WO2018168287A1 - Information terminal device - Google Patents

Information terminal device Download PDF

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Publication number
WO2018168287A1
WO2018168287A1 PCT/JP2018/004739 JP2018004739W WO2018168287A1 WO 2018168287 A1 WO2018168287 A1 WO 2018168287A1 JP 2018004739 W JP2018004739 W JP 2018004739W WO 2018168287 A1 WO2018168287 A1 WO 2018168287A1
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WO
WIPO (PCT)
Prior art keywords
temperature
circuit board
ssd
flexible circuit
temperature sensor
Prior art date
Application number
PCT/JP2018/004739
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French (fr)
Japanese (ja)
Inventor
眞一 廣瀬
Original Assignee
富士通クライアントコンピューティング株式会社
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Publication of WO2018168287A1 publication Critical patent/WO2018168287A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements

Definitions

  • This application relates to information terminal devices.
  • SSD Solid State Drive
  • NAND flash memory NAND flash memory
  • the SSD provided in the information terminal device is provided with a temperature sensor in the vicinity of the NAND flash memory. This temperature sensor is provided so that when the SSD reaches a predetermined temperature or higher, the processing speed is automatically reduced so that a thermal runaway state called thermal throttling does not occur.
  • HDD hard disk drive
  • the CPU measures the temperature uniquely measured by the SSD. Information cannot be obtained. If the CPU can acquire the temperature information of the SSD, before the SSD goes into a thermal runaway state, the amount of heat generated can be reduced by increasing the amount of air blown by the cooling fan or decreasing the frequency of the CPU itself. You can take action.
  • the object is to measure the temperature of a temperature measurement object without increasing wiring.
  • a temperature measurement object for measuring temperature there are a flexible circuit board arranged so as to straddle the temperature measurement object, and a temperature sensor for measuring the temperature of the temperature measurement object, which is flexible
  • the temperature sensor is provided in a portion of the circuit board across the temperature measurement object and connected to a part of the wiring of the flexible circuit board, and the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected.
  • a processing device that receives and processes the temperature information of the temperature measurement object measured in step (1).
  • the temperature of the temperature measurement object can be measured without providing separate wiring.
  • FIG. 1 is a perspective view showing a notebook personal computer which is the disclosed information terminal device.
  • FIG. 2A is a plan view showing the inside of an information terminal device body as a comparative technique.
  • 2B is a cross-sectional view of the information terminal device main body taken along line B2-B2 in a state in which the upper surface cover is attached to the information terminal device main body shown in FIG. 2A.
  • FIG. 3A is a plan view showing the inside of the disclosed information terminal device main body.
  • FIG. 3B is a cross-sectional view of the information terminal device main body taken along line B3-B3 in a state where the upper surface cover is attached to the information terminal device main body shown in FIG. 3A.
  • FIG. 4A is a plan view showing a first embodiment of a flexible circuit board provided in the disclosed information terminal device body.
  • 4B is a cross-sectional view taken along line B4-B4 of FIG. 4A.
  • FIG. 5 is a perspective view showing a part of the first embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 6A is a plan view showing a second embodiment of the flexible circuit board provided in the disclosed information terminal device main body. 6B is a cross-sectional view taken along line B6-B6 of FIG. 6A.
  • FIG. 7 is a perspective view showing a part of the second embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 8A is a plan view showing a third embodiment of the flexible circuit board provided in the disclosed information terminal device main body.
  • FIG. 8B is a sectional view taken along line B8-B8 in FIG. 8A.
  • FIG. 9 is a perspective view showing a part of a third embodiment of the temperature sensor and the flexible circuit board.
  • FIG. 10 is a plan view showing a fourth embodiment of the flexible circuit board provided in the disclosed information terminal device body.
  • FIG. 11A is a plan view showing a fifth embodiment of the flexible circuit board provided in the disclosed information terminal device main body.
  • FIG. 11B is a sectional view taken along line B11-B11 in FIG. 11A.
  • FIG. 12 is a flowchart showing a flow of processing in which the CPU of the information terminal device controls the operation of the SSD based on temperature information from the temperature sensor.
  • FIG. 1 is a perspective view showing a notebook personal computer 1 which is an example of the information terminal device of the present embodiment.
  • the notebook computer 1 includes a terminal body 10 and a display 11 that is opened and closed at the rear end of the terminal body 10 via a hinge.
  • FIG. 1 shows a state in which the display 11 is opened.
  • the terminal body 10 houses a circuit board on which electronic components such as a CPU and an SSD are mounted.
  • Input devices such as a keyboard and a touch panel are provided on the upper surface of the terminal body 10.
  • FIG. 2A is a plan view showing the internal structure of the terminal main body 110 of the notebook computer of the comparative technique, and shows a state in which the upper cover of the casing 120 of the terminal main body 110 is removed.
  • FIG. FIG. 6 is a sectional view taken along line B2-B2.
  • the terminal main body 110 includes a housing 120, a main circuit board 121 and a sub circuit board 122 provided in the housing 120, a battery 140, and a cooling fan 124.
  • a CPU 123 as a processing device
  • an SSD 125 as a storage device
  • the SSD 125 is connected to the main circuit board 121 by a connector 135a.
  • terminals for connecting to an external device are mounted on the sub circuit board 122.
  • the main circuit board 121 and the sub circuit board 122 are connected by a flexible circuit board 129 via connectors 135b and 135c provided respectively.
  • a flexible circuit substrate 129 is used as means for transmitting a signal of one substrate (main circuit substrate 121) to the other substrate (sub circuit substrate 122).
  • connectors 135b and 135c are provided so that the flexible circuit board 129 protruding from the end of one board is connected to the end of the other board so that the length of the flexible circuit board 129 becomes shorter.
  • the battery 140 is a power source for operating the CPU 123 and the SSD 125.
  • the CPU 123 mounted on the main circuit board 121 is provided with a CPU heat radiation plate 131. Then, the cooling fan 124 rotates according to the instruction of the CPU 123, whereby cooling air flows, and the CPU heat dissipation plate 131 is cooled, so that the CPU 123 in contact with it is cooled.
  • the housing 120 is provided with a suction port 136 for taking in outside air and a discharge port 137 for discharging air taken in the vicinity of the cooling fan 124.
  • the SSD 125 is an example of a storage device mounted on an information terminal device, and includes an SSD substrate 128, a plurality of NAND flash memories 126 mounted on the SSD substrate 128, and an SSD temperature sensor that measures the temperature of the SSD 125. 127.
  • the SSD 125 is connected to the main circuit board 121 via the connector 135a.
  • a heat radiating plate 130 for cooling the SSD 125 is disposed between the SSD 125 and the main circuit board 121. Since the SSD temperature sensor 127 is not connected to the CPU 123 on the main circuit board 121, the CPU 123 cannot monitor and control the temperature of the NAND flash memory 126 mounted on the SSD 125. Therefore, the heat radiating plate 130 is disposed as a physical heat radiating measure.
  • the SSD 125 determines that the SSD 125 is in a thermal runaway state when the temperature obtained by the SSD temperature sensor exceeds a predetermined value. And since the SSD 125 itself lowers the operating speed of the SSD 125 itself, it leads to a decrease in the performance of the information terminal device. Also, the operation of the SSD 125 during a thermal runaway is different for each manufacturer and is not unified. For example, when there is a thermal runaway, there are things that gradually lower the performance, and those that lower the performance at once.
  • the CPU 123 of the information terminal device directly monitors the state of the SSD 125 and controls the operation of the SSD 125 and the cooling fan 124 to prevent the performance of the information terminal device from being deteriorated due to the unpredictable operation of the SSD 125. It was done.
  • the arrangement of the NAND flash memory and the temperature sensor in the SSD differs depending on the manufacturer and the generation in which it is manufactured. For this reason, even if different NAND flash memories for different manufacturers are arranged at different locations, a temperature sensor capable of appropriately measuring the temperatures is required.
  • FIG. 3A The information terminal device of the present invention will be described with reference to FIGS. 3A to 12.
  • FIG. 3A The information terminal device of the present invention will be described with reference to FIGS. 3A to 12.
  • FIG. 3A is a plan view showing the internal structure of the terminal body 10 of the notebook personal computer 1 which is an example of the information processing terminal according to the present invention, and shows a state in which the top cover of the casing 20 of the terminal body 10 is removed. It is.
  • FIG. 3B is a cross-sectional view taken along line B3-B3 of FIG. 3A and shows a state where the top cover is covered.
  • the terminal body 10 is similar to the terminal body 110 of the notebook computer of the comparative technique shown in FIG. 2, the housing 20, the main circuit board 21 and the sub circuit board 22 provided inside the housing 20, the battery 40, And a cooling fan 24.
  • the SSD 25 is connected to the main circuit board 21 by a connector 35a.
  • terminals for connecting to an external device are mounted on the sub circuit board 22.
  • the CPU 23 mounted on the main circuit board 21 is provided with a CPU heat radiation plate 31.
  • the cooling fan 24 rotates in response to an instruction from the CPU 23 and can cool the CPU 23 by cooling the CPU heat radiation plate 31 with cooling air. Further, the cooling fan 24 rotates, so that the SSD 25 provided on the main circuit board 21 can also be cooled.
  • the housing 20 is formed with a suction port 36 for taking in outside air and a discharge port 37 for discharging the taken outside air.
  • an SSD 25 (an example of a temperature measurement object) is mounted as a storage device, similarly to the information terminal device of the comparative technique.
  • the SSD 25 includes an SSD substrate 28, a plurality of NAND flash memories 26 mounted on the SSD substrate 28, and an SSD temperature sensor 27 that measures the temperature of the SSD 25.
  • the SSD 25 is connected to the main circuit board 21 via the connector 35a. Further, a heat dissipation plate 30 for cooling the SSD 25 is disposed between the SSD 25 and the main circuit board 21.
  • a flexible circuit board 29 that connects the main circuit board 21 and the sub circuit board 22 is disposed so as to straddle the SSD 25.
  • One end of the flexible circuit board 29 is connected to the connector 35 b of the main circuit board 21, and the other end is connected to the connector 35 c of the sub circuit board 22.
  • the flexible circuit board 29 has a plurality of wirings 34 passing therethrough, and the main circuit board 21 is connected via connectors 35b and 35c provided on the main circuit board 21 and the sub circuit board 22, respectively.
  • the sub circuit board 22 transmit and receive signals.
  • a temperature sensor 32 that measures the temperature of the SSD 25 is provided above the portion where the flexible circuit board 29 straddles the SSD 25. As shown in FIGS. 4B and 5, the temperature sensor 32 is connected to two of the plurality of wirings 34 of the flexible circuit board 29. Since the wiring 34 is close to the SSD 25, the temperature sensor 32 can measure the temperature of the SSD 25. One of the wirings connected to the temperature sensor 32 is connected to the CPU 23, and the temperature information measured by the temperature sensor 32 can be sent to the CPU 23 via the wiring 34. That is, the CPU 23 receives the temperature information of the SSD 25 measured by the temperature sensor 32 via a part of the wiring 34 connected to the temperature sensor 32. In addition, the wiring 34 which connects CPU23 and the temperature sensor 32 uses the wiring which is not used for the communication of the signal of board
  • the flexible circuit board 29 is a thin plate, if it is arranged on the SSD 25 of the temperature measurement object that generates heat, the flexible circuit board 29 and the back side thereof also have substantially the same heat. Therefore, if the temperature sensor 32 is arranged on the flexible circuit board 29, the temperature of the SSD 25 can be measured.
  • the temperature sensor 32 may be disposed at any location on the flexible circuit board 29 as long as it can be connected to the wiring 34. Further, as shown in FIG. 3B, a fixing cushion 39 is disposed between the inner wall of the housing 20 and the flexible circuit board 29 so that the flexible circuit board 29 and the SSD 25 as the temperature measurement object are in close contact with each other. Also good.
  • the flexible circuit board 29a includes a metal pattern 33 for assisting temperature detection instead of arranging the wiring 34 in a portion straddling the SSD 25.
  • the metal pattern 33 is provided by enlarging the width of a part of the wiring of the flexible circuit board 29.
  • the metal pattern 33 of the second embodiment is made of copper, the metal pattern 33 may be made of another material, such as aluminum, as long as it is made of a metal having good thermal conductivity.
  • the flexible circuit board 29a is wider than the case where the normal wiring 34 is used, and can contact the SSD 25 in a wider range. That is, although the arrangement of the NAND flash memory 26 differs depending on the manufacturer, it is possible to perform measurement by contacting the NAND flash memory 26 by providing the wide metal pattern 33.
  • the flexible circuit board 29b shows a flexible circuit board 29b according to the third embodiment.
  • the wide metal pattern 33 is arranged like the flexible circuit board 29a of the second embodiment, the area through which the wiring 34 passes is reduced, and the number of the wirings 34 is reduced.
  • the width of the metal pattern 33b is made equal to the width of the flexible circuit board 29b, and The number of wirings 34 can be maintained. If the width of the SSD 25 and the width of the metal pattern 33b of the flexible circuit board 29b are substantially the same size, the metal pattern 33b can remove the heat of the NAND flash memory 26 no matter how the NAND flash memory 26 is arranged. Can receive.
  • FIG. 10 shows a flexible circuit board 29c according to the fourth embodiment.
  • the inside of the flexible circuit board 29b has two layers, and the wiring 34 and the metal pattern 33b are arranged.
  • the metal pattern 33 is arranged at the center of the flexible circuit board 29 with a single layer, and the width of the flexible circuit board 29 where the metal pattern 33 is arranged is not arranged. It is wider than the width.
  • wirings 34 are arranged on both sides of the metal pattern 33. By arranging the metal patterns 33 and the wirings 34 in this manner, the number of the wirings 34 can be maintained, and a wider metal pattern 33 can be provided.
  • FIG. 11A and FIG. 11B show a flexible circuit board 29d according to the fifth embodiment.
  • the metal pattern 33 is separately prepared and provided on the flexible circuit board 29 in advance.
  • a temperature detection assisting metal pattern is formed by connecting some of the wirings 34 of all the wirings 34.
  • the plurality of wirings 34 are preferably connected in the vicinity of the end portion of the SSD 25 when the flexible circuit board 29 d covers the SSD 25.
  • the plurality of wirings 34 can be connected by forming a hole penetrating the coating of the flexible circuit board and providing a connecting metal 38 such as a metal tape outside the coating through the hole.
  • the temperature sensor 32 can acquire temperature information from the SSD 25 via a plurality of wires 34.
  • step S ⁇ b> 101 the CPU 23 receives temperature information from the temperature sensor 32 and detects the temperature of the SSD 25.
  • step S102 the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a predetermined temperature (specified value).
  • the CPU 23 determines that there is no danger that the SSD 25 is in a thermal runaway state, and the SSD 25 is not sent to the temperature sensor 32 without performing any particular processing on the SSD 25. Continue to detect the temperature.
  • the temperature of the SSD 25 is not lower than the specified value (in the case of NO)
  • the SSD 25 may be in a thermal runaway state, so the CPU 23 executes a process for cooling the SSD 25.
  • the CPU 23 performs a process of increasing the rotational speed of the cooling fan 24 (rotational speed UP), increasing the air volume, or decreasing the operating speed (operating frequency) of the CPU 23 (Clock Down).
  • the CPU 23 After executing the process of cooling the SSD 25, the CPU 23 detects the temperature of the SSD 25 again based on the temperature information received from the temperature sensor 32 (step S104). Then, the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a specified value (step S105). If it falls below the specified value (in the case of YES), it is determined that there is no longer a possibility of a thermal runaway state. Then, the rotation speed of the cooling fan 24 is decreased (rotation speed DOWN) to reduce the air volume, or the operation speed (operation frequency) of the CPU 23 is increased (Clock Up) (step S106).
  • step S104 If it does not fall below the specified value (in the case of NO), the process of cooling the SSD 25 is continued as it is, and the process returns to step S104 so as to continue detecting the temperature of the SSD 25.
  • the temperature detection is continued until the information terminal device 1 is turned off (step S107). If the power is not turned off in step S107 (in the case of NO), the process returns to step S101, and the CPU 23 detects the temperature of the SSD 25 and continues monitoring so as not to be in a thermal runaway state.
  • the CPU 23 can control the SSD 25 so that it does not go into a thermal runaway state.
  • the intended performance of the information terminal device 1 can be controlled.
  • the temperature information of the SSD 25 can be obtained only by changing the arrangement of the flexible circuit board 29, no additional wiring is required. Therefore, the number of parts such as wiring provided on the circuit board does not increase, and the number of operations for incorporating wiring and the like does not increase.
  • the SSD 25, which is a temperature measurement object is an M.M. It may be a 2 (M dot toe) type SSD.
  • the SSD 25 may be an SSD with SATA connection.
  • the temperature measurement object is not limited to SSD, but a device that can generate heat, for example, HDD, memory for desktop personal computer (DIMM), memory used in notebook personal computer (SO.DIMM), etc. It may be.
  • (Appendix 1) A temperature measurement object whose temperature is measured; A flexible circuit board arranged to straddle the temperature measurement object; A temperature sensor that measures the temperature of the temperature measurement object, the temperature sensor being provided in a portion of the flexible circuit board that straddles the temperature measurement object, and connected to a part of the wiring of the flexible circuit board; , An information terminal comprising: a processing device that receives and processes temperature information of the temperature measurement object measured by the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected. apparatus. (Additional remark 2) The said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected to the said temperature sensor, The said metal pattern is expanded and provided in the width
  • the information terminal device is an information terminal device of Additional remark 1 or 2 which controls operation
  • the said metal pattern is an information terminal device of Additional remark 2 provided with the width
  • the said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected with the said temperature sensor, and the said metal pattern is arrange
  • the information terminal device according to attachment 1.

Abstract

Provided is an information terminal device comprising a temperature sensor that measures a temperature of a temperature measurement object without the need to increase wires separately. An information terminal device 1 is provided with: a temperature measurement object 25, the temperature of which is to be measured; a flexible circuit board 29 that is arranged across the temperature measurement object; a temperature sensor 32 that measures the temperature of the temperature measurement object and is provided on a portion of the flexible circuit board that lies across the temperature measurement object, the temperature sensor being connected to a part of wiring of the flexible circuit board; and a processing device 23 that receives temperature information on the temperature measurement object measured by the temperature sensor via the part of the wiring of the flexible circuit board to which the temperature sensor is connected, the processing device then processing the temperature information. Consequently, the operation or temperature of the temperature measurement object is controlled.

Description

情報端末装置Information terminal equipment
　本出願は情報端末装置に関する。 This application relates to information terminal devices.
　ノートブック型パーソナルコンピュータ（以下、ノートパソコンと称する）等の情報端末装置は小型化又は薄型化が進められている。そのため、例えば記憶装置としてＮＡＮＤ型フラッシュメモリを搭載したソリッドステートドライブ（Ｓｏｌｉｄ　Ｓｔａｔｅ　Ｄｒｉｖｅ：以下ＳＳＤと称する）が設けられるようになった。情報端末装置に設けられるＳＳＤには、そのＮＡＮＤ型フラッシュメモリの近辺に温度センサが設けられている。この温度センサは、ＳＳＤが所定の温度以上になった場合に、自動的に処理速度を落としてサーマルスロットリングと呼ばれる熱暴走状態にならないよう設けられる。 Information terminal devices such as notebook personal computers (hereinafter referred to as notebook personal computers) are being made smaller or thinner. For this reason, for example, a solid state drive (Solid State Drive: hereinafter referred to as SSD) equipped with a NAND flash memory is provided as a storage device. The SSD provided in the information terminal device is provided with a temperature sensor in the vicinity of the NAND flash memory. This temperature sensor is provided so that when the SSD reaches a predetermined temperature or higher, the processing speed is automatically reduced so that a thermal runaway state called thermal throttling does not occur.
　このような、記憶装置の温度を計測する方法として、ハードディスクドライブ（Ｈａｒｄ　Ｄｉｓｋ　Ｄｒｉｖｅ：以下、ＨＤＤ）の固定部材を熱伝導性の良い部品とし、ＨＤＤの固定部材に温度センサを取付けることが提案されている（例えば特開２０００－１１４７５９号公報参照）。 As a method for measuring the temperature of such a storage device, it has been proposed to use a hard disk drive (hereinafter referred to as HDD) fixing member as a component having good thermal conductivity and to attach a temperature sensor to the HDD fixing member. (See, for example, Japanese Patent Laid-Open No. 2000-114759).
　しかしながら、ＳＳＤの温度センサが計測した温度は、情報端末装置の中央処理装置（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ：以下、ＣＰＵ）等に送付されることがないため、ＣＰＵは、ＳＳＤが独自に計測している温度情報を取得することができない。ＣＰＵがＳＳＤの温度情報を取得することができれば、ＳＳＤが熱暴走状態になる前に、冷却用のファンの送風量を多くしたり、ＣＰＵ自体の周波数を落としたりすることで発熱量を下げたりする対応をとることができる。 However, since the temperature measured by the SSD temperature sensor is not sent to the central processing unit (hereinafter referred to as CPU) of the information terminal device, the CPU measures the temperature uniquely measured by the SSD. Information cannot be obtained. If the CPU can acquire the temperature information of the SSD, before the SSD goes into a thermal runaway state, the amount of heat generated can be reduced by increasing the amount of air blown by the cooling fan or decreasing the frequency of the CPU itself. You can take action.
　ＣＰＵに接続された温度センサを温度計測対象物であるＳＳＤ及びＨＤＤ等に設置する場合、温度センサにより得た温度情報をＣＰＵに伝達するための配線を別途設けなければならない。そのため、回路基板に設ける配線等の部品が増加すると共に、配線等を組み入れるための作業数が多くなるという課題があった。 When the temperature sensor connected to the CPU is installed in an SSD, HDD, or the like that is a temperature measurement object, wiring for transmitting temperature information obtained by the temperature sensor to the CPU must be provided separately. For this reason, there are problems that the number of parts such as wiring provided on the circuit board is increased and the number of operations for incorporating the wiring is increased.
　１つの側面では、別途配線を増やすことなく、温度計測対象物の温度計測をすることを目的とする。 ¡In one aspect, the object is to measure the temperature of a temperature measurement object without increasing wiring.
　１つの形態によれば、温度が計測される温度計測対象物と、温度計測対象物を跨ぐように配置されるフレキシブル回路基板と、温度計測対象物の温度を計測する温度センサであって、フレキシブル回路基板の温度計測対象物を跨ぐ部分に設けられ、フレキシブル回路基板の配線の一部に接続される温度センサと、温度センサが接続されたフレキシブル回路基板の配線の一部を介して、温度センサで計測された温度計測対象物の温度情報を受信して処理する処理装置と、を備える情報端末装置が提供される。 According to one embodiment, there are a temperature measurement object for measuring temperature, a flexible circuit board arranged so as to straddle the temperature measurement object, and a temperature sensor for measuring the temperature of the temperature measurement object, which is flexible The temperature sensor is provided in a portion of the circuit board across the temperature measurement object and connected to a part of the wiring of the flexible circuit board, and the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected. And a processing device that receives and processes the temperature information of the temperature measurement object measured in step (1).
　別配線を設けることなく、温度計測対象物の温度を計測することができる。 The temperature of the temperature measurement object can be measured without providing separate wiring.
図１は開示の情報端末装置であるノートパソコンを示す斜視図である。FIG. 1 is a perspective view showing a notebook personal computer which is the disclosed information terminal device. 図２Ａは比較技術である情報端末装置本体の内部を示す平面図である。FIG. 2A is a plan view showing the inside of an information terminal device body as a comparative technique. 図２Ｂは図２Ａに示した情報端末装置本体に上面カバーが取付けられた状態のＢ２－Ｂ２線に沿った情報端末装置本体の断面図である。2B is a cross-sectional view of the information terminal device main body taken along line B2-B2 in a state in which the upper surface cover is attached to the information terminal device main body shown in FIG. 2A. 図３Ａは開示する情報端末装置本体の内部を示す平面図である。FIG. 3A is a plan view showing the inside of the disclosed information terminal device main body. 図３Ｂは図３Ａに示した情報端末装置本体に上面カバーが取付けられた状態のＢ３－Ｂ３線に沿った情報端末装置本体の断面図である。FIG. 3B is a cross-sectional view of the information terminal device main body taken along line B3-B3 in a state where the upper surface cover is attached to the information terminal device main body shown in FIG. 3A. 図４Ａは開示する情報端末装置本体に設けられたフレキシブル回路基板の第１の実施例を示す平面図である。FIG. 4A is a plan view showing a first embodiment of a flexible circuit board provided in the disclosed information terminal device body. 図４Ｂは図４ＡのＢ４－Ｂ４線に沿った断面図である。4B is a cross-sectional view taken along line B4-B4 of FIG. 4A. 図５は温度センサとフレキシブル回路基板の第１の実施例の一部を示す斜視図である。FIG. 5 is a perspective view showing a part of the first embodiment of the temperature sensor and the flexible circuit board. 図６Ａは開示する情報端末装置本体に設けられたフレキシブル回路基板の第２の実施例を示す平面図である。FIG. 6A is a plan view showing a second embodiment of the flexible circuit board provided in the disclosed information terminal device main body. 図６Ｂは図６ＡのＢ６－Ｂ６線に沿った断面図である。6B is a cross-sectional view taken along line B6-B6 of FIG. 6A. 図７は温度センサとフレキシブル回路基板の第２の実施例の一部を示す斜視図である。FIG. 7 is a perspective view showing a part of the second embodiment of the temperature sensor and the flexible circuit board. 図８Ａは開示する情報端末装置本体に設けられたフレキシブル回路基板の第３の実施例を示す平面図である。FIG. 8A is a plan view showing a third embodiment of the flexible circuit board provided in the disclosed information terminal device main body. 図８Ｂは図８ＡのＢ８－Ｂ８線に沿った断面図である。FIG. 8B is a sectional view taken along line B8-B8 in FIG. 8A. 図９は温度センサとフレキシブル回路基板の第３の実施例の一部を示す斜視図である。FIG. 9 is a perspective view showing a part of a third embodiment of the temperature sensor and the flexible circuit board. 図１０は開示する情報端末装置本体に設けられたフレキシブル回路基板の第４の実施例を示す平面図である。FIG. 10 is a plan view showing a fourth embodiment of the flexible circuit board provided in the disclosed information terminal device body. 図１１Ａは開示する情報端末装置本体に設けられたフレキシブル回路基板の第５の実施例を示す平面図である。FIG. 11A is a plan view showing a fifth embodiment of the flexible circuit board provided in the disclosed information terminal device main body. 図１１Ｂは図１１ＡのＢ１１－Ｂ１１線に沿った断面図である。FIG. 11B is a sectional view taken along line B11-B11 in FIG. 11A. 図１２は情報端末装置のＣＰＵが、温度センサによる温度情報によりＳＳＤの動作を制御する処理の流れを示すフローチャートである。FIG. 12 is a flowchart showing a flow of processing in which the CPU of the information terminal device controls the operation of the SSD based on temperature information from the temperature sensor.
　以下、添付図面を用いて本出願の実施の形態を、具体的な実施例に基づいて詳細に説明する。また、以下の実施の形態において同一又は類似の要素には共通の参照符号を付けて示し、理解を容易にするために、これらの図面は縮尺を適宜変更している。 Hereinafter, embodiments of the present application will be described in detail based on specific examples with reference to the accompanying drawings. In the following embodiments, the same or similar elements are denoted by common reference numerals, and the scale of these drawings is appropriately changed for easy understanding.
　図１は、本実施形態の情報端末装置の一例であるノートパソコン１を示す斜視図である。ノートパソコン１は、端末本体１０と端末本体１０の後端部にヒンジを介して開閉されるディスプレイ１１とを備える。図１は、ディスプレイ１１が開いた状態を示している。端末本体１０には、ＣＰＵ及びＳＳＤ等の電子部品を搭載する回路基板が収納されていて、端末本体１０の上面にはキーボード及びタッチパネル等の入力機器が設けられている。 FIG. 1 is a perspective view showing a notebook personal computer 1 which is an example of the information terminal device of the present embodiment. The notebook computer 1 includes a terminal body 10 and a display 11 that is opened and closed at the rear end of the terminal body 10 via a hinge. FIG. 1 shows a state in which the display 11 is opened. The terminal body 10 houses a circuit board on which electronic components such as a CPU and an SSD are mounted. Input devices such as a keyboard and a touch panel are provided on the upper surface of the terminal body 10.
　ここで、比較技術の情報端末装置であるノートパソコンについて図２を用いて説明する。図２Ａは、比較技術のノートパソコンの端末本体１１０の内部構造を示す平面図であって、端末本体１１０の筐体１２０の上部カバーを外した状態を示す図であり、図２Ｂは、図２ＡのＢ２－Ｂ２線に沿った断面図である。図２Ａに示されるように、端末本体１１０は、筐体１２０と、筐体１２０の内部に設けられたメイン回路基板１２１及びサブ回路基板１２２と、バッテリー１４０と、冷却用ファン１２４とを備える。メイン回路基板１２１には、処理装置であるＣＰＵ１２３と、記憶装置であるＳＳＤ１２５が搭載されている。ＳＳＤ１２５は、コネクタ１３５ａによりメイン回路基板１２１と接続される。サブ回路基板１２２には例えば外部装置と接続するための端子等が搭載されている。メイン回路基板１２１とサブ回路基板１２２とはそれぞれに設けられたコネクタ１３５ｂ、１３５ｃを介して、フレキシブル回路基板１２９により接続される。筐体１２０の内部に複数の基板がある場合、一方の基板（メイン回路基板１２１）の信号を他方の基板（サブ回路基板１２２）に伝達する手段として、フレキシブル回路基板１２９が用いられる。そして、フレキシブル回路基板１２９の長さがより短くなるように、一方の基板の端部から出たフレキシブル回路基板１２９を他方の基板の端部につなげるようコネクタ１３５ｂ、１３５ｃが設けられる。バッテリー１４０は、ＣＰＵ１２３及びＳＳＤ１２５を動かすための電源である。 Here, a notebook personal computer which is an information terminal device of comparative technology will be described with reference to FIG. 2A is a plan view showing the internal structure of the terminal main body 110 of the notebook computer of the comparative technique, and shows a state in which the upper cover of the casing 120 of the terminal main body 110 is removed. FIG. FIG. 6 is a sectional view taken along line B2-B2. As shown in FIG. 2A, the terminal main body 110 includes a housing 120, a main circuit board 121 and a sub circuit board 122 provided in the housing 120, a battery 140, and a cooling fan 124. On the main circuit board 121, a CPU 123 as a processing device and an SSD 125 as a storage device are mounted. The SSD 125 is connected to the main circuit board 121 by a connector 135a. For example, terminals for connecting to an external device are mounted on the sub circuit board 122. The main circuit board 121 and the sub circuit board 122 are connected by a flexible circuit board 129 via connectors 135b and 135c provided respectively. When there are a plurality of substrates in the housing 120, a flexible circuit substrate 129 is used as means for transmitting a signal of one substrate (main circuit substrate 121) to the other substrate (sub circuit substrate 122). Then, connectors 135b and 135c are provided so that the flexible circuit board 129 protruding from the end of one board is connected to the end of the other board so that the length of the flexible circuit board 129 becomes shorter. The battery 140 is a power source for operating the CPU 123 and the SSD 125.
　メイン回路基板１２１に搭載されたＣＰＵ１２３には、ＣＰＵ用放熱プレート１３１が設けられている。そして、ＣＰＵ１２３の指示により冷却用ファン１２４が回ることにより冷却風が流れ、ＣＰＵ用放熱プレート１３１が冷却されることでそれに接触するＣＰＵ１２３が冷却される。筐体１２０には、外気を取り入れる吸入口１３６と冷却用ファン１２４の近辺に取り入れた空気を排出する排出口１３７が設けられている。 The CPU 123 mounted on the main circuit board 121 is provided with a CPU heat radiation plate 131. Then, the cooling fan 124 rotates according to the instruction of the CPU 123, whereby cooling air flows, and the CPU heat dissipation plate 131 is cooled, so that the CPU 123 in contact with it is cooled. The housing 120 is provided with a suction port 136 for taking in outside air and a discharge port 137 for discharging air taken in the vicinity of the cooling fan 124.
　ＳＳＤ１２５は、情報端末装置に搭載される記憶装置の一例であり、ＳＳＤ用基板１２８と、ＳＳＤ用基板１２８に搭載された複数のＮＡＮＤ型フラッシュメモリ１２６と、ＳＳＤ１２５の温度を計測するＳＳＤ用温度センサ１２７を備える。ＳＳＤ１２５は、コネクタ１３５ａを介してメイン回路基板１２１と接続する。また、ＳＳＤ１２５とメイン回路基板１２１との間には、ＳＳＤ１２５を冷却する放熱プレート１３０が配置されている。ＳＳＤ用温度センサ１２７は、メイン回路基板１２１上のＣＰＵ１２３に接続されていないため、ＣＰＵ１２３は、ＳＳＤ１２５に搭載されたＮＡＮＤ型フラッシュメモリ１２６の温度を監視・制御することができない。そのため、物理的な放熱対策として、放熱プレート１３０が配置されている。その放熱対策が十分でない場合、すなわち、ＳＳＤ１２５は、ＳＳＤ用温度センサにより入手した温度が所定の値より大きくなると、ＳＳＤ１２５が熱暴走状態になったと判断する。そして、ＳＳＤ１２５の動作速度をＳＳＤ１２５自らが勝手に下げることから、情報端末装置のパフォーマンスの低下に繋がってしまう。また、熱暴走時におけるＳＳＤ１２５の動作も、メーカ毎に異なっていて統一されていない。例えば、熱暴走時に、徐々にそのパフォーマンスを下げるものや、一気にパフォーマンスを下げるものがある。そのため、情報端末装置のＣＰＵ１２３がＳＳＤ１２５の状態を直接監視してＳＳＤ１２５の動作及び冷却用ファン１２４を制御することで、ＳＳＤ１２５の予測できない動作低下による情報端末装置のパフォーマンスの低下を防止することが求められていた。 The SSD 125 is an example of a storage device mounted on an information terminal device, and includes an SSD substrate 128, a plurality of NAND flash memories 126 mounted on the SSD substrate 128, and an SSD temperature sensor that measures the temperature of the SSD 125. 127. The SSD 125 is connected to the main circuit board 121 via the connector 135a. In addition, a heat radiating plate 130 for cooling the SSD 125 is disposed between the SSD 125 and the main circuit board 121. Since the SSD temperature sensor 127 is not connected to the CPU 123 on the main circuit board 121, the CPU 123 cannot monitor and control the temperature of the NAND flash memory 126 mounted on the SSD 125. Therefore, the heat radiating plate 130 is disposed as a physical heat radiating measure. If the heat dissipation measure is not sufficient, that is, the SSD 125 determines that the SSD 125 is in a thermal runaway state when the temperature obtained by the SSD temperature sensor exceeds a predetermined value. And since the SSD 125 itself lowers the operating speed of the SSD 125 itself, it leads to a decrease in the performance of the information terminal device. Also, the operation of the SSD 125 during a thermal runaway is different for each manufacturer and is not unified. For example, when there is a thermal runaway, there are things that gradually lower the performance, and those that lower the performance at once. Therefore, the CPU 123 of the information terminal device directly monitors the state of the SSD 125 and controls the operation of the SSD 125 and the cooling fan 124 to prevent the performance of the information terminal device from being deteriorated due to the unpredictable operation of the SSD 125. It was done.
　また、近年の情報端末装置の薄型・小型、製造コストを下げることから、別途配線を設けることなく、簡便に温度センサを設置することが求められる。 In addition, since the information terminal device in recent years is thin and small, and the manufacturing cost is reduced, it is required to simply install the temperature sensor without providing a separate wiring.
　さらに、ＳＳＤにおけるＮＡＮＤ型フラッシュメモリ及び温度センサの配置は、メーカ及び作製された世代によって異なっている。そのため、メーカ毎に異なるＮＡＮＤ型フラッシュメモリが異なる場所に配置されている場合でも、適切にそれらの温度を計測することができる温度センサが求められる。 Furthermore, the arrangement of the NAND flash memory and the temperature sensor in the SSD differs depending on the manufacturer and the generation in which it is manufactured. For this reason, even if different NAND flash memories for different manufacturers are arranged at different locations, a temperature sensor capable of appropriately measuring the temperatures is required.
　図３Ａ～図１２を用いて本願発明の情報端末装置について説明する。 The information terminal device of the present invention will be described with reference to FIGS. 3A to 12. FIG.
　図３Ａは、本願発明に係る情報処理端末の一例であるノートパソコン１の端末本体１０の内部構造を示す平面図であって、端末本体１０の筐体２０の上面カバーを外した状態を示す図である。図３Ｂは、図３ＡのＢ３－Ｂ３線に沿った断面図であり、上面カバーを被せた状態を示す。端末本体１０は、図２に示す比較技術のノートパソコンの端末本体１１０と同様、筐体２０と、筐体２０の内部に設けられたメイン回路基板２１及びサブ回路基板２２と、バッテリー４０と、冷却用ファン２４とを備える。メイン回路基板２１には、処理装置であるＣＰＵ２３と、記憶装置であるＳＳＤ２５が搭載されている。ＳＳＤ２５は、コネクタ３５ａによりメイン回路基板２１に接続される。サブ回路基板２２には例えば外部装置と接続するための端子等が搭載される。 FIG. 3A is a plan view showing the internal structure of the terminal body 10 of the notebook personal computer 1 which is an example of the information processing terminal according to the present invention, and shows a state in which the top cover of the casing 20 of the terminal body 10 is removed. It is. FIG. 3B is a cross-sectional view taken along line B3-B3 of FIG. 3A and shows a state where the top cover is covered. The terminal body 10 is similar to the terminal body 110 of the notebook computer of the comparative technique shown in FIG. 2, the housing 20, the main circuit board 21 and the sub circuit board 22 provided inside the housing 20, the battery 40, And a cooling fan 24. On the main circuit board 21, a CPU 23 as a processing device and an SSD 25 as a storage device are mounted. The SSD 25 is connected to the main circuit board 21 by a connector 35a. For example, terminals for connecting to an external device are mounted on the sub circuit board 22.
　メイン回路基板２１に搭載されたＣＰＵ２３には、ＣＰＵ用放熱プレート３１が設けられている。冷却用ファン２４は、ＣＰＵ２３の指示により回り、冷却風でＣＰＵ用放熱プレート３１を冷却することでＣＰＵ２３を冷却することができる。また、この冷却用ファン２４が回ることで、メイン回路基板２１に設けられたＳＳＤ２５も冷却することができる。筐体２０には、外気を取り入れる吸入口３６と取り入れた外気を排出する排出口３７が形成される。 The CPU 23 mounted on the main circuit board 21 is provided with a CPU heat radiation plate 31. The cooling fan 24 rotates in response to an instruction from the CPU 23 and can cool the CPU 23 by cooling the CPU heat radiation plate 31 with cooling air. Further, the cooling fan 24 rotates, so that the SSD 25 provided on the main circuit board 21 can also be cooled. The housing 20 is formed with a suction port 36 for taking in outside air and a discharge port 37 for discharging the taken outside air.
　本実施形態では、比較技術の情報端末装置と同様に、記憶装置としてＳＳＤ２５（温度計測対象物の一例）が搭載されている。ＳＳＤ２５は、ＳＳＤ用基板２８と、ＳＳＤ用基板２８に搭載された複数のＮＡＮＤ型フラッシュメモリ２６と、ＳＳＤ２５の温度を計測するＳＳＤ用温度センサ２７を備える。ＳＳＤ２５は、コネクタ３５ａを介してメイン回路基板２１に接続する。また、ＳＳＤ２５とメイン回路基板２１との間には、ＳＳＤ２５を冷却する放熱プレート３０が配置される。 In this embodiment, an SSD 25 (an example of a temperature measurement object) is mounted as a storage device, similarly to the information terminal device of the comparative technique. The SSD 25 includes an SSD substrate 28, a plurality of NAND flash memories 26 mounted on the SSD substrate 28, and an SSD temperature sensor 27 that measures the temperature of the SSD 25. The SSD 25 is connected to the main circuit board 21 via the connector 35a. Further, a heat dissipation plate 30 for cooling the SSD 25 is disposed between the SSD 25 and the main circuit board 21.
　本実施形態の情報端末装置１では、図３Ａ及び図３Ｂに示されるように、メイン回路基板２１とサブ回路基板２２とを接続するフレキシブル回路基板２９が、ＳＳＤ２５を跨ぐように配置される。フレキシブル回路基板２９は一方の端部がメイン回路基板２１のコネクタ３５ｂに、他方の端部がサブ回路基板２２のコネクタ３５ｃに接続される。フレキシブル回路基板２９は、図４Ａに示すように複数の配線３４が内部を通っていて、メイン回路基板２１とサブ回路基板２２のそれぞれに設けられたコネクタ３５ｂ、３５ｃを介して、メイン回路基板２１とサブ回路基板２２との間で信号を送受信している。さらに、フレキシブル回路基板２９がＳＳＤ２５を跨ぐ部分の上側に、ＳＳＤ２５の温度を計測する温度センサ３２が設けられる。温度センサ３２は図４Ｂ、図５に示すように、フレキシブル回路基板２９の複数の配線３４の２本と接続されている。配線３４はＳＳＤ２５と近接していることから、温度センサ３２はＳＳＤ２５の温度を計測することができる。また、温度センサ３２に接続する配線の１本は、ＣＰＵ２３と接続されており、温度センサ３２が計測した温度情報を、配線３４を介してＣＰＵ２３に送付することができる。すなわち、ＣＰＵ２３は、温度センサ３２と接続した配線３４の一部を介して、温度センサ３２で計測されたＳＳＤ２５の温度情報を受信する。なお、ＣＰＵ２３と温度センサ３２を接続する配線３４は、例えば基板同士の信号の連絡に使用されない配線を使用する。 In the information terminal device 1 of the present embodiment, as shown in FIGS. 3A and 3B, a flexible circuit board 29 that connects the main circuit board 21 and the sub circuit board 22 is disposed so as to straddle the SSD 25. One end of the flexible circuit board 29 is connected to the connector 35 b of the main circuit board 21, and the other end is connected to the connector 35 c of the sub circuit board 22. As shown in FIG. 4A, the flexible circuit board 29 has a plurality of wirings 34 passing therethrough, and the main circuit board 21 is connected via connectors 35b and 35c provided on the main circuit board 21 and the sub circuit board 22, respectively. And the sub circuit board 22 transmit and receive signals. Furthermore, a temperature sensor 32 that measures the temperature of the SSD 25 is provided above the portion where the flexible circuit board 29 straddles the SSD 25. As shown in FIGS. 4B and 5, the temperature sensor 32 is connected to two of the plurality of wirings 34 of the flexible circuit board 29. Since the wiring 34 is close to the SSD 25, the temperature sensor 32 can measure the temperature of the SSD 25. One of the wirings connected to the temperature sensor 32 is connected to the CPU 23, and the temperature information measured by the temperature sensor 32 can be sent to the CPU 23 via the wiring 34. That is, the CPU 23 receives the temperature information of the SSD 25 measured by the temperature sensor 32 via a part of the wiring 34 connected to the temperature sensor 32. In addition, the wiring 34 which connects CPU23 and the temperature sensor 32 uses the wiring which is not used for the communication of the signal of board | substrates, for example.
　フレキシブル回路基板２９は薄い板状であることから、発熱する温度計測対象物のＳＳＤ２５上に配置すれば、フレキシブル回路基板２９上とその裏面側の部分も略同じ熱になる。そのため、フレキシブル回路基板２９上に温度センサ３２を配置すれば、ＳＳＤ２５の温度を計測することが可能になる。 Since the flexible circuit board 29 is a thin plate, if it is arranged on the SSD 25 of the temperature measurement object that generates heat, the flexible circuit board 29 and the back side thereof also have substantially the same heat. Therefore, if the temperature sensor 32 is arranged on the flexible circuit board 29, the temperature of the SSD 25 can be measured.
　温度センサ３２は、配線３４と接続可能であればフレキシブル回路基板２９上の何れの場所に配置されてよい。また、図３Ｂに示されるように、フレキシブル回路基板２９と温度計測対象物であるＳＳＤ２５とが密着するよう、筐体２０の内壁とフレキシブル回路基板２９との間に固定用クッション３９が配置されてもよい。 The temperature sensor 32 may be disposed at any location on the flexible circuit board 29 as long as it can be connected to the wiring 34. Further, as shown in FIG. 3B, a fixing cushion 39 is disposed between the inner wall of the housing 20 and the flexible circuit board 29 so that the flexible circuit board 29 and the SSD 25 as the temperature measurement object are in close contact with each other. Also good.
　図６Ａ、図６Ｂ及び図７に、本願発明の情報端末装置で用いられるフレキシブル回路基板の第２の実施例を示す。フレキシブル回路基板２９ａは、ＳＳＤ２５を跨ぐ部分に、配線３４を配置するかわりに、温度検出を補助するための金属パターン３３を備える。金属パターン３３は、フレキシブル回路基板２９の配線の一部の幅を拡大して設けられる。第２の実施例の金属パターン３３は銅で作製されるが、金属パターン３３は熱伝導性の良い金属で形成されていれば他の材料、例えばアルミニウムで形成されてよい。フレキシブル回路基板２９ａは通常の配線３４を利用する場合と比較して幅が広くなり、より広範囲でＳＳＤ２５と接触することが可能である。すなわち、ＮＡＮＤ型フラッシュメモリ２６の配置はメーカにより異なるが、幅が広い金属パターン３３を設けることで、ＮＡＮＤ型フラッシュメモリ２６に接触して計測することが可能となる。 6A, 6B and 7 show a second embodiment of the flexible circuit board used in the information terminal device of the present invention. The flexible circuit board 29a includes a metal pattern 33 for assisting temperature detection instead of arranging the wiring 34 in a portion straddling the SSD 25. The metal pattern 33 is provided by enlarging the width of a part of the wiring of the flexible circuit board 29. Although the metal pattern 33 of the second embodiment is made of copper, the metal pattern 33 may be made of another material, such as aluminum, as long as it is made of a metal having good thermal conductivity. The flexible circuit board 29a is wider than the case where the normal wiring 34 is used, and can contact the SSD 25 in a wider range. That is, although the arrangement of the NAND flash memory 26 differs depending on the manufacturer, it is possible to perform measurement by contacting the NAND flash memory 26 by providing the wide metal pattern 33.
　図８Ａ、図８Ｂ及び図９に第３の実施例であるフレキシブル回路基板２９ｂが示される。第２の実施例のフレキシブル回路基板２９ａのように幅の広い金属パターン３３が配置されると、配線３４を通す面積が狭くなり、配線３４の本数が少なくなる。第３の実施例では、フレキシブル回路基板２９ｂに配線３４が通る層と金属パターン３３ｂが形成される層とを分けて設けることにより、金属パターン３３ｂの幅をフレキシブル回路基板２９ｂの幅に揃え、且つ、配線３４の本数を維持することができる。ＳＳＤ２５の幅とフレキシブル回路基板２９ｂの金属パターン３３ｂの幅とが略同じ大きさになれば、ＮＡＮＤ型フラッシュメモリ２６がどのように配置されても、金属パターン３３ｂはＮＡＮＤ型フラッシュメモリ２６の熱を受け取ることができる。 8A, 8B and 9 show a flexible circuit board 29b according to the third embodiment. When the wide metal pattern 33 is arranged like the flexible circuit board 29a of the second embodiment, the area through which the wiring 34 passes is reduced, and the number of the wirings 34 is reduced. In the third embodiment, by providing the flexible circuit board 29b with a layer through which the wiring 34 passes and a layer on which the metal pattern 33b is formed, the width of the metal pattern 33b is made equal to the width of the flexible circuit board 29b, and The number of wirings 34 can be maintained. If the width of the SSD 25 and the width of the metal pattern 33b of the flexible circuit board 29b are substantially the same size, the metal pattern 33b can remove the heat of the NAND flash memory 26 no matter how the NAND flash memory 26 is arranged. Can receive.
　図１０に第４の実施例であるフレキシブル回路基板２９ｃが示される。図８Ａ、図８Ｂ及び図９に示されるフレキシブル回路基板２９ｂでは、フレキシブル回路基板２９ｂの内部は２層となっていて、配線３４と金属パターン３３ｂとが配置されていた。図１０に示すフレキシブル回路基板２９ｃでは、単層のままフレキシブル回路基板２９の中央部に金属パターン３３が配置され、金属パターン３３が配置された部分のフレキシブル回路基板２９の幅が配置されていない部分の幅よりも広くなっている。そして、金属パターン３３の両側に配線３４が配置されている。このように金属パターン３３と配線３４が配置されることで、配線３４の本数が維持されると共に、より幅の広い金属パターン３３を設けることができる。 FIG. 10 shows a flexible circuit board 29c according to the fourth embodiment. In the flexible circuit board 29b shown in FIGS. 8A, 8B, and 9, the inside of the flexible circuit board 29b has two layers, and the wiring 34 and the metal pattern 33b are arranged. In the flexible circuit board 29c shown in FIG. 10, the metal pattern 33 is arranged at the center of the flexible circuit board 29 with a single layer, and the width of the flexible circuit board 29 where the metal pattern 33 is arranged is not arranged. It is wider than the width. In addition, wirings 34 are arranged on both sides of the metal pattern 33. By arranging the metal patterns 33 and the wirings 34 in this manner, the number of the wirings 34 can be maintained, and a wider metal pattern 33 can be provided.
　図１１Ａ及び図１１Ｂに第５の実施例であるフレキシブル回路基板２９ｄが示される。第２から第４の実施例では別途金属パターン３３がフレキシブル回路基板２９に予め作製して設けられていた。第５の実施例では、全配線３４の一部の複数の配線３４が連結されることで温度検出補助用の金属パターンが形成される。複数の配線３４の連結は、図１１Ａに示すように、フレキシブル回路基板２９ｄがＳＳＤ２５を覆ったときに、ＳＳＤ２５の端部の近辺で行われることが望ましい。複数の配線３４の連結は、フレキシブル回路基板の被覆を貫通する孔が形成され、その孔を介して被覆の外部において金属テープ等の連結用金属３８が設けられることにより連結することができる。温度センサ３２は複数の配線３４を介して温度情報をＳＳＤ２５から取得することができる。 FIG. 11A and FIG. 11B show a flexible circuit board 29d according to the fifth embodiment. In the second to fourth embodiments, the metal pattern 33 is separately prepared and provided on the flexible circuit board 29 in advance. In the fifth embodiment, a temperature detection assisting metal pattern is formed by connecting some of the wirings 34 of all the wirings 34. As shown in FIG. 11A, the plurality of wirings 34 are preferably connected in the vicinity of the end portion of the SSD 25 when the flexible circuit board 29 d covers the SSD 25. The plurality of wirings 34 can be connected by forming a hole penetrating the coating of the flexible circuit board and providing a connecting metal 38 such as a metal tape outside the coating through the hole. The temperature sensor 32 can acquire temperature information from the SSD 25 via a plurality of wires 34.
　温度センサ３２を用いてＳＳＤ２５を制御する手順について図１２を用いて説明する。なお、図１２には符号は省略してあるが説明では各部材に符号を付してある。ステップＳ１０１では、ＣＰＵ２３は温度センサ３２から温度情報を受信し、ＳＳＤ２５の温度を検知する。次に、ステップＳ１０２で、ＣＰＵ２３はＳＳＤ２５の温度が予め決められた温度（規定値）以下であるか否かを判断する。ＳＳＤ２５の温度が決められた温度以下である場合（ＹＥＳの場合）は、ＳＳＤ２５が熱暴走状態である危険性はないとＣＰＵ２３は判断し、特にＳＳＤ２５に対する処理をすることなく、温度センサ３２にＳＳＤ２５の温度の検知を継続させる。ＳＳＤ２５の温度が規定値以下ではない場合（ＮＯの場合）は、ＳＳＤ２５が熱暴走状態になる可能性があることから、ＣＰＵ２３はＳＳＤ２５を冷却するための処理を実行する。例えば、ＣＰＵ２３は冷却用ファン２４の回転数を上げ（回転数ＵＰ）風量を増大させるか、又はＣＰＵ２３の動作速度（動作周波数）を下げる（Ｃｌｏｃｋ　Ｄｏｗｎ）処理を行う。 The procedure for controlling the SSD 25 using the temperature sensor 32 will be described with reference to FIG. In addition, although the code | symbol is abbreviate | omitted in FIG. 12, the code | symbol is attached | subjected to each member in description. In step S <b> 101, the CPU 23 receives temperature information from the temperature sensor 32 and detects the temperature of the SSD 25. Next, in step S102, the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a predetermined temperature (specified value). When the temperature of the SSD 25 is equal to or lower than a predetermined temperature (in the case of YES), the CPU 23 determines that there is no danger that the SSD 25 is in a thermal runaway state, and the SSD 25 is not sent to the temperature sensor 32 without performing any particular processing on the SSD 25. Continue to detect the temperature. When the temperature of the SSD 25 is not lower than the specified value (in the case of NO), the SSD 25 may be in a thermal runaway state, so the CPU 23 executes a process for cooling the SSD 25. For example, the CPU 23 performs a process of increasing the rotational speed of the cooling fan 24 (rotational speed UP), increasing the air volume, or decreasing the operating speed (operating frequency) of the CPU 23 (Clock Down).
　ＣＰＵ２３は、ＳＳＤ２５を冷却する処理を実行したのち、温度センサ３２から受信した温度情報に基づいて再度ＳＳＤ２５の温度を検知する（ステップＳ１０４）。そして、ＣＰＵ２３はＳＳＤ２５の温度が規定値以下であるか否かを判断する（ステップＳ１０５）。規定値を下回った場合（ＹＥＳの場合）は、熱暴走状態になる可能性はなくなったと判断する。そして、冷却用ファン２４の回転数を下げて（回転数ＤＯＷＮ）風量を低減させるか、又はＣＰＵ２３の動作速度（動作周波数）を上げる（Ｃｌｏｃｋ　Ｕｐ）処理を行う（ステップＳ１０６）。規定値を下回らない場合（ＮＯの場合）は、ＳＳＤ２５を冷却する処理をそのまま続け、ＳＳＤ２５の温度の検知を継続するようステップＳ１０４に戻る。最終的に温度の検知は、情報端末装置１の電源がＯＦＦされるまで継続される（ステップＳ１０７）。ステップＳ１０７で電源がＯＦＦされない場合（ＮＯの場合）は、ステップＳ１０１に戻り、ＣＰＵ２３はＳＳＤ２５の温度を検知して、熱暴走状態とならないよう監視を継続する。 After executing the process of cooling the SSD 25, the CPU 23 detects the temperature of the SSD 25 again based on the temperature information received from the temperature sensor 32 (step S104). Then, the CPU 23 determines whether or not the temperature of the SSD 25 is equal to or lower than a specified value (step S105). If it falls below the specified value (in the case of YES), it is determined that there is no longer a possibility of a thermal runaway state. Then, the rotation speed of the cooling fan 24 is decreased (rotation speed DOWN) to reduce the air volume, or the operation speed (operation frequency) of the CPU 23 is increased (Clock Up) (step S106). If it does not fall below the specified value (in the case of NO), the process of cooling the SSD 25 is continued as it is, and the process returns to step S104 so as to continue detecting the temperature of the SSD 25. The temperature detection is continued until the information terminal device 1 is turned off (step S107). If the power is not turned off in step S107 (in the case of NO), the process returns to step S101, and the CPU 23 detects the temperature of the SSD 25 and continues monitoring so as not to be in a thermal runaway state.
　このように、フレキシブル回路基板２９に設けた温度センサ３２で計測した温度情報を基にＣＰＵ２３は、ＳＳＤ２５が勝手に熱暴走状態とならないよう制御することができる。そして意図された情報端末装置１のパフォーマンスのコントロールが可能になる。 Thus, based on the temperature information measured by the temperature sensor 32 provided on the flexible circuit board 29, the CPU 23 can control the SSD 25 so that it does not go into a thermal runaway state. The intended performance of the information terminal device 1 can be controlled.
　ＳＳＤ２５の温度情報の取得がフレキシブル回路基板２９の配置を変更するのみで行うことができるため、別途追加の配線が設けなくてもよい。そのため、回路基板に設ける配線等の部品が増加することはなく、配線等を組み入れるための作業数も増えない。 Since the temperature information of the SSD 25 can be obtained only by changing the arrangement of the flexible circuit board 29, no additional wiring is required. Therefore, the number of parts such as wiring provided on the circuit board does not increase, and the number of operations for incorporating wiring and the like does not increase.
　温度計測対象物であるＳＳＤ２５は、ＰＣＩｅ接続によるＭ．２（エムドットツー）タイプのＳＳＤであってもよい。また、ＳＳＤ２５は、ＳＡＴＡ接続によるＳＳＤであってもかまわない。また、温度計測対象物はＳＳＤに限定されず、熱を発生する可能性の装置、例えばＨＤＤ、デスクトップパソコン用のメモリ（ＤＩＭＭ）、又はノートパソコン等で使用されるメモリ（Ｓ.Ｏ．ＤＩＭＭ）であってもよい。 The SSD 25, which is a temperature measurement object, is an M.M. It may be a 2 (M dot toe) type SSD. The SSD 25 may be an SSD with SATA connection. Further, the temperature measurement object is not limited to SSD, but a device that can generate heat, for example, HDD, memory for desktop personal computer (DIMM), memory used in notebook personal computer (SO.DIMM), etc. It may be.
　以上、本出願を特にその好ましい実施の形態を参照して詳細に説明した。本出願の容易な理解のために、本出願の具体的な形態を以下に付記する。 In the foregoing, the present application has been described in detail with particular reference to preferred embodiments thereof. For easy understanding of the present application, specific forms of the present application are appended below.
（付記１）温度が計測される温度計測対象物と、
　前記温度計測対象物を跨ぐように配置されるフレキシブル回路基板と、
　前記温度計測対象物の温度を計測する温度センサであって、前記フレキシブル回路基板の前記温度計測対象物を跨ぐ部分に設けられ、前記フレキシブル回路基板の配線の一部に接続される、温度センサと、
　前記温度センサが接続された前記フレキシブル回路基板の前記配線の一部を介して、前記温度センサで計測された前記温度計測対象物の温度情報を受信して処理する処理装置と、を備える情報端末装置。
（付記２）前記フレキシブル回路基板は、前記温度センサと接続する温度検出補助用の金属パターンを備え、前記金属パターンは、前記フレキシブル回路基板の前記配線の一部の幅を拡大して設けられる付記１に記載の情報端末装置。
（付記３）前記処理装置は、前記温度センサから受信した前記温度計測対象物の温度情報に基づいて、前記温度計測対象物の動作を制御する付記１又は２に記載の情報端末装置。
（付記４）前記金属パターンは、前記フレキシブル回路基板が跨ぐ前記温度計測対象物の幅まで拡大された幅を備える付記２に記載の情報端末装置。
（付記５）前記フレキシブル回路基板は、前記温度センサと接続する温度検出補助用の金属パターンを備え、前記金属パターンは、前記フレキシブル回路基板の前記配線がある層とは別の層に配置される付記１に記載の情報端末装置。 (Appendix 1) A temperature measurement object whose temperature is measured;
A flexible circuit board arranged to straddle the temperature measurement object;
A temperature sensor that measures the temperature of the temperature measurement object, the temperature sensor being provided in a portion of the flexible circuit board that straddles the temperature measurement object, and connected to a part of the wiring of the flexible circuit board; ,
An information terminal comprising: a processing device that receives and processes temperature information of the temperature measurement object measured by the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected. apparatus.
(Additional remark 2) The said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected to the said temperature sensor, The said metal pattern is expanded and provided in the width | variety of a part of said wiring of the said flexible circuit board. 1. The information terminal device according to 1.
(Additional remark 3) The said processing apparatus is an information terminal device of Additional remark 1 or 2 which controls operation | movement of the said temperature measurement target object based on the temperature information of the said temperature measurement target object received from the said temperature sensor.
(Additional remark 4) The said metal pattern is an information terminal device of Additional remark 2 provided with the width | variety expanded to the width | variety of the said temperature measurement target object which the said flexible circuit board straddles.
(Additional remark 5) The said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected with the said temperature sensor, and the said metal pattern is arrange | positioned in the layer different from the layer with the said wiring of the said flexible circuit board. The information terminal device according to attachment 1.
　１　　ノートパソコン
　１０、１１０　端末本体
　１１　ディスプレイ
　２０、１２０　筐体
　２１、１２１　メイン回路基板
　２２、１２２　サブ回路基板
　２３、１２３　ＣＰＵ
　２４、１２４　冷却用ファン
　２５、１２５　ＳＳＤ
　２６、１２６　ＮＡＮＤ型フラッシュメモリ
　２７、１２７　ＳＳＤ用温度センサ
　２８、１２８　ＳＳＤ用基板
　２９、２９ａ、２９ｂ、２９ｃ、２９ｄ、１２９　フレキシブル回路基板
　３０、１３０　放熱プレート
　３１、１３１　ＣＰＵ用放熱プレート
　３２　温度センサ
　３３、３３ｂ　金属パターン
　３４　配線
　３５ａ、３５ｂ、３５ｃ、１３５ａ、１３５ｂ、１３５ｃ　コネクタ
　３６、１３６　吸入口
　３７、１３７　排出口
　３９　固定用クッション
　３８　連結用金属
　４０、１４０　バッテリー DESCRIPTION OF SYMBOLS 1 Notebook personal computer 10,110 Terminal body 11 Display 20, 120 Case 21, 121 Main circuit board 22, 122 Sub circuit board 23, 123 CPU
24, 124 Cooling fan 25, 125 SSD
26, 126 NAND flash memory 27, 127 SSD temperature sensor 28, 128 SSD substrate 29, 29a, 29b, 29c, 29d, 129 Flexible circuit board 30, 130 Heat dissipation plate 31, 131 CPU heat dissipation plate 32 Temperature sensor 33 33b Metal pattern 34 Wiring 35a, 35b, 35c, 135a, 135b, 135c Connector 36, 136 Suction port 37, 137 Discharge port 39 Fixing cushion 38 Connecting metal 40, 140 Battery

Claims (3)

  1. 　温度が計測される温度計測対象物と、
    　前記温度計測対象物を跨ぐように配置されるフレキシブル回路基板と、
    　前記温度計測対象物の温度を計測する温度センサであって、前記フレキシブル回路基板の前記温度計測対象物を跨ぐ部分に設けられ、前記フレキシブル回路基板の配線の一部に接続される温度センサと、
    　前記温度センサが接続された前記フレキシブル回路基板の前記配線の一部を介して、前記温度センサで計測された前記温度計測対象物の温度情報を受信して処理する処理装置と、を備える情報端末装置。     A temperature measurement object whose temperature is measured;
    A flexible circuit board arranged to straddle the temperature measurement object;
    A temperature sensor for measuring the temperature of the temperature measurement object, provided at a portion straddling the temperature measurement object of the flexible circuit board, and connected to a part of the wiring of the flexible circuit board,
    An information terminal comprising: a processing device that receives and processes temperature information of the temperature measurement object measured by the temperature sensor via a part of the wiring of the flexible circuit board to which the temperature sensor is connected. apparatus.
  2. 　前記フレキシブル回路基板は、前記温度センサと接続する温度検出補助用の金属パターンを備え、前記金属パターンは、前記フレキシブル回路基板の配線の一部の幅を拡大して設けられる請求項１に記載の情報端末装置。 The said flexible circuit board is equipped with the metal pattern for temperature detection assistance connected with the said temperature sensor, The said metal pattern is expanded and provided in the one part width | variety of the wiring of the said flexible circuit board. Information terminal device.
  3. 　前記処理装置は、前記温度センサから受信した温度情報に基づいて、前記温度計測対象物の動作を制御する請求項１又は２に記載の情報端末装置。 3. The information terminal device according to claim 1, wherein the processing device controls the operation of the temperature measurement object based on temperature information received from the temperature sensor.
PCT/JP2018/004739 2017-03-14 2018-02-09 Information terminal device WO2018168287A1 (en)

Applications Claiming Priority (2)

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JP2017-048890 2017-03-14
JP2017048890A JP2018151314A (en) 2017-03-14 2017-03-14 Information terminal device

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JP7292873B2 (en) * 2018-12-26 2023-06-19 キヤノン株式会社 image forming device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07296786A (en) * 1994-04-22 1995-11-10 Matsushita Electric Ind Co Ltd Battery case
JP2002124618A (en) * 2000-10-18 2002-04-26 Unisia Jecs Corp Semiconductor device
JP2008084019A (en) * 2006-09-27 2008-04-10 Toshiba Corp Electronic device
JP2014011385A (en) * 2012-07-02 2014-01-20 Nec Access Technica Ltd Electronic device, electronic apparatus, and manufacturing method of electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07296786A (en) * 1994-04-22 1995-11-10 Matsushita Electric Ind Co Ltd Battery case
JP2002124618A (en) * 2000-10-18 2002-04-26 Unisia Jecs Corp Semiconductor device
JP2008084019A (en) * 2006-09-27 2008-04-10 Toshiba Corp Electronic device
JP2014011385A (en) * 2012-07-02 2014-01-20 Nec Access Technica Ltd Electronic device, electronic apparatus, and manufacturing method of electronic device

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