JP2014007219A - Holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holder which reduces a height when the holder that holds an object is loaded on a substrate and which achieves a thin structure constructed on the substrate.SOLUTION: A holder comprises: a holding part 1 for holding an object; and a snap part 2 which is formed integrally with the holding part 1 and fitted to a fitting hole H provided in the base plate B for fixing the holding part 1 to the base plate B. The snap part 2 includes a snap piece 21 fitted to the fitting hole H. The snap piece 21 is fitted to the fitting holes H at a position lateral to the holding part 1. An underside space of the holding part 1 becomes unnecessary thereby to achieve a low height of the holder and a thin structure constructed on the base plate B.

Description

  The present invention relates to a holder for holding various components on a substrate such as a chassis or a panel, and more particularly to a holder having a snap structure that facilitates attachment to and removal from a substrate.

  Various holders for holding cables and circuit boards on boards such as chassis and panels have been proposed, but in recent years they have a snap structure that can be attached to and detached from a hole established in the board with a single touch, a so-called reuse structure. Retainers have been proposed. Patent Document 1 is a snap structure according to the present applicant, and is fitted to a hole by fitting into the hole when it is inserted into a hole provided in the board on the lower side of a holding part for holding an object. And a pair of release pieces which are connected to the snap pieces and are reduced in diameter when detached from the holes when manually operated. According to this snap structure, the substrate can be attached to the substrate simply by inserting the snap piece into the hole, and the snap piece can be removed from the hole by simply grasping the pair of release pieces with a finger. Suitable for reuse of the holder. The technique of Patent Document 2 is also based on the same technique.

Japanese Patent No. 3905527 Japanese Patent No. 4214471

  In each of the techniques of Patent Documents 1 and 2, a snap piece having a snap structure is arranged below the holding portion. Therefore, although the details will be described later, the leg piece and the release piece connected to the snap piece are also arranged over the lower side or the side region of the holding part. It is necessary to secure a space for arranging the piece and the release piece. Therefore, the overall height dimension of the holder is increased, and when the holder is mounted on the surface of the substrate, the space is secured in comparison with the original height dimension necessary for holding the object. Therefore, there is a problem that the height dimension on the surface side of the substrate is increased by the height dimension for this purpose, which becomes an obstacle when the structure constructed on the substrate is thinned.

  An object of the present invention is to provide a holder that can reduce the height dimension when mounted on a substrate and can reduce the thickness of a structure constructed on the substrate.

  The holder of the present invention is a holder provided with a holding part that holds an object, and a snap part that is provided integrally with the holding part and that fits into a mounting hole provided in the board and attaches the holding part to the board. The snap portion includes a snap piece that fits into the attachment hole at a side position of the holding portion. Further, the snap piece is located at a position where the bottom surface of the holding portion is close to the surface of the substrate or lower than the surface of the substrate as long as the object can be held by the holding portion when the snap piece is fitted into the mounting hole. It is set as the structure to fit. In the present invention, it is preferable to include a release piece that is coupled to the snap piece at a position just beside the holding portion and that releases the fitting of the snap piece when deformed toward the holder.

According to the present invention, since the snap piece is fitted into the mounting hole at the side position of the holding portion, the holding portion can be lowered to a height position equivalent to the snap piece, and the bottom surface of the holding portion is The height position close to the surface or a position lower than the surface of the substrate can reduce the overall height of the holder relative to the surface of the substrate, and the structure formed on the substrate can be thinned. In particular, in the snap portion that connects the leg piece and the release piece to the upper end portion of the snap piece, the leg piece and the release piece are arranged below the holding portion by arranging the upper end portion directly beside the holding portion. For this reason, there is no need for a space, and the height dimension of the holder can be reduced.

The perspective view which abbreviate | omitted one part which looked at Embodiment 1 of this invention from the back side. FIG. 3 is a front view, a side view, and a rear view of the first embodiment. The front view and side view which show the attachment state to a board | substrate. The front view for demonstrating the height dimension of a holder. The perspective view of the principal part of Embodiment 2. FIG. The front view and side view which show the attachment state to the board | substrate of Embodiment 2. FIG.

(Embodiment 1)
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view in which a part of the first embodiment in which the present invention is applied to a holder that binds a cable called a snapping tie and is held on a substrate, as viewed from the back side, is omitted. FIGS. These are a front view, a side view, and a rear view. The snapping tie includes a holding portion 1 for holding an object, here a cable, and a snap portion 2 for fixing the holding portion 1 to a substrate B such as a chassis. The holding part 1 has an elongated belt-like band 3 for binding cables and a head 4 integrally provided at the base end of the band 3, and the band 3 and the head 4 are made of an elastic resin. The material is integrally formed. In the following description, the vertical direction is based on FIG. 1, and the width direction is based on the horizontal direction of FIGS. 2 (a) and 2 (c).

In the band 3, a tooth portion 31 having a sawtooth cross section in the length direction is formed on a part of one surface in the length direction. A band insertion groove 41 through which the band 3 is inserted from the front end side is formed through the head 4, and a lock piece 42 having a tongue-like shape is formed at a portion facing the band insertion groove 41. The locking piece 42 is integrally provided with a locking tooth 43 engaged with the tooth portion 31 of the band 3, and when the band 3 is inserted into the band insertion groove 41, the locking tooth 43 is formed. The band 3 is locked by engaging with the tooth portion 31 and locking the movement in the direction opposite to the direction in which the band 3 is inserted. Since the configuration of the holding unit 1 including the hand 3 and the head 4 is already widely known, detailed description thereof is omitted here.

As will be described later, the snap portion 2 is fitted into a substantially rectangular mounting hole H opened in the substrate B to support the holding portion 1 on the substrate B, and is formed integrally with the head 4. Yes. The snap portion 2 includes a column body 21 that extends downward from the lower surface of the head 4, a snap piece 22 that is disposed in a pair so as to face both sides of the column body 21, and the snap piece 22. One end is connected to the pair of leg pieces 23 connected to each other, the snap piece 22 and the leg piece 23, and the other end is connected to a part near the upper side of the head 4 and is bent so as to bulge outward. The release piece 24 which makes the shape of a pair is provided. The snap piece 22, the leg piece 23, and the release piece 24 can be elastically deformed by the elasticity of the resin material.

  The column body 21 has a width dimension substantially equal to the width dimension of the head 4 and extends longer than the plate thickness dimension of the substrate B to be mounted. Further, in this embodiment, a guide rib 211 protruding along the vertical direction is integrally formed on one side surface in a direction orthogonal to the width direction of the column body 21. The pair of snap pieces 22 extend from both side edges in the width direction of the lower end of the column body 21 to a position higher than the bottom surface of the head 4 along both sides of the column body 21. The portion is extended to a position directly on both sides of the head 4. Each snap piece 22 has a hook 221 integrally on each outer surface, and is elastically deformed when the hook 221 is attached to a mounting hole H opened in the substrate B as will be described later. It can be fitted to the inner edge of the hole H.

The leg piece 23 has a base end connected to an upper end portion of the snap piece 22 and is formed in a tongue piece shape projecting outward from the base end obliquely downward. Since the upper end portion of the snap piece 22 extends to a position higher than the bottom surface of the head 4 and is positioned beside the head 4, the base end of the leg piece 23 connected thereto is also the head 4. It is arranged right next to both sides. The tips of the leg pieces 23 are brought into elastic contact with the surface of the substrate B when a snapping tie is attached to the substrate B.

  Similarly, the release piece 24 is connected to the upper end portion of the snap piece 22 at right lateral positions on both sides of the head 4, and extends outward and upward from the connection position, and is substantially equal to the upper end of the head 4. After being extended to the height, it is bent inward, and the tip portion 241 adjacent to the head 4 is connected to both side surfaces of the head 4 while being bent somewhat downward. In the first embodiment, the distal end portion 241 is smaller in width than the other portions and is smaller in thickness and easily elastically deformed, and the release piece 24 is removed by elastic deformation at the distal end portion 241. When the operation is performed, the release piece 24 can be deformed in the width direction at right lateral positions on both sides of the head 4.

  The mounting hole H opened in the substrate B is a rectangular through-hole whose length in the width direction is slightly longer than the length in the direction perpendicular to the horizontal direction corresponding to the planar shape of the snap portion 2. It is formed as. Further, a recess r corresponding to the guide rib 211 is formed on one side in the width direction.

  According to the snapping tie having the above configuration, when the cable is held on the board, as shown in the front view and the side view in FIGS. 3A and 3B, for example, the cable that is the object to be held first. The band 3 is wound around C, the tip of the band 3 is inserted into the band insertion groove 41 of the head 4, and the inserted tip is pulled and tied. As a result, the tooth portion 31 of the band 3 is engaged with the locking teeth 43 of the lock piece 42, and the band 3 is locked to move in the direction opposite to the insertion direction with respect to the head 4. To do. Note that the remaining tip side portion of the band 3 protruding from the head 4 is appropriately cut.

  Then, when the snap portion 2 is inserted into the mounting hole H from the surface side of the substrate B, the pair of snap pieces 22 are inserted into the mounting hole H while being elastically deformed inward, and the hook 221 extends the inner edge of the mounting hole H. When it gets over, it is elastically restored to the outside and fitted to the inner edge. At this time, the leg piece 23 is elastically deformed somewhat upward, and is elastically brought into contact with the surface of the substrate B by its elastic restoring force. As a result, the snap piece 22 is brought into contact with the inner edge of the mounting hole H in the outer diameter direction, and the substrate B is sandwiched between the leg piece 23 and the snap piece 22 in the plate thickness direction. It is fixedly attached to. At this time, since the guide rib 211 is fitted in the recess r of the mounting hole H, the mounting direction of the snap portion 2 with respect to the mounting hole H is specified. Further, even if an external force in the width direction is applied to the snap portion 2, the snap portion 2 is not moved in the width direction due to the fitting of the guide rib 211 and the recess r, and the snap piece 22 is deformed unexpectedly. Thus, the fitting with the mounting hole H is not released.

In the snapping tie attached to the substrate B in this way, as shown in FIG. 4A, the snap piece 22 is fitted into the attachment hole H at the side position of the head 4, and the upper end of the snap piece 22 is Since the holding portion 1, i.e., beside the both sides of the head 4, is fitted to the mounting hole H in a state of overlapping the head 4 in the height direction with respect to the substrate B, the bottom surface of the head 4 is The height position is almost the same as the surface of the substrate B, or a height position close to the surface of the substrate B. As a result, the leg pieces 23 and the release pieces 24 are also arranged on both sides of the head 4. Therefore, the height L1 of the upper surface of the head 4 with respect to the substrate B is substantially equal to the height dimension of the head 4, and the band insertion groove 41 of the head 4 is also at the same height position as the surface of the substrate B. In the band 3 inserted through the insertion groove 41, the lower side of the loop that binds the cable C is in a state along the surface of the substrate B. Thereby, the height dimension L2 of the loop of the band 3 is suppressed, and the overall height dimension of the snapping tie on the surface of the substrate B is suppressed. Therefore, the thin structure of the structure formed on the substrate B using this holder It becomes advantageous for the conversion.

  Incidentally, in the holders of the techniques of Patent Documents 1 and 2, as illustrated in FIG. 4B, a snap piece 122 constituting the snap portion 102 is disposed on the lower side of the head 104. Since the leg piece 123 and the release piece 124 connected to the upper end portion of the piece 122 are also provided from the lower side of the head 104 to the side, the leg piece 123 and the release piece 124 are provided on the lower side of the head 104. Therefore, it is necessary to ensure the space height dimension L10 in the height direction. Since the snap piece 122 is fitted into the mounting hole H of the substrate B on the lower side of the head 104, the bottom surface of the head 104 is located higher than the surface of the substrate B by the space height dimension L10 as a result. The height dimension L11 of the upper surface of 104 becomes higher, and the overall height dimension L12 of the holder is higher than the height dimension L2 of the first embodiment by the height dimension L10 of the space.

When the snapping tie is removed from the substrate B, the pair of release pieces 24 that are paired in the same manner as in Patent Documents 1 and 2 are picked from both sides with a finger and deformed inward, so that the snap pieces 22 connected thereto are also inside. Thus, the hook 221 is disengaged from the inner edge of the mounting hole H, so that the snap portion 2 can be pulled out from the mounting hole H in this state. As a result, the snapping tie and the substrate can be reused. As described above, even when the snap piece 2 is provided with the leg piece 23 and the release piece 24 to form a reuse structure, the leg piece 23 and the release piece 24 can be arranged right next to the holding portion 1, that is, the head 4. It is possible to reduce the dimension L2.

(Embodiment 2)
FIG. 5 is a perspective view of a main part of the second embodiment as a modified example of the snapping tie to which the present invention is applied. In the second embodiment, the snap portion is simplified, and the same reference numerals are given to the portions equivalent to the first embodiment. The point that the holding unit 1 is composed of the band 3 and the head 4 is the same as in the first embodiment, but the band 4 is formed in the head 4 in the vertical direction. It has been extended. Further, a lateral rib 44 protruding outward is integrally formed at a portion along the upper surface of the head 4. On the other hand, the snap portion 2 is not provided with a support on the lower surface of the head 4, and the base end portion of the snap piece 22 is connected to the lower ends of both side surfaces of the head 4. The snap piece 22 has its tip extended upward at right lateral positions on both sides of the head 4, and has a hook 221 on the outer surface of the middle position thereof. Moreover, the upper end part used as the front-end | tip is comprised also as a cancellation | release piece, and the protrusion 25 for hooking a finger | toe at the time of cancellation | release operation is integrally formed in both outer side surfaces. Although the leg piece is omitted here, the upper end portion of the snap piece 22 may be bent obliquely downward on both outer sides to constitute a leg piece. On the other hand, in the second embodiment, the mounting hole H opened in the substrate B is constituted by a rectangular hole having side lengths corresponding to the width direction of the snap portion 2 and the direction orthogonal to the horizontal direction.

Also in the second embodiment, as shown in the front view and the side view in FIGS. 6A and 6B, the cable 4 is bundled with the band 3, and the head 4 and the snap portion 2 are attached to the mounting holes of the substrate B. Interpolate to H. At this time, the tip of the band 3 inserted through the band insertion groove 41 of the head 4 is directed to the back side of the substrate through the attachment hole H. The pair of snap pieces 22 are respectively inserted into the mounting holes H, and the respective hooks 221 are fitted to the inner edges of the mounting holes H at positions on both sides of the head 4. As a result, the engagement state with the mounting hole H is maintained by the elastic contact force of the snap pieces 22 toward both outer sides, and the snap portion 2 is fixedly attached to the substrate B. At this time, the head 4 is prevented from falling off the mounting hole H by the lateral ribs 44 provided on the head 4 and the base end of the band 3 coming into contact with the surface of the substrate B at the inner edge of the mounting hole H. Is done. Therefore, a part of the bottom surface side of the head 4 is inserted into the mounting hole H, and the bottom surface of the head 4 is lower than the surface of the substrate B. As a result, attachment is performed in a state where the lower part of the loop of the band 3 is substantially in contact with the surface of the substrate B, and the overall height dimension of the snapping tie can be further reduced. Further, even if the bottom surface of the head 4 is made lower than the surface of the substrate B in this way, the band 3 is inserted through the head portion 4 with the attachment hole H inserted, and this may hinder the binding of the cable C. There is no.

In this second embodiment, if a finger is caught on the protrusion 25 provided on the upper end of the snap piece 22 and deformed inward, the snap piece 22 connected to the protrusion 25 is deformed inward to form the mounting hole H in the hook 221. And the snapping tie can be removed from the substrate B.

  In Embodiments 1 and 2 described above, the cable C is first bundled with the band 3 and then the snap portion 2 is fitted into the mounting hole H to be attached to the substrate B. Needless to say, the cable C may be bound by the band 3 after being fitted into the mounting hole H.

  Moreover, although Embodiment 1, 2 is an example applied to the snapping tie as a holder of this invention, the structure of a holding | maintenance part is not limited to this. Although illustration is omitted, the holding portion can be configured as a cable clamp for clamping the cable. Alternatively, the holding unit can be configured as a substrate holder for supporting the second substrate on the substrate. In any case, the snap piece of the snap part is configured to fit into the mounting hole at the side position of the holding part, preferably by arranging the upper end part or the whole of the snap piece directly beside the holding part, The height dimension of the holder from the surface of the substrate can be reduced. This effect is particularly effective in reducing the height dimension in a holder having a reuse structure in which a leg piece and a release piece are connected to a snap piece.

The snap portion in the present invention is not limited to the configuration provided with the elastically deformable snap pieces on both sides of the holding portion as shown in the first and second embodiments, but is not illustrated but only on one side of the holding portion. The present invention can also be applied to a snap structure in which a snap piece is provided and the opposite side is configured as a rigid hook piece fitted to the inner edge of the mounting hole.

  The present invention can be applied to a holder for holding an object on a substrate such as a chassis or a panel, and holding the object on the substrate by fitting in a mounting hole opened in the substrate by a snap portion. Is possible.

DESCRIPTION OF SYMBOLS 1 Holding part 2 Snap part 3 Band 4 Head 21 Prop body 22 Snap piece 23 Leg piece 24 Release piece 25 Protrusion 31 Tooth part 41 Band insertion groove 42 Lock piece 43 Locking tooth B Substrate H Mounting hole

Claims (3)

  A holding portion that holds an object; and a snap portion that is provided integrally with the holding portion and that fits into a mounting hole provided in the substrate and attaches the holding portion to the substrate. A holding tool comprising a snap piece that fits into the mounting hole at a lateral position.   When the snap piece is fitted in the mounting hole, the bottom surface of the holding part is lower than the position close to the surface of the substrate or the surface of the substrate as long as the object can be held by the holding unit. The holder according to claim 1, wherein the holder is fitted at a position. 3. A release piece connected to the snap piece at a position just beside the holding part and releasing the fitting of the snap piece when deformed toward the holder side. Retainer.

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