JP2014017028A - Optical pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently carry out an aligning work for an optical axis in an optical pickup device.SOLUTION: The optical pickup device comprises: a housing having a bottom face and a side face and open on an upper face; a laser unit mounted in the housing and emitting a laser beam in a direction along the bottom face; an optical component mounted in the housing and disposed on an optical path of the laser beam; a connector connected to a control circuit; a laser driver outputting a drive signal to allow the laser unit to emit light in response to a control signal outputted from the control circuit; and a rigid substrate mounted in the housing to overlap the laser unit on an upper face side, on which a first conductive path for transmitting a control signal from the connector to the laser driver and a second conductive path for transmitting the drive signal from the laser driver to the laser unit are formed. The rigid substrate further includes a terminal on a surface on an opposite side to the surface opposing to the bottom face of the housing, the terminal conducted to the second conductive path for inputting the drive signal.

Description

  The present invention relates to an optical pickup apparatus that performs an operation of reading a signal recorded on an optical disc and an operation of recording a signal on the optical disc.

Along with recent technical progress, an optical pickup device that optically records and reproduces an optical signal using a laser beam with respect to an optical disc such as a DVD (Digital Versatile Disc) or a CD (Compact Disc) is progressing. .
For example, an optical pickup device generally called a slim type has a thickness of 12.7 mm, and an optical pickup device called an ultra slim type has a thickness of 9.5 mm.
Various techniques have been developed for thin optical pickup devices (see, for example, Patent Document 1).

JP 2010-073229 A

  In so-called thin optical pickup devices such as slim type and ultra slim type, information on optical discs using optical components such as lenses and mirrors, as well as optical components such as lenses and mirrors, in a housing with a predetermined height (12.7 mm or 9.5 mm) Flexible printed circuit board (hereinafter also referred to as FPC (Flexible Printed Circuit)) on which electronic parts such as a laser unit for recording and reading are recorded, and further, conductive paths for electrically connecting the electronic parts are formed. Etc. are stored in high density.

  These laser units and optical components are aligned in the optical axis after being assembled in the housing. At the time of this optical axis alignment, an optical pickup device is connected to a predetermined inspection device, and laser light is emitted from the laser unit by a control signal output from the inspection device.

  By the way, the optical pickup device and the inspection device are connected by connecting the FPC of the optical pickup device to the connector of the inspection device. The FPC is made of a resin film having a thickness of about several tens of micrometers. Therefore, it is difficult to eliminate the possibility of causing scratches or damage when attaching to or detaching from the inspection apparatus. Further, work time for connecting the FPC to the connector of the inspection apparatus and work time for removing the FPC also occur.

  For this reason, there is a need for a technique that can improve the efficiency of the optical axis alignment operation of the optical pickup device.

  The present invention has been made in view of the above problems, and an object thereof is to make it possible to improve the efficiency of the optical axis alignment work of the optical pickup device.

  An optical pickup device according to one aspect has a bottom surface and a side surface surrounding the bottom surface, a housing having an open top surface, and a laser beam mounted in the housing for recording and reading information on an optical disc. A laser unit that emits light in a direction along the bottom surface, an optical component that is mounted in the housing and disposed on the optical path of the laser light, and a connector that is connected to a control circuit that controls the laser unit; A laser driver that outputs a drive signal for causing the laser unit to emit the laser light in accordance with a control signal output from the control circuit, and is mounted on the housing so as to overlap the laser unit from the upper surface side. And a first conductive path for transmitting the control signal from the connector to the laser driver; A rigid board formed with a second conductive path for transmitting the drive signal from the driver to the laser unit, and the rigid board is further defined as a first surface facing the bottom surface of the housing The second surface on the opposite side is configured to have a terminal for conducting the second conductive path and inputting the drive signal.

  In addition, the problems disclosed by the present application and the solutions thereof will be clarified by the description in the column of the embodiment for carrying out the invention and the description of the drawings.

  It becomes possible to improve the efficiency of the optical axis alignment work of the optical pickup device.

It is a figure which shows the external appearance structure of an optical pick-up apparatus. It is a figure which shows the internal structure of an optical pick-up apparatus. It is a figure which shows the internal structure of an optical pick-up apparatus. It is a figure for demonstrating the optical system of an optical pick-up apparatus. It is a figure for demonstrating the optical system of an optical pick-up apparatus. It is a figure which shows the external appearance structure of a laser unit. It is a figure which shows the generation circuit of a laser beam. It is a figure which shows a laser driver. It is a figure which shows the terminal formed in a rigid board | substrate.

  At least the following matters will become apparent from the description of this specification and the accompanying drawings.

== Overall configuration of optical pickup device ==
An external configuration of an optical pickup device 1000 according to an embodiment of the present invention is shown in FIG. An exploded perspective view of the optical pickup device 1000 is shown in FIG. The internal configuration of the optical pickup device 1000 is shown in FIG. The configuration of the optical system of the optical pickup device 1000 is shown in FIGS.

  The optical pickup device 1000 is a device that performs reading operation of a signal recorded on the optical disc 5 and recording operation of the signal on the optical disc 5 by irradiating the optical disc 5 with laser light having a predetermined wavelength.

  The optical disk 5 is, for example, a BD (Blu-ray (registered trademark)) optical disk, a DVD (Digital Versatile Disc) standard optical disk, a CD (Compact Disc) standard optical disk, or the like.

  Although details will be described later, as shown in FIGS. 1 and 2, the optical pickup device 1000 according to the present embodiment has a bottom surface and a side surface surrounding the bottom surface, and has a predetermined inside of the housing 300 whose top surface is open. At the position, the laser unit 100 that emits laser light, the composite optical element 210, the polarizing beam splitter 220, the quarter wavelength plate 230, the collimator lens 240, the reflection mirror 250, the AS (AStigmatism) plate 270, the objective lens driving device 400 The first heat radiating plate 500, the second heat radiating plate 600, the printed circuit board 700, and the like are accommodated, the cover 800 is attached to the upper surface of the housing 300, and the cover 800 and the housing 300 are fixed with screws 301. .

  The first heat radiating plate 500 and the second heat radiating plate 600 are metal plates for effectively taking in and radiating heat generated from heat sources such as the laser unit 100 and a laser driver 180 described later.

  As shown in FIG. 2, the printed circuit board 700 includes a rigid circuit board portion 710 composed of a rigid circuit board and a flexible circuit board portion 720 composed of a flexible printed circuit board (FPC). The rigid board portion 710 and the flexible board portion 720 are each formed with a conductive path, but each conductive path is electrically connected as appropriate, and is formed to be a unified conductive path in the entire printed circuit board 700. Has been.

  Further, a connector 730 is attached to the rigid board portion 710. Connector 730 is provided with terminals that are respectively coupled to the respective conductive paths formed on printed circuit board 700. As shown in FIG. 1, the connector 730 is for a control circuit that is a flexible printed circuit board that is electrically connected to a main circuit board 2000 of a rigid printed circuit board in an optical disk device in which a control circuit of the optical pickup device 1000 is formed. The FPC 2100 is detachably connected.

  Further, as shown in FIG. 2, a photodetector 280 and a front monitor light receiving detector 290 described later are connected to the flexible substrate unit 720. The light detector 280 and the front monitor light reception detector 290 are configured to include a light sensor that receives the laser light emitted from the laser unit 100. The light detector 280 and the front monitor light reception detector 290 transmit a signal corresponding to the detected intensity of the laser light to the main board 2000 via the control circuit FPC 2100 connected to the connector 730.

  As shown in FIG. 2, the printed circuit board 700 is mounted on the housing 300 from the upper surface side of the housing 300 so as to overlap the laser unit 100. A substrate opening 711 is formed in the rigid substrate portion 710 at a portion facing the laser unit 100, and the rigid substrate portion 710 is mounted so that the laser unit 100 is inserted into the substrate opening 711.

  The housing 300 has a bottom surface and a side surface surrounding the bottom surface, and has an open top surface, and is formed of a metal such as a magnesium alloy or a synthetic resin such as PPS (polyphenylene sulfide).

  In FIG. 1, the Z axis is an axis along the direction of the rotation center axis 50 of the optical disk 5, and the direction from the optical pickup device 1000 toward the optical disk 5 is the + Z direction. The X axis is an axis along the direction in which the optical pickup device 1000 moves in the tracking direction of the optical disk 5 among the directions from the center of the optical disk 5 toward the outer periphery, and the direction away from the center of the optical disk 5 is the + X direction. The Y axis is an axis orthogonal to the Z axis and the X axis, and is an axis along the tangential direction of the optical disc 5.

== Optical system ==
The optical system of the optical pickup device 1000 in the present embodiment will be described with reference to FIGS.

  As an example, the optical pickup apparatus 1000 of the present embodiment performs recording and reproduction on the DVD standard optical disk 5 and the CD standard optical disk 5.

  Therefore, when performing recording and reproduction on the DVD standard optical disk 5, the laser unit 100 is a laser beam having a wavelength of 655 nm (first wavelength) in the red wavelength band (645 nm to 675 nm) corresponding to the DVD standard ( In the case of performing recording and reproduction on the CD standard optical disk 5 by emitting a first laser beam), for example, a wavelength of 785 nm (second wavelength) in the infrared wavelength band (765 nm to 805 nm) corresponding to the CD standard. ) Laser light (also referred to as second laser light). That is, the laser unit 100 selectively emits one of two types of laser beams (first laser beam and second laser beam) having different wavelengths.

  The laser unit 100 selectively outputs either the first laser beam or the second laser beam in accordance with a control signal output from the main board 2000.

  The laser light emitted from the laser unit 100 is irradiated onto the optical disk 5 from the objective lens 260 by various optical components 200 (210 to 290) housed in the housing 300 of the optical pickup device 1000, and then the reflected light is irradiated. Guided to the photodetector 280.

  FIG. 3 shows a state in which the optical component 200 constituting the optical system of the optical pickup device 1000 in this embodiment is housed in the housing 300.

  Specifically, in FIG. 3, a laser unit 100, a composite optical element 210, a polarizing beam splitter 220, a quarter-wave plate 230, a collimator lens 240, and a reflection mirror 250 (not shown in FIG. ), The objective lens 260, the AS plate 270, the light detector 280, and the front monitor light receiving detector 290 are mounted.

  The optical system of the optical pickup apparatus 1000 in this embodiment will be described with reference to FIGS.

  As described above, the laser unit 100 includes, for example, a wavelength of 655 nm in the red wavelength band (645 nm to 675 nm) applied to the DVD standard optical disk 5 and an infrared wavelength band (765 nm to 805 nm) applied to the CD standard optical disk 5. ), For example, one of two types of laser beams having different wavelengths such as a wavelength of 785 nm is selectively generated.

  The laser unit 100 includes a laser chip 110 described later. The laser chip 110 is formed with a first laser diode 111 having a first light emitting part for generating a first laser light and a second laser diode 112 having a second light emitting part for generating a second laser light. .

  The first or second laser light selectively emitted from the laser unit 100 is incident on the composite optical element 210. The composite optical element 210 includes a half-wave plate 211 and a diffraction grating 212.

  The half-wave plate 211 converts the laser light emitted from the laser unit 100 into S-polarized linearly polarized light with respect to the polarizing beam splitter 220, for example.

  The diffraction grating 212 separates the laser light emitted from the laser unit 100 into three beams of a 0th order light beam, a + 1st order diffracted light beam, and a −1st order diffracted light beam.

  For example, the polarization beam splitter 220 reflects most of the S-polarized laser light in the red wavelength band and the infrared wavelength band, and transmits part of the S-polarized laser light in the red wavelength band and the infrared wavelength band. The polarization beam splitter 220 transmits most of the P-polarized laser light in the red wavelength band and the infrared wavelength band, for example.

  Therefore, the polarization beam splitter 220 reflects most of the S-polarized laser light in the red wavelength band or the infrared wavelength band incident from the composite optical element 210 in the direction of the quarter wavelength plate 230, and a part of the front monitor. The light passes in the direction of the light receiving detector 290.

  The front monitor light receiving detector 290 is an optical component that is used to receive the laser light transmitted through the polarization beam splitter 220 and adjust the intensity of the laser light emitted from the laser unit 100. The front monitor light receiving detector 290 outputs a monitor signal that changes according to the intensity of the detected laser light to a predetermined terminal of the connector 730 via a conductive path formed in the flexible substrate portion 720 and the rigid substrate portion 710. To do. The monitor signal is transmitted to the main board 2000 via the control circuit FPC 2100 connected to the connector 730.

  Based on the monitor signal, the control circuit of the main board 2000 outputs a control signal so that the laser light output from the laser unit 100 has a predetermined intensity. This control signal is input from the main board 2000 to a predetermined terminal of the connector 730 via the control circuit FPC 2100, and then passed through a laser driver 180 (details will be described later) attached to the rigid board portion 710. 100 is input.

  The quarter wavelength plate 230 converts the laser light incident from the polarization beam splitter 220 from S-polarized linearly polarized light to circularly polarized light. The quarter-wave plate 230 converts the return light of the laser light incident from the collimator lens 240 from circularly polarized light to P-polarized linearly polarized light.

  The collimator lens 240 converts the laser light incident as diffused light from the quarter wavelength plate 230 into parallel light.

  The reflection mirror 250 reflects the laser light incident from the collimator lens 240 in the direction of the objective lens 260. The reflection mirror 250 reflects the return light of the laser light incident from the objective lens 260 in the direction of the collimator lens 240.

  The objective lens 260 focuses the laser light incident from the reflection mirror 250 on the signal recording layer on the recording surface of the optical disc 5.

  The objective lens 260 is held by the objective lens driving device 400 as shown in FIG. The objective lens driving device 400 includes an actuator 410 and a lens holder 420. Based on a control signal transmitted from a control circuit of the main board 2000 that controls the optical pickup device 1000, the actuator 410 detects the position of the lens holder 420 and the like. By controlling the direction, focusing control, tracking control, and the like are performed so that the laser light passing through the objective lens 260 attached to the lens holder 420 is appropriately applied to the signal recording layer of the optical disc 5.

  The return light of the laser light reflected by the signal recording layer of the optical disk 5 is converted into parallel light by the objective lens 260, then passes through the collimator lens 240 through the reflection mirror 250, and is circularly polarized by the quarter wavelength plate 230. To P-polarized linearly polarized light.

  The return light of the laser light that has become P-polarized light passes through the polarization beam splitter 220 and enters the AS plate 270.

  The AS plate 270 generates astigmatism in the return light of the laser beam that has passed through the polarization beam splitter 220 and focuses it on the photodetector 280. The AS plate 270 is configured, for example, by tilting a parallel plate in a predetermined direction in consideration of the astigmatism generation direction.

  The photodetector 280 detects the return light of the laser light incident from the AS plate 270. The light detector 280 is configured to include a light receiving unit that receives the return light of the laser light separated into three beams by the diffraction grating 212, and reads information recorded on the signal recording layer of the optical disc 5. A reproduction signal for performing, a focus error signal for performing focusing control, and a tracking error signal for performing tracking control are generated. These reproduction signal, focus error signal, and tracking error signal are transmitted to the main board 2000.

  As described above, the optical pickup apparatus 1000 according to the present embodiment can cope with recording and reproduction of a DVD and also with recording and reproduction of a CD.

== Laser unit ==
Next, the laser unit 100 according to the present embodiment will be described in detail with reference to FIG.
As shown in FIG. 6, the laser unit 100 according to the present embodiment includes a frame portion 120, a resin mold portion 130, a laser chip 110, a submount 150, a first input terminal 141, and a second input terminal 142. And a third input terminal 143.

  The frame portion 120, the resin mold portion 130, the laser chip 110, and the submount 150 are collectively referred to as a main body portion. In this case, the laser unit 100 has a structure in which laser light is emitted from the main body, and the first input terminal 141, the second input terminal 142, and the third input terminal 143 extend from the main body.

  The frame part 120 is made of a substantially flat plate made of metal, and a submount 150 made of a dielectric is attached. The laser chip 110 is fixed to the submount 150. The frame unit 120 is grounded via the second input terminal 142.

  The laser chip 110 is configured by forming, for example, a first laser diode 111 that emits first laser light and a second laser diode 112 that emits second laser light on a crystal substrate of GaAs (gallium arsenide). The The laser chip 110 selectively emits the first laser light and the second laser light in a direction along the bottom surface of the housing 300.

  The first input terminal 141 and the third input terminal 143 are input terminals for inputting a drive signal of the laser unit 100 output from the laser driver 180. The second input terminal 142 is grounded.

  The first input terminal 141, the second input terminal 142, and the third input terminal 143 extend from the resin mold part 130 in a direction opposite to the laser light emission direction.

  Further, the laser unit 100 is mounted on the housing 300, and then the rigid board portion 710 is mounted on the housing 300 so as to overlap the laser unit 100. At this time, the first input terminal 141 and the second input terminal of the laser unit 100 are connected. The input terminal 142 and the third input terminal 143 are soldered to conductive paths formed in the rigid board portion 710, respectively. The first input terminal 141 and the third input terminal 143 are electrically connected to the main board 2000 via the control circuit FPC 2100, and the second input terminal 142 is grounded.

  When the first drive signal is input between the first input terminal 141 and the second input terminal 142 from the laser driver 180, the laser unit 100 emits the first laser light in the red wavelength band from the first laser diode 111. The laser unit 100 emits the second laser beam in the infrared wavelength band from the second laser diode 112 when the second drive signal is input from the laser driver 180 between the third input terminal 143 and the second input terminal 142. To do.

  The first drive signal and the second drive signal are signals having a predetermined voltage for causing the laser unit 100 to emit the first laser beam and the second laser beam.

  The resin mold part 130 is a synthetic resin formed so as to cover a part of both surfaces of the frame part 120. The resin mold part 130 fixes the first input terminal 141 and the third input terminal 143, and insulates the first input terminal 141 and the frame part 120, and the third input terminal 143 and the frame part 120, respectively. To do.

  In addition, the resin mold portion 130 has a wall surface surrounding the laser chip 110 so as to surround three directions except the direction in which the laser light is emitted.

  As described above, the second input terminal 142 and the frame portion 120 are connected so as to be conductive. For example, the second input terminal 142 and the frame portion 120 are integrally formed.

  Next, the laser unit 110 and the laser driver 180 will be described with reference to FIG.

  As shown in FIG. 7, the laser unit 110 and the laser driver 180 are mounted on the rigid board part 710 by soldering. The laser unit 110 and the laser driver 180 are connected by a conductive path formed in the rigid substrate portion 710 and constitute a circuit for emitting laser light. FIG. 8 shows a state where the laser driver 180 is mounted on the rigid board portion 710.

  The laser driver 180 outputs a drive signal for causing the laser unit 100 to emit laser light in accordance with a control signal output from the main board 2000.

  More specifically, the laser driver 180 outputs a first drive signal for causing the laser unit 100 to emit the first laser light in response to a first control signal output from the main board 2000 and outputs it from the main board 2000. In response to the second control signal, the laser unit 100 outputs a second drive signal for emitting the second laser beam.

  In addition, the laser unit 100 emits laser light for recording and reading information on the optical disc 5 in a direction along the bottom surface of the housing 300 in accordance with a drive signal output from the laser driver 180.

  More specifically, the laser unit 100 emits the first laser light having the first wavelength from the first laser diode 111 in response to the first drive signal output from the laser driver 180, and is output from the laser driver 180. In response to the two drive signals, the second laser light having a second wavelength longer than the first wavelength is emitted from the second laser diode 112.

  The connector 730 attached to the rigid board unit 710 is connected to the main board 2000 that controls the laser unit 100, and the first control signal and the second control signal output from the main board 2000 are sent to the laser driver 180. introduce.

  The rigid board portion 710 has a first conductive path 751 for transmitting a first control signal from the connector 730 to the laser driver 180, and a second conductive path 752 for transmitting a first drive signal from the laser driver 180 to the laser unit 100. And formed.

  Further, a fifth conductive path 755 that transmits a second control signal from the connector 730 to the laser driver 180 and a sixth conductive path 756 that transmits a second drive signal from the laser driver 180 to the laser unit 100 are provided in the rigid board portion 710. And formed.

  Further, a third conductive path 753 for providing a ground voltage to the laser unit 100 and a fourth conductive path 754 for providing a power supply voltage for causing the laser driver 180 to function to the laser driver 180 are formed in the rigid substrate unit 710. It becomes.

  As described above, the main substrate 2000 outputs a predetermined control signal when emitting laser light, and this control signal is input to the laser unit 100 via the laser driver 180 on the rigid substrate unit 710.

  Specifically, first, the laser driver 180 starts its function when a power supply voltage is applied via the connector 730.

  Then, when the main substrate 2000 outputs a first control signal to emit the first laser beam, the first control signal is input to the laser driver 180. The laser driver 180 outputs a first drive signal between the first input terminal 141 and the second input terminal 142 of the laser unit 100. Then, the laser unit 100 emits the first laser beam from the first laser diode 111.

  When the main board 2000 outputs a second control signal for emitting the second laser light, the second control signal is input to the laser driver 180. The laser driver 180 outputs a second drive signal between the third input terminal 143 and the second input terminal 142 of the laser unit 100. Then, the laser unit 100 emits the second laser light from the second laser diode 112.

  As described above, the optical pickup device 1000 of the present embodiment emits laser light by using the laser unit 100 and the laser driver 180. For this reason, the laser unit 100 and the laser driver 180 of this embodiment function as a laser beam generating element.

  In addition, as shown in FIG. 7, the rigid substrate unit 710 according to the present embodiment is formed with a first terminal 741, a second terminal 742, and a third terminal 743 (hereinafter also collectively referred to as a laser lighting terminal 740). ing.

  As shown in FIG. 9, these laser lighting terminals 741, 742, and 743 are provided on a surface (second surface) opposite to the surface (first surface) facing the bottom surface of the housing 300 of the rigid board portion 710. Surface, that is, a surface facing the cover 800).

  The laser lighting terminals 741, 742, and 743 are formed by a conductive pattern such as a land formed on the surface of the second surface of the rigid substrate portion 710.

  The first terminal 741 is formed so as to conduct to a second conductive path 752 that transmits the first drive signal output from the laser driver 180 to the laser unit 100.

  The second terminal 742 is formed to conduct to a third conductive path 753 that provides a ground voltage to the laser unit 100.

  The third terminal 743 is formed to be electrically connected to a fourth conductive path 754 that provides the laser driver 180 with a power supply voltage for causing the laser driver 180 to function.

== Optical axis alignment ==
As described above, when the optical pickup device 1000 is manufactured, various optical components 200 (210 to 290) such as the laser unit 100 and the composite optical element 210 are assembled in the housing 300, and then these optical axes are assembled. Matching is done.

  When performing optical axis alignment, it is necessary to actually emit laser light from the laser unit 100 in the housing 300, but the optical pickup device 1000 according to the present embodiment has a configuration as shown in FIGS. Laser lighting terminals 741, 742, and 743 are formed on the rigid substrate portion 710.

  For this reason, in the optical pickup device 1000 according to the present embodiment, a drive signal is input to the laser unit 100 using these laser lighting terminals 741, 742, and 743, so that the inspection device or the like for emitting laser light can receive light. Without connecting the pickup device 1000, the laser unit 100 can emit laser light to perform the optical axis alignment operation.

  Specifically, the first laser light can be emitted from the laser unit 100 by inputting the first drive signal to the first terminal 741 of the rigid board portion 710 during the optical axis alignment operation.

  As a result, the optical axis alignment operation of the optical pickup device 1000 can be facilitated, and the operation time can be shortened.

  The laser unit according to the present embodiment can emit a first laser beam having a first wavelength and a second laser beam having a second wavelength longer than the first wavelength, but the first laser having a short wavelength. Light has less tolerance for optical axis misalignment. Therefore, by performing optical axis alignment using the first laser beam having a short wavelength as in the present embodiment, the quality of the recording / reproducing process of the optical disc 5 using the first laser beam is maintained, and the second laser beam is used. This eliminates the need for optical axis alignment work using the optical axis, thereby reducing the work load of optical axis alignment.

  Further, it is more preferable that the optical axis alignment operation is performed in a state where the power voltage of the laser driver 180 is applied to the third terminal 743 and the laser driver 180 is functioned.

  That is, by applying a power supply voltage to the laser driver 180, the internal circuit of the laser driver 180 can be put into a working state, and the output impedance of the first terminal 741 of the laser driver 180 can be kept high. The first drive signal input between the second terminals 742 can be reliably supplied between the first terminal 141 and the second terminal 142 of the laser unit 100, and the first laser diode 111 is reliably made to emit light to align the optical axis. Work can be done. Moreover, it is possible to prevent the laser driver 180 from being damaged by bringing the laser driver 180 into an operating state.

  Further, although not shown, a fourth terminal 744 that is electrically connected to a sixth conductive path 756 for transmitting the second drive signal to the third input terminal 143 of the laser unit 100 is formed on the rigid substrate portion 710. May be.

  In this case, the second laser light is emitted from the second laser diode 112 of the laser unit 100 by inputting the second drive signal between the fourth terminal 744 and the second terminal 742 of the rigid substrate unit 710. Can do.

  As a result, the optical axis alignment operation when the optical axis alignment operation of the optical pickup apparatus 1000 is performed using the second laser light can be facilitated, and the operation time can be shortened.

  In addition, the optical axis alignment operation of the optical pickup device 1000 can be performed using the second laser light instead of using the first laser light. In this case, it is possible to improve the quality of recording and reproduction of the optical disk 5 by the second laser light.

  As described above, the optical pickup device 1000 of this embodiment is configured by mounting the cover 800 on the housing 300 so as to cover the rigid board portion 710.

  For this reason, after the cover 800 is attached to the housing 300, the laser lighting terminals 741, 742, and 743 can be prevented from being exposed to the outside. For example, foreign matters such as metal pieces can be exposed to the laser lighting terminals 741, 742, and 743. It is possible to prevent a malfunction that causes the laser unit 100 and the laser driver 180 to malfunction by being in contact with each other.

  The optical pickup apparatus 1000 according to the present embodiment has been described above. However, according to the optical pickup apparatus 1000 according to the present embodiment, the optical axis alignment work of the optical pickup apparatus 1000 can be made efficient.

  In the above embodiment, as an example of the laser unit 100, the case of a dual wavelength laser corresponding to DVD and CD has been described. However, a Blu-ray Disc using a blue-violet wavelength band of 395 nm to 420 nm (for example, 405 nm) is used. A three-wavelength laser adapted to the (registered trademark) standard may be used, or a one-wavelength laser or a two-wavelength laser corresponding to any one or two of them may be used.

  In the above-described embodiment, the slim type (height 12.7 mm) or ultra slim type (height 9.5 mm) optical pickup apparatus 1000 has been described as an example. However, in the optical pickup apparatus 1000 of other thicknesses (for example, thinner), There may be.

  The embodiments of the present invention described above are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The present invention can be changed and improved without departing from the gist thereof, and equivalents thereof are also included in the present invention.

5 Optical disc 50 Rotating shaft 100 Laser unit 110 Laser chip 111 First laser diode 112 Second laser diode 120 Frame portion 130 Resin mold portion 140 Input terminal 141 First input terminal 142 Second input terminal 143 Third input terminal 150 Submount 180 Laser driver 200 Optical component 210 Compound optical element 211 1/2 wavelength plate 212 Diffraction grating 220 Polarizing beam splitter 230 1/4 wavelength plate 240 Collimator lens 250 Reflecting mirror 260 Objective lens 270 AS plate 280 Photo detector 290 Front monitor light receiving detector 300 Housing 301 Screw 400 Objective lens driving device 410 Actuator 420 Lens holder 500 First heat sink 600 Second heat sink 700 Printed circuit board 710 Rigid circuit board portion 711 Open circuit board Part 720 Flexible board part 730 Connector 740 Laser lighting terminal 741 First terminal 742 Second terminal 743 Third terminal 751 First conductive path 752 Second conductive path 753 Third conductive path 754 Fourth conductive path 755 Fifth conductive path 756 Sixth conductive path 800 Cover 1000 Optical pickup device 2000 Main board 2100 FPC for control circuit

Claims (6)

A housing having a bottom surface and a side surface surrounding the bottom surface, the top surface being open;
A laser unit that is mounted in the housing and emits laser light in a direction along the bottom surface for recording and reading information on an optical disc;
An optical component mounted in the housing and disposed on the optical path of the laser beam;
A connector connected to a control circuit for controlling the laser unit;
A laser driver that outputs a drive signal for causing the laser unit to emit the laser light in accordance with a control signal output from the control circuit;
A first conductive path which is mounted on the housing so as to overlap the laser unit from the upper surface side and which transmits the control signal from the connector to the laser driver, and the drive signal from the laser driver to the laser unit A second conductive path for transmitting
With
The rigid board further has a terminal on the second surface opposite to the first surface facing the bottom surface of the housing, the terminal being connected to the second conductive path and for inputting the drive signal. An optical pickup device configured as described above. The optical pickup device according to claim 1,
The rigid substrate further includes a third conductive path for providing a ground voltage to the laser unit, and is electrically connected to the first terminal as the terminal and the third conductive path on the second surface. And a second terminal for providing a ground voltage to the laser unit. The optical pickup device according to claim 1 or 2,
The rigid substrate further includes a fourth conductive path for providing the laser driver with a power supply voltage for causing the laser driver to function, and the second surface includes a first terminal serving as the terminal. An optical pickup device comprising: a third terminal that is conductive to the fourth conductive path and provides a power supply voltage to the laser driver. The optical pickup device according to claim 1,
The laser unit selectively emits a first laser beam having a first wavelength and a second laser beam having a second wavelength longer than the first wavelength;
The laser driver outputs a first drive signal for causing the laser unit to emit the first laser light in response to a first control signal output from the control circuit, and a second output from the control circuit. Outputting a second drive signal for emitting the second laser light from the laser unit in response to a control signal;
The rigid board includes: the first conductive path that transmits the first control signal from the connector to the laser driver; the second conductive path that transmits the first drive signal from the laser driver to the laser unit; The fifth conductive path for transmitting the second control signal from the connector to the laser driver and the sixth conductive path for transmitting the second drive signal from the laser driver to the laser unit are formed. A characteristic optical pickup device. The optical pickup device according to claim 4,
The rigid board is further formed with a first terminal as the terminal and a fourth terminal for inputting the second drive signal, which is conducted to the sixth conductive path, on the second surface. An optical pickup device characterized by comprising: The optical pickup device according to claim 1,
An optical pickup device further comprising a cover attached to the housing so as to cover the rigid substrate from the upper surface side of the housing.

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