JP2019212731A - Apparatus and method for detecting erroneous assembly of circuit element - Google Patents

Abstract

To provide an apparatus and a method capable of accurately detecting erroneous assembly of a circuit element on a circuit board without adversely affecting the circuit element.SOLUTION: A contact sensor 2 outputs a signal according to the presence or absence of contact between a tip of a terminal protruding from a circuit board and the contact detection surface of the contact sensor 2. An erroneous assembly determination unit 14c determines whether or not the circuit board has been erroneously assembled by determining whether or not the tip of the terminal protruding from the circuit board has been brought into contact with the contact detection surface of the contact sensor 2 on the basis of the signal output from the contact sensor 2.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an erroneous assembly detection apparatus and method for circuit elements.

  Conventionally, when a circuit element is mounted on a circuit board, a circuit element that can be mounted on a machine such as a microchip is mounted on a circuit board printed by soldering. An automatic optical inspection (AOI) is performed in order to inspect the presence or absence of defects on the circuit board that has been heat-treated and finished.

  After the AOI confirms that the circuit board is free of defects, a plurality of (for example, two) terminals of circuit elements such as diodes that are difficult to be mechanically mounted are respectively assembled in the corresponding holes of the circuit board. For example, a circuit element that is difficult to mount mechanically has a positive terminal and a negative terminal that is shorter than the positive terminal, and the positive terminal is a hole formed in the circuit board so as to correspond to the positive terminal. The negative terminal is inserted into a hole formed in the circuit board so as to correspond to the negative terminal.

  Then, after confirming that the plurality of terminals of the circuit element are correctly assembled in the corresponding holes of the circuit board, that is, after confirming that the circuit element is not erroneously assembled to the circuit board. A plurality of terminals of circuit elements that are difficult to be mechanically mounted are soldered. Whether or not the circuit element is erroneously assembled to the circuit board is confirmed by visual inspection, image recognition, or electrical inspection by an operator (for example, Patent Document 1).

JP 2006-73686 A

  When checking whether or not a circuit element is mistakenly mounted on a circuit board by visual inspection by an operator, it may not be possible to accurately detect the incorrect assembly of the circuit element to the circuit board due to a false determination due to a human error. is there.

  In addition, when confirming whether or not a circuit element has been misassembled on the circuit board by image recognition, it is possible to accurately correct the misassembly of the circuit element with respect to the circuit board due to an erroneous determination due to a change in the outer shape of the circuit element. It may not be detected.

  Further, in the case where it is confirmed by electrical inspection whether or not the circuit element is erroneously assembled to the circuit board, a current that flows through the circuit element when the terminal of the circuit element is brought into electrical contact with the probe of the inspection device As a result, the circuit element may be adversely affected (current destruction).

  An object of the present invention is to provide an erroneous assembly detection apparatus and method for a circuit element that can accurately detect an erroneous assembly of a circuit element to a circuit board without adversely affecting the circuit element.

  According to the present invention, there is provided a circuit element misassembly detection device that connects a first terminal of a first length of a circuit element and a second terminal of a second length different from the first length of the circuit board. Incorrect assembly of circuit elements for detecting erroneous assembly of circuit elements when being inserted into the first hole and the second hole from the first surface of the circuit board and projecting from the second surface of the circuit board A sensor for determining whether or not the length of the terminal protruding from the second surface of the circuit board is substantially the same as a predetermined length; and from the second surface of the circuit board And an erroneous assembly determination unit that determines that the circuit element is erroneously assembled to the circuit board when the length of the protruding terminal is not substantially the same as the predetermined length.

  Preferably, the sensor is a contact sensor, and the erroneous assembly determination unit is opposed to the first hole of the circuit board and the distance from the second surface of the circuit board is substantially the same as the predetermined length. If the tip of the terminal protruding from the second surface of the circuit board does not contact the sensor when the sensor is arranged at a certain position, it is determined that the circuit element is erroneously assembled to the circuit board.

  Preferably, the sensor has a light emitting part that emits light and a light receiving part that receives light, and outputs an electrical signal corresponding to the intensity of light that hits the object and returns to the light receiving part after being emitted from the light emitting part. A photoelectric sensor for outputting, when the light emitting part emits light at a position facing the first hole of the circuit board and having a distance from the second surface of the circuit board longer than a predetermined length. And a distance measuring unit that measures a distance between the tip of the terminal protruding from the second surface of the circuit board and the sensor based on the electrical signal output from the circuit board. If the length of the terminal protruding from the second surface is calculated based on the distance measured by the distance measuring unit, and the calculated length is not substantially the same as the predetermined length, the circuit element may be mistaken for the circuit board. It is determined that it has been assembled.

  Preferably, the circuit element misassembly detection device according to the present invention further includes a sensor drive mechanism that enables the sensor to move to a predetermined position, and a drive control unit that drives and controls the sensor drive mechanism.

  Preferably, the circuit element misassembly detection device according to the present invention includes a circuit board release mechanism for releasing the circuit board from the pallet holding the circuit board, and a length of the terminal protruding from the second surface of the circuit board. A circuit board release control unit that controls release of the circuit board from the pallet by the circuit board release mechanism when the erroneous assembly determination unit determines that the length is substantially the same as the predetermined length. .

  According to the circuit element misassembly detection method of the present invention, the first terminal of the first length of the circuit element and the second terminal of the second length different from the first length are connected to the circuit board. Incorrect assembly of circuit elements for detecting erroneous assembly of circuit elements when being inserted into the first hole and the second hole from the first surface of the circuit board and projecting from the second surface of the circuit board A method of detecting by a sensor whether or not the length of a terminal protruding from the second surface of the circuit board is substantially the same as a predetermined length; and from the second surface of the circuit board Determining that the circuit element is erroneously assembled to the circuit board when the length of the protruding terminal is not substantially the same as the predetermined length.

  According to the present invention, it is possible to accurately detect an incorrect assembly of a circuit element with respect to a circuit board without adversely affecting the circuit element.

1 is a configuration diagram of a system including an erroneous assembly detection device 1 for circuit elements according to the present invention. FIG. It is a figure which shows typically a cross section of a part of circuit assembly error detection apparatus 1 of FIG. 1 and a part of circuit board 4 of FIG. FIG. 2 is a block diagram of the circuit element misassembly detection device 1 of FIG. 1. It is a flowchart which shows an example of the misassembly determination procedure of the misassembly detection apparatus 1 of the circuit element shown in FIG.1 and FIG.3. It is a block diagram of the system containing the misassembly detection apparatus 1 'of the other circuit element by this invention. It is a figure which shows typically a cross section of a part of circuit assembly error detection apparatus 1 'of FIG. 5, and a part of circuit board 4 of FIG. FIG. 6 is a block diagram of a circuit element erroneous assembly detection apparatus 1 ′ of FIG. 5. It is a flowchart which shows an example of the misassembly determination procedure of the misassembly detection apparatus 1 'of the circuit element shown in FIG.5 and FIG.7. It is a figure which shows typically the cross section of a part of modification of the incorrect assembly | attachment detection apparatus 1 of the circuit element of FIG. 1, and a part of circuit board 4 of FIG. It is a figure which shows typically the cross section of a part of other modifications of the circuit element incorrect assembly | attachment detection apparatus 1 of FIG. 1, and a part of circuit board 4 of FIG. It is a figure which shows typically a cross section of a part of a part of circuit element incorrect assembly | attachment detection apparatus 1 of FIG. 1, and a modification of the circuit board 4 of FIG.

An apparatus and method for detecting misassembly of circuit elements according to the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals.
FIG. 1 is a block diagram of a system including a circuit element erroneous assembly detection apparatus 1 according to the present invention. FIG. 2 is a part of the circuit element erroneous assembly detection apparatus 1 of FIG. 1 and a circuit board of FIG. 4 is a diagram schematically showing a cross section of a part of FIG. 4, and FIG. 3 is a block diagram of the circuit element misassembly detection device 1 of FIG.

  As shown in FIGS. 1 and 3, the circuit element misassembly detection device 1 includes a contact sensor 2 and a main body 3, and detects misassembly of the diode 5 with respect to the circuit board 4. The contact sensor 2 is an example of a sensor, and the diode 5 is an example of a circuit element.

  Referring to FIG. 2 in more detail, the circuit element misassembly detection device 1 includes a positive electrode terminal 5a having a length 11 and a negative electrode terminal 5b having a length 12 that is shorter than the length 11. Is inserted into the holes 4a and 4b of the circuit board 4 from the surface 4c of the circuit board 4 and protruded from the surface 4d of the circuit board 4 to detect an incorrect assembly of the diode 5. In the present embodiment, the surfaces 4c and 4d are parallel to the horizontal plane (xy plane) and are squares with one side length L. Further, as shown in FIG. 2, the surface 4c is on the upper side of the surface 4d.

  The length l1 is an example of a first length, the length l2 is an example of a second length different from the first length, the terminal 5a is an example of a first terminal, The terminal 5b is an example of a second terminal, the hole 4a is an example of a first hole, the hole 4b is an example of a second hole, and the surface 4c is an example of a first surface. Yes, the surface 4d is an example of a second surface. FIG. 2 shows a state in which the contact sensor 2 is in contact with the tip of the terminal 5a.

  In the present embodiment, the edge of the surface 4d of the circuit board 4 is placed on the pallet 6 so that a portion other than the edge of the surface 4d of the circuit board 4 is exposed. It is fixed to the pallet 6. The pallet 6 is placed on a table 7, and the table 7 is formed with an opening 7a so that a portion other than the edge of the surface 4d of the circuit board 4 is exposed.

In this embodiment, the coordinates of one corner C of the surface 4d as shown in FIG. 1 is (0, 0, 0), the thickness of the circuit board 4 is t, and the surface 4c of the cylindrical portion 5c of the diode 5 is used. When the distance between the bottom surface closer to the surface 4c and the surface 4c is t ′, the coordinates of the terminal 5a are (S _x , S _y , −11 + t + t ′). The coordinates (S _x , S _y , −l1 + t + t ′) are an example of a position that faces the first hole of the circuit board and that the distance from the second surface of the circuit board is substantially the same as the predetermined length. is there.

  As will be described later, in the contact sensor 2, the length of the terminal inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protruding from the surface 4d of the circuit board 4 is the length l1-tt '. Is used to determine whether or not they are substantially the same. The length l1-t-t ′ is an example of a predetermined length.

  The contact sensor 2 is a capacitance type sensor, a strain sensor, a piezo element, or the like. The contact sensor 2 is inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protrudes from the surface 4d of the circuit board 4. An electrical signal corresponding to the presence or absence of contact with the contact detection surface of the contact sensor 2 is output.

In this embodiment, when the contact detection surface of the contact sensor 2 is arranged at the coordinates (S _x , S _y , −11 + t + t ′), the contact detection surface of the contact sensor 2 comes into contact with the tip of the terminal 5a. The electrical signal output from the sensor 2 is approximately the length l1-tt ′ of the length of the terminal inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protruding from the surface 4d of the circuit board 4. It corresponds to a signal (for example, a High signal) indicating the same.

In the present embodiment, when the contact detection surface of the contact sensor 2 is arranged at coordinates (S _x , S _y , −11 + t + t ′), the contact detection surface of the contact sensor 2 does not contact the tip of the terminal 5a. The electrical signal output from the contact sensor 2 is inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4, and the length of the terminal protruding from the surface 4d of the circuit board 4 is the length l1-tt '. Corresponds to a signal (for example, a Low signal) indicating that it is not substantially the same.

As shown in FIG. 3, the main body 3 includes an amplifier 11, a ROM 12, a RAM 13, and a CPU 14. The amplifier 11 has an input side connected to the contact sensor 2 and an output side connected to the CPU 14, amplifies an electric signal output from the contact sensor 2, and supplies the amplified signal to the CPU 14. The ROM 12 is connected to the CPU 14 and has various control programs such as an incorrect assembly determination program and the tip of the terminal 5a inserted and assembled in the circuit board 4 with respect to a predetermined position (in this case, corner C) of the circuit board 4. Various data such as substrate data such as data relating to the position (in this case, coordinates (S _x , S _y , −11 + t + t ′)) is stored. The RAM 13 is connected to the CPU 14 and stores various data such as detection result data relating to the electrical signal output from the contact sensor 2.

  The CPU 14 is connected to the amplifier 11, the ROM 12, and the RAM 13, and executes various control programs. In the present embodiment, the CPU 14 is configured by software by a control program executed by the CPU 14 or is configured by hardware by a dedicated circuit in the CPU 14, a drive control unit 14 b, a misconfiguration. An attachment determination unit 14c and a circuit board release control unit 14d are provided.

The circuit board determination unit 14a reads a bar code (not shown) including circuit board information, which is identification information attached to the circuit board 4, with a bar code reader (not shown) connected to the CPU 14, thereby The type of the circuit board 4 is determined based on the circuit board information included in the code. Then, the circuit board determination unit 14a determines the position of the tip of the terminal 5a based on the predetermined position of the circuit board 4 based on the above-described board data. In the present embodiment, the circuit board determination unit 14a has a position (in this case, coordinates (S _x , S _y , −) at the tip of the terminal 5a inserted into the circuit board 4 and assembled to the corner C of the circuit board 4. l1 + t + t ′)).

  The drive control unit 14b preliminarily contacts the contact sensor 2 with a motor for moving the contact sensor 2 in the x direction, a motor for moving the contact sensor 2 in the y direction, and a motor for moving the contact sensor 2 in the z direction. A sensor drive mechanism (not shown) that can move to the determined position is driven and controlled.

In the present embodiment, as shown in FIG. 1, the center of the contact detection surface of the contact sensor 2 has coordinates (0, 0, −h) (h> l1) by the control of the sensor drive mechanism by the drive controller 14b. -T-t '). Thereafter, the contact sensor 2 to detect the mis-mounting of the diode 5, the control of the sensor driving mechanism by the drive control section 14b, is moved in the + x direction as shown by an arrow X by a distance S _x, by the arrow Y As shown, it is moved by a distance S _y in the + y direction, and as shown by an arrow Z, it is moved by a distance h−11 + t + t ′ in the + z direction. Thereby, the center part of the contact detection surface of the contact sensor 2 is arranged at the position of the coordinates (S _x , S _y , −11 + t + t ′). Thereafter, the drive control unit 14b stops the sensor drive mechanism.

  In the present embodiment, the drive control unit 14b moves the body 3 to + x after the determination whether the diode 5 described later is erroneously assembled to the circuit board 4 is performed by the erroneous assembly determination unit 14c. By driving a main body drive mechanism (not shown) having a motor for moving in the direction, the main body 3 can be moved by L in the + x direction.

  The erroneous assembly determination unit 14c determines whether the tip of the terminal 5a is in contact with the contact detection surface of the contact sensor 2 based on the electrical signal output from the contact sensor 2, so that the diode 5 is connected to the circuit board 4. It is determined whether or not it has been misassembled. In the present embodiment, the misassembly determination unit 14c is configured such that the length of the terminal inserted from the surface 4c of the circuit board 4 into the hole 4a of the circuit board 4 and protruding from the surface 4d of the circuit board 4 is the length l1-t. When a signal that does not indicate substantially the same as −t ′ is output by the contact sensor 2, it is determined that the diode 5 is erroneously assembled to the circuit board 4.

  When it is determined that the diode 5 is erroneously assembled to the circuit board 4, the erroneous assembly determination unit 14c notifies the erroneous assembly by lighting a lamp (not shown) connected to the CPU 14.

  Further, in the present embodiment, the misassembly determination unit 14c has the length of the terminal 11 inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protruding from the surface 4d of the circuit board 4. When a signal indicating that it is substantially the same as −t−t ′ is output by the contact sensor 2, it is determined that the diode 5 is not erroneously assembled to the circuit board 4.

  The circuit board release control unit 14d releases the circuit board 4 from the pallet 6 holding the circuit board 4 when the erroneous assembly determination unit 14c determines that the diode 5 is not erroneously assembled to the circuit board 4. Release control of the circuit board 4 from the pallet 6 is performed by a circuit board release mechanism (not shown). By performing release control by the circuit board release controller 14d, the claw portion 6a of the pallet 6 moves in the direction indicated by the arrow α, and the circuit board 4 can be removed from the pallet 6.

  In the case where the circuit element misassembly detection device 1 determines whether or not another circuit board 4 adjacent to the circuit board 4 on which it has been determined whether or not the circuit element has been misassembled is determined. Then, the main body 3 is moved by L in the + x direction by the drive control unit 14b, and the circuit board determination, the drive control, the incorrect assembly determination, and the like described above for another circuit board 4 are performed.

  FIG. 4 is a flowchart showing an example of an incorrect assembly determination procedure of the circuit element erroneous assembly detection apparatus 1 shown in FIGS. 1 and 3. This flow is mainly executed by the CPU 14 in cooperation with each element of the circuit element misassembly detection device 1 based on a misassembly determination program stored in the ROM 12 in advance. This flow is executed whenever the contact detection surface of the contact sensor 2 is arranged at the coordinates (0, 0, −h) and the barcode reader reads the barcode on the circuit board 4.

  First, the circuit board determination unit 14a determines the type of the circuit board 4 based on the circuit board information included in the barcode, and the tip of the terminal 5a based on the corner C of the circuit board 4 based on the board data described above. Is determined (step S1).

Next, the drive control section 14b has a central portion the coordinates of the contact detection surface of the contact sensor _{2 (S x, S y,} -l1 + t + t ') for driving and controlling the sensor drive mechanism to be placed in the position (step S2 ). Next, the incorrect assembly determination unit 14c determines whether or not the tip of the terminal 5a has contacted the contact detection surface of the contact sensor 2 based on the electrical signal output from the contact sensor 2 (step S3).

  When it is determined by the misassembly determination unit 14c that the tip of the terminal 5a has come into contact with the contact detection surface of the contact sensor 2 (YES in step S3), the circuit board release control unit 14d starts from the pallet 6 by the circuit board release mechanism. The release control of the circuit board 4 is controlled (step S4). Thereafter, the CPU 14 ends the process.

  On the other hand, if it is determined by the erroneous assembly determination unit 14c that the tip of the terminal 5a is not in contact with the contact detection surface of the contact sensor 2 (YES in step S3), the erroneous assembly determination unit 14c turns on the lamp. Thus, the erroneous assembly is notified (step S5). Thereafter, the CPU 14 ends the process.

  According to the present embodiment, it is determined whether or not the diode 5 is erroneously assembled to the circuit board 4 by determining the length of the terminal protruding from the surface 4 d of the circuit board 4 using the contact sensor 2. As a result, the erroneous assembly of the diode 5 to the circuit board 4 can be accurately detected without adversely affecting the diode 5.

  Further, according to the present embodiment, the two-dimensional position (on the xy plane) of the central portion of the contact detection surface of the contact sensor 2 substantially coincides with the two-dimensional position of the terminal 5a and the contact of the contact sensor 2 It is determined that the diode 5 is correctly assembled to the circuit board 4 only when the distance from the center of the detection surface to the surface 4d substantially matches the distance from the tip of the terminal 5a to the surface 4d. Thereby, it is possible to improve the accuracy of determination of erroneous assembly of the diode 5 to the circuit board 4.

  In addition, by driving and controlling the contact sensor 2 by the drive control unit 14b that drives and controls the sensor driving mechanism, the two-dimensional position of the contact sensor 2 is changed to the two-dimensional position of the terminal 5a. The distance between the surface 4d of the contact sensor 2 and the distance from the surface 4d at the front end of the terminal 5a can be accurately arranged.

  Furthermore, by controlling the release of the circuit board 4 from the pallet 6 by the circuit board release mechanism by the circuit board release control unit 14d, only the circuit board 4 in which the diode 5 is not erroneously assembled can be taken out.

  FIG. 5 is a configuration diagram of a system including an erroneous assembly detection device 1 ′ for another circuit element according to the present invention, and FIG. 6 shows a part and a diagram of the erroneous assembly detection device 1 ′ for a circuit element shown in FIG. 5 is a diagram schematically showing a cross section of a part of the circuit board 4 of FIG. 5, and FIG. 7 is a block diagram of the circuit element erroneous assembly detection device 1 ′ of FIG.

  As shown in FIGS. 5 and 7, the circuit element misassembly detection device 1 ′ includes a photoelectric sensor 2 ′ and a main body 3 ′, and detects misassembly of the diode 5 with respect to the circuit board 4. The photoelectric sensor 2 'is another example of the sensor.

  The photoelectric sensor 2 ′ will be described in more detail with reference to FIG. 6. The photoelectric sensor 2 ′ includes a light emitting unit 2a ′ that emits light such as visible light and a light receiving unit 2b ′ that receives light, and includes a circuit element misassembly detection device. 1 ′ indicates that the error of the diode 5 when the terminals 5a and 5b of the diode 5 are inserted into the holes 4a and 4b of the circuit board 4 from the surface 4c of the circuit board 4 and protruded from the surface 4d of the circuit board 4 is assembled. Detect assembly. FIG. 6 shows a state where the light is emitted from the light emitting portion 2a 'and then hits the tip of the terminal 5a and returns to the light receiving portion 2b'.

  As will be described later, the photoelectric sensor 2 ′ has a length of l1-t−t that is inserted from the surface 4 c of the circuit board 4 into the hole 4 a of the circuit board 4 and protrudes from the surface 4 d of the circuit board 4. It is used to determine whether or not it is substantially the same as', and outputs an electrical signal corresponding to the intensity of light that hits the object and returns to the light receiving portion 2b 'after being emitted from the light emitting portion 2a'.

  As the distance between the photoelectric sensor 2 ′ and the object increases, the intensity of the light returning to the light receiving unit 2b ′ decreases. Therefore, the level of the electric signal of the photoelectric sensor 2 ′ is between the photoelectric sensor 2 ′ and the object. Decreases with increasing distance. Accordingly, the distance between the photoelectric sensor 2 ′ and the object can be determined based on the relationship between the distance between the photoelectric sensor 2 ′ and the object and the level of the electric signal of the photoelectric sensor 2 ′. In the present embodiment, the object is the tip of the terminal 5a.

As shown in FIG. 7, the main body 3 ′ includes an amplifier 11 ′, a ROM 12 ′, a RAM 13 ′, and a CPU 14 ′. The amplifier 11 ′ has an input side connected to the photoelectric sensor 2 ′ and an output side connected to the CPU 14 ′, amplifies an electric signal output from the photoelectric sensor 2 ′, and supplies the amplified signal to the CPU 14 ′. The ROM 12 ′ is connected to the CPU 14 ′, and is inserted into the circuit board 4 for assembling various control programs such as a photoelectric sensor driving program and an erroneous assembly determination program and a predetermined position of the circuit board 4 (in this case, corner C) and assembled. Board data such as data relating to the position of the tip of the terminal 5a (in this case, coordinates (S _x , S _y , −11 + t + t ′)), the distance between the photoelectric sensor 2 ′ and the object, and the electricity of the photoelectric sensor 2 ′ Various data such as distance data indicating the relationship between signal levels is stored. The RAM 13 ′ is connected to the CPU 14 ′ and stores various data such as detection result data relating to the signal output from the photoelectric sensor 2 ′.

  The CPU 14 'is connected to the amplifier 11', the ROM 12 ', and the RAM 13', and executes various control programs. In the present embodiment, the CPU 14 ′ is configured by software by a control program executed by the CPU 14 ′, or is configured by hardware by a dedicated circuit in the CPU 14 ′, and the drive control unit 14b. , A distance measurement unit 14b ′, an erroneous assembly determination unit 14c, and a circuit board release control unit 14d.

In the present embodiment, as shown in FIG. 5, the central portion of the upper surface of the photoelectric sensor 2 ′ has coordinates (0, 0, −h) (h> l1−) by the control of the sensor driving mechanism by the drive control unit 14b. It is previously arranged at the position of t−t ′). Thereafter, the photoelectric sensor 2 'in order to detect the mis-mounting of the diode 5, is moved a distance S _x in the + x-direction as indicated by the arrow X by the control of the sensor driving mechanism by the drive control section 14b, an arrow Y As shown, it is moved by a distance S _y in the + y direction, and is moved by a distance h ′ (h> h ′> l1-t−t ′) in the + z direction as indicated by an arrow Z ′.

And the center part of the upper surface of photoelectric sensor 2 'is arrange | positioned in the position of a coordinate (0, _Sy , -h + h'). Thereafter, the drive control unit 14b stops the sensor driving mechanism and emits light from the light emitting unit 2a ′. Thereby, an electrical signal is output from the photoelectric sensor 2 ′.

When the diode 5 is not erroneously assembled to the circuit board 4, the upper surface of the photoelectric sensor 2 ′ is positioned when the center of the upper surface of the photoelectric sensor 2 ′ is arranged at the coordinates (S _x , S _y , −h + h ′). The distance between the center portion and the tip of the terminal 5a is the shortest. The coordinates (S _x , S _y , −h + h ′) are examples of positions where the distance from the second surface of the circuit board that faces the first hole of the circuit board and the terminal protrudes is longer than a predetermined length. It is.

  Further, when the diode 5 is not erroneously assembled to the circuit board 4, the shortest distance between the central portion of the upper surface of the photoelectric sensor 2 'and the tip of the terminal 5a is h-h'-l1 + t + t'.

  The distance measuring unit 14b 'measures the distance between the center of the upper surface of the photoelectric sensor 2' and the tip of the terminal 5a based on the electrical signal output from the photoelectric sensor 2 'and the distance data described above.

  The misassembly determination unit 14c is a length measured by the distance measurement unit 14b ′ by measuring the length of a terminal inserted into the hole 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protruding from the surface 4d of the circuit board 4. And whether or not the diode 5 is erroneously assembled to the circuit board 4 is determined by determining whether or not the calculated length is substantially the same as the length l1-t−t ′. .

  In the present embodiment, the erroneous assembly determination unit 14c determines that the diode 5 is not erroneously assembled to the circuit board 4 when the calculated length is substantially the same as the length l1-t−t ′. When the calculated length is not substantially the same as the length l1-tt ′, it is determined that the diode 5 is erroneously assembled to the circuit board 4.

  FIG. 8 is a flowchart showing an example of another misassembly determination procedure of the circuit element misassembly detection device 1 ′ shown in FIGS. 5 and 7. This flow is executed mainly by the CPU 14 'in cooperation with each element of the circuit element misassembly detection device 1' based on a misassembly determination program stored in advance in the ROM 12 '. This flow is executed each time the bar code reader reads the bar code on the circuit board 4 while the central portion of the upper surface of the photoelectric sensor 2 ′ is arranged at the coordinates (0, 0, −h).

  First, the circuit board determination unit 14a determines the type of the circuit board 4 based on the circuit board information included in the barcode, and the tip of the terminal 5a based on the corner C of the circuit board 4 based on the board data described above. Is determined (step S11).

Next, the drive control unit 14b arranges the central portion of the upper surface of the photoelectric sensor 2 ′ at the position of the coordinates (0, S _y , −h + h ′), and then emits light and then indicates the + x direction as indicated by the arrow X ′. The sensor drive mechanism is driven and controlled so as to be moved by a distance L (step S12). Next, the distance measuring unit 14b ′ measures the distance between the center of the upper surface of the photoelectric sensor 2 ′ and the tip of the terminal 5a based on the electrical signal output from the photoelectric sensor 2 ′ and the above-described distance data. (Step S13). Next, the misassembly determination unit 14c calculates the length of the terminal protruding from the surface 4d of the circuit board 4 based on the length measured by the distance measurement unit 14b ′, and the calculated length is the length l1. It is determined whether or not the diode 5 is erroneously assembled to the circuit board 4 by determining whether or not it is substantially the same as −t−t ′ (step S14).

  When the misassembly determination unit 14c determines that the calculated length is substantially the same as the length l1-tt '(YES in step S14), the circuit board release control unit 14d uses the circuit board release mechanism. Control to release the circuit board 4 from the pallet 6 is performed (step S15). Thereafter, the CPU 14 ends the process.

  On the other hand, if it is determined by the misassembly determination unit 14c that the calculated length is not substantially the same as the length l1-tt '(YES in step S14), the misassembly determination unit 14c turns on the lamp. Thus, the erroneous assembly is notified (step S5). Thereafter, the CPU 14 ends the process.

  According to the present embodiment, the diode 5 is erroneously assembled to the circuit board 4 when the length calculated based on the length measured by the distance measuring unit 14b ′ is not substantially the same as the length l1-t−t ′. It is determined that As a result, the erroneous assembly of the diode 5 to the circuit board 4 can be accurately detected without adversely affecting the diode 5.

  In addition, according to the present embodiment, the two-dimensional (xy plane) position of the central portion of the upper surface of the photoelectric sensor 2 ′ substantially coincides with the two-dimensional position of the tip of the terminal 5a, and the distance measuring unit 14b. It is determined that the diode 5 is correctly assembled to the circuit board 4 only when the length calculated based on the length measured by 'substantially matches the distance from the tip of the terminal 5a to the surface 4d. Thereby, it is possible to improve the accuracy of determination of erroneous assembly of the diode 5 to the circuit board 4.

  The present invention is not limited to the above-described embodiment, and many changes and modifications can be made. For example, the present invention can also determine whether an alumina electrolytic capacitor or a tantalum capacitor having a positive electrode terminal and a negative electrode terminal shorter than the positive electrode terminal as a circuit element is erroneously assembled to the circuit board. Further, the present invention can detect erroneous assembly of circuit elements even when a plurality of circuit elements are assembled on a circuit board.

  In the embodiment described with reference to FIGS. 1 to 4, it is determined whether or not the length of the terminal protruding from the surface 4d of the circuit board 4 is substantially the same as the length l2-tt '. In this way, detection of erroneous assembly of circuit elements may be performed.

  In the embodiment described with reference to FIGS. 5 to 8, the surface 4 d of the circuit board 4 that faces the hole 4 b of the circuit board 4 (substantially directly below the hole 4 b of the circuit board 4) and the terminal protrudes from It is also possible to detect erroneous assembly of circuit elements by determining whether or not the shortest distance is equal to hh′−l2 + t + t ′.

  FIG. 9 is a diagram schematically showing a cross section of a part of a modification of the circuit element misassembly detection device 1 of FIG. 1 and a part of the circuit board 4 of FIG. As shown in FIG. 9, in order to determine erroneous assembly of circuit elements, contact is made with the tips of terminals inserted into the holes 4a of the circuit board 4 from the surface 4c of the circuit board 4 and protruding from the surface 4d of the circuit board 4. You may use the contact sensor 21 which outputs the electrical signal according to the presence or absence of the contact with the contact detection surface of the sensor 2 with the contact sensor 2.

FIG. 10 is a diagram schematically showing a cross section of a part of another modification of the circuit element erroneous assembly detection apparatus 1 of FIG. 1 and a part of the circuit board 4 of FIG. As shown in FIG. 10, a plate 22 on which the contact sensor 2 is arranged is provided, and the contact detection surface of the contact sensor 2 has coordinates (S _x , S _y , −l1 + t + t ′) in order to determine erroneous assembly of circuit elements. The plate 22 may be driven and controlled by a sensor driving mechanism so as to be disposed at the position.

  FIG. 11 is a diagram schematically showing a cross section of a part of the circuit element erroneous assembly detection apparatus 1 of FIG. 1 and a modification of the circuit board 4 of FIG. As shown in FIG. 11, the circuit element misassembly detection device 1 includes a terminal having a length l2 ′ arranged between a terminal having a length l1 ′ and a terminal having a length l2 ′ shorter than the length l1 ′. It is also possible to detect erroneous assembly of the circuit element 5 ′ having

1,1 ′ Circuit element misassembly detection device 2,21 Contact sensor 2 ′ Photoelectric sensor 2a ′ Light emitting part 2b ′ Light receiving part 3,3 ′ Body 4 Circuit board 4a, 4b Hole 4c, 4d surface 5 Diode 5 ′ Circuit element 5a, 5b, 5a ', 5b', 5c 'Terminal 5c Cylindrical part 6 Pallet 6a Claw part 7 Table 7a Opening 11, 11' Amplifier 12, 12 'ROM
13,13 'RAM
14,14 'CPU
14a Circuit board determination unit 14b Drive control unit 14b 'Distance measurement unit 14c Incorrect assembly determination unit 14d Circuit board release control unit 22 Plate

Claims (6)

A circuit board having a first terminal of a first length of a circuit element and a second terminal of a second length different from the first length in the first hole and the second hole of the circuit board, respectively. A circuit element erroneous assembly detection device for detecting an erroneous assembly of a circuit element when assembled from a first surface of the circuit board and protruding from the second surface of the circuit board.
A sensor for determining whether or not the length of the terminal protruding from the second surface of the circuit board is substantially the same as a predetermined length;
An erroneous assembly determination unit that determines that the circuit element is erroneously assembled to the circuit board when the length of the terminal protruding from the second surface of the circuit board is not substantially the same as the predetermined length;
An erroneous assembly detection device for circuit elements comprising: The sensor is a contact sensor;
When the sensor is disposed at a position facing the first hole of the circuit board and the distance from the second surface of the circuit board is substantially the same as the predetermined length, the erroneous assembly determination unit 2. The circuit element misassembly detection device according to claim 1, wherein when the tip of a terminal protruding from the second surface of the circuit board does not contact the sensor, the circuit element is determined to be misassembled to the circuit board. . The sensor has a light emitting part for emitting light and a light receiving part for receiving light, and outputs an electrical signal corresponding to the intensity of light that hits an object and returns to the light receiving part after being emitted from the light emitting part. A photoelectric sensor that
Output from the photoelectric sensor when the light emitting part emits light at a position facing the first hole of the circuit board and having a distance from the second surface of the circuit board longer than the predetermined length. A distance measuring unit that measures the distance between the tip of the terminal protruding from the second surface of the circuit board and the sensor based on the electrical signal;
The erroneous assembly determination unit calculates the length of the terminal protruding from the second surface of the circuit board based on the distance measured by the distance measurement unit, and the calculated length is the predetermined length. The circuit element misassembly detection device according to claim 1, wherein when the circuit elements are not substantially identical, it is determined that the circuit element is misassembled on the circuit board. A sensor drive mechanism that allows the sensor to move to a predetermined position;
A drive control unit for driving and controlling the sensor drive mechanism;
The circuit element erroneous assembly detection apparatus according to any one of claims 1 to 3, further comprising: A circuit board release mechanism for releasing the circuit board from the pallet holding the circuit board;
When the erroneous assembly determination unit determines that the length of the terminal protruding from the second surface of the circuit board is substantially the same as the predetermined length, the terminal is removed from the pallet by the circuit board release mechanism. A circuit board release controller for controlling the release of the circuit board;
The circuit element erroneous assembly detection apparatus according to any one of claims 1 to 4, further comprising: A circuit board having a first terminal of a first length of a circuit element and a second terminal of a second length different from the first length in the first hole and the second hole of the circuit board, respectively. A circuit element erroneous assembly detection method for detecting an erroneous assembly of a circuit element when assembled from a first surface of the circuit board and protruded from the second surface of the circuit board.
Determining by a sensor whether or not the length of the terminal protruding from the second surface of the circuit board is substantially the same as a predetermined length;
Determining that the circuit element has been misassembled on the circuit board when the length of the terminal protruding from the second surface of the circuit board is not substantially the same as the predetermined length;
An erroneous assembly detection method for circuit elements comprising:

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