JP2013258175A5 - - Google Patents

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Publication number
JP2013258175A5
JP2013258175A5 JP2012131691A JP2012131691A JP2013258175A5 JP 2013258175 A5 JP2013258175 A5 JP 2013258175A5 JP 2012131691 A JP2012131691 A JP 2012131691A JP 2012131691 A JP2012131691 A JP 2012131691A JP 2013258175 A5 JP2013258175 A5 JP 2013258175A5
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JP
Japan
Prior art keywords
groove
emitting device
sealing member
semiconductor light
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012131691A
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English (en)
Japanese (ja)
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JP5976406B2 (ja
JP2013258175A (ja
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Priority to JP2012131691A priority Critical patent/JP5976406B2/ja
Priority claimed from JP2012131691A external-priority patent/JP5976406B2/ja
Publication of JP2013258175A publication Critical patent/JP2013258175A/ja
Publication of JP2013258175A5 publication Critical patent/JP2013258175A5/ja
Application granted granted Critical
Publication of JP5976406B2 publication Critical patent/JP5976406B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012131691A 2012-06-11 2012-06-11 半導体発光装置 Active JP5976406B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012131691A JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012131691A JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2013258175A JP2013258175A (ja) 2013-12-26
JP2013258175A5 true JP2013258175A5 (enrdf_load_stackoverflow) 2014-12-18
JP5976406B2 JP5976406B2 (ja) 2016-08-23

Family

ID=49954394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012131691A Active JP5976406B2 (ja) 2012-06-11 2012-06-11 半導体発光装置

Country Status (1)

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JP (1) JP5976406B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
TWI583028B (zh) * 2016-02-05 2017-05-11 行家光電股份有限公司 具有光形調整結構之發光裝置及其製造方法
JP7295437B2 (ja) * 2019-11-29 2023-06-21 日亜化学工業株式会社 発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170998A (ja) * 2000-12-01 2002-06-14 Sharp Corp 半導体発光装置およびその製造方法
JP4400786B2 (ja) * 2004-06-11 2010-01-20 シチズン電子株式会社 発光ダイオード
TW200943590A (en) * 2008-01-22 2009-10-16 Alps Electric Co Ltd Led package and manufacturing method therefor
JP2009246353A (ja) * 2008-03-10 2009-10-22 Opt Link Co Ltd Ｌｅｄ低背光源装置及びｌｅｄ低背光源装置の製造方法

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