JP2014003242A5 - - Google Patents
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- Publication number
- JP2014003242A5 JP2014003242A5 JP2012139155A JP2012139155A JP2014003242A5 JP 2014003242 A5 JP2014003242 A5 JP 2014003242A5 JP 2012139155 A JP2012139155 A JP 2012139155A JP 2012139155 A JP2012139155 A JP 2012139155A JP 2014003242 A5 JP2014003242 A5 JP 2014003242A5
- Authority
- JP
- Japan
- Prior art keywords
- solder
- light emitting
- light
- thermosetting resin
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 16
- 239000000463 material Substances 0.000 claims 15
- 229920001187 thermosetting polymer Polymers 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 4
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 2
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012139155A JP6490328B2 (ja) | 2012-06-20 | 2012-06-20 | 発光装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012139155A JP6490328B2 (ja) | 2012-06-20 | 2012-06-20 | 発光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014003242A JP2014003242A (ja) | 2014-01-09 |
| JP2014003242A5 true JP2014003242A5 (cg-RX-API-DMAC7.html) | 2015-05-14 |
| JP6490328B2 JP6490328B2 (ja) | 2019-03-27 |
Family
ID=50036117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012139155A Active JP6490328B2 (ja) | 2012-06-20 | 2012-06-20 | 発光装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6490328B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9812625B2 (en) | 2014-02-18 | 2017-11-07 | Nichia Corporation | Light-emitting device having resin member with conductive particles |
| JP2015153981A (ja) * | 2014-02-18 | 2015-08-24 | 日亜化学工業株式会社 | 発光装置 |
| JP7428916B2 (ja) * | 2021-12-27 | 2024-02-07 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
| CN116169231B (zh) * | 2023-04-21 | 2023-07-18 | 惠科股份有限公司 | 发光装置、显示装置以及发光装置的制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591399B2 (ja) * | 2006-04-03 | 2010-12-01 | パナソニック株式会社 | 部品接合方法ならびに部品接合構造 |
| JP4107349B2 (ja) * | 2007-06-20 | 2008-06-25 | ソニー株式会社 | 光源装置、表示装置 |
| JP5716281B2 (ja) * | 2010-03-01 | 2015-05-13 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP5402804B2 (ja) * | 2010-04-12 | 2014-01-29 | デクセリアルズ株式会社 | 発光装置の製造方法 |
| JP5710915B2 (ja) * | 2010-09-09 | 2015-04-30 | シチズンホールディングス株式会社 | 半導体発光装置 |
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2012
- 2012-06-20 JP JP2012139155A patent/JP6490328B2/ja active Active