JP2013243200A - Measuring device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring device which can measure the height of a measurement section in a mounting component rapidly with a high degree of accuracy.SOLUTION: A distance sensor 12 is moved in the direction which is parallel to a substrate surface 31 and along predetermined scanning lines (L1-L3) by an orthogonal robot. A measurement signal is outputted to the distance sensor 12 by a control circuit, whenever the distance sensor 12 moves for a predetermined distance, on the basis of the movement amount of the distance sensor 12 which is measured by an encoder. When a formation waveform is generated in which the height from the substrate surface 31 which is obtained from relative distance measured by the distance sensor 12 is determined as a vertical axis and a scanning position is determined as a horizontal axis, the measurement height of a press face 45a of each of connector pins 42a-42c is calculated from the height from the substrate surface 31 corresponding to the scanning position of the press face 45a, on the basis of the formation waveform.

Description

  The present invention relates to a measuring apparatus that measures the height of a measurement site in a mounting component mounted on a substrate.

  Conventionally, a mounting inspection apparatus disclosed in Patent Document 1 below is known as a technique related to a measuring apparatus that measures the height of a measurement site in a mounted component mounted on a substrate. This mounting inspection apparatus automatically inspects using an image of a tip portion of a terminal, which is an inspection portion of a press-fit press-fit connector. Specifically, an image of the inspection portion of the press-fit connector press-fitted into the printed wiring board is picked up by applying light from the light emitting means from the lower surface of the printed wiring board, and a portion corresponding to the inspection portion of the captured image is configured. Each pixel is binarized into a white portion and a black portion, and if the number of pixels in the white portion is equal to or greater than a certain number, it is determined as a non-defective product.

JP 2010-062294 A

  However, in the configuration in which the mounting component is imaged as described above, there is a problem that the height of the measurement site in the mounting component cannot be accurately detected even if the presence or absence of the mounting component or the terminal can be detected. For example, if a pin is press-fitted in a semi-fitted state with respect to a through hole or the like on the substrate surface, it may be determined that the mounting state is determined to be appropriate. In addition, in the configuration in which the mounted component is imaged, there is a problem that the measurement result may not be stable because sufficient reflected light cannot be obtained due to the influence of disturbance light caused by the installation location of the measurement apparatus.

  Therefore, a method of individually measuring the height of the measurement site using a non-contact type distance sensor such as a laser type or an eddy current type can be considered. However, if there are many measurement parts, move the distance sensor to the measurement position, wait for attenuation of the vibration of the distance sensor due to the stop after the movement, and actually measure each step. Since it is necessary to repeat only, the measurement time becomes long. In order to shorten the measurement time, when the distance sensor is continuously moved at high speed using a high-speed SCARA robot or the like, if a speed fluctuation occurs during measurement such as the start of movement, a part different from the part to be measured is measured. There is a problem that measurement is performed as a part, and erroneous measurement or measurement leakage occurs.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a measuring apparatus capable of measuring the height of a measurement site in a mounted component quickly and with high accuracy. .

In order to achieve the above object, the invention described in claim 1 of the claims includes one or more mounted on the substrate surface (31) of the substrate (30) mounted on the mounting surface (11). Apparatus for measuring the height from the reference plane (31) of a plurality of measurement sites (45a) positioned on a predetermined scanning line (L1 to L3) with respect to the mounted component (40) as a measurement height (H) (10) A distance sensor (12) for measuring a relative distance from an object located anywhere on the predetermined scanning line according to an input measurement signal, and the distance sensor with respect to the reference plane Moving means (20) movable in the scanning direction along the predetermined scanning line, moving amount measuring means (13) for measuring the moving amount of the distance sensor moved by the moving means, Based on the movement amount measured by the movement amount measuring means. And a control means (14) for outputting the measurement signal to the distance sensor each time the distance sensor moves a predetermined distance, and a height from the reference plane obtained from the relative distance measured by the distance sensor. Generating means (14) for generating a waveform (S) having the scanning position as an axis and a scanning position as a horizontal axis, and from the reference plane corresponding to the scanning position of the measurement site based on the waveform generated by the generating means And a calculation means (14) for calculating the measurement height of the measurement site from the height.
In addition, the code | symbol in the parenthesis of a claim and the said means shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  According to the first aspect of the present invention, the distance sensor is moved in the direction along the predetermined scanning line by the moving means in a direction parallel to the reference plane, and based on the movement amount of the distance sensor measured by the movement amount measuring means. Every time the distance sensor moves a predetermined distance, a measurement signal is output to the distance sensor by the control means. Then, when the generation unit generates a waveform with the height from the reference plane obtained from the relative distance measured by the distance sensor as the vertical axis and the scanning position as the horizontal axis, based on this waveform, the measurement site is scanned. The measurement height of the measurement site is calculated by the calculation means from the height from the reference plane corresponding to the position.

As described above, the waveform is generated by measuring the relative distance for each predetermined distance. Therefore, the generated waveform is a plane including a scanning line along the measurement direction of the distance sensor, excluding time elements. The line segment shape including the line segment corresponding to the measurement site and the reference plane on the cut surface obtained by cutting the substrate is similar. That is, the generated waveform is generated as a waveform that does not affect the speed fluctuation even if the distance sensor is continuously moved at a high speed.
Therefore, by calculating the measurement height of the measurement site based on the generated waveform, the height of the measurement site in the mounted component can be measured quickly and with high accuracy.

It is a perspective view which shows schematic structure of the measuring apparatus which concerns on 1st Embodiment. It is a block diagram which shows the main electrical structures of a measuring apparatus. It is a perspective view which expands and shows the connector mounted in the board | substrate surface. It is sectional drawing which shows the state in which the connector pin was press-fit in the through hole. FIG. 5A is an explanatory diagram for explaining the sampling interval when the sampling time is constant and the distance sensor is moved at a high speed, and FIG. 5B shows the change in the sensor moving speed in FIG. It is a graph to show. It is explanatory drawing explaining the scanning direction of the distance sensor with respect to a connector. It is explanatory drawing explaining the measurement state which moves a distance sensor at high speed and samples every fixed distance. It is explanatory drawing which shows an example of the production | generation process of the production | generation waveform from which the element of time was excluded. It is explanatory drawing which expands and shows a part of produced | generated generated waveform. It is explanatory drawing explaining the principal part of the measuring apparatus which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, a first embodiment in which a measuring apparatus according to the present invention is embodied will be described with reference to the drawings. The measuring apparatus 10 shown in FIG. 1 measures the height from the substrate surface 31 of a plurality of measurement parts located on a predetermined scanning line with respect to one or more mounted components mounted on the substrate surface 31 of the substrate 30. It is a device that continuously measures the height. As shown in FIGS. 1 and 2, the measurement apparatus 10 mainly includes a table on which a measurement target such as a substrate 30 is placed on the placement surface 11, a distance sensor 12, an orthogonal robot 20, and an encoder 13. And a control circuit 14 that performs overall control.

  The distance sensor 12 is a laser displacement sensor, and the measurement site is based on the timing of receiving reflected light from the measurement site in accordance with the irradiated laser beam with respect to the measurement target placed on the placement surface 11. It is a sensor that measures the relative distance between. The distance sensor 12 is fixed to a moving member 21a (to be described later) of the orthogonal robot 20 so as to sequentially measure the relative distance while moving on a predetermined scanning line according to the operation of the orthogonal robot 20. The distance sensor 12 measures the relative distance according to the timing of the measurement signal input from the control circuit 14, and a signal corresponding to the measurement result is amplified by the sensor amplifier 12a and input to the control circuit 14. It is configured.

  The orthogonal robot 20 includes a first rectilinear moving unit 21 having a moving member 21a that can move linearly in the X direction, and a moving member 22a that is arranged on the moving member 21a and is movable in the Y direction orthogonal to the moving member 21a. And a second linearly moving unit 22 having the same. The first linear movement unit 21 includes a first motor 21b. The first motor 21b is driven by a motor driver 23 and is assembled to the movement member 21a so as to move the movement member 21a in the X direction. Yes. The second rectilinear movement unit 22 includes a second motor 22b. The second motor 22b is driven by the motor driver 24 and is assembled to the moving member 22a so as to move the moving member 22a in the Y direction. It has been. The orthogonal robot 20 may correspond to an example of a “moving unit” described in the claims.

  The encoder 13 is a measuring unit that measures the relative X-direction movement amount of the moving member 21a with respect to the placement surface 11, that is, the X-direction movement amount of the distance sensor 12, and is assembled to the moving member 21a that is a measurement target. Yes. The encoder 13 is configured to output a predetermined pulse signal to the control circuit 14 via the line driver 13a every time the distance sensor 12 moves a certain distance. The encoder 13 may correspond to an example of a “movement amount measuring unit” described in the claims.

  The control circuit 14 is composed of a microcomputer composed of a CPU, a ROM, a RAM, and the like, and peripheral circuits. The control circuit 14 controls the motor drivers 23 and 24 by performing measurement processing described later, thereby controlling the first motor 21b. And the distance sensor 12 is moved on a predetermined scanning line by driving the second motor 22b. The control circuit 14 calculates the height from the substrate surface 31 of each measurement site located on the predetermined scanning line according to the signals input from the distance sensor 12 and the encoder 13 during the movement control. . The control circuit 14 may correspond to an example of “control means” recited in the claims.

  Next, each connector pin 42a-42c of the connector 40 mounted in the board | substrate 30 used as the measuring object in this embodiment is demonstrated using FIG. 3 and FIG. FIG. 3 is an enlarged perspective view showing the connector 40 mounted on the board surface 31. FIG. 4 is a cross-sectional view showing a state where the connector pin 42a is press-fitted into the through hole 32a. The substrate surface 31 may correspond to an example of a “reference surface” recited in the claims, and the connector 40 may correspond to an example of a “mounting component” recited in the claims.

  A connector 40 shown in FIG. 3 is a press-fit connector, and includes a connector main body 41 and a plurality of substantially L-shaped connector pins whose one ends are connected to an end surface 41 a of the connector main body 41. A plurality of through holes 32a arranged in a straight line along the end surface 41a in the vicinity of the end surface 41a of the assembled connector main body 41 are opposed to the end surface 41a through the through holes 32a. Thus, a plurality of through holes 32b arranged in a straight line and a plurality of through holes 32c arranged in a straight line so as to face the end surface 41a via each through hole 32b are formed. That is, the array line in which the through holes 32a are arranged is closest to the end surface 41a, the array line in which the through holes 32c are arranged is farthest from the end surface 41a, and the array line in which the through holes 32b are arranged is an intermediate position. In addition, the through holes 32 a to 32 c are formed in the substrate surface 31. Conductive portions 33 for electrically connecting the press-fit connector pins to a wiring pattern (not shown) of the substrate 30 are provided on the inner peripheral surfaces of the through holes 32a to 32c.

  Each connector pin is press-fitted into a connector pin 42a whose other end is press-fitted into the corresponding through hole 32a, a connector pin 42b whose other end is press-fitted into the corresponding through-hole 32b, and the other end into the corresponding through-hole 32c. Connector pin 42c. And the connector 40 and the wiring pattern of the board | substrate 30 are electrically connected by press-fitting the other end of each connector pin 42a-42c to corresponding through-hole 32a-32c, respectively.

  Here, the press-fitting state of the connector pins 42a to 42c into the corresponding through holes 32a to 32c will be described with reference to FIG. 4 in which the connector pins 42a are press-fitted into the through holes 32a. The other end 43 of the connector pin 42a is provided with a cavity 44 therein, and the other end 43 is formed so that its outer diameter is slightly larger than the inner diameter of the through hole 32a. For this reason, as shown in FIG. 4, when the other end 43 of the connector pin 42a is press-fitted into the through hole 32a, the cavity 44 is deformed according to the pressure received from the inner peripheral surface of the through hole 32a. The conductive portion 33 is closely attached and fixed, and the connector 40 and the wiring pattern of the substrate 30 are electrically connected.

  When the other end 43 of each connector pin 42a to 42c is press-fitted, the pressing surface 45a of the pressing portion 45 provided above the other end 43 is pressed toward the substrate surface 31 by a predetermined press-fitting jig (not shown). The Each pressing portion 45 is formed such that its pressing surface 45a is substantially parallel to the substrate surface 31 and extends in the corresponding through-hole arrangement direction.

  For this reason, when the connector pin is press-fitted well into the corresponding through hole, the height from the substrate surface 31 to the pressing surface 45a becomes a substantially constant value. On the other hand, for example, if the press-fit state is not good so that the connector pins cannot be press-fit into the through holes, the height from the substrate surface 31 to the pressing surface 45a becomes a value different from the above-mentioned constant value.

  In the present embodiment, in order to inspect the press-fitted state, the pressing surface at the cut surface obtained by cutting the substrate 30 along the surface including the scanning line along the measurement direction of the distance sensor 12 based on the output signal from the distance sensor 12. A waveform corresponding to a line segment shape including a line segment corresponding to 45a and the substrate surface 31 (hereinafter simply referred to as a measurement cross-sectional shape) is generated. Then, based on this generated waveform, the height from the substrate surface 31 to the pressing surface 45a (hereinafter referred to as the measurement height H) is calculated and measured, and the press-fitted state of each connector pin 42a to 42c using this measurement result Inspect whether or not is good. The pressing surface 45a may correspond to an example of a “measurement site” described in the claims.

FIG. 5A is an explanatory diagram for explaining the sampling interval when the sampling time is constant and the distance sensor 12 is moved at a high speed, and FIG. 5B is a diagram of the sensor moving speed v in FIG. It is a graph which shows a change.
By the way, when the distance sensor 12 is continuously moved at a high speed using the orthogonal robot 20, if a speed fluctuation occurs during measurement such as the start of movement, a part different from the part to be measured is measured as a measurement part, and erroneous measurement is performed. And there is a problem that measurement leakage occurs. Specifically, as illustrated in FIG. 5B, when the sensor moving speed v of the distance sensor 12 fluctuates, a region with a narrow sampling interval and a region with a wide sampling interval are illustrated as illustrated in FIG. 5A. In some cases, the sampling interval varies so that. If it does so, a site | part different from the site | part which should be measured will be measured as a measurement site | part, and there exists a problem that an erroneous measurement, a measurement leak, etc. arise. In particular, this problem becomes significant when the measurement location is narrow or the shape is not stable.

  Therefore, in this embodiment, every time the distance sensor 12 moves by a predetermined distance, the relative distance is measured to generate a waveform corresponding to the measurement cross-sectional shape, and the measurement height H is calculated from the generated waveform.

  Hereinafter, the inspection of the press-fit state in each connector pin 42 of the connector 40 using the measuring apparatus 10 according to the present embodiment will be described in detail with reference to FIGS. 6A and 6B are explanatory diagrams for explaining the scanning direction of the distance sensor 12 with respect to the connector 40. FIG. 6A shows a state in which the substrate surface 31 is viewed from above, and FIG. 6B shows the Y direction. An enlarged view of the cross section is shown. FIG. 7 is an explanatory diagram for explaining a measurement state in which the distance sensor 12 is moved at a high speed and sampling is performed at constant intervals. FIG. 8 is an explanatory diagram showing an example of the generation process of the generated waveform S from which the time element is eliminated. FIG. 8A shows a part of the measurement result of the encoder 13, and FIG. FIG. 8C shows a waveform generated by converting the horizontal axis to be the scanning position. FIG. 8C shows a part of the waveform generated by sampling at a constant time interval. FIG. 9 is an explanatory diagram showing an enlarged part of the generated waveform S that has been generated. In FIG. 6A, the horizontal direction in the drawing corresponds to the X direction in which the moving member 21a moves straight, and the vertical direction in the drawing corresponds to the Y direction in which the moving member 22a moves straight. In FIG. 6A, for convenience, the number of connector pins 42a to 42c is shown to be smaller than the number of FIG.

  Before the measurement process is performed by the control circuit 14, first, as shown in FIG. 6A, the board 30 to be inspected is measured for the measurement height H of the pressing surface 45a of each connector pin 42a. Scanning line L1, scanning line L2 for measuring the measurement height H of the pressing surface 45a of each connector pin 42b, and scanning line L3 for measuring the measurement height H of the pressing surface 45a of each connector pin 42c. Is placed on the placement surface 11 so as to be parallel to the surface. That is, the substrate 30 is placed on the placement surface 11 so that the arrangement direction of the through holes 32 a to 32 c is parallel to the scanning direction of the distance sensor 12.

  In this mounted state, the control circuit 14 starts measurement processing, whereby the motor driver 24 is controlled so that the scanning direction of the distance sensor 12 coincides with the scanning line L1, and according to the driving of the second motor 22b. The moving member 22a moves in the Y direction. And the distance sensor 12 will be in the state which can measure the said relative distance, the motor driver 23 will be controlled, and the movement member 21a will start the movement to a X direction according to the drive of the 1st motor 21b. Thereby, the distance sensor 12 is scanned on the scanning line L1 as illustrated in FIG. 6B.

  At this time, the measurement signal is output from the control circuit 14 to the distance sensor 12 in accordance with the timing of the pulse signal input from the encoder 13. As a result, as illustrated in FIG. 7, the relative distance to each object located on the scanning line L <b> 1 is measured by the distance sensor 12 at regular intervals, and a signal from the distance sensor 12 is input to the control circuit 14. Then, a waveform (hereinafter referred to as a generated waveform S) corresponding to the measurement cross-sectional shape is generated based on this signal. 7 and FIG. 8 is an image of the input timing of the measurement signal input from the control circuit 14 to the distance sensor 12.

Note that the sampling cycle Sa of the distance sensor 12 can be expressed by the relationship between the sensor moving speed v and the measurement target width W of the pressing surface 45a. The time t during which the distance sensor 12 passes the measurement target range of the pressing surface 45a (sampling time) t is expressed as t = W / v. If the number of samples (= safety factor) in the measurement target width W is N, the sampling period Sa is determined by Sa = t / N. The safety factor N is desirably 10 or more because it is necessary to consider delays and variations in sensor response time. Therefore, the sampling period Sa can be set with reference to the following formula (1).
Sa ≦ W / (v · N) (1)

  In the generated waveform S generated as described above, the horizontal axis is the scanning position, the time element is eliminated, and the measurement cross-sectional shape is similar. That is, the generated waveform S is generated as a waveform that does not affect the speed variation even if the distance sensor 12 is continuously moved at a high speed. The control circuit 14 may correspond to an example of a “generating unit” recited in the claims.

  More specifically, with reference to FIGS. 8A to 8C, the generated waveform S is generated by sampling at regular time intervals and the horizontal axis is generated as time (see FIG. 8B). By using the measurement result of the encoder 13 (see FIG. 8A), as shown in FIG. 8C, the time element is eliminated and the horizontal axis is converted to the scanning position. This is the waveform. Further, as can be seen from FIGS. 8A to 8C, the sampling measurement result measured at a certain time interval by the distance sensor 12 is converted based on the measurement result of the encoder 13 so as to eliminate the time element. However, it is possible to generate a waveform converted so that the horizontal axis is the scanning position. 8A and 8B exaggerate the speed fluctuation of the moving speed v of the distance sensor 12 for convenience of explanation.

  When the generated waveform S is generated as described above, the control circuit 14 measures the measurement height based on the height from the substrate surface 31 corresponding to the scanning position of the pressing surface 45a of each connector pin 42a from the generated waveform S. H is calculated, and this calculation result is used to check whether the press-fitted state of each connector pin 42a is good. The measurement height H is calculated based on the difference between the average value of the height of the pressing surface 45a and the average value of the height of the substrate surface 31. At this time, as shown in FIG. To improve the calculation accuracy of the measurement height H by averaging the values before and after the value where the height greatly fluctuates and the value of the region excluding the values in the vicinity thereof (see the alternate long and short dash line regions S1 and S2 in FIG. 9). Can do. The control circuit 14 may correspond to an example of “calculation unit” recited in the claims.

  Subsequently, when the motor driver 24 is controlled by the control circuit 14, the moving member 22a moves in the Y direction according to the driving of the second motor 22b so that the scanning direction of the distance sensor 12 coincides with the scanning line L2. To do. Then, when the motor driver 23 is controlled by the control circuit 14 and the moving member 21a moves in the X direction according to the driving of the first motor 21b, the measurement cross-sectional shape is the same as in the measurement of the scanning line L1. Is generated so as to eliminate the time element. Then, the measured height H of the pressing surface 45a of each connector pin 42b is measured from the generated waveform S, and whether or not the press-fitted state of each connector pin 42b is good is determined using this measurement result. Thereafter, similarly, when a waveform is generated based on a signal from the distance sensor 12 moved so that the scanning direction of the distance sensor 12 coincides with the scanning line L3, each connector pin is generated based on the generated waveform S. The measurement height H of the pressing surface 45a of 42c is measured, and using this measurement result, it is inspected whether or not the press-fitted state of each connector pin 42c is good.

  As described above, in the measuring apparatus 10 according to the present embodiment, the distance sensor 12 is moved in the direction along the predetermined scanning lines (L1 to L3) by the orthogonal robot 20 in parallel to the substrate surface 31. Based on the movement amount of the distance sensor 12 measured by the encoder 13, a measurement signal is output to the distance sensor 12 by the control circuit 14 every time the distance sensor 12 moves a predetermined distance. Then, when the generated waveform S having the vertical axis as the height from the substrate surface 31 obtained from the relative distance measured by the distance sensor 12 and the horizontal axis as the scanning position is generated, The measurement height H of the pressing surface 45a is calculated from the height from the substrate surface 31 corresponding to the scanning position of the pressing surface 45a of the connector pins 42a to 42c.

Thus, since the generated waveform S is generated by measuring the relative distance for each predetermined distance, the generated waveform S has a similar relationship with the measured cross-sectional shape by eliminating the time element. Become. That is, the generated waveform S is generated as a waveform that does not affect the speed fluctuation even if the distance sensor 12 is continuously moved at a high speed.
Therefore, by calculating the measurement height H of the measurement site such as the pressing surface 45a based on the generated waveform S, the height of each pressing surface 45a of the connector 40 can be measured quickly and with high accuracy.

  In particular, since the distance sensor 12 is a laser displacement sensor, the relative distance can be reliably measured even if the measurement site such as the pressing surface 45a is small and dense.

  Further, the measurement site is a pressing surface 45 a that is pressed during press-fitting provided in each connector pin 42 a-42 c that is press-fitted into each through-hole 32 a-32 c of the substrate surface 31. Thus, by calculating the height of the pressing surface 45a from the substrate surface 31 as the measurement height H, the press-fitted states of the connector pins 42a to 42c can be quickly and accurately based on the measurement height H. Can be inspected.

[Second Embodiment]
Next, a measuring apparatus according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 10 is an explanatory diagram for explaining a main part of the measuring apparatus 10 according to the second embodiment. FIG. 10A shows a state in which the scanning lines L1 to L3 are deviated from the scheduled scanning direction. 10 (B) illustrates the calculation process of the length Y1 of the perpendicular line drawn from the pressing surface 45a on the start end side to the reference line Lo and the length Y2 of the perpendicular line drawn from the pressing surface 45a on the end side to the reference line Lo. It is explanatory drawing to do. 10A and 10B, the horizontal direction in the drawing corresponds to the X direction in which the moving member 21a moves straight, and the vertical direction in the drawing corresponds to the Y direction in which the moving member 22a moves straight. Further, in FIG. 10A, for convenience, the number of connector pins 42a to 42c is shown to be smaller than the number in FIG.

  The measurement apparatus 10 according to the second embodiment is different from the measurement apparatus according to the first embodiment in that a scanning direction change process is performed before the measurement process. Therefore, substantially the same components as those of the measurement apparatus of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As illustrated in FIG. 10A, the substrate 30 is inclined and placed such that each of the scanning lines L1 to L3 is deviated by an angle θ with respect to the X direction in which the moving member 21a that is a predetermined scanning direction moves straight. Assume a state of being placed on the surface 11. When the distance sensor 12 is moved and measured in the X direction (scheduled scanning direction) in such an inclined state, the pressing surface 45a on the end side can be measured by the distance sensor 12 even though the pressing surface 45a on the starting end side can be measured. There may be a case where measurement failure of the pressing surface 45a occurs without entering the range. In particular, not only the mounting state of the substrate 30 with respect to the mounting surface 11 but also the dimensional accuracy of the substrate 30 itself, etc., the deviation of the angle θ occurs. For example, it is conceivable that the mounting state of the substrate 30 with respect to the mounting surface 11 is imaged using a camera or the like and the angle θ is calculated based on the captured image, but it is necessary to prepare a camera or the like separately. There exists a problem that the manufacturing cost of the measuring apparatus 10 will increase.

  Therefore, in the present embodiment, before the measurement process is performed, the control circuit 14 performs a scanning direction change process to change the scanning direction of the distance sensor 12. This scanning direction changing process will be described in detail below.

  When the scanning direction changing process is started by the control circuit 14, first, the scanning direction is lowered from the two pressing surfaces 45a that are separated from each other in the X direction with respect to the reference scanning direction Lo that is parallel to the X direction. The length of the perpendicular is calculated. The calculation targets are the length Y1 of the perpendicular line drawn from the pressing surface 45a on the start end side to the reference line Lo, and the length Y2 of the perpendicular line drawn from the pressing surface 45a on the end side to the reference line Lo.

  Specifically, as shown in FIG. 10B, the lengths Y1 and Y2 of the vertical lines are measured until the pressing surface 45a is detected by the distance sensor 12 moved at a constant angle α from the reference line Lo. Calculation is performed based on the moving distance of the distance sensor 12. In the present embodiment, the constant angle α is set to 45 °, for example, and the distance sensor 12 is moved at the constant angle α by the orthogonal robot 20 controlled by the control circuit 14. At this time, since the encoder 13 knows the movement amount of the distance sensor 12 in the X direction, the perpendicular length Y1 is calculated from the X direction movement amount X1 when the pressing surface 45a on the start end side is detected and the constant angle α. be able to. Further, the perpendicular length Y2 can be calculated from the X-direction movement amount X2 when the terminal-side pressing surface 45a is detected and the constant angle α.

  When the perpendicular lengths Y1 and Y2 are thus calculated, the perpendicular length difference Y2-Y1 and the separation distance X3 in the X direction between the pressing surface 45a on the start end side and the pressing surface 45a on the end end side are obtained. Based on this, the angle θ (tan θ = (Y2−Y1) / X3) can be calculated. As the angle θ increases, the difference Y2-Y1 in the length of the perpendicular line drawn from the start-side pressing surface 45a and the terminal-side pressing surface 45a that are separated from each other in the scheduled scanning direction to the reference line Lo increases. . In the present embodiment, the separation distance X3 is a fixed value set in advance, and is set to about 80 mm, for example.

  And even when implementing the said measurement process by changing each scanning line L1-L3 so that the angle (theta) calculated in this way may approach 0 degrees, it is the inclination at the time of mounting in the mounting surface 11 Measurement omission of the pressing surface 45a due to (angle θ) can be eliminated. In particular, since the Y-direction movement amount (Y1, Y2) obtained by moving the distance sensor 12 at a constant angle α can also be measured using the encoder 13, it is not necessary to separately provide a sensor or the like for detecting the angle θ. An increase in manufacturing cost of the device 10 can be suppressed. The control circuit 14 may correspond to an example of “calculation unit” and “scan direction changing unit” recited in the claims.

In addition, this invention is not limited to the said embodiment, You may actualize as follows.
(1) The measurement site is not limited to the pressing surface 45a provided to each connector pin 42a to 42c, but may be another surface provided to each connector pin 42a to 42c. Further, the measurement target is not limited to the connector 40, but may be other mounted components. In this case, the measurement site may be, for example, a connection terminal of a mounting component or a part of a housing of the mounting component.

  Further, since the generation waveform S having a similar relationship to the measurement cross-sectional shape can be generated by the measurement device 10, the outer shape of the measurement target can be detected, and the measurement device 10 can be used for inspection of a mounted part for different products or dimensional inspection. The present invention can also be applied.

(2) The measurement height H of the measurement site is not limited to being measured based on the substrate surface 31, and may be measured based on a surface parallel to the placement surface 11 in the substrate 30.

(3) The distance sensor 12 is not limited to a laser displacement sensor, and may be a sensor capable of measuring a relative distance to an object located on a predetermined scanning line.

(4) The measuring means for measuring the moving amount of the moving member 21a in the X direction is not limited to the encoder 13 and may be a sensor capable of measuring the moving amount in one direction. Further, instead of the encoder 13, a sensor capable of measuring both the X-direction movement amount and the Y-direction movement amount may be employed for the moving member 21a and the moving member 22a.

DESCRIPTION OF SYMBOLS 10 ... Measuring apparatus 11 ... Mounting surface 12 ... Distance sensor 13 ... Encoder (movement amount measuring means)
14 ... Control circuit (control means, generation means, calculation means, calculation means, scanning direction change means)
20 ... Orthogonal robot (moving means)
DESCRIPTION OF SYMBOLS 30 ... Board | substrate 31 ... Board | substrate surface (reference | standard surface) 32a-32c ... Through hole 40 ... Connector (mounting component) 42a-42c ... Connector pin 45a ... Pressing surface (measurement site)
H ... Measurement height L1 to L3 ... Scanning line (predetermined scanning line) Lo ... Reference line Y1, Y2 ... Length of perpendicular line

Claims (4)

It is located on a predetermined scanning line (L1 to L3) with respect to one or more mounting components (40) mounted on the substrate surface (31) of the substrate (30) mounted on the mounting surface (11). A measuring device (10) for measuring a height from a reference plane (31) of a plurality of measurement sites (45a) as a measurement height (H),
A distance sensor (12) for measuring a relative distance to an object located on any one of the predetermined scanning lines in accordance with an input measurement signal;
Moving means (20) that is movable in the scanning direction along the predetermined scanning line, the distance sensor being parallel to the reference plane;
A moving amount measuring means (13) for measuring a moving amount by which the distance sensor is moved by the moving means;
Control means (14) for outputting the measurement signal to the distance sensor each time the distance sensor moves a predetermined distance based on the movement amount measured by the movement amount measurement means;
Generating means (14) for generating a waveform (S) having a vertical axis as a height from the reference plane obtained from the relative distance measured by the distance sensor and a horizontal axis as a scanning position;
Calculation means (14) for calculating the measurement height of the measurement site from the height from the reference plane corresponding to the scanning position of the measurement site based on the waveform generated by the generation unit;
A measuring apparatus comprising:   The measuring apparatus according to claim 1, wherein the distance sensor is a laser displacement sensor. The reference surface is the substrate surface,
At least a part of the measurement site is a pressing surface (45a) pressed at the time of press-fitting provided in connector pins (42a-42c) to be press-fitted into the through holes (32a-32c) of the substrate surface. The measuring apparatus according to claim 1 or 2. The distance sensor in which the length (Y1, Y2) of the perpendicular to the reference line (Lo) parallel to the scanning direction planned from the measurement site is moved at a constant angle (α) from the reference line Calculating means (14) for calculating based on the movement distance (X1, X2) of the distance sensor until it is detected by
A scanning direction change that changes the scanning direction based on a difference in length of the perpendiculars calculated by the calculating means for two measurement parts that are separated from each other in the predetermined scanning direction among the plurality of measurement parts. Means (14);
The measuring apparatus according to claim 1, further comprising:

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