JP2013526777A5 - - Google Patents

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Publication number
JP2013526777A5
JP2013526777A5 JP2013510126A JP2013510126A JP2013526777A5 JP 2013526777 A5 JP2013526777 A5 JP 2013526777A5 JP 2013510126 A JP2013510126 A JP 2013510126A JP 2013510126 A JP2013510126 A JP 2013510126A JP 2013526777 A5 JP2013526777 A5 JP 2013526777A5
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JP
Japan
Prior art keywords
structured
polyether
nonionic surfactant
type nonionic
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013510126A
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Japanese (ja)
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JP2013526777A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/034439 external-priority patent/WO2011142986A1/en
Publication of JP2013526777A publication Critical patent/JP2013526777A/en
Publication of JP2013526777A5 publication Critical patent/JP2013526777A5/ja
Pending legal-status Critical Current

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Claims (4)

構造化研磨物品であって：
第１及び第２の対向する主表面を有する裏材、及び
前記第１の主表面上に配置され、固定される構造化研磨層、を含み、前記構造化研磨層が、以下；
ポリマー結合剤；
前記結合剤中に分散している研磨粒子；及び
前記結合剤中に分散しているポリエーテル型非イオン性界面活性剤、を含み、
前記研磨粒子が約２００ｎｍ未満の平均粒径を有し、
前記ポリエーテル型非イオン性界面活性剤が架橋ポリマー結合剤と共有結合しておらず、
前記ポリエーテル型非イオン性界面活性剤が、構造化接着層の全重量を基準として、０．７５〜２．２重量％の量で存在する、構造化研磨物品。 A structured abrasive article comprising:
A structured abrasive layer disposed on and secured to the first major surface, the structured abrasive layer comprising: a backing having first and second opposing major surfaces; and
Polymer binders;
Abrasive particles dispersed in the binder; and a polyether type nonionic surfactant dispersed in the binder;
The abrasive particles have an average particle size of less than about 200 nm;
The polyether-type nonionic surfactant is not covalently bonded to the crosslinked polymer binder;
A structured abrasive article wherein the polyether-type nonionic surfactant is present in an amount of 0.75 to 2.2 wt%, based on the total weight of the structured adhesive layer. 前記界面活性剤がポリエチレンオキシドセグメント又はポリプロピレンオキシドセグメントを含む、請求項１に記載の構造化研磨物品。 The structured abrasive article of claim 1, wherein the surfactant comprises a polyethylene oxide segment or a polypropylene oxide segment . 前記成形研磨複合材がアニオン性リン酸ポリエーテルエステルを更に含み、
前記アニオン性リン酸ポリエーテルエステルがポリエーテル型非イオン性界面活性剤よりも少量で存在する、請求項１に記載の構造化研磨物品。 The shaped abrasive composite further comprises an anionic phosphate polyether ester;
The structured abrasive article according to claim 1, wherein the anionic phosphoric polyether ester is present in a smaller amount than the polyether-type nonionic surfactant. 工作物の研磨方法であって、
水性流体の存在下で、構造化研磨物品の少なくとも一部分と工作物の表面とを摩擦接触させる工程、及び
前記工作物又は構造化研磨層のうちの少なくとも一方を他方に対して移動させて、前記工作物の表面の少なくとも一部分を研磨する工程、を含み、
前記構造化研磨物品が、
第１及び第２の対向する主表面を有する裏材、及び
前記第１の主表面上に配置され、固定される構造化研磨層を含み、前記構造化研磨層が、
ポリマー結合剤；
前記結合剤中に分散している研磨粒子；及び
前記結合剤中に分散しているポリエーテル型非イオン性界面活性剤、を含み、
前記研磨粒子が約２００ｎｍ未満の平均粒径を有し、
前記ポリエーテル型非イオン性界面活性剤が架橋ポリマー結合剤と共有結合しておらず、及び
前記ポリエーテル型非イオン性界面活性剤が、構造化接着層の全重量を基準として、０．７５〜２．２重量％の量で存在する、方法。 A method for polishing a workpiece,
Frictionally contacting at least a portion of the structured abrasive article and the surface of the workpiece in the presence of an aqueous fluid, and moving at least one of the workpiece or the structured abrasive layer relative to the other, Polishing at least a portion of the surface of the workpiece;
The structured abrasive article comprises:
A backing having first and second opposing main surfaces; and a structured polishing layer disposed on and secured to the first main surface, the structured polishing layer comprising:
Polymer binders;
Abrasive particles dispersed in the binder; and a polyether type nonionic surfactant dispersed in the binder;
The abrasive particles have an average particle size of less than about 200 nm;
The polyether-type nonionic surfactant is not covalently bonded to the cross-linked polymer binder, and the polyether-type nonionic surfactant is 0.75, based on the total weight of the structured adhesive layer. A process present in an amount of -2.2% by weight.
JP2013510126A 2010-05-11 2011-04-29 Fixed polishing pad containing surfactant for chemical mechanical planarization Pending JP2013526777A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33335110P 2010-05-11 2010-05-11
US61/333,351 2010-05-11
PCT/US2011/034439 WO2011142986A1 (en) 2010-05-11 2011-04-29 Fixed abrasive pad with surfactant for chemical mechanical planarization

Publications (2)

Publication Number Publication Date
JP2013526777A JP2013526777A (en) 2013-06-24
JP2013526777A5 true JP2013526777A5 (en) 2014-06-19

Family

ID=44383031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013510126A Pending JP2013526777A (en) 2010-05-11 2011-04-29 Fixed polishing pad containing surfactant for chemical mechanical planarization

Country Status (7)

Country Link
US (1) US20130059506A1 (en)
JP (1) JP2013526777A (en)
KR (1) KR20130081229A (en)
CN (1) CN102892553B (en)
SG (1) SG185523A1 (en)
TW (1) TWI532597B (en)
WO (1) WO2011142986A1 (en)

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