JP2013246610A - Electrostatic capacitance type touch panel substrate, display device and method of manufacturing electrostatic capacitance type touch panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic capacitance type touch panel substrate having an anti-reflection film on a transparent base material to thereby prevent an exterior appearance from being reflected onto a display surface and having excellent visibility, the electrostatic capacitance type touch panel substrate applying a cover glass integrated type and employing a coated metal material for a connection part or wiring to reduce a cost.SOLUTION: An electrostatic capacitance type touch panel substrate includes a transparent base material as a cover glass located on an outermost surface of a touch panel. One surface of the transparent base material includes: first transparent electrodes 1; second transparent electrodes 2; first connection portions 3 connecting between the first electrodes 1; second connection portions 4 connecting between the second electrodes 2; an insulation layer 5 formed between the first connection portions 3 and the second connection portions 4 at intersection portions therebetween; and extraction wiring 20 connected to the first transparent electrodes 1 and the second transparent electrodes 2. The other surface of the transparent base material includes an anti-reflection film.

Description

  The present invention relates to a capacitive touch panel substrate, a display device, and a method for manufacturing a capacitive touch panel substrate.

  The touch panel is a component of an input device that allows the operator to touch a transparent surface on the display screen with a finger or a pen to detect a touched position and input data. In recent years, it has become widely used because it enables intuitive input. In particular, the touch panel is often combined with a display panel such as a liquid crystal to input and output information in an integrated manner.

  The touch panel detection method includes a resistance film type, a capacitance type, an ultrasonic type, an optical type, and the like. Until now, the resistance film type, which was relatively excellent in terms of manufacturing cost, has been the mainstream. However, a resistive touch panel having a structure in which an air layer is provided between two transparent conductive films has low optical characteristics (for example, transmittance), and it cannot be said that durability and operating temperature characteristics are sufficient. Improvements have been sought.

On the other hand, capacitive touch panels that do not have moving parts have high optical characteristics (for example, transmittance), and are superior in resistance and operating temperature characteristics in terms of durability and operating temperature characteristics. Development is progressing toward the application (see, for example, Patent Documents 1 and 2).
The capacitive touch panel can be roughly classified into a surface type and a projected type, and a surface type is used for a large product of 10 type (25.4 cm size) or more. In many cases, a projection type is used for a small product of type 6 or less. A surface type with a simple electrode plate structure is likely to be large, but it is difficult to detect two or more contact points simultaneously. On the other hand, a projection type with a complicated electrode plate structure is disadvantageous for an increase in size, but two or more contact points can be detected simultaneously.

  In general, a projected capacitive touch panel substrate includes a first transparent electrode arranged in the x direction, a second transparent electrode arranged in the y direction, and a first transparent on a transparent substrate. The first connection part that joins the first connection part, the second connection part that joins the second transparent electrodes, and the first connection part and the second connection part intersect with each other. And an insulating layer for electrically insulating the second connection portion. In addition, on the transparent base material, extraction wiring connecting these transparent electrodes and control circuit is formed, and extraction wiring connecting to the control circuit to protect the transparent electrodes, connection parts and extraction wiring from corrosion and contact scratches. In many cases, a protective layer is formed and used so as to cover almost the entire surface other than the connection portion (see, for example, Patent Document 3).

  There are two types of projected capacitive touch panels: a film type using a resin film such as polyethylene terephthalate (PET) as a transparent substrate, and a glass type using non-alkali glass or soda glass. However, the glass type is often used for small products such as portable terminals because the transparency is inferior and the resistance of the transparent electrode on the film is high, so the electrode part cannot be made small. ing.

  Since the conventional glass-type touch panel uses two types of glass, a cover glass and a glass on which a touch panel sensor is formed, there is a problem that the material cost is high. On the other hand, a cover integrated touch panel has been proposed (see, for example, Patent Document 4). However, the cover-integrated touch panel has a visibility problem that an external appearance is reflected on the outermost surface thereof.

In addition, the formation of the transparent electrode, the connecting portion, the insulating layer, the lead-out wiring, and the protective layer described above requires a plurality of film forming and patterning steps, which requires a lot of manufacturing costs.
Molybdenum (Mo) / aluminum (Al) / molybdenum film (MAM) is generally used as the lead-out wiring because of its high conductivity and easy microfabrication, and MAM is formed by sputtering as the manufacturing process. Thereafter, a method of performing etching / resist peeling after a photolithography (hereinafter referred to as “photolitho”) process using a positive resist is widely used.

In addition, indium tin oxide (ITO) is generally used as the transparent electrode and the connecting portion because of its high transparency and excellent resistance value. Like the lead-out wiring, ITO is applied to the base material put into the vacuum vessel. A method of forming a protective film, etching, and removing a protective film after sputtering is widely used.
As a method for manufacturing the lead-out wiring at a low cost, a photolithography method using a conductive paste in which conductive powder such as silver is dispersed in an organic binder and has photosensitivity is known (for example, Patent Documents 5 and 6). reference). An etching method using an ink coating film in which conductive powder such as silver is dispersed is also known. By using the photolithographic method and the etching method, the extraction wiring and the transparent electrode can be produced at a lower cost than the vapor deposition method.
As another merit of the photolithographic method and the etching method, it is possible to obtain a conductive portion with high definition as compared with a printing method formed by screen printing or gravure offset printing.

JP 63-174120 A JP 2006-23904 A JP 2007-279819 A Special table 2011-526023 gazette Japanese Patent No. 4374653 Japanese Patent No. 3329723 Japanese Patent No. 4826007

  An object of the present invention is to provide a capacitive touch panel substrate that is inexpensive and excellent in visibility, and a display device including the substrate. Furthermore, it is providing the manufacturing method of the electrostatic capacitance type touch panel substrate which was cheap and excellent in visibility, and the electrostatic capacitance type touch panel substrate manufactured using the method.

  One aspect of the first aspect of the invention according to claim 1 is the capacitive touch panel substrate using a cover glass positioned on the outermost surface of the touch panel as a transparent base material, and at least (A) the first side of the transparent base material. One transparent electrode, (B) the second transparent electrode, (C) the first connection portion connecting the (A) first transparent electrode, and (D) the (B) second transparent electrode. A second connecting portion to be connected; (E) the insulating layer formed between the (C) first connecting portion and the (D) second connecting portion; and (F) the (A) first connecting portion. And (B) a lead-out wiring connected to the second transparent electrode, and (G) an antireflection film on the other surface of the transparent substrate. This is a capacitive touch panel substrate.

One aspect of the second invention according to claim 2 is that at least one of the (D) second connecting portion and the (F) extraction wiring is Au, Ag, Cu, Al, Mo, Pd, Pt, It is a capacitive touch panel substrate characterized by being formed of a metal material composed of one or more elements selected from the group of C and Fe.
One aspect of the third aspect of the present invention according to claim 3 is a display device including the above-described capacitance type touch panel substrate.
One aspect of the fourth invention according to claim 4 is the method of manufacturing a capacitive touch panel substrate as described above, wherein the (G) antireflection film is formed by a vacuum deposition method, an ion assist deposition method, an ion plate. A method of manufacturing a capacitive touch panel substrate, wherein the film is formed by at least one method selected from the group consisting of a deposition deposition method, a sputtering method, and a CVD method.

One aspect of the fifth invention according to claim 5 is the method of manufacturing a capacitive touch panel substrate as described above, wherein the antireflection film (G) is formed by a spin coating method, a roll coating method, or a spray coating method. And forming a film by one or more methods selected from the group consisting of a dip coating method, a bar coating method, a screen printing method, and a flexographic printing method.
One aspect of the sixth invention according to claim 6 is a capacitive touch panel substrate manufactured by the manufacturing method described above.

According to the present invention, it is possible to provide a capacitive touch panel substrate having good visibility by preventing an appearance from being reflected on a display surface by having an antireflection film on a transparent substrate.
Furthermore, an inexpensive electrostatic capacitance type touch panel substrate can be provided by being a cover glass integrated type and using a coating-type metal material for a connection part and wiring.
In addition, a display device with favorable visibility can be provided by including the capacitance touch panel substrate.

After the first transparent electrode, the second transparent electrode, and the first connection portion connecting the first transparent electrode were formed, the second connection portion and the extraction wiring were simultaneously formed through the insulating layer, The plane schematic diagram which shows an example of an electrostatic capacitance type touch panel. After the second connecting portion and the extraction wiring are formed at the same time, the first connecting portion connecting the first transparent electrode through the first transparent electrode, the second transparent electrode, and the insulating layer is formed, The plane schematic diagram which shows an example of an electrostatic capacitance type touch panel. The projection schematic diagram (a) which shows an example of a cover glass integrated capacitive touch panel, and the cross-sectional schematic diagram (b) which show an example of the capacitive touch panel board | substrate which has an antireflection film.

A method for manufacturing a projected capacitive touch panel substrate according to the present invention and a touch panel substrate manufactured using the same will be described in detail based on the embodiments thereof. In addition, the touch panel board | substrate of this invention is not limited to the following structures, unless the summary is exceeded.
≪Projected capacitive touch panel substrate≫
1 and 2 are plan views of the touch panel substrate through the protective film 6. Here, FIG. 1 and FIG. 2 are examples in which the positional relationship among the first connection portion 3, the second connection portion 4, and the insulating layer 5 is different.
As shown in FIG. 1, the projected capacitive touch panel substrate of the present embodiment includes a first transparent electrode 1, a second transparent electrode 2, a first connection portion 3, and a second connection on a transparent substrate 10. Connecting portion 4, insulating layer 5, and lead-out wiring 20. The insulating layer 5 is disposed in order to prevent and insulate the second connecting portion 4 orthogonal to the first connecting portion 3. Note that a frame layer 7 such as black or white may be provided between the transparent substrate 10 and the extraction wiring 20 for the purpose of making the extraction wiring 20 invisible.

FIG. 1 shows a structure in which the first connecting portion 3 is formed in the lowermost layer, the insulating layer 5 is provided thereon, and the second connecting portion 4 is formed on the insulating layer 5. 2, the second connecting portion 4 may be formed in the lowermost layer, and the insulating layer 5 may be provided thereon, and the first connecting portion 3 may be formed on the insulating layer 5. The first connection portion 3 and the second connection portion 4 may be in either the x direction or the y direction with respect to the transparent substrate 10.
Although it does not specifically limit as the transparent base material 10, For example, glass plates, such as a soda lime glass, a low alkali borosilicate glass, an alkali free alumino borosilicate glass, or a polyethylene terephthalate (PET), a triacetyl cellulose ( A plastic plate or plastic film made of TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), or the like is used.

FIG. 3A is a diagram showing the structure of a cover glass integrated projection type capacitive touch panel substrate using a cover glass as the transparent base material 10.
FIG. 3B is a view showing the structure of the cover glass integrated projection type capacitive touch panel substrate of this embodiment having the antireflection film 50. By having the antireflection film 50 on the surface of the transparent base material 10, it is possible to prevent the appearance from being reflected on the display surface.

  As the transparent base material 10, a special glass plate such as aluminosilicate glass (for example, trade name “Gollira (manufactured by Corning)”, “Dragontrail (manufactured by Asahi Glass)”) or chemically strengthened soda lime glass is used. These can be used as glass that doubles as both a cover glass and a glass on which a touch panel sensor is formed. In order to provide both the frame layer 7 (not shown in FIG. 3 and located between the transparent base material 10 and the extraction wiring 20 in FIG. 1 and FIG. 2) and the touch panel sensor 40 on one glass. The number of parts for one glass can be reduced, and a touch panel can be manufactured at low cost.

  The first transparent electrode 1 and the second transparent electrode 2 are not particularly limited as long as the first transparent electrode 1 and the second transparent electrode 2 can be disposed on the surface of the transparent substrate 10, such as ITO and zinc oxide (ZnO). An organic conductive material such as an inorganic conductive material, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), polyaniline, polypyrrole, or the like can be used. These materials may be used alone or in combination of two or more. Among these, it is preferable to use ITO in terms of transparency and resistance value.

  In the case of the structure shown in FIG. 1, that is, the first connection portion 3 is a connection portion for connecting the adjacent first transparent electrodes 1 arranged in the x direction with respect to the transparent substrate 10. Are formed simultaneously with the first transparent electrode 1 using the same transparent conductive material as the material of the first transparent electrode 1. In other words, when the first transparent electrode 1 is formed, the first connecting portion 3 is also formed at the same time, which means that a continuous transparent electrode pattern is formed without interruption in the x direction.

Furthermore, although the 2nd transparent electrode 2 arranged in the y direction with respect to the transparent base material 10 is also formed simultaneously with the 1st transparent electrode 1 and the 1st connection part 3, the 2nd transparent electrode 2 Is not formed at the same time as the second connection portion 4, the state is not yet connected in the y direction at this point.
The second connection portion 4 is formed so as not to be in direct contact with the first connection portion 3 by laminating the insulating layer 5 therebetween. Moreover, in the example shown in FIG. 1 and FIG. 2, the connection part of the x direction with respect to the transparent base material 10 is the first connection part 3, and the connection part of the y direction is the second connection part 4. As described above, the x direction and the y direction may be reversed.

  As with the materials of the first transparent electrode 1 and the second transparent electrode 2, the second connection portion 4 is made of an inorganic conductive material such as ITO or zinc oxide (ZnO), polyethylenedioxythiophene / polystyrenesulfonic acid ( Organic conductive materials such as PEDOT / PSS), polyaniline, and polypyrrole can be used. Conventionally, ITO has been preferably used from the viewpoint of permeability and resistance value, but Au (gold), Ag (silver), Cu (copper), Al (aluminum), Mo (molybdenum), Pd (palladium), Pt Metals such as (platinum), C (carbon), and Fe (iron) can be used as long as visibility is not hindered by fine processing. By forming a conductive paste or conductive ink containing these metals by a wet method, the second connection portion 4 can be obtained by a process that is cheaper than the vapor deposition method.

  Conventionally, MAM is generally used as the lead-out wiring 20 because it is highly conductive and easy to finely process. However, Au (gold), Ag (silver), Cu (copper), Al (aluminum), Metals such as Mo (molybdenum), Pd (palladium), Pt (platinum), C (carbon), and Fe (iron) can also be preferably used. By forming a conductive paste or conductive ink containing these metals by a wet method, the extraction wiring 20 can be obtained by a process that is cheaper than the vapor deposition method.

Moreover, when the 2nd connection part 4 and the extraction wiring 20 are made from the same material, since these can be formed simultaneously, manufacturing cost becomes cheaper.
The insulating layer 5 and the protective film 6 can be formed using known materials conventionally used for insulating layers and protective films. For example, inorganic films such as SiO ₂ and SiN _x and organic materials such as transparent resins are used. Can be mentioned. Since inorganic films are formed of SiO ₂ or SiN _x by a CVD method, a sputtering method, or the like, there is a problem that the manufacturing cost becomes high, such as an increase in energy consumption and the number of processes. Organic materials are preferably used. As the organic material, a UV curable coating composition containing a polymerizable group-containing oligomer, monomer, photopolymerization initiator and other additives can be used.

The material constituting the antireflection film 50 in this embodiment is not particularly limited as long as it satisfies the relationship of the refractive index, whether it is an organic material or an inorganic material, but is preferably a ceramic thin film, oxide, sulfide. , Fluorides, nitrides and other materials can be used. The thin film made of the above-mentioned inorganic compound has a different refractive index depending on the material, and a plurality of ceramic thin films having different refractive indexes can be laminated to have a specific film thickness to form an antireflection film.
Examples of the material having a low refractive index include silicon dioxide (1.5), magnesium fluoride (1.4), calcium fluoride (1.3 to 1.4), and aluminum fluoride (1.3).

Moreover, as a material with a high refractive index, titanium dioxide (2.4), zirconium dioxide (2.0), zinc sulfide (2.3), tantalum oxide (2.1), zinc oxide (2.1), Indium oxide (2.0) is mentioned. (For example, see Patent Document 7)
As materials having a refractive index between these low refractive index materials and high refractive index materials, magnesium oxide (1.6), silicon nitride (1.7) cerium fluoride (1.6), and the like can be given. However, the numerical value in the parenthesis represents the refractive index.

  These materials include vacuum deposition methods, ion-assisted deposition methods, ion plating deposition methods, sputtering methods, CVD methods and other deposition methods, spin coating methods, roll coating methods, spray coating methods, dip coating methods, bar coating methods, The film is formed by a wet method such as a screen printing method or a flexographic printing method. These materials may be used alone or in combination of two or more. When the content ratio of the material to be combined is changed, the internal structure of the obtained film can be changed, and the refractive index can be adjusted.

<Method of manufacturing capacitive touch panel substrate>
As the first transparent electrode 1, the second transparent electrode 2, and the first connection part 3, ITO that is generally used in many cases is suitable, but is not limited. Depending on the specific specifications of the capacitive touch panel function, the characteristics of ITO and the characteristics as a transparent electrode pattern are selected. For example, as an ITO film, a film having a film thickness of 30 nm and a sheet resistance value of about 100Ω / □ is formed by a thin film forming unit of a sputtering apparatus. Next, a resist pattern is formed by a photolithographic method including a series of steps of resist coating, exposure, and development using an etching-resistant photosensitive resin. Thereafter, a pattern is formed through ITO etching and a resist peeling process. For example, as the first connection portion 3, a large number of patterns having a width of 50 μm to 100 μm and a length of 200 μm to 500 μm are formed.

  ITO is generally used as the second connection portion 4 and MAM is generally used as the lead-out wiring 20, but the aforementioned Au (gold), Ag (silver), Cu (copper), Al (aluminum), Mo (molybdenum), Metals such as Pd (palladium), Pt (platinum), C (carbon), and Fe (iron) can be used as long as visibility is not hindered by fine processing.

The insulating layer 5 is formed so as to cover a range including the effective area of the first connection portion 3 or the second connection portion 4. As a manufacturing method of the insulating layer 5, an insulating function can be obtained by forming a SiO ₂ film with a thickness of 100 nm or more. However, as an easier manufacturing method, an organic insulating film can also be formed by a photolithography method. For example, a photosensitive organic insulating film material having a refractive index of 1.53 and a volume resistivity of 2 × 10 ¹⁵ Ω · cm is dried by a coating method such as spray coating, spin coating, slit die coating, roll coating, or bar coating. It is applied so that the film thickness is 0.2 to 10 μm, more preferably 0.5 to 5 μm. After application to the transparent substrate 10, pre-baking is performed as necessary to evaporate the organic solvent. For pre-baking, a hot air circulation oven, a hot plate, or an IR oven can be used. If necessary, the dried film is exposed through a mask having a predetermined pattern provided in contact with or not in contact with the film. The kind of the light beam at the time of exposure is not particularly limited, and examples thereof include visible light, ultraviolet rays, far infrared rays, electron beams, X-rays, etc. Among them, ultraviolet rays are preferable. Is not particularly limited illuminance of the light beam is preferably 5~150mW / cm ² at 365 nm, and particularly preferably 15~35mW / cm ^2.

  Then, if necessary, the film is immersed in an aqueous alkaline developer such as sodium carbonate or sodium hydroxide, or sprayed with a developer or the like to remove uncured portions and form a desired pattern. Furthermore, in order to accelerate the polymerization of the photosensitive composition to form a film, heating (so-called post-baking) is performed as necessary. A pattern is formed through these steps, and a patterned insulating layer 5 having a transmittance exceeding 97% can be obtained.

  If necessary, the protective film 6 is provided with an effective area of the first transparent electrode 1, the second transparent electrode 2, the first connection part 3, the second connection part 4, the insulating layer 5, and the extraction wiring 20. It is formed over the range to include. The protective film 6 can be formed using the materials and methods described in the description of the insulating layer 5 so that the dry film thickness is 0.5 to 20 μm, more preferably 1.0 to 10 μm. In addition, since the protective film 6 forms the outermost layer of the capacitive touch panel substrate, it is desirable that the protective film 6 be disposed as wide as possible to serve as a planarization layer. Moreover, the structure which overlaps with a part of metal layer used as the formed terminal electrode is also possible.

The antireflection film 50 is formed on the transparent substrate 10 by a vapor deposition method or a wet method.
For example, examples of the vapor deposition method include a vacuum vapor deposition method, an ion assist vapor deposition method, a sputter vapor deposition method, an ion plating vapor deposition method, and a CVD method. The vapor deposition method is an excellent method in that a multi-layered film of a nano-level thin film can be formed, but the size of the substrate is limited, and there is a problem that the production cost is high because it is not suitable for continuous production. .

Examples of the wet method include a spin coating method, a roll coating method, a spray coating method, a dip coating method, a bar coating method, a screen printing method, and a flexographic printing method. While these methods are less expensive than vapor deposition methods, it is difficult to control the coating property to the substrate, and thus there is a problem that problems such as color unevenness and film thickness variations are likely to occur.
The refractive index suitable for the antireflection film 50 is obtained by the following calculation formula.
N ₁ = (N ₂ ) ^1/2 (N ₁ : refractive index of the antireflection film 50, N ₂ : refractive index of the transparent substrate 10) (Equation 1)

Equation 1 represents a non-reflective condition. For example, when the refractive index N ₂ ≈1.5 of the aluminosilicate glass that is the transparent substrate 10 of the present embodiment is substituted, N ₁ ≈1.2 is obtained.
Therefore, a low refractive material is suitable for the antireflection film 50. Specifically, silicon dioxide (1.5), magnesium fluoride (1.4), calcium fluoride (1.3 to 1.4), aluminum fluoride (1.3) and the like can be preferably used. . These materials may be used alone or in combination of two or more.

<Metal nanoparticle dispersion>
The metal nanoparticle dispersion liquid used in the present embodiment is not particularly limited as long as it can form the lead-out wiring 20 and the connection portions 3 and 4 of the present embodiment. For example, (H) silver powder, (I) a metal nanoparticle dispersion containing a solvent can be used as an example of the present metal nanoparticle dispersion, and may contain other dispersants and additives as necessary. it can. The lead-out wiring 20 constituting the capacitive touch panel substrate of the present embodiment is formed by etching / resist peeling after applying a metal nanoparticle dispersion on the transparent base material 10, passing through a photolithography process using a positive resist.

  It is preferable that the average particle diameter of (H) silver powder of the metal nanoparticle dispersion liquid used for this embodiment is 1-500 nm. An average particle diameter of 500 nm or more is not preferable because linearity and pattern accuracy in a fine pattern are deteriorated. Moreover, the contact area of the metal nanoparticles increases as the particle size decreases. For this reason, electroconductivity is impaired as a particle size is 500 nm or more. Moreover, as content of (H) silver powder, 10-60 weight% is preferable on the basis of the total solid content of a metal nanoparticle dispersion liquid, More preferably, it is 20-50 weight%. (H) If the added amount of silver powder is 10% by weight or less, it is difficult to form a fine pattern due to a decrease in silver concentration. If it is 60% by weight or more, it is difficult to maintain the silver dispersion state.

Examples of the (I) solvent of the metal nanoparticle dispersion used in this embodiment include water, ethanol, methanol, ethanol, isopropyl alcohol, ethylene glycol-based polyhydric alcohols, cyclohexanone, propylene glycol monomethyl ether acetate, and the like. These can be used alone or in combination. (I) The amount of the solvent added is preferably in the range of 40 to 90% by weight based on the total amount of the metal nanoparticle dispersion.
After applying the metal nanoparticle dispersion liquid used in the present embodiment to the base material, heat treatment is performed in a hot-air circulation oven, so that the nanoparticles are melted and the dispersant and additive are decomposed so that the conductivity is improved. To express. When the heat treatment is performed at a high temperature, the metal nanoparticles can be fused in a short time, but the heating temperature is preferably 150 ° C. to 250 ° C. in order not to cause decomposition of the insulating film.

<The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using a metal nanoparticle dispersion liquid>
The manufacturing method of the 2nd connection part 4 and the extraction wiring 20 using the metal nanoparticle dispersion liquid in this embodiment is demonstrated below.
Examples of the method for applying the metal nanoparticle dispersion liquid to the transparent substrate 10 include a pin coating method, a slit coating method, a roll coating method, a die coating method, a bar coating method, and a screen printing method. After application to the transparent substrate 10, pre-baking is performed as necessary to evaporate the organic solvent. For pre-baking, a hot air circulation oven, a hot plate, or an IR oven can be used.

After apply | coating a metal nanoparticle dispersion liquid to the transparent base material 10, it heat-processes to a hot-air circulation type oven, and is set as a silver thin film. A positive resist is applied on the obtained silver thin film, and pattern exposure is performed through a photomask corresponding to the desired second connection portion 4 and extraction wiring 20. A normal high-pressure mercury lamp may be used as the exposure light source. The exposure amount is preferably about 10 to 200 mJ / cm ² from the viewpoint of tact time.

Development is performed following exposure. An alkaline aqueous solution is used as the developer. As an example of the alkaline aqueous solution, a tetramethylammonium hydroxide aqueous solution or a potassium hydroxide aqueous solution is preferably used, but a sodium carbonate aqueous solution, a sodium hydrogen carbonate aqueous solution, a mixed aqueous solution of both, or a surfactant suitable for them. You may use what added.
Etching is performed following development. An acidic aqueous solution is used as the etching solution. Examples of the acidic aqueous solution include nitric acid, acetic acid, hydrochloric acid, phosphoric acid, oxalic acid, and the like. These can be used alone or in admixture of two or more.
Following the etching, the positive resist is peeled off, and the second connection portion 4 and the extraction wiring 20 are obtained. An organic alkaline solution is used as the stripping solution, and an organic solution containing silicate is preferably used.

≪Display device≫
The display device according to the present embodiment is a display device (not shown) having the above-described projected capacitive touch panel substrate. Since the display device according to the present embodiment has the above-described projected capacitive touch panel substrate, a display device with good visibility can be provided.

[Example]
Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited thereto without departing from the spirit of the present invention.
<Manufacture of cover glass integrated capacitive touch panel substrate>
[Example 1]
On the aluminosilicate glass, a silver nanoparticle dispersion liquid (particle size: 10 to 30 nm) manufactured by Toxen Industry Co., Ltd. was applied by spin coating, and heat treatment was performed at 235 ° C. for 18 minutes in a hot air circulation oven. A 0.25 μm silver thin film was prepared. A positive resist was spin-coated on the silver thin film and dried on a hot plate at 100 ° C. for 5 minutes to dry the coating film. Thereafter, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then shower development was performed with a mixed aqueous solution of sodium hydroxide and sodium carbonate. After washing with water, post-baking is performed, wet etching is performed using an etching solution SEA-5 (manufactured by Kanto Chemical Co., Inc.), the resist is removed using an aqueous potassium hydroxide solution, and the second connection portion 4 and the extraction wiring 20 are removed. Was made. The obtained second connection portion 4 was 4 μm wide × 200 μm long. The sheet resistance of the silver thin film was 0.1Ω / □.

Next, a negative resist (NN901 manufactured by JSR) was applied by spin coating, and dried at 100 ° C. for 5 minutes on a hot plate to dry the coating film. Then, using a high-pressure mercury lamp as a light source, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² , and then shower development was performed for 30 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. did. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form the insulating layer 5. The insulating layer 5 has a width of 60 μm × length of 120 μm so as to cover only the effective portion of the second connection portion 4.

Subsequently, an ITO film with a film thickness of 30 nm was formed by a sputtering apparatus, a positive resist (LC100-10 cp manufactured by Rohm and Haas Electronic Materials) was spin-coated, and dried at 100 ° C. for 5 minutes on a hot plate, The coating film was dried. Thereafter, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² using a high-pressure mercury lamp as a light source, and then a 2.3 wt% tetramethylammonium hydroxide aqueous solution was used at 23 ° C. at 60 ° C. Shower development was performed for 2 seconds. After washing with water, wet etching is performed using an etching solution composed of oxalic acid (ITO etching solution manufactured by Mizuho Chemical Co., Ltd.), and the resist is removed using a 2% potassium hydroxide resist stripping solution. A heat treatment was performed at 230 ° C. for 30 minutes to form the first transparent electrode 1, the second transparent electrode 2, and the first connection portion 3. The sheet resistance of the ITO film was 100Ω / □.

Further, a negative resist (NN901 manufactured by JSR) was applied by spin coating, dried on a hot plate at 100 ° C. for 5 minutes, and the coating film was dried. Then, using a high-pressure mercury lamp as a light source, exposure was performed through a photomask having a desired opening at 100 mJ / cm ² , and then shower development was performed for 30 seconds with a 0.2 wt% aqueous sodium bicarbonate solution. did. After washing with water, heat treatment was performed at 230 ° C. for 30 minutes in a hot air circulation oven to form the protective layer 6 to obtain a capacitive touch panel substrate. The insulating layer 5 was formed so as to cover the entire region 2 mm inside from the glass edge of the touch panel substrate, excluding the connection part connected to the extraction wiring 20 and the control circuit, to obtain a cover glass integrated touch panel.

An antireflection film comprising a SiO ₂ film is formed by depositing TEOS (tetraethoxysilane) in an oxygen plasma atmosphere by a plasma CVD method on the surface opposite to the side having the touch panel sensor 40 of the obtained cover glass integrated touch panel. 50 was obtained. The obtained SiO _{2 had} a thickness of 90 nm and a refractive index of 1.47. The cover glass integrated touch panel 100 was obtained through the above steps.
In addition, one side of the aluminosilicate glass was black-treated, and an SiO ₂ film was produced on the other side by the CVD method, whereby a reflectance evaluation substrate 101 was obtained.

[Example 2]
The cover glass integrated touch panel 200 was obtained through the same process as in Example 1.
A-2014 made by Nissan Chemical Co., Ltd. is spin-coated on the surface opposite to the side having the touch panel sensor 40 of the obtained cover glass integrated touch panel 200, and dried on a hot plate at 100 ° C. for 5 minutes. The membrane was dried. Then, after performing exposure at 50 mJ / cm ² using a high-pressure mercury lamp as a light source, a heat treatment is performed at 230 ° C. for 30 minutes in a hot-air circulating oven, and the reflection is made of a SiO ₂ —TiO ₂ composite film. The prevention film 50 was obtained. The SiO ₂ —TiO ₂ composite film had a thickness of 100 nm and a refractive index of 1.46. The cover glass integrated touch panel 200 was obtained through the above steps.
Moreover, one side on the aluminosilicate glass was black-treated, and an A-2014 film was produced on the other side by the above-described coating method to obtain a reflectance evaluation substrate 201.

[Comparative Example 1]
The process of the antireflection film 50 of Example 1 was omitted, and the cover glass integrated touch panel 300 was obtained.
In addition, one side of the aluminosilicate glass was black-treated to obtain a reflectance evaluation substrate 301.

[Visibility evaluation method]
<Reflectance evaluation>
The reflectance evaluation of the obtained reflectance evaluation substrates 101, 201, and 301 was performed. The measuring device used was a Hitachi High-Tech U-4000 with an integrating sphere attached. Table 1 shows the results of calculating the average reflectance of 400 to 800 nm.
<Appearance reflection evaluation>
When the obtained cover glass-integrated touch panels 100, 200, and 300 were viewed by changing the angle in the interior of the fluorescent lamp illumination, the reflection of the appearance was evaluated visually.
○ ・ ・ ・ The outline of the reflected image of the appearance is blurred and not clearly observed. × ・ ・ ・ The reflection of the appearance is clearly visible. ○ is the usable level. The evaluation results are shown in Table 1.

  By having the antireflection film 50 according to Examples 1 and 2, the reflectance could be reduced. Regardless of the film forming method, the anti-reflection film 50 can be provided to obtain a capacitive cover-integrated touch panel with less appearance reflection on the display surface.

DESCRIPTION OF SYMBOLS 1 ... 1st transparent electrode 2 ... 2nd transparent electrode 3 ... 1st connection part 4 ... 2nd connection part 5 ... Insulating layer 6 ... Protective film 7 ... Frame layer 10 ... Transparent base material 20 ... Extraction wiring 40 ... Touch panel sensor 50 ... Antireflection film

Claims (6)

In the capacitive touch panel substrate with the cover glass located on the outermost surface of the touch panel as a transparent substrate,
At least on one side of the transparent substrate, (A) a first transparent electrode, (B) a second transparent electrode, and (C) a first connection portion connecting the (A) first transparent electrode, (D) formed between the (B) second connecting portion connecting the second transparent electrodes, (E) the (C) first connecting portion and the (D) second connecting portion intersecting. An insulating layer, and (F) the (A) first transparent electrode and the (B) extraction wiring connected to the second transparent electrode,
A capacitive touch panel substrate comprising (G) an antireflection film on the other surface of the transparent substrate.   At least one of the (D) second connection portion and the (F) extraction wiring is made of one or more elements selected from the group consisting of Au, Ag, Cu, Al, Mo, Pd, Pt, C, and Fe. The capacitive touch panel substrate according to claim 1, wherein the capacitive touch panel substrate is formed of a metal material.   A display device comprising the capacitive touch panel substrate according to claim 1. It is a manufacturing method of the capacitance type touch panel substrate according to claim 1 or 2,
The antireflection film (G) is formed by one or more methods selected from the group consisting of a vacuum deposition method, an ion assist deposition method, an ion plating deposition method, a sputtering method, and a CVD method. A method of manufacturing a capacitive touch panel substrate. It is a manufacturing method of the capacitance type touch panel substrate according to claim 1 or 2,
The antireflection film (G) is formed by one or more methods selected from the group consisting of spin coating, roll coating, spray coating, dip coating, bar coating, screen printing, and flexographic printing. A method for manufacturing a capacitive touch panel substrate, comprising:   A capacitive touch panel substrate manufactured by the manufacturing method according to claim 4.

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