JP2013237894A5 - - Google Patents

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Publication number
JP2013237894A5
JP2013237894A5 JP2012111115A JP2012111115A JP2013237894A5 JP 2013237894 A5 JP2013237894 A5 JP 2013237894A5 JP 2012111115 A JP2012111115 A JP 2012111115A JP 2012111115 A JP2012111115 A JP 2012111115A JP 2013237894 A5 JP2013237894 A5 JP 2013237894A5
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JP
Japan
Prior art keywords
substrate holder
serving
conveying
pair
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012111115A
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Japanese (ja)
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JP5876767B2 (en
JP2013237894A (en
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Publication date
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Priority claimed from JP2012111115A external-priority patent/JP5876767B2/en
Priority to JP2012111115A priority Critical patent/JP5876767B2/en
Priority to TW102115693A priority patent/TW201350625A/en
Priority to KR1020130052387A priority patent/KR20130127921A/en
Priority to EP13020015.7A priority patent/EP2664692A3/en
Priority to US13/893,940 priority patent/US20130306483A1/en
Priority to CN2013101802397A priority patent/CN103422140A/en
Publication of JP2013237894A publication Critical patent/JP2013237894A/en
Publication of JP2013237894A5 publication Critical patent/JP2013237894A5/ja
Publication of JP5876767B2 publication Critical patent/JP5876767B2/en
Application granted granted Critical
Priority to KR1020160100330A priority patent/KR20160098144A/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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基板ホルダ１６の第１保持部材１５４の端部には、基板ホルダ１６を搬送したり、吊下げ支持したりする際の支持部となる一対の略Ｔ字状のハンド１９０が連接されている。 At the end of the first holding member 1 54 of the substrate holder 16, or conveying the substrate holder 16, a pair of substantially T-shaped hand 1 90 serving as a supporting portion at the time of or lowering support hanging is connected Yes.

JP2012111115A 2012-05-15 2012-05-15 Plating apparatus and plating solution management method Active JP5876767B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (en) 2012-05-15 2012-05-15 Plating apparatus and plating solution management method
TW102115693A TW201350625A (en) 2012-05-15 2013-05-02 Plating apparatus and plating solution management method
KR1020130052387A KR20130127921A (en) 2012-05-15 2013-05-09 Plating apparatus and method for controlling plating solution
US13/893,940 US20130306483A1 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method
EP13020015.7A EP2664692A3 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method
CN2013101802397A CN103422140A (en) 2012-05-15 2013-05-15 Plating apparatus and plating solution management method
KR1020160100330A KR20160098144A (en) 2012-05-15 2016-08-05 Plating apparatus and method for controlling plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (en) 2012-05-15 2012-05-15 Plating apparatus and plating solution management method

Publications (3)

Publication Number Publication Date
JP2013237894A JP2013237894A (en) 2013-11-28
JP2013237894A5 true JP2013237894A5 (en) 2014-11-13
JP5876767B2 JP5876767B2 (en) 2016-03-02

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012111115A Active JP5876767B2 (en) 2012-05-15 2012-05-15 Plating apparatus and plating solution management method

Country Status (6)

Country Link
US (1) US20130306483A1 (en)
EP (1) EP2664692A3 (en)
JP (1) JP5876767B2 (en)
KR (2) KR20130127921A (en)
CN (1) CN103422140A (en)
TW (1) TW201350625A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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JP6022922B2 (en) * 2012-12-13 2016-11-09 株式会社荏原製作所 Sn alloy plating apparatus and method
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (en) 2014-12-19 2016-06-17 주식회사 포스코 Apparatus for controlling nikel plating solution
CN105177646B (en) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 A kind of device for being used to produce cyanide-free copper electroplating solution
KR102002342B1 (en) * 2018-06-28 2019-07-23 김대범 Device for agitating and supplying of plating solution
CN110161306A (en) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 Multiloop ampere-hour total amount instrument and electroplating control system and method
CN110318090B (en) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 Electroplating device and electroplating method for printed circuit board
CN111663172A (en) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 Electroplating chemical monitoring method, system and device
KR102192890B1 (en) * 2020-07-10 2020-12-18 김춘옥 Dielectric ceramic filter dipping methodi

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