JP2013521408A - 基板処理用デバイスおよび方法 - Google Patents
基板処理用デバイスおよび方法 Download PDFInfo
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- JP2013521408A JP2013521408A JP2012555364A JP2012555364A JP2013521408A JP 2013521408 A JP2013521408 A JP 2013521408A JP 2012555364 A JP2012555364 A JP 2012555364A JP 2012555364 A JP2012555364 A JP 2012555364A JP 2013521408 A JP2013521408 A JP 2013521408A
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- 239000000758 substrate Substances 0.000 title claims abstract description 195
- 238000000034 method Methods 0.000 title claims abstract description 101
- 230000008569 process Effects 0.000 claims abstract description 85
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 239000007789 gas Substances 0.000 claims description 30
- 238000005096 rolling process Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052711 selenium Inorganic materials 0.000 claims description 5
- 239000011669 selenium Substances 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 3
- 239000012159 carrier gas Substances 0.000 claims description 3
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052951 chalcopyrite Inorganic materials 0.000 claims description 2
- 238000005486 sulfidation Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 238000005496 tempering Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000005328 architectural glass Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052798 chalcogen Inorganic materials 0.000 description 1
- 150000001787 chalcogens Chemical class 0.000 description 1
- 230000007748 combinatorial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (15)
- 少なくとも1つのプロセスエリア(2;2’)内に少なくとも1つのプロセスツール(3;21)が配置される処理システムにおいて基板(11、11’)を処理するためのデバイス(1;20)であって、このデバイスは、少なくとも略垂直に位置合わせされるプロセスエリア(2;2’)内で互いに向かい合って配置される2つの基板レベル(A、B;A’、B’)を有し、デバイス(1;20)は、プロセスエリア(2;2’)内でプロセスツール(3;21)によって少なくとも2つの基板(11、11’)を同時に処理するように適合化され、基板(11、11’)は、基板(11、11’)のコーティング(13、13’)が互いに向き合い、かつ少なくとも処理中は基板(11、11’)間に準閉鎖処理空間(12;12’)が形成されるように基板レベル(A、B;A’、B’)内に配置されることが可能である、デバイス(1;20)。
- 基板レベル(A、B;A’、B’)が、それらの垂直要素に対して平行に位置合わせされる、請求項1に記載のデバイス(1;20)。
- 閉鎖された処理空間(12;12’)を形成するために、基板間にフレームが配置される、請求項1または2のいずれか一項に記載のデバイス(1;20)。
- デバイス(1;20)を通る基板(11、11’)をプロセスツール(3;21)を通して移送するように実装される基板移送デバイス(5、6)が設けられ、かつ/またはデバイスを通るプロセスツールを基板を通して移送するように実装されるプロセスツール移送デバイスが設けられる、請求項1から3のいずれか一項に記載のデバイス(1;20)。
- プロセスツール(3)が2つの基板レベル(A、B)間に配置され、かつ/またはプロセスツールは2つの基板レベル(A’、B’)の外側に配置される熱源(21)である、請求項1から4のいずれか一項に記載のデバイス(1)。
- 基板レベル(A、B;A’、B’)が基板(11、11’)を支持するように実装される転動体(9)を有する、請求項1から5のいずれか一項に記載のデバイス(1;20)。
- 基板移送デバイス(5、6)が転動体(9)を有する、請求項6に記載のデバイス(1;20)。
- 転動体(9)が溝形で実装され、よって基板(11、11’)のガイドチャネル(10)を形成する、請求項6または7のいずれか一項に記載のデバイス(1;20)。
- プロセスエリア内に少なくとも1つのガス入口が設けられ、かつ/または基板レベルの下に少なくとも1つのベイスンが配置される、請求項1から8のいずれか一項に記載のデバイス。
- 基板レベル間にフレームが配置される、請求項1から9のいずれか一項に記載のデバイス。
- 少なくとも1つのプロセスエリア(2;2’)内に少なくとも1つのプロセスツール(3;21)が配置される処理システムにおいてコーティングされた基板(11、11’)を処理するための方法であって、プロセスエリア(2;2’)において互いに向かい合って配置される基板レベル(A、B;A’、B’)内に少なくとも2つの基板(11、11’)が配置され、基板レベル(A、B;A’、B’)は少なくとも略垂直に位置合わせされ、基板(11、11’)はコーティング(13、13’)を有しかつ基板(11、11’)は、基板(11、11’)のコーティング(13、13’)が互いに面するように互いに向かい合って配置され、かつ少なくとも基板(11、11’)間の処理中は、基板間に準閉鎖処理空間(12;12’)が形成される、方法。
- 閉鎖された処理空間(12;12’)を形成するために、基板間にフレーム(23)が配置される、請求項11に記載の方法。
- 基板レベル(A、B;A’、B’)間にキャリアガスおよび/またはプロセスガスが導入される、請求項11または12のいずれか一項に記載の方法。
- 基板(11、11’)がプロセスツール(3;21)を通って移動され、かつ/またはプロセスツールが基板を通って移動される、請求項11から13のいずれか一項に記載の方法。
- 薄膜太陽電池またはモジュール、具体的にはCIS(CIGSSe)薄膜太陽電池またはCIS(CIGSSe)薄膜太陽モジュールを製造するための、請求項1から10のいずれか一項に記載されたデバイス並びに請求項11から14のいずれか一項に記載された方法の使用であって、具体的には、各基板はガラス板の形式で実装され、かつ少なくとも元素Cu、InまたはCu、In、GaまたはCu、In、Ga、黄銅鉱薄膜半導体のセレン化および/または硫化のためのセレンでコーティングされる使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10154992A EP2368860A1 (de) | 2010-03-01 | 2010-03-01 | Vorrichtung und Verfahren zur Substratprozessierung |
EP10154992.1 | 2010-03-01 | ||
PCT/EP2011/052575 WO2011107373A1 (de) | 2010-03-01 | 2011-02-22 | Vorrichtung und verfahren zur substratprozessierung |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013521408A true JP2013521408A (ja) | 2013-06-10 |
Family
ID=42320330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012555364A Ceased JP2013521408A (ja) | 2010-03-01 | 2011-02-22 | 基板処理用デバイスおよび方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130059431A1 (ja) |
EP (2) | EP2368860A1 (ja) |
JP (1) | JP2013521408A (ja) |
KR (1) | KR20130024884A (ja) |
CN (1) | CN102770385A (ja) |
EA (1) | EA201290845A1 (ja) |
WO (1) | WO2011107373A1 (ja) |
ZA (1) | ZA201206144B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101768788B1 (ko) | 2012-12-20 | 2017-08-16 | 쌩-고벵 글래스 프랑스 | 화합물 반도체의 제조 방법 및 박막 태양 전지 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58174570A (ja) * | 1982-03-29 | 1983-10-13 | エナージー・コンバーション・デバイセス・インコーポレーテッド | グロー放電法による膜形成装置 |
JPH01312072A (ja) * | 1988-06-13 | 1989-12-15 | Asahi Glass Co Ltd | 真空処理装置 |
JPH06291349A (ja) * | 1992-07-24 | 1994-10-18 | Fuji Electric Co Ltd | 薄膜光電変換素子の製造方法および製造装置 |
WO2009148077A1 (ja) * | 2008-06-06 | 2009-12-10 | 株式会社アルバック | 薄膜太陽電池製造装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0346815A3 (en) * | 1988-06-13 | 1990-12-19 | Asahi Glass Company Ltd. | Vacuum processing apparatus and transportation system thereof |
DE4324320B4 (de) * | 1992-07-24 | 2006-08-31 | Fuji Electric Co., Ltd., Kawasaki | Verfahren und Vorrichtung zur Herstellung einer als dünne Schicht ausgebildeten fotovoltaischen Umwandlungsvorrichtung |
US5444217A (en) * | 1993-01-21 | 1995-08-22 | Moore Epitaxial Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
DE102007052524B4 (de) * | 2007-11-01 | 2012-05-31 | Von Ardenne Anlagentechnik Gmbh | Transportmittel und Vakuumbeschichtungsanlage für Substrate unterschiedlicher Größe |
DE102008022784A1 (de) | 2008-05-08 | 2009-11-12 | Avancis Gmbh & Co. Kg | Vorrichtung und Verfahren zum Tempern von Gegenständen in einer Behandlungskammer |
WO2010014761A1 (en) * | 2008-07-29 | 2010-02-04 | Intevac, Inc. | Processing tool with combined sputter and evaporation deposition sources |
-
2010
- 2010-03-01 EP EP10154992A patent/EP2368860A1/de not_active Withdrawn
-
2011
- 2011-02-22 EA EA201290845A patent/EA201290845A1/ru unknown
- 2011-02-22 WO PCT/EP2011/052575 patent/WO2011107373A1/de active Application Filing
- 2011-02-22 JP JP2012555364A patent/JP2013521408A/ja not_active Ceased
- 2011-02-22 US US13/581,982 patent/US20130059431A1/en not_active Abandoned
- 2011-02-22 CN CN2011800120953A patent/CN102770385A/zh active Pending
- 2011-02-22 EP EP11709348.4A patent/EP2598453A1/de not_active Withdrawn
- 2011-02-22 KR KR1020127022885A patent/KR20130024884A/ko not_active Application Discontinuation
-
2012
- 2012-08-15 ZA ZA2012/06144A patent/ZA201206144B/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58174570A (ja) * | 1982-03-29 | 1983-10-13 | エナージー・コンバーション・デバイセス・インコーポレーテッド | グロー放電法による膜形成装置 |
JPH01312072A (ja) * | 1988-06-13 | 1989-12-15 | Asahi Glass Co Ltd | 真空処理装置 |
JPH06291349A (ja) * | 1992-07-24 | 1994-10-18 | Fuji Electric Co Ltd | 薄膜光電変換素子の製造方法および製造装置 |
WO2009148077A1 (ja) * | 2008-06-06 | 2009-12-10 | 株式会社アルバック | 薄膜太陽電池製造装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2598453A1 (de) | 2013-06-05 |
EP2368860A1 (de) | 2011-09-28 |
KR20130024884A (ko) | 2013-03-08 |
WO2011107373A1 (de) | 2011-09-09 |
US20130059431A1 (en) | 2013-03-07 |
ZA201206144B (en) | 2013-04-24 |
EA201290845A1 (ru) | 2013-02-28 |
CN102770385A (zh) | 2012-11-07 |
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