JP2014011385A - Electronic device, electronic apparatus, and manufacturing method of electronic device - Google Patents

Electronic device, electronic apparatus, and manufacturing method of electronic device Download PDF

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JP2014011385A
JP2014011385A JP2012148520A JP2012148520A JP2014011385A JP 2014011385 A JP2014011385 A JP 2014011385A JP 2012148520 A JP2012148520 A JP 2012148520A JP 2012148520 A JP2012148520 A JP 2012148520A JP 2014011385 A JP2014011385 A JP 2014011385A
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Prior art keywords
electronic device
circuit board
flexible circuit
generating component
heat
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Shizuaki Masuda
靜昭 増田
Kikuo Wada
喜久男 和田
Jiichi Hino
滋一 樋野
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HINO JISSO SEKKEI KK
NEC Platforms Ltd
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HINO JISSO SEKKEI KK
NEC AccessTechnica Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of detecting a temperature of a heating component even through the heating component, which generates heat by electrification, does not have a temperature detection function.SOLUTION: An electronic device includes: a heating component 1 which generates heat by electrification; a flexible circuit board 3 on which the heating component 1 is mounted, the flexible circuit board 3 which is bent so as to enclose the heating component 1; and a thermocouple 2 fixed to the flexible circuit board 3 near the heating component 1.

Description

本発明は、通電によって発熱する発熱部品を可撓性回路基板で包み込んだ構造を有する電子デバイス、その電子デバイスを備えている電子機器、およびその電子デバイスの製造方法に関する。   The present invention relates to an electronic device having a structure in which a heat-generating component that generates heat when energized is wrapped with a flexible circuit board, an electronic apparatus including the electronic device, and a method for manufacturing the electronic device.

通電によって発熱する発熱部品の一つに半導体チップがある。近年、半導体チップを可撓性回路基板で包み込んだ構造を有する３次元実装型半導体装置が提案されている（特許文献１参照）。３次元実装型半導体装置では、一般的に、可撓性回路基板が半導体チップの端部に沿って折り曲げられる。これにより、半導体チップが可撓性回路基板に包み込まれる。３次元実装型半導体装置では、可撓性回路基板の平面積（外形サイズ）が半導体チップと同等になる。そのため、装置の小型化を実現できるというメリットがある。   One of the heat generating components that generate heat when energized is a semiconductor chip. In recent years, a three-dimensional mounting type semiconductor device having a structure in which a semiconductor chip is wrapped with a flexible circuit board has been proposed (see Patent Document 1). In a three-dimensional mounting type semiconductor device, generally, a flexible circuit board is bent along an end portion of a semiconductor chip. As a result, the semiconductor chip is wrapped in the flexible circuit board. In the three-dimensional mounting type semiconductor device, the plane area (outer size) of the flexible circuit board is equal to that of the semiconductor chip. Therefore, there is an advantage that the apparatus can be downsized.

国際公開第２００９／０３１８６９号International Publication No. 2009/031869

通電によって発熱する発熱部品は、発熱温度が許容範囲を超えると誤動作する可能性が高くなる。そのため、発熱部品を有する電子デバイスは、発熱部品の温度を検出する機能を備えることが望ましい。しかし、上述した３次元実装型半導体装置のように可撓性回路基板に発熱部品が包み込まれた電子デバイスには、一般的に、発熱部品の温度を検出する機能は備わっていない。発熱部品が半導体チップの場合には、温度検出用のダイオードを半導体チップに形成する技術で対処できる。しかし、発熱部品が温度検出用のダイオードを形成するスペースを確保できない半導体チップ、または受動部品（例えば、コイル、抵抗）などの場合には、発熱部品の温度を検出することができない。   A heat-generating component that generates heat when energized is more likely to malfunction if the heat generation temperature exceeds an allowable range. Therefore, it is desirable that an electronic device having a heat generating component has a function of detecting the temperature of the heat generating component. However, an electronic device in which a heat generating component is encapsulated in a flexible circuit board, such as the above-described three-dimensional mounting type semiconductor device, generally does not have a function of detecting the temperature of the heat generating component. When the heat-generating component is a semiconductor chip, it can be dealt with by a technique for forming a temperature detecting diode on the semiconductor chip. However, the temperature of the heat generating component cannot be detected when the heat generating component is a semiconductor chip or a passive component (for example, a coil or a resistor) in which a space for forming a temperature detecting diode cannot be secured.

そこで、本発明は、可撓性回路基板に包み込まれている発熱部品が温度検出機能を備えていなくてもその発熱部品の温度を検出することが可能な電子デバイス、その電子デバイスを備えた電子機器、およびその電子デバイスの製造方法を提供することを目的とする。   Therefore, the present invention provides an electronic device capable of detecting the temperature of a heat generating component encased in a flexible circuit board even if the heat generating component does not have a temperature detection function, and an electronic device including the electronic device. It is an object to provide a device and a method for manufacturing the electronic device.

上記目的を達成するため、本発明の電子デバイスは、通電により発熱する発熱部品と、前記発熱部品が搭載され、前記発熱部品を包み込むように折り曲げられている可撓性回路基板と、前記発熱部品の近傍で前記可撓性回路基板に固定されている熱電対と、を有する。   In order to achieve the above object, an electronic device of the present invention includes a heat generating component that generates heat when energized, a flexible circuit board on which the heat generating component is mounted and bent so as to wrap the heat generating component, and the heat generating component. And a thermocouple fixed to the flexible circuit board.

上記目的を達成するため、本発明の電子機器は、上記電子デバイスと、前記熱電対と電気的に接続され、前記熱電対の熱起電力に基づいて温度を計測する温度計測部と、を有する。   In order to achieve the above object, an electronic apparatus of the present invention includes the electronic device, and a temperature measurement unit that is electrically connected to the thermocouple and measures a temperature based on a thermoelectromotive force of the thermocouple. .

上記目的を達成するため、本発明の電子デバイスの製造方法は、通電により発熱する発熱部品を、該発熱部品よりも平面積が広い可撓性回路基板に搭載する工程と、前記発熱部品を包み込むように前記可撓性回路基板を折り曲げる工程と、前記可撓性回路基板を折り曲げたときに前記発熱部品の近傍となる位置で熱電対を前記可撓性回路基板に固定する工程と、を有する。   In order to achieve the above object, an electronic device manufacturing method according to the present invention includes a step of mounting a heat generating component that generates heat upon energization on a flexible circuit board having a larger plane area than the heat generating component, and enveloping the heat generating component. Bending the flexible circuit board, and fixing the thermocouple to the flexible circuit board at a position near the heat-generating component when the flexible circuit board is bent. .

本発明によれば、可撓性回路基板に包み込まれている発熱部品が温度検出機能を備えていなくてもその発熱部品の温度を検出することが可能となる。   According to the present invention, it is possible to detect the temperature of the heat generating component even if the heat generating component encapsulated in the flexible circuit board does not have a temperature detection function.

実施形態１の電子機器の断面図である。1 is a cross-sectional view of an electronic device according to a first embodiment. 実施形態１の電子機器の断面図である。1 is a cross-sectional view of an electronic device according to a first embodiment. 図１に示す可撓性回路基板の断面図である。It is sectional drawing of the flexible circuit board shown in FIG. 発熱部品が可撓性回路基板に搭載された状態を示す断面図である。It is sectional drawing which shows the state in which the heat-emitting component was mounted in the flexible circuit board. 発熱部品が可撓性回路基板に搭載された状態を示す上面図である。It is a top view which shows the state in which the heat-emitting component was mounted in the flexible circuit board. 発熱部品の上面に熱電対が載せられた状態を示す断面図である。It is sectional drawing which shows the state in which the thermocouple was mounted on the upper surface of a heat-emitting component. 発熱部品の上面に熱電対が載せられた状態を示す上面図である。It is a top view which shows the state in which the thermocouple was mounted on the upper surface of a heat-emitting component. 発熱部品が可撓性回路基板に包み込まれ、かつ熱電対が可撓性回路基板に固定された状態を示す断面図である。It is sectional drawing which shows the state in which the heat-emitting component was wrapped in the flexible circuit board, and the thermocouple was fixed to the flexible circuit board. 実施形態１の電子デバイスの断面図である。1 is a cross-sectional view of an electronic device according to a first embodiment. コネクタを介して熱電対を温度計測部に電気的に接続させる形態を示す断面図である。It is sectional drawing which shows the form which electrically connects a thermocouple to a temperature measurement part via a connector. 実施形態２の電子デバイスの断面図である。FIG. 6 is a cross-sectional view of an electronic device according to a second embodiment. 実施形態３の電子デバイスの断面図である。FIG. 6 is a cross-sectional view of an electronic device according to a third embodiment. 実施形態３の電子デバイスの上面図である。FIG. 6 is a top view of an electronic device according to a third embodiment. 実施形態４の電子デバイスの断面図である。FIG. 6 is a cross-sectional view of an electronic device according to a fourth embodiment. 実施形態５の電子デバイスの断面図である。FIG. 10 is a cross-sectional view of an electronic device according to a fifth embodiment. 実施形態６の電子デバイスの断面図である。FIG. 10 is a cross-sectional view of an electronic device according to a sixth embodiment. 実施形態７の電子デバイスの断面図である。FIG. 10 is a cross-sectional view of an electronic device according to a seventh embodiment. 図１７に示す電子デバイスを有する電子機器の断面図である。It is sectional drawing of the electronic device which has an electronic device shown in FIG.

（実施形態１）
本発明の実施形態１について説明する。図１は、実施形態１の電子機器の断面図である。図１に示す電子機器１００では、電子デバイス１０１が実装基板５に搭載されている。図２は、実施形態１の電子デバイス１０１の上面図である。電子デバイス１０１では、通電により発熱する平板状の発熱部品１が可撓性回路基板３に包み込まれている。発熱部品１には、例えば、半導体チップ、半導体チップが収容された電子部品、受動部品などが挙げられる。半導体チップが収容された電子部品には、ＣＰＵ（Central Processing Unit）、半導体メモリ、ＩＣ（Integrated Circuit）などが挙げられる。受動部品には、例えば、コンデンサ、抵抗、コイルなどが挙げられる。 (Embodiment 1)
A first embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of the electronic apparatus according to the first embodiment. In the electronic device 100 shown in FIG. 1, the electronic device 101 is mounted on the mounting substrate 5. FIG. 2 is a top view of the electronic device 101 according to the first embodiment. In the electronic device 101, a flat plate-like heat generating component 1 that generates heat when energized is enclosed in a flexible circuit board 3. Examples of the heat generating component 1 include a semiconductor chip, an electronic component in which the semiconductor chip is accommodated, and a passive component. Examples of electronic components in which a semiconductor chip is housed include a CPU (Central Processing Unit), a semiconductor memory, and an IC (Integrated Circuit). Examples of the passive component include a capacitor, a resistor, and a coil.

可撓性回路基板３には、発熱部品１の温度を検出するための熱電対２が固定されている。熱電対２の先端部では、互いに異なる２種類の金属線が接合されている。本実施形態では、熱電対２の先端部は発熱部品１に接触している。熱電対２の後端部は、パッド１３に電気的に接続されている。パッド１３は、配線６を通じて温度計測部７に電気的に接続されている。パッド１３、配線６、および温度計測部７は、実装基板５に搭載されている。熱電対２には、発熱部品１の温度に対応した熱起電力が生じる。温度計測部７は、熱電対２の熱起電力に基づいて温度を計測する。   A thermocouple 2 for detecting the temperature of the heat generating component 1 is fixed to the flexible circuit board 3. Two different types of metal wires are joined at the tip of the thermocouple 2. In the present embodiment, the tip of the thermocouple 2 is in contact with the heat generating component 1. The rear end portion of the thermocouple 2 is electrically connected to the pad 13. The pad 13 is electrically connected to the temperature measurement unit 7 through the wiring 6. The pad 13, the wiring 6, and the temperature measurement unit 7 are mounted on the mounting substrate 5. A thermoelectromotive force corresponding to the temperature of the heat generating component 1 is generated in the thermocouple 2. The temperature measurement unit 7 measures the temperature based on the thermoelectromotive force of the thermocouple 2.

図３は、図１に示す可撓性回路基板３の断面図である。図３に示す可撓性回路基板３は、折り曲げられる前の状態（平板状の状態）である。可撓性回路基板３は絶縁層１６を有する。絶縁層１６の片面には、外部電極１０が形成され、絶縁層１５が積層されている。絶縁層１６のもう片面には、外部電極１２が形成され、絶縁層１７が積層されている。本実施形態の可撓性回路基板３は、２つの配線層を有する構造であるが、配線層数は１つまたは３つ以上であってもよい。   FIG. 3 is a cross-sectional view of the flexible circuit board 3 shown in FIG. The flexible circuit board 3 shown in FIG. 3 is in a state before being bent (a flat plate state). The flexible circuit board 3 has an insulating layer 16. The external electrode 10 is formed on one surface of the insulating layer 16, and the insulating layer 15 is laminated. On the other surface of the insulating layer 16, the external electrode 12 is formed, and the insulating layer 17 is laminated. The flexible circuit board 3 of the present embodiment has a structure having two wiring layers, but the number of wiring layers may be one or three or more.

外部電極１０は、発熱部品１と電気的に接続される。外部電極１２は、球体の外部端子４（図１参照）に電気的に接続される。本実施形態では、外部端子４にはＳｎＡｇＣｕはんだボールが用いられている。   The external electrode 10 is electrically connected to the heat generating component 1. The external electrode 12 is electrically connected to a spherical external terminal 4 (see FIG. 1). In the present embodiment, SnAgCu solder balls are used for the external terminals 4.

絶縁層１５の表面９には、接着層１４が形成されている。本実施形態では、接着層１４には、熱可塑性樹脂の接着シートが用いられている。接着層１４には、熱電対２が接着される。   An adhesive layer 14 is formed on the surface 9 of the insulating layer 15. In the present embodiment, a thermoplastic resin adhesive sheet is used for the adhesive layer 14. The thermocouple 2 is bonded to the adhesive layer 14.

以下、本実施形態の電子機器の製造方法について説明する。   Hereinafter, the manufacturing method of the electronic device of this embodiment will be described.

まず、可撓性回路基板３の外部電極１０（図３参照）の上にフラックスまたはクリームはんだが塗布される。その後、フリップチップ実装マウンター、およびチップマウンターを用いて、発熱部品１が外部電極１０の上に搭載される。図４は、発熱部品１が可撓性回路基板３に搭載された状態を示す断面図である。図５は、発熱部品１が可撓性回路基板３に搭載された状態を示す上面図である。   First, flux or cream solder is applied on the external electrode 10 (see FIG. 3) of the flexible circuit board 3. Thereafter, the heat generating component 1 is mounted on the external electrode 10 using a flip chip mounting mounter and a chip mounter. FIG. 4 is a cross-sectional view showing a state where the heat generating component 1 is mounted on the flexible circuit board 3. FIG. 5 is a top view showing a state in which the heat generating component 1 is mounted on the flexible circuit board 3.

可撓性回路基板３に搭載された発熱部品１の上面には熱電対２が載せられる。図６は、発熱部品１の上面に熱電対２が載せられた状態を示す断面図である。図７は、発熱部品１の上面に熱電対２が載せられた状態を示す上面図である。   A thermocouple 2 is placed on the upper surface of the heat generating component 1 mounted on the flexible circuit board 3. FIG. 6 is a cross-sectional view showing a state where the thermocouple 2 is placed on the upper surface of the heat generating component 1. FIG. 7 is a top view showing a state where the thermocouple 2 is placed on the top surface of the heat generating component 1.

次に、可撓性回路基板３は、所定の温度に加熱されたヒーターステージ上に吸着固定される。その後、加圧ツールを用いて可撓性回路基板３を発熱部品１の一対の端面１８で折り曲げる。これにより端面１８に隣接する発熱部品１の両面が可撓性回路基板３に覆われる。このとき、熱電対２が可撓性回路基板３の接着層１４（図３参照）に接着する。図８は、発熱部品１が可撓性回路基板３に包み込まれ、かつ熱電対２が可撓性回路基板３に固定された状態を示す断面図である。   Next, the flexible circuit board 3 is adsorbed and fixed on a heater stage heated to a predetermined temperature. Thereafter, the flexible circuit board 3 is bent at the pair of end surfaces 18 of the heat generating component 1 using a pressurizing tool. Thereby, both surfaces of the heat generating component 1 adjacent to the end surface 18 are covered with the flexible circuit board 3. At this time, the thermocouple 2 is bonded to the adhesive layer 14 (see FIG. 3) of the flexible circuit board 3. FIG. 8 is a cross-sectional view showing a state in which the heat generating component 1 is encased in the flexible circuit board 3 and the thermocouple 2 is fixed to the flexible circuit board 3.

その後、可撓性回路基板３における外部電極１２（図３参照）がおよび裏面１１（絶縁層１７の表面）に外部端子４が形成される。これにより、電子デバイス１０１が完成する。図９は、電子デバイス１０１の断面図である。   Thereafter, the external electrode 12 (see FIG. 3) and the external terminal 4 are formed on the back surface 11 (the surface of the insulating layer 17) in the flexible circuit board 3. Thereby, the electronic device 101 is completed. FIG. 9 is a cross-sectional view of the electronic device 101.

最後に、マウンターで電子デバイス１０１が実装基板５に搭載され、リフロー装置で電子デバイス１０１が実装基板５にはんだ接続される。その後、熱電対２の後端部がパッド１３にはんだ接続される。これにより、図１に示す電子機器１００が完成する。   Finally, the electronic device 101 is mounted on the mounting substrate 5 by the mounter, and the electronic device 101 is soldered to the mounting substrate 5 by the reflow apparatus. Thereafter, the rear end portion of the thermocouple 2 is soldered to the pad 13. Thereby, the electronic device 100 shown in FIG. 1 is completed.

上述した本実施形態の電子デバイス１０１では、熱電対２が発熱部品１の近傍で可撓性回路基板３に固定されている。そのため、発熱部品１が温度検出機能を備えていなくても、熱電対２で発熱部品１の温度を検出することが可能となる。特に、本実施形態の電子デバイス１０１では、熱電対２が発熱部品１に接触しているので、発熱部品１の温度をより正確に検出することが可能となる。   In the electronic device 101 of this embodiment described above, the thermocouple 2 is fixed to the flexible circuit board 3 in the vicinity of the heat generating component 1. Therefore, even if the heat generating component 1 does not have a temperature detection function, the temperature of the heat generating component 1 can be detected by the thermocouple 2. In particular, in the electronic device 101 of this embodiment, since the thermocouple 2 is in contact with the heat generating component 1, the temperature of the heat generating component 1 can be detected more accurately.

本実施形態の電子デバイス１０１では、熱電対２は、実装基板５に形成されたパッド１３を介して温度計測部７に電気的に接続されている。本発明では、図１０に示すようにコネクタ１９を介して熱電対２を温度計測部７に電気的に接続させる形態であってもよい。   In the electronic device 101 of the present embodiment, the thermocouple 2 is electrically connected to the temperature measurement unit 7 via the pad 13 formed on the mounting substrate 5. In the present invention, as shown in FIG. 10, the thermocouple 2 may be electrically connected to the temperature measurement unit 7 via the connector 19.

本実施形態の電子デバイス１０１では、熱電対２は発熱部品１の上面に接触している。本発明では、熱電対２が発熱部品１の下面または側面に接触する形態であってもよい。   In the electronic device 101 of the present embodiment, the thermocouple 2 is in contact with the upper surface of the heat generating component 1. In this invention, the form which the thermocouple 2 contacts the lower surface or side surface of the heat-emitting component 1 may be sufficient.

（実施形態２）
本発明の実施形態２について説明する。以下、上述した実施形態１と異なる点を中心に説明する。図１１は、実施形態２の電子デバイスの断面図である。図１１では、実施形態１で説明した構成要素と同様の構成要素については同じ符号を付している。 (Embodiment 2)
A second embodiment of the present invention will be described. Hereinafter, a description will be given focusing on differences from the first embodiment. FIG. 11 is a cross-sectional view of the electronic device of the second embodiment. In FIG. 11, the same components as those described in the first embodiment are denoted by the same reference numerals.

発熱部品１が半導体チップの場合、半導体チップは簡単に折り曲げられる。そのため発熱部品１が破壊しやすいことが懸念される。そこで、本実施形態の電子デバイス１０２では、図１１に示すように補強部材８が発熱部品１の周囲に配置されている。補強部材８は、可撓性回路基板３を折り曲げる前の状態（図６、７参照）で発熱部品１の周囲に配置される。本実施形態では、可撓性回路基板３は補強部材８の端部で折り曲げられる。これにより、補強部材８は、発熱部品１と同様に可撓性回路基板３に包み込まれる。   When the heat generating component 1 is a semiconductor chip, the semiconductor chip is easily bent. Therefore, there is a concern that the heat generating component 1 is easily broken. Therefore, in the electronic device 102 of the present embodiment, the reinforcing member 8 is disposed around the heat generating component 1 as shown in FIG. The reinforcing member 8 is disposed around the heat generating component 1 in a state before the flexible circuit board 3 is bent (see FIGS. 6 and 7). In the present embodiment, the flexible circuit board 3 is bent at the end of the reinforcing member 8. As a result, the reinforcing member 8 is encased in the flexible circuit board 3 in the same manner as the heat generating component 1.

補強部材８は、発熱部品１よりも曲げ剛性が高い素材で構成されている。そのため、本実施形態の電子デバイス１０２は、実施形態１の電子デバイス１０１に比べて折り曲げにくくなるので発熱部品１が破壊しにくくなる。   The reinforcing member 8 is made of a material having higher bending rigidity than the heat generating component 1. For this reason, the electronic device 102 according to the present embodiment is less likely to be bent than the electronic device 101 according to the first embodiment, so that the heat generating component 1 is not easily broken.

補強部材８の素材には、例えば、金属、樹脂、または雲母が挙げられる。金属には、鉄、アルミニウム、アルミニウムを含んだ合金、ニッケルと鉄を含んだ合金、ニッケルとクロムを含んだ合金、クロムを含んだ合金、銅などが挙げられる。樹脂には、ナイロン、ポリプロピレン、エポキシ樹脂、カーボン、アラミド樹脂が挙げられる。   Examples of the material of the reinforcing member 8 include metal, resin, and mica. Examples of the metal include iron, aluminum, an alloy containing aluminum, an alloy containing nickel and iron, an alloy containing nickel and chromium, an alloy containing chromium, and copper. Examples of the resin include nylon, polypropylene, epoxy resin, carbon, and aramid resin.

（実施形態３）
本発明の実施形態３について説明する。以下、上述した実施形態１、２と異なる点を中心に説明する。図１２は、実施形態３の電子デバイスの断面図である。図１３は、実施形態３の電子デバイスの上面図である。図１３、図１４では、実施形態１、２で説明した構成要素と同様の構成要素については同じ符号を付している。 (Embodiment 3)
Embodiment 3 of the present invention will be described. The following description will focus on the differences from the first and second embodiments. FIG. 12 is a cross-sectional view of the electronic device of the third embodiment. FIG. 13 is a top view of the electronic device according to the third embodiment. In FIGS. 13 and 14, the same reference numerals are given to the same components as those described in the first and second embodiments.

本実施形態の電子デバイス１０３では、２本の熱電対２が、発熱部品１の上面に接触した状態で可撓性回路基板３に固定されている。本実施形態の電子デバイス１０３では、発熱部品１の２箇所の温度を検出することが可能となる。   In the electronic device 103 of the present embodiment, the two thermocouples 2 are fixed to the flexible circuit board 3 in a state where the two thermocouples 2 are in contact with the upper surface of the heat generating component 1. In the electronic device 103 of the present embodiment, it is possible to detect the temperatures of two locations of the heat generating component 1.

熱電対２の本数は、２本に限定されず３本以上であってもよい。各熱電対２は、発熱部品１の上面だけでなく、発熱部品１の下面あるいは側面に接触していてもよい。
（実施形態４）
本発明の実施形態４について説明する。以下、上述した実施形態１〜３と異なる点を中心に説明する。図１４は、実施形態４の電子デバイスの断面図である。図１４では、実施形態１〜３で説明した構成要素と同様の構成要素については同じ符号を付している。 The number of thermocouples 2 is not limited to two and may be three or more. Each thermocouple 2 may be in contact with the lower surface or side surface of the heat generating component 1 as well as the upper surface of the heat generating component 1.
(Embodiment 4)
Embodiment 4 of the present invention will be described. Hereinafter, a description will be given focusing on differences from Embodiments 1 to 3 described above. FIG. 14 is a cross-sectional view of the electronic device of the fourth embodiment. In FIG. 14, the same code | symbol is attached | subjected about the component similar to the component demonstrated in Embodiment 1-3.

本実施形態の電子デバイス１０４は、一部が可撓性回路基板３と一体化した熱電対２０を有する。熱電対２０では、互いに異なる２種類の金属線が可撓性回路基板３に配線として形成されている。これらの金属線はポリイミドで被覆されている。可撓性回路基板３もポリイミドで構成されている。すなわち、本実施形態の熱電対２０では、金属線の被覆部の素材が可撓性回路基板３の素材と同じになっている。   The electronic device 104 of the present embodiment has a thermocouple 20 that is partly integrated with the flexible circuit board 3. In the thermocouple 20, two different types of metal wires are formed on the flexible circuit board 3 as wiring. These metal wires are coated with polyimide. The flexible circuit board 3 is also made of polyimide. That is, in the thermocouple 20 of the present embodiment, the material of the metal wire covering portion is the same as the material of the flexible circuit board 3.

本実施形態の電子デバイス１０４によれば、熱電対２０が可撓性回路基板３の内部に形成されている。そのため、上述した電子デバイス１０１〜１０３に比べてデバイス全体の厚みが抑えられる。よって、デバイスの薄型化が可能となる。   According to the electronic device 104 of this embodiment, the thermocouple 20 is formed inside the flexible circuit board 3. Therefore, the thickness of the entire device is suppressed as compared with the electronic devices 101 to 103 described above. Therefore, the device can be thinned.

（実施形態５）
本発明の実施形態５について説明する。以下、上述した実施形態１〜４と異なる点を中心に説明する。図１５は、実施形態５の電子デバイスの断面図である。図１５では、実施形態１〜４で説明した構成要素と同様の構成要素については同じ符号を付している。 (Embodiment 5)
Embodiment 5 of the present invention will be described. Hereinafter, a description will be given centering on differences from Embodiments 1 to 4 described above. FIG. 15 is a cross-sectional view of the electronic device of the fifth embodiment. In FIG. 15, the same code | symbol is attached | subjected about the component similar to the component demonstrated in Embodiment 1-4.

本実施形態の電子デバイス１０５は、実施形態４で説明した２本の熱電対２０を有する。各熱電対２０は、図１５に示すように発熱部品の上方で各先端部が互いに対向するように配置されている。   The electronic device 105 of the present embodiment includes the two thermocouples 20 described in the fourth embodiment. As shown in FIG. 15, each thermocouple 20 is disposed above the heat generating component so that the tip portions thereof face each other.

本実施形態の電子デバイス１０５によれば、熱電対２０が可撓性回路基板３の内部に形成されているので、デバイス全体の厚さが抑えられる。よって、デバイスの薄型化が可能となる。さらに、２本の熱電対２０によって、発熱部品１の２箇所の温度を検出することが可能となる。熱電対２０の本数は、２本に制限されず、３本以上であってもよい。   According to the electronic device 105 of this embodiment, since the thermocouple 20 is formed inside the flexible circuit board 3, the thickness of the entire device can be suppressed. Therefore, the device can be thinned. Furthermore, the two thermocouples 20 can detect the temperatures at two locations of the heat generating component 1. The number of thermocouples 20 is not limited to two and may be three or more.

（実施形態６）
本発明の実施形態６について説明する。以下、上述した実施形態１〜５と異なる点を中心に説明する。図１６は、実施形態６の電子デバイスの断面図である。図１６では、実施形態１〜５で説明した構成要素と同様の構成要素については同じ符号を付している。 (Embodiment 6)
Embodiment 6 of the present invention will be described. Hereinafter, a description will be given focusing on differences from Embodiments 1 to 5 described above. FIG. 16 is a cross-sectional view of the electronic device of the sixth embodiment. In FIG. 16, the same code | symbol is attached | subjected about the component similar to the component demonstrated in Embodiment 1-5.

本実施形態の電子デバイス１０６には、実施形態２で説明した補強部材８が発熱部品１の周囲に配置されている。さらに、実施形態３で説明した熱電対２０が可撓性基板３の内部に形成されている。   In the electronic device 106 of the present embodiment, the reinforcing member 8 described in the second embodiment is disposed around the heat generating component 1. Furthermore, the thermocouple 20 described in the third embodiment is formed inside the flexible substrate 3.

本実施形態の電子デバイス１０５によれば、発熱部品１よりも曲げ剛性が高い補強部材８が発熱部品１の周囲に配置されている。そのため、電子デバイス１０５は、折り曲げにくくなるので発熱部品１が破壊しにくくなる。さらに、熱電対２０が可撓性回路基板３の内部に形成されているので、デバイス全体の厚さが抑えられる。よって、デバイスの薄型化が可能となる。   According to the electronic device 105 of the present embodiment, the reinforcing member 8 having higher bending rigidity than the heat generating component 1 is disposed around the heat generating component 1. Therefore, since the electronic device 105 is difficult to bend, the heat generating component 1 is not easily broken. Furthermore, since the thermocouple 20 is formed inside the flexible circuit board 3, the thickness of the entire device can be suppressed. Therefore, the device can be thinned.

（実施形態７）
本発明の実施形態７について説明する。以下、上述した実施形態１〜６と異なる点を中心に説明する。図１７は、実施形態７の電子デバイスの断面図である。図１７では、実施形態１〜６で説明した構成要素と同様の構成要素については同じ符号を付している。 (Embodiment 7)
Embodiment 7 of the present invention will be described. Hereinafter, a description will be given centering on differences from Embodiments 1 to 6 described above. FIG. 17 is a cross-sectional view of the electronic device according to the seventh embodiment. In FIG. 17, the same code | symbol is attached | subjected about the component similar to the component demonstrated in Embodiment 1-6.

本実施形態の電子デバイス１０７は、全体が可撓性回路基板３と一体化した熱電対２１を有する。熱電対２１では、互いに異なる２種類の金属線が可撓性回路基板３に配線として形成されている。図１８は、図１７に示す電子デバイスを有する電子機器の断面図である。図１８に示すように、熱電対２１の後端部は外部電極１２に電気的に接続されている。この外部電極１２は、配線６を通じて温度計測部７に接続されている。   The electronic device 107 of this embodiment includes a thermocouple 21 that is integrated with the flexible circuit board 3 as a whole. In the thermocouple 21, two different types of metal wires are formed on the flexible circuit board 3 as wiring. 18 is a cross-sectional view of an electronic apparatus having the electronic device shown in FIG. As shown in FIG. 18, the rear end portion of the thermocouple 21 is electrically connected to the external electrode 12. The external electrode 12 is connected to the temperature measurement unit 7 through the wiring 6.

本実施形態の電子デバイス１０７によれば、熱電対２１が可撓性回路基板３の内部に形成されている。そのため、デバイス全体の厚さが抑えられる。よって、デバイスの薄型化が可能となる。特に、本実施形態の電子デバイス１０７では、熱電対２１の全体が可撓性回路基板３の内部に形成されている。そのため、熱電対２１が可撓性回路基板３からはみ出ないので、デバイスの小型化が可能となる。   According to the electronic device 107 of this embodiment, the thermocouple 21 is formed inside the flexible circuit board 3. Therefore, the thickness of the entire device can be suppressed. Therefore, the device can be thinned. In particular, in the electronic device 107 of this embodiment, the entire thermocouple 21 is formed inside the flexible circuit board 3. Therefore, since the thermocouple 21 does not protrude from the flexible circuit board 3, the device can be miniaturized.

１ 発熱部品
２、２０、２１ 熱電対
３ 可撓性回路基板
４ 外部端子
５ 実装基板
６ 配線
７ 温度計測部
８ 補強部材
９ 表面
１１ 裏面
１０、１２ 外部電極
１３ パッド
１４ 接着層
１５、１６、１７ 絶縁層
１８ 端部
１９ コネクタ
１００ 電子機器
１０１〜１０７ 電子デバイス DESCRIPTION OF SYMBOLS 1 Heat-generating component 2, 20, 21 Thermocouple 3 Flexible circuit board 4 External terminal 5 Mounting board 6 Wiring 7 Temperature measurement part 8 Reinforcement member 9 Front surface 11 Back surface 10, 12 External electrode 13 Pad 14 Adhesive layers 15, 16, 17 Insulating layer 18 End 19 Connector 100 Electronic equipment 101-107 Electronic device

Claims (9)

通電により発熱する発熱部品と、
前記発熱部品が搭載され、前記発熱部品を包み込むように折り曲げられている可撓性回路基板と、
前記発熱部品の近傍で前記可撓性回路基板に固定されている熱電対と、
を有する電子デバイス。 Heating parts that generate heat when energized;
A flexible circuit board on which the heat generating component is mounted and bent so as to wrap the heat generating component;
A thermocouple fixed to the flexible circuit board in the vicinity of the heat generating component;
An electronic device. 前記熱電対が、前記可撓性回路基板に形成された接着層に固定され、かつ前記発熱部品に接触している、請求項１に記載の電子デバイス。   The electronic device according to claim 1, wherein the thermocouple is fixed to an adhesive layer formed on the flexible circuit board and is in contact with the heat-generating component. 前記熱電対が、前記可撓性回路基板の内部に一体化されている、請求項１に記載の電子デバイス。   The electronic device of claim 1, wherein the thermocouple is integrated inside the flexible circuit board. 前記発熱部品の周囲で前記可撓性回路基板に包み込まれ、前記発熱部品よりも曲げ剛性が高い補強部材をさらに有する、請求項１から３のいずれか１項に記載の電子デバイス。   4. The electronic device according to claim 1, further comprising a reinforcing member that is wrapped around the flexible circuit board around the heat-generating component and has higher bending rigidity than the heat-generating component. 5. 前記補強部材の素材が、金属、樹脂、または雲母である、請求項４に記載の電子デバイス。   The electronic device according to claim 4, wherein a material of the reinforcing member is metal, resin, or mica. 複数の前記熱電対が前記可撓性回路基板に固定されている、請求項１から５のいずれか１項に記載の電子デバイス。   The electronic device according to claim 1, wherein a plurality of the thermocouples are fixed to the flexible circuit board. 前記発熱部品が、半導体チップ、前記半導体チップが収容された電子部品、または受動部品である、請求項１から６のいずれか１項に記載の電子デバイス。   The electronic device according to claim 1, wherein the heat generating component is a semiconductor chip, an electronic component in which the semiconductor chip is accommodated, or a passive component. 請求項１から６のいずれか１項に記載の電子デバイスと、
前記熱電対と電気的に接続され、前記熱電対の熱起電力に基づいて温度を計測する温度計測部と、
を有する電子機器。 The electronic device according to any one of claims 1 to 6,
A temperature measuring unit electrically connected to the thermocouple and measuring a temperature based on a thermoelectromotive force of the thermocouple;
Electronic equipment having 通電により発熱する発熱部品を、該発熱部品よりも平面積が広い可撓性回路基板に搭載する工程と、
前記発熱部品を包み込むように前記可撓性回路基板を折り曲げる工程と、
前記可撓性回路基板を折り曲げたときに前記発熱部品の近傍となる位置で熱電対を前記可撓性回路基板に固定する工程と、
を有する電子デバイスの製造方法。 Mounting a heat-generating component that generates heat upon energization on a flexible circuit board having a larger area than the heat-generating component;
Bending the flexible circuit board so as to wrap the heat-generating component;
Fixing a thermocouple to the flexible circuit board at a position near the heat-generating component when the flexible circuit board is bent;
Manufacturing method of electronic device having
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