JP2013239928A - 複合電子部品 - Google Patents
複合電子部品 Download PDFInfo
- Publication number
- JP2013239928A JP2013239928A JP2012111936A JP2012111936A JP2013239928A JP 2013239928 A JP2013239928 A JP 2013239928A JP 2012111936 A JP2012111936 A JP 2012111936A JP 2012111936 A JP2012111936 A JP 2012111936A JP 2013239928 A JP2013239928 A JP 2013239928A
- Authority
- JP
- Japan
- Prior art keywords
- package
- electronic component
- composite electronic
- functional element
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
【解決手段】配線基板40と、分波器チップを含み、配線基板40の上面に設けられた機能素子パッケージ50、54、56及び58と、配線基板40の上面に設けられたダミーパッケージ60と、機能素子パッケージ及びダミーパッケージ60の上に設けられたリッド42と、を具備し、当該ダミーパッケージ60は、機能素子パッケージ50と機能素子パッケージ54との間である実装位置P2に搭載・配設され、複数の機能素子パッケージと1つのダミーパッケージ60とを共通に覆って、リッド42が配設される事で、機械的強度の高い電子部品を構成する。
【選択図】図6
Description
40 配線基板
42 リッド
44 隙間
46 空間
50、52、54、56、58 機能素子パッケージ
60 ダミーパッケージ
72 分波器チップ
100、102、106、108、200、300 複合電子部品
Claims (10)
- 配線基板と、
弾性波フィルタを含み、前記配線基板の上面に設けられたパッケージと、
前記配線基板の上面に設けられたダミーパッケージと、
前記パッケージ及び前記ダミーパッケージの上に設けられたリッドと、を具備することを特徴とする複合電子部品。 - 前記パッケージと前記ダミーパッケージとの間には隙間が形成されていることを特徴とする請求項1記載の複合電子部品。
- 前記配線基板の上面には複数の前記パッケージが設けられ、
前記複数のパッケージの間には隙間が形成されていることを特徴とする請求項1又は2記載の複合電子部品。 - 前記ダミーパッケージは、不良品のパッケージであることを特徴とする請求項1から3いずれか一項記載の複合電子部品。
- 前記ダミーパッケージは弾性波フィルタを含まないことを特徴とする請求項1から3いずれか一項記載の複合電子部品。
- 前記パッケージは複数の前記弾性波フィルタを含む分波器を備えることを特徴とする請求項1から5いずれか一項記載の複合電子部品。
- 前記ダミーパッケージは、前記パッケージと同じ重さを有することを特徴とする請求項1から6いずれか一項記載の複合電子部品。
- 前記ダミーパッケージは、2つの前記パッケージの間であって、かつ前記配線基板の中心部から外れた位置に設けられていることを特徴とする請求項1から7いずれか一項記載の複合電子部品。
- 前記ダミーパッケージは前記配線基板の中心部に位置することを特徴とする請求項1から7いずれか一項記載の複合電子部品。
- 前記ダミーパッケージは前記配線基板の周縁部に設けられ、1つの前記パッケージの隣に位置することを特徴とする請求項1から7いずれか一項記載の複合電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012111936A JP5878823B2 (ja) | 2012-05-15 | 2012-05-15 | 複合電子部品 |
SG2013007745A SG195436A1 (en) | 2012-05-15 | 2013-01-31 | Composite electronic component |
US13/759,402 US9306538B2 (en) | 2012-05-15 | 2013-02-05 | Composite electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012111936A JP5878823B2 (ja) | 2012-05-15 | 2012-05-15 | 複合電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013239928A true JP2013239928A (ja) | 2013-11-28 |
JP5878823B2 JP5878823B2 (ja) | 2016-03-08 |
Family
ID=49580848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012111936A Active JP5878823B2 (ja) | 2012-05-15 | 2012-05-15 | 複合電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9306538B2 (ja) |
JP (1) | JP5878823B2 (ja) |
SG (1) | SG195436A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10052073B2 (en) | 2016-05-02 | 2018-08-21 | Dexcom, Inc. | System and method for providing alerts optimized for a user |
JP2019087943A (ja) * | 2017-11-09 | 2019-06-06 | 株式会社東芝 | 無線通信装置 |
EP3749183B1 (en) | 2018-02-09 | 2024-04-10 | DexCom, Inc. | System for decision support |
US11510353B2 (en) * | 2018-02-12 | 2022-11-22 | Fuji Corporation | Mounting accuracy measurement chip and mounting accuracy measurement kit |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198774A (ja) * | 2000-10-17 | 2002-07-12 | Murata Mfg Co Ltd | 複合電子部品 |
JP2007180529A (ja) * | 2005-12-02 | 2007-07-12 | Nec Electronics Corp | 半導体装置およびその製造方法 |
WO2007114224A1 (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corporation | 回路モジュール及び無線通信機器、並びに回路モジュールの製造方法 |
JP2009296508A (ja) * | 2008-06-09 | 2009-12-17 | Fujitsu Media Device Kk | 分波器 |
JP2010258586A (ja) * | 2009-04-22 | 2010-11-11 | Taiyo Yuden Co Ltd | 通信モジュール |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3375936B2 (ja) * | 2000-05-10 | 2003-02-10 | 富士通株式会社 | 分波器デバイス |
US6700061B2 (en) * | 2000-10-17 | 2004-03-02 | Murata Manufacturing Co., Ltd. | Composite electronic component |
US6762495B1 (en) * | 2003-01-30 | 2004-07-13 | Qualcomm Incorporated | Area array package with non-electrically connected solder balls |
US8779599B2 (en) * | 2011-11-16 | 2014-07-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages including active dies and dummy dies and methods for forming the same |
-
2012
- 2012-05-15 JP JP2012111936A patent/JP5878823B2/ja active Active
-
2013
- 2013-01-31 SG SG2013007745A patent/SG195436A1/en unknown
- 2013-02-05 US US13/759,402 patent/US9306538B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198774A (ja) * | 2000-10-17 | 2002-07-12 | Murata Mfg Co Ltd | 複合電子部品 |
JP2007180529A (ja) * | 2005-12-02 | 2007-07-12 | Nec Electronics Corp | 半導体装置およびその製造方法 |
WO2007114224A1 (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corporation | 回路モジュール及び無線通信機器、並びに回路モジュールの製造方法 |
JP2009296508A (ja) * | 2008-06-09 | 2009-12-17 | Fujitsu Media Device Kk | 分波器 |
JP2010258586A (ja) * | 2009-04-22 | 2010-11-11 | Taiyo Yuden Co Ltd | 通信モジュール |
Also Published As
Publication number | Publication date |
---|---|
US9306538B2 (en) | 2016-04-05 |
US20130307636A1 (en) | 2013-11-21 |
SG195436A1 (en) | 2013-12-30 |
JP5878823B2 (ja) | 2016-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102436686B1 (ko) | 내장형 rf 필터 패키지 구조 및 그 제조 방법 | |
US10305444B2 (en) | Electronic component module | |
US9748194B2 (en) | Electronic device | |
JP6282410B2 (ja) | モジュール | |
JP2006203652A (ja) | 高周波モジュール及びそれを用いた通信機器 | |
KR102599294B1 (ko) | 고주파 모듈 및 통신 장치 | |
JP5878823B2 (ja) | 複合電子部品 | |
US11831299B2 (en) | High-frequency module and communication device | |
WO2021002157A1 (ja) | 高周波モジュール及び通信装置 | |
US9214445B2 (en) | Electronic component and method of fabricating the same | |
JP5494840B2 (ja) | 高周波モジュール | |
US9160301B2 (en) | Acoustic wave device | |
WO2014013831A1 (ja) | モジュールおよびこのモジュールの製造方法 | |
US7763960B2 (en) | Semiconductor device, method for manufacturing semiconductor device, and electric equipment system | |
US20220173759A1 (en) | Radio frequency module and communication device | |
WO2019065668A1 (ja) | 高周波モジュールおよび通信装置 | |
KR101633643B1 (ko) | 필터 모듈 | |
KR20210117949A (ko) | 고주파 모듈 및 통신 장치 | |
JP5716875B2 (ja) | 電子部品及び電子モジュール | |
JP2015041680A (ja) | 電子デバイス | |
WO2022138441A1 (ja) | 高周波モジュール及び通信装置 | |
US20230298959A1 (en) | High-frequency module and communication device | |
KR102443990B1 (ko) | 고주파 모듈 및 통신 장치 | |
JP2006128327A (ja) | 電子部品及びその製造方法 | |
JP2006066731A (ja) | 高周波配線基板及びそれを用いた通信機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141125 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151104 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151217 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160119 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160129 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5878823 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |