JP2013239800A - Electronic component manufacturing method, electronic component testing method, sheet substrate, electronic component and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit decrease in the number of electronic components to be taken from a sheet substrate; ensure a required contact area of an electrode for a testing probe on the electronic component; and decrease the occurrence of parasitic capacitance against the electronic element arranged on the sheet substrate.SOLUTION: An electronic component manufacturing method comprises: arranging, on a sheet substrate 54 where piezoelectric vibrating reeds 38 and lids 32 that cover the piezoelectric vibrating reeds 38 are to be arranged in a plurality of substrate regions 56, interconnections 34A, 34B for electrically connecting the piezoelectric vibrating reed 38 to be arranged in a first substrate region with the lid to be arranged in at least one of second substrate regions located around the first substrate region so as to cross a border of the first substrate region; arranging the piezoelectric reed 38 and the lid 32 in each substrate region 56 and subsequently performing an input and an output of signals to the piezoelectric vibrating reed 38 arranged in the first substrate region through the lid 32 connected to the interconnections 34A, 34B; and dividing the sheet substrate 54 along borders to part each of the interconnections 34A, 34B.

Description

  The present invention relates to an electronic component manufacturing method, an electronic component inspection method, a sheet substrate, an electronic component, and an electronic device, and in particular, a technique capable of easily performing an inspection after mounting an electronic element on which the electronic component is mounted. It is about.

  Conventionally, a so-called multi-cavity technique has been used as an efficient method for manufacturing electronic components. Specifically, a sheet substrate having a plurality of substrate regions is prepared, and electronic elements such as piezoelectric vibrators and ICs are arranged in each substrate region, and the sheet substrate is divided into pieces along the boundary of the substrate region. Thus, individual electronic components are obtained.

  By the way, in the above-described electronic component, there are cases where operations such as operation confirmation are performed on an electronic element mounted on the electronic component. For example, when the electronic element is the above-described piezoelectric vibrator, the inspection probe is brought into contact with a connection electrode electrically connected to the piezoelectric vibrator on the substrate, and whether the piezoelectric vibrator oscillates or the resonance frequency. Or whether the CI value or the like is within an appropriate range. By this operation, only the electronic components that have passed the inspection can be advanced to the next step.

  However, as the electronic component is miniaturized, the connection electrode described above becomes very small, making it difficult to contact the inspection probe. Therefore, a technique is disclosed in which an inspection electrode having a larger area than the connection electrode is newly provided on the sheet substrate while being electrically connected to the electronic element, and the inspection probe is brought into contact with the inspection electrode.

  FIG. 21 shows a plan view of the sheet substrate described in Patent Document 1. FIG. Patent Document 1 discloses a sheet substrate 100 in which scribe lines 104 are arranged vertically and horizontally, and substrate regions 102 and inspection regions 112 are alternately partitioned. In the sheet substrate 100, a region surrounded by the scribe line 104 of the sheet substrate 100 is a substrate region 102 and an inspection region 112. The inspection electrode 106 is disposed in the inspection region 112 of the sheet substrate 100, and the connection electrode 108 connected to the electronic element (not shown) is disposed in the substrate region 102. The connection electrode 108 and the inspection electrode 106 are electrically connected to each other by a wiring 110 that straddles the substrate region 102 and the inspection region 112.

  In the above configuration, after the electronic element (not shown) is mounted on the substrate region 102 in a manner to be connected to the connection electrode 108, input / output is inspected with respect to the electronic element (not shown) via the inspection electrode 106. After the inspection, the substrate region 102 is separated from the sheet substrate 100 along the scribe line 104 and the wiring 110 is divided.

  However, in the configuration of Patent Document 1, since the inspection region 112 is required to form the inspection electrode 106, there is a problem that the amount of the substrate region 102 in the sheet substrate 100 is reduced.

  In order to solve this problem, as shown in FIG. 22, in Patent Document 2, a sheet substrate 202 in which first substrate regions 204 and second substrate regions 206 adjacent to each other are alternately used is used. An electronic component 200 having an electronic element 208 disposed in the substrate region 204 and an inspection electrode 210 disposed on the lower surface of the second substrate region 206 is disclosed. The electronic element 208 and the inspection electrode 210 are electrically connected by a wiring 212 that passes through the first substrate region 204 and the second substrate region 206.

  In the above configuration, after the inspection probe 210 is brought into contact with the inspection electrode 210 and the input / output inspection for the electronic element 208 is performed via the inspection electrode 210 and the wiring 212, the first substrate region 204 and the second substrate The sheet substrate 202 is divided along the boundary with the region 206 to divide the electronic component 200 into pieces, and the wiring 212 is divided.

  According to the configuration of Patent Document 2, unlike the case of Patent Document 1, it is not necessary to design the inspection region 112, and thus it is possible to suppress a reduction in the amount of the substrate region (electronic component 200) in the sheet substrate 202.

JP 2005-109783 A JP 2008-35486 A

  However, in the case of the configuration of Patent Document 2, the inspection electrode 210 remains on the electronic component 200 even after the sheet substrate 202 is divided. Therefore, the inspection electrode 210 becomes a parasitic capacitance with respect to the electronic element 208, which may adversely affect the characteristics of the electronic element 208.

  Therefore, the present invention pays attention to the above-described problems, suppresses a reduction in the amount of electronic components on the sheet substrate, secures a contact area of the inspection electrode on the electronic component side required by the inspection probe, and An object of the present invention is to provide an electronic component manufacturing method, an electronic component inspection method, a sheet substrate, an electronic component, and an electronic device that reduce the occurrence of parasitic capacitance with respect to an electronic element disposed on the sheet substrate.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 With respect to a sheet substrate having a plurality of substrate regions and an electronic device and a lid covering the electronic device being disposed in each substrate region, the electronic device disposed in the first substrate region; A wiring for electrically connecting the lids arranged in at least one of the second substrate regions around the first substrate region to straddle the boundary of the first substrate region After the first step of placing the electronic device and the lid in each substrate region, signal input / output to the electronic device placed in the first substrate region was connected to the wiring A method of manufacturing an electronic component, comprising: a second step performed through the lid body; and a third step of dividing the sheet substrate along the boundary to divide the wiring.

  According to the above method, in the inspection of the input / output of the electronic element after mounting, the lid which is the upper surface of the electronic component can be used as the inspection electrode without newly providing an inspection electrode. Then, the input / output inspection of the electronic device to be inspected is a second substrate region around the first substrate region in which the electronic device is disposed, and is electrically connected to the electronic device to be inspected. 2 can be used. Therefore, while ensuring the contact area of the inspection electrode on the electronic component side required by the inspection probe, it is possible to suppress a decrease in the amount of the electronic component on the sheet substrate and to reduce the parasitic capacitance to the electronic element after the sheet substrate is divided. This is a method for manufacturing an electronic device in which the occurrence of this is reduced.

  [Application Example 2] A method of manufacturing an electronic component according to Application Example 1, wherein a second electronic element electrically connected to the electronic element is disposed in the substrate region after the second step. .

  According to the above method, the second electronic element can be mounted only on the substrate region where the mounted electronic element operates favorably, so that the loss of the second mounting element can be avoided and the cost can be suppressed.

  Application Example 3 With respect to a sheet substrate having a plurality of substrate regions and having an electronic element and a lid covering the electronic device disposed in each substrate region, the electronic device disposed in the first substrate region; Wiring for electrically connecting the lid disposed in at least one of the second substrate regions around the first substrate region to each other is disposed, and the electronic element is disposed in each substrate region After the lid is arranged, input / output of signals to and from the electronic element arranged in the first substrate region is performed through the lid connected to the wiring. Method.

  For the same reason as in Application Example 1, while ensuring the contact area of the inspection electrode on the electronic component side required by the inspection probe, the reduction in the amount of the electronic component in the sheet substrate is suppressed, and the sheet substrate is divided It becomes an inspection method of an electronic device in which the generation of parasitic capacitance to a later electronic element is reduced.

  Application Example 4 A sheet substrate having a plurality of substrate regions and having an electronic element and a lid covering the electronic device disposed in each substrate region, the sheet substrate being disposed across a boundary of the substrate region, Wiring electrically connecting the electronic element disposed in the substrate region and the lid disposed in at least one of the second substrate regions around the first substrate region A sheet substrate comprising:

  For the same reason as in Application Example 1, while ensuring the contact area of the inspection electrode on the electronic component side required by the inspection probe, the reduction in the amount of the electronic component in the sheet substrate is suppressed, and the sheet substrate is divided A sheet substrate in which generation of parasitic capacitance with respect to a later electronic element is reduced is obtained.

  Application Example 5 The wiring is arranged such that a path that alternately passes through the boundary of the substrate region that the wiring straddles and the substrate region where the wiring is disposed passes through the substrate region with a single stroke. The sheet substrate according to Application Example 4, wherein the sheet substrate is characterized in that:

With the above configuration, the input / output inspection of all the electronic elements except the electronic elements arranged in the substrate region serving as the end portion of the path is performed in the second area around the first substrate region in which the electronic elements are arranged. This can be done through a lid disposed in the substrate area. On the other hand, the input / output inspection of the electronic element arranged in the substrate region serving as the end of the path can be performed by connecting a wiring connected to the electronic element to the inspection electrode.
Therefore, the number of inspection electrodes can be suppressed and the cost can be suppressed.

  Application Example 6 The application is characterized in that the wiring is arranged so that a route that alternately passes through a boundary of the substrate region across which the wiring extends and the substrate region in which the wiring is arranged circulates. The sheet substrate according to Example 4 or 5.

  With the above configuration, all input / output inspections of the electronic elements arranged on the path are performed via the lid arranged in the second substrate region around the first substrate region in which the electronic elements are arranged. Can be done. Therefore, the inspection electrode described in Application Example 5 is not necessary, and the cost can be suppressed.

  Application Example 7 The electronic element and the lid are arranged in each substrate region of the sheet substrate according to any one of Application Examples 4 to 6, and the sheet substrate is divided along the boundary of the substrate region. Electronic parts characterized by being separated into individual pieces.

  For the same reason as in Application Example 1, while ensuring the contact area of the inspection electrode on the electronic component side required by the inspection probe, the reduction in the amount of the electronic component in the sheet substrate is suppressed, and the sheet substrate is divided The electronic component is reduced in the generation of parasitic capacitance with respect to the subsequent electronic element.

  Application Example 8 The electronic component according to Application Example 7, wherein the electronic element is a piezoelectric vibrating piece and the second electronic element is an integrated circuit electrically connected to the piezoelectric vibrating piece. .

  With the above configuration, a piezoelectric device that oscillates by itself can be constructed, and for the same reason as in Application Example 2, it is possible to avoid the loss of the integrated circuit and reduce the cost.

[Application Example 9] An electronic apparatus comprising the electronic component according to any one of Application Examples 7 and 8.
For the same reason as in Application Example 1, while ensuring the area of the inspection electrode required by the inspection probe, the reduction in the amount of electronic components on the sheet substrate is suppressed, and the parasitic on the electronic elements after the sheet substrate is divided An electronic device with reduced generation of capacity is obtained.

It is a top view of the electronic component (before individualization) of a 1st embodiment. It is the sectional view on the AA line of FIG. It is a bottom view of the electronic component (before singulation) of a 1st embodiment. FIG. 2 is a cross-sectional view of the electronic component (after singulation) according to the first embodiment, and is a cross-sectional view based on a line on the left side of the stepped part of the AA line in FIG. 1. FIG. 2 is a cross-sectional view of the electronic component (after separation) according to the first embodiment, and is a cross-sectional view based on a line on the right side of the stepped part of the AA line in FIG. 1. 6A and 6B are diagrams illustrating a manufacturing process of the electronic component according to the first embodiment, in which FIG. 6A is a sheet substrate manufacturing process, FIG. 6B is a piezoelectric vibrating piece mounting process, and FIG. 6C is a lid; The mounting process and the piezoelectric vibrating piece inspection process are shown. It is a figure which shows the manufacturing process of the base substrate of 1st Embodiment, Fig.7 (a) shows a sheet | seat board | substrate division | segmentation process, FIG.7 (b) shows the electronic component after a division | segmentation. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (the 1) of an inspection process. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (2) of an inspection process. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (the 3) of an inspection process. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (the 4) of an inspection process. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (the 5) of an inspection process. It is a figure which shows the pattern of the wiring in the electronic component (before individualization) of 1st Embodiment, and the path | route (6) of an inspection process. It is a top view of the electronic component (before individualization) of a 2nd embodiment. It is AA sectional view taken on the line of FIG. It is the BB sectional drawing of FIG. It is a bottom view of the electronic component (before singulation) of a 2nd embodiment. It is sectional drawing of the electronic component (after individualization) of 2nd Embodiment. It is a figure which shows the electronic component (before individualization) test | inspection method of 2nd Embodiment. The schematic diagram of the electronic device (mobile terminal) carrying the electronic component of this embodiment is shown. 10 is a plan view of a sheet substrate described in Patent Document 1. FIG. 10 is a cross-sectional view of an electronic component described in Patent Document 2. FIG.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 is a plan view of the electronic component (before separation) according to the first embodiment, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is an electronic component according to the first embodiment. The bottom view of (before singulation) is shown. 4 and 5 are cross-sectional views of the electronic component according to the first embodiment (after separation), and a line on the left side of the stepped part of line AA in FIG. 1 and a part on the right side Sectional drawing based on this line is shown. For ease of explanation, the description of the lid 32 is omitted in the electronic component 10 drawn in the center in FIG. 1, and the description of the lid 32 and the piezoelectric vibrating piece 38 is omitted in the electronic component 10 drawn on the right side. Is omitted.

  Although details will be described later, the electronic component 10 of the present embodiment is obtained by forming a plurality of electronic components 10 on the sheet substrate 54 and then separating the sheet substrate 54 into individual pieces. In this embodiment, the piezoelectric vibrating piece 38 after being mounted on the sheet substrate 54 is a substrate region 56 (second substrate region) around the substrate region 56 (first substrate region) on which the piezoelectric vibrating piece 38 is mounted. Wiring 34A, 34B that can be electrically connected to the lid 32 arranged in at least one (two in this embodiment) of the substrate region) is formed so as to straddle the substrate region 56 (first substrate region), The input / output inspection of the piezoelectric vibrating reed 38 is performed through the lid 32, and the wirings 34A and 34B are divided at the time of separation. Here, when the input / output inspection after mounting the piezoelectric vibrating piece 38 is performed, the substrate region 56 on which the piezoelectric vibrating piece 38 to be inspected is disposed is set as the first substrate region, and the substrate region 56 around the substrate region 56 is the first substrate region. 2 substrate region.

  As shown in FIGS. 4 and 5, the electronic component 10 of the present embodiment is electrically connected to the substrate 12 made of an insulating material such as ceramic, the piezoelectric vibrating piece 38 (electronic element), and the piezoelectric vibrating piece 38. The integrated integrated circuit 50 (second electronic element) and a lid 32 (lid body) having conductivity such as metal are formed into a piezoelectric device that oscillates itself by receiving power from the outside.

  The substrate 12 that forms the outer shape of the electronic component 10 has a four-layer structure of a first frame substrate 14, a first center substrate 18, a second center substrate 22, and a second frame substrate 26 from the bottom. As shown, the cross section is an H-shaped substrate 12.

  The first frame-like substrate 14 has a rectangular frame shape in plan view, and forms an accommodation space for accommodating the integrated circuit 50 by bonding to the first center substrate 18. A mounting electrode 16 is provided on the lower surface of the first frame-shaped substrate 14, and the mounting electrode 16 is connected to a mounting destination electrode.

  The first center substrate 18 has the integrated circuit 50 mounted on the lower surface thereof, and the connection electrode 20 is provided at a position facing the pad electrode 52 of the integrated circuit 50.

  The second center substrate 22 has a piezoelectric vibrating piece 38 mounted on the upper surface thereof, and mount electrodes 24 </ b> A and 24 </ b> B are disposed at positions where the second center substrate 22 is joined to the piezoelectric vibrating piece 38. Further, the mount electrodes 24A and 24B are electrically connected to a part of the connection electrode 20 through a through electrode (not shown) penetrating the first center substrate 18 and the second center substrate 22. Therefore, the piezoelectric vibrating piece 38 and the integrated circuit 50 are electrically connected.

  The second frame-shaped substrate 26 has a rectangular frame shape in plan view, and is bonded to the second center substrate 22 to form a storage space for storing the piezoelectric vibrating piece 38. A frame-shaped metallization 28 is provided on the upper surface of the second frame-shaped substrate 26, and a lid 32 is bonded to the metallization 28. The metallized 28 is electrically connected to the mounting electrode 16a through the second frame substrate 26, the second center substrate 22, the first center substrate 18, and the through electrode 30A (FIG. 5) penetrating the first frame substrate 14. Has been.

The lid 32 is bonded to the metallization 28 around the opening of the second frame-shaped substrate 26 to seal the opening. Therefore, the piezoelectric vibrating piece 38 can be vacuum-sealed by bonding the lid 32 to the metallized 28 in a vacuum environment.
On the other hand, the lid 32 bonded to the metallized 28 can be grounded by grounding the mounting electrode 16a. Note that the connection electrode 20 connected to the grounding pad electrode 52 of the integrated circuit 50 is electrically connected to the through electrode 30A.

In the present embodiment, wirings 34 </ b> A and 34 </ b> B exposed on the side surface of the substrate 12 are provided on the second center substrate 22 (or the first center substrate 18).
As shown in FIGS. 4 and 5, the wiring 34Aa is formed at a position facing the mount electrode 24A on the lower surface of the second center substrate 22, and is electrically connected to the mount electrode 24A through the through electrode 36A. . The wiring 34 </ b> Aa extends to the side surface of the substrate 12. As described later, the wiring 34Aa is the wiring 34A in the sheet substrate 54 before separation.

  Similarly, the wiring 34Ba is formed at a position facing the mount electrode 24B, and is electrically connected to the mount electrode 24B through the through electrode 36B. The wiring 34Ba extends in the opposite direction to the wiring 34Aa and extends to the side surface of the substrate 12. As will be described later, the wiring 34Ba is the wiring 34B in the sheet substrate 54 before separation.

  As shown in FIGS. 1 and 4, the piezoelectric vibrating piece 38 is formed of a piezoelectric material such as quartz. In the present embodiment, for example, a thickness-shear vibrating piece using a quartz AT-cut substrate is used. The piezoelectric vibrating piece 38 includes a vibrating portion 40 that vibrates in thickness and a mount portion 42 that is bonded to the second center substrate 22. An excitation electrode 44A is disposed on the upper surface of the vibration unit 40, and an excitation electrode 44B is disposed on the lower surface. An extraction electrode 46A (FIG. 1) is extracted from the excitation electrode 44A, and an extraction electrode 46B (FIG. 1) is extracted from the excitation electrode 44B. The extraction electrode 46 </ b> A is extracted to the lower surface of the mount portion 42. The extraction electrode 46 </ b> B is extracted to the lower surface of the mount portion 42 via the upper surface and side surfaces of the mount portion 42.

  The mount portion 42 is joined to the second center substrate 22 in such a manner that the lead electrodes 46A, 46B and the mount electrodes 24A, 24B are joined by the conductive adhesives 48A, 48B. Accordingly, the piezoelectric vibrating piece 38 is supported by the substrate 12 in a cantilevered state and is electrically connected to the integrated circuit 50. In addition, as the piezoelectric vibrating piece 38, a tuning fork type vibrating piece, a double tuning fork type vibrating piece, a SAW resonance piece, and a gyro vibrating piece can be applied.

  The integrated circuit 50 is integrally formed with an oscillation circuit that drives using the piezoelectric vibrating piece 38 as an oscillation source, a temperature compensation circuit that compensates the temperature of the oscillation signal of the oscillation circuit, and the like. A pad electrode 52 is disposed on the active surface (upper surface) of the integrated circuit 50. The pad electrode 52 includes connection terminals (X1, X2) that are electrically connected to the piezoelectric vibrating piece 38. These pad electrodes 52 are electrically connected to the mount electrodes 24A and 24B via through electrodes (not shown), respectively. The pad electrode 52 is a power supply terminal (Vcc) that receives power from the outside, a ground terminal (GND), an oscillation signal output terminal (O / P), and other adjustment terminals for writing programs and the like. ing. Each of these pad electrodes 52 is electrically connected to the mounting electrode 16, and the ground terminal (GND) is electrically connected to the mounting terminal 16a. Therefore, the number of mounting electrodes 16 is designed according to the number of electrode pads 52 of the integrated circuit 50.

  As shown in FIGS. 1 to 3, the sheet substrate 54 is a member before the substrate 12 of the electronic component 10 is separated. In the sheet substrate 54, substrate regions 56 serving as a share for each electronic component 10 are partitioned in a matrix. A dividing groove 58 for dividing the sheet substrate 54 is formed at the boundary of the substrate region 56.

  As shown in FIG. 2, the sheet substrate 54 has a four-layer structure of a first sheet substrate 60, a second sheet substrate 62, a third sheet substrate 64, and a fourth sheet substrate 66 from the bottom.

  The first sheet substrate 60 is a member before the first frame substrate 14 is separated into pieces, and has a form in which the first frame substrates 14 are gathered in a matrix. A dividing groove 58 for dividing the sheet substrate 54 is formed on the lower surface of the first sheet substrate 60.

  The second sheet substrate 62 is a member before the first center substrate 18 is singulated, and has a form in which the first center substrates 18 are gathered in a matrix. The third sheet substrate 64 is a member before the second center substrate 22 is divided into pieces, and has a form in which the second center substrates 22 are gathered in a matrix.

  The fourth sheet substrate 66 is a member before the above-described second frame substrate 26 is singulated, and has a form in which the second frame substrates 26 are gathered in a matrix. A dividing groove 58 for dividing the sheet substrate 54 is formed on the upper surface of the fourth sheet substrate 66.

  As shown in FIGS. 1 and 2, the third sheet substrate 64 (which may be the second sheet substrate 62) is connected to the mount electrodes 24A and 24B and the wiring 34A electrically connected through the through electrodes 36A and 36B. , 34B are arranged.

  The wiring 34A electrically connected to the mount electrode 24A extends to the right from a position directly below the mount electrode 24A. Then, the substrate region 56 including the mount electrode 24A extends across the dividing groove 58 to a position where the metallized 28 of the substrate region 56 on the right side is disposed. The wiring 34A is electrically connected to the metallized 28 via the through electrode 30A.

  The wiring 34B electrically connected to the mount electrode 24B extends to the left from the position directly below the mount electrode 24B. Then, the substrate region 56 including the mount electrode 24B extends across the dividing groove 58 to a position where the metallized 28 of the substrate region 56 on the left side is disposed. The wiring 34B is electrically connected to the metallized 28 through the through electrode 30B.

  In the present embodiment, the wiring 34A and the wiring 34B extend in opposite directions to straddle the boundary (dividing groove 58) between adjacent substrate regions 56 and are disposed in the substrate region 56 (first substrate region). The piezoelectric vibrating piece 38 and at least one (two in the present embodiment) of the substrate region 56 (second substrate region) around the substrate region 56 where the piezoelectric vibrating piece 38 is arranged are arranged. The lid 32 is electrically connected to each other.

  As shown in FIG. 2, the excitation electrode 44A of the piezoelectric vibrating piece 38 drawn at the center includes an extraction electrode 46A (FIG. 1), a conductive adhesive 48A, a mount electrode 24A, a through electrode 36A, a wiring 34A, and a through electrode 30A. Is electrically connected to the lid 32 of the right substrate region 56 (electronic component 10). Similarly, the excitation electrode 44B is connected to the left substrate region 56 (electronic component 10) via the extraction electrode 46B (FIG. 1), the conductive adhesive 48B, the mount electrode 24B, the through electrode 36B, the wiring 34B, and the through electrode 30B. The lid 32 is electrically connected.

  In the present embodiment, before the sheet substrate 54 is divided, the piezoelectric vibrating reeds 38 disposed in each substrate region 56 (first substrate region) are arranged on the substrate regions 56 (second substrate) on both sides thereof. It is electrically connected to the lid 32 arranged in the region. That is, in the input / output inspection of the piezoelectric vibrating piece 38 after being mounted on the sheet substrate 54, the lid 32 on the upper surface of the electronic component 10 can be used as the inspection electrode without newly providing an inspection electrode. Therefore, it is possible to suppress a reduction in the portion of the substrate region 56 (electronic component 10) in the sheet substrate 54 while securing a contact area of the inspection electrode on the electronic component 10 side required by the inspection probe 68 described later. it can.

  On the other hand, by dividing the sheet substrate 54 along the dividing groove 58, the wirings 34A and 34B are divided, and the piezoelectric vibrating piece 38 is formed only with the integrated circuit 50 arranged in the same substrate region 56 (first substrate region). It can be electrically connected. The lid 32 after the division of the sheet substrate 54 is grounded, so that no parasitic capacitance is generated for the piezoelectric vibrating piece 38. Therefore, the sheet substrate 54 and the electronic component 10 are reduced in the generation of parasitic capacitance with respect to the piezoelectric vibrating piece 38 after the sheet substrate 54 is divided.

Next, the manufacturing process of the electronic component of the first embodiment will be described. 6 and 7 show the manufacturing process of the electronic component of the first embodiment.
As shown in FIG. 6A, the first sheet substrate 60, the second sheet substrate 62, the third sheet substrate 64, and the fourth sheet substrate 66 are formed, and these are laminated to form the sheet substrate 54.

  As shown in FIG. 6B, the piezoelectric vibrating piece 38 is mounted on each substrate region 56. As shown in FIG. 6C, the lid 32 is bonded in each substrate region 56, and the substrate regions 56 on both sides of the substrate region 56 (first substrate region) on which the piezoelectric vibrating piece 38 to be inspected is mounted. The inspection probe 68 is brought into contact with the lid 32 in the (second substrate region). When an input / output inspection is performed on the piezoelectric vibrating piece 38 using the inspection probe 68, the piezoelectric vibrating piece 38 that cannot be operated, or a piezoelectric vibrating piece whose resonance frequency or CI value is out of an allowable range even when operated. 38 can be specified.

  In the manufacturing process of the present embodiment, identification inspection information is generated by associating position information of the inspection probe 68 with pass / fail of the inspection of the piezoelectric vibrating piece 38. Then, a manipulator (not shown) for mounting the integrated circuit 50 is operated based on the identification inspection information, and the integrated circuit 50 is not mounted on the substrate region 56 having the piezoelectric vibrating piece 38 that is rejected based on the identification inspection information. ing. Then, the integrated circuit 50 is mounted only on the substrate region 56 in which the mounted piezoelectric vibrating piece 38 operates favorably. Thereby, the loss of the integrated circuit 50 can be avoided and the cost can be suppressed.

  As shown in FIG. 7A, by pressing a blade (not shown) along the dividing groove 58 of the sheet substrate 54, the electronic component 10 is separated into pieces as shown in FIG. 7B. . As a result of the separation, the wires 34A and 34B are divided with the dividing groove 58 as a boundary, but the wires 34Aa (FIG. 5) and 34Ba (FIG. 4) remain in the electronic component 10.

  8 to 13 show wiring patterns and inspection process paths in the electronic component (before separation) of the first embodiment. 8 to 13, the description of the lid 32 and the piezoelectric vibrating piece 38 is omitted.

  When the electronic component 10 is inspected, a path 70 that alternately passes through the boundary of the substrate region 56 over which the wirings 34A and 34B straddle and the substrate region 56 in which the wirings 34A and 34B are arranged passes through the inspection probe 68. This is the direction in which the substrate region 56 that was the inspection target is moved to the substrate region 56 that is the next inspection target. When inspecting the piezoelectric vibrating piece 38 of the substrate region 56 passing through the k (positive integer) th path in this path 70, the (k-1) th lid 32 and the (k + 1) th lid 32 are used for inspection. The probe 68 is brought into contact. However, there is no substrate region 56 (lid 32) that is one of the connection destinations of the wirings 34A and 34B in the substrate region 56 that is the start and end of the path 70.

  Therefore, as shown in FIG. 8, it is necessary to separately provide inspection electrodes 72 (72A, 72B). For example, in the third sheet substrate 64 (or the second sheet substrate 62) on which the wirings 34A and 34B are arranged, the inspection substrate 64a is left at a position adjacent to the substrate region 56 serving as the start and end of the path 70 described above. Keep it. Inspection electrodes 72A and 72B are formed on the upper surface of the inspection substrate 64a, and wirings 34A and 34B are extended to the lower surface of the inspection substrate 64a. Then, the inspection electrodes 72A and 72B and the wirings 34A and 34B may be electrically connected to each other via through electrodes 74A and 74B that penetrate the inspection substrate 64a.

  As shown in FIG. 8, when inspecting from right to left, when inspecting the piezoelectric vibrating piece 38 in the first (first) substrate region 56, the inspection electrode 72A on the right and the second substrate region are provided. The inspection probe 68 may be brought into contact with the 56 lids 32. When the piezoelectric vibrating piece 38 in the fourth (last) substrate region 56 is inspected, the inspection probe 68 is brought into contact with the inspection electrode 72B on the left and the lid 32 of the third substrate region 56. Good.

  FIG. 8 shows a case where the substrate regions 56 (electronic components 10) are arranged in a horizontal row on the sheet substrate 54. However, when the substrate regions 56 are arranged in a matrix on the sheet substrate 54, the above-described wiring 34A. , 34B, the inspection electrodes 72A, 72B need to be prepared at both ends of each row, and the amount of the substrate area 56 (electronic component 10) in the sheet substrate 54 is reduced. Therefore, as shown in FIGS. 9 to 13, when the substrate region 56 (electronic component 10) is partitioned into a matrix (4 × 4 = 16) on the sheet substrate 54, the patterns of the wirings 34A and 34B are changed. Devise it.

  9 and 10, as described above, not only the pattern for extending the wiring to both adjacent substrate regions 56 in the horizontal direction but also the pattern for extending the wiring to both adjacent substrate regions 56 in the horizontal direction, and one of the wirings in the horizontal direction. In this way, a path 70 that passes through all the substrate regions 56 in a single stroke is constructed by combining the pattern extending to the substrate regions 56 adjacent to each other and the other wiring extending in the vertical direction to the substrate regions 56 adjacent to each other. In FIGS. 9 and 10, the substrate region 56 to be inspected next is the substrate region 56 to be inspected first.

  As a result, only two inspection electrodes 72 are required, and the inspection electrode 72 is provided only on one edge of the sheet substrate 54, so that a reduction in the amount of the sheet substrate 54 can be suppressed.

  11 to 13, a path 76 that goes around the substrate region 56 is constructed using the three patterns described above. In FIG. 11, a path 76 that goes around the substrate region 56 that forms the periphery of the sheet substrate 54 and a path 76 that goes around the inside of the sheet substrate 54 are constructed, and all the substrate areas 56 are covered by the two paths 76. In FIG. 12, all the substrate regions 56 are covered by the two routes 76 in a manner in which the routes 76 that go around the substrate region 56 are arranged side by side. In FIG. 13, a path 76 is constructed that not only goes around the substrate region 56 but also passes through the substrate region 56 with a single stroke to cover all the substrate regions 56. By constructing the path 76 shown in FIGS. 11 to 13, the inspection electrode 72 is not necessary, and a reduction in the amount of the sheet substrate 54 can be avoided.

  In FIG. 11, when the piezoelectric vibrating piece 38 in the first substrate region 56 is inspected, the inspection probe 68 may be brought into contact with the lid 32 in the twelfth and second substrate regions 56. When inspecting the piezoelectric vibrating piece 38 in the substrate region 56, the inspection probe 68 may be brought into contact with the lid 32 of the eleventh and first substrate regions 56. When inspecting the piezoelectric vibrating piece 38 in the thirteenth substrate region 56, the inspection probe 68 may be brought into contact with the lid 32 of the sixteenth and fourteenth substrate regions 56. The sixteenth substrate region When the 56 piezoelectric vibrating reeds 38 are inspected, the inspection probe 68 may be brought into contact with the lid 32 of the 15th and 13th substrate regions 56.

  In FIG. 12, when inspecting the piezoelectric vibrating piece 38 in the first substrate region 56, the inspection probe 68 may be brought into contact with the lid 32 in the eighth and second substrate regions 56. When inspecting the piezoelectric vibrating piece 38 in the substrate region 56, the inspection probe 68 may be brought into contact with the lid 32 of the seventh and first substrate regions 56.

  In FIG. 13, when the piezoelectric vibrating piece 38 in the first substrate region 56 is inspected, the inspection probe 68 may be brought into contact with the lid 32 in the 16th and second substrate regions 56. When inspecting the piezoelectric vibrating piece 38 in the substrate region 56, the inspection probe 68 may be brought into contact with the lid 32 of the fifteenth and first substrate regions 56.

  In FIG. 14, the top view of the electronic component (before individualization) of 2nd Embodiment is shown. 15 is a cross-sectional view taken along line AA in FIG. 14, and FIG. 16 is a cross-sectional view taken along line BB in FIG. In FIG. 17, the bottom view of the electronic component (before singulation) of 2nd Embodiment is shown. FIG. 18 is a cross-sectional view of the electronic component (after separation) according to the second embodiment. In the following description, components common to the first embodiment are denoted by the same reference numerals, and description thereof is omitted unless necessary.

  As shown in FIG. 18, in the electronic component 78 of the second embodiment, the piezoelectric vibrating piece 38 and the integrated circuit 50 are disposed on the same surface of the substrate 80, and the piezoelectric vibrating piece 38 and the integrated circuit 50 are connected to the cap 82 (lid Body). The cap 82 is formed of a conductive member such as a metal, has a housing space for housing the piezoelectric vibrating piece 38 and the integrated circuit 50, and hermetically seals the piezoelectric vibrating piece 38 and the integrated circuit 50.

  As shown in FIGS. 14 to 17, the sheet substrate 84 that is the material of the substrate 80 is a single sheet, and a dividing groove 58 that serves as a boundary of the substrate region 56 is provided on the upper surface and the lower surface. In each substrate region 56 on the upper surface of the sheet substrate 84, mount electrodes 24A and 24B for mounting the piezoelectric vibrating piece 38 and a connection electrode 20 for mounting the integrated circuit 50 are disposed. Further, in each substrate region 56, a metallized 28 that is bonded to the lower surface of the cap 82 is disposed at a position around the piezoelectric vibrating piece 38 and the integrated circuit 50.

  Wirings 34A and 34B that are electrically connected to the mound electrodes 24A and 24B through the through-electrodes 36A and 36B, respectively, are disposed on the lower surface of the sheet substrate 84 so as to face the mount electrodes 24A and 24B.

  14 and 17, the wiring 34A extends to the right from the position facing the mount electrode 24A, straddles the boundary of the substrate region 56 (first substrate region), and the substrate region 56 (second second) on the right side. The substrate electrode is connected to the mounting electrode 16a. The mounting electrode 16a is electrically connected through the metallized 28 and the through electrode 30A. On the other hand, the wiring 34B extends to the left from the position facing the mount electrode 24B, straddles the boundary of the substrate region 56 (first substrate region), and metallizes the substrate region 56 (second substrate region) on the left side. The metallized layer 28 (cap 82) and the through electrode 30B are electrically connected to the metallized layer 28 (cap 82).

  Therefore, the piezoelectric vibrating piece 38 in the central substrate region 56 (first substrate region) shown in FIGS. 15 and 16 is arranged in the left substrate region 56 (second substrate region) as shown in FIG. As shown in FIG. 16, the cap 82 is electrically connected to the cap 82 disposed in the right substrate region 56 (second substrate region).

  In the manufacturing process of the electronic component 78 according to the second embodiment, the piezoelectric vibrating piece 38 and the integrated circuit 50 are mounted on the sheet substrate 84 and then the cap 82 is joined. Then, the inspection of the piezoelectric vibrating piece 38 to be inspected is performed by a cap disposed in the substrate region 56 (second substrate region) adjacent to the substrate region 56 (first substrate region) on which the piezoelectric vibrating piece 38 is mounted. It is also possible to carry out by bringing the inspection probe 68 into contact with 82. However, if the piezoelectric vibrating piece 38 fails the inspection, the integrated circuit 50 mounted on the same substrate region 56 as the piezoelectric vibrating piece 38 is lost even if it operates normally. Therefore, the inspection is performed as follows.

  FIG. 19 shows an electronic component (before separation) inspection method according to the second embodiment. In FIG. 19, the left half with respect to the central one-dot chain line is a cross-sectional view taken along the line AA in FIG. 14, and is in a state before the integrated circuit 50 and the cap 82 are attached, and the right half is FIG. FIG. 6 is a cross-sectional view taken along the line BB of FIG.

  As shown in FIG. 19, the piezoelectric vibrating piece 38 is mounted on each substrate region 56 of the sheet substrate 84. For example, as shown in FIG. 19, an inspection member 86 of the same type as the cap 82 is attached to the tip of the inspection probe 68, and this inspection member 86 is mounted on the substrate region on which the piezoelectric vibrating piece 38 to be inspected is mounted. 56 (first substrate region) is brought into contact with the metallization 28 of the substrate region 56 (second substrate region) adjacent to both sides. As a result, the integrated circuit 50 can be mounted only on the substrate region 56 on which the piezoelectric vibrating reed 38 that has passed the inspection is mounted, and the cap 82 can be joined. Therefore, the loss of the integrated circuit 50 and the cap 82 can be avoided. it can.

  In FIG. 20, the schematic diagram of the electronic device (portable terminal) carrying the electronic component of this embodiment is shown. In FIG. 20, the portable terminal 88 (including PHS) includes a plurality of operation buttons 90, an earpiece 92, and a mouthpiece 94, and a display unit 96 is disposed between the operation buttons 90 and the earpiece 92. Yes. Recently, the portable terminal 88 has a GPS function. Therefore, the portable terminal 88 incorporates the electronic components 10 and 78 (piezoelectric devices) of this embodiment as a clock source for the GPS circuit.

  The electronic device including the electronic components 10 and 78 according to the present embodiment is not limited to the portable terminal 88 described above, but includes a high-functionality portable, digital still camera, personal computer, laptop personal computer, television, video camera, and video tape. Recorder, car navigation device, pager, ink jet dispenser, electronic notebook, calculator, electronic game device, word processor, workstation, video phone, security TV monitor, electronic binoculars, POS terminal, medical device (eg, electronic thermometer, blood pressure) Applicable to meter, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicle, aircraft, ship instruments), flight simulator, etc. Can do.

DESCRIPTION OF SYMBOLS 10 ......... Electronic component, 12 ...... Board | substrate, 14 ......... 1st frame-shaped board | substrate, 16 ......... Mounting electrode, 16a ...... Mounting electrode, 18 ...... 1st center board | substrate, 20 ......... Connection electrode, 22 ......... Second center substrate, 24A, 24B ......... Mount electrode, 26 ......... Second frame substrate, 28 ......... Metalized, 30A, 30B ......... Penetration electrode, 32 ......... Lid, 34A, 34B ......... wiring, 36A, 36B ......... through electrode, 38 ......... piezoelectric vibrating piece, 40 ......... vibrating part, 42 ......... mounting part, 44A, 44B ... excitation electrode 46A, 46B ... Extraction electrode, 48A, 48B ... Conductive adhesive, 50 ......... Integrated circuit, 52 ... Pad electrode, 54 ... Sheet substrate, 56 ... Substrate region, 58 ... ... Dividing grooves, 60 ......... First sheet substrate, 62 ......... Second sheet Plate 64... Third sheet substrate 64 a .. Inspection substrate 66... Fourth sheet substrate 68 .. Inspection probe 70... Path, 72, 72 A, 72 B. Electrode for inspection, 74A, 74B ......... Penetration electrode, 76 ......... Route, 78 ......... Electronic component, 80 ......... Substrate, 82 ......... Cap, 84 ......... Sheet substrate, 86 ......... Inspection 88 ......... Portable terminal, 90 ......... Operation buttons, 92 ......... Entrance, 94 ......... Speech, 96 ......... Display section, 100 ......... Sheet substrate, 102 ......... Substrate area 104 ... scribe line 106 ... electrode for inspection 108 connection electrode 110 wiring 110 inspection area 200 electronic parts 202 sheet Substrate 204... First substrate region 206... Second substrate region 208 ......... electronic device, 210 ......... testing electrode, 212 ......... wiring.

Claims (9)

The electronic device disposed in the first substrate region and the first substrate with respect to a sheet substrate having a plurality of substrate regions and having an electronic device and a lid covering the electronic device disposed in each substrate region A wiring that electrically connects the lid disposed in at least one of the second substrate regions around the region with each other across the boundary of the first substrate region. Process,
After the electronic element and the lid are arranged in each substrate region, a signal input / output to / from the electronic element arranged in the first substrate region is performed via the lid connected to the wiring. Two steps,
And a third step of dividing the sheet substrate along the boundary to divide the wiring.   The method of manufacturing an electronic component according to claim 1, wherein a second electronic element electrically connected to the electronic element is disposed in the substrate region after the second step. The electronic device disposed in the first substrate region and the first substrate with respect to a sheet substrate having a plurality of substrate regions and having an electronic device and a lid covering the electronic device disposed in each substrate region A wiring that electrically connects the lid disposed in at least one of the second substrate regions around the region to each other;
After the electronic element and the lid are arranged in each substrate region, signal input / output to / from the electronic element arranged in the first substrate region is performed via the lid connected to the wiring. A method for inspecting electronic parts characterized by the above. A sheet substrate having a plurality of substrate regions and an electronic element and a lid covering the electronic device being disposed in each substrate region,
The electronic device disposed across the boundary of the substrate region and disposed in at least one of the electronic element disposed in the first substrate region and the second substrate region around the first substrate region. A sheet substrate having wiring for electrically connecting the lid and each other. The wiring is
The path that alternately passes through the boundary of the substrate region across which the wiring straddles and the substrate region in which the wiring is disposed is disposed so as to pass through the substrate region with a single stroke. 4. The sheet substrate according to 4. The wiring is
6. The sheet substrate according to claim 4, wherein the sheet substrate is disposed so that a path that alternately passes through a boundary of the substrate region across which the wiring extends and the substrate region in which the wiring is disposed circulates. .   The electronic device and the lid are arranged in each substrate region of the sheet substrate according to any one of claims 4 to 6, and the sheet substrate is divided into individual pieces along a boundary of the substrate region. An electronic component characterized by that.   The electronic component according to claim 7, wherein the electronic element is a piezoelectric vibrating piece, and the second electronic element is an integrated circuit electrically connected to the piezoelectric vibrating piece.   An electronic apparatus comprising the electronic component according to claim 7.

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