JP2014013178A - Electronic device, electronic module, electronic apparatus and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device that suppresses vibration leakage due to a spurious mode.SOLUTION: An electronic device comprises: a vibration substrate that has front and rear surfaces and comprises two vibration arms disposed in parallel, a first base portion for coupling two vibration arms at one ends thereof, a second base portion for coupling the two vibration arms at the other ends thereof, and an electrode pad electrically connected to the two vibration arms on a surface where widths of the two vibration arms extend in an extension direction of the vibration arms; a first substrate connected to the front surface of the vibration substrate; and a second substrate connected to the rear surface of the vibration substrate. As viewed in a plan view from a direction of the first substrate connected to the vibration substrate, the electrode pad is disposed at a position exposed from the first substrate.

Description

  The present invention relates to an electronic device, an electronic module, an electronic apparatus, and a moving object.

  2. Description of the Related Art Conventionally, electronic devices such as pressure sensors that detect the magnitude of a force applied to a passive element are known that use a double tuning fork piezoelectric vibration element formed on a substrate as a passive element. A double tuning fork piezoelectric vibration element is a passive element that vibrates and flexibly vibrates in a shape in which the free ends of two tuning fork type piezoelectric vibration elements are connected to each other. The double tuning fork piezoelectric vibrating element includes two vibrating arms in parallel between two bases, an excitation electrode, and an extraction electrode on the vibrating arm. The lead electrode is connected to a wiring for extracting the oscillation of the double tuning fork piezoelectric vibration element to the outside. Patent Document 1 discloses that a lead electrode is provided at a corner portion of a substrate on which a double tuning fork piezoelectric vibration element is formed.

JP 2010-243207 A

  However, due to the piezoelectric bending vibration of the double tuning fork piezoelectric vibration element, a twisting phenomenon repeatedly occurs on the substrate on which the double tuning fork piezoelectric vibration element is formed, and the amount of displacement of the substrate accompanying the twist increases at the corner of the substrate. . Therefore, when the extraction electrode swings with the displacement of the substrate, the disconnection of the wiring connected to the extraction electrode and the vibration due to the displacement of the substrate are conducted to the wiring, so that the outside of the double tuning fork piezoelectric vibration element. There was a problem that vibration leakage occurred. In addition, there is a problem in that a vibration frequency change due to a force applied to the double tuning fork piezoelectric vibration element cannot be accurately detected due to vibration leakage.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic device according to this application example has front and back surfaces, two vibrating arms arranged in parallel, a first base connected at one end of the two vibrating arms, and the other of the two vibrating arms. A vibration substrate comprising: a second base coupled at an end; and an electrode pad electrically connected to the vibration arm on a surface on which a width of the two vibration arms extends in the extending direction of the vibration arm; An electrode pad comprising a first substrate connected to the front surface of the substrate and a second substrate connected to the back surface of the vibration substrate, and when viewed in plan from the direction of the first substrate connected to the vibration substrate Is arranged at a position exposed from the first substrate.

  According to such an electronic device, two vibrating arms are arranged in parallel on the vibrating substrate, and the vibrating arms and the electric arms are arranged in a region on the surface where the width of the two vibrating arms extends in the extending direction of the vibrating arms. Connected electrode pads. This region becomes a node (fulcrum) of parasitic vibration of the vibration substrate that is generated when the vibrating arm vibrates in a piezoelectric manner. Thereby, by providing the electrode pad in the region, it is possible to suppress the swing of the electrode pad due to the parasitic vibration of the vibration substrate. Accordingly, it is possible to suppress the parasitic vibration of the vibration substrate from being transmitted to the wiring connected to the electrode pad and leaking to the outside of the vibration substrate. Moreover, it is possible to prevent the wiring connected to the electrode pad from being disconnected due to parasitic vibration.

[Application Example 2]
The electronic device according to this application example has front and back surfaces, two vibrating arms arranged in parallel, a first base connected at one end of the two vibrating arms, and at the other end of the two vibrating arms. A vibration substrate having a second base to be connected and an electrode pad electrically connected to the vibration arm on a surface extending in a direction in which the two vibration arms are arranged, and connected to the surface of the vibration substrate The electrode pads are exposed from the first substrate when viewed in plan from the direction of the first substrate connected to the vibration substrate. It is arrange | positioned in the position which is located.

  According to such an electronic device, on the vibrating substrate, two vibrating arms are arranged in parallel, and the electrode is electrically connected to the vibrating arm in a region on the surface extending in the direction in which the vibrating arms are arranged. Has a pad. This region becomes a node (fulcrum) of parasitic vibration of the vibration substrate that is generated when the vibrating arm vibrates in a piezoelectric manner. Thereby, by providing the electrode pad in the region, it is possible to suppress the swing of the electrode pad due to the parasitic vibration of the vibration substrate. Accordingly, it is possible to suppress the parasitic vibration of the vibration substrate from being transmitted to the wiring connected to the electrode pad and leaking to the outside of the vibration substrate. Moreover, it is possible to prevent the wiring connected to the electrode pad from being disconnected due to parasitic vibration.

[Application Example 3]
In the electronic device according to the application example, two vibrating arms are accommodated in an internal space formed by the first substrate, the second substrate, and the vibrating substrate, and the first base and the second base are connected to the first substrate. It is characterized by that.

  According to such an electronic device, the force applied to the first substrate is transmitted to the first base and the second base included in the vibration substrate connected to the first substrate, and the first base and the second base The force can be transmitted to the two vibrating arms connected by. Thereby, the bending vibration of the vibrating arm is changed, and the change of the force applied to the first substrate can be detected by detecting the change.

[Application Example 4]
An electronic module according to this application example includes the above-described electronic device, a package having a recess in which the electronic device is accommodated, and an electrode pad provided on a vibration substrate provided in the package and the electronic device is electrically connected by wiring. It is connected.

  According to such an electronic module, in the mounted electronic device, the electrode pad and the package provided in a region serving as a node (fulcrum) of the parasitic vibration of the vibration substrate generated when the vibrating arm undergoes piezoelectric bending vibration are wired. Are electrically connected. Thereby, the oscillation of the electrode pad due to the parasitic vibration of the vibration substrate is suppressed, and it is possible to suppress the parasitic vibration from being transmitted to the wiring connecting the electrode pad and the package to leak the vibration to the package. Further, disconnection of the wiring connected to the electrode pad can be suppressed. Therefore, by suppressing vibration leakage to the package, it is possible to improve detection accuracy such as pressure detected in the electronic module, and to obtain a highly reliable electronic module that suppresses disconnection of wiring due to parasitic vibration.

[Application Example 5]
An electronic apparatus according to this application example is characterized in that the above-described electronic module is mounted.

  According to such an electronic device, it is possible to obtain an electronic device in which the detection accuracy such as pressure is improved by mounting the above-described electronic module.

[Application Example 6]
The moving body according to this application example is characterized in that the electronic module described above is mounted.

  According to such a moving body, it is possible to obtain a moving body with improved detection accuracy such as pressure by mounting the electronic module described above.

1 is a perspective view schematically showing a schematic configuration of an electronic device according to a first embodiment. FIG. 3 is a cross-sectional view schematically showing a schematic configuration of the electronic device according to the first embodiment. FIG. 3 is a plan view schematically showing a vibration substrate of the electronic device according to the first embodiment. The figure which shows the twist of the vibration board | substrate by the spurious mode which concerns on 1st Embodiment. FIG. 3 is a schematic diagram showing an operation of the electronic device according to the first embodiment. The perspective view which shows typically schematic structure of the electronic device which concerns on 2nd Embodiment. The side view which shows typically schematic structure of the electronic device which concerns on 2nd Embodiment. The top view which shows typically schematic structure of the electronic device which concerns on 2nd Embodiment. The schematic diagram which shows arrangement | positioning of the excitation electrode provided in the double tuning fork vibration element which concerns on 2nd Embodiment. The figure which shows schematic structure of the electronic module which concerns on 3rd Embodiment. FIG. 6 is a schematic diagram illustrating an electronic apparatus according to an example. FIG. 6 is a schematic diagram illustrating an electronic apparatus according to an example. FIG. 6 is a schematic diagram illustrating an electronic apparatus according to an example. The schematic diagram which shows the mobile body which concerns on an Example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure shown below, the size and ratio of each component may be described differently from the actual component in order to make each component large enough to be recognized on the drawing. is there. Further, an XYZ rectangular coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ rectangular coordinate system. A predetermined direction in the vertical plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the vertical plane is defined as a Y-axis direction, and a direction orthogonal to the X-axis direction and the Y-axis direction is defined as a Z-axis direction. In addition, with the gravitational direction as a reference, the gravitational direction is a downward direction, and the reverse direction is an upward direction.

(First embodiment)
The electronic device according to the first embodiment is shown in FIGS.
FIG. 1 is a perspective view showing a schematic configuration when the electronic device 10a is viewed in perspective, and shows the first substrate 100, the second substrate 200, and the vibration substrate 300 that are connected separately.
FIG. 2 is a schematic view showing a cross section taken along line AA of electronic device 10a shown in FIG. FIG. 3 is a plan view of the surface 300 a of the vibration substrate 300. FIG. 4 is a diagram illustrating the displacement of the vibration substrate 300 in the spurious mode. FIG. 5 is a schematic view showing an operation when pressure is applied to the electronic device 10a.
The electronic device 10a according to the first embodiment will be described with reference to FIGS.

(Configuration of electronic device)
As shown in FIG. 1, the electronic device 10 a of this embodiment includes a first substrate 100, a second substrate 200, and a vibration substrate 300. In the electronic device 10a, the front surface 300a of the vibration substrate 300 and the first substrate 100 are connected, and the back surface 300b of the vibration substrate 300 and the second substrate 200 are connected and integrated. The first substrate 100 is connected to the vibration substrate 300 so as not to overlap with the extraction electrode 360 provided on the surface 300a of the vibration substrate 300.

  The electronic device 10a is configured as a device that detects a pressure applied to the electronic device 10a. In this embodiment, the 1st board | substrate 100 becomes a structure bent according to a pressure as a diaphragm which receives a pressure.

As shown in FIG. 2, the first substrate 100 includes convex portions 110, 111, and 112, and the top surfaces 110 a, 111 a, and 112 a are connected to the surface 300 a of the vibration substrate 300. The first substrate 100 and the vibration substrate 300 are connected (bonded) with, for example, vanadium-based low-melting glass.
The first substrate 100 of this embodiment is formed using, for example, a quartz substrate. However, the present invention is not limited to this, and a glass substrate, a silicon substrate, or the like whose thermal expansion coefficient approximates that of a quartz substrate may be used.

As shown in FIG. 2, the second substrate 200 is provided with a concave portion 210 that becomes a space when the first substrate 100, the vibration substrate 300, and the second substrate 200 are connected, and the top surface 210 a is the vibration substrate 300. Is connected to the rear surface 300b. Similar to the connection between the first substrate 100 and the vibration substrate 300, the connection between the second substrate 200 and the vibration substrate 300 is performed (bonded) with low-melting glass.
The second substrate 200 of the present embodiment is formed using a quartz substrate as with the first substrate 100. Further, the present invention is not limited to a quartz substrate, and a glass substrate or a silicon substrate whose thermal expansion coefficient approximates that of a quartz substrate may be used.

  As shown in FIG. 2, the vibration substrate 300 includes an extraction electrode 360 as an electrode pad on the surface 300a. The extraction electrode 360 is provided on the surface 300 a of the vibration substrate 300 so as not to overlap the first substrate 100 when the vibration substrate 300 and the first substrate 100 are connected.

(Configuration of vibration substrate)
Here, the configuration of the vibration substrate 300 will be described. The vibration substrate 300 shown in FIG. 3 is provided with a double tuning fork piezoelectric vibration element (hereinafter referred to as “double tuning fork vibration element”) 350. The double tuning fork vibrating element 350 includes a first base 351a, a second base 351b, and two vibrating arms 353a, 353b arranged in parallel between the first base 351a and the second base 351b. The double tuning fork vibrating element 350 includes excitation electrodes 370a and 370b on vibrating arms 353a and 353b, and an extraction electrode 360 extending from the excitation electrodes 370a and 370b (370) is provided on the surface 300a. In the following description, the excitation electrode 370 is used as a general term for the excitation electrodes 370a and 370b.

  Voltages having opposite polarities are applied to the excitation electrodes 370a and 370b provided on the vibrating arms 353a and 353b of such a double tuning fork vibrating element 350, respectively. Thus, the centers of the vibrating arms 353a and 353b in the longitudinal direction of the vibrating arms 353a and 353b orthogonal to the central axis L (extending direction) in the extending direction of the vibrating arms 353a and 353b of the double tuning fork vibrating element 350. Symmetric piezoelectric bending vibration can be excited in the vibrating arms 353a and 353b in the direction in which the axis S extends, that is, in the direction in which the vibrating arms 353a and 353b are arranged.

Here, the spurious mode (parasitic vibration) of the vibration substrate 300 generated by the piezoelectric bending vibration will be described. FIG. 4 shows the result of an experiment conducted by the inventors of the present invention regarding the spurious mode of the vibration substrate 300. FIG. 4 is a diagram illustrating a twisted state (displacement) of the vibration substrate 300 by a spurious mode that is generated when the double tuning fork vibration element 350 included in the vibration substrate 300 performs piezoelectric bending vibration.
Note that the twist (displacement) of the vibration substrate 300 due to the spurious mode extends to the first substrate 100 and the second substrate 200 connected to the vibration substrate 300. For convenience of explanation, only the vibration substrate 300 will be described with reference to FIG.

In the spurious mode by piezoelectric bending vibration, when piezoelectric bending vibration is started, as shown in FIG. 4A, the vertices α and γ which are diagonally related to the vibration substrate 300 are in the −Z axis direction, and the vibration substrate 300 The vertices β and σ in a diagonal relationship are displaced (twisted) in the + Z-axis direction. Next, as shown in FIG. 4B, the vertices α and γ are displaced (twisted) in the + Z-axis direction and the vertices β and σ are displaced in the −Z-axis direction. The spurious mode due to the piezoelectric bending vibration is vibration in which the vibration substrate 300 repeats these two displacements (twisting).
Here, the spurious mode by the piezoelectric bending motion is displaced in the ± Z-axis direction with the central axis L of the vibrating arms 353a and 353b provided in parallel as shown in FIGS. 4 (a) and 4 (b). It is vibration. Further, the vibration is displaced in the ± Z-axis direction with a central axis S orthogonal to the central axis L of the vibrating arms 353a and 353b provided in parallel as a fulcrum. From this, it has been found by experiments by the inventors that the vibration substrate 300 is less displaced (twisted) by the spurious mode on the axis along which the central axis L and the central axis S extend.
Therefore, in the present embodiment, the extraction electrode 360 is provided in the region of the surface 300a of the vibration substrate 300 around the central axis L.

Returning to FIG. 3, the arrangement of the extraction electrode 360 provided on the surface 300a of the vibration substrate 300 will be described.
The extraction electrode 360 is a longitudinal direction of the double tuning fork vibrating element 350 and has two extension lines extending from the width dimension of the vibrating arms 353a and 353b around the central axis L in the extending direction of the vibrating arms 353a and 353b. It is provided in a region between 353L. Wiring 511 (not shown in FIG. 3) for extracting oscillation of the double tuning fork vibrating element 350 is provided by providing the extraction electrode 360 in a region around the central axis L where the displacement of the vibration substrate 300 due to the spurious mode is suppressed. Can be prevented from being disconnected due to displacement (twisting) of the vibration substrate 300. Further, it is possible to suppress the vibration of the double tuning fork vibrating element 350 from leaking to the wiring 511 (not shown in FIG. 3) for extracting the oscillation of the double tuning fork vibrating element 350 from leaking.
Note that the center line L, the center line S, and the extension line 353L are virtual lines illustrated for the description of the present embodiment, and do not actually exist.

(Operation of electronic device)
Here, the operation of the electronic device 10a will be described. FIG. 5 schematically shows a state in which the pressure indicated by the arrow P is applied to the electronic device 10a. The pressure is received by the first substrate 100 that functions as a diaphragm. By applying the pressure in the −Z axis direction, the first substrate 100 between the convex portions 111 and 112 bends according to the pressure in the direction in which the pressure is applied, that is, in the −Z axis direction. When the first substrate 100 is bent, a tension is generated in which the first base 351a of the double tuning fork vibrating element 350 is in the −Y axis direction (arrow Wa) and the second base 351b is in the + Y axis direction (arrow Wb). As a result, tension is applied to the vibrating arms 353a and 353b of the double tuning fork vibrating element 350 provided between the first base 351a and the second base 351b, and the vibration frequency (oscillation) of the piezoelectric bending vibration changes. Thereby, the pressure can be detected.

According to the first embodiment described above, the following effects can be obtained.
According to such an electronic device 10a, the center line L extending in the extending direction of the vibrating arms 353a and 353b provided on the vibrating substrate 300 becomes a node (fulcrum) of vibration due to the spurious mode of the vibrating substrate 300, On the center line L, the displacement of the vibration substrate 300 due to the spurious mode is suppressed. Therefore, by providing the extraction electrode 360 between the extension lines 353L around the center line L, the oscillation of the extraction electrode 360 is suppressed, and vibration is conducted to the wiring connected to the extraction electrode 360. Leakage outside can be suppressed. Moreover, it can suppress that the wiring connected to the extraction electrode 360 is cut | disconnected.

(Second Embodiment)
An electronic device according to the second embodiment is shown in FIGS.
FIG. 6 is a perspective view showing a schematic configuration when the electronic device 10b is seen in perspective, and shows the first substrate 100, the second substrate 200, and the vibration substrate 300 that are connected separately. FIG. 7 is a schematic diagram illustrating a side surface of the electronic device 10b illustrated in FIG. 6 as viewed from the X-axis direction. FIG. 8 is a plan view of the surface 300 a of the vibration substrate 300. FIG. 9 is a schematic diagram showing the arrangement of excitation electrodes provided in the double tuning fork vibrating element.
The electronic device 10b of the present embodiment is different from the electronic device 10a described in the first embodiment in the arrangement position of the extraction electrode 360 provided on the vibration substrate 300. Since the other points are the same as those of the electronic device 10a, the same reference numerals are given to the same components, and the description will be omitted or simplified. The electronic device 10b according to the second embodiment will be described below with reference to FIGS.

(Configuration of electronic device)
As shown in FIG. 6, the electronic device 10 b of this embodiment includes a first substrate 100, a second substrate 200, and a vibration substrate 300. In the electronic device 10b, the front surface 300a of the vibration substrate 300 and the first substrate 100 are connected, and the back surface 300b of the vibration substrate 300 and the second substrate 200 are connected and integrated. The first substrate 100 is connected to the vibration substrate 300 so as not to overlap with the extraction electrode 360 provided on the surface 300a of the vibration substrate 300.

  As shown in FIG. 7, the vibration substrate 300 includes an extraction electrode 360 on the surface 300a. The extraction electrode 360 is provided on the surface 300 a of the vibration substrate 300 so as not to overlap the first substrate 100 when the vibration substrate 300 and the first substrate 100 are connected. Further, the second substrate 200 is connected to the back surface 300 b of the vibration substrate 300.

(Configuration of vibration substrate)
Here, the configuration of the vibration substrate 300 will be described. The vibration substrate 300 shown in FIG. 8 is provided with a double tuning fork vibration element 350 as in the vibration substrate 300 described in the electronic device 10a. The double tuning fork vibrating element 350 includes excitation electrodes 370a and 370b on the vibrating arms 353a and 353b, and an extraction electrode 360 extending from the excitation electrode 370 is provided on the surface 300a.

  In such an electronic device 10b, similarly to the electronic device 10a described above, voltages having opposite polarities are applied to the excitation electrodes 370a and 370b provided on the vibrating arms 353a and 353b of the double tuning fork vibrating element 350, respectively. As a result, the double tuning fork vibrating element 350 excites symmetrical bending vibrations of the vibrating arms 353a and 353b in the direction in which the central axis S of the vibrating arms 353a and 353b extends, that is, the direction in which the vibrating arms 353a and 353b are arranged. be able to.

Here, the excitation electrode 370 formed on the vibrating arms 353a and 353b of the double tuning fork vibrating element 350 will be described in detail. FIG. 9 schematically shows the arrangement of the excitation electrode 370 by enlarging the double tuning fork vibrating element 350.
FIG. 9A is an enlarged schematic view of a portion of the double tuning fork vibrating element 350 provided on the vibration substrate 300. FIG. 9B is a diagram illustrating the polarity of the voltage applied to the excitation electrode 370 of the double tuning fork vibrating element 350. FIG. 9C is a schematic view showing a cross section of the line segment BB in FIG. 9B.

The vibrating arm 353a of the double tuning fork vibrating element 350 is provided with three divided excitation electrodes 371a, 372a, and 373a. The vibrating arm 353b is provided with excitation electrodes 371b, 372b, and 373b divided into three. In the description of the present embodiment, these are collectively referred to as the excitation electrode 370. The excitation electrode 370 is divided at the vibration nodes of the vibrating arms 353a and 353b, and the excitation electrodes 370 are connected to each other so that a reverse polarity voltage is applied to the divided excitation electrodes 370 adjacent to each other. . FIG. 9C is a cross-sectional view taken along the line BB of FIG. 9B, and shows a method for connecting the excitation electrodes 370 provided on the front and back surfaces and both side surfaces of the vibrating arms 353a and 353b. is there. The vibrating arms 353a and 353b are arranged so as to connect the excitation electrodes 370 facing each other, connect the excitation electrodes 370 of the same polarity to each other, and be connected to the extraction electrode 360 as two terminals of a positive pole and a negative pole. .
When the excitation electrodes 370 are connected in this way, voltages having opposite polarities are applied to the corresponding excitation electrodes 370 of the vibrating arms 353a and 353b, and the centers in the direction in which the vibrating arms 353a and 353b of the double tuning fork vibrating element 350 are extended. Symmetric piezoelectric bending vibration can be excited in the direction of the central axis S orthogonal to the axis L, that is, in the direction in which the vibrating arms 353a and 353b are arranged.

  Returning to FIG. 8, the arrangement of the extraction electrode 360 provided on the surface 300a of the vibration substrate 300 will be described. The extraction electrode 360 is disposed in a region between two extending lines 353S extending from both ends of the vibrating arms 353a and 353b of the double tuning fork vibrating element 350 in the direction in which the vibrating arms 353a and 353b are arranged. More preferably, between the two extended lines 372S extending from the width of the excitation electrodes 372a and 372b, which are the centers of the excitation electrodes 370 provided by being divided into the vibrating arms 353a and 353b shown in FIG. The extraction electrode 360 is preferably disposed in the region to be formed. The extraction electrode 360 can be provided in a region where the displacement of the vibration substrate 300 by the spurious mode described above with reference to FIG. 4 is small. Accordingly, it is possible to suppress the vibration of the double tuning fork vibrating element 350 from leaking to the outside of the vibration substrate 300 due to the conduction of vibration to the wiring 511 (see FIG. 10) for extracting the oscillation of the double tuning fork vibrating element 350. Note that the center line L, the center line S, and the extension lines 353S and 372S are virtual lines illustrated for explanation of the present embodiment and do not actually exist.

  Note that the arrangement of the two extraction electrodes 360 described in the first embodiment and the second embodiment on the surface 300a of the vibration substrate 300 may be appropriately changed depending on the configuration of the electronic devices 10a and 10b.

  For example, the extraction electrode 360 may be provided on the surface 300 a of the vibration substrate 300 in the −X axis direction from the point orthogonal to the central axis S in the central axis L of the double tuning fork vibrating element 350. In addition, the extraction electrode 360 may be provided on the surface 300a of the vibration substrate 300 in both the + X axis direction and the −X axis direction.

  Further, for example, the extraction electrode 360 has a surface 300a of the vibration substrate 300 in either the + Y axis direction or the −Y axis direction from the point orthogonal to the center axis L in the center axis S of the double tuning fork vibrating element 350. May be provided. In addition, the extraction electrode 360 may be provided on the surface 300a of the vibration substrate 300 in the + X-axis direction or the −X-axis direction of the central axis L and the + Y-axis direction or the −Y-axis direction of the central axis S.

According to the second embodiment described above, the following effects can be obtained.
According to such an electronic device 10b, the center line S of the vibrating arms 353a and 353b extending in the direction in which the vibrating arms 353a and 353b provided on the vibrating substrate 300 are aligned is a vibration node in the spurious mode of the vibrating substrate 300 ( The displacement (vibration) of the vibration substrate 300 due to the spurious mode is suppressed on the center line S.
Therefore, by providing the extraction electrode 360 between the extension lines 353S centering on the center line S extending in the direction in which the vibrating arms 353a and 353b are arranged, the extraction electrode 360 is prevented from swinging and connected to the extraction electrode 360. It is possible to prevent the vibration from being transmitted to the wiring to be leaked out of the vibration substrate 300. Further, it is possible to prevent the wiring joined to the extraction electrode 360 from being cut.

(Third embodiment)
An electronic module according to the third embodiment is shown in FIG.
FIG. 10 is a cross-sectional view showing a schematic configuration when the electronic module 50 is viewed in cross section, and shows a case where the electronic device 10a described above is mounted (accommodated). Although the electronic module 50 of this embodiment demonstrates the example which mounts the electronic device 10a as an example of the embodiment, you may mount the electronic device 10b mentioned above. Since the configuration of the mounted electronic device 10a is the same as that of the first embodiment, the same components are denoted by the same reference numerals, the description thereof is simplified or omitted, and the electronic module 50 of the present embodiment is illustrated. 10 will be used for explanation.

  The electronic module 50 includes an electronic device 10a and a package 500 on which the electronic device 10a is mounted. The package 500 includes a recess 530a in which the electronic device 10a is mounted and a recess 530b in which a drive circuit module 550 for driving the electronic device 10a is mounted. The package 500 of this embodiment is formed of a material such as ceramics.

  In the electronic module 50, the mounted electronic device 10a is provided on the bottom surface 531a of the recess 530a. In the electronic device 10a, the surface of the second substrate 200, which is the surface connected to the vibration substrate 300 constituting the electronic device 10a, and the bottom surface 531a are connected using an adhesive 540 or the like. Further, the drive circuit module 550 is connected to the recess 530b using the bottom surface 531b of the recess 530b and an adhesive 541 or the like.

  In addition, the package 500 is provided with a wiring electrode 510a in order to transmit an oscillation signal such as piezoelectric bending vibration output from the electronic device 10a to the outside of the package 500 or the drive circuit module 550. The wiring electrode 510a is electrically connected to the extraction electrode 360 provided on the vibration substrate 300 of the electronic device 10a by the wiring 511. The wiring 511 of the present embodiment electrically connects the extraction electrode 360 and the wiring electrode 510 using, for example, a gold (Au) wire by a wire bonding method. In addition, the wiring 511 is not limited to gold (Au) as a wire bonding method and the wire material of the wiring 511, but is electrically connected by other wiring methods using aluminum (Al), copper (Cu), or the like. You may do it. In addition, the electrode 551 provided in the drive circuit module 550 and the wiring electrode 510b are electrically connected to each other by, for example, a wire bonding method or the like by the wiring 512 similarly to the wiring 511.

  The electronic module 50 includes a lid 520 and is connected to the top surface 532 of the recess 530. The lid 520 has a conduction hole 521 for transmitting, for example, pressure fluctuation of air (atmosphere) to be measured to the electronic device 10a mounted in the recess 530.

  Thus, the electronic module 50 detects the pressure by the electronic device 10a mounted in the recess 530a, and outputs the change in the piezoelectric bending vibration of the double tuning fork vibrating element 350 according to the pressure to the outside of the package 500 as an oscillation signal. Can do. Further, since vibration due to the spurious mode of the electronic device 10 a is suppressed from leaking to the package 500 through the wiring 511, a change in piezoelectric bending vibration due to a slight pressure change can be output to the outside of the package 500. .

According to the third embodiment described above, the following effects can be obtained.
According to such an electronic module 50, the vibration arms 353 a and 353 b of the electronic devices 10 a and 10 b described above are provided in a region serving as a node (fulcrum) of vibration due to the spurious mode of the vibration substrate 300 generated by piezoelectric bending vibration. The lead electrode 360 and the wiring electrode 510 provided in the package 500 are electrically connected by the wiring 511.
As a result, the swinging of the extraction electrode 360 provided on the vibration substrate 300 of the electronic devices 10a and 10b is suppressed, and parasitic vibration is conducted to the wiring 511 connecting the extraction electrode 360 and the wiring electrode 510a. Can be prevented from leaking. Therefore, by suppressing vibration leakage to the package 500, the detection accuracy of the pressure and the like detected in the electronic module 50 is improved, and a highly reliable electronic module 50 in which disconnection of the wiring 511 due to parasitic vibration is suppressed is obtained. it can.

(Example)
Next, examples in which the electronic module 50 according to an embodiment of the present invention is applied will be described with reference to FIGS. 11 to 14.

[Electronics]
First, an electronic apparatus to which an electronic module 50 equipped with electronic devices 10a and 10b according to an embodiment of the present invention is applied will be described in detail with reference to FIGS.

  FIG. 11 is a perspective view schematically illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including an electronic module according to an embodiment of the present invention. In this figure, a notebook personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1008. The display unit 1106 is connected to the main body portion 1104 via a hinge structure portion. And is rotatably supported. Such a notebook personal computer 1100 incorporates an electronic module (pressure sensor) 50 that functions as a pressure sensor for detecting opening and closing of the display unit 1106.

  FIG. 12 is a perspective view schematically illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic device according to the embodiment of the invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates an electronic module (pressure sensor) 50 that functions as an atmospheric pressure sensor or the like.

FIG. 13 is a perspective view illustrating a schematic configuration of a digital still camera as an electronic apparatus including the vibration element according to the embodiment of the invention. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.
A display unit 1308 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1308 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.
When the photographer confirms the subject image displayed on the display unit 1308 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1310. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1310 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates an electronic module (pressure sensor) 50 that functions as an atmospheric pressure sensor or the like.

  The electronic module 50 according to an embodiment of the present invention is not limited to the personal computer (mobile personal computer) in FIG. 11, the mobile phone in FIG. 12, and the digital still camera in FIG. (For example, inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations , Video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices , Instruments (e.g., Two, aircraft, gauges of a ship), can be applied to electronic equipment such as a flight simulator.

[Moving object]
FIG. 14 is a perspective view schematically showing an automobile as an example of a moving body. The automobile 1500 is equipped with an electronic module 50 including the electronic devices 10a and 10b according to the present invention. For example, as shown in the figure, an automobile 1500 as a moving body has an electronic control unit 1508 that incorporates an electronic module 50 and controls the driving of a tire 1509 mounted on a vehicle body 1507. In addition, the electronic module 50 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine The present invention can be widely applied to electronic control units (ECUs) such as controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  DESCRIPTION OF SYMBOLS 10 ... Electronic device, 50 ... Electronic module, 100 ... 1st board | substrate, 200 ... 2nd board | substrate, 300 ... Vibration board, 350 ... Double tuning fork vibration element, 360 ... Extraction electrode, 370 ... Excitation electrode, 500 ... Package, 510 ... Wiring electrodes, 511... Wiring, 550... Drive circuit module, 1100... Personal computer, 1200.

Claims (6)

Two vibrating arms having front and back surfaces, arranged in parallel, a first base connected at one end of the two vibrating arms, a second base connected at the other end of the two vibrating arms, and A vibrating substrate comprising an electrode pad electrically connected to the vibrating arm on the surface where the width of the two vibrating arms extends in the extending direction of the vibrating arm;
A first substrate connected to the surface of the vibration substrate;
A second substrate connected to the back surface of the vibration substrate,
The electronic device, wherein the electrode pad is disposed at a position exposed from the first substrate when viewed in plan from the direction of the first substrate connected to the vibration substrate. Two vibrating arms having front and back surfaces, arranged in parallel, a first base connected at one end of the two vibrating arms, a second base connected at the other end of the two vibrating arms, and A vibrating substrate including an electrode pad electrically connected to the vibrating arm on the surface extending in a direction in which the two vibrating arms are arranged;
A first substrate connected to the surface of the vibration substrate;
A second substrate connected to the back surface of the vibration substrate,
The electronic device, wherein the electrode pad is disposed at a position exposed from the first substrate when viewed in plan from the direction of the first substrate connected to the vibration substrate.   The two vibrating arms are accommodated in an internal space constituted by the first substrate, the second substrate, and the vibrating substrate, and the first base and the second base are connected to the first substrate. The electronic device according to claim 1, wherein the electronic device is an electronic device. An electronic module on which the electronic device according to any one of claims 1 to 3 is mounted,
A package having a recess accommodating the electronic device;
An electronic module, wherein the package and the electrode pad provided on the vibration substrate provided in the electronic device are electrically connected by wiring.   An electronic device comprising the electronic module according to claim 4.   A moving body comprising the electronic module according to claim 4 mounted thereon.