JP2014021099A - Thickness profile measurement device - Google Patents

Thickness profile measurement device Download PDF

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JP2014021099A
JP2014021099A JP2012163495A JP2012163495A JP2014021099A JP 2014021099 A JP2014021099 A JP 2014021099A JP 2012163495 A JP2012163495 A JP 2012163495A JP 2012163495 A JP2012163495 A JP 2012163495A JP 2014021099 A JP2014021099 A JP 2014021099A
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fluctuation amount
pass line
pass
thickness profile
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Yoshinori Watanabe
慶典 渡邊
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Toshiba Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a thickness profile measurement device that corrects an error due to a path line variation and a path angle variation, and thereby can more accurately measure a thickness profile in a width direction of a sheet-like measured object.SOLUTION: A thickness profile measurement device according to an embodiment comprises: a detector that includes an X-ray generator and a plurality of ionization chambers; and a control part that uses characteristics in which an attenuation amount of the X-ray is different depending upon a sheet thickness of a substance and a material thereof when an X-ray to be output from the X-ray generator is transmitted through the substance, and measures the sheet thickness in the width direction of the measured object from a detection result by the plurality of ionization chambers. The thickness profile measurement device is configured to include: first variation amount measurement means that calculates a path line variation amount of the measured object passing through the detector; and first correction means that, on the basis of the path line variation amount calculated by the first variation amount measurement means, calculates a sheet thickness profile in which a measurement error of the sheet thickness due to the path line variation is corrected.

Description

本発明の実施形態は、厚みプロファイル測定装置に関する。   Embodiments described herein relate generally to a thickness profile measuring apparatus.

従来より、様々な板状の物体(ここでは鋼板を例とする)の製造ラインにおいて、鋼板の幅方向の厚みプロファイルをリアルタイムに測定する厚みプロファイル測定装置が用いられている。従来の厚みプロファイル測定装置は、厚みプロファイルを測定するために、X線発生器と鋼板の幅方向に複数の電離箱を有する検出器とで構成される検出部を備えている。検出部では、鋼板を透過するX線発生器からのX線量を、各電離箱で電気信号に変換し、その電流を積分型AD変換器でディジタル変換し電流値として、厚みプロファイル測定装置の制御部へと伝送する。   Conventionally, in a production line for various plate-like objects (here, a steel plate is taken as an example), a thickness profile measuring device for measuring a thickness profile in the width direction of the steel plate in real time has been used. In order to measure the thickness profile, a conventional thickness profile measuring apparatus includes a detection unit including an X-ray generator and a detector having a plurality of ionization chambers in the width direction of the steel plate. In the detection unit, the X-ray dose from the X-ray generator that passes through the steel plate is converted into an electrical signal by each ionization chamber, and the current is digitally converted by an integrating AD converter to obtain a current value as a control of the thickness profile measuring device. Transmitted to the department.

制御部では、内蔵されるマイクロコンピュータにより、上記電流値と、設定値および事前に校正処理で求めておいた検量線パラメータとを用いて、板厚を演算し、板厚偏差を出力する。このような厚みプロファイル測定装置では、電離箱を複数用いて多点測定することで、幅方向の板厚プロファイルをリアルタイムに測定することが可能である。   In the control unit, the built-in microcomputer calculates the plate thickness using the current value, the set value and the calibration curve parameter obtained in advance by the calibration process, and outputs the plate thickness deviation. In such a thickness profile measuring apparatus, it is possible to measure the thickness profile in the width direction in real time by performing multipoint measurement using a plurality of ionization chambers.

特開2006−170883号公報JP 2006-170883 A

しかしながら、上記のような厚みプロファイル測定装置を用いて鋼板の幅方向の板厚プロファイルを測定する際に、パスライン変動(鋼板が厚みプロファイル測定装置を通過すべき基準となる位置からの高さ変動)およびパスアングル変動(鋼板が厚みプロファイル測定装置を通過する際に幅方向に傾いた場合の傾きの変動)が発生する。   However, when measuring the thickness profile in the width direction of the steel sheet using the thickness profile measuring apparatus as described above, the pass line fluctuation (height fluctuation from the reference position where the steel sheet should pass through the thickness profile measuring apparatus) ) And pass angle fluctuation (inclination fluctuation when the steel sheet is inclined in the width direction when passing through the thickness profile measuring device).

パスライン変動が発生し、X線発生器、検出器および鋼板の位置関係が変化すると、上記従来技術においては、検出器に入射されるX線の散乱線量が変化し、厚み誤差が発生してしまうという問題が生じる。さらに、パスアングル変動が発生すると、鋼板に対し斜めにX線が透過するため、上記従来技術においては、電離箱とX線発生器の位置関係で異なる厚み誤差が発生してしまうという問題が生じる。   When pass line fluctuations occur and the positional relationship between the X-ray generator, detector, and steel plate changes, the scattered radiation of X-rays incident on the detector changes in the above-described prior art, resulting in a thickness error. Problem arises. Further, when the pass angle variation occurs, X-rays are transmitted obliquely with respect to the steel sheet, so that the conventional technique has a problem in that different thickness errors occur depending on the positional relationship between the ionization chamber and the X-ray generator. .

本発明が解決しようとする課題は、X線発生器と板状の被測定物の幅方向に複数の電離箱を有する検出器とを備えた厚みプロファイル測定装置において、パスライン変動およびパスアングル変動による誤差を補正して、より高精度に板状の被測定物の幅方向の厚みプロファイルを測定することができる厚みプロファイル測定装置を提供することである。   SUMMARY OF THE INVENTION Problems to be solved by the present invention are a thickness profile measuring apparatus including an X-ray generator and a detector having a plurality of ionization chambers in the width direction of a plate-like object to be measured. It is an object to provide a thickness profile measuring apparatus capable of correcting a thickness profile in the width direction of a plate-like object to be measured with higher accuracy by correcting an error due to the above.

実施形態の厚みプロファイル測定装置は、X線発生器と複数の電離箱を有する検出器とを備える検出部と、X線発生器から出力されるX線が物質を透過する際に、その物質の板厚、材質によってX線の減衰量が異なる特性を利用して、複数の電離箱による検出結果より被測定物の幅方向の板厚を測定する制御部とを備える厚みプロファイル測定装置である。このような厚みプロファイル測定装置において、検出器を通過する被測定物のパスライン変動量を求める第1変動量測定手段と、第1変動量測定手段により求めたパスライン変動量を基に、パスライン変動による板厚の測定誤差を補正した板厚プロファイルを求める第1補正手段とを備えた。   The thickness profile measuring apparatus according to the embodiment includes a detection unit including an X-ray generator and a detector having a plurality of ionization chambers, and when X-rays output from the X-ray generator pass through the substance, A thickness profile measuring apparatus including a control unit that measures a plate thickness in a width direction of an object to be measured from detection results obtained by a plurality of ionization chambers using characteristics in which the amount of X-ray attenuation varies depending on the plate thickness and material. In such a thickness profile measuring apparatus, the first fluctuation amount measuring means for obtaining the pass line fluctuation amount of the object passing through the detector, and the pass line fluctuation amount obtained by the first fluctuation amount measuring means, And a first correction unit for obtaining a plate thickness profile in which a plate thickness measurement error due to line fluctuation is corrected.

図1は、実施形態にかかる厚みプロファイル測定装置の全体構成を示す概略図である。FIG. 1 is a schematic diagram illustrating an overall configuration of a thickness profile measuring apparatus according to an embodiment. 図2は、実施形態の厚みプロファイル測定装置の制御部の、厚みプロファイル測定にかかる機能構成を示す図である。FIG. 2 is a diagram illustrating a functional configuration related to thickness profile measurement of the control unit of the thickness profile measuring apparatus according to the embodiment. 図3は、レーザ発振器からレーザ照射した被測定物の表面をエリアCCDカメラで撮影して得られるレーザ投影画像の変化例を示した図である。FIG. 3 is a diagram showing a change example of the laser projection image obtained by photographing the surface of the measurement object irradiated with laser from the laser oscillator with an area CCD camera. 図4は、パスライン変動誤差補正テーブルの一例を示した図である。FIG. 4 is a diagram showing an example of a pass line fluctuation error correction table. 図5は、被測定物の厚みT、被測定物を通過するX線の通過長T、および補正前厚みT”の関係を説明する図である。FIG. 5 is a diagram for explaining the relationship among the thickness T of the object to be measured, the passage length T of X-rays passing through the object to be measured, and the thickness T ″ before correction. 図6−1は、パスライン変動誤差補正を実施した場合と実施しない場合の板厚の検出結果を示した図である。FIG. 6A is a diagram illustrating a detection result of the plate thickness when the pass line fluctuation error correction is performed and when it is not performed. 図6−2は、200mmのパスライン変動が有った場合の様子を示した図である。FIG. 6B is a diagram illustrating a state in which there is a 200 mm pass line variation. 図7−1は、パスアングル変動誤差補正を実施した場合と実施しない場合の板厚の検出結果を示した図である。FIG. 7A is a diagram illustrating a plate thickness detection result when the pass angle variation error correction is performed and when it is not performed. 図7−2は、5度のパスアングル変動が有った場合の様子を示した図である。FIG. 7-2 is a diagram illustrating a state where there is a 5 degree path angle variation.

はじめに、厚みプロファイル測定装置の全体構成について、図1を用いて説明する。図1は、実施形態にかかる厚みプロファイル測定装置の全体構成を示す概略図である。   First, the overall configuration of the thickness profile measuring apparatus will be described with reference to FIG. FIG. 1 is a schematic diagram illustrating an overall configuration of a thickness profile measuring apparatus according to an embodiment.

本実施形態の厚みプロファイル測定装置は、X線発生器11と板状の被測定物(鋼板等)3の幅方向に複数の電離箱を有する検出器12とで構成される検出部1を備える。被測定物3の厚みプロファイルを測定する際、検出部1を通過する被測定物3に対し、X線発生器11からX線を照射する。そして、この被測定物3を透過するX線量を検出器12の各電離箱で電気信号に変換し、その電流を積分型AD変換器(図示せず)でアナログ/ディジタル変換し、検出信号(電流値)として制御部2に伝送する。制御部2は、マイクロコンピュータを備えており、このマイクロコンピュータにより、検出部1から受ける電流値と、設定値および事前に校正処理で求めておいた検量線パラメータを用いて、板厚を演算し、板厚偏差を出力する(誤差補正無しの場合)。また、制御部2は、検出部1のX線照射に係る制御など検出部1の各種制御も行う。   The thickness profile measuring apparatus according to the present embodiment includes a detection unit 1 including an X-ray generator 11 and a detector 12 having a plurality of ionization chambers in the width direction of a plate-like object to be measured (such as a steel plate) 3. . When measuring the thickness profile of the object 3 to be measured, the X-ray generator 11 irradiates the object 3 passing through the detector 1 with X-rays. Then, the X-ray dose transmitted through the object to be measured 3 is converted into an electric signal by each ionization chamber of the detector 12, and the current is converted into an analog / digital signal by an integrating AD converter (not shown), and a detection signal ( Current value) to the control unit 2. The control unit 2 includes a microcomputer, and the microcomputer calculates the plate thickness using the current value received from the detection unit 1, the set value, and the calibration curve parameter obtained in advance in the calibration process. , Outputs the thickness deviation (when there is no error correction). The control unit 2 also performs various controls of the detection unit 1 such as control related to X-ray irradiation of the detection unit 1.

以上の構成および板厚の算出方法は、従来の厚みプロファイル測定装置と同様であるが、本実施形態の厚みプロファイル測定装置の制御部2は、図2に示すように、パスライン変動量測定部21、パスライン変動誤差補正部22、パスアングル変動量測定部23、パスアングル変動誤差補正部24、および後述のパスライン変動誤差補正テーブル25を備える。   The configuration and the method for calculating the plate thickness are the same as those of the conventional thickness profile measuring apparatus, but the control unit 2 of the thickness profile measuring apparatus of the present embodiment has a pass line variation measuring unit as shown in FIG. 21, a pass line fluctuation error correction unit 22, a pass angle fluctuation amount measurement unit 23, a path angle fluctuation error correction unit 24, and a pass line fluctuation error correction table 25 described later.

パスライン変動量測定部21は、被測定物3のパスライン変動量を求める。パスライン変動誤差補正部22は、パスライン変動量測定部21により求めたパスライン変動量を基に、後述のように、パスライン変動による板厚の測定誤差を補正した板厚プロファイルを求める。パスアングル変動量測定部23は、検出部1を通過する被測定物3のパスアングル変動量を測定する。パスアングル変動誤差補正部24は、パスアングル変動量測定部23により求めたパスアングル変動量を基に、後述のように、パスアングル変動による板厚の測定誤差を補正した板厚プロファイルを求める。   The pass line fluctuation measuring unit 21 obtains the pass line fluctuation of the DUT 3. Based on the pass line fluctuation amount obtained by the pass line fluctuation amount measuring unit 21, the pass line fluctuation error correction unit 22 obtains a plate thickness profile in which a plate thickness measurement error due to the pass line fluctuation is corrected, as will be described later. The path angle variation measuring unit 23 measures the path angle variation of the DUT 3 that passes through the detection unit 1. The pass angle variation error correction unit 24 obtains a plate thickness profile in which a plate thickness measurement error due to the pass angle variation is corrected based on the pass angle variation obtained by the pass angle variation measurement unit 23 as described later.

なお、制御部2は、マイクロコンピュータと、ROM(Read Only Memory)やRAMや内蔵HDDなどの記憶装置と、HDD、CDドライブ装置などの外部記憶装置と、液晶ディスプレイ装置などの表示装置と、キーボードやマウスなどの入力装置を備えており、通常のコンピュータを利用したハードウェア構成となっている。   The control unit 2 includes a microcomputer, a storage device such as a ROM (Read Only Memory), a RAM, and a built-in HDD, an external storage device such as an HDD and a CD drive device, a display device such as a liquid crystal display device, and a keyboard. And a hardware configuration using a normal computer.

上記パスライン変動誤差補正テーブル25および上記マイクロコンピュータが実行する制御プログラムは、上記内蔵HDDなどの記憶装置または上記外部記憶装置に格納されており、マイクロコンピュータが制御プログラムを主記憶装置としてのRAMにロードし実行することにより、当該マイクロコンピュータが、上記パスライン変動量測定部21、パスライン変動誤差補正部22、パスアングル変動量測定部23、および、パスアングル変動誤差補正部24として機能する。   The pass line fluctuation error correction table 25 and the control program executed by the microcomputer are stored in a storage device such as the built-in HDD or the external storage device, and the microcomputer stores the control program in a RAM as a main storage device. By loading and executing the microcomputer, the microcomputer functions as the pass line variation measuring unit 21, the pass line variation error correcting unit 22, the path angle variation measuring unit 23, and the path angle variation error correcting unit 24.

また、本実施形態の厚みプロファイル測定装置の検出部1は、被測定物3の幅方向にレーザ発振器13およびエリアCCDカメラ14を備えている。パスライン変動量測定部21およびパスアングル変動量測定部23は、レーザ発振器13からレーザ照射した被測定物3の表面をエリアCCDカメラ14で撮影して得られるレーザ投影画像(カメラ画像)の変化(図3参照)から、被測定物3のパスライン変動量およびパスアングル変動量を求める。または、レーザ発振器13およびエリアCCDカメラ14に代えて、その他の検出器(センサ等)を用いて、被測定物3のパスライン変動量およびパスアングル変動量を検出する。   In addition, the detection unit 1 of the thickness profile measuring apparatus of the present embodiment includes a laser oscillator 13 and an area CCD camera 14 in the width direction of the device under test 3. The pass line fluctuation measuring unit 21 and the pass angle fluctuation measuring unit 23 change a laser projection image (camera image) obtained by photographing the surface of the object 3 to be measured irradiated with laser from the laser oscillator 13 with the area CCD camera 14. From (see FIG. 3), the pass line fluctuation amount and the pass angle fluctuation amount of the DUT 3 are obtained. Or, instead of the laser oscillator 13 and the area CCD camera 14, other detectors (sensors or the like) are used to detect the pass line fluctuation amount and the pass angle fluctuation amount of the DUT 3.

そして、被測定物3のパスライン変動量およびパスアングル変動量が求められると、以下のパスライン変動誤差補正およびパスアングル変動誤差補正を行う。   When the pass line fluctuation amount and the pass angle fluctuation amount of the device under test 3 are obtained, the following pass line fluctuation error correction and pass angle fluctuation error correction are performed.

(1)パスライン変動誤差補正
制御部2には、図4に一例を示す、板厚毎・パスライン変動量(基準位置(パスライン0mm)からの高さデータ)毎の補正量が設定されたパスライン変動誤差補正テーブル25が予め登録されている。制御部2のパスライン変動誤差補正部22は、設定板厚および検出したパスライン変動量を基に、パスライン変動誤差補正テーブル25の該当する補正値を用いて、パスライン変動による厚み誤差の補正を行う。
(1) Correction of Pass Line Fluctuation Error The control unit 2 is set with a correction amount for each plate thickness and for each pass line fluctuation amount (height data from the reference position (pass line 0 mm)) as shown in FIG. The pass line fluctuation error correction table 25 is registered in advance. The pass line fluctuation error correction unit 22 of the control unit 2 uses the corresponding correction value in the pass line fluctuation error correction table 25 based on the set plate thickness and the detected pass line fluctuation amount, to correct the thickness error due to the pass line fluctuation. Make corrections.

(2)パスアングル変動誤差補正
X線発生器11からのX線の、被測定物3への照射角度は、検出器12の各電離箱の位置毎に異なる。このため、パスアングル補正量は、X線ビーム角度と被測定物3の角度の2つの角度により、各電離箱毎に補正量を決定する。
(2) Correction of Path Angle Fluctuation Error The irradiation angle of the X-ray from the X-ray generator 11 to the object to be measured 3 varies depending on the position of each ionization chamber of the detector 12. For this reason, the pass angle correction amount is determined for each ionization chamber based on the two angles of the X-ray beam angle and the object 3 to be measured.

図5に示すように、被測定物3に照射されるX線ビームは被測定物3に対し垂直でないため、厚みTの被測定物3を通過するX線の通過長はTではなく、T’(=T/cosθ;ただし、θはX線ビーム角度であり、垂直に対し時計方向を正とする)となる。このため、制御部2において検量線は、X線の通過長がT’の時に被測定物3の厚みをTとして認識するようになっている。ここで、パスアングル変動のため被測定物3が、その幅方向に角度φ(ただし、水平に対し反時計方向を正とする)だけ傾いた場合のX線通過長T”とすると、補正前厚みT”から補正後厚みT’を求める補正式は下式となる。   As shown in FIG. 5, since the X-ray beam irradiated to the device under test 3 is not perpendicular to the device under test 3, the passage length of X-rays passing through the device under test 3 having a thickness T is not T but T '(= T / cos θ; where θ is the X-ray beam angle, and the clockwise direction is positive with respect to the vertical). For this reason, the calibration curve in the control unit 2 recognizes the thickness of the DUT 3 as T when the X-ray passage length is T ′. Here, if the measured object 3 is inclined by an angle φ (however, the counterclockwise direction is positive with respect to the horizontal direction) in the width direction due to the path angle variation, it is assumed that the X-ray passage length T ″ is before correction. The correction formula for obtaining the corrected thickness T ′ from the thickness T ″ is as follows.

Figure 2014021099
Figure 2014021099

また、被測定物3の角度φの符号をX線ビーム角度θと同様、時計方向を正とする場合は、補正式は下式で表すことができる。   When the sign of the angle φ of the DUT 3 is the same as the X-ray beam angle θ and the clockwise direction is positive, the correction formula can be expressed by the following formula.

Figure 2014021099
Figure 2014021099

被測定物3の傾きがφの場合、上記のようにして補正することで、パスアングル変動誤差補正を実施できる。   When the inclination of the device under test 3 is φ, correction of the path angle variation error can be performed by correcting as described above.

(3)ラベリング処理
検出部1に同期信号を入力し、検出部1から同期して得られた検出結果を基に求めたパスライン変動量(高さ)、パスアングル変動量(角度)、板厚の結果にラベリングを行い、一致するラベル毎に上記パスライン変動誤差補正およびパスアングル変動誤差補正を実施することで、通板中のパスライン変動量およびパスアングル変動量の変化に追従した補正を行うことができる。
(3) Labeling process A synchronization signal is input to the detection unit 1, and a pass line fluctuation amount (height), a pass angle fluctuation amount (angle), a plate obtained based on a detection result obtained in synchronization with the detection unit 1 By labeling the thickness results and performing the above-mentioned pass line fluctuation error correction and pass angle fluctuation error correction for each matching label, the correction follows the changes in the pass line fluctuation amount and the pass angle fluctuation amount in the plate. It can be performed.

ここで、パスライン変動誤差補正を実施した場合と実施しない場合の板厚の検出結果を図6−1に示す。図6−2に示すような200mmのパスライン変動が有った場合、この200mmのパスライン変動に対し、前述のパスライン変動誤差補正を実施することにより板厚誤差が板厚の0.9%から0.1%に軽減された。   Here, FIG. 6-1 shows the detection results of the plate thickness when the pass line fluctuation error correction is performed and when it is not performed. When there is a 200 mm pass line fluctuation as shown in FIG. 6B, the above-mentioned pass line fluctuation error correction is performed on the 200 mm pass line fluctuation to reduce the plate thickness error to 0.9. % To 0.1%.

次に、パスアングル変動誤差補正を実施した場合と実施しない場合の板厚(T=2mm)の検出結果を図7−1に示す。図7−2に示すような、5度のパスアングル変動が有った場合、この5度のパスアングル変動に対し、パスアングル変動誤差補正を実施することにより板厚誤差(板厚偏差)が板厚の1.97%から0.1%に軽減された。   Next, FIG. 7-1 shows the detection results of the plate thickness (T = 2 mm) when the pass angle variation error correction is performed and when it is not performed. When there is a 5 degree pass angle variation as shown in FIG. 7-2, a plate angle error (plate thickness deviation) is obtained by performing a path angle variation error correction for the 5 degree pass angle variation. The thickness was reduced from 1.97% to 0.1%.

以上説明したとおり、上記実施形態の厚みプロファイル測定装置によれば、パスライン変動およびパスアングル変動による誤差を補正した、より高精度な、被測定物3の幅方向の厚みプロファイルを測定することができる。   As described above, according to the thickness profile measuring apparatus of the above embodiment, it is possible to measure the thickness profile in the width direction of the DUT 3 with higher accuracy, in which errors due to the pass line fluctuation and the pass angle fluctuation are corrected. it can.

以上、本発明の実施形態を説明したが、上記実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。この新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。また、この実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   As mentioned above, although embodiment of this invention was described, the said embodiment was shown as an example and is not intending limiting the range of invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. Further, this embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1 検出部
2 制御部
3 被測定物
11 X線発生器
12 検出器
13 レーザ発振器
14 エリアCCDカメラ
21 パスライン変動量測定部
22 パスライン変動誤差補正部
23 パスアングル変動量測定部
24 パスアングル変動誤差補正部
25 パスライン変動誤差補正テーブル
DESCRIPTION OF SYMBOLS 1 Detection part 2 Control part 3 Measured object 11 X-ray generator 12 Detector 13 Laser oscillator 14 Area CCD camera 21 Pass line fluctuation measurement part 22 Pass line fluctuation error correction part 23 Pass angle fluctuation measurement part 24 Path angle fluctuation Error correction unit 25 Pass line fluctuation error correction table

Claims (5)

X線発生器と複数の電離箱を有する検出器とを備える検出部と、前記X線発生器から出力されるX線が物質を透過する際に、その物質の板厚、材質によってX線の減衰量が異なる特性を利用して、前記複数の電離箱による検出結果より板状の被測定物の幅方向の板厚を測定する制御部とを備える厚みプロファイル測定装置において、
前記検出器を通過する被測定物のパスライン変動量を求める第1変動量測定手段と、
前記第1変動量測定手段により求めた前記パスライン変動量を基に、パスライン変動による板厚の測定誤差を補正した板厚プロファイルを求める第1補正手段と、
を備えた厚みプロファイル測定装置。
A detection unit including an X-ray generator and a detector having a plurality of ionization chambers, and when X-rays output from the X-ray generator pass through the substance, In a thickness profile measuring apparatus comprising a control unit that measures the plate thickness in the width direction of a plate-like object to be measured from the detection results of the plurality of ionization chambers using characteristics with different attenuation amounts,
First fluctuation amount measuring means for obtaining a pass line fluctuation amount of an object passing through the detector;
First correction means for obtaining a plate thickness profile obtained by correcting a measurement error of the plate thickness due to pass line fluctuation based on the pass line fluctuation amount obtained by the first fluctuation amount measuring means;
A thickness profile measuring apparatus comprising:
板厚毎・パスライン変動量毎の補正量が設定されたパスライン変動誤差補正テーブルを備え、前記第1補正手段は、設定板厚および前記第1変動量測定手段により求めた前記パスライン変動量を基に、前記パスライン変動誤差補正テーブルの該当する補正値を用いて、前記パスライン変動による厚み誤差の補正を行う、請求項1に記載の厚みプロファイル測定装置。   A pass line fluctuation error correction table in which a correction amount is set for each plate thickness and for each pass line fluctuation amount, and the first correction means has the pass line fluctuation determined by the set plate thickness and the first fluctuation amount measuring means. The thickness profile measuring apparatus according to claim 1, wherein a thickness error due to the pass line fluctuation is corrected based on an amount, using a corresponding correction value in the pass line fluctuation error correction table. 前記検出器を通過する被測定物のパスアングル変動量を測定する第2変動量測定手段と、
前記第2変動量測定手段により求めた前記パスアングル変動量を基に、パスアングル変動による板厚の測定誤差を補正した板厚プロファイルを求める第2補正手段と、をさらに備えた請求項1または請求項2に記載の厚みプロファイル測定装置。
A second fluctuation amount measuring means for measuring a path angle fluctuation amount of the measurement object passing through the detector;
2. A second correction means for obtaining a plate thickness profile obtained by correcting a plate thickness measurement error due to the pass angle fluctuation based on the pass angle fluctuation amount obtained by the second fluctuation amount measuring means. The thickness profile measuring apparatus according to claim 2.
前記第1変動量測定手段および前記第2変動量測定手段はそれぞれ、前記複数の電離箱の各々の位置に対応して、前記パスライン変動量および前記パスアングル変動量を求め、前記第1補正手段および前記第2補正手段はそれぞれ、前記複数の電離箱の各々の位置に対応して、前記パスライン変動による板厚の測定誤差および前記パスアングル変動による板厚の測定誤差を補正した板厚プロファイルを求める、請求項3に記載の厚みプロファイル測定装置。   The first fluctuation amount measuring means and the second fluctuation amount measuring means obtain the pass line fluctuation amount and the pass angle fluctuation amount corresponding to the positions of the plurality of ionization chambers, respectively, and perform the first correction. And the second correcting means correct the plate thickness measurement error due to the pass line variation and the plate thickness measurement error due to the pass angle variation corresponding to the positions of the plurality of ionization chambers, respectively. The thickness profile measuring apparatus according to claim 3, wherein a profile is obtained. 前記第1変動量測定手段により求めたパスライン変動量、前記第2変動量測定手段により求めたパスアングル変動量、ならびに、前記第1補正手段および前記第2補正手段により補正した板厚の測定結果にラベリング処理を施すようにした請求項4に記載の厚みプロファイル測定装置。   Measurement of the pass line fluctuation amount obtained by the first fluctuation amount measurement means, the pass angle fluctuation amount obtained by the second fluctuation amount measurement means, and the plate thickness corrected by the first correction means and the second correction means. The thickness profile measuring apparatus according to claim 4, wherein the result is subjected to a labeling process.
JP2012163495A 2012-07-24 2012-07-24 Thickness profile measurement device Pending JP2014021099A (en)

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WO2022130582A1 (en) 2020-12-17 2022-06-23 Primetals Technologies Japan株式会社 Rolling equipment

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JPS5988610A (en) * 1982-11-12 1984-05-22 Fuji Electric Co Ltd Thickness gauge
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JP2006170883A (en) * 2004-12-17 2006-06-29 Toshiba Corp Thickness profile measuring device

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JPS587507A (en) * 1981-07-07 1983-01-17 Fuji Electric Co Ltd Thickness gage
JPS5973713A (en) * 1982-10-20 1984-04-26 Kawasaki Steel Corp Bus line fluctuation error correcting apparatus for radiation thickness gage
JPS5988610A (en) * 1982-11-12 1984-05-22 Fuji Electric Co Ltd Thickness gauge
JPS62285008A (en) * 1986-06-04 1987-12-10 Toshiba Corp Profile measuring apparatus
JP2006170883A (en) * 2004-12-17 2006-06-29 Toshiba Corp Thickness profile measuring device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022130582A1 (en) 2020-12-17 2022-06-23 Primetals Technologies Japan株式会社 Rolling equipment
KR20230034369A (en) 2020-12-17 2023-03-09 프리메탈스 테크놀로지스 재팬 가부시키가이샤 rolling equipment

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