JP2014011338A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of making inductance much lower.SOLUTION: A positive electrode terminal 13 and a negative electrode terminal 14 constituting one part of positive electrode side wiring and negative electrode side wiring sealed in a resin mold section 18 are made into a plate-like conductor 16 constituted by a parallel conductor. A short-circuit direction for connecting the positive electrode terminal 13 and the negative electrode terminal 14 is an opposite direction. Therefore, regarding the plate-like conductor 16, magnetic offset can be generated, so as to make inductance low. Then, in this structure, the plate-like conductor 16 constituted by the parallel conductor enters into the resin mold section 18. Therefore, an area to be a more parallel conductor can be increased, and an area for generating more magnetic offset can be increased, so as to make inductance much lower.

Description

  The present invention relates to a semiconductor device having a bridge circuit in which a semiconductor switching element is provided in each of an upper arm and a lower arm.

  Conventionally, as a semiconductor device having a bridge circuit in which a semiconductor switching element is provided in each of an upper arm and a lower arm, there is a power conversion device provided with a three-phase inverter circuit of u phase, v phase, and w phase (Patent Document 1). reference). This power conversion device includes power semiconductor elements in the upper arm and the lower arm of each of the three phases, and converts a direct current into an alternating current by a switching operation of the power semiconductor element.

  In this power conversion device, a rectangular flat parallel conductor in which a positive electrode terminal and a negative electrode terminal are bonded together with an insulating film interposed therebetween is used as an input terminal. On one side of the parallel conductor, an input bus bar (hereinafter referred to as a positive input bus bar) constituting a part of the positive electrode side wiring and an input bus bar (hereinafter referred to as a negative input bus bar) constituting a part of the negative electrode side wiring are mutually connected. It extends in parallel with a predetermined interval. Further, the power semiconductor elements of the upper arm for three phases are arranged at equal intervals on the positive input bus bar, and the power semiconductor elements of the lower arm for three phases are arranged at equal intervals on the negative input bus bar. Then, the output bus bar for three phases extends vertically to the input bus bar so as to connect the upper arm and the lower arm of each phase, and an alternating current is supplied through the output bus bar. Connected to the load.

Japanese Patent No. 3793407

  The three-phase inverter circuit is a bridge in which a semiconductor switching element J1 such as an IGBT and a reflux diode (hereinafter referred to as FWD) J2 are connected in parallel as shown in FIG. The circuit J3 includes three phases. The three-phase inverter circuit is connected to a load such as a motor, and by switching on and off the semiconductor switching element J1 of the upper arm and the lower arm, the DC current supplied from the DC power source is converted into an AC current, To be supplied. FIG. 14 shows the state of the drain-source current Ids, the drain-source voltage Vds, and the switching loss Esw at this time.

  In the circuit configuration as described above, a short-circuit loop of the upper and lower arms indicated by arrows in FIG. 13 is formed, and dI / dt in the short-circuit loop when the semiconductor switching element J1 on the lower arm side is switched from on to off. Change has occurred.

  Here, as shown in FIG. 14, a surge voltage ΔVsur is generated during switching. This surge voltage ΔVsur is expressed by the following equation. In the following equation, L indicates inductance in a short-circuit loop.

(Equation 1) ΔVsur = L · dI / dt
The surge voltage ΔVsur tends to increase due to the large current / high-speed switching that has been promoted in recent years. Surge protection can be realized if the element breakdown voltage is set high, but the on-resistance in a trade-off relationship increases, resulting in an increase in steady loss. In addition, there is a need for reduction in switching loss Esw and downsizing of the apparatus, and in order to meet these needs, improvement in dI / dt and higher frequency are required. Therefore, in order to improve dI / dt without increasing the surge voltage ΔVsur, it is necessary to reduce the inductance in the short-circuit loop.

  In order to achieve low inductance, each part constituting the positive electrode side wiring and each part constituting the negative electrode side wiring of the semiconductor device provided with the three-phase inverter circuit are configured with parallel conductors as much as possible. It is considered effective to allow currents to flow in opposite directions. This is because it is possible to cause magnetic cancellation between the positive electrode side wiring and the negative electrode side wiring, and a reduction in inductance can be achieved.

  However, in the structure as described in Patent Document 1, the region that is a parallel conductor is limited to the input terminal, and the reduction in inductance is insufficient. Specifically, the connection place between the positive electrode terminal and the positive electrode input bus bar and the connection place between the negative electrode terminal and the negative electrode input bus bar in the plate-like conductor constituting the input terminal are completely different, and the positive electrode input bus bar and the negative electrode input bus bar are different. They are also offset and are not parallel conductors. And about the positive electrode input bus bar and the negative electrode input bus bar, it has shifted in the plane direction of each bus bar comprised by plate shape, and the planes of each bus bar are not opposingly arranged. For this reason, the magnetic canceling effect by the positive input bus bar and the negative input bus bar is small, and a reduction in inductance cannot be achieved. In addition, since the path from the positive electrode to the negative electrode is different for the u phase, the v phase, and the w phase, variations in inductance occur.

  Here, a semiconductor device having a three-phase inverter circuit having three phases of u-phase, v-phase, and w-phase, that is, six arms are modularized as one because upper and lower arms are provided in each phase. The 6-in-1 structure has been described as an example. However, this is merely an example. For example, a 2-in-1 structure in which only one phase is modularized or a 4-in-1 structure in which a bridge circuit for two phases such as an H-bridge circuit is modularized has the same problem as described above. Will occur.

  In view of the above points, an object of the present invention is to provide a semiconductor device capable of further reducing inductance.

  In order to achieve the above object, according to the first aspect of the present invention, the upper arm (51, 53, 55) and the lower arm (52, 54, 56) are respectively provided on the front surface side and the back surface side of the semiconductor chip (10). In the semiconductor device in which the heat sinks (11, 12) are arranged, the positive terminal (13) connected to the heat sink connected to the positive side of the semiconductor chip of the upper arm, and the negative side of the semiconductor chip of the lower arm A negative terminal (14) connected to the connected heat sink; and an insulating film (15) disposed between the positive terminal and the negative terminal, the positive terminal and the negative terminal sandwiching the insulating film And a lead conductor part (16) having parallel conductors arranged opposite to each other, covering the semiconductor chip with the resin mold part (18), and from the resin mold part on the side opposite to the semiconductor chip of the heat sink A positive terminal and exposes a portion of the negative terminal, is characterized in that as a part enters the parallel conductors of the at least lead conductor portion.

  Thus, it has the structure where the extraction conductor part comprised with a parallel conductor has penetrated into the resin mold part. For this reason, the area used as a parallel conductor can be increased more. Therefore, it is possible to increase the area where magnetic cancellation can be generated, and to further reduce the inductance.

  In the invention according to claim 2, the heat radiating plate has an upper heat radiating plate (11) disposed on the front surface side of the semiconductor chip and a lower heat radiating plate (12) disposed on the back surface side of the semiconductor chip, The upper heat sink of the upper arm and the lower heat sink of the lower arm are electrically connected via the upper and lower arm relay electrodes (21), and the positive terminal is connected to the lower heat sink of the upper arm. The negative terminal is connected to the upper heat sink of the lower arm, and after the short circuit direction from the positive terminal to the negative terminal flows in the order of the lower heat sink, the semiconductor chip, and the upper heat sink in the upper arm, A current path that flows to the lower arm via the upper and lower arm relay electrodes and flows to the negative terminal after flowing in the order of the lower heat sink, the semiconductor chip, and the upper heat sink is formed in the lower arm.

  In such a configuration, the upper and lower heat radiating plates are also arranged to face each other in the respective arms and face each other. Since the current can flow in the opposite direction in each of the upper and lower heat sinks arranged in opposition, it is possible to cause magnetic cancellation by flowing the current in the reverse direction in the upper and lower heat sinks. It becomes. As a result, it is possible to further reduce the inductance between the upper and lower radiator plates in the resin mold portion.

  The invention according to claim 5 is characterized in that recesses (11f, 12f) are formed in the outer edge portion of the surface of the heat radiating plate exposed from the resin mold portion.

  Thus, if a recessed part is formed in the outer edge part of a heat sink, a resin mold part will also enter here, and it becomes possible to improve the holdability of a heat sink. For this reason, the distortion by the thermal stress of a heat sink can be reduced, the stress application to the semiconductor chip arrange | positioned between heat sinks can be suppressed more, and peeling with a semiconductor chip and a joining material etc. can be suppressed.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows an example of a corresponding relationship with the specific means as described in embodiment mentioned later.

1 is a circuit diagram of an inverter circuit 1 to which a semiconductor module as a semiconductor device according to a first embodiment of the present invention is applied. 2 is a perspective view of a semiconductor module 6. FIG. 4 is a perspective view showing an example of a semiconductor module 6. FIG. 4 is a perspective view showing an example of a semiconductor module 6. FIG. It is an exploded view of the semiconductor module 6 before the resin mold. FIG. 4 is an exploded view showing a state where various relay electrodes 19 are connected to the semiconductor chip 10 and the upper and lower arm relay electrodes 21 and the plate-like conductor 16 are connected to the lower heat radiation plate 12 with respect to FIG. 3. FIG. 5 is a cross-sectional view of the semiconductor module 6 at a position corresponding to the line VA-VA ′ in FIG. 4. FIG. 5 is a cross-sectional view of the semiconductor module 6 at a position corresponding to the line VB-VB ′ in FIG. 4. FIG. 5 is a cross-sectional view of the semiconductor module 6 at a position corresponding to the line VC-VC ′ in FIG. 4. FIG. 5 is a cross-sectional view of the semiconductor module 6 at a position corresponding to the line VD-VD ′ in FIG. 4. 3 is a front view of a plate-like conductor 16. FIG. It is VIB-VIB 'sectional drawing in FIG. 6A. 2 is a front view of a positive electrode terminal 13. FIG. 3 is a front view of a negative electrode terminal 14. FIG. It is a layout diagram when the positive electrode terminal 13 and the negative electrode terminal 14 are overlapped. FIG. 5 is a cross-sectional view of the semiconductor module 6 according to the second embodiment of the present invention at a position corresponding to the line VB-VB ′ in FIG. 4. It is a front view of the plate-shaped conductor 16 concerning 3rd Embodiment of this invention. It is sectional drawing of the semiconductor module 6 concerning 4th Embodiment of this invention. FIG. 9B is a top view of the semiconductor module 6 shown in FIG. 9A. It is sectional drawing of the semiconductor module 6 concerning the modification of 4th Embodiment. It is sectional drawing of the semiconductor module 6 concerning the modification of 4th Embodiment. FIG. 11B is a top view of the semiconductor module 6 shown in FIG. 11A. It is sectional drawing which showed the positive electrode terminal 13, the negative electrode terminal 14, each heat sink 11,12, etc. with which the semiconductor module 6 concerning 5th Embodiment of this invention is equipped. It is the time chart which showed the mode at the time of switching of the semiconductor switching element J1 in the bridge circuit J3. It is a simple model figure of the circuit to which the bridge circuit J3 comprised with a semiconductor module is applied.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
A first embodiment of the present invention will be described. In this embodiment, as an application example of the semiconductor device according to one embodiment of the present invention, a semiconductor module provided with a three-phase inverter that drives, for example, a three-phase AC motor will be described as an example.

  First, the configuration of the inverter circuit 1 provided in the semiconductor device module will be described with reference to FIG. As shown in FIG. 1, the inverter circuit 1 is for driving a three-phase AC motor 3 as a load based on a DC power supply 2. A smoothing capacitor 4 is connected in parallel to the inverter circuit 1 and is used to form a constant power supply voltage while suppressing ripple reduction during switching and the influence of noise.

  The inverter circuit 1 has a configuration in which upper and lower arms 51 to 56 connected in series are connected in parallel for three phases, and an intermediate potential between the upper arms 51, 53, 55 and the lower arms 52, 54, 56 is set to the three-phase AC motor 3. The U phase, the V phase, and the W phase are applied while being sequentially replaced. That is, the upper and lower arms 51 to 56 are configured to include semiconductor switching elements 51a to 56a such as IGBT and MOSFET and rectifying elements (one-side conduction elements) 51b to 56b for the purpose of refluxing such as FWD and SBD, respectively. The semiconductor switching elements 51 a to 56 a of the upper and lower arms 51 to 56 of each phase are controlled to be turned on / off, thereby supplying a three-phase AC current having a different cycle to the three-phase AC motor 3. Thereby, the three-phase AC motor 3 can be driven.

  In the present embodiment, a 6-in-1 structure in which semiconductor chips formed with semiconductor switching elements 51a to 51f and rectifying elements 51b to 56b constituting the six upper and lower arms 51 to 56 constituting the inverter circuit 1 are modularized and integrated. It is a semiconductor module.

  Next, the detailed structure of the semiconductor module 6 provided with the inverter circuit 1 having the circuit configuration as described above will be described with reference to FIGS.

  As shown in FIGS. 3 to 5, the semiconductor module 6 configured as shown in FIG. 2A includes the semiconductor chip 10, the upper and lower radiator plates 11, 12, the positive terminal 13, and the negative terminal 14 having the insulating film 15. A plate-like conductor 16 provided between the control unit 17 and the control terminal 17 is provided. Of these, the semiconductor chip 10, the upper and lower radiator plates 11, 12 and the control terminal 17 are used as component blocks for one arm, and six sets of component blocks are resin molded as shown in FIG. 2A. It is configured to be covered with the portion 18. In addition, although the detailed structure of each component block for 6 arms covered with the resin mold part 18 is slightly different, the basic structure is the same. First, each part which comprises the basic structure of the component block covered with this resin mold part 18 is demonstrated.

  The semiconductor chip 10 has a front surface and a back surface, and is formed with semiconductor switching elements 51a to 56a, rectifying elements 51b to 56b, and the like that constitute the upper arms 51, 53, 55 or the lower arms 52, 54, 56. . For example, the semiconductor chip 10 is formed using Si, SiC, GaN or the like as a base material substrate. In the present embodiment, the semiconductor switching elements 51 a to 56 a and the rectifying elements 51 b to 56 b formed on the semiconductor chip 10 are formed as vertical elements that allow current to flow in the substrate vertical direction. Various pads are formed, and electrical connection is made through these pads. In the case of this embodiment, the back surface side of each semiconductor chip 10 is connected to the lower heat sink 12 via a bonding material such as solder. Further, the surface side of the semiconductor chip 10 is connected to an element relay electrode 19 configured using Cu, Al, Fe or the like as a base material via a bonding material such as solder, and the element relay electrode 19 is further made of solder or the like. It connects with respect to the upper side heat sink 11 via the joining material. As a result, each semiconductor chip 10 is electrically connected to the upper and lower radiator plates 11 and 12.

  In the present embodiment, the semiconductor chip 10 is configured such that elements such as the semiconductor switching elements 51a to 56a and the rectifying elements 51b to 56b constituting the arms 51 to 56 are separately formed. 51 to 56 may be formed of the same chip. Moreover, as a joining material, it has electroconductivity, for example, what is necessary is just a metal joining material whose heat conductivity is 30-400 W / mK, Ag paste etc. other than a solder can be used.

  The upper and lower heat sinks 11 and 12 correspond to heat sinks, and are formed by, for example, applying plating for connection with a main component of Cu, Al, Fe, etc., and one surface side is provided on the semiconductor chip 10. The multi-side is exposed from the resin mold portion 18. The upper heat radiation plate 11 is connected to the surface side of the semiconductor chip 10 via the element relay electrode 19, so that the surface electrodes of the semiconductor switching elements 51 a to 56 a (for example, the source of the MOSFET and the emitter of the IGBT) and the rectifying element 51 b. To the first electrodes (for example, anodes of FWD and SBD). Further, the lower heat radiation plate 12 is connected to the rear surface side of the semiconductor chip 10 so that the rear surface electrodes of the semiconductor switching elements 51a to 56a (for example, the drain of the MOSFET and the collector of the IGBT) and the rectifier elements 51b to 56b. It is connected to two electrodes (for example, cathode of FWD or SBD). Further, both the front surface side of the upper radiator plate 11 and the rear surface side of the lower radiator plate 12, that is, the surface opposite to the surface on which the semiconductor chip 10 is disposed, are exposed from the resin mold portion 18. The exposed portion can dissipate heat.

  In the case of the present embodiment, the lower radiator plate 12 constitutes a part of the positive side wiring for the arms 51 to 56, and the upper radiator plate 11 is a negative electrode for the arms 51 to 56. Part of the side wiring.

  The lower heat radiating plate 12a is electrically connected to the positive electrode terminal 13, and the voltage of the DC power source 2 is applied thereto. Although the heat radiating plate 12a has a single-chip configuration in which all of the semiconductor chips 10 constituting the three upper arms 51, 53, and 55 are mounted, the heat radiating plate 12a may have a structure divided separately for each arm. In the case of the present embodiment, considering the bonding with the positive electrode terminal 13, the lower heat radiating plate 12a has a single structure. As will be described later, the positive electrode terminal 13 is divided into two portions, and is connected to the lower heat radiating plate 12a between the semiconductor chips 10 constituting the three arms 51, 53, and 55, respectively. For this reason, current supply from the DC power supply 2 to each phase can be performed without variation in wiring resistance between the phases.

  On the surface of the lower heat radiating plate 12a that is exposed from the resin mold portion 18, a concave portion 12e that is partitioned for each phase is formed. Since the resin mold portion 18 can enter the recess 12e, the holdability of the lower heat radiating plate 12a by the resin mold portion 18 is enhanced, and the influence of thermal stress on the lower heat radiating plate 12a can be suppressed. In particular, for the v phase located at the center, the thermal stress of the lower heat sink 12a can be excessive compared to the u phase and w phase on both sides, but the holdability of the lower heat sink 12a is improved. Thus, thermal deformation of the lower heat radiating plate 12a can be suppressed. For this reason, application of stress to the semiconductor chip 10 can be suppressed, and peeling between the semiconductor chip 10 and the bonding material can be suppressed. The lower heat radiating plate 12a is dimensioned so that each region defined by the recess 12e has a desired heat radiating area. That is, when heat is transferred from the semiconductor chip 10 to the lower heat sink 12a through the element relay electrode 19, heat diffusion occurs at an angle of 45 degrees in the lower heat sink 12a. For this reason, the heat dissipation area is equal to or greater than the area after the thermal diffusion, that is, at least the area of the semiconductor chip 10 plus the thermal diffusion.

  The upper radiator plates 11a to 11c constitute part of the intermediate wiring that connects the upper and lower arms 51 to 56 of each phase. The output terminals 20a to 20c of the respective phases are drawn out from the upper radiator plates 11a to 11c.

  The lower heat sinks 12b to 12d also constitute part of the intermediate wiring that connects the upper and lower arms 51 to 56 of each phase. These lower heat sinks 12b to 12d are connected to the upper heat sinks 11a to 11c via upper and lower arm relay electrodes 21 each having a base material of Cu, Al, Fe or the like for each phase.

  The upper heat radiating plates 11a to 11c and the lower heat radiating plates 12b to 12d are also dimensioned so that each has a desired heat radiating area. That is, when heat is transmitted from the semiconductor chip 10 to the lower heat sink 12a through the element relay electrode 19, heat diffusion occurs at an angle of 45 degrees in each of the heat sinks 11a to 11c and 12b to 12d. For this reason, the heat dissipation area is equal to or greater than the area after the thermal diffusion, that is, at least the area of the semiconductor chip 10 plus the thermal diffusion.

  The upper heat radiating plate 11 d is electrically connected to the negative electrode terminal 14 and is GND-connected via the negative electrode terminal 14. The upper heat radiating plate 11d is configured as a single piece connected to all the semiconductor chips 10 constituting the three lower arms 52, 54, 56, but may have a structure divided separately for each arm. . In the case of the present embodiment, considering the bonding with the negative electrode terminal 14, the upper heat radiating plate 11d is configured as one sheet. As will be described later, the negative electrode terminal 14 is divided into two portions, and is connected to the upper heat radiation plate 11d between the semiconductor chips 10 constituting the three arms 52, 54, and 56, respectively. For this reason, a current from each phase can flow without variation in wiring resistance between the phases.

  On the surface of the upper heat radiating plate 11d that is exposed from the resin mold portion 18, a recess 11e that is partitioned for each phase is formed. Since the resin mold portion 18 can enter the recess 11e, the holdability of the upper heat radiating plate 11d by the resin mold portion 18 is enhanced, and the influence of the thermal stress of the upper heat radiating plate 11d can be suppressed. In particular, for the v-phase located at the center, the thermal stress of the upper radiator plate 11d can be excessive compared to the u-phase and w-phase on both sides, but by increasing the holdability of the upper radiator plate 11d. Thermal deformation of the upper radiator plate 11d can be suppressed. For this reason, application of stress to the semiconductor chip 10 can be suppressed, and peeling between the semiconductor chip 10 and the bonding material can be suppressed. The upper heat radiating plate 11d is dimensioned so that each region defined by the recess 11e has a desired heat radiating area. That is, when heat is transferred from the semiconductor chip 10 to the upper radiator plate 11d through the element relay electrode 19, thermal diffusion occurs at an angle of 45 degrees in the upper radiator plate 11d. The heat dissipation area is increased by adding the diffusion.

  As shown in FIGS. 6A and 6B, the plate-like conductor 16 as the lead conductor portion composed of the positive electrode terminal 13, the negative electrode terminal 14, and the insulating film 15 has the positive electrode terminal 13 sandwiching the insulating film 15 having a predetermined thickness. And the negative electrode terminal 14 are constituted by parallel conductors arranged to face each other. The plate-like conductor 16 is configured by bonding the positive electrode terminal 13 and the negative electrode terminal 14 using an adhesive, an adhesive sheet, or the like.

  The positive electrode terminal 13 constitutes a part of the positive electrode side wiring to which the power supply voltage from the DC power source 2 is applied, and is configured in a plate shape, and is connected to the lower heat radiating plate 12a via a bonding material such as solder. Or by welding. The positive electrode terminal 13 is constituted by a bus bar, and is constituted by, for example, applying plating for connection to a material mainly composed of Cu, Al, Fe or the like. In the present embodiment, as shown in FIGS. 6A, 6C, and 6E, the positive electrode terminal 13 is divided into two forks at a position covered with the resin mold portion 18, and each of the three arms of the lower heat radiating plate 12a. The semiconductor chip 10 constituting the 51, 53, 55 is connected between the corresponding positions.

  The negative electrode terminal 14 constitutes a part of the negative electrode side wiring to be GND-connected, is configured in a plate shape with respect to the upper heat radiating plate 11d, and is connected through a bonding material such as solder or by welding. The This negative electrode terminal 14 is also constituted by a bus bar, and is constituted, for example, by applying connection plating to a material mainly composed of Cu, Al, Fe or the like. In the present embodiment, as shown in FIGS. 6A, 6D, and 6E, the negative electrode terminal 14 is also divided into two forks at a position covered with the resin mold portion 18, and each of the three arms 52 of the upper radiator plate 11d. , 54, 56 are connected between positions where the semiconductor chip 10 is disposed.

The insulating film 15 is a mixed material in which an organic resin material such as epoxy, silicone, and polyimide, or a ceramic material such as Al ₂ O ₃ , Si ₃ N ₄ , AlN, glass, or a ceramic material is mixed with an organic resin material. It is comprised with the flat insulator comprised by these. As shown in FIG. 6A, when the protruding direction of the plate-shaped conductor 16 from the resin mold portion 18 is the protruding direction and the direction perpendicular to the protruding direction is the width direction, the insulating film 15 protrudes from the positive terminal 13 and the negative terminal 14. The size is one size larger in the direction and the width direction. That is, the outer edge portions of the positive electrode terminal 13 and the negative electrode terminal 14 enter inside the outer edge portion of the insulating film 15, and the insulating film 15 protrudes from the positive electrode terminal 13 and the negative electrode terminal 14. In this way, by designing the dimensions of the insulating film 15, the creepage distance between the positive electrode terminal 13 and the negative electrode terminal 14 is increased, and the withstand voltage is improved.

  The positive electrode terminal 13 and the negative electrode terminal 14 are cut out at different corners, and an opening is formed at each of the cutout portion and the corner opposite to the cutout portion. By using this, the plate conductor 16 is connected to a connection portion of a component (for example, a smoothing capacitor) to be connected. For example, a positive electrode side connection terminal and a negative electrode side connection terminal that are spaced apart from each other so as to sandwich the plate-like conductor 16 are provided in the connection portion on the connection target side, and cutout portions of the positive electrode terminal 13 and the negative electrode terminal 14 are provided in these terminals. Or a cutout or opening corresponding to the opening. Then, the plate-like conductor 16 is sandwiched between the positive electrode side connection terminal and the negative electrode side connection terminal, and the positive electrode terminal 13 and the positive electrode side connection terminal are fixed with screws, for example, at the openings of the negative electrode terminal 14 and the negative electrode side. The connection terminal is fixed with, for example, a screw at the opening of each other. Thereby, the plate-like conductor 16 can be electrically connected to the connection portion of the component to be connected.

  The control terminal 17 serves as a signal line terminal constituting various signal lines such as gate wirings of the semiconductor switching elements 51a to 56a. For example, the control terminal 17 is electrically connected to the pads connected to the gates of the semiconductor switching elements 51a to 56a formed on the surface side of the semiconductor chip 10 via bonding wires 22 (see FIG. 5C) made of Au or the like. It is connected to the. An end portion of the control terminal 17 opposite to the semiconductor chip 10 is exposed from the resin mold portion 18 and is configured to be connected to the outside through the exposed portion. In each figure, the control terminal 17 is described as being integrated in a lead frame state, and is also in an integrated state with the lower heat sink 12. The signal lines are divided, and each signal line becomes independent.

  The resin mold portion 18 is a sealing resin configured by placing each of the above-described components in a mold and then encapsulating the resin in the mold, and is configured, for example, in a rectangular plate shape. The resin mold part 18 is made of an insulating resin having a lower linear expansion coefficient and Young's modulus than the conductor parts such as the upper and lower radiator plates 11 and 12. For example, the resin mold portion 18 can be mainly composed of an organic resin such as epoxy or silicone. One end of the plate-like conductor 16, the control terminal 17, and the output terminals 20a to 20c is exposed from each side constituting the rectangular plate shape from the resin mold portion 18, and can be electrically connected to the outside. ing. Further, the upper heat radiating plate 11 and the lower heat radiating plate 12 are exposed from the front and back surfaces of the rectangular plate shape, respectively, so that heat can be radiated satisfactorily.

  Specifically, the above-described parts are mounted on the surface side of the lower heat sink 12 in a lead frame state in which the control terminals 17 are integrated. That is, the semiconductor chip 10, the plate-like conductor 16, the element relay electrode 19, and the upper and lower arm relay electrode 21 are mounted on the lower heat radiating plate 12. Then, after the electrical connection between the semiconductor chip 10 and the control terminal 17 is completed with the bonding wire, the upper heat sink 11 is mounted thereon, and in this state, these are installed in the mold, A resin mold portion 18 is formed by molding by injecting resin. In addition to the surfaces of the upper and lower heat sinks 11 and 12, the resin mold portion 18 covers other than the exposed portions of the plate-like conductor 16, the control terminal 17, and the output terminals 20 a to 20 c, so that the semiconductor chip 10 etc. Is protected.

  The semiconductor module 6 according to the present embodiment is configured by the above structure. In FIG. 2A, the semiconductor module 6 has a shape in which the plate-like conductor 16, the control terminal 17, and the output terminals 20 a to 20 c protrude linearly from one side of the resin mold portion 18. However, this is merely an example, and as shown in FIG. 2B, the protruding control terminal 17 is bent in a direction perpendicular to the surface of the resin mold 18, or as shown in FIG. 16, the control terminal 17, and the output terminals 20 a to 20 c can be bent in a direction perpendicular to the surface of the resin mold 18. When only the control terminal 17 is bent, for example, the control terminal 17 may be bent to the side opposite to the plate-like conductor 16. When the plate conductor 16, the control terminal 17, and the output terminals 20a to 20c are bent, for example, the bending direction of the control terminal 17 and the bending direction of the plate conductor 16 and the output terminals 20a to 20c may be reversed. Thus, by bending and using the plate-like conductor 16, the control terminal 17, and the output terminals 20a to 20c, space saving and noise resistance performance can be improved.

  In the semiconductor module 6 configured as described above, the positive / negative short-circuit loop, which is an inductance generation path, is a path indicated by a solid arrow in FIGS. 5A to 5D.

  That is, current is supplied through the positive terminal 13 as shown in FIG. 5D, and flows from the positive terminal 13 to the lower radiator plate 12a as shown in FIG. 5B. And it flows into each upper side heat sink 11a-11c through each semiconductor chip 10 of upper arm 51,53,54 from the lower side heat sink 12a. Subsequently, as shown in FIG. 5C, the upper heat sinks 11a to 11c flow to the lower heat sinks 12b to 12d through the upper and lower arm relay electrodes 21, and as shown in FIGS. 5A and 5C, the lower arms 52, 54, and 56 It flows to the upper radiator plate 11d through each semiconductor chip 10. Then, it flows to the negative terminal 14 as shown in FIGS. 5A and 5D. A current flows through such a path. That is, in the present embodiment, the current flow path from the upper arms 51, 53, 55 to the lower arms 52, 54, 56 is N-shaped as shown in FIG. 5C. Of course, since the inverter circuit 1 actually generates a three-phase alternating current, all the semiconductor switching elements 51a to 56a of the three phases are not simultaneously turned on. However, the change in dI / dt which is a problem in (Expression 1) Flows in the direction in which the positive and negative electrodes are short-circuited, and basically flows in the path as described above in each arm of the selected phase.

  Therefore, according to the semiconductor module 6 of the present embodiment, the following effects can be obtained.

  First, in the semiconductor module 6 of the present embodiment, the positive electrode terminal 13 and the negative electrode terminal 14 constituting a part of the positive electrode side wiring and the negative electrode side wiring sealed in the resin mold portion 18 are configured by parallel conductors. The conductor 16 is used. And the short circuit direction which connects these positive electrode terminals 13 and the negative electrode terminals 14 is a reverse direction, as FIG. 5D shows. For this reason, the plate-like conductor 16 can be magnetically canceled, and the inductance can be reduced.

  Thus, the plate-like conductor 16 composed of parallel conductors is inserted into the resin mold portion 18. For this reason, like the structure of Patent Document 1, the positive input bus bar constituting the positive electrode terminal and the negative input bus bar constituting the negative electrode terminal are separated separately, and only the input terminal connected to these is constituted by parallel conductors. Compared with the case of using a plate-like conductor, the area that becomes a parallel conductor can be increased. Specifically, in the present embodiment, the positive electrode terminal 13 and the negative electrode terminal 14 are opposed to each other in a wide plane. On the other hand, in the structure of Patent Document 1, the positive electrode terminal and the negative electrode terminal can be opposed only on the side surfaces. Moreover, since the gap between them is large, it is difficult to obtain a parallel conductor. Therefore, according to the structure of the present embodiment, it is possible to increase the area where magnetic cancellation can be generated, and to further reduce the inductance.

  Further, the upper and lower radiator plates 11 and 12 are also arranged to face each other in each of the arms 51 to 56, and face each other. And as FIG. 5A-FIG. 5C show, an electric current flows through the reverse direction in each upper side and lower side heat sink 11 and 12 opposingly arranged. For this reason, as indicated by white arrows in FIGS. 5A to 5C, it is possible to cause magnetic cancellation by causing currents to flow in the opposite directions in the upper and lower radiator plates 11 and 12. Thereby, it is possible to further reduce the inductance between the upper and lower radiator plates 11 and 12 in the resin mold portion 18.

  In particular, in the present embodiment, the arrangement direction of the upper and lower arms 51 to 56 of each phase is matched with the direction in which the positive electrode terminal 13 and the negative electrode terminal 14 are drawn, and current flows in an N shape in the upper and lower arms 51 to 56. This constitutes a short-circuit loop. Therefore, the upper arms 51, 53, 55 and the lower arms 52, 54, 56 are arranged side by side in the direction in which the positive electrode terminal 13 and the negative electrode terminal 14 are pulled out. In such a state, in the upper heat radiation plates 11a to 11c and the lower heat radiation plate 12a of the upper arms 51, 53, 55 arranged at positions farther from the side where the positive electrode terminal 13 and the negative electrode terminal 14 are drawn, The current flow can be reversed. The effect of magnetic cancellation becomes higher when magnetic cancellation is generated at a position farther from the side where the positive electrode terminal 13 and the negative electrode terminal 14 are drawn. Therefore, by adopting the structure as in the present embodiment, it is possible to obtain a higher magnetic canceling effect and to further reduce the inductance.

  To be precise, on the lower arm 52, 54, 56 side, the current does not return so much to the upper arm 51, 53, 55 side in the upper heat radiating plate 11d, so that the portion where the current flow is reversed is reduced. . However, as described above, the effect of magnetic cancellation becomes higher when magnetic cancellation is generated at a position farther from the side where the positive electrode terminal 13 and the negative electrode terminal 14 are pulled out. Even with this effect alone, a sufficiently low inductance can be achieved.

  On the other hand, in the structure of Patent Document 1, the arrangement direction of the upper and lower arms of each phase and the lead-out direction of the positive electrode terminal and the negative electrode terminal are orthogonal to each other. Further, the vertical arrangement of the positive and negative electrode sides of the semiconductor chip constituting the upper and lower arms is reversed. For this reason, after flowing from the lower heat sink to the upper heat sink through the semiconductor chip in the upper arm, it becomes a current path that flows to the lower heat sink through the semiconductor chip after flowing to the upper heat sink of the lower arm, A short-circuit loop in which a current flows in a U-shape in the upper and lower arms. For this reason, it can be said that the area where magnetic cancellation is generated is small and the reduction in inductance is insufficient.

(Second Embodiment)
A second embodiment of the present invention will be described. This embodiment is different from the first embodiment because the configuration of the upper and lower radiator plates 11 and 12 is changed with respect to the first embodiment, and the other is the same as the first embodiment. Only the part will be described.

  As shown in FIG. 7, in the present embodiment, the recesses 11 f and 12 f are formed on the outer edge portions of the surfaces of the upper and lower radiator plates 11 and 12 that are exposed from the resin mold portion 18. Thus, if the recessed parts 11f and 12f are formed, the resin mold part 18 will also enter here, and it becomes possible to improve the hold property of the upper side and lower side heat sinks 11 and 12. FIG. For this reason, the distortion by the thermal stress of the upper side and the lower side heat sinks 11 and 12 can be reduced compared with 1st Embodiment. Therefore, since stress application to the semiconductor chip 10 disposed between the upper and lower radiator plates 11 and 12 can be suppressed, peeling between the semiconductor chip 10 and the bonding material can be suppressed.

  Furthermore, the distance between the upper radiator plates 11a to 11c and the upper radiator plate 11d and the distance between the lower radiator plate 12a and the lower radiator plates 12b to 12d can be increased by the recesses 11f and 12f. For this reason, it becomes possible to earn the creepage distance between them, and the enlargement of the whole semiconductor module 6 required for securing the creepage distance can be avoided.

  In the case of the above structure, the heat radiation area of the upper and lower heat radiation plates 11 and 12 is reduced, but the heat transmitted from the semiconductor chip 10 or the element relay electrode 19 is diffused at an angle of 45 degrees. In view of this, it is only necessary to ensure a heat dissipation area that is equal to or greater than the area after thermal diffusion.

(Third embodiment)
A third embodiment of the present invention will be described. In the present embodiment, the configuration of the plate-like conductor 16 is changed with respect to the first embodiment, and the other parts are the same as those in the first embodiment. Therefore, only different parts from the first embodiment will be described. .

  As shown in FIG. 8, in this embodiment, the width of the insulating film 15 in the plate-like conductor 16 is made larger than that in the first embodiment. Specifically, the dimension L2 of the part exposed from the resin mold part 18 is larger than the dimension L1 of the part embedded in the resin mold part 18 of the plate-like conductor 16. As a result, the amount of the insulating film 15 protruding from the positive electrode terminal 13 and the negative electrode terminal 14 is increased, and a creeping distance between the positive electrode terminal 13 and the negative electrode terminal 14 can be obtained.

  Although the width of the insulating film 15 can also be increased inside the resin mold portion 18, it becomes an impediment to resin flow during resin sealing. Therefore, by enlarging the width only outside the resin mold portion 18, It is possible to prevent the resin flow from being hindered when stopping.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. This embodiment is obtained by changing the connection form of the upper and lower arms 51 to 56 and the connection form of the plate-like conductor 16 with respect to the first embodiment, and the other parts are the same as those of the first embodiment. Only portions different from the present embodiment will be described. Note that, here, a 2-in-1 structure including only the upper and lower arms 51 and 52 for one phase will be described as an example, but the present invention can of course be applied to a 6-in-1 structure as shown in the above embodiments.

  As shown in FIGS. 9A and 9B, in the present embodiment, the semiconductor chip 10 constituting the upper arm 51 and the semiconductor chip 10 constituting the lower arm 52 are arranged upside down, and the upper heat sinks of the upper and lower arms 51, 52 are reversed. 11 has a single structure. That is, in the upper arm 51, the positive side of the semiconductor chip 10 (the back electrode of the semiconductor switching element 51 a and the second electrode of the rectifying element 51 b) is on the lower side of the heat sink 12, and the negative side of the semiconductor chip 10 is on the upper side of the heat sink 11. (The surface electrode of the semiconductor switching element 51a and the first electrode of the rectifying element 51b) are directed and connected. In the lower arm 52, the negative side of the semiconductor chip 10 (surface electrode of the semiconductor switching element 52a and the first electrode of the rectifying element 52b) is provided on the lower radiator plate 12 side, and the negative side of the semiconductor chip 10 (semiconductor is provided on the upper radiator plate 11 side). The back electrode of the switching element 52a and the second electrode of the rectifying element 52b are directed and connected. Further, between the both side surfaces of the lower heat sink 12 of the upper arm 51 and the lower heat sink 12 of the lower arm 52, the thickness direction of the plate conductor 16 matches the normal direction of the both side surfaces. It is arranged to do. The side surface of the lower heat sink 12 of the upper arm 51 and the positive electrode terminal 13 are connected, and the side surface of the lower heat sink 12 of the lower arm 52 and the negative electrode terminal 14 are connected.

  In the case of such a configuration, a short-circuit loop in which current flows in a U-shape in the upper and lower arms 51 and 52 is formed. For this reason, the area where the magnetic cancellation is generated is less effective than the first embodiment arranged in an N shape, etc., but the plate-like conductor 16 has a structure that enters the resin mold portion 18 inside. Therefore, the inductance can be reduced.

(Modification of the fourth embodiment)
In the fourth embodiment, the shape of the plate conductor 16 can be changed as appropriate. For example, a structure in which the facing surfaces of the positive electrode terminal 13 and the negative electrode terminal 14 constituting the plate conductor 16 serving as the lead conductor portion are parallel to each other, but the opposite surface is not in a parallel relationship. It may be. Specifically, as shown in FIG. 10, the upper position of the positive electrode terminal 13 and the negative electrode terminal 14 may be projected to be caught on the surface of the lower heat radiating plate 12.

  Further, the plate-like conductor 16 may not be arranged so that the thickness direction thereof coincides with the normal direction of both side surfaces of the lower heat sink 12 of the upper and lower arms 51 and 52. For example, as shown in FIG. 11A, the plane of the plate-like conductor 16 and the surface of the lower heat radiating plate 12 are arranged in parallel, and the lower heat radiating plate 12 on the upper arm 51 side has a stepped shape. Further, the positive electrode terminal 13 and the negative electrode terminal 14 are arranged so as to be shifted from each other while forming opposing surfaces, and the shifted portion is projected from the insulating film 15. Then, the positive terminal 13 is disposed on the stepped shape portion of the lower heat sink 12 of the upper arm 51 and the negative terminal 14 is disposed on the surface of the lower heat sink 12 of the lower arm 52. Such a structure can also be used. In the case of such a structure, as shown in FIG. 11B, the portion of the plate-like conductor 16 that is exposed from the resin mold portion 18 may have the same structure as that of the first embodiment.

  Furthermore, although the case where the lead conductor portion is configured by the plate-like conductor 16 has been described, it does not necessarily have to be plate-like, and may be, for example, a thicker block-like shape.

(Fifth embodiment)
A fifth embodiment of the present invention will be described. In the present embodiment, the configuration of the plate-like conductor 16 is changed with respect to the first to fourth embodiments, and the others are the same as those of the first to fourth embodiments. Only portions different from the embodiment will be described. In addition, although described as a change with respect to 1st-3rd embodiment here, it is the same also about 4th Embodiment.

  As shown in FIG. 12, the positive electrode terminal 13 constituting the plate-like conductor 16 can be constituted by a part of the lower heat radiating plate 12, and the negative electrode terminal 14 can be constituted by a part of the upper heat radiating plate. That is, the positive electrode terminal 13 and the negative electrode terminal 14 may be connected to the upper or lower heat sinks 11 and 12 in the lead frame state, and may be drawn from these. Then, when mounting each component to be resin-sealed by the resin mold portion 18, an insulating film 15 is disposed between the positive electrode terminal 13 and the negative electrode terminal 14 in the lead frame state, and the positive electrode terminal 13 and the negative electrode terminal 14 are bonded together. You can do that.

(Other embodiments)
In the first to third embodiments, the semiconductor module 6 having a 6in1 structure including the inverter circuit 1 having three phases of u phase, v phase, and w phase has been described as an example. However, this is merely an example. For example, a 2-in-1 structure in which only one phase is modularized or a 4-in-1 structure in which a bridge circuit for two phases such as an H-bridge circuit is modularized may be used. The fourth embodiment is not limited to the 2 in 1 structure, and may be a 6 in 1 structure or a 4 in 1 structure.

  In addition, any element such as IGBT or MOSFET may be used for the semiconductor switching elements 51a to 56a shown in the above embodiments. Moreover, any of a PN diode and a Schottky diode can be applied to the rectifying elements 51b to 51f.

DESCRIPTION OF SYMBOLS 1 Inverter circuit 6 Semiconductor module 10 Semiconductor chip 11, 12 Upper side and lower side heat sink 11e, 11f, 12e Recessed part 13 Positive electrode terminal 14 Negative electrode terminal 15 Insulating film 16 Plate-shaped conductor 18 Resin mold part 21 Upper and lower arm relay electrode 51-56 Upper and lower arm

Claims (8)

An upper arm (51, 53, 55) and a lower arm (52, 54, 56) having a semiconductor chip (10) having a front surface and a back surface and having semiconductor switching elements (51a to 56a) formed thereon;
A heat sink (11, 12) disposed on the front side and the back side of the semiconductor chip of each of the upper arm and the lower arm;
Connected to the positive terminal (13) connected to the heat dissipation plate connected to the positive electrode side of the semiconductor chip of the upper arm, and to the heat dissipation plate connected to the negative electrode side of the semiconductor chip of the lower arm. A negative electrode terminal (14) and an insulating film (15) disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are arranged to face each other with the insulating film interposed therebetween. A lead conductor portion (16) having parallel conductors;
While exposing the surface opposite to the semiconductor chip and part of the positive electrode terminal and the negative electrode terminal of the heat radiating plate, at least a part of the parallel conductor of the lead conductor part enters, and the semiconductor And a resin mold part (18) configured to cover the chip. The heat sink has an upper heat sink (11) disposed on the front surface side of the semiconductor chip and a lower heat sink (12) disposed on the back surface side of the semiconductor chip,
The upper heat sink of the upper arm and the lower heat sink of the lower arm are electrically connected via an upper and lower arm relay electrode (21), and the positive terminal is connected to the lower heat sink of the upper arm. And the negative terminal is connected to the upper radiator plate of the lower arm,
In the upper arm, the short-circuit direction from the positive terminal to the negative terminal flows in the order of the lower radiator plate, the semiconductor chip, and the upper radiator plate, and then flows to the lower arm via the upper and lower arm relay electrodes. 2. The semiconductor device according to claim 1, wherein in the lower arm, a current path that flows to the negative terminal after flowing in the order of the lower heat sink, the semiconductor chip, and the upper heat sink is configured. . The lead conductor portion is composed of a plate-like conductor (16) in which the positive electrode terminal and the negative electrode terminal are plate-like, and the resin mold portion is arranged in the same direction as the arrangement direction of the upper arm and the lower arm. Protruding from the
The plate-like conductor is in a state where the insulating film protrudes from the positive electrode terminal and the negative electrode terminal because the size of the insulating film is larger than that of the positive electrode terminal and the negative electrode terminal. The amount of the insulating film protruding from the positive electrode terminal and the negative electrode terminal is larger than the portion covered by the resin mold portion in the exposed portion protruding from the mold portion. The semiconductor device according to claim 1, wherein the semiconductor device is characterized. The heat sink has an upper heat sink (11) disposed on the front surface side of the semiconductor chip and a lower heat sink (12) disposed on the back surface side of the semiconductor chip,
The upper heat sink of the upper arm and the upper heat sink of the lower arm are connected, and the lead conductor portion is between the side surface of the lower heat sink of the upper arm and the side surface of the lower heat sink of the lower arm. Arranged, the positive terminal is connected to the side of the lower heat sink of the upper arm, and the negative terminal is connected to the side of the lower heat sink of the lower arm,
After the current supplied from the positive terminal flows in the upper arm in the order of the lower heat sink, the semiconductor chip, and the upper heat sink, the upper heat sink, the semiconductor chip, The semiconductor device according to claim 1, wherein a current path that flows in the negative electrode terminal after flowing in the order of the lower heat sink is formed.   5. The semiconductor according to claim 1, wherein a recess (11 f, 12 f) is formed in an outer edge portion of a surface of the heat radiating plate exposed from the resin mold portion. apparatus.   The area of the surface of the heat radiating plate exposed from the resin mold part inside the recess is larger than the area after diffusion when heat from the semiconductor chip diffuses at an angle of 45 degrees. 6. The semiconductor device according to claim 5, wherein:   The semiconductor device according to claim 1, wherein the positive electrode terminal and the negative electrode terminal are separated from the heat sink. The positive terminal is integrally formed with the heat sink connected to the positive side of the semiconductor chip of the upper arm,
The semiconductor device according to claim 1, wherein the negative electrode terminal is integrally formed with the heat radiating plate connected to the negative electrode side of the semiconductor chip of the lower arm.

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