of an electronic device, and that seals the through hole,
A frame-like member that can be bonded so as to surround the periphery of the through hole;
A lid member provided to cover the frame-shaped member;
A first adhesive layer provided on a surface of the frame-shaped member facing the lid member;
A second adhesive layer provided on the lid member to face the first adhesive layer;
A third adhesive layer provided on a surface opposite to the surface on which the first adhesive layer of the frame-shaped member is provided;
The periphery of the wiring member is sealed by the first adhesive layer and the second adhesive layer, and the lid member and the frame-shaped member are connected to the first adhesive layer and the second adhesive member. A wiring body attached to a predetermined portion of the wiring body via an adhesive layer.

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