JP2013508533A5 - - Google Patents
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- JP2013508533A5 JP2013508533A5 JP2012536979A JP2012536979A JP2013508533A5 JP 2013508533 A5 JP2013508533 A5 JP 2013508533A5 JP 2012536979 A JP2012536979 A JP 2012536979A JP 2012536979 A JP2012536979 A JP 2012536979A JP 2013508533 A5 JP2013508533 A5 JP 2013508533A5
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- Japan
- Prior art keywords
- composition
- weight percent
- carbon filaments
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- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical group C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25529509P | 2009-10-27 | 2009-10-27 | |
| US61/255,295 | 2009-10-27 | ||
| PCT/US2010/054208 WO2011053621A1 (en) | 2009-10-27 | 2010-10-27 | Compositions and articles for high-temperature wear use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013508533A JP2013508533A (ja) | 2013-03-07 |
| JP2013508533A5 true JP2013508533A5 (cg-RX-API-DMAC7.html) | 2013-12-12 |
Family
ID=43332750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012536979A Pending JP2013508533A (ja) | 2009-10-27 | 2010-10-27 | 高温磨耗用途のための組成物および物品 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2493967A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2013508533A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20120113720A (cg-RX-API-DMAC7.html) |
| CN (1) | CN102666692B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2011053621A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101944140B1 (ko) * | 2011-07-21 | 2019-01-30 | 엔테그리스, 아이엔씨. | 나노튜브 및 미세하게 분쇄된 탄소섬유 중합체 복합체 조성물 및 그의 제조 방법 |
| EP2706272B1 (en) * | 2011-10-31 | 2017-05-31 | Kabushiki Kaisha Riken | Piston ring |
| WO2014168979A1 (en) * | 2013-04-08 | 2014-10-16 | Vorbeck Materials | Use of graphene-containing polymer composites |
| KR101678724B1 (ko) * | 2013-12-06 | 2016-11-22 | 주식회사 엘지화학 | 열가소성 수지 조성물 및 이로부터 얻어지는 성형 물품 |
| KR101652566B1 (ko) * | 2013-12-06 | 2016-08-30 | 주식회사 엘지화학 | 전도성이 개선된 복합재 및 이를 함유하는 성형품 |
| CN104963976B (zh) * | 2015-06-25 | 2017-10-03 | 海安县东洋通达汽车配件有限公司 | 高耐磨刹车片 |
| CN105299081B (zh) * | 2015-11-30 | 2017-10-27 | 天津永恒泰科技有限公司 | 一种适合于高压重载离合器片的摩擦材料 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09508161A (ja) * | 1994-01-21 | 1997-08-19 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | 改善された特性を有するポリイミド組成物 |
| WO1997003116A1 (en) * | 1995-07-11 | 1997-01-30 | E.I. Du Pont De Nemours And Company | Polyimide compositions with improved wear resistance |
| EP1414894B1 (en) * | 2001-08-06 | 2012-06-13 | Showa Denko K.K. | Conductive curable resin composition and separator for fuel cell |
| US20040158005A1 (en) * | 2002-12-18 | 2004-08-12 | Bloom Joy Sawyer | Low coefficient of friction thermoplastic containing filler |
| US20050070658A1 (en) * | 2003-09-30 | 2005-03-31 | Soumyadeb Ghosh | Electrically conductive compositions, methods of manufacture thereof and articles derived from such compositions |
| JP4374464B2 (ja) * | 2004-03-10 | 2009-12-02 | 独立行政法人産業技術総合研究所 | バイオセンサ |
| US20070181855A1 (en) * | 2004-04-15 | 2007-08-09 | Yuji Nagao | Carbon-based electrically conducting filler, composition and use thereof |
| JP2005325346A (ja) * | 2004-04-15 | 2005-11-24 | Showa Denko Kk | 摺動材組成物およびその製造方法 |
| WO2006041186A1 (en) * | 2004-10-12 | 2006-04-20 | Showa Denko K.K | Resin composition containing vapor grown carbon fiber and use thereof |
| JP2008545839A (ja) * | 2005-05-27 | 2008-12-18 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 低い熱膨張率を有する樹脂組成物およびそれから製造された物品 |
| CN100451052C (zh) * | 2005-06-30 | 2009-01-14 | 日信工业株式会社 | 复合材料 |
| JP2007039649A (ja) * | 2005-06-30 | 2007-02-15 | Nissin Kogyo Co Ltd | 複合材料 |
| WO2008054864A2 (en) * | 2006-05-01 | 2008-05-08 | U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration | Composite material having a thermally-reactive-endcapped imide oligomer and carbon nanofillers |
| US20090048388A1 (en) * | 2007-08-16 | 2009-02-19 | Elia Andri E | Wear resistant toughened and reinforced polyacetal compositions |
-
2010
- 2010-10-27 JP JP2012536979A patent/JP2013508533A/ja active Pending
- 2010-10-27 WO PCT/US2010/054208 patent/WO2011053621A1/en not_active Ceased
- 2010-10-27 CN CN201080048379.3A patent/CN102666692B/zh not_active Expired - Fee Related
- 2010-10-27 KR KR1020127013668A patent/KR20120113720A/ko not_active Withdrawn
- 2010-10-27 EP EP10773504A patent/EP2493967A1/en not_active Withdrawn
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