JP2014007124A - Led lighting fixture and led lighting device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide LED lighting fixtures usable for both low output and high output in a relatively easy and inexpensive manner, and an LED lighting device using the same.SOLUTION: LED lighting fixtures for low output include a housing to which a light emission unit 15 is fitted, and a radiating fin 101 that dissipates the drive heat generated from the light emission unit 15 to outside. The LED lighting fixtures for low output also include a heat sink attachment unit for detachable attachment of an additional heat sink 120 capable of thermal coupling to the radiating fin 101.

Description

  The present invention relates to a lighting fixture using an LED as a light source and an LED lighting device using the same.

There has been developed an embedded LED lighting device that uses an LED as a light source and is embedded in a ceiling or a wall surface (see, for example, Patent Document 1).
FIG. 21 shows a configuration example of a conventional embedded LED lighting device 1X. FIG. 22 shows a partial cross section of LED lighting device 1X and a usage example.
The LED lighting device 1X includes an LED lighting fixture 2X, a light emitting unit 15, and a power supply device (not shown).

The LED lighting device 2X includes a device main body 10X and a frame 20X.
The instrument body 10X is made of a metal member. The instrument main body 10 </ b> X includes an internal space that houses the light emitting unit 15 and a heat radiating unit (radiating fin 101 </ b> X) that radiates driving heat generated in the light emitting unit 15 to the outside. The radiating fin 101X is formed to have a certain size and mass (heat capacity) so that the driving heat can be radiated even when the light emitting unit 15 has a high output. The heat radiating fins 101X are erected radially, for example, in the vertical (Z) direction on the upper surface of the housing 100X of the instrument body 10X (FIG. 21).

The frame 20X is a cylindrical body. The frame 20X accommodates the light emitting unit 15 together with the instrument main body 10X. The frame body 20X includes a reflection plate 104 that reflects light emitted from the light emitting unit 15 and an auxiliary reflection plate 201 (FIG. 22). Further, the frame body 20X has instrument mounting springs 202A and 202B attached to the outer side surface.
The light emitting unit 15 includes, for example, six LED modules 15A to 15F (see FIG. 2).

The cable 110 is used for electrical connection between the power supply device and the light emitting unit.
The LED illumination device 1X is used as an embedded downlight as shown in FIG. At the time of installation, a power supply device (not shown) is placed on the back of the ceiling 1001 through a ceiling hole 1000A provided in the ceiling 1001. Then, the fixture mounting springs 202A and 202B are set in the vertical (Z) direction, and the LED lighting fixture 2X is inserted through the ceiling hole 1000A. At this time, the LED lighting device 2X is fixed by friction between the side surface 1001B of the ceiling hole 1000A and the device mounting springs 202A and 202B.

JP 2012-48996 A

In recent years, high-power LED lighting devices suitable for uses in public facilities and factories have been developed. On the other hand, low-power LED lighting devices suitable for home use and indirect lighting are also being developed.
As described above, LED lighting devices having various outputs have been developed. Accordingly, there is a demand to provide each output LED lighting device at a low cost. One of the measures to respond to this is to reduce the production cost of the LED lighting device.

However, at the current manufacturing site of LED lighting devices, there are cases where low-power LED lighting fixtures are manufactured using, for example, parts stocked for high-power LED lighting fixtures. In this case, in a low-power LED lighting fixture, a heat radiation fin having a large mass and a heat radiation area having excessive heat radiation characteristics may be used. This may cause an increase in production cost.
This invention is made | formed in view of the said subject, and it aims at providing the LED lighting fixture which can respond to both low output and high output at low cost, and an LED lighting apparatus using the same.

In order to solve the above problems, an LED lighting apparatus of one embodiment of the present invention includes a housing to which a light emitting unit is attached, a heat dissipating unit provided in the housing, and the heat dissipating unit so as to be thermally coupled to the heat dissipating unit. It is set as the structure which has a heat sink attachment part for attaching a heat sink detachably with respect to a thermal radiation part.
Further, as another aspect of the present invention, the heat radiating portion includes a plurality of heat radiating fins standing upright with a gap therebetween, the heat sink is a heat radiating plate, and the heat radiating plate is connected to a top portion of the heat radiating fin. A first flat plate portion disposed so as to be thermally coupled; and a second flat plate portion erected in a direction intersecting a plane direction of the first flat plate portion, and communicated with the gap at a position overlapping the gap. The heat sink may be configured to be attached to the heat sink mounting portion so that there is an opening to be formed and the first flat plate portion is thermally coupled to the top of the heat radiating fin.

As another aspect of the present invention, the heat radiating plate may be formed of an integral flat plate member that is bent so as to have a concave portion and a convex portion, and the opening portion may exist in the convex portion.
In another aspect of the present invention, the first flat plate portion and the second flat plate portion are formed of an integral flat plate member, and the second flat plate portion is cut and raised in a direction intersecting the plane direction of the first flat plate portion. It can also be set as the structure formed.

In another aspect of the present invention, the heat radiating plate includes a plurality of long radiating pieces having an L-shaped cross section having the first flat plate portion and the second flat plate portion, and the heat radiating pieces are radiated from the heat radiating pieces. It can also be set as the structure which has a connecting member connected to the fin and equal intervals, and the said opening part exists between adjacent thermal radiation pieces.
In another aspect of the present invention, the heat dissipating fin may have a flat top, and the heat sink may be attached in surface contact with the top of the heat dissipating fin.

Moreover, in another aspect of the present invention, the heat sink mounting portion may have one or more screwed structures that can be attached by screwing the heat sink.
In another aspect of the present invention, the heat sink mounting portion may have one or more locking structures that can be attached by locking the heat sink.
Moreover, in another aspect of the present invention, an LED lighting apparatus including the LED lighting apparatus according to any one of the above aspects of the present invention, the light emitting unit, and a power supply device for supplying power to the light emitting unit is provided.

  Here, in another aspect of the present invention, the exterior member of the power supply device and the heat sink can be configured as an integral member.

The LED lighting fixture of the present invention having the above-described configuration has a heat sink mounting portion for detachably attaching a heat sink to the heat radiating portion.
Therefore, a high-power LED lighting apparatus can be configured by attaching a heat sink to the heat sink mounting portion and improving heat dissipation characteristics.
On the other hand, in a state in which the heat sink is detached from the heat sink attachment portion, a low-power LED lighting apparatus in which an unnecessary heat sink is omitted can be configured.

Thereby, when manufacturing LED lighting fixtures for low outputs, the production cost can be reduced by omitting parts.
Furthermore, by sharing the configuration other than the heat sink with the LED lighting fixtures for low output and high output, it can be expected to reduce the production cost due to the common use of parts.
As described above, according to the present invention, it is possible to provide an LED lighting apparatus that can support both low output and high output at low cost, and an LED lighting apparatus using the same.

1 is an overall view showing a configuration of an LED lighting device 1 according to Embodiment 1. FIG. 1 is an overall view showing a configuration of an LED lighting device 1 according to Embodiment 1. FIG. It is sectional drawing of the LED lighting fixture 2 for high outputs. It is a fragmentary sectional view around the radiation fin 101 and the additional heat sink 120. It is an expanded view of the sheet metal member 120X. It is a partial cross section figure which shows the mode at the time of use of LED lighting apparatus 1. FIG. It is a general view which shows the structure of LED lighting apparatus 1A which abbreviate | omits the additional heat sink 120. FIG. It is a partial cross section figure which shows the mode at the time of use of 1 A of LED lighting apparatuses. It is sectional drawing which shows the mode at the time of attachment of the additional heat sink 120A which concerns on Embodiment 2. FIG. It is sectional drawing which shows the mode at the time of attachment of the additional heat sink 120A which concerns on Embodiment 2. FIG. It is sectional drawing which shows the mode at the time of attachment of the expansion heat sink 120B which concerns on Embodiment 3. FIG. It is sectional drawing which shows the mode at the time of attachment of the expansion heat sink 120B which concerns on Embodiment 3. FIG. It is a fragmentary sectional view around the radiation fin 101 and expansion heat sink 120C concerning Embodiment 4. It is a general view which shows the structure of the LED lighting apparatus 1B which concerns on Embodiment 5. FIG. It is a fragmentary sectional view of the periphery of the radiation fin 101 and expansion heat sink 120D which concern on Embodiment 5. FIG. It is a general view which shows the structure of 1C of LED lighting apparatuses which concern on Embodiment 6. FIG. It is a fragmentary sectional view around the radiation fin 101 and expansion heat sink 120D concerning Embodiment 6. It is a general view which shows the structure of LED lighting apparatus 1D which concerns on Embodiment 7. FIG. It is a general view which shows the structure of the LED lighting apparatus 1E which concerns on Embodiment 8, and an expanded view of the expansion heat sink 120G. It is a fragmentary sectional view around the radiation fin 101 and the expansion heat sink 120H according to the ninth embodiment. It is a general view which shows the structure of the conventional LED lighting apparatus 1X. It is a partial cross section figure which shows the mode at the time of use of the conventional LED lighting apparatus 1X.

Hereinafter, each embodiment of the present invention will be described.
<Embodiment 1>
1 and 2 show the configuration of the LED lighting device 1. FIG. 1 is an overall view of the LED illumination device 1 as viewed obliquely from above. FIG. 2 is an overall view of the LED lighting device 2 for high output and the light emitting unit 15 of the LED lighting device 1 as viewed obliquely from below (the panel 103 is omitted for explanation). FIG. 3 is an XZ cross-sectional view (XZ cross-sectional view passing through the gap between the radiation fins 101C and 101D in FIG. 1) showing the configuration of the LED lighting device 2.

The LED lighting device 1 includes a high-power LED lighting fixture 2, a light emitting unit 15, and a power supply device 40. The high-power LED lighting device 2 includes a device main body 10 and a frame 20.
Here, as an example, the high-power LED lighting fixture 2 is configured to assume a 700-type recessed downlight.
Hereinafter, each component of the LED lighting device 1 will be described.
(Light Emitting Unit 15)
The light emitting unit 15 is a light emitting unit of the LED lighting device 1. The light emitting unit 15 includes six LED modules 15A to 15F having the same configuration (FIG. 2).

  As shown in FIG. 2, the LED module 15A (15D) includes a base substrate 105A (105D) made of a composite material as an example. The LED module 15A (15D) includes an LED element 106A (106D) mounted on the base substrate 105A (105D). Further, the LED module 15A (15D) has a connector 107A (107D) electrically connected to the LED element 106A (106D). Further, the LED module 15A (15D) has a lead wire 108A (108D) extended by being electrically connected to the connector 107A (107D) (FIG. 3).

Here, the LED modules 15A to 15F are high-output type standards. As an example of “high output”, the overall output of the light emitting unit 15 can be set to 7000 lm, 84.2 W, and 83.2 lm / W.
Lead wires (108A, 108D, etc.) of the LED modules 15A to 15D are extended to the outside through the flow path 111 of the housing 100. Lead wires (108A, 108D, etc.) are combined into a single cable 110 and electrically connected to the power supply device 40.
(Frame body 20)
The frame 20 is a cylindrical body made of a resin material or a metal material having excellent heat resistance. The frame 20 includes a ring-shaped main body 200 and an auxiliary reflector 201 disposed on the surface of the main body 200 in the internal space 210 (FIGS. 2 and 3). The lower (reverse Z) direction front end portion of the main body 200 is formed in a flange shape.
(Power supply device 40)
The power supply device 40 is a unit that supplies power from the outside to the light emitting unit 15 side. The power supply device 40 is electrically connected to the light emitting unit 15 via the cable 110.

An external voltage that can be applied to the power supply device 40 can be selected as appropriate. As an external voltage, for example, a range of 100V-242V can be exemplified.
(Apparatus body 10)
The instrument body 10 is made of a die-cast product using a zinc alloy material having excellent thermal conductivity or an extrusion-molded product using an aluminum material. The instrument main body 10 includes a housing 100, radiating fins 101 (101A to 101G), an additional heat sink mounting portion 112, and an additional heat sink 120 (FIGS. 1 and 2). Furthermore, the instrument main body 10 includes a reflector 104, a panel 103, and a panel presser 102 disposed on the internal space 110 side below the casing 100 (FIG. 3).
[Reflector 104]
The reflection plate 104 is a member that reflects light emitted from the light emitting unit 15 downward (in the reverse Z direction). The reflector 104 has bowl-shaped curved portions 104A to 104F. The reflection plate 104 is arranged in the internal space 110 so that the light emission of the LED modules 15A to 15F can be reflected by the curved surface portions 104A to 104F in the same order.
[Panel 103]
The panel 103 is a transparent member that protects the light emitting unit 15 from the outside and transmits light emitted from the light emitting unit 15. The panel 103 is disposed so as to overlap the reflector 104. A lens or a color filter may be used instead of the panel 103.
[Panel presser 102]
The panel retainer 102 is an annular member made of a metal material or the like. The panel presser 102 is used for fixing the panel 103 to the internal space 110 side.
[Case 100]
As shown in FIG. 3, the housing 100 is formed as a dish-like member having a recess in the lower part of the drawing. The housing 100 has a flat plate portion 109.

The flat plate part 109 is a main part of the housing 100. The LED modules 15 </ b> A to 15 </ b> F of the light emitting unit 15 are mounted on one surface (surface on the reverse Z direction side) of the flat plate portion 109 with an interval. An internal space 110 exists around one surface (surface on the reverse Z direction side) of the flat plate portion 109. In addition, a flow passage 111 communicating between the internal space 110 and the outside exists in the center of the flat plate portion 109.
The internal space 110 is secured around the light emitting unit 15 attached to the flat plate portion 109. A plurality of heat radiation fins 101 are provided upright on the other surface (upper surface in the drawing) of the flat plate portion 109.
[Heat radiation fin 101]
The radiating fins 101 (101A to 101G) are radiating units that radiate driving heat generated in the light emitting unit 15 to the outside. The radiation fins 101 (101A to 101G) are erected in the vertical (Z) direction with the upper surface of the flat plate portion 109 as an erected region (FIGS. 1 and 3). The radiation fins 101 (101A to 101G) have the XZ direction along the main surface. The radiating fins 101 (101A to 101G) are arranged side by side with a gap in the Y direction. Each radiation fin 101 (101A to 101G) has a flat top portion 1010A to 1010G. As an example of the size of each radiation fin 101 (101A to 101G), it can be set to a thickness of about 3 mm and a height of about 50 mm. Hereinafter, when it is not necessary to distinguish between the radiation fins 101A to 101G, they are referred to as “radiation fins 101”.
[Heat sink mounting part 112]
The heat sink mounting portion 112 is provided for detachably attaching the additional heat sink 120 so as to be thermally coupled to the heat radiation fin 101. The heat sink mounting portion 112 includes columnar portions 112A, 112D, and 112G and male screws B1, B2, and B3 (see partial sectional views of the heat radiation fin 101 and the additional heat sink 120 in FIG. 6).

  The columnar portions 112A, 112D, and 112G are columnar in which the vertical (Z) direction is the longitudinal direction. The columnar portions 112A, 112D, and 112G are provided by partially bulging the radiating fins 101A, 101D, and 101G in the thickness (Y) direction. The height of the Z-direction upper surfaces of the columnar portions 112A, 112D, and 112G is set to the same height as the top portions 1010A to 1010G of the radiation fins. Female screws C1, C2, and C3 are provided in the same order on the upper surfaces in the Z direction of the columnar portions 112A, 112D, and 112G. The female screws C1, C2, and C3 are screwed with the male screws B1, B2, and B3. Thereby, the heat sink attachment part 112 attaches the expansion heat sink 120 so that attachment or detachment is possible.

Note that the columnar portions 112 </ b> A, 112 </ b> D, and 112 </ b> G may be erected on the upper surface of the housing 100 independently of the heat radiating fins 101.
[Additional heat sink 120]
The additional heat sink 120 is provided for the purpose of increasing the heat radiation effect of the driving heat generated in the light emitting unit 15 and making the LED lighting device 1 and the LED lighting fixture 2 compatible with high output. As an example, the additional heat sink 120 is composed of a heat sink.

  Specifically, the additional heat sink 120 includes a plurality of first flat plate portions 1205 (1205A to 1205G) whose plane direction is the XY direction. Furthermore, the additional heat sink 120 has a plurality of additional fins 1204 (1204A to 1204F) that are erected in a direction intersecting the XY direction (as an example, the Z direction) (FIGS. 1 and 2). Each expansion fin 1204 (1204A to 1204F) has the same configuration. The additional fins 1204 (1204A to 1204F) are arranged in parallel at regular intervals in the Y direction across the first flat plate portion 1205 (1205A to 1205G).

Here, FIG. 4 is a YZ sectional view of the additional heat sink 120 and the heat radiation fin 101.
Each expansion fin 1204 (1204A to 1204F) has a pair of second flat plate portions (1201a, 1202a, etc.). Between the second flat plate portions (1201a, 1202a, etc.), there are first opening portions 1203a to 1203f.
The second flat plate portion (1201a, 1202a, etc.) is a main heat radiating portion of the additional heat sink 120. The height and thickness of the second flat plate portion (1201a, 1202a, etc.) can be adjusted as appropriate. As an example, the height in the vertical (Z) direction can be set to about 50 mm and the thickness can be set to about 1 mm.

  The first openings 1203a to 1203f utilize the characteristic that heated air rises. That is, the first openings 1203a to 1203f form a flow path for letting the heated air staying between the radiating fins 101 to the outside along the vertical (Z) direction. For this reason, the first openings 1203a to 1203f are present so as to communicate with the gaps between the radiation fins 101A to 101G at the positions overlapping the gaps between the radiation fins 101A to 101G.

  The 1st flat plate part 1205 (1205A-1205G) is provided so that it may thermally couple with the top part 1010A-1010G of each radiation fin 101A-101G. For this reason, the first flat plate portion 1205 (1205A to 1205G) is in direct surface contact with the top portions 1010A to 1010G. Alternatively, the first flat plate portions 1205 (1205A to 1205G) are thermally coupled to the top portions 1010A to 1010G via a heat conductive member such as silicone grease, a heat conductive sheet, or a heat conductive seal. By interposing the heat conductive member, an improvement in the thermal conductivity between the first flat plate portion 1205 (1205A to 1205G) and the top portions 1010A to 1010G can be expected. Screw holes 1206A, 1206D, and 1206G are provided in the first flat plate portions 1205A, 1205D, and 1205G, respectively. The additional heat sink 120 is detachably attached to the radiation fin 101 side by screwing the male screws B1, B2, and B3 into the female screws C1, C2, and C3 through the screw holes 1206A, 1206D, and 1206G.

FIG. 5 is a development view of a metal plate (sheet metal member 120X) constituting the additional heat sink 120. FIG.
As shown in FIG. 5, the additional heat sink 120 is formed by bending and punching a sheet metal member 120X, which is an integral member, by, for example, pressing. As an example, the expansion fins 1204A (1204B) are configured to have adjacent first flat plate portions 1201a, 1202a (1201b, 1202b). Further, the additional fins 1204A (1204B) are configured to have the peripheral portions (frame portions 1200a (1200b)) of the first openings 1203a and 1203b between the first flat plate portions 1201a and 1202a (1201b and 1202b). The sheet metal member 120X is bent so as to have a concave portion and a convex portion as a whole along the folding lines L1 to L4 (L5 to L7 and the like). Thus, the additional heat sink 120 has a three-dimensional structure with a wavy cross section (see FIG. 4). The other expansion fins 1204C to 1204G and the first flat plate portions 1205C to 1205G can be configured in the same manner as the expansion fins 1204A to 1204B and the first flat plate portions 1205A to 1205B. That is, the 1st flat plate part 1205 (1205A-1205G) is located in the position of a recessed part. Further, the first openings 1203a to 1203f are present at the positions of the convex portions.

As described above, the additional heat sink 120 can be constituted by the sheet metal member 120X which is an integral member. Therefore, a great effect is achieved in both production cost and production efficiency.
(When using the LED lighting device 1)
FIG. 6 is a partial cross-sectional view showing an example of use of the LED lighting device 1. In the figure, for the sake of explanation, only the ceiling 1000, the ceiling hole 1000A, and the side surface 1000B are shown in a sectional structure.

When installing the LED lighting device 1, the power supply device 40 is placed on the back of the ceiling 1000. The high-power LED lighting device 2 is inserted into the hole 1000A with the device mounting springs 202A and 202B oriented in the vertical (Z) direction. At this time, the high-power LED lighting device 2 is fixed by friction between the side surface 1000B of the ceiling hole 1000A and the device mounting springs 202A and 202B.
Here, if the additional heat sink 120 is attached to the top portions 1010A to 1010G of the radiation fins 101, the size (diameter) of the high-power LED lighting device 2 when viewed from the vertical (Z) direction is not so large. . Therefore, it is not necessary to provide a large ceiling hole 1001A.

Further, during driving, the heated air escapes from the first openings 1203a to 1203f of the additional heat sink 120 in the vertical (Z) direction. For this reason, it is difficult for heat to remain near the side surface 1001B of the ceiling hole 1001A. Therefore, even if the diameter of the ceiling hole 1000A is small, the driving heat generated in the light emitting unit 15 can be effectively radiated. As a result, the LED lighting device 1 can be driven stably.
(Effect of attaching / detaching the additional heat sink 120)
FIG. 7 is a diagram illustrating a state in which the additional heat sink 120 of the high-power LED lighting device 2 is detached to form the low-power LED lighting device 3.

  In the LED lighting device 1, the additional heat sink 120 is detachably attached by the heat sink attachment portion 112. That is, the additional heat sink 120 can be detached from the radiation fin 101 side relatively easily by simply removing the male screws B1 to B3 from the female screws C1 to C3 side. Thereby, the low output apparatus main body 10A and the low output LED lighting apparatus 3 using the same can be configured.

  In the low output LED lighting fixture 3, low output type LED modules 15A to 15F are mounted on the flat portion 109 of the fixture main body 10A as the light emitting portion 15 (see FIG. 2). Thereby, low output LED lighting apparatus 1A can be comprised. As an example of “low output”, the overall output of the light emitting unit 15 can be 3615 lm, 42.4 W, and 85.1 lm / W.

  FIG. 8 is a partial cross-sectional view showing a usage example of the LED lighting device 1A. Since the member thickness of the ceiling 1001 is relatively thin as shown in the figure, the holding force by the instrument mounting springs 202A and 202B may be relatively weak. However, by omitting the additional heat sink 120, the weight of the low-power LED lighting fixture 3 is slightly reduced. Therefore, the LED light fixture 3 for low output can be safely mounted in the ceiling hole 1001A accordingly. Further, by omitting the unnecessary additional heat sink 120, the size of the low-power LED lighting fixture 3 can be minimized and contribute to downsizing.

Further, the high-power LED lighting fixture 2 and the low-output LED lighting fixture 3 have a common configuration except for the additional heat sink 120 and the light emitting unit 15. For this reason, the high output LED lighting fixture 3 can be manufactured comparatively easily and rapidly only by manufacturing the low output LED lighting fixture 3 and attaching the additional heat sink 120 to the heat sink mounting portion 112 when necessary.
As a result, the production cost can be reduced. Moreover, the LED lighting fixture which can respond to both a low output use and a high output use, and an LED lighting apparatus using the same can be manufactured with favorable production efficiency.

The term “detachably attached” as used in the present invention does not include attachment using an adhesive or attachment by welding, but refers to attaching and detaching separate members mechanically.
Hereinafter, another embodiment of the present invention will be described focusing on differences from the first embodiment.
<Embodiment 2>
The heat sink mounting portion of the present invention is not limited to a configuration having a screwed structure. For example, a heat sink mounting portion having a locking structure can be configured.

9 and 10 are XZ sectional views showing the configuration of the LED lighting apparatus 2A according to Embodiment 2 (the sectional position corresponds to FIG. 3).
Specifically, in the LED lighting apparatus 2A shown in FIG. 9, a clip-shaped heat sink mounting portion 1030D is provided on the top portion 1010D1 of the heat radiation fin 101D1. Further, the LED lighting fixture 2A is provided with a columnar portion 112D similar to that of the first embodiment. The clip-shaped heat sink mounting portion 1030D has a bulging portion 1031D whose tip bulges downward (in the reverse Z direction).

On the other hand, the expansion heat sink 120A is provided with notches 1250D1 and 1251D1 at positions corresponding to the clip-shaped heat sink mounting portion 1030D and the columnar portion 112D in the first flat plate portion 1205D1.
When attaching the additional heat sink 120A, the first flat plate portion 1205D1 is slid along the top portion 1010D1 (FIG. 9). At this time, the first flat plate portion 1205D1 is sandwiched between the bulging portion 1031D and the top portion 1010D1. Further, the first flat plate portion 1205D1 is pressed toward the top portion 1010D1 by the bulging portion 1031D. On the other hand, the male screw B2 is screwed into the female screw C2 of the columnar part 112D through the notch 1250D1 (FIG. 10). The first flat plate portion 1205D1 is pressed and locked to the top portion 1010D1 side by the clip-like heat sink mounting portion 1030D that rides above the first flat plate portion 1205D1. Further, the first flat plate portion 1205D1 is detachably attached by a female screw C2 and a male screw B2.

Although not shown, the heat sink 120A can be locked by providing a heat sink mounting portion on any of the other heat radiating fins. When removing the additional heat sink 120A, an operation reverse to the above may be performed.
According to the second embodiment described above, the same effect as that of the first embodiment can be expected.
<Embodiment 3>
The third embodiment is characterized in that a heat sink mounting portion having only a locking structure is used.

11 and 12 are XZ sectional views showing the configuration of the LED lighting apparatus 2B according to Embodiment 3 (the sectional position corresponds to FIG. 3).
In LED lighting fixture 2B shown in FIG. 11, a plurality of claw-shaped heat sink attachment portions 1040D to 1042D having L-shaped cross sections at regular intervals are provided at the top portion 1010D2 of the heat radiation fin 101D2.

Further, the extension heat sink 120B is provided with notches 1250D2 to 1252D2 at positions of the first flat plate portion 1205D2 corresponding to the claw-shaped heat sink attachment portions 1040D to 1042D.
When attaching the additional heat sink 120B, the first flat plate portion 1205D2 is slid along the top portion 1010D2 (FIG. 12). At this time, the first flat plate portion 1205D2 is sandwiched between the heat sink mounting portions 1040D to 1042D and the top portion 1010D2. Further, the first flat plate portion 1205D2 is pressed toward the top portion 1010D2 by the heat sink mounting portions 1040D to 1042D.

Thereby, 1205D2 of the additional heat sink 120B is detachably attached to the top portion 1010D2 by the claw-like heat sink attachment portions 1040D to 1042D.
It should be noted that a heat sink mounting portion may be similarly provided on any of the other heat dissipating fins to lock the additional heat sink 120B. When detaching the additional heat sink 120B, an operation reverse to the above is performed.

According to the third embodiment, the same effect as that of the first embodiment can be expected.
<Embodiment 4>
The fourth embodiment is characterized in that an additional heat sink is formed by increasing the heat radiation area at both ends in the Y direction of the additional heat sink 120 of the first embodiment.
FIG. 13 is a YZ sectional view showing the configuration of the additional heat sink 120C according to the fourth embodiment (the sectional position corresponds to FIG. 4). The expansion heat sink 120C is obtained by adding expansion fins 1204G and 1204H made of flat plate portions at both ends in the Y direction with respect to the expansion heat sink 120. The expansion fins 1204G and 1204H are configured by extending members from the first flat plate portions 1205A and 1205G, respectively.

If such an additional heat sink 120C is used, the effect of the first embodiment can be expected. Further, the additional heat sink 120C has a wide heat radiation area. For this reason, the heat sink 120C can be expected to further improve the heat dissipation characteristics.
Note that the heat dissipation characteristics improve as the heat dissipation area of the additional heat sink increases. However, there is a trade-off between the heat dissipation characteristics and the problems such as member cost and weight increase. It is necessary to pay attention to this point.
<Embodiment 5>
The fifth embodiment is characterized in that an additional heat sink is configured by cutting and processing the sheet metal member 120X (see FIG. 5).

FIG. 14 is an overall view showing an LED lighting apparatus 2C according to Embodiment 5 and an LED lighting apparatus 1B using the same. FIG. 15 is a YZ sectional view around the additional heat sink 120D of the LED lighting apparatus 2C (the sectional position corresponds to FIG. 4).
The additional heat sink 120D is a heat sink. The additional heat sink 120D includes a plurality of first flat plate portions 1200 and a plurality of second flat plate portions 1207A to 1207H arranged between the first flat plate portions 1200. Second openings 1208A to 1208F exist between the first flat plate portion 1200 and the second flat plate portions 1207A to 1207H (FIG. 15). The first flat plate portion 1200 and the second flat plate portions 1207A to 1207H are configured using a sheet metal member 120X which is an integral member.

The first flat plate portion 1200 uses a flat portion of the sheet metal member 120X. The first flat plate portion 1200 has the XY direction as the plane direction. The first flat plate portion 1200 is disposed so as to be thermally coupled to the top portions 1010A to 1010G of the radiation fins 101A to 101G.
The second flat plate portions 1207 </ b> A to 1207 </ b> H are cut and raised in a direction intersecting the plane direction of the first flat plate portion 1200 (for example, a vertical (Z) direction).

The second openings 1208A to 1208F are arranged at positions corresponding to the gaps between the heat radiating fins 101A to 101G.
The method of attaching / detaching the heat sink 120D to / from the radiation fins 101A to 101G is the same as that in the first embodiment.
Even when the additional heat sink 120D having the above configuration is used, the same effects as those of the first embodiment are obtained. Further, as shown in FIG. 15, the heated air generated on the side of the radiating fin 101 rises in the vertical (Z) direction and is radiated to the outside through the second openings 1208 </ b> A to 1208 </ b> F during driving. Further, the second flat plate portions 1207A to 1207H serve as heat dissipation means. As a result, it is possible to dissipate the drive heat generated on the side of the radiation fin 101.

In addition, you may devise the 2nd flat plate parts 1207A-1207H separately, such as joining the flat plate member which consists of metals along a perpendicular | vertical (Z) direction, and increasing a thermal radiation area.
<Embodiment 6>
The sixth embodiment is characterized in that an additional heat sink is constituted by a ladder-like member and a flat plate member.

FIG. 16 is an overall view showing an LED lighting apparatus 2D according to Embodiment 6 and an LED lighting apparatus 1C using the same. FIG. 17 is a YZ sectional view around the additional heat sink 120E of the LED lighting apparatus 2D.
The additional heat sink 120E is a heat sink. The additional heat sink 120E includes a ladder-shaped connecting member 1201 and a plurality of heat radiation pieces 1209A to 1209G.

  The connecting member 1201 includes a pair of extending members 1212A and 1212B whose extending direction is the Y direction, and a plurality of strip-shaped members 1211A to 1211G arranged at regular intervals so as to intersect the extending members 1212A and 1212B. (FIGS. 16 and 17). The extending members 1212A and 1212B and the strip-shaped members 1211A to 1211G are connected by, for example, spot welding. The gaps between the strip-shaped members 1211A to 1211G are equal to the intervals between the top portions 1010A to 1010G of the radiation fins 101A to 101G.

The heat radiating pieces 1209A to 1209G are long bodies formed by bending a flat plate member into an L-shaped cross section, and have first flat plate portions 1210A to 1210G and second flat plate portions 1211A to 1211G.
The first flat plate portions 1210A to 1210G are connected to one surface (the upper surface in FIG. 17) of the strip-shaped members 1211A to 1211G by spot welding or the like. Accordingly, the heat radiation pieces 1209A to 1209G are connected to the connection member 1201 at equal intervals with the heat radiation fins 101A to 101G.

In the additional heat sink 120E, the other surfaces (the lower surfaces in FIG. 17) of the strip-shaped members 1211A to 1211G are arranged so as to be thermally coupled to the top portions 1010A to 1010G of the radiation fins 101A to 101G. Thereby, 1st flat plate part 1210A-1210G is arrange | positioned in the position which overlaps with top part 1010A-1010G.
In addition, 3rd opening part 1213A-1213F exists in the clearance gap between 1st flat plate part 1210A-1210G of adjacent thermal radiation piece 1209A-1209G. The third openings 1213A to 1213F are arranged at positions overlapping the gaps between the adjacent heat radiation fins 101A to 101G. As a result, the third openings 1213A to 1213F communicate with the gaps between the adjacent radiating fins 101A to 101G.

The method of attaching / detaching the heat sink 120E to / from the radiation fins 101A to 101G is the same as that in the first embodiment.
Even when the additional heat sink 120E having the above configuration is used, the same effects as those of the first embodiment are obtained. Also, as shown in FIG. 17 during driving, the heated air generated on the side of the radiation fin 101 rises in the vertical (Z) direction. The heated air is radiated to the outside through the third openings 1213A to 1213F. On the other hand, each of the heat dissipating pieces 1209A to 1209G functions as a heat dissipating means. That is, the drive heat generated on the side of the radiation fin 101 is conducted to the first flat plate portions 1210A to 1210G. The driving heat is radiated to the outside in each of the second flat plate portions 1211A to 1211G.

The additional heat sink 120E can be configured such that the components of the connecting member 1201 are thicker than the thickness of the sheet metal member 120X (see FIG. 5). Therefore, the abundant heat capacity of the additional heat sink 120E can be secured. Moreover, further improvement of heat dissipation characteristics can be expected.
<Embodiment 7>
The seventh embodiment is characterized in that the top plate of the power supply device also serves as an additional heat sink.

FIG. 18 is an overall view showing a configuration of an LED lighting apparatus 2E according to Embodiment 7 and an LED lighting apparatus 1D using the same.
In the LED lighting device 1D, the additional heat sink 120F that is detachably attached to the heat sink attaching / detaching portion 112 of the lighting fixture 2E is configured by using the top plate 401 of the power supply device 40A and an integral member (such as the sheet metal member 120X in FIG. 4). Is done. Thereby, the top plate 401 of the power supply device 40A also serves as the additional heat sink 120F.

The configuration of the additional heat sink 120F is substantially the same as that of the additional heat sink 120D of the fifth embodiment. The additional heat sink 120F has a plurality of first flat plate portions 1200 and a plurality of second flat plate portions 1207 (1207A to 1207H). The additional heat sink 120F is detachably attached to the radiating fin 101 using the heat sink mounting portion 112.
The LED lighting device 1D having the above configuration can be expected to have the same effect as that of the first embodiment. Moreover, the number of parts can be reduced because the top plate 401 also serves as the additional heat sink 120F. Furthermore, it is possible to dissipate the drive heat generated in the power supply device 40A with the additional heat sink 120F. Alternatively, the driving heat generated on the side of the radiation fin 101 can be radiated by the top plate 401.
<Eighth embodiment>
The eighth embodiment is characterized in that an additional heat sink is detachably attached to an LED lighting apparatus having a star-shaped heat radiation fin.

FIG. 19A is an overall view (assembly diagram) showing the configuration of the LED lighting apparatus 2F according to Embodiment 8 and the LED lighting apparatus 1E using the same. FIG. 19B is a development view of the additional heat sink 120G.
The LED lighting device 2F includes a device main body 10B and a frame body 20A (similar to the frame body 20 of the first embodiment).

  The instrument main body 10B includes a plurality of heat radiation fins 101A to 101K (star-shaped heat radiation fins) radially arranged on the upper surface of the housing 100A, and columnar portions 112A to 112K provided integrally with the heat radiation fins 101A to 101K. And have. Furthermore, the instrument main body 10B includes male screws B4 to B14 having a screwed structure with female screws C4 to C14 provided on the top portions 1010A to 1010K, and an additional heat sink 120G (FIG. 19A).

  The additional heat sink 120G is configured to bend the sheet metal member 120X along a plurality of fold lines along the Z direction to form a star-shaped cross section. The additional heat sink 120G includes a plurality of first flat plate portions 1214A to 1214K, a second flat plate portion 1201G, and screw holes 1215A to 1215K, as shown in FIG. L8 to L20 and the like are part of the fold line along the vertical (Z) direction.

The first flat plate portions 1214A to 1214K are bent in the horizontal (XY) direction. The first flat plate portions 1214A to 1214K are arranged in surface contact with the top portions 1010A to 1010K so as to be thermally coupled to the top portions 1010A to 1010K.
The male screws B4 to B14 are screwed with the female screws C4 to C14 through the screw holes 1215A to 1215K.

Also in the LED lighting device 1E having the above configuration, the same effect as that of the first embodiment can be expected.
In addition, since the folding lines L8 to L20 and the like are aligned along the vertical (Z) direction, the heated air from the radiation fin 101 side can be smoothly guided to the outside along the surface of each first flat plate portion 1201G. . As a result, excellent heat dissipation characteristics can be expected.
<Embodiment 9>
The ninth embodiment is characterized in that a radiation fin and a heat sink mounting portion are individually provided.

FIG. 20 is a partial cross-sectional view around the radiation fin 101 and the additional heat sink 120H according to the ninth embodiment.
The heat sink attachment portions 112A ′ and 112G ′ according to the ninth embodiment include female screws C1 and C3 and male screws B1 and B3 provided on the housing 100A.
The female screws C1 and C3 are provided on the upper surface of the casing 100 outside the radiation fins 101A and 101G.

  The additional heat sink 120H has the heat sink 120 as a basic structure. Furthermore, it has extension parts 1215 and 1216 respectively extended from the first flat plate parts 305A and 305G to the housing 100A side (reverse Z direction), and first flat plate parts 1205G and 1205I having the XY direction as the plane direction. The first flat plate portions 1205G and 1205I are arranged so as to be in surface contact with the surface of the housing 100A.

The additional heat sink 120H is detachably attached to the female screws C1, C3, the male screws B1, B3, and the housing 100A side through opening holes 1206A, 1206G formed in the first flat plate portions 1205G, 1205I. At this time, the heat sink 120H is placed and attached to the top portions 1010A to 1010G.
The ninth embodiment having such a configuration also has the same effect as the first embodiment. Further, the heat sink attachment portions 112A ′ and 112G ′ exist outside the heat radiating fins 101. For this reason, the effect at the time of attaching the additional heat sink 120H can also be expected to be reduced.
<Other matters>
The “high output” and “low output” of the light emitting section referred to in the present invention are not limited to fixed values. For example, it can define suitably according to the size and form of an instrument main-body part.

  When an additional heat sink is attached to the radiating fin, a joint surface is formed between the radiating fin and the additional heat sink. As a result, a slight thermal resistance is generated between the radiation fin and the additional heat sink. However, most of the driving heat generated in the light emitting part is sufficiently radiated by the radiation fins. Therefore, even if some thermal resistance is generated, it is considered that sufficient heat radiation characteristics can be obtained by the heat radiation fin and the additional heat sink.

The material of the heat radiating fin is not limited to a die-cast alloy or an aluminum alloy, and various materials (such as copper) having excellent thermal conductivity can be used.
In each said embodiment, although C1-C14 was made into the internal thread, this invention is not limited to this. C1 to C14 can be male threads, and B1 to B14 can be nuts.
Further, when the additional heat sink is configured by the sheet metal member 120X as in the first embodiment, through holes may be formed in the thickness (Y) direction of the heat radiation fin 101 and the sheet metal member 120X, respectively. In this case, a heat sink attachment part is comprised with a volt | bolt and a nut. The additional heat sink can be detachably attached to the radiating fin by passing a bolt through each through hole and screwing the nut into the bolt.

What is necessary is just to provide the heat sink attachment part shown in Embodiment 1-8 in at least one of the radiation fins. In order to increase the thermal coupling between the additional heat sink and the heat radiating fins, it is desirable to increase the number of heat sink mounting portions.
The heat sink attachment portion shown in the second or third embodiment can be applied to any of the fourth to ninth embodiments.

In each said embodiment, the example which comprised the radiation fin and the housing | casing integrally in the instrument main-body part was shown. However, the heat dissipating fins and the housing may be separate members.
The radiating fin in the present invention is not limited to a plate-like body as shown in FIG. For example, a columnar body having a short length in the X direction in FIG. 1 may be used. In this case, a plurality of columnar bodies (radiating fins) can be provided in the X direction and the Y direction.

B1-B14 male screw C1-C14 female screw 1, 1A-1E, 1X LED lighting device 2, 2A-2F LED lighting fixture for high output 3 LED lighting fixture for low output 10, 10A, 10B, 10C, 10X DESCRIPTION OF SYMBOLS 15 Light emission part 15A-15F LED module 20, 20A, 20X Frame 40, 40A Power supply 100, 100A, 100X Case 101 (101A-101G), 101X Radiation fin 109 Flat plate part 110 Internal space 120, 120A-120H Additional heat sink 120X Sheet metal member 1010A to 1010K Radiation fin top part 112, 112A, 112A ', 112D, 112G, 112G' Heat sink attachment part 112A to 112K Columnar part 1201 Connecting member 1201a, 1201b, 1202a, 1202b, 1205G, 1207 ˜1207H, 1211A to 1211G Second flat plate portion 1203a to 1203f, 1203G First opening portion 1204A to 1204H Expansion fin 1205A to 1205I, 1200, 1210A to 1210G, 1214A to 1214K First flat plate portion 1206A, 1206D, 1206G, 1215A to 1215K Screw holes 1208A to 1208E Second openings 1209A to 1209G Radiating pieces 1211A to 1211G Strip members 1212A and 1212B Stretch members 1213A to 1213F Third openings 1215 and 1215 Extension portions 1250D1, 1251D1, 1250D2 and 1250D2 Notches

Claims (10)

A housing to which the light emitting unit is mounted;
A heat dissipating part provided in the housing;
A heat sink mounting portion for detachably attaching a heat sink to the heat radiating portion so as to be thermally coupled to the heat radiating portion. The heat dissipating part is composed of a plurality of heat dissipating fins erected with a gap therebetween,
The heat sink is a heat sink,
The heat radiating plate includes a first flat plate portion arranged so as to be thermally coupled to a top portion of the radiating fin, and a second flat plate portion erected in a direction intersecting with a planar direction of the first flat plate portion. , There is an opening communicating with the gap at a position overlapping the gap,
The LED lighting apparatus according to claim 1, wherein the heat radiating plate is attached to the heat sink mounting portion such that the first flat plate portion is thermally coupled to a top portion of the heat radiating fin. The LED lighting apparatus according to claim 2, wherein the heat radiating plate is formed of an integrated flat plate member that is bent so as to have a concave portion and a convex portion, and the opening portion exists in the convex portion. The said 1st flat plate part and the said 2nd flat plate part consist of an integral flat plate member, and the said 2nd flat plate part is cut and raised in the direction which cross | intersects the plane direction of the said 1st flat plate part. LED lighting fixtures. The heat radiating plate includes a plurality of long radiating pieces having an L-shaped cross section having the first flat plate portion and the second flat plate portion, and a connecting member connecting the plurality of radiating pieces with the fins at equal intervals. Have
The LED lighting apparatus according to claim 2, wherein the opening is present between adjacent heat radiation pieces. The radiating fin has a flat top;
The LED lighting apparatus according to claim 9, wherein the heat sink is attached in a state of being in surface contact with the top portion of the heat radiating fin. The LED lighting apparatus according to claim 1, wherein the heat sink mounting portion has one or more screwed structures that can be attached by screwing the heat sink. The LED lighting apparatus according to claim 1, wherein the heat sink mounting portion has one or more locking structures that can be attached by locking the heat sink. LED lighting fixture according to any one of claims 1 to 8,
The light emitting unit;
An LED lighting device comprising: a power supply device for supplying power to the light emitting unit. The LED lighting device according to claim 9, wherein an exterior member of the power supply device and the heat sink are formed as a single member.

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