JP2006165409A - Power conversion equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve durability with respect to degradation that occurs in a conductor junction due to vibration and temperature changes, and to increase the reliability in the conductor junction. <P>SOLUTION: The power semiconductor devices Mpu to Mnw of power module PMU and the signal terminals 24a to 24f are electrically connected via the flexible conductors (wires) 16a to 16f, and the signal terminals 24a to 24f and the wire (conductor) of the driver circuit substrate 30 of the driver circuit device DCU are electrically connected via wiring which is flexible conductor for solving 19. The use of the wires 16a to 16f and 19 is more flexible than that of signal terminals, so they can absorb or reduce distortion that arises in the conductive junction for vibration and temperature change. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a power converter, and more particularly to an electrical connection configuration between a power module unit and a circuit board of a control unit.

  As an electrical connection configuration between a power module unit and a circuit board of a control unit that controls the power module unit, a configuration described in, for example, Patent Document 1 is conventionally known. In the device described in Patent Document 1, a power module unit and a circuit board of the control unit are electrically connected by inserting a connector provided on the circuit board of the control unit into a terminal insert-molded in the case of the power module unit. Connected. In addition, as a conventional connection configuration, the signal terminal protruding from the power module part is passed through the through hole of the circuit board of the control part, and the signal terminal and the circuit board are joined by soldering to control the power module part. Some of them are electrically connected to a part of the circuit board.

JP 2003-78107 A

  In recent years, power converters are required to be downsized. For this reason, a configuration is often adopted in which the power module unit and the control unit are arranged close to each other and the power module unit and the circuit board of the control unit are electrically connected as in the background art described above. However, in the connection configuration as in the former background art described above, it is easy to join the power module unit and the circuit board of the control unit, but a space for housing the connector is required in the power module unit. The power converter becomes larger. In this regard, the connection configuration as in the latter background art described above is advantageous over the connection configuration as in the former background art described above because the power converter is not increased in size.

  Recently, however, power converters are often placed in severe environments such as temperature conditions and vibrations. In such a situation, the power conversion device is required to have a long life. For this reason, higher reliability is required for the connection configuration as in the latter background art described above. In other words, in the above environment, the solder used as the joining material of the latter background art described above is due to distortion caused by vibration or the difference in linear expansion coefficient between the signal terminal and the circuit board of the control unit when temperature changes. The resulting distortion occurs. When strain is repeatedly generated in the solder, the solder is fatigued from the inside. Therefore, in order to satisfy the long-term life of the power converter in the above environment, it is necessary to further increase the reliability of the conductor junction of the power converter including the joint between the signal terminal and the circuit board of the control unit. is there.

  The rate of solder fatigue deterioration depends on the amount and shape of the solder. Therefore, by adjusting the amount and shape of the solder on the back side of the circuit board of the control unit to adjust the solder variation, it is possible to further increase the reliability of the connection structure between the signal terminal and the circuit board of the control unit. is there. However, in the connection structure such as the latter background art described above, the power module unit and the control unit are arranged close to each other, so that the back side of the circuit board of the control unit is difficult to see, and the amount of solder on the back side of the circuit board It is difficult to adjust the shape.

  The present invention provides a power conversion device that can improve the reliability of a conductor joint between a power module unit and a control unit.

  A feature of the present invention is that a flexible conductor is used to electrically connect between the signal module and the power module unit, which are electrically connected between the power module unit and the control unit, and between the signal terminal and the control unit side. Being connected.

  The signal terminal is composed of an elongated metal plate formed in a step shape. The flexible conductor is composed of a long and thin wire-shaped conductive member or a flat ribbon-shaped member in which a conductive member is covered with an insulating resin film.

  Flexible conductors are much more flexible than signal terminals. For this reason, even if the flexible conductor is distorted due to relative displacement between the signal terminal and the power module unit side and between the signal terminal and the control unit side due to vibration or temperature change, the distortion is caused. Can be relaxed. Therefore, according to this invention, the tolerance with respect to the fatigue deterioration of the conductor junction part between a power module part and a control part improves.

  According to the present invention described above, since the resistance against fatigue deterioration of the conductor joint between the power module unit and the control unit is improved, the reliability of the conductor joint between the power module unit and the control unit is improved. Can be made.

  Therefore, according to the present invention, it is possible to extend the life of the power conversion device, and even when the power conversion device is placed in a severe environment such as a temperature condition or vibration, a predetermined requirement required for the power conversion device is provided. It is possible to ensure a lifetime of more than a few years (for example, 15 years or more).

  A representative best embodiment of the present invention is as follows.

  In other words, the power module unit includes a power module unit having a power semiconductor element and a control unit for controlling the operation of the power semiconductor element. The power module unit includes a signal terminal electrically connected to the power semiconductor element. The signal terminal is electrically connected to the control unit, and the power module unit and the signal terminal and the signal terminal and the control unit side are electrically connected by a flexible conductor. It is in the power converter that is.

  Hereinafter, an embodiment of a power converter of the present invention is described based on a drawing. In this embodiment, an inverter device will be described as an example of a power conversion device. In this embodiment, an inverter device will be described as an example. However, the configuration described below includes a power semiconductor element such as a DC / DC converter or an AC / DC converter as a DC / DC converter. The present invention can be similarly applied to a module section and a control section that controls the operation of the power semiconductor element.

  1 to 3 show the configuration of the inverter device of this embodiment. 1 and 2 show the mechanical configuration of the inverter device of this embodiment. FIG. 3 shows a circuit configuration of the inverter device shown in FIGS. 1 and 2.

  The inverter device INV includes a power module PMU, a drive circuit device DCU, and a motor control device MCU. The power module PMU constitutes the main circuit (or conversion circuit) of the inverter device INV. The drive circuit unit DCU constitutes a drive unit of the inverter unit INV. The motor control unit MCU constitutes a control unit of the inverter unit INV. In some cases, the drive circuit device DCU may also be referred to as a control unit of the inverter device INV.

  In FIG. 3, the power supply system and power system lines are indicated by solid lines, and the control system lines are indicated by broken lines and arrows so that the power supply system and power system lines can be easily distinguished from the control system lines. Yes.

  First, the circuit configuration of the power module PMU will be described.

  The power module PMU constitutes a main circuit for power conversion, operates in response to a drive signal output from the drive circuit device DCU, converts DC power supplied from the DC power source DC into three-phase AC power, An AC load, for example, a stator winding of the motor M is supplied. The main circuit is a three-phase bridge circuit, and is configured by electrically connecting a series circuit for three phases in parallel between the positive electrode side and the negative electrode side of the DC power supply DC. The series circuit is also called an arm, and is constituted by two power semiconductor elements.

  The arm is configured by electrically connecting an upper arm side power semiconductor element and a lower arm side power semiconductor element in series. In this embodiment, a MOSFET (metal oxide semiconductor field effect transistor) which is a switching semiconductor element is used as the power semiconductor element. A semiconductor chip constituting the MOSFET includes three electrodes, a drain electrode, a source electrode, and a gate electrode. In addition, a parasitic diode having a forward direction from the source electrode to the drain electrode is electrically connected between the drain electrode and the source electrode of the MOSFET.

  An IGBT (Insulated Gate Bipolar Transistor) may be used as the power semiconductor element. In the IGBT, it is necessary to separately connect a diode element between the collector electrode and the emitter electrode. The IGBT includes a gate electrode in addition to the collector electrode and the emitter electrode.

  The u-phase arm Au is configured by electrically connecting the source electrode of the power semiconductor element Mpu and the drain electrode of the power semiconductor element Mnu in series. The v-phase arm Av and the w-phase arm Aw are also configured similarly to the u-phase arm Au, and the v-phase is obtained by electrically connecting the source electrode of the power semiconductor element Mpv and the drain electrode of the power semiconductor element Mnv in series. The arm Av is configured such that the source electrode of the power semiconductor element Mpw and the drain electrode of the power semiconductor element Mnw are electrically connected in series to form the w-phase arm Aw.

  The drain electrodes of the upper arm side power semiconductor elements Mpu, Mpv, Mpw are on the high potential side (positive side) of the DC power supply DC, and the source electrodes of the lower arm side power semiconductor elements Mnu, Mnv, Mnw are on the low potential side of the DC power supply DC. (Negative electrode side) are electrically connected to each other. The midpoint of the u-phase arm Au (connection portion between the source electrode of the upper arm side power semiconductor element Mpu and the drain electrode of the lower arm side power semiconductor element Mnu) is electrically connected to the u phase stator winding of the motor M. Has been. The midpoint of the v-phase arm Av and the w-phase arm Aw has the same relationship as the midpoint of the u-phase arm Au, and the midpoint of the v-phase arm Av (the source electrode and lower arm of the upper arm side power semiconductor element Mpv) The connection portion with the drain electrode of the side power semiconductor element Mnv) is connected to the middle winding of the w-phase arm Aw (the source electrode of the upper arm side power semiconductor element Mpw and the lower arm side power semiconductor) in the v-phase stator winding of the motor M. The portion of the element Mnw connected to the drain electrode) is electrically connected to the w-phase stator winding of the motor M.

  A smoothing electrolytic capacitor SEC is electrically connected between the positive electrode side and the negative electrode side of the DC power source DC in order to suppress fluctuations in DC voltage caused by the operation of the power semiconductor element.

  Next, the configuration of the drive circuit device DCU will be described.

  The drive circuit unit DCU operates a drive signal Vpu for operating the power semiconductor elements Mpu to Mnw of the power module PMU based on a control signal (a signal for operating the power semiconductor elements Mpu to Mnw) output from the motor control unit MCU. ~ Vnw is output and the drive unit for operating the power semiconductor elements Mpu to Mnw is configured, and is composed of circuit components such as an insulated power supply, an interface circuit, a drive circuit, a sensor circuit, and a snubber circuit (all not shown) Has been.

  The insulated power source constitutes the power source for circuit components that require an operating power source, and the primary side is electrically connected to the DC power source DC, and the secondary side (low voltage side) is electrically connected to the circuit components that require the operating power source. Is a transformer connected to The operating voltage of a circuit component that requires an operating power supply is, for example, 12v.

  The interface circuit is a signal transmission circuit provided between the motor control unit MCU and the drive circuit. The interface circuit is provided corresponding to the power semiconductor elements of the upper and lower arms of each phase, and receives the control signal output from the motor control unit MCU. The drive signals Vpu to Vnw for operating the power semiconductor elements Mpu to Mnw are output to the drive circuit. The interface circuit is also provided between the sensor circuit and the motor control unit MCU, and outputs a detection signal output from the sensor circuit to the motor control unit MCU.

  The drive circuit outputs final drive signals Vpu to Vnw supplied to the gate electrodes of the power semiconductor elements of the upper and lower arms of each phase, detects abnormalities such as overcurrent, overvoltage, and overtemperature, and detects overcurrent, overvoltage, This is a circuit for protecting the power semiconductor elements Mpu to Mnw of the power module PMU from over temperature.

  The sensor circuit is a current detection element provided to detect a current flowing through each power semiconductor element Mpu to Mnw of the power module PMU, and is electrically connected to the source electrode side of each power semiconductor element Mpu to Mnw of the power module PMU. It is comprised from the resistive element connected in parallel. From the sensor circuit, the voltage (detection signal) across the resistance element is output to the drive circuit. The drive circuit detects the current flowing through each of the power semiconductor elements Mpu to Mnw based on the voltage output from the sensor circuit. Thereby, the drive circuit can perform overcurrent protection of each power semiconductor element Mpu to Mnw.

  The snubber circuit is a protection circuit that protects the power semiconductor elements Mpu to Mnw from an abnormal voltage generated due to the influence of the stray inductance in the main circuit during the switching operation of the power semiconductor elements Mpu to Mnw of the power module PMU. The power semiconductor elements Mpu to Mnw are electrically connected in parallel between the drain electrode and the source electrode.

  Next, the motor control unit MCU will be described.

The motor control unit MCU is an arithmetic unit composed of a microcomputer, and receives a plurality of input signals and drives control signals Vpu ^{* to} Vnw ^* for operating the power semiconductor elements Mpu to Mnw of the power module PMU. Output to device DSU. As input signals, a torque command value τ, a rotational speed command value N, detection signals iu to iw, and a detection signal θ are input. The torque command value τ and the rotational speed command value N are output from the host control device according to the driving mode of the vehicle. The detection signals iu to Iw are currents that flow through the stator windings of the stator STR of the motor M, and are output from the current sensors Cu to Cw. The detection signal θ is for the magnetic pole position of the rotor ROT of the motor M, and is output from the detection magnetic pole position sensor MPC.

  The current sensors Cu to Cw are for detecting the u-phase to w-phase currents iu to iw supplied from the inverter device INV to the stator winding of the stator STR of the motor M, and include shunt resistors, It consists of a current transformer (CT). The magnetic pole position sensor MPC is for detecting the magnetic pole position θ of the rotor ROT of the motor M, and includes a resolver, an encoder, a Hall element, a Hall IC, and the like.

The motor control unit MCU calculates voltage control values Vu to Vw based on the input signal, and uses the voltage control values Vu to Vw as control signals (PWM signals) for operating the power semiconductor elements Mpu to Mnw of the power module PMU. (Pulse Width Modulation Signal)) Output to the drive circuit unit DSU as Vpu ^{* to} Vnw ^* .

  Next, the actual structure of the inverter device INV of this embodiment to which the circuit configuration described above is applied will be described with reference to FIGS.

  The inverter unit INV is configured by housing a power module PMU, a drive circuit unit DCU, and a motor control unit MCU in an aluminum inverter case (not shown). The inverter case is a sealed container, and is configured to shield noise emission from the inside of the inverter device INV to the outside and noise transmission from the outside to the inside of the inverter device INV.

  A heat dissipating member 9 as a cooler is installed at the bottom inside the inverter case. The heat dissipating member 9 is cooled by a cooling medium (cooling liquid such as water or cooling air) supplied from the outside to the bottom of the inverter case, and on one side (bottom surface) of the cooling medium and A plurality of fins 9a that are in contact with each other are formed.

  The power module PMU is fixed on the other surface of the heat dissipating member 9 (the surface opposite to the side where the fins 9a are formed and the upper surface). A drive circuit board 30 of the drive circuit unit DCU is fixed on the power module PMU. The drive circuit board 30 is mounted with a power source of the drive circuit device DCU and electrical and electronic components (both not shown) constituting each circuit.

  In the inverter device INV, one assembly structure in which the power module PMU and the drive circuit device DCU are combined is called an intelligent power module (IPM).

  A control circuit board (not shown) of the motor control unit MCU is disposed above the intelligent power module (IPM). Electronic components such as a microcomputer constituting the motor control unit MCU are mounted on the control circuit board of the motor control unit MCU (not shown). The drive circuit unit DCU and the motor control unit MCU are electrically connected by signal wiring.

  An input / output power cable (not shown) extends from the inverter case. The input power cable electrically connects the positive and negative electrodes of the DC power source DC and the input end of the inverter device INV, and the output power cable electrically connects the output end of the inverter device INV and the stator winding of the stator STR of the motor M. Connected.

  The power module PMU includes a module case 1. The module case 1 is a member having a rectangular parallelepiped shape (a shape whose height is smaller than the horizontal and vertical lengths) made of an insulating resin, and is composed of two opposing pairs of side walls. Openings are formed at the top and bottom of the module case 1. A drive circuit board 30 is fixed to the upper part of the module case 1 so as to close the upper opening of the module case 1. A module base 7 is fixed to the bottom of the module case 1 so as to close the bottom opening of the module case 1. The module base 7 is a heat conductive member made of copper or Al—SiC alloy, and is a flat plate-shaped member that is larger than the bottom opening of the module case 1. A first side that is one of two opposing sides of the module base 7 extends outward from a first side wall that is one of the two pairs of side walls of the module case 1. . Bolt holes 8 are formed at the four corners of the extended portion of the module base 7. The bolt hole 8 is a through hole. A heat radiation grease 42 is applied between the bottom surface of the module base 7 and the top surface of the heat radiation member 9. The module base 7 is screwed to the heat radiating member 9 by screwing a bolt penetrating the bolt hole 8 into a bolt hole of the heat radiating member 9. Thus, the bottom surface of the module base 7 is in surface contact with the upper surface of the heat radiating member 9 via the heat radiating grease 42 and is thermally connected to the heat radiating member 9.

  Output terminals (AC terminals) 4 to 6 protrude from one of the second side walls, which is the remaining side wall (a side wall different from the first side wall) of the two pairs of side walls of the module case 1 so as to extend outward. ing. The output terminals 4 to 6 are elongated flat plate-shaped conductive members whose longitudinal direction is the protruding direction and whose short direction is the direction orthogonal to the protruding direction, and extend so as to be parallel to the module base 7. ing.

  An input terminal (DC terminal) 40 protrudes from the other side of the second side wall of the module case 1 so as to extend outward. The input terminal 40 is composed of a laminate in which a wide range of flat plate-like conductive members whose lateral direction is the projecting direction and whose longitudinal direction is perpendicular to the projecting direction are parallel to the module base 7. It extends so that it becomes. The laminated body of the input terminals 40 is configured such that the positive electrode side terminal 3, the insulating member 31, and the negative electrode side terminal 2 are laminated in that order from the lower layer side to the upper layer side. The insulating member 31 electrically insulates between the positive electrode side terminal 3 and the negative electrode side terminal 2. The length of the positive terminal 3 in the short direction is longer than the length of the negative terminal 2 in the short direction.

  Note that the stacking position of the positive electrode side terminal 3 and the negative electrode side terminal 2 may be reversed such that the positive electrode side terminal 3 is the upper layer and the negative electrode side terminal 2 is the lower layer.

  A capacitor terminal 50 is fixed to the input terminal 40 with screws. The capacitor terminal 50 is composed of a laminate in which a wide range of flat plate-like conductive members whose short direction is the short direction of the input terminal 40 and whose long direction is the long direction of the input terminal 40 are laminated. 7 extends toward the input terminal 40 so as to be parallel to the input terminal 7. The laminated body of the capacitor terminals 50 is configured such that a positive electrode side terminal 51, an insulating member 53, and a negative electrode side terminal 52 are laminated in that order from the lower layer side to the upper layer side. The insulating member 53 electrically insulates between the positive electrode side terminal 51 and the negative electrode side terminal 52. The length of the negative terminal 52 in the short direction is longer than the length of the positive terminal 51 in the short direction.

  When the stacking position of the positive terminal 3 and the negative terminal 2 of the input terminal 40 is reversed, the stacking position of the positive terminal 51 and the negative terminal 52 of the capacitor terminal 50 is the same as the stacking position of the input terminal 40. At the same time reverse.

  The negative electrode side terminal 52 is laminated and fixed on the negative electrode side terminal 2 so that the lower surface thereof is in surface contact with the upper surface of the negative electrode side terminal 2. Thereby, the negative electrode side terminal 52 and the negative electrode side terminal 2 are electrically connected. The positive electrode side terminal 51 is laminated and fixed on the positive electrode side terminal 3 so that the lower surface thereof is in surface contact with the upper surface of the positive electrode side terminal 3. Thereby, the positive electrode side terminal 52 and the positive electrode side terminal 3 are electrically connected. Two smoothing electrolytic capacitors SEC are arranged on the lower surface side of the positive electrode side terminal 51. The smoothing electrolytic capacitors SEC are juxtaposed in the longitudinal direction of the capacitor terminal 50. The positive electrode terminal of the smoothing electrolytic capacitor SEC is screwed to the positive electrode side terminal 51, and the negative electrode terminal of the smoothing electrolytic capacitor SEC is screwed to the negative electrode side terminal 52. Thus, the smoothing electrolytic capacitor SEC is fixed to the capacitor terminal 50, and the positive electrode terminal and the positive electrode side terminal 51 are electrically connected to the negative electrode terminal and the negative electrode side terminal 52, respectively. A direct current power source DC is electrically connected to the capacitor terminal 50.

  The input terminal 40 passes through the above-described wide flat plate portion (corresponding to the comb main body portion) (hereinafter, abbreviated as “wide flat plate portion”) and the other inner wall surface of the second side wall of the module case 1. 1 is a comb-shaped conductive member composed of three elongated flat plate portions (corresponding to comb teeth portions) (hereinafter referred to as “elongated flat plate portions”) extending inward of 1. The elongated flat plate portion of the input terminal 40 has a laminated structure like the wide flat plate portion. The elongated flat plate portions of the input terminal 40 are arranged in parallel at equal intervals along the other wall surface of the second side wall of the module case 1, and face the module base 7 via the insulating members 17 a, 17 c, and 17 f. Has been implemented. In the elongated flat plate portion of the input terminal 40, the short side direction is a protruding direction, and the long side direction is a direction orthogonal to the protruding direction. The longitudinal length of the elongated flat plate portion of the positive terminal 3 of the input terminal 40 is longer than the longitudinal length of the elongated flat plate portion of the negative terminal 2 of the input terminal 40. The reason for adopting such a configuration is to enable joining of the positive electrode side terminal 3 positioned on the lower layer side and a wire wiring described later.

  The output terminals 4 to 6 penetrate the outer wall surface of the side wall of the module case 1 and extend to the outside of the module case 1 (hereinafter abbreviated as “extended portion”) and the inner wall surface of the side wall of the module case 1. It is comprised from the part (henceforth abbreviated as "inward extending part") extended inside the module case 1, and is arranged in parallel along the one wall surface of the 2nd side wall of the module case 1 at equal intervals. . Inwardly extending portions of the output terminals 4 to 6 are surface-mounted on the module base 7 via insulating members 17b, 17d, and 17f. As described above, the output terminals 4 to 6 are elongate flat plate-like conductive members, and the longitudinal direction is the protruding direction, and the short direction is the direction orthogonal to the protruding direction.

  The inwardly extending portions of the output terminals 4 to 6 and the elongated flat plate portion of the input terminal 40 are arranged on the module base 7 so that those constituting the in-phase arms are opposed diagonally.

  Insulating substrates 15 a to 15 f are disposed on the upper surface of the module base 7. The insulating substrates 15a to 15f are flat insulating substrates made of ceramics (aluminum nitride). The insulating substrate 15a (15c, 15e) is opposed to the longitudinal direction of the elongated flat plate portion arranged on one side of the input terminal 40 in the terminal arrangement direction (the central portion in the terminal arrangement direction and the other side in the terminal arrangement direction), and the output terminal 4 It is surface-mounted on the module base 7 so as to be adjacent to the other side in the terminal arrangement direction of the inwardly extending portion of (5, 6). The insulating substrate 15b (15d, 15e) is adjacent to the side of the elongated flat plate portion arranged on one side in the terminal arrangement direction of the input terminals 40 (the central portion in the terminal arrangement direction and the other side in the terminal arrangement direction). At the same time, it is surface-mounted on the module base 7 so as to face the longitudinal direction of the inwardly extending portion of the output terminal 4 (5, 6). Thus, the insulating substrates 15a to 15f are arranged on the module base 7 so that the in-phase substrates face each other diagonally.

  A metallization process is performed on the upper surface of the insulating substrate 15a (15c, 15e) to provide a substrate conductor 18a (18c, 18e). Metallization is also performed on the lower surface of the insulating substrate 15a (15c, 15e) to provide a substrate conductor (not shown). The substrate conductors on the lower surface side of the substrate conductors 18a (18c, 18e) and the insulating substrate 15a (15c, 15e) are copper plate-like conductive members. On the upper surface of the substrate conductor 18a (18c, 18e), a bare chip 13a (13c, 13e) constituting the power semiconductor element Mpu (Mpv, Mpw) is mounted by bonding with a brazing material. Thereby, the drain electrode side of the power semiconductor element Mpu (Mpv, Mpw) and the substrate conductor 18a (18c, 18e) are electrically connected.

  The upper surface of the insulating substrate 15b (15d, 15f) is subjected to metallization processing to provide a substrate conductor 18b (18d, 18f). Metallization is also performed on the lower surface of the insulating substrate 15b (15d, 15f) to provide a substrate conductor (not shown). Substrate conductors on the lower surface side of the substrate conductors 18b (18d, 18f) and the insulating substrate 15b (15d, 15f) are copper plate-like conductive members. On the upper surface of the substrate conductor 18b (18d, 18f), a bare chip 13b (13d, 13f) constituting the power semiconductor element Mnu (Mnv, Mnw) is mounted by bonding with a brazing material. Thereby, the drain electrode side of the power semiconductor element Mnu (Mnv, Mnw) and the substrate conductor 18b (18d, 18f) are electrically connected.

  Substrate conductors provided on the lower surfaces of the insulating substrates 15a to 15f are joined to the module base 7 by a brazing material.

  Wire wiring is provided between the positive electrode side terminal 3 of the elongated flat plate portion arranged on one side of the input terminal 40 in the terminal arrangement direction (center portion in the terminal arrangement direction and the other side in the terminal arrangement direction) and the substrate conductor 18a (18c, 18e). 14a (14e, 14i) is bonded. Thereby, the positive electrode side terminal 3 of the input terminal 40 and the drain electrode of the bare chip 13a (13c, 13e) are electrically connected. Wire wiring 14b (14f, 14j) is bonded between the output terminal 4 (5, 6) and the source electrode of the bare chip 13a (13c, 13e). Thereby, the source electrode of the bare chip 13a (13c, 13e) and the output terminal 4 (5, 6) are electrically connected.

  Between the negative electrode side terminal 2 of the elongated flat plate portion arranged on one side of the input terminal 40 in the terminal arrangement direction (center portion in the terminal arrangement direction and the other side in the terminal arrangement direction) and the source electrode of the bare chip 13b (13d, 13f) Wire wiring 14d (14h, 14l) is bonded. Thereby, the negative electrode side terminal 2 of the input terminal 40 and the source electrode of the bare chip 13b (13d, 13f) are electrically connected. Wire wiring 14c (14g, 14k) is bonded between the output terminal 4 (5, 6) and the board conductor 18b (18d, 18f). Thereby, the drain electrode of the bare chip 13b (13d, 13f) and the output terminal 4 (5, 6) are electrically connected.

  The wire wirings 14a to 14l are elongate conductive members made of aluminum, and are members having flexibility.

  The module case 1 is filled with gel. Gel is an insulating resin and is an electrical insulation protection member of the bare chips 13a to 13e.

  Signal terminals 24 a to 24 f are provided on the second side wall of the module case 1. The signal terminals 24a to 24f are arranged as relays between the gate electrodes of the corresponding bare chips 13a to 13f and the wiring conductors of the drive circuit board 30 and are electrically connected to the step-like elongated metal plates. And is insert-molded on the second side wall of the module case 1.

  The second side wall of the module case 1 is formed in a staircase shape, and includes a lower stage that is higher than the module base 7 and an upper stage that is higher than the lower stage. The electrode surfaces on one end side of the signal terminals 24 a to 24 f are exposed on the upper surface of the upper side of the second side wall of the module case 1. The electrode surfaces on the other end side of the signal terminals 24 a to 24 f are exposed on the upper surface of the lower stage of the second side wall of the module case 1.

  The electrode surface on the other end side of the signal terminal 24a (24b to 24f) and the gate electrode of the bare chip 13a (13b to 13f) and the electrode surface on the other end side of the signal terminal 24a (24b to 24f) and the substrate conductor. Wire wiring 16a (16b to 16f) is bonded to 18a (18b to 18f). Thereby, the signal terminals 24a (24b to 24f) and the gate electrodes of the bare chips 13a (13b to 13f), the signal terminals 24a (24b to 24f), and the substrate conductors 18a (18b to 18f) are electrically connected to each other. .

  A wire wiring 19 is bonded between the electrode surface on one end side of the signal terminals 24 a to 24 f and the wiring conductor of the drive circuit board 30. As a result, the signal terminals 24a to 24f and the electronic components (drive circuit) of the drive circuit board 30 are electrically connected.

  The wire wirings 16a to 16f and 19 are long and thin conductive members made of aluminum, and are members having flexibility. The flexibility of the wire wirings 16a to 16f and 19 is much more flexible than the signal terminals 24a to 24f.

  In this embodiment, the case where wire wiring is used as the flexible conductor has been described as an example. However, a flat ribbon-shaped wiring member in which a conductive member is covered with an insulating resin film may be used as the flexible conductor.

  In the present embodiment described above, stepped ones are used as the signal terminals 24a to 24f, and the electrode surface on one end side of the signal terminals 24a to 24f is on the upper surface of the upper side of the second side wall of the module case 1. Therefore, the connection surfaces of the signal terminals 24 a to 24 f and the wiring conductors on the upper surface of the drive circuit board 30 can be made substantially the same surface, and the signal terminals 24 a to 24 f and the upper surface of the drive circuit board 30 can be made. Electrical connection with the upper wiring conductor can be made using the wire wiring 19. Therefore, according to the present embodiment, even when the power module PMU and the drive circuit board 30 of the drive circuit apparatus DCU are disposed close to each other in order to reduce the size of the inverter apparatus INV, the signal terminals 24a to 24f and the drive circuit board are disposed. The electrical connection work with the wiring conductor on the upper surface of 30 becomes easy.

  In this embodiment, the electrical connection work between the signal terminals 24a to 24f and the wiring conductor on the upper surface of the drive circuit board 30 is performed on the surface of the drive circuit board 30 of the power module PMU and the drive circuit device DCU. Since it is easy to adjust the bonding conditions at the joint of the wire wiring 19 between them, there is little variation in bonding due to the wire wiring 19, and the bonding status of the wire wiring 19 can be confirmed visually. The reliability of the joint portion of the wire wiring 19 between them can be improved.

  In this embodiment, the wire wirings 16a to 16f and the signal terminals 24a to 24f and the drive are electrically connected to the signal terminals 24a to 24f and the gate electrodes of the bare chips 13a to 13f and the substrate conductors 18a to 18f. For the electrical connection between the wiring conductors on the upper surface of the circuit board 30, the wire wiring 19 having much higher flexibility than the signal terminals 24 a to 24 f is used. Accordingly, in this embodiment, the gate electrodes of the bare chips 13a to 13f and the substrate conductors 18a to 18f and the signal terminals 24a to 24f, the signal terminals 24a to 24f and the wiring conductor on the upper surface of the drive circuit board 30 are provided. Even if a distortion due to relative displacement due to vibration or temperature change occurs between the two, the distortion can be absorbed and relaxed. Therefore, according to the present embodiment, it is possible to improve the resistance to fatigue deterioration of the joint portion of the wire wiring 19 between them and improve the reliability of the joint portion. In addition, the life of the inverter device INV more than a predetermined number of years (for example, 15 years or more) required for the inverter device INV can be ensured even when the inverter device INV is placed in a severe environment such as temperature conditions and vibrations. it can.

  In the present embodiment, the output terminals 4 to 5 are arranged so that the insulating substrates 15 a to 15 f, the elongated flat plate portions of the input terminals 40 and the output terminals 4 to 6 are arranged in a checkered pattern on the upper surface of the module base 7. 6 and the insulating substrates 15a, 15c, and 15e, and the insulating substrates 15b, 15d, and 15e and the elongated flat plate portions of the input terminals 40 are alternately arranged in the terminal arrangement direction. As a result, in this embodiment, the source electrodes of the bare chips 13a to 13f and the substrate conductors 18a to 18f, the input terminal 40, and the output terminals 4 to 6 are provided without providing extra substrate conductors on the upper surfaces of the insulating substrates 15a to 15f. Can be electrically connected by wire wirings 14a to 14l. Therefore, according to the present embodiment, the wire wiring connection locations can be reduced, the mounting area in the power module PMU can be reduced, and the power module PMU can be downsized.

  Furthermore, in this embodiment, a small loop current path can be formed on the module base 7 by the arrangement configuration of the insulating substrates 15a to 15f, the elongated flat plate portion of the input terminal 40, and the output terminals 4 to 6. For example, in the U-phase arm, the positive terminal 3 of the elongated flat plate portion on one side in the terminal arrangement direction of the input terminal 40 → the wire wiring 14a → the substrate conductor 18a → the drain electrode of the bare chip 13a → the source electrode of the bare chip 13a → the wire wiring 14b → the output terminal. 4 → Wire wiring 14c → Substrate conductor 18b → Drain electrode of bare chip 13b → Source electrode of bare chip 13b → Wire wiring 14d → Negative plate side negative electrode side terminal 2 on one side of terminal arrangement direction of input terminal 40 A current path can be formed. As a result, in this embodiment, when the amount of current changes with time, an eddy current that is opposed to the current flowing through the loop-shaped current path and has the opposite energization direction can flow on the module base 7. Due to electromagnetic interference between the magnetic flux generated by the current flowing through the current path and the magnetic flux generated by the eddy current, the parasitic inductance in the current path can be reduced. Therefore, in this embodiment, it is possible to suppress the jumping voltage during the switching operation of the power semiconductor element.

  In addition, in this embodiment, since the loop current path can be minimized, the inductance parasitic on the current path can be further reduced.

  Further, in this embodiment, since the wiring direction by the wire wiring can be made orthogonal, electromagnetic noise generated by the current flowing through the wire wiring can be reduced.

  Further, according to the present embodiment, since the positive electrode side terminal 3 and the negative electrode side terminal 2 of the DC terminal 40 have a laminated structure, the current flowing through the positive electrode side terminal 3 and the current flowing through the negative electrode side terminal 2 are brought close to each other, Moreover, it can flow in opposite directions. Thereby, in the present embodiment, the parasitic inductance of the DC terminal 40 can be reduced by electromagnetic interference of two magnetic fluxes generated in the currents flowing in opposite directions, so that the jump voltage due to the parasitic inductance can be kept low. Further, in the present embodiment, the capacitor terminal 50 has the same configuration as the input terminal 40, and therefore the same operation and effect can be obtained.

  As described above, the inverter device INV described in the present embodiment ensures a lifetime of a predetermined number of years or more (for example, 15 years or more) required for the inverter device INV even when the inverter device INV is placed in a severe environment such as temperature conditions and vibrations. Therefore, it is particularly suitable as an in-vehicle inverter device INV used in an automobile.

  As the automobile, for example, an engine, which is an internal combustion engine, is used as a vehicle drive source, and a motor generator mounted on a side of the engine and mechanically connected to the engine by a belt is used as an engine start source, engine assist source, and vehicle. There are hybrid vehicles that use this as a power generation source. In this hybrid vehicle, the inverter device INV described above is electrically connected between a high-voltage battery (for example, battery voltage 36V) and the motor generator as a motor generator control device. Therefore, the DC power source DC in FIG. 3 corresponds to a high voltage battery, and the motor M corresponds to a motor generator.

  When the hybrid vehicle is in an idle stop operation mode in which the engine is temporarily stopped while the vehicle is stopped, such as waiting for a signal, and the engine is started again when starting, the DC power supplied from the high voltage battery is converted into AC power in the inverter INV. The AC power is converted and supplied to the motor generator. As a result, the motor generator operates as a motor and generates a rotational driving force. This rotational driving force is transmitted to the engine. As a result, the engine is cranked and restarted. In this case, the rotational speed of the motor generator is controlled by the inverter device INV.

  Since the engine load is large when the engine is initially started (when the engine is started in a cold state), the engine is started using a separately provided starter. Since the engine load is small when the engine is warm, the engine is started (hot start) using the motor generator as described above.

  When the vehicle is in an acceleration operation mode that assists driving of the engine during acceleration of the vehicle, the DC power supplied from the high voltage battery is converted into AC power in the inverter device INV, and this AC power is supplied to the motor generator. As a result, the motor generator operates as a motor and generates a rotational driving force. This rotational driving force is transmitted to the engine, and is transmitted to the axle as a vehicle driving force together with the rotational driving force of the engine. In this case, the motor generator is torque-controlled by the inverter device INV.

  When in the engine running power generation mode in which power is generated during engine running, the motor generator is driven to rotate by the engine. Thus, the motor generator operates as a generator and generates AC power. The generated AC power is converted into DC power by the inverter device INV and supplied to the high voltage battery. The high voltage battery charges the DC power supplied from the inverter device INV.

  When the vehicle is in a regenerative operation mode such as when the vehicle is decelerated or braked, the motor generator is driven to rotate by the kinetic energy of the vehicle. As a result, the motor generator operates as a generator, generates regenerative braking force, and generates AC power. The generated AC power is converted into DC power by the inverter device INV and supplied to the high voltage battery. The high voltage battery charges the DC power supplied from the inverter device INV.

  As a motor generator, a permanent magnet type AC synchronous machine in which a rotor field magnetic pole is composed of a permanent magnet, a field winding on a magnetic pole core in which N-pole and S-pole claw-shaped magnetic poles are alternately arranged in the rotation direction. AC synchronous machine equipped with a Rundel-type rotor wound with a secondary conductor (aluminum rod-shaped conductor) cast into a rotor core made of a stratified iron core, and both axial ends of the secondary conductor are made of copper An AC induction machine having a rotor mechanically connected by a short-circuit ring and electrically short-circuited can be used.

  In this embodiment, the motor generator is disposed on the side of the engine and mechanically connected to the engine, and is used as an engine start source, an engine assist source, and a vehicle power generation source. An AC synchronous machine having a child is used as a motor generator.

It is sectional drawing which shows the mechanical structure of the inverter apparatus INV of one Example of this invention, and shows the cross-sectional structure shown with the dashed-dotted line of FIG. It is a top view which shows the mechanical structure of the inverter apparatus INV of one Example of this invention, and shows the whole structure of a power module. The circuit diagram which shows the circuit structure of the inverter apparatus INV of FIG. 1, FIG.

Explanation of symbols

Mpu to Mnw ... power semiconductor element, PMU ... power module, DCU ... drive circuit device, MCU ... motor control device, 16a-16f, 19 ... wire wiring, 24a-24f ... signal terminals, 30 ... drive circuit board.

Claims (7)

A power module having a power semiconductor element;
A control unit for controlling the operation of the power semiconductor element,
The power module unit includes a signal terminal electrically connected to the power semiconductor element,
The signal terminal is electrically connected to the control unit;
The power conversion device, wherein the power module unit side and the signal terminal and the signal terminal and the control unit side are electrically connected by a flexible conductor. The power conversion device according to claim 1,
The power conversion device according to claim 1, wherein the signal terminal is formed of a metal plate formed in a step shape. The power conversion device according to claim 1,
The power conversion device according to claim 1, wherein the conductor is formed of an elongated wire-like conductive member. The power conversion device according to claim 1,
The power converter according to claim 1, wherein the conductor is a flat ribbon-shaped member in which a conductive member is covered with an insulating resin film. The power conversion device according to claim 1,
The power module portion includes a case for holding a resin filled to electrically insulate the power semiconductor element,
The power conversion device, wherein the signal terminal is inserted and held in the case. The power conversion device according to claim 5,
A heat conductive member is provided at the bottom of the case,
On one side of the heat conducting member, the power semiconductor element is mounted in an electrically insulated state,
A power converter, wherein a cooler is provided on the other side of the thermally conductive member and on the side opposite to the mounting side of the power semiconductor element. The power conversion device according to claim 1,
The said control part is mounted and comprised on the said power module part, The power converter device characterized by the above-mentioned.

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