JP2014004681A - 陽極接合ひずみアイソレータ - Google Patents

陽極接合ひずみアイソレータ Download PDF

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Publication number
JP2014004681A
JP2014004681A JP2013129309A JP2013129309A JP2014004681A JP 2014004681 A JP2014004681 A JP 2014004681A JP 2013129309 A JP2013129309 A JP 2013129309A JP 2013129309 A JP2013129309 A JP 2013129309A JP 2014004681 A JP2014004681 A JP 2014004681A
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Japan
Prior art keywords
isolator
layer
mems
sensor
mems die
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JP2013129309A
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English (en)
Japanese (ja)
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JP2014004681A5 (enExample
Inventor
Mark Eskridge
マーク・エスクリッジ
Shifang Zhou
シーファン・ジョウ
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Honeywell International Inc
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Honeywell International Inc
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Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2014004681A publication Critical patent/JP2014004681A/ja
Publication of JP2014004681A5 publication Critical patent/JP2014004681A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
JP2013129309A 2012-06-26 2013-06-20 陽極接合ひずみアイソレータ Withdrawn JP2014004681A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/533,356 US9187313B2 (en) 2012-06-26 2012-06-26 Anodically bonded strain isolator
US13/533,356 2012-06-26

Publications (2)

Publication Number Publication Date
JP2014004681A true JP2014004681A (ja) 2014-01-16
JP2014004681A5 JP2014004681A5 (enExample) 2016-07-21

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ID=48655969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013129309A Withdrawn JP2014004681A (ja) 2012-06-26 2013-06-20 陽極接合ひずみアイソレータ

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US (1) US9187313B2 (enExample)
EP (2) EP2679536B1 (enExample)
JP (1) JP2014004681A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130264755A1 (en) * 2012-04-05 2013-10-10 Honeywell International Inc. Methods and systems for limiting sensor motion
US20140374847A1 (en) * 2013-06-20 2014-12-25 Honeywell International Inc. Packaging method for mems devices
EP3367082A1 (en) * 2013-11-06 2018-08-29 Invensense, Inc. Pressure sensor
CN105182004A (zh) * 2015-09-06 2015-12-23 苏州大学 基于硅硅键合的减小封装应力的微机械加速度计
FR3042483B1 (fr) 2015-10-16 2017-11-24 Thales Sa Microsysteme electromecanique et procede de fabrication
US10278281B1 (en) * 2015-10-30 2019-04-30 Garmin International, Inc. MEMS stress isolation and stabilization system
US10060820B2 (en) 2015-12-22 2018-08-28 Continental Automotive Systems, Inc. Stress-isolated absolute pressure sensor
EP3243793B1 (en) * 2016-05-10 2018-11-07 ams AG Sensor assembly and arrangement and method for manufacturing a sensor assembly
US10442680B2 (en) * 2016-06-14 2019-10-15 Mems Drive, Inc. Electric connection flexures
GB2555412A (en) 2016-10-25 2018-05-02 Atlantic Inertial Systems Ltd Inertial sensor
FR3075772B1 (fr) 2017-12-22 2020-11-20 Commissariat Energie Atomique Mise en œuvre d'une structure de decouplage pour l'assemblage d'un composant avec un boitier
US10988375B1 (en) 2018-10-04 2021-04-27 EngeniusMicro, LLC Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
US12258264B2 (en) 2022-06-03 2025-03-25 International Business Machines Corporation Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4938779B2 (ja) * 2006-08-25 2012-05-23 京セラ株式会社 微小電子機械機構装置およびその製造方法
US8614491B2 (en) 2009-04-07 2013-12-24 Honeywell International Inc. Package interface plate for package isolation structures

Also Published As

Publication number Publication date
EP2915778A1 (en) 2015-09-09
EP2679536A3 (en) 2014-01-22
US9187313B2 (en) 2015-11-17
EP2679536B1 (en) 2015-04-15
EP2679536A2 (en) 2014-01-01
EP2915778B1 (en) 2016-11-02
US20130341735A1 (en) 2013-12-26

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