JP2014033057A - Substrate sucking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate sucking device capable of preventing dirt adhering to a sensor provided at a stage.SOLUTION: A substrate sucking device 10 includes: a stage 12; and a sensor 40. The sensor 12 includes: a substrate placement region 28 on which a substrate is placed; an opening 22a formed in the substrate placement region 28; and suction holes 22, 14, 36 which communicate with the opening 22a. The stage 12 performs vacuum suction through the suction holes 22, 14, 36 thereby suctioning and fixing the substrate in the substrate placement region 28. The sensor 40 is disposed in the suction holes 22x, 14, faces the opening 22a, and detects the substrate placed in the substrate placement region 28.

Description

  The present invention relates to a substrate suction device, and more particularly to a substrate suction device that sucks a substrate onto a table surface by vacuum suction.

  2. Description of the Related Art Conventionally, a substrate adsorption device that adsorbs and fixes a substrate is used in various processes for processing an electronic component.

  For example, as shown in the cross-sectional view of FIG. 4, the substrate 1 is adsorbed and fixed to the upper surface of the stage 2 by vacuum suction as indicated by an arrow through the suction channel 7 formed in the stage 2 ( For example, see Patent Document 1).

JP 2000-349430 A

  In order to recognize the position of the substrate fixed to the substrate suction device or to recognize the presence or absence of the substrate, a hole may be formed in the stage and a sensor may be arranged in the hole. In this case, if dust or dirt adheres to the sensor, it may cause erroneous detection of the sensor. Removing dust and dirt attached to the sensor can prevent false detection, but it takes time to clean the sensor.

  In view of such circumstances, the present invention is intended to provide a substrate suction device that can prevent contamination of a sensor provided on a stage.

  In order to solve the above-mentioned problems, the present invention provides a substrate suction device configured as follows.

  The substrate suction device includes a stage and a sensor. The stage includes a substrate placement area on which a substrate is placed, an opening formed in the substrate placement area, and a suction hole communicating with the opening. The stage can suck and fix the substrate in the substrate placement region by vacuum suction through the suction hole. The sensor is disposed in the suction hole, faces the opening, and can detect the substrate placed in the substrate placement region.

  In the above configuration, air flows through the suction hole along with vacuum suction. Due to this air flow, dirt such as dust and dirt is difficult to adhere to the sensor arranged in the suction hole of the stage. Therefore, contamination of the sensor provided on the stage can be prevented.

  According to the above configuration, since it is not necessary to separately provide holes or openings dedicated to the sensor on the stage, the configuration of the substrate suction device can be simplified.

  Preferably, the sensor includes a light receiving portion, and the light receiving portion faces the opening.

  When the sensor includes a light receiving part, it is usually easy for dirt and dust to accumulate on the light receiving part, and it is sensitive to the influence of the light receiving part contamination and easily causes false detection. Therefore, the effect of the present invention is particularly remarkable.

  Preferably, the substrate fixed in the substrate placement region is cut.

  Cutting waste tends to be generated by cutting the substrate, and the sensor is usually easily soiled. However, the sensor is prevented from being soiled, and the effect of the present invention is particularly remarkable.

  According to the present invention, it is possible to prevent the sensor provided on the stage from being soiled.

It is a disassembled perspective view of a board | substrate adsorption | suction apparatus. Example 1 It is a top view of a substrate adsorption device. Example 1 It is sectional drawing of a board | substrate adsorption | suction apparatus. Example 1 It is sectional drawing of a board | substrate adsorption | suction apparatus. (Conventional example)

  Embodiments of the present invention will be described below with reference to FIGS.

  <Example 1> The board | substrate adsorption | suction apparatus 10 of Example 1 is demonstrated referring FIGS. 1-3. FIG. 1 is an exploded perspective view of the substrate suction apparatus 10. FIG. 2 is a plan view of the substrate suction apparatus 10. FIG. 3 is a cross-sectional view taken along line XX in FIG.

  As shown in FIGS. 1 to 3, the substrate suction device 10 includes a stage 12 and a sensor 40. The stage 12 includes a top plate 20 and a base 30 that are coupled to each other.

  A substrate (not shown) is placed on the upper surface 20 a of the top plate portion 20. A through hole 22 is formed in the top plate portion 20. Due to the through holes 22, openings 22 a and 22 b are formed in the upper surface 20 a and the lower surface 20 b of the top plate portion 20. As shown in FIGS. 1 and 2, the opening 22a on the upper surface 20a is formed in the substrate placement region 28 on which the substrate is placed on the upper surface 20a.

  As shown in FIGS. 1 and 3, the base 30 is formed with a recess 34 that is recessed from the upper surface 32 facing the top plate 20. A connection hole 36 connected to a vacuum source (not shown) is formed in the bottom surface 34 a of the recess 34.

  As shown in FIG. 3, the stage 12 is coupled to the top plate portion 20 and the base portion 30 so that the opening 22 b of the lower surface 20 b of the top plate portion 20 faces the bottom surface 34 a of the recess 34. In the stage 12, a suction hole including a through hole 22, a space 14 formed between the top plate portion 20 and the base portion 30 by the concave portion 34, and a connection hole 36 is formed.

  When the substrate is placed on the substrate placement region 28, the opening 22a on the upper surface 20a of the top plate 20 is covered with the substrate. In this state, the connection hole 36 is connected to a vacuum source and evacuated as indicated by an arrow 38, whereby the substrate can be adsorbed and fixed to the upper surface 20a of the top plate portion 20.

  As shown in FIGS. 1 and 3, the sensor 40 is fixed to the bottom surface 34 a of the recess 34 and is inserted into at least one of the through holes 22 of the top plate 20. The sensor 40 is disposed such that a gap 48 is formed between the inner peripheral surface 22s of the through hole 22x in which the sensor 40 is inserted.

  Since the through hole 22x into which the sensor 40 is inserted is not blocked by the sensor 40, air flows around the sensor 40 along with vacuum suction. Even if dirt such as dust or dust adheres to the sensor 40, it is easily removed by the flow of air, so that the sensor 40 is difficult to adhere dirt. Therefore, the sensor 40 can be prevented from being soiled.

  By disposing the sensor 40 in the through hole 22x for suction, it is not necessary to provide a hole or opening dedicated to the sensor in the stage 12 in addition to the suction hole. Therefore, the configuration of the substrate suction device 10 can be simplified.

  The sensor 40 can be used for process automation and monitoring. For example, the sensor 40 detects whether or not the substrate is placed at a predetermined position on the stage 12, and when the substrate placement is detected, control is performed so as to start vacuum suction or the substrate placement is not detected. It is judged that an abnormality has occurred when vacuum suction is performed.

  For example, the sensor 40 is a proximity sensor that utilizes light transmission. In this case, as shown in FIGS. 1 to 3, a light receiving portion (not shown) is provided at the distal end portion 42 of the sensor 40 facing the opening 22 a of the upper surface 20 a of the top plate portion 20. When the amount of received light detected by the light receiving unit is equal to or less than a predetermined value, it is determined that the light incident on the light receiving unit is blocked by the substrate, that is, the substrate is placed.

  Alternatively, the sensor 40 is a proximity sensor that utilizes light reflection. In this case, the front end portion 42 of the sensor 40 includes a light receiving portion and a light emitting portion. When the amount of received light detected by the light receiving unit exceeds a predetermined value, it is determined that the light emitted from the light emitting unit is reflected by the substrate and enters the light receiving unit, that is, the substrate is placed. Conversely, when the amount of received light is equal to or less than a predetermined value, it is determined that the light emitted from the light emitting unit is reflected by the substrate and is not incident on the light receiving unit, that is, the substrate is not placed.

  When the light receiving unit is provided at the tip 42 of the sensor 40, normally, dirt such as dust and dust is likely to accumulate on the light receiving unit, and erroneous detection is likely to occur due to contamination of the light receiving unit. The effect of the present invention is particularly significant because the flow prevents the light receiving portion from being contaminated.

  The sensor 40 is not limited to a proximity sensor that uses light, but may be a sensor other than the proximity sensor (for example, a pressure sensor, a temperature sensor, or the like), even if it is a proximity sensor that uses an ultrasonic wave, an electric field, a magnetic field, or the like. It does not matter.

  The board | substrate adsorption | suction apparatus 10 can be used in various processes, such as cutting of a board | substrate, application | coating of the resin on a board | substrate, and component mounting on a board | substrate.

  When the substrate adsorbing device 10 is used in the substrate cutting process, cutting waste tends to be generated by the substrate cutting process, and the sensor is usually easily contaminated. However, the sensor is prevented from being contaminated by the air flow accompanying vacuum suction. The effect of the present invention is particularly remarkable.

  Even if the sensor is not inserted into the through hole 22, it can detect the substrate placed in the substrate placement region if it is arranged in the suction hole so as to face the opening 22a of the through hole 22. can do. If the sensor is disposed in the suction hole, the sensor can be prevented from being soiled.

  <Summary> As described above, the sensor can be prevented from being contaminated by providing the sensor in the suction hole.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, a plurality of sensors may be provided, or the sensors may be provided so as to be inserted into all through holes.

10 Substrate suction device 12 Stage 14 Space (suction hole)
20 Top plate 20a Top surface (main surface)
20b Lower surface (main surface)
22,22x Through hole (suction hole)
22a, 22b Opening 22s Inner peripheral surface 28 Substrate placement region 30 Base 32 Upper surface 34 Recess 34a Bottom surface 36 Connection hole (suction hole)
38 Arrow 40 Sensor 42 Tip 48 Clearance

Claims (3)

The substrate has a substrate placement area on which the substrate is placed, an opening formed in the substrate placement area, and a suction hole communicating with the opening, and the substrate is vacuum-sucked through the suction hole. A stage capable of adsorbing and fixing the substrate in the mounting area;
A sensor arranged in the suction hole, opposed to the opening, and capable of detecting the substrate placed in the substrate placement region;
A substrate suction apparatus comprising:   The substrate suction apparatus according to claim 1, wherein the sensor includes a light receiving portion, and the light receiving portion faces the opening.   The substrate suction apparatus according to claim 1, wherein the substrate fixed in the substrate placement region is cut.

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