JP2013258484A - Dielectric board connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount components achieving high package density in a device where the components are installed on a multi-layer dielectric board.SOLUTION: An insulator layer is covered by an inner conductor, and an outer conductor is covered by the insulator layer. Openings are provided at the outer conductor and the insulator layer so as to expose the inner conductor. Signal line paths, such as a microstrip line and a coplanar line, which are formed on a surface of a dielectric board, are electrically connected with the inner conductor through the openings. This structure allows electronic components to be mounted on the dielectric board achieving higher packaging density than a convention structure. Further, the structure realizes higher heat radiation performance than the convention structure.

Description

  The present invention relates to a connection structure between a signal line on a dielectric substrate and a coaxial line.

  In an apparatus having a structure in which an electronic component such as a transistor is mounted on a dielectric substrate, a technique for electrically connecting a signal line such as a microstrip line on the dielectric substrate and a coaxial line or a coaxial connector is known. (For example, refer to Patent Document 1).

  Also, a technique for connecting signal lines on each of a plurality of laminated dielectric substrates by connecting a signal line on the dielectric substrate and a coaxial line passing through a through-hole provided in the dielectric substrate. Is known (see, for example, Patent Document 2).

  Here, a laminated structure of a dielectric substrate using a conventional technique will be described with reference to FIGS. FIG. 10 is a side view showing a dielectric substrate connection structure using a conventional technique. FIG. 11 is a plan view showing the structure of the dielectric substrate of each layer in the conventional dielectric substrate connection structure, (a) is a plan view seen from the point A in FIG. 10 in the direction of the solid line arrow, and (b) is a plan view. 10 is a plan view seen from the point B in FIG. 10 in the direction of the broken line arrow, (c) is a plan view seen from the point B in FIG. 10 in the direction of the solid line arrow, and (d) is a direction from the point C in FIG. FIG.

  10 and 11, a signal line 303 is formed on the outer surface of the dielectric substrate 301, and electronic components 305 such as resistors and capacitors are mounted at appropriate positions on the signal line 303. 10 and 11, a signal line 304 is formed on the outer surface of the dielectric substrate 302, and an electronic component 305 is mounted at an appropriate position on the signal line 304. As used herein, “inner surface” refers to the surface of each dielectric substrate facing the other dielectric substrate, and “outer surface” refers to the opposite surface. And

  The inner surface of the dielectric substrate 301 and the inner surface of the dielectric substrate 302 are connected by a coaxial line 306. Here, the coaxial line 306 has an inner conductor 307 formed at the center and an outer conductor 308 formed concentrically on the outer periphery, and a dielectric 309 is interposed between the inner conductor 307 and the outer conductor 308. The signal line 303 and the signal line 304 are electrically connected via the internal conductor 307.

  In addition, a reference surface (GND surface) of a potential is formed on the inner surface of the dielectric substrate 301 and the inner surface of the dielectric substrate 302 by a conductor foil or the like, and is electrically connected to each other via the external conductor 308. Has been.

  As shown in FIGS. 10 and 11, in the conventional mounting method, when a plurality of dielectric substrates are stacked and an electronic component is mounted on each dielectric substrate, the outer side of each dielectric substrate sandwiching the coaxial is sandwiched. A signal line is formed on the surface. FIG. 12 is a side view showing an example in which a conventional dielectric substrate laminated structure is stored in a housing 300. In addition, the same code | symbol is attached | subjected about the thing which is common in the element of the dielectric substrate connection structure shown in FIG.10 and FIG.11. In the structure shown in FIG. 12, the electronic components must be mounted on the outer surfaces of the two dielectric substrates, and a useless space in which the electronic components are not mounted is generated between the two dielectric substrates. End up.

  In order to solve the above-described problem, a structure is considered in which the direction of the mounting surface of the electronic component is aligned by guiding the signal line to the inner surface of the dielectric substrate using a through hole or the like. FIG. 13 is a side view showing a configuration in which a mounting surface is changed using a through hole 310 in a conventional layered structure of a dielectric substrate, and FIG. 14A is a view from the point A in FIG. (B) is a plan view seen from the point B in FIG. 13 in the direction of the broken line arrow, (c) is a plan view seen from the point B in FIG. 13 in the direction of the solid line arrow, and (d) is FIG. It is the top view seen from the C point in the inside in the direction of a dashed-line arrow. 13 and 14, a signal line 311 is formed on the inner surface of the dielectric substrate 302, and an electronic component 305 is mounted at an appropriate position. The signal line 311 is electrically connected to the signal line 304 through the through hole 310.

  By using such a structure, it is possible to align the mounting direction of the electronic component 305 between the dielectric substrate 301 and the dielectric substrate 302. However, in this structure, various restrictions are imposed on the mounting of the electronic component. Therefore, the effect of increasing the mounting density is limited.

  Specifically, since no signal line exists between the coaxial line 306 and the through hole 311 on the inner surface of the dielectric substrate 302, an electronic component cannot be mounted in this region. In addition, since the signal line 304 exists between the coaxial line 306 and the through hole 311 on the outer surface of the dielectric substrate 302, this portion is brought into contact with the GND surface (reference surface where the potential is 0) of the housing. I can't let you.

Japanese Utility Model Publication No. 6-73902 JP 2001-189609 A

  Therefore, an object of the present invention is to provide a structure in which components can be mounted at a high mounting density in an apparatus in which components are arranged on a plurality of layers of dielectric substrates.

  In order to solve the above problems, a dielectric substrate connection structure according to the present invention includes an inner conductor, an insulator layer covering the inner conductor, an outer conductor layer covering the insulator layer, and the inner conductor. And a dielectric substrate having a signal line electrically connected to the inner conductor on the surface.

  In an apparatus in which components are arranged on a multi-layer dielectric substrate, components can be mounted at a high mounting density.

The perspective view of the dielectric substrate connection structure concerning 1st Embodiment. The side view of the dielectric substrate connection structure concerning a 1st embodiment. The top view of the dielectric substrate connection structure concerning 1st Embodiment. The side view example at the time of storing the dielectric substrate connection structure concerning 1st Embodiment in the housing | casing 100. FIG. The side view of the dielectric substrate connection structure concerning 2nd Embodiment. The top view of the dielectric substrate connection structure concerning 2nd Embodiment. The side view of the dielectric substrate connection structure concerning 3rd Embodiment. The top view of the dielectric substrate connection structure concerning 3rd Embodiment. The example of a side view at the time of storing the dielectric substrate connection structure concerning 3rd Embodiment in the housing | casing 200. FIG. The side view which shows the connection structure of the 1st example of the dielectric substrate using a prior art. The top view which shows the connection structure of the 1st example of the dielectric substrate using a prior art. The side view example at the time of storing the connection structure of the 1st example of the dielectric material board using a prior art in the housing | casing 300. FIG. The side view which shows the connection structure of the 2nd example of the dielectric substrate using a prior art. The top view which shows the connection structure of the 2nd example of the dielectric substrate using a prior art.

Exemplary embodiments of a dielectric substrate connecting structure according to the present invention will be explained below in detail with reference to the accompanying drawings. Note that this embodiment does not limit the disclosed technology.
[First Embodiment]

  FIG. 1 is a perspective view of the dielectric substrate connection structure according to the first embodiment, and FIG. 2 is a side view of the dielectric substrate connection structure according to the first embodiment. 3 (a), (b), (c) and (d) are respectively a plan view (a) viewed from the point A in FIG. 2 in the direction of the solid line arrow, and a plan view viewed from the point B in the direction of the broken line arrow ( b) A plan view (c) seen from the point B in the direction of the solid line arrow and a plan view (d) seen from the point C in the direction of the broken line arrow.

  Here, as a material of the dielectric substrate according to the present embodiment, epoxy, PTFE (polytetrafluoroethylene), polyimide, or the like is generally used. However, any dielectric material may be used as long as the function of the device including the dielectric substrate connection structure according to the present embodiment can be correctly realized. The same applies to the second and subsequent embodiments.

  1, 2, and 3, a signal line 3 is formed on the outer surface of the dielectric substrate 1, and electronic components 5 such as resistors and capacitors are mounted at appropriate positions on the signal line 3. In the present embodiment, the surface of each dielectric substrate that faces the other dielectric substrate may be referred to as an “inner surface” and the opposite surface may be referred to as an “outer surface”. The case where a microstrip line is used as the signal line will be described below.

1, 2, and 3, a signal line 4 is formed on the inner surface of the dielectric substrate 2, and an electronic component 5 is mounted at an appropriate position on the signal line 4.
A coaxial line 6 is formed between the inner surface of the dielectric substrate 1 and the inner surface of the dielectric substrate 2, and the coaxial line 6 has an inner conductor 7 at the center and an outer conductor 8 at the outer periphery. Concentric circles are formed, and a dielectric 9 is interposed between the inner conductor 7 and the outer conductor 8. Further, an insulator layer (not shown) may be formed outside the outer conductor 8 as necessary. The signal line 3 and the signal line 4 are electrically connected via the internal conductor 7. Each coaxial line is arranged so as to match the characteristic impedance of each electronic component and each signal line constituting the dielectric substrate connection structure according to the present invention.

  Further, a cutout window 10 is formed in the coaxial line 6 so as to expose the inner conductor 7, and the signal line 4 passes through the cutout window 10 and is electrically connected to the inner conductor 7 without contacting the outer conductor 8. Has been.

  A GND surface is formed on the inner surface of the dielectric substrate 1 by a conductor foil or the like, and is electrically connected to the outer conductor 8 of the coaxial line 6. A GND surface is also formed on the outer surface of the dielectric substrate 2 by a conductor foil or the like, and is electrically connected to the external conductor 8 through the through hole 11.

  According to the present embodiment, it is possible to provide a mounting surface on the inner surface of the dielectric substrate 2 in the structure in which the dielectric substrate 1 and the dielectric substrate 2 are connected by the coaxial line 6. That is, in a structure in which a plurality of layers of dielectric substrates are connected, the orientation of the mounting surface of the electronic component of each layer can be made uniform. Moreover, according to this structure, the thickness between the dielectric substrates can be easily changed by setting the length of the coaxial line 6 according to the size of the electronic component to be mounted. Furthermore, according to this structure, it is possible to align the mounting surface of the electronic component of each layer without changing the mounting surface using a through hole, so that the mounting surface of the electronic component is more than the conventional dielectric substrate connection structure. There are few structural restrictions that arise when aligning. Therefore, the dielectric substrate connection structure according to the present embodiment can achieve a higher mounting density than the conventional dielectric substrate connection structure.

  FIG. 4 is a side view showing an example when the dielectric substrate connection structure according to the present embodiment is stored in the housing 100. In addition, the same code | symbol is attached | subjected about the thing which is common in the element of the dielectric substrate connection structure shown in FIG. 1 thru | or FIG. As shown in FIG. 4, according to the present embodiment, the entire outer surface of dielectric substrate 2 can be the GND surface, so that the outer surface of dielectric substrate 2 is the GND surface of housing 100. It can be contacted arbitrarily. Therefore, the dielectric substrate connection structure according to the present embodiment can increase heat dissipation and strengthen the GND surface as compared with the conventional dielectric substrate connection structure.

1, 2, and 3, one electronic component 5 is illustrated on each dielectric substrate. However, a plurality of electronic components 5 may be actually mounted. 1, 2 and 3, the signal line 3 and the signal line 4 are illustrated on a straight line, but may actually be curved or branched. 1, 2, and 3, the direction of the cutout window 10 is set so that the signal line 3 and the signal line 4 are parallel to each other, but in practice, the cutout window 10 is formed in an arbitrary direction. The internal conductor 7 and the signal line 4 may be connected.
[Second Embodiment]

  Next, a dielectric substrate connection structure according to the second embodiment will be described. In the first embodiment, a structure in which two layers of dielectric substrates are connected is described. In the second embodiment, a structure in which three or more layers of dielectric substrates are connected is described.

  FIG. 5 is a side view of the dielectric substrate connection structure according to the second embodiment. 5 and 6, the signal line 104 is provided on the upper surface of the dielectric substrate 101, the signal line 105 is provided on the upper surface of the dielectric substrate 102, and the signal line 106 is provided on the upper surface of the dielectric substrate 103. Are formed, and electronic components 107 such as resistors and capacitors are mounted at appropriate positions on the signal line 104, the signal line 105, and the signal line 106, respectively.

  6A and 6B are plan views showing a dielectric substrate connection structure according to the second embodiment, wherein FIG. 6A is a plan view of the dielectric substrate 101, FIG. 6B is a plan view of the dielectric substrate 102, and FIG. FIG. 3 is a plan view of the dielectric substrate 103. A coaxial line 108 is formed between the lower surface of the dielectric substrate 101 and the upper surface of the dielectric substrate 102. The coaxial line 108 has an inner conductor 109 at the center and an outer conductor 110 at the outer periphery. Are formed concentrically, and a dielectric 111 is interposed between the inner conductor 109 and the outer conductor 110. Further, an insulator layer (not shown) may be formed outside the outer conductor 110 as necessary. The signal line 104 and the signal line 105 are electrically connected via the internal conductor 109.

  Similarly, a coaxial line 108 is also formed between the lower surface of the dielectric substrate 102 and the upper surface of the dielectric substrate 103, and the signal line 105 and the signal line 106 are connected via the internal conductor 109. Are electrically connected. Each coaxial line is arranged so as to match the characteristic impedance of each electronic component and each signal line constituting the dielectric substrate connection structure according to the present invention.

  Further, a cutout window 112 is formed on the coaxial line 108 so as to expose the internal conductor 109, and the signal line 105 and the signal line 106 pass through the cutout window and contact the internal conductor 109 without contacting the external conductor 110. Electrically connected. A GND surface is formed by a conductive foil or the like on the lower surface of the dielectric substrates 101, 102, and 103, and each GND surface is electrically connected to each other through the through hole 113 and the external conductor 110. Yes.

According to the present embodiment, it is possible to adopt a structure in which three or more dielectric substrates are connected by aligning the mounting surfaces of the electronic components of the respective layers.
[Third Embodiment]

  Next, a dielectric substrate connection structure according to the third embodiment will be described. In the first embodiment and the second embodiment, in the structure in which two or more dielectric substrates are connected, the structure in which the mounting surfaces of the electronic components of each layer are aligned has been described. The third embodiment In the embodiment, a structure in which two layers of dielectric substrates are connected and a mounting surface of an electronic component is formed on a surface facing each other across a coaxial line connecting the two dielectric substrates will be described.

  7 is a side view of the dielectric substrate connecting structure according to the third embodiment. FIGS. 8A, 8B, 8C, and 8D are respectively viewed from the point A in FIG. FIG. 4A is a plan view seen from the point B in the direction of the dashed arrow, a plan view seen from the point B in the direction of the solid arrow, and a plan view seen from the point C in the direction of the dashed arrow. .

  7 and 8, a signal line 203 is formed on the inner surface of the dielectric substrate 201, and electronic components 205 such as resistors and capacitors are mounted at appropriate positions on the signal line 203. In FIG. 7, a signal line 204 is formed on the inner surface of the dielectric substrate 202, and electronic components 205 such as resistors and capacitors are mounted at appropriate positions on the signal line 204.

  A coaxial line 206 is formed between the lower surface of the dielectric substrate 201 and the upper surface of the dielectric substrate 202. The coaxial line 206 has an inner conductor 207 at the center and an outer conductor 208 at the outer periphery. Are formed concentrically, and a dielectric 209 is interposed between the inner conductor 207 and the outer conductor 208. Further, an insulator layer (not shown) may be formed outside the external conductor 208 as necessary. The signal line 203 and the signal line 204 are electrically connected through the internal conductor 207. Each coaxial line is arranged so as to match the characteristic impedance of each electronic component and each signal line constituting the dielectric substrate connection structure according to the present invention.

  Furthermore, a cutout window 210 and a cutout window 211 are formed in the coaxial line 206 so as to expose the internal conductor 207. The signal line 203 passes through the cutout window 210, and the signal line 204 passes through the cutout window 211, and is electrically connected to the internal conductor 207 without contacting the external conductor 208.

  A GND surface is formed on the upper surface of the dielectric substrate 201 with a conductive foil or the like, and is electrically connected to the external conductor 208 through the through hole 212. In addition, a GND surface is formed on the lower surface of the dielectric substrate 202 with a conductive foil or the like, and is electrically connected to the external conductor 208 through the through hole 212.

  According to the present embodiment, the mounting surface is formed on the lower surface of the dielectric substrate 201 and the upper surface of the dielectric substrate 202 in the structure in which the dielectric substrate 201 and the dielectric substrate 202 are coupled by the coaxial line 206. It is possible to provide. Therefore, according to the present embodiment, it is possible to achieve a higher mounting density than that of the first embodiment and to strengthen the GND surface.

  FIG. 9 is a side view showing an example in which the dielectric substrate connection structure according to the present embodiment is stored in the housing 200. In addition, the same code | symbol is attached | subjected about the thing which is common in the element of the dielectric substrate connection structure shown in FIG.7 and FIG.8. As shown in FIG. 9, according to the present embodiment, the outer surfaces of dielectric substrate 201 and dielectric substrate 202 can be arbitrarily brought into contact with the GND surface of housing 200. Therefore, the dielectric substrate connection structure according to the present embodiment can further improve the heat dissipation as compared with the first embodiment.

  Although the example in the case of using the microstrip line as the signal line in the dielectric substrate connection structure according to the present invention has been described so far, a coplanar line may actually be used as the signal line. Similarly, each component of the dielectric substrate connection structure according to the present invention does not necessarily have to take the form shown in the drawing, and can take various forms within a range not impairing the gist of the present invention.

DESCRIPTION OF SYMBOLS 1, 2 Dielectric board | substrates 3 and 4 Signal line 5 Electronic component 6 Coaxial line 7 Inner conductor 8 Outer conductor 9 Dielectric 10 Cutting window 11 Through hole 100 Housing | casing 101-103 Dielectric substrates 104-106 Signal line 107 Electronic component 108 Coaxial line 109 Internal conductor 110 External conductor 111 Dielectric 112 Cutting window 113 Through hole 200 Housing 201, 202 Dielectric substrate 203, 204 Signal line 205 Electronic component 206 Coaxial line 207 Internal conductor 208 External conductor 209 Dielectric 210, 211 Cutting Window 212 Through hole 300 Housing 301, 302 Dielectric substrate 303, 304 Signal line 305 Electronic component 306 Coaxial line 307 Internal conductor 308 External conductor 309 Dielectric 310, 311 Through hole 312 Signal line

Claims (7)

An inner conductor; an insulator layer covering the inner conductor; an outer conductor layer covering the insulator layer; the insulating layer exposing the inner conductor; and an opening formed in the outer conductor layer. A coaxial line,
A dielectric substrate electrically connected to the inner conductor and having a signal line formed on the surface thereof so as to pass through the opening;
A dielectric substrate connection structure comprising:   The coaxial line connects signal lines on a plurality of laminated dielectric substrates, and a signal line formed on the surface of at least one dielectric substrate is formed so as to pass through the opening. The dielectric substrate connection structure according to claim 2.   4. The dielectric substrate connection structure according to claim 3, wherein the signal lines on the plurality of dielectric substrates are formed on surfaces in the same direction in the stacking direction.   4. The dielectric substrate connection structure according to claim 3, wherein the signal lines on the plurality of dielectric substrates are formed on surfaces facing each other.   6. The signal line according to claim 1, wherein the signal line is a signal line constituting a microstrip line in which a conductor is formed on a surface of the dielectric substrate opposite to the signal line. The dielectric substrate connection structure described.   6. The dielectric according to claim 1, wherein the signal line is a signal line constituting a coplanar line in which a plurality of conductors are formed in parallel so as to sandwich the signal line. Board connection structure. A signal line is formed on the surface of the dielectric substrate,
Cover the inner conductor with an insulator layer,
Coating the insulator layer with an outer conductor;
Forming an opening to expose the inner conductor to the outer conductor and the insulator layer;
The dielectric substrate laminating method, wherein the signal line is electrically connected to the inner conductor so as to pass through the opening.

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