JP2013509733A - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP2013509733A JP2013509733A JP2012537330A JP2012537330A JP2013509733A JP 2013509733 A JP2013509733 A JP 2013509733A JP 2012537330 A JP2012537330 A JP 2012537330A JP 2012537330 A JP2012537330 A JP 2012537330A JP 2013509733 A JP2013509733 A JP 2013509733A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- component
- electronic component
- joint
- assembly position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/04—Bases; Housings; Mountings
- H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
- H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
- H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Thermally Actuated Switches (AREA)
- Fuses (AREA)
Abstract
【選択図】図2
Description
Claims (12)
- 熱的過負荷に対応し、電子部品(1)を通る電流フローを遮断する保護素子(3)が組み込まれた電子部品(1)において、
前記保護素子(3)は、自己弾力性によってばね初期応力下に置ける電気接続部(4)であって、初期応力が掛かった状態において組立ポジションを取り、弛緩状態において電流遮断ポジションを取る前記電気接続部(4)を有することを特徴とする、電子部品(1)。 - 前記接続部(4)は、外部から電気的に接続可能な、又は、内部の、特に外部から到達不可能な、前記部品(1)の接続素子であることを特徴とする、請求項1に記載の電子部品。
- 内部の接続素子として構成された、前記組立ポジションを取る前記接続部(4)は、熱により解消可能な電気接合(16)により、前記部品(1)の対応する電気接続部と接続されることを特徴とする、請求項2に記載の電子部品。
- 前記接合(16)は半田接合であることを特徴とする、請求項1〜3のいずれか1項に記載の電子部品。
- 前記接続部(4)は、初期応力が掛かった状態を取るために、少なくとも領域ごとに弾性的に湾曲していることを特徴とする、請求項1〜4のいずれか1項に記載の電子部品。
- 前記部品(1)には、前記接続部(4)を前記組立ポジションに保持する取り外し可能な固定素子(15)が固定されることを特徴とする、請求項1〜5のいずれか1項に記載の電子部品。
- 前記接続部(4)は、前記組立ポジションにおいて、前記固定素子(15)が包囲し又は開くU字形状の弾性領域を有することを特徴とする、請求項1〜6のいずれか1項に記載の電子部品。
- 請求項1〜7のいずれか1項又は請求項1〜7の複数に記載の電子部品(1)と、少なくとも1つの電気接点(12)を有する回路基板(11)と、を備えた電気回路構成(10)において、
組立ポジションにある前記部品(1)の前記接続部(4)は、熱により解消可能な電気接合(16)により前記接点(12)と接続され、前記部品(1)の、前記接続部(4)に属しない少なくとも1つの領域が、前記回路基板(11)に固定されることを特徴とする、電気回路構成(10)。 - 前記接続部(4)は前記接点(12)上に存在することを特徴とする、請求項8に記載の回路構成。
- 前記接合(16)は半田接合であることを特徴とする、請求項8又は9に記載の回路構成。
- 前記接合(16)は、導電性の粘着接合であることを特徴とする、請求項8又は9に記載の回路構成。
- 特に請求項1〜7のいずれか1項又は請求項1〜7の複数に記載の電子部品(1)を備えた回路基板(11)を実装する方法であって、前記電子部品(1)の電子接続部(4)と、前記回路基板(11)の接点(12)と、の電気的接続が行われる、前記方法において、
前記部品(1)の前記接続部(4)は組立ポジションに置かれ、取り外し可能な固定素子(15)により前記組立ポジションに保持され、前記接続部(4)は、熱により解消可能な電気接合(16)により前記接点(12)と接続され、前記接合(16)が硬化した後に前記固定素子(15)が取り外され、前記組立ポジションへと前記接続部(4)を置く前若しくは置いた後に、又は、前記接合(16)を形成する前若しくは形成した後に、前記部品(1)の、前記接続部(4)に属しない領域が前記回路基板(11)に固定されることを特徴とする、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009046446.8 | 2009-11-06 | ||
DE102009046446A DE102009046446A1 (de) | 2009-11-06 | 2009-11-06 | Elektronisches Bauelement |
PCT/EP2010/063231 WO2011054565A1 (de) | 2009-11-06 | 2010-09-09 | Elektronisches bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013509733A true JP2013509733A (ja) | 2013-03-14 |
JP5695069B2 JP5695069B2 (ja) | 2015-04-01 |
Family
ID=42790934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537330A Expired - Fee Related JP5695069B2 (ja) | 2009-11-06 | 2010-09-09 | 電子部品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8749940B2 (ja) |
EP (1) | EP2497345A1 (ja) |
JP (1) | JP5695069B2 (ja) |
KR (1) | KR20120100974A (ja) |
CN (1) | CN102668729B (ja) |
DE (1) | DE102009046446A1 (ja) |
WO (1) | WO2011054565A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018513562A (ja) * | 2015-04-21 | 2018-05-24 | ブラウン ゲーエムベーハー | 特殊電気部品、プリント回路基板アセンブリ、及び電気器具を製造する方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010036909B3 (de) * | 2010-08-06 | 2012-02-16 | Phoenix Contact Gmbh & Co. Kg | Thermische Überlastschutzvorrichtung |
DE102011052390A1 (de) * | 2011-08-03 | 2013-02-07 | Phoenix Contact Gmbh & Co. Kg | Thermische Überlastschutzvorrichtung |
US9082737B2 (en) | 2012-11-15 | 2015-07-14 | Infineon Technologies Ag | System and method for an electronic package with a fail-open mechanism |
ITTO20140011U1 (it) * | 2014-01-23 | 2015-07-23 | Johnson Electric Asti S R L | Regolatore di tensione per un elettroventilatore di raffreddamento, particolarmente per uno scambiatore di calore di un autoveicolo |
TWI648759B (zh) * | 2014-05-22 | 2019-01-21 | 聚鼎科技股份有限公司 | 可回焊式溫度保險絲 |
DE102014111772B4 (de) * | 2014-08-18 | 2016-03-24 | Borgwarner Ludwigsburg Gmbh | Sicherung für einen elektrischen Stromkreis sowie Leiterplatte mit einer Sicherung |
KR101755102B1 (ko) * | 2015-06-23 | 2017-07-06 | 주식회사 만도 | 브릿지 어셈블리 |
JP6459947B2 (ja) * | 2015-12-14 | 2019-01-30 | 株式会社デンソー | タンク蓋ユニット及び燃料供給装置 |
DE102016104424B4 (de) * | 2016-03-10 | 2023-12-07 | Borgwarner Ludwigsburg Gmbh | Bestückte Leiterplatte und Verfahren zur Bestückung einer Leiterplatte |
US10151292B2 (en) * | 2016-03-23 | 2018-12-11 | Magna Electronics Inc. | Control device with thermal fuse having removable pre-tension element |
DE102016213019B3 (de) * | 2016-07-15 | 2017-12-14 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Elektronische Baugruppe mit Thermosicherung und Verwendung der elektronischen Baugruppe für einen Elektromotor eines Verstellsystems oder -antriebs |
KR102629270B1 (ko) * | 2016-10-26 | 2024-01-25 | 에이치엘만도 주식회사 | 온도 퓨즈 및 이에 적용되는 인쇄회로기판 |
DE202017104268U1 (de) * | 2017-07-18 | 2018-07-20 | HKR Seuffer Automotive GmbH & Co. KG | Sicherungselement |
US10147573B1 (en) * | 2017-07-28 | 2018-12-04 | Polytronics Technology Corp. | Reflowable thermal fuse |
JP6924714B2 (ja) * | 2018-02-16 | 2021-08-25 | ボーンズ株式会社 | 回路保護素子 |
DE102018214059A1 (de) * | 2018-08-21 | 2020-02-27 | Robert Bosch Gmbh | Gehäuserahmen für ein Steuergerät, welcher zur elektrischen Außenkontaktierung eines Schaltungsträgers des Steuergeräts geeignet ist |
FR3095305B1 (fr) | 2019-04-16 | 2022-03-11 | G Cartier Tech | Dispositif de commande securise pour actionneur electrique |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006059568A (ja) * | 2004-08-17 | 2006-03-02 | Nikon Corp | ヒューズおよび回路基板 |
WO2009130946A1 (ja) * | 2008-04-21 | 2009-10-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3205662A1 (de) | 1982-02-17 | 1983-08-25 | Olaf 8130 Starnberg Huckenholz | Loesbarer loetverbinder fuer gedruckte schaltungen |
US4486804A (en) | 1983-03-30 | 1984-12-04 | Northern Telecom Limited | Overload protector for a telephone set |
DE3825897A1 (de) * | 1988-07-28 | 1990-02-01 | Siemens Ag | Schmelzsicherung mit federarm |
DE3930819A1 (de) | 1988-07-29 | 1991-03-28 | Siemens Ag | Schmelzsicherung mit federarm |
US4906962A (en) * | 1989-01-05 | 1990-03-06 | Babcock, Inc. | Fuse wire switch |
DE9319287U1 (de) | 1993-12-10 | 1994-02-17 | Siemens AG, 80333 München | Überspannungsschutzgerät |
US5612662A (en) * | 1995-02-07 | 1997-03-18 | Siemens Aktiengesellschaft | Thermal fuse and method for its activation |
JPH0992110A (ja) * | 1995-09-26 | 1997-04-04 | Denso Corp | 温度ヒューズ付抵抗器 |
JP3993256B2 (ja) | 1996-05-08 | 2007-10-17 | ニチコン株式会社 | 過電圧・過電流保護装置 |
DE19752781A1 (de) | 1997-11-28 | 1999-06-02 | Wabco Gmbh | Schaltungsanordnung zum Schutz eines elektrischen Bauteils vor einem elektrischen Potential |
DE60135405D1 (de) * | 2000-03-21 | 2008-10-02 | Autonetworks Technologies Ltd | Leistungsverteiler für ein Kraftfahrzeug und Verfahren zur Herstellung dazu |
DE102005005549A1 (de) | 2005-02-07 | 2006-08-10 | Robert Bosch Gmbh | Vorrichtung zur Steuerung eines Heizelements in einem Kraftfahrzeug |
DE102006041123B4 (de) * | 2006-09-01 | 2009-03-12 | Beru Ag | Elektrischer Stromkreis mit einer thermisch-mechanischen Sicherung |
-
2009
- 2009-11-06 DE DE102009046446A patent/DE102009046446A1/de not_active Withdrawn
-
2010
- 2010-09-09 WO PCT/EP2010/063231 patent/WO2011054565A1/de active Application Filing
- 2010-09-09 EP EP10754313A patent/EP2497345A1/de not_active Withdrawn
- 2010-09-09 JP JP2012537330A patent/JP5695069B2/ja not_active Expired - Fee Related
- 2010-09-09 CN CN201080050328.4A patent/CN102668729B/zh not_active Expired - Fee Related
- 2010-09-09 KR KR1020127011637A patent/KR20120100974A/ko not_active Application Discontinuation
- 2010-09-09 US US13/503,983 patent/US8749940B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006059568A (ja) * | 2004-08-17 | 2006-03-02 | Nikon Corp | ヒューズおよび回路基板 |
WO2009130946A1 (ja) * | 2008-04-21 | 2009-10-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018513562A (ja) * | 2015-04-21 | 2018-05-24 | ブラウン ゲーエムベーハー | 特殊電気部品、プリント回路基板アセンブリ、及び電気器具を製造する方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102668729B (zh) | 2016-08-24 |
WO2011054565A1 (de) | 2011-05-12 |
EP2497345A1 (de) | 2012-09-12 |
JP5695069B2 (ja) | 2015-04-01 |
US8749940B2 (en) | 2014-06-10 |
US20120268854A1 (en) | 2012-10-25 |
DE102009046446A1 (de) | 2011-05-12 |
KR20120100974A (ko) | 2012-09-12 |
CN102668729A (zh) | 2012-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5695069B2 (ja) | 電子部品 | |
KR101453292B1 (ko) | 열 과부하 보호 장치 | |
RU2531804C2 (ru) | Устройство защиты от тепловой перегрузки | |
KR100693057B1 (ko) | 전지팩 및 그 제조 방법 | |
JP5587971B2 (ja) | リフロー可能な温度ヒューズ | |
US8633795B2 (en) | Thermal fuse | |
KR102364833B1 (ko) | 전기회로용 퓨즈 및 퓨즈를 구비한 인쇄회로기판 | |
US20140232511A1 (en) | Thermal overload protection apparatus | |
TWI533347B (zh) | 電路保護裝置 | |
CN109273321B (zh) | 熔断器元件 | |
JP6285932B2 (ja) | リフロー可能な回路保護装置 | |
JP2001524735A (ja) | 故障の際に規定された特性を有している半導体構造エレメント及びこのような半導体構造エレメントを製作する方法 | |
US11653450B2 (en) | Power distributor of an electrical system of a motor vehicle | |
CN107995785B (zh) | 印刷电路板组件 | |
CN109216286B (zh) | 半导体装置 | |
US20070200194A1 (en) | Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device | |
JP4134532B2 (ja) | 端子構造、接続装置、電子部品および機器 | |
KR102679566B1 (ko) | 실장 인쇄회로기판 및 인쇄회로기판 실장 방법 | |
JP6615697B2 (ja) | サーモスタット | |
CN105378889B (zh) | 受限于安装空间的过电压保护装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131126 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140226 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140305 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140526 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140909 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141209 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150205 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5695069 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |