JP2013258386A - Inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection device capable of reducing influences of dusts etc. included in an antioxidation gas, which prevents the oxidation of a probe needle, on the electric inspection of an inspected body.SOLUTION: An inspection device places a tip of a probe needle 12 attached to a probe card 11 in contact with an electrode pad formed on a surface of an inspected body 14 in a wafer state thereby conducting electric inspection of the inspected body 14. The inspection device includes: gas supply means 16 which supplies an antioxidation gas, which prevents the oxidation of the tip of the probe needle 12, to the tip of the probe needle 12; a gas supply line 17 which receives the antioxidation gas and supplies the antioxidation gas to the gas supply means 16; and a first filter device 18 which is disposed on the gas supply line 17 and removes dust included in the antioxidation gas.

Description

  The present invention relates to an inspection apparatus for performing an electrical inspection of an object to be inspected by bringing an electrode pad formed on the surface of the object to be inspected in a wafer state into contact with a tip of a probe needle attached to a probe card. The present invention relates to an inspection apparatus that performs a probing test on a semiconductor wafer.

  A wafer test using a probe card as a jig for inspecting a semiconductor chip in a wafer state is performed by bringing a probe needle into contact with an electrode pad formed on an integrated circuit.

  FIG. 5 shows a system configuration of an inspection apparatus that performs a probing test on a semiconductor wafer in the prior art. In FIG. 5, the inspection apparatus 30 includes a jet nozzle 31, a cantilever type probe card 33 to which a probe needle 32 is attached, a wafer stage 35 for fixing a semiconductor wafer 34, and a housing 36. A signal processing unit 37 that generates an electrical signal to be input to an electrode pad on the chip and analyzes the output signal output to the electrode pad to determine whether the chip is good or bad.

  Here, oxidation of the probe needle 32 is prevented by blowing an antioxidant gas (for example, an inert gas such as nitrogen gas) onto the probe needle 32 by the ejection nozzle 31.

  Thus, in the conventional inspection apparatus, the oxidation of the probe needle tip is prevented by blowing the antioxidant gas toward the probe needle through the injection nozzle (see, for example, Patent Document 1 below).

  Furthermore, in the inspection apparatus shown in Patent Document 2, after using an injection nozzle, the entire wafer stage is further surrounded by a casing, and an antioxidant gas is injected into the casing to maintain a purge gas atmosphere. Prevents oxidation ahead.

  On the other hand, the configuration using such an injection nozzle is difficult to use in a vertical probe card having no opening at the center. In Patent Document 3, a hollow portion is provided between an upper substrate and a lower substrate of a probe card, and a hole for allowing an antioxidant gas to pass through is provided in the upper substrate and the lower substrate, so that a vertical probe card is also provided. Thus, it is possible to use such an injection nozzle.

JP-A-7-273157 JP 2001-7164 A Japanese Patent Laid-Open No. 11-218548

  In the conventional inspection apparatus for preventing oxidation of the probe needle by spraying the antioxidant gas disclosed in Patent Documents 1 to 3 described above, when the antioxidant gas contains dust or the like, the dust is In some cases, it adheres to the surface of the semiconductor chip to be inspected and becomes an obstacle to the inspection. Semiconductor image sensors such as CCD sensors and CMOS sensors are particularly problematic because light incidence is hindered by dust or the like adhering to the surface.

  In addition, the dust generated when the probe needle is brought into contact with the electrode pad is not taken into consideration, and there is a risk that the dust may fly due to the blowing of the antioxidant gas, which is difficult to operate particularly in a sensing device such as a semiconductor image sensor. It was.

  The present invention has been made in view of the above-mentioned problems, and its purpose is to reduce the influence of dust and the like contained in an antioxidant gas that prevents oxidation of the probe needle on the electrical inspection of the object to be inspected. Is to provide a simple inspection device.

  In order to achieve the above object, the present invention provides an electrode pad formed on a surface of an object to be inspected in a wafer state and a tip of a probe needle attached to a probe card, thereby contacting the electrical object of the object to be inspected. An inspection apparatus for performing an accurate inspection, wherein a gas supply means for supplying an antioxidant gas for preventing oxidation of the tip of the probe needle to the tip of the probe needle, and receiving and supplying the antioxidant gas to the gas supply means And a first filter device for removing dust contained in the antioxidant gas interposed on the gas supply line.

  Furthermore, the inspection apparatus of the first feature includes a housing that houses therein the probe card and a movable stage on which the object to be inspected is placed, and a gas inside the housing is sucked out of the housing. A second feature is that a second filter device for removing dust contained in the gas discharged by the discharge means is installed.

  Furthermore, in the inspection apparatus according to the second feature, it is preferable that a gas suction port in the casing of the discharge means is disposed below the movable stage in the casing.

  Furthermore, the inspection device of the second feature has a third feature of including a blowing unit that blows the gas in the casing downward.

  Furthermore, in the inspection apparatus of the third feature, it is preferable that a third filter device for removing dust contained in the gas blown by the blowing means is installed.

  Furthermore, in the inspection apparatus according to the second or third feature, when the probe card has an opening, the second space outside the housing communicating with the first space in the housing is sealed through the opening. Preferably, the first space and the second space are integrated and sealed.

  Furthermore, in the inspection apparatus according to any one of the first to third features, when the object to be inspected is an image sensor, the first filter device has a minimum pixel size of 0.1 to 0. Preferably, it has the ability to remove dust that is larger than the size multiplied by a predetermined ratio in the range of 7.

  According to the inspection device of the first feature, dust contained in the antioxidant gas is removed by the first filter device, so that the influence of the dust on the electrical inspection of the object to be inspected can be reduced. .

  Furthermore, according to the inspection device of the second feature, since the second filter device is installed in the discharge means, it is possible to prevent the dust generated inside the inspection device casing from being discharged outside the inspection device. It is possible to maintain the number of dusts per unit volume in the room in which the is installed at a low level.

  Further, in the inspection device of the second feature, a gas suction port in the housing of the discharge means is provided below the movable stage, or a downward air flow in the housing by the inspection device of the third feature. The dust generated when the probe needle contacts the electrode pad and the dust generated by the mechanical operation of the movable stage are transported downward in the housing by the air flow, so that the dust generated in the housing is inspected. It is possible to prevent adhesion on the surface of the body.

  Furthermore, when the probe card has an opening, by providing the sealing structure, dust can enter the housing from outside the housing through the opening, or dust generated inside the housing can be removed from the housing. It can prevent discharge.

  Furthermore, according to the inspection apparatus having any of the above characteristics, when the object to be inspected is an image sensor, dust having a high possibility of affecting the electrical inspection of the image sensor can be removed, and the apparent appearance caused by the dust can be removed. Inspection defects can be eliminated, and inspection yield can be improved.

The figure which shows typically the structural example of the inspection apparatus which concerns on 1st Embodiment of this invention. The figure which shows typically the principal part which comprises the nozzle and air supply line which inject the antioxidant gas in the inspection apparatus shown in FIG. The figure which shows the verification result of the effect at the time of providing the 1st filter in the air supply line in the inspection apparatus shown in FIG. The figure which shows typically the structural example of the inspection apparatus which concerns on 2nd Embodiment of this invention. The figure which shows the structural example of the conventional inspection apparatus typically

  Hereinafter, embodiments of an inspection apparatus of the present invention (hereinafter, referred to as “the present inspection apparatus” as appropriate) will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a side view schematically showing a configuration example in the first embodiment of the inspection apparatus, and shows the inside of the housing 10 of the inspection apparatus 1 through the internal configuration. Note that FIG. 1 is a schematic diagram, and because the main part is highlighted, the dimensional ratio of each part is not necessarily the same as that of the actual inspection apparatus.

  As shown in FIG. 1, the inspection apparatus 1 includes a housing 10 in which a probe card 11, a card support portion 13 to which the probe card 11 is attached, and a plurality of test objects are arranged and formed in a matrix. A movable stage 15 for mounting and supporting 14, a nozzle 16 (corresponding to a gas supply means) for injecting an antioxidant gas toward the tip of a probe needle 12 attached to the probe card 11, and receiving an antioxidant gas from the outside Air supply line 17 (corresponding to a gas supply line) supplied to the nozzle 16, a first filter 18 provided in the middle of the air supply line 17, and an exhaust line for exhausting the gas in the housing 10 to the outside of the housing 10. 19, a suction fan 20 and a second filter 21 provided on the exhaust line, and a blower fan 2 that blows air toward the bottom of the housing 10 provided in the upper part of the housing 10 (Corresponding to a blowing means), and configured to include a third filter 23 provided to the suction port of the blower fan 22.

  In the present embodiment, the probe card 11 is a vertical probe card in which the probe needle 12 protrudes vertically downward from the plate surface of the probe card 11 and the opening of the probe needle 12 does not have an opening. Therefore, the housing 10 is in a sealed state except for the air supply line 17 and the exhaust line 19 in a state where the card support 13 to which the probe card 11 is attached is attached to the top plate 10a of the housing 10, and dust or the like It is a structure that cannot enter and exit.

  Further, in a state where the probe card 11 and the card support 13 are mounted on the housing 10, the pogo pin ring 3 that contacts a connection terminal provided on the upper surface of the probe card 11 and the probe needle 12 via the pogo pin ring 3. The test head 4 that transmits and receives electrical signals is disposed above the probe card 11. The test head 4 is connected to the test apparatus 5. The test apparatus 5 generates an electrical signal to be input to the electrode pad of the device under test, receives the electrical signal output from the electrode pad, analyzes the received electrical signal, and determines whether the device under test is good or bad To do. In the present embodiment, the test apparatus 5 controls the positioning and movement of the movable stage 15.

  In the present embodiment, as shown in FIG. 2, a plurality of nozzles 16 are formed in the card support portion 13 so as to surround the probe needle 12, and one end of the air supply line 17 is formed in the card support portion 13. Further, it is connected to an inlet 24 of a vent hole communicating with the plurality of nozzles 16. The other end of the air supply line 17 is connected to an antioxidant gas supply source (not shown) installed outside the housing 10. The antioxidant gas uses an inert gas such as nitrogen or a reducing gas, and the supply source of the antioxidant gas is a gas cylinder filled with the antioxidant gas or an antioxidant gas generator that generates nitrogen from the air. is assumed. Further, a flow rate regulator (not shown) and a pressure regulator (not shown) for adjusting the flow rate of the antioxidant gas are provided in the middle of the antioxidant gas supply source or supply line 17 as necessary. ing.

  The exhaust line 19 and the suction fan 20 constitute a discharge unit that sucks the gas in the housing 10 and discharges it outside the housing 10. The discharging means may be configured using a suction pump instead of the suction fan 20. The suction fan 20 and the suction pump may be installed at a plurality of locations in the housing 10 or may be installed outside the housing 10. The second filter 21 may also be installed outside the housing 10. In the example shown in FIG. 1, the suction fan 20 and the second filter 21 are installed in the housing 10, one end of the exhaust line 19 is connected to the suction fan 20, and the other end is opened outside the housing 10. When the suction fan 20 is installed in the housing 10, the second filter 21 may be provided at the suction port of the suction fan 20.

  Further, in the present embodiment, the suction port of the suction fan 20 is disposed below the movable stage 15 in the housing 10, and the blower fan 22 is provided downward in the upper portion of the housing 10, thereby An airflow that flows downward is generated.

  The first to third filters 18, 21, and 23 are porous filtration membranes, which capture dust contained in the inflowing gas and having a diameter of, for example, about 0.1 to 0.7 μm or more, and after removing the dust. Exhaust the gas. The structure of each filter 18, 21, 23, and the material of the filtration membrane in the case of using a filtration membrane are not limited to a filter having a specific structure or method as long as the above dust can be removed. When the first filter 18 uses a filtration membrane, if moisture for adsorbing dust or the like is contained in the filtration membrane, the moisture or the like is mixed into the antioxidant gas after dust removal, and the probe needle There is a possibility that the antioxidation effect at the tip may be reduced, which is not preferable. Therefore, each of the filters 18, 21, and 23 preferably has a structure and method in which extra substances such as moisture are not added to the passing gas.

  The air supply line 17 is configured by using metal or resin pipes, but the above-mentioned dust may be generated in the air supply line 17 due to rust of the metal pipes or deterioration of the resin pipes. In addition, there is a possibility that dust is generated from a supply source of an antioxidant gas (not shown). Therefore, by providing the first filter 18 in the middle of the air supply line 17, the antioxidant gas after dust removal is injected from the nozzle 16 provided in the card support portion 13 toward the tip of the probe needle 12. Can do. As a result, the tip of the probe needle 12 can be prevented from being oxidized, and dust contained in the antioxidant gas can be prevented from adhering to the surface of the semiconductor wafer 14. It is possible to prevent a decrease in yield due to a defective inspection. In particular, in a semiconductor image sensor such as a CCD sensor or a CMOS sensor, the object to be inspected is obstructed by light incident due to dust or the like adhering to the surface. The improvement effect by the filter 18 becomes remarkable. In this case, it is preferable that dust larger than the size obtained by multiplying the minimum pixel size of the semiconductor image sensor by a predetermined ratio within the range of 0.1 to 0.7 can be removed by the first filter 18.

  FIG. 3 shows the result of measuring the number of dusts in the antioxidant gas ejected from the nozzle 16 with and without the first filter 18 in the air supply line 17 in the space on the movable stage 15. In FIG. 3, the solid broken line indicates the number of detected dusts when the first filter 18 is provided, and the broken broken line indicates the number of detected dusts when the first filter 18 is not provided. Indicates a reference value in a wafer test environment. In the measurement example of the number of dusts shown in FIG. 3, the number of dusts having a diameter of 0.3 to 1.0 μm present in a constant volume of gas every minute using an optical particle counter using laser light. I counted. From FIG. 3, when the first filter 18 is provided, the number of detected dust is stably below the reference value 1 minute after the start of measurement, whereas when the first filter 18 is not provided, It can be seen that the unstable state continues for about 6 minutes after the start of measurement, and the number of detected dust exceeds the reference value even after stabilization.

  When a gas having a specific gravity smaller than that of air is used as the antioxidant gas, the antioxidant gas stays above the movable stage 15, and the air originally present in the housing 10 mainly stays below the housing 10. Then, the same amount of air as the flowing antioxidant gas or a mixed gas of air and antioxidant gas is discharged from the exhaust line 19 to the outside of the housing 10, and the concentration of the antioxidant gas in the housing 10 gradually increases. Conversely, the concentration of oxygen, which is an oxidizing gas, decreases. Therefore, by arranging the suction port of the suction fan 20 below the movable stage 15 in the housing 10, the upper side of the movable stage 15 in the housing 10 is relatively lower than the concentration of the antioxidant gas. On the contrary, the concentration of oxygen, which is an oxidizing gas, decreases. Nitrogen used as an antioxidant gas in this embodiment occupies about 75% (weight ratio) in air and has a specific gravity slightly smaller than air.

  Since there are mechanically movable parts such as the movable stage 15 in the casing 10, dust may be generated from the movable parts. Further, dust may be generated due to rust of other metal members in the housing 10 or deterioration of resin parts. Furthermore, when the tip of the probe needle 12 comes into contact with the electrode pad of the object to be inspected, there is a possibility that shavings of a metal material (such as aluminum) constituting the electrode pad are generated as dust. The shavings may be scattered on the semiconductor wafer 14 by an antioxidant gas injected toward the tip of the probe needle 12.

  Therefore, as described above, an airflow flowing downward in the housing 10 is generated, so that dust generated in the housing 10 and dust flowing into the housing 10 are moved downward by the airflow flowing downward. By moving, it is possible to avoid returning and adhering to the surface of the semiconductor wafer 14, and in the electrical inspection of the object to be inspected, it is possible to prevent a decrease in yield due to an inspection failure due to dust.

  Further, since the dust that adversely affects the electrical inspection of the object to be inspected is removed by the third filter 23 provided at the suction port of the blower fan 22, the dust is not discharged out of the housing 10 by the discharging means. The number of dust in the convection gas in the housing 10 is reduced, and it is more effectively avoided that the dust returns to the surface of the semiconductor wafer 14 and adheres.

  Furthermore, by providing the second filter 21 in the discharge means, it is possible to prevent the dust in the casing 10 from being discharged out of the casing 10 as it is. As a result, the cleanliness of the room in which the inspection apparatus 1 is installed (the number of dusts per unit volume) can be maintained below a certain level.

[Second Embodiment]
FIG. 4 is a side view schematically showing a configuration example in the second embodiment of the inspection apparatus, and shows the inside of the housing 10 of the inspection apparatus 2 through the internal configuration. Note that FIG. 4 is a schematic diagram, and because the main parts are highlighted, the dimensional ratios of the respective parts are not necessarily the same as those of the actual inspection apparatus. Further, the same components as those in the first embodiment will be described with the same reference numerals.

  As shown in FIG. 4, the inspection apparatus 2 includes a probe card 11, a card support unit 13 for attaching the probe card 11, and a plurality of inspected objects in the housing 10, as in the case of the inspection apparatus 1 of the first embodiment. A movable stage 15 for mounting and supporting a semiconductor wafer 14 having a body arranged and formed in a matrix, an exhaust line 19 for exhausting the gas in the housing 10 to the outside of the housing 10, and an exhaust line are provided. The suction fan 20 and the second filter 21, the blower fan 22 that blows air toward the bottom of the housing 10 provided at the top of the housing 10, and the third filter 23 provided at the suction port of the blower fan 22. It is configured with.

  In the present embodiment, the probe card 11 is a cantilever type probe card having an opening 25 and the probe needle 12 extending obliquely downward from the outer periphery of the opening. For this reason, the space in the housing 10 (hereinafter referred to as “first space 26”) is the space above the probe card 11 (hereinafter referred to as “first space 26”) surrounded by the pogo pin ring 3 and the test head 4 via the opening 25. (Referred to as “second space 27”). Since the pogo pins are arranged at the lower end and the upper end of the pogo pin ring 3, the second space 27 communicates with the external space via the gap between the pogo pins, so the first space 26 communicates with the second space 27. Will not be sealed. Therefore, in the present embodiment, in order to block the first space 26 and the second space 27 from the external space, the pogo pin ring 3 and the test head 4 are configured by a side wall portion 28 and a lid portion 29 made of an airtight material. The second space 27 is sealed by the shield. The lower end portion of the side wall portion 28 is in close contact with the upper surface of the outer peripheral portion of the opening 25 of the probe card 11, and the upper end portion of the side wall portion 28 is in close contact with the outer peripheral end of the lid portion 29.

  In the present embodiment, a nozzle 16 (corresponding to a gas supply means) that injects an antioxidant gas toward the tip of the probe needle 12, and an air supply line 17 (gas supply line) that receives the antioxidant gas from the outside and supplies it to the nozzle 16. The first filter 18 provided in the middle of the air supply line 17 is provided outside the housing 10. Specifically, a through hole 4a through which the air supply line 17 is inserted is provided at the center of the test head 4, and a nozzle 16 is formed on the downstream side integrally with the air supply line 17, and the nozzle 16 is a shield. The front end of the lid portion 29 is in the second space 27. The nozzle 16 is in intimate contact with the lid portion 29 at a location penetrating the lid portion 29. As a result, the housing 10 is in a sealed state except for the air supply line 17 and the exhaust line 19 as in the first embodiment, and has a structure in which dust and the like cannot enter and exit.

  The upstream side of the air supply line 17 is connected to an antioxidant gas supply source (not shown) installed outside the housing 10 as in the first embodiment. Since the antioxidant gas, the supply line 17 and the supply source of the antioxidant gas are the same as those in the first embodiment, a duplicate description is omitted. In the present embodiment, with the above-described configuration, the antioxidant gas is ejected from the nozzle 16 into the second space 27, and the surface of the semiconductor wafer 14, that is, the tip of the probe needle 12 through the opening 25 of the probe card 11. To be supplied. As a result, the tip of the probe needle 12 can be prevented from being oxidized, and dust contained in the antioxidant gas can be prevented from adhering to the surface of the semiconductor wafer 14. It is possible to prevent a decrease in yield due to a defective inspection.

  Since the configuration and effects of the discharge means (the exhaust line 19 and the suction fan 20), the blower fan 22, and the second and third filters 21 and 23 are the same as those of the first embodiment, overlapping descriptions are omitted. . Further, the first to third filters 18, 21, 23 are the same as those in the first embodiment, and thus redundant description is omitted.

  Further, the pogo pin ring 3, the test head 4, and the test apparatus 5 are the same as those in the first embodiment except that the above-described through hole 4a is provided, and therefore, a duplicate description is omitted.

[Another embodiment]
<1> In each of the above embodiments, it is assumed that the nozzle 16 and the air supply line 17 are provided in the card support portion 13 and a case in which the nozzle 16 and the air supply line 17 are provided above the probe card 11 having the opening 25. The arrangement locations of the nozzle 16 and the air supply line 17 are not limited to those described in the above embodiments. For example, as disclosed in Patent Document 1, the nozzle 16 may be provided so as to be close to the tip of the probe needle 12 from the side. Alternatively, as disclosed in Patent Document 1, the nozzle 16 may be provided. You may make it form in the probe card 11 by providing the opening part which injects antioxidant gas.

  In particular, in the first embodiment, the nozzle 16 and the air supply line 17 are provided on the card support portion 13 for the vertical probe card. In the second embodiment, the nozzle 16 and the air supply line 17 are provided for the cantilever probe card. Although the air supply line 17 is provided above the probe card 11, the arrangement location of the nozzle 16 and the air supply line 17 is not limited to a specific installation location as long as it matches the type of the probe card 11 to be used. Absent.

  Further, the number of nozzles 16 installed and the injection direction of the antioxidant gas are not limited to a specific number or direction as long as the antioxidant gas can be supplied toward the tip of the probe needle 12.

  Further, when a plurality of nozzles 16 having different antioxidant gas injection directions are provided, the plurality of nozzles 16 are divided into a plurality of systems so that the antioxidant gas from the air supply line 17 is independently received for each system. It is also preferable to control the number of nozzles 16 that inject the antioxidant gas toward the tip of the probe needle 12. Thus, since the injection direction of the antioxidant gas can be controlled, for example, dust or the like adhering to the surface of the semiconductor wafer 14 can be efficiently removed before starting the electrical inspection of the object to be inspected. it can.

  <2> Furthermore, in the first embodiment, as shown in FIG. 2, a vent hole inlet 24 is provided in the side wall portion of the card support portion 13, and one end of the air supply line 17 is the inlet 24 in the housing 10. For example, the inlet 24 of the vent hole is provided on the upper surface of the card support portion 13 that comes into contact with the lower surface of the top plate 10a of the housing 10, and the through hole penetrates the top plate 10a up and down. Is provided at a position communicating with the inlet 24, and one end of the air supply line 17 is preferably connected to the through hole of the top plate 10a. Thereby, the inlet 24 of the air hole and the air supply line 17 are automatically connected only by mounting the card support portion 13 on the top plate 10a.

  <3> Further, in each of the above embodiments, the case where the blower fan 22 and the third filter 23 are provided in the housing 10 has been described as an example, but the blower fan 22 and the third filter 23 are not necessarily provided. . If the exhaust line 19 or the suction port of the suction fan 20 is provided in the lower part of the housing 10, an airflow that flows downward in the housing 10 can be generated without the blower fan 22 or the like.

  <4> Further, in each of the above embodiments, it is assumed that the probe card 11 is attached to the top plate 10a of the housing 10 via the card support portion 13, but the probe card 11 is directly mounted on the top plate of the housing 10. The structure attached to 10a may be sufficient.

  <5> Further, in each of the above embodiments, the case where the probe card 11 is connected to the test apparatus 5 via the pogo pin ring 3 and the test head 4 has been described as an example. It may be configured to be connected to the test apparatus 5 via the pogo pin ring 3 or another type of connector.

  INDUSTRIAL APPLICABILITY The present invention can be used for an inspection apparatus that performs an electrical inspection of an object to be inspected in a wafer state using a probe card.

DESCRIPTION OF SYMBOLS 1, 2: Inspection apparatus 3: Pogo pin ring 4: Test head 4a: Through hole of test head 5: Test apparatus 10: Housing | casing 10a: Top plate of a housing | casing 11: Probe card 12: Probe needle 13: Card support part 14 : Semiconductor wafer 15: Movable stage 16: Nozzle (gas supply means)
17: Air supply line (gas supply line)
18: First filter (first filter device)
19: Exhaust line (exhaust means)
20: Suction fan (exhaust means)
21: Second filter (second filter device)
22: Blower fan (blower means)
23: Third filter (second filter device)
24: Vent hole entrance 25: Probe card opening 26: Space in housing (first space)
27: Space above the probe card (second space)
28: Side wall portion of shield body 29: Cover portion of shield body 30: Conventional inspection device 31: Injection nozzle 32: Probe needle 33: Probe card 34: Semiconductor wafer 35: Wafer stage 36: Housing 37: Signal processing section

Claims (7)

An inspection apparatus for performing an electrical inspection of the inspection object by contacting an electrode pad formed on the surface of the inspection object in a wafer state and a tip of a probe needle attached to the probe card,
A gas supply means for supplying an antioxidant gas for preventing oxidation of the tip of the probe needle to the tip of the probe needle;
A gas supply line that receives the antioxidant gas and supplies it to the gas supply means; and
An inspection apparatus comprising a first filter device for removing dust contained in the antioxidant gas interposed on the gas supply line. A housing that houses therein the probe card and a movable stage on which the object to be inspected is placed;
A suction means for sucking the gas in the housing and discharging it out of the housing;
The inspection apparatus according to claim 1, wherein a second filter device for removing dust contained in the gas discharged by the discharge means is installed.   The inspection apparatus according to claim 2, wherein a suction port for the gas in the casing of the discharging unit is disposed below the movable stage in the casing.   The inspection apparatus according to claim 2, further comprising a blowing unit that blows gas in the casing downward.   The inspection apparatus according to claim 4, wherein a third filter device for removing dust contained in the gas blown by the blower is installed. When the probe card has an opening, the probe card includes a sealing structure that seals the second space outside the housing that communicates with the first space in the housing through the opening.
The inspection apparatus according to claim 2, wherein the first space and the second space are integrated and sealed.   When the object to be inspected is an image sensor, the first filter device removes dust larger than a size obtained by multiplying the minimum pixel size of the image sensor by a predetermined ratio within a range of 0.1 to 0.7. The inspection apparatus according to claim 1, wherein the inspection apparatus has a capability.

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