JP2014022527A5

JP2014022527A5 -

Info

Publication number: JP2014022527A5
Application number: JP2012159078A
Authority: JP
Filing date: 2012-07-17
Publication date: 2015-09-03
Anticipated expiration: 2032-07-17

Description

上記目的を達成するために、本発明の一側面としてのインプリント装置は、基板上のインプリント材にモールドを用いてパターンを形成するインプリント装置であって、前記モールドを保持して移動可能なモールド保持部と、前記基板を保持して移動可能な基板保持部と、前記モールドと前記基板との距離に基づいて、前記モールドと前記基板との距離を変更するときの抗力を決定する決定部と、前記抗力に基づいて、前記モールドと前記基板との相対位置を制御する制御部と、を含むことを特徴とする。 To achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus for forming a pattern using a mold imprint material on the base plate, holding the mold moving A drag force when changing the distance between the mold and the substrate is determined based on a possible mold holding portion, a substrate holding portion movable while holding the substrate, and a distance between the mold and the substrate. And a control unit that controls a relative position between the mold and the substrate based on the drag .

＜第１実施形態＞
本発明の第１実施形態のインプリント装置１００について、図１を参照して説明する。インプリント装置は、半導体デバイスなどの製造に使用され、パターンが形成されたモールドを基板上の樹脂（インプリント材）と接触させた状態（押し付けた状態）で樹脂を硬化させ、硬化した樹脂からモールドを剥離することで基板上にパターンを転写するインプリント処理を行う。インプリント装置１００は、モールド１を保持するモールド保持部１０と、基板２を保持する基板保持部２０と、モールド１を変形させる変形部１５と、基板上の樹脂に光（紫外光）を照射する光照射部３０と、基板２に樹脂を塗布する塗布部４０とを含む。また、インプリント装置１００は、インプリント処理を制御するための制御系５０として、第１制御部５１と、第２制御部５２と、第３制御部５３と、決定部５４と、補正部５５と、記憶部５６とを含む。 <First Embodiment>
An imprint apparatus 100 according to a first embodiment of the present invention will be described with reference to FIG. The imprint apparatus is used in the manufacture of semiconductor devices and the like. From the cured resin, the resin is cured in a state ( pressed state ) in which the pattern-formed mold is in contact with the resin (imprint material) on the substrate. An imprint process for transferring the pattern onto the substrate is performed by peeling the mold. The imprint apparatus 100 irradiates the resin on the substrate with light ( ultraviolet light ) , the mold holding unit 10 that holds the mold 1, the substrate holding unit 20 that holds the substrate 2, the deformation unit 15 that deforms the mold 1. The light irradiation part 30 to perform and the application part 40 which apply | coats resin to the board | substrate 2 are included. The imprint apparatus 100 also includes a first control unit 51, a second control unit 52, a third control unit 53, a determination unit 54, and a correction unit 55 as a control system 50 for controlling the imprint process. And a storage unit 56.

モールド１は、通常、石英など紫外線を透過させることができる材料で作製されており、基板側の面の一部には、基板上の樹脂に転写する凹凸のパターン１ａが形成されている。また、モールド１の基板側の面と反対側の面には、パターン１ａが形成された部分の厚みが薄くなるように掘り込まれた凹部１ｂが形成されている。このように、パターン１ａが形成された部分を薄くすることで、後述する気室１４に圧力を加えたときにモールド１が変形しやすい状態にしている。基板２は、例えば、単結晶シリコン基板やＳＯＩ（ＳｉｌｉｃｏｎｏｎＩｎｓｕｌａｔｏｒ）基板が用いられる。基板２の上面（被処理面）には、後述する塗布部４０によって紫外線硬化樹脂（以下、樹脂）が塗布され、基板２に塗布された樹脂にモールド１が押し付けられる。樹脂にモールド１が押し付けられた状態で紫外線３１ａを照射することによって樹脂が硬化し、硬化した樹脂からモールド１が剥離されることによって樹脂にモールド１のパターン１ａが転写される。 The mold 1 is usually made of a material that can transmit ultraviolet rays, such as quartz, and an uneven pattern 1a to be transferred to a resin on the substrate is formed on a part of the surface on the substrate side. A recess 1b is formed on the surface of the mold 1 opposite to the surface on the substrate side so as to reduce the thickness of the portion where the pattern 1a is formed. Thus, by thinning the portion where the pattern 1a is formed, the mold 1 is easily deformed when pressure is applied to an air chamber 14 described later. As the substrate 2, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate is used. An ultraviolet curable resin (hereinafter, resin) is applied to the upper surface (surface to be processed ) of the substrate 2 by an application unit 40 described later, and the mold 1 is pressed against the resin applied to the substrate 2. When the mold 1 is pressed against the resin, the resin is cured by irradiating the ultraviolet rays 31a, and the mold 1 is peeled off from the cured resin, whereby the pattern 1a of the mold 1 is transferred to the resin.

モールド保持部１０は、モールドチャック１１と、位置計測部１２とを含む。モールドチャック１１は、ｚ方向に推力を発生させるアクチュエータ１３を介して構造体３に固定されており、真空吸着力や静電力などによりモールド１を保持する。モールドチャック１１にはモールド１と接触する面に凹部１１ａが形成されており、モールドチャック１１の凹部１１ａは、モールド１により覆われてほぼ密閉された空間となる。モールドチャック１１の凹部１１ａとモールド１の凹部１ｂとによって規定される空間を、以下では気室１４と呼ぶ。気室１４は、配管１４ａを介して変形部１５に接続されている。変形部１５は、気室１４に圧縮空気を供給する供給源と気室１４を真空にする排気装置とを切り替えるための切換え弁やサーボバルブなどの圧力調整器１５ａ（図４）を含む。この変形部１５によってインプリント処理時に気室１４の圧力を制御し、モールド１を基板２に向かって凸型の形状に変形させることができる。このように、モールド１を変形させてインプリント処理を行うと、モールド１はその中心部から基板２に接触していくため、モールド１のパターン１ａに気泡が閉じ込められることが抑制され、基板上に転写されるパターンの欠損を防止することができる。アクチュエータ１３は、例えば、３個以上用いることによって、モールドチャック１１（モールド１）の位置および姿勢をｚ方向、ｘ軸まわりの回転（θ_ｘ）、およびｙ軸まわりの回転（θ_ｙ）について制御することができる。また、位置計測部１２は、例えば、エンコーダや干渉計、静電容量センサなどを含み、モールドチャック１１の位置を計測する。位置計測部１２は、例えば、３個以上のエンコーダを含む場合、モールドチャック１１におけるｚ方向の位置、ｘ軸を中心にしたθ_ｘ回転量、およびｙ軸を中心にしたθ_ｙ回転量を計測することができる。ここで、モールド保持部１０が固定される構造体３は、インプリント装置が固定された場所（床）からの振動を抑制するため、床に固定された定盤６によって、支持台５および空気ばね４を介して支持されている。また、構造体３を支持台５および定盤６と一体化し、定盤６の下に空気ばね４を挿入する構成にしてもよく、この場合も床からの振動を抑制できる。また、第１実施形態において変形部１５は、気室１４の圧力を調整してモールド１を変形しているが、例えば、圧電素子などによってモールド１の側面から力を加えてモールド１を変形してもよい。 The mold holding unit 10 includes a mold chuck 11 and a position measurement unit 12. The mold chuck 11 is fixed to the structure 3 via an actuator 13 that generates a thrust force in the z direction, and holds the mold 1 by a vacuum suction force or an electrostatic force. The mold chuck 11 has a recess 11 a formed on the surface that contacts the mold 1. The recess 11 a of the mold chuck 11 is covered with the mold 1 and becomes a substantially sealed space. A space defined by the concave portion 11a of the mold chuck 11 and the concave portion 1b of the mold 1 is hereinafter referred to as an air chamber 14. The air chamber 14 is connected to the deformation part 15 via the pipe 14a. The deformation unit 15 includes a pressure regulator 15a (FIG. 4) such as a switching valve or a servo valve for switching between a supply source for supplying compressed air to the air chamber 14 and an exhaust device for evacuating the air chamber 14. By this deforming portion 15, the pressure of the air chamber 14 can be controlled during the imprint process, and the mold 1 can be deformed into a convex shape toward the substrate 2. When the imprint process is performed by deforming the mold 1 in this manner, the mold 1 comes into contact with the substrate 2 from the central portion thereof, so that air bubbles are suppressed from being confined in the pattern 1a of the mold 1, and It is possible to prevent the loss of the pattern transferred to the surface. For example, by using three or more actuators 13, the position and posture of the mold chuck 11 (mold 1) are controlled with respect to the z direction, rotation about the x axis (θ _x ), and rotation about the y axis (θ _y ). can do. The position measurement unit 12 includes, for example, an encoder, an interferometer, a capacitance sensor, and the like, and measures the position of the mold chuck 11. For example, when the position measurement unit 12 includes three or more encoders, the position measurement unit 12 measures the position in the z direction of the mold chuck 11, the θ _x rotation amount around the x axis, and the θ _y rotation amount around the y axis. can do. Here, the structure 3 to which the mold holding unit 10 is fixed has the support base 5 and the air by the surface plate 6 fixed to the floor in order to suppress vibration from the place (floor) where the imprint apparatus is fixed. It is supported via a spring 4. Further, the structure 3 may be integrated with the support base 5 and the surface plate 6 and the air spring 4 may be inserted under the surface plate 6. In this case, vibration from the floor can be suppressed. Further, in the first embodiment, the deforming portion 15 deforms the mold 1 by adjusting the pressure of the air chamber 14. For example, the deforming portion 15 deforms the mold 1 by applying a force from the side surface of the mold 1 with a piezoelectric element or the like. May be.

Claims

A imprint apparatus for forming a pattern using a mold to imprint material on the base plate,
A mold holding unit that is movable while holding the mold;
A substrate holding part that is movable while holding the substrate;
A determination unit for determining a drag force when changing a distance between the mold and the substrate based on a distance between the mold and the substrate;
A control unit for controlling a relative position between the mold and the substrate based on the drag ;
An imprint apparatus comprising:

And further including a deforming portion that deforms the pattern by applying a force to the mold,
Wherein the control unit, the imprint apparatus according to claim 1, characterized in that for controlling the flexible portion on the basis of the previous SL drag.

When the drag is F, the distance between the mold and the substrate is h, the relative speed between the mold and the substrate is dh / dt, and the coefficient is K,

The imprint apparatus according to claim 1, wherein the imprint apparatus is represented by:

The imprint apparatus according to claim 3, wherein the coefficient is determined by a viscosity coefficient of a gas between the mold and the substrate and an area where the mold and the substrate overlap.

A storage unit for storing information representing a correspondence relationship between the position on the substrate and the coefficient at the position;
5. The imprint apparatus according to claim 3, wherein the determination unit acquires the coefficient corresponding to the position on the substrate on which the imprint process is performed, based on information stored in the storage unit.

The information for controlling the relative position between the mold and the substrate includes at least one of information for controlling the mold holding unit and information for controlling the substrate holding unit. The imprint apparatus according to any one of claims 1 to 5.

A correction unit that corrects information for controlling the relative position between the mold and the substrate based on the drag;
The control unit controls a relative position between the mold and the substrate based on information for controlling a relative position between the mold and the substrate corrected by the correction unit. The imprint apparatus according to any one of 1 to 6.

Forming a pattern on the substrate using an imprint apparatus according to any one of claims 1 to 7,
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

A imprint method of forming a pattern using a mold to imprint material on the base plate,
A determination step of determining a drag force when changing a distance between the mold and the substrate based on a distance between the mold and the substrate;
A control step of controlling a relative position between the mold and the substrate based on the drag ;
The imprint method characterized by including.