JP2013236141A - Antenna device - Google Patents

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JP2013236141A
JP2013236141A JP2012105745A JP2012105745A JP2013236141A JP 2013236141 A JP2013236141 A JP 2013236141A JP 2012105745 A JP2012105745 A JP 2012105745A JP 2012105745 A JP2012105745 A JP 2012105745A JP 2013236141 A JP2013236141 A JP 2013236141A
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radiation electrode
antenna
support member
antenna device
electrode
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JP6011910B2 (en
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Naoyuki Onishi
直幸 大西
Hirohiko Miki
裕彦 三木
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Proterial Ltd
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Hitachi Metals Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an antenna device that is small enough to have it contained in a mobile communication device, that is able to receive a signal of FM radio broadcast, and that reduces an impact of noise without installing a metal shielding member and the like.SOLUTION: An antenna device comprises: a chip antenna provided with a first radiation electrode; a power supply terminal to the first radiation electrode; and a support member provided with a second radiation electrode. On the support member, the chip antenna is mounted such that the chip antenna overlaps with the second radiation electrode with space in between. The first radiation electrode of the chip antenna is formed in a coil shape, the second radiation electrode of the support member is formed in a linear shape, one end of the first radiation electrode is connected with the power supply terminal, the other end is connected with one end of the second radiation electrode, and the second radiation electrode is placed farther from a circuit board on which the support member is mounted than the first radiation electrode.

Description

本発明は、携帯電話等の小型の移動体通信機に用いられるアンテナ装置に関し、特には小型化が可能なFMラジオ放送受信用アンテナ装置に関する。   The present invention relates to an antenna device used in a small mobile communication device such as a mobile phone, and more particularly to an FM radio broadcast receiving antenna device that can be miniaturized.

近年、携帯電話機等の移動体通信機は多機能化が進み、通話のみならずFMラジオを受信する付加機能を備えるものも少なくない。VHF帯を利用するFMラジオ放送では、その音声信号を聞くためのイヤホンのケーブル長さを受信周波数に応じて選定することでアンテナとして使用することが行われている。一方で、イヤホンが接続されていないとFMラジオ放送を受信できない為、移動体通信機に内蔵可能な小型のアンテナ装置が求められていた。   In recent years, mobile communication devices such as mobile phones have become more multifunctional, and many have an additional function of receiving FM radio as well as calls. In FM radio broadcasting using the VHF band, it is used as an antenna by selecting the cable length of an earphone for listening to the audio signal according to the reception frequency. On the other hand, FM radio broadcasts cannot be received unless earphones are connected, so there has been a demand for a small antenna device that can be built into a mobile communication device.

この様な課題に対して、特許文献1には、図10に示す様に、プリント基板220上に搭載されている第1アンテナ223と、携帯電話機のキャビネットの空き部分に導電膜をコーティングして形成された第2アンテナ213とを、それぞれの一端側214,224で接続して、必要な長さをもった一つのFMラジオ放送受信アンテナ装置とすることが記載されている。   To deal with such a problem, Patent Document 1 discloses that a conductive film is coated on the first antenna 223 mounted on the printed circuit board 220 and the empty part of the cabinet of the mobile phone as shown in FIG. It is described that the formed second antenna 213 is connected at one end side 214 and 224 to form one FM radio broadcast receiving antenna device having a necessary length.

特開2006−217381号公報JP 2006-217381 A

特許文献1の受信アンテナ装置は、波長λの1/4の長さで動作するモノポールアンテナで構成される。例えば、FMラジオの受信帯域である80MHzの信号を受信するのに必要なアンテナの物理的な長さは、およそ86cmにもなる。アンテナを指示する絶縁体による波長短縮効果を50%程度見込んでも、40cmを越える長さが必要となる。   The receiving antenna device of Patent Document 1 is configured by a monopole antenna that operates at a length of ¼ of the wavelength λ. For example, the physical length of the antenna required to receive an 80 MHz signal, which is the FM radio reception band, is approximately 86 cm. Even if the wavelength shortening effect by the insulator indicating the antenna is expected to be about 50%, a length exceeding 40 cm is required.

特許文献1においては、プリント基板上に搭載されている第1アンテナ223は、銅板を所定形状に打ち抜いたプレートを樹脂成形体222に貼り合わせて形成された銅板アンテナである。携帯電話機に内蔵された実施態様によれば、その長さは、せいぜい10cm程度であると類推される。受信に必要なアンテナの物理長を確保するには、線状の蒸着アンテナとして構成される第2アンテナを、相当に長く構成する必要がある。第2アンテナはシールドと同じ面に形成されるので、第2アンテナが長くなれば、その分、シールドの面積が減じられてしまい、筐体内からのノイズが外部へ漏れたり、逆に、外部からのノイズが入り込んだりして誤動作の原因ともなる。   In Patent Document 1, the first antenna 223 mounted on a printed circuit board is a copper plate antenna formed by bonding a plate obtained by punching a copper plate into a predetermined shape to a resin molded body 222. According to the embodiment built in the mobile phone, the length is estimated to be about 10 cm at most. In order to secure the physical length of the antenna necessary for reception, it is necessary to configure the second antenna configured as a linear vapor deposition antenna to be considerably long. Since the second antenna is formed on the same surface as the shield, if the second antenna becomes longer, the area of the shield is reduced correspondingly, and noise from inside the housing leaks to the outside, or conversely from the outside. Noise may enter and cause malfunctions.

また、本発明者が鋭意研究するなかで、移動体通信機に受信アンテナ装置を内蔵する場合、筐体内で発生するノイズの影響を受けてFMラジオ放送の周波数帯に雑音が重畳しやすいことが判明した。その発生源は明らかではないものの、変調されて可聴音に重畳される雑音となる。アンテナ装置とノイズ発生源となる高周波回路部との間に、金属の遮蔽板を設置してノイズ干渉を防止することは可能だが、遮蔽板方向からの電波も遮蔽するのでアンテナ装置として利得を低下させてしまうという問題があった。   In addition, as a result of diligent research by the present inventor, when a receiving antenna device is built in a mobile communication device, noise is likely to be superimposed on the frequency band of FM radio broadcasting due to the influence of noise generated in the housing. found. Although the source is not clear, it becomes noise that is modulated and superimposed on the audible sound. Although it is possible to prevent noise interference by installing a metal shielding plate between the antenna device and the high-frequency circuit part that is the source of noise, it also shields radio waves from the direction of the shielding plate, thus reducing the gain as an antenna device. There was a problem of letting it go.

そこで本発明では、移動体通信機に内蔵可能であって、FMラジオ放送の信号を受信することが出来、ノイズの影響が低減されたアンテナ装置を提供することを目的とする。   Therefore, an object of the present invention is to provide an antenna device that can be incorporated in a mobile communication device, can receive FM radio broadcast signals, and has reduced noise influence.

本発明は、セラミックの基体に第1放射電極が設けられたチップアンテナと、絶縁部材に前記第1放射電極への給電端子と、実装端子と、第2放射電極が設けられた支持部材を備え、前記支持部材に、前記第2放射電極と間隔をもって重なるように前記チップアンテナが搭載され、前記チップアンテナの第1放射電極はコイル状に構成され、前記支持部材の第2放射電極は線状に構成され、前記第1放射電極の一方端が前記給電端子と接続し、他方端が前記第2放射電極の一方端と接続し、前記第2放射電極は前記第1放射電極よりも前記支持部材が実装される基板から離れて位置することを特徴とするアンテナ装置である。   The present invention includes a chip antenna in which a first radiation electrode is provided on a ceramic base, a power supply terminal to the first radiation electrode on an insulating member, a mounting terminal, and a support member in which a second radiation electrode is provided. The chip antenna is mounted on the support member so as to overlap the second radiation electrode with a gap, the first radiation electrode of the chip antenna is configured in a coil shape, and the second radiation electrode of the support member is linear. The one end of the first radiation electrode is connected to the feeding terminal, the other end is connected to one end of the second radiation electrode, and the second radiation electrode is more supported than the first radiation electrode. An antenna device is characterized in that the member is located away from a substrate on which the member is mounted.

前記チップアンテナは、セラミックの基体として磁性体部材を用いるのが好ましい。磁性体部材を構成する磁性材料として、Ni系、Li系、Mn系の軟磁性フェライト、Fe−Si系、Fe基やCo基のアモルファス系、超微結晶軟磁性材料などの磁性合金を用いることが出来る。
The chip antenna preferably uses a magnetic member as a ceramic substrate. Use magnetic alloys such as Ni-based, Li-based, and Mn-based soft magnetic ferrite, Fe-Si based, Fe-based and Co-based amorphous materials, and ultra-crystalline soft magnetic materials as the magnetic material constituting the magnetic member. I can do it.

磁性材料として軟磁性フェライトを用いる場合、酸化第二鉄(Fe)、酸化亜鉛(ZnO)、酸化ニッケル(NiO)及び酸化銅(CuO)を主成分とし、仮焼粉を粉末成形し、焼結して磁性体部材を得る。焼結体をそのまま磁性体部材として用いる場合もあるが、研削等の加工手段によって所定の形状に加工する場合もある。 When soft magnetic ferrite is used as the magnetic material, the main component is ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO). And a magnetic member is obtained by sintering. The sintered body may be used as a magnetic member as it is, but may be processed into a predetermined shape by a processing means such as grinding.

またドクターブレード法等の公知のシート化技術により得たグリーンシートを所定の形状に加工し、単層、あるいは積層し、得られた積層体を焼結して磁性体部材とする場合もある。この場合も、グリーンシートの状態や焼結体の状態で、研削等の手段によって所定の形状に加工する場合がある。   In some cases, a green sheet obtained by a known sheet forming technique such as a doctor blade method is processed into a predetermined shape, and a single layer or a laminate is formed, and the obtained laminate is sintered to form a magnetic member. Also in this case, the green sheet or the sintered body may be processed into a predetermined shape by means such as grinding.

アモルファス系、超微結晶軟磁性材料などの磁性合金は、通常、リボン状で供せられるので、それを粉状あるいは薄片状として、樹脂やゴムに分散させた後にシート化、あるいは所定形状のブロック状にして磁性体部材とすることも出来る。   Magnetic alloys such as amorphous and ultra-microcrystalline soft magnetic materials are usually provided in the form of ribbons, so they are made into powder or flakes, dispersed in resin or rubber, and then formed into sheets or blocks of a predetermined shape It can also be used as a magnetic member.

第1放射電極はセラミックの基体にコイル状の導体で構成され、巻軸方向に導線が巻回されている。第1放射電極に用いる導線は、単線のエナメル線を用いるのが好ましく、融着力を持つオーバーコート(融着層)が形成されたエナメル線(自己融着線)がより好ましい。融着層は熱又は溶剤により活性化するものであり、コイル20を自己融着コイルとすることで組立工程における取り扱いが容易と成る。またその線径は30μm〜80μmであるのが好ましい。
また、セラミックの基体を積層体として構成する場合には、AgやCu等の低抵抗金属の導体ペーストを用いて、それを所定のパターンでグリーンシートに印刷するなどして、積層インダクタの様な周知のコイル構成としても良い。
The first radiation electrode is formed of a coiled conductor on a ceramic base, and a conducting wire is wound in the winding axis direction. The conducting wire used for the first radiation electrode is preferably a single enameled wire, more preferably an enameled wire (self-bonded wire) on which an overcoat (fused layer) having a fusion force is formed. The fusion layer is activated by heat or a solvent, and handling in the assembly process is facilitated by making the coil 20 a self-fusion coil. Moreover, it is preferable that the wire diameter is 30 micrometers-80 micrometers.
When a ceramic substrate is formed as a multilayer body, a conductive paste of a low resistance metal such as Ag or Cu is used and printed on a green sheet in a predetermined pattern. A well-known coil configuration may be used.

支持部材は絶縁材料で構成されるが、成形性や給電端子等の一体化の容易性を考慮すると樹脂部材とするのが好ましい。樹脂部材は、樹脂組成物として、はんだリフロー等の高温に耐え得るような、液晶ポリマーやポリフェニレンサルファイド等の高耐熱の熱可塑性エンジニアリングプラスチックを用いて構成されるのが好ましい。   The support member is made of an insulating material, but it is preferable to use a resin member in view of formability and ease of integration of the power supply terminal and the like. The resin member is preferably configured using a high heat-resistant thermoplastic engineering plastic such as a liquid crystal polymer or polyphenylene sulfide that can withstand high temperatures such as solder reflow as the resin composition.

支持部材は、略矩形に形成された絶縁部材の表面に、給電端子と、実装端子と、第2放射電極が設けられている。給電端子と実装端子は少なくとも支持部材の底面と側面に現れるように構成することが好ましい。また、第2放射電極は、少なくともチップアンテナと間隔をもって重なるような位置であって、前記底面と対向する天面に現れるように構成するのが好ましい。
給電端子、実装端子、第2放射電極には、それぞれCu、黄銅やリン青銅などのCu合金、Fe−Ni−Co系合金が用いられ、所定の形状に形成されて、圧入、はめ込み、貼り付け等によって絶縁部材に固定する場合や、インサートモールドして一体化する場合がある。
The support member is provided with a power supply terminal, a mounting terminal, and a second radiation electrode on the surface of an insulating member formed in a substantially rectangular shape. It is preferable that the power supply terminal and the mounting terminal are configured to appear at least on the bottom surface and the side surface of the support member. Further, it is preferable that the second radiating electrode is configured so as to appear at the top surface opposite to the bottom surface at a position at least overlapping with the chip antenna.
Cu, Cu, brass, phosphor bronze, and other Cu alloys and Fe-Ni-Co alloys are used for the power supply terminal, mounting terminal, and second radiation electrode, respectively. In some cases, it may be fixed to the insulating member by means of, for example, or may be integrated by insert molding.

支持部材は、樹脂部材の対向する一対の側面の一方から他方に向けて溝を形成し、その断面がコの字状となるようにしたり、窪みを形成したりしてキャップ状として形成するのが好ましく、その溝部や窪み部にチップアンテナを配置するのが好ましい。   The support member is formed as a cap shape by forming a groove from one side of the pair of opposite side surfaces of the resin member toward the other and forming a U-shaped cross section or forming a recess. It is preferable to dispose the chip antenna in the groove or recess.

本発明においては、前記チップアンテナの第1放射電極の巻軸を、受信アンテナ装置が実装される基板と略平行となるように構成するのが好ましい。基体を通過する磁束に対して、第2放射電極が含む導体が垂直に広がらない様にすることで、アンテナ装置の利得低下を防ぐことが出来る。   In the present invention, the winding axis of the first radiation electrode of the chip antenna is preferably configured to be substantially parallel to the substrate on which the receiving antenna device is mounted. By preventing the conductor included in the second radiation electrode from spreading vertically with respect to the magnetic flux passing through the base, it is possible to prevent a decrease in gain of the antenna device.

また、第2放射電極の他方端は自由端であって、前記支持部材の第2放射電極の自由端が位置する面内にて、前記第2放射電極を屈曲させて、その物理長さを確保する構成とするのも好ましい。   The other end of the second radiation electrode is a free end, and the second radiation electrode is bent in a plane where the free end of the second radiation electrode of the support member is located, and the physical length of the second radiation electrode is increased. It is also preferable to secure the configuration.

本発明によれば、移動体通信機に内蔵可能なほどに小型であって、FMラジオ放送の信号を受信することが出来、金属の遮蔽部材等を設けることなくノイズの影響が低減されたアンテナ装置を提供することが出来る。   According to the present invention, an antenna that is small enough to be incorporated in a mobile communication device, can receive FM radio broadcast signals, and has reduced influence of noise without providing a metal shielding member or the like. A device can be provided.

部品点数及び作業工程を増やすことなく、受信アンテナ装置を移動体通信機に内蔵できるので、製造時間の短縮、製造コストの削減などが可能となり、移動体通信機を安価に提供することも可能となる。また遮蔽部材等が必要ないので、その分の空き領域を利用して多機能化を図ったり、小型化を図ったりすることもできる。   Since the receiving antenna device can be built in the mobile communication device without increasing the number of parts and the work process, the manufacturing time can be shortened and the manufacturing cost can be reduced, and the mobile communication device can be provided at low cost. Become. In addition, since a shielding member or the like is not necessary, it is possible to increase the number of functions or to reduce the size by using the corresponding empty area.

本発明の一実施例に係るアンテナ装置を上面側から見た斜視図である。It is the perspective view which looked at the antenna apparatus which concerns on one Example of this invention from the upper surface side. 本発明の一実施例に係るアンテナ装置を下面側から見た平面図である。It is the top view which looked at the antenna apparatus which concerns on one Example of this invention from the lower surface side. 本発明の一実施例に係るアンテナ装置をA方向側から見た側面図である。It is the side view which looked at the antenna apparatus which concerns on one Example of this invention from the A direction side. 本発明の一実施例に係るアンテナ装置をB方向側から見た側面図である。It is the side view which looked at the antenna apparatus which concerns on one Example of this invention from the B direction side. 本発明の一実施例に係るアンテナ装置のa−a’断面図である。It is a-a 'sectional drawing of the antenna device which concerns on one Example of this invention. 本発明の一実施例に係るアンテナ装置に用いるチップアンテナの外観斜視図である。It is an external appearance perspective view of the chip antenna used for the antenna apparatus which concerns on one Example of this invention. 本発明の他の実施例に係るアンテナ装置に用いるチップアンテナの外観斜視図である。It is an external appearance perspective view of the chip antenna used for the antenna apparatus which concerns on the other Example of this invention. 本発明の一実施例に係るアンテナ装置の基板への実装状態を説明するための図である。It is a figure for demonstrating the mounting state to the board | substrate of the antenna apparatus which concerns on one Example of this invention. 本発明の一実施例に係るアンテナ装置の移動体通信機への内蔵状態を説明するための図である。It is a figure for demonstrating the built-in state to the mobile communication apparatus of the antenna apparatus which concerns on one Example of this invention. 従来のアンテナ装置の構成を示す斜視図である。It is a perspective view which shows the structure of the conventional antenna device.

本発明のアンテナ装置について図面を用いて説明する。
図1にアンテナ装置を上面側から見た斜視図を示し、図2に下面側から見た平面図を示し、図3にA方向側から見た側面図を示し、図4にB方向側から見た側面図を示し、図5にa−a’断面図を示す。また、図6はアンテナ装置に用いるチップアンテナの外観斜視図であり、図7はアンテナ装置に用いる他の構成のチップアンテナの外観斜視図である。また図8はアンテナ装置を基板に実装した状態を示す斜視図である。
The antenna device of the present invention will be described with reference to the drawings.
1 is a perspective view of the antenna device as viewed from the upper surface side, FIG. 2 is a plan view as viewed from the lower surface side, FIG. 3 is a side view as viewed from the A direction side, and FIG. The seen side view is shown, and aa 'sectional drawing is shown in FIG. 6 is an external perspective view of a chip antenna used in the antenna device, and FIG. 7 is an external perspective view of a chip antenna having another configuration used in the antenna device. FIG. 8 is a perspective view showing a state where the antenna device is mounted on a substrate.

ここに示すアンテナ装置1は、セラミックの基体6に第1放射電極7となるコイルが設けられたチップアンテナ5と、絶縁部材に前記第1放射電極への給電端子10と、実装端子15と、第2放射電極30が設けられた支持部材20を備える。第1放射電極7と重ねる様に線状の第2放射電極3が設けられ、アンテナ装置は平面的に小型化された構成となっている。   The antenna device 1 shown here includes a chip antenna 5 in which a coil serving as a first radiation electrode 7 is provided on a ceramic base 6, a power supply terminal 10 to the first radiation electrode on an insulating member, a mounting terminal 15, The support member 20 provided with the second radiation electrode 30 is provided. A linear second radiation electrode 3 is provided so as to overlap the first radiation electrode 7, and the antenna device is configured to be downsized in plan.

支持部材20には、対向する一対の側面の一方から他方に向けて、長手方向に溝部22が形成されており、断面がコの字状となっている。溝部22を挟んで向かい合う2つの脚部には、長手方向の両端側に給電端子10と実装端子15が形成される。基板61に形成された給電線路70と接続される給電端子10と、基板61に形成された実装パッド(図示せず)と接続される実装端子15のぞれぞれは、樹脂部材の脚部を、その厚み方向に把持する様なコの字型となっている。更に給電端子10は、溝部22の底部まで至り、チップアンテナ5のコイル端部8bと接続の為の接続部11aを構成している。   The support member 20 is formed with a groove portion 22 in the longitudinal direction from one side to the other of a pair of opposing side surfaces, and has a U-shaped cross section. On the two leg portions facing each other with the groove portion 22 in between, the feeding terminal 10 and the mounting terminal 15 are formed on both ends in the longitudinal direction. Each of the power supply terminal 10 connected to the power supply line 70 formed on the substrate 61 and the mounting terminal 15 connected to the mounting pad (not shown) formed on the substrate 61 is a leg portion of the resin member. Is U-shaped so that it is gripped in the thickness direction. Furthermore, the power supply terminal 10 reaches the bottom of the groove 22 and constitutes a connection portion 11 a for connection with the coil end portion 8 b of the chip antenna 5.

支持部材20の天面側には線状の第2放射電極30が形成されている。第2放射電極30の一端側は、支持部材20の側面を通って溝部22の底部まで至り、その端部は、チップアンテナ5のコイル端部8aと接続の為の接続部11bを構成するように幅広に形成されている。電気的な接続には、はんだや導電性接着剤が用いられる。   A linear second radiation electrode 30 is formed on the top surface side of the support member 20. One end side of the second radiation electrode 30 passes through the side surface of the support member 20 and reaches the bottom of the groove portion 22, and the end portion constitutes a connection portion 11 b for connection with the coil end portion 8 a of the chip antenna 5. It is formed wide. Solder or conductive adhesive is used for electrical connection.

支持部材20に形成された溝部22は、チップアンテナ5が収容可能であって、基板61への実装面となる支持部材2の底面よりも、チップアンテナ5の全体が落ち込むような深さとなっている。   The groove portion 22 formed in the support member 20 can accommodate the chip antenna 5, and has such a depth that the entire chip antenna 5 falls below the bottom surface of the support member 2 that is the mounting surface on the substrate 61. Yes.

図8にアンテナ装置を基板に実装した状態を示す。通常、アンテナ装置1が実装される基板61には、グランド電極GNDが設けられている。前記グランド電極GNDと、第1放射電極7や第2放射電極30との間に寄生容量が形成されると、その容量によって受信アンテナ装置1の利得が劣化したり、動作周波数(共振周波数と呼ぶ場合がある)が移動したりする場合がある。また本来、コイル状の第1放射電極7に入射すべき電磁界がグランド電極に吸収されて利得の低下を招く場合もある。   FIG. 8 shows a state where the antenna device is mounted on a substrate. Usually, the substrate 61 on which the antenna device 1 is mounted is provided with a ground electrode GND. If a parasitic capacitance is formed between the ground electrode GND and the first radiating electrode 7 or the second radiating electrode 30, the gain of the receiving antenna device 1 deteriorates due to the capacitance, or an operating frequency (referred to as a resonance frequency). May move). In addition, an electromagnetic field that should be incident on the coil-shaped first radiation electrode 7 may be absorbed by the ground electrode, leading to a decrease in gain.

本発明者らの研究によれば、チップアンテナを用いたアンテナ装置のアンテナ特性の内、特には受信性能であるゲイン特性を向上させる手法として2つの方法があげられる。その一つは、チップアンテナ5の体積を増やすことであり、他の一つは受信に寄与する導体(エレメントとも呼ばれる)の長さを、モノポール動作に応じた必要な長さとすることである。   According to the study by the present inventors, there are two methods for improving the gain characteristic which is reception performance among antenna characteristics of an antenna device using a chip antenna. One is to increase the volume of the chip antenna 5, and the other is to set the length of the conductor (also referred to as an element) that contributes to reception to the required length according to the monopole operation. .

チップアンテナの体積を増やす場合 共振周波数foが低下しやすくなるため、エレメントを極端に短縮することで適正な共振周波数foに合わせざるを得なくなり、その結果、受信性能が低下する。一方で、チップアンテナを極小化してエレメントを延長するという手法は、受信性能を向上させる一方でノイズも拾いやすくなるため、人の耳で聞いた感覚としてノイズ混じりの音声となってしまい、あたかも受信性能が低下したように感じてしまう。   When the volume of the chip antenna is increased, the resonance frequency fo tends to decrease. Therefore, the element must be adjusted to an appropriate resonance frequency fo by extremely shortening the element, and as a result, the reception performance decreases. On the other hand, minimizing the chip antenna and extending the element makes it easier to pick up noise while improving the reception performance, so it becomes as if it was received by the human ear, resulting in a voice that contains noise. It feels like the performance has dropped.

移動体通信機器は、個々に筐体のサイズや構造、チップアンテナ周辺の部品配置も異なるため、一概に最適エレメント長、あるいは 最適チップアンテナ体積を規定することは出来ないものの、個々にはノイズを拾いにくく、かつ受信性能を満足できる組み合わせを見出すことは可能である。しかしながら、チップアンテナをプリント基板に実装した後、共振周波数がドリフトする現象があり、その原因がプリント基板のグランドパターンとの容量結合であって、それが受信性能を大きく左右することを知見した。   Since mobile communication devices differ in size and structure of the case and component arrangement around the chip antenna, the optimum element length or the optimum chip antenna volume cannot be specified in general, but noise is individually applied to each device. It is possible to find a combination that is difficult to pick up and that satisfies the reception performance. However, after mounting the chip antenna on the printed circuit board, there is a phenomenon that the resonance frequency drifts, and the cause is capacitive coupling with the ground pattern of the printed circuit board, and it has been found that this greatly affects the reception performance.

本発明のアンテナ装置1では、基板61への実装面とチップアンテナ5との間に空間を有し、第2放射電極30は第1放射電極7よりも基板61から離れて位置することで、各放射電極はグランド電極から出来るだけ遠ざけられ、更に第1、第2放射電極とグランド電極との間に空気層を積極的に設けている。この様な構成によれば発生する寄生容量を小さくすることが出来る。この様な構成によって、筐体内で発生するノイズ源からの信号に対して鈍感な構成とすることが出来て、可聴音に重畳される雑音を低減することが出来る。   In the antenna device 1 of the present invention, there is a space between the mounting surface on the substrate 61 and the chip antenna 5, and the second radiation electrode 30 is located farther from the substrate 61 than the first radiation electrode 7, Each radiation electrode is kept as far as possible from the ground electrode, and an air layer is positively provided between the first and second radiation electrodes and the ground electrode. According to such a configuration, the generated parasitic capacitance can be reduced. With such a configuration, a configuration insensitive to a signal from a noise source generated in the housing can be obtained, and noise superimposed on the audible sound can be reduced.

支持部材20を構成する樹脂部材は、基板61への実装の際にはんだリフロー時に曝される熱を考慮すれば、液晶ポリマーやポリフェニレンサルファイド等、高耐熱の熱可塑性エンジニアリングプラスチック等の樹脂を用いるのが好ましい。比誘電率が5以下、好ましくは4以下のポリイミド樹脂、フッ素樹脂、あるいは、形状は限定されるもののガラスエポキシ樹脂も用いることが出来る。   The resin member constituting the support member 20 is made of a resin such as a liquid crystal polymer, polyphenylene sulfide, or other heat-resistant thermoplastic engineering plastic in consideration of heat exposed during solder reflow during mounting on the substrate 61. Is preferred. A polyimide resin, a fluororesin having a relative dielectric constant of 5 or less, preferably 4 or less, or a glass epoxy resin having a limited shape can also be used.

第1放射電極7を備えたチップアンテナ5を構成するセラミックの基体6は、磁性体部材で構成するのが好ましい。磁性体部材を構成する磁性材料として、Ni系、Li系、Mn系の軟磁性フェライト、Fe−Si系、Fe基やCo基のアモルファス系、超微結晶軟磁性材料などの磁性合金を用いることが出来る。アモルファス系、超微結晶軟磁性材料などの磁性合金は、通常、リボン状で供せられるので、それを所定の形状のシートに加工して、単層、あるいは複数層に積層して磁性体部材とすることが出来る。また磁性材料を粉状あるいは薄片状として、樹脂やゴムに分散させた後に成形して磁性体部材とすることも出来る。その形状はシート状、ブロック状等、本発明の思想を逸脱しない範囲であれば、限定はされない。   The ceramic base 6 constituting the chip antenna 5 provided with the first radiation electrode 7 is preferably made of a magnetic member. Use magnetic alloys such as Ni-based, Li-based, and Mn-based soft magnetic ferrite, Fe-Si based, Fe-based and Co-based amorphous materials, and ultra-crystalline soft magnetic materials as the magnetic material constituting the magnetic member. I can do it. Magnetic alloys such as amorphous and microcrystalline soft magnetic materials are usually provided in the form of ribbons, so they are processed into sheets of a predetermined shape and laminated into a single layer or multiple layers to form a magnetic member It can be. Also, the magnetic material can be made into a powder or flake form, dispersed in resin or rubber, and then molded into a magnetic member. The shape is not limited as long as it does not depart from the idea of the present invention, such as a sheet shape or a block shape.

チップアンテナ5の構成は、図6に示す様な、基体6を構成する磁性体部材に導線7を巻回するものや、図7に示す様な、基体6を構成する磁性体部材の内部に導線7を構成する積層構造のものがある。   As shown in FIG. 6, the chip antenna 5 has a structure in which a conducting wire 7 is wound around a magnetic member constituting the base 6 or inside the magnetic member constituting the base 6 as shown in FIG. There is a laminated structure constituting the conductor 7.

また第1放射電極7と第2放射電極30とを重ねる構成により、それらの間には寄生容量が形成される。その容量によって受信アンテナ装置の動作周波数を低周波化することが出来る。容量値は、第1放射電極7と第2放射電極30とを対向させる間隔や面積、あるいは介在する樹脂部材の比誘電率で調整することが出来る。また、図2に示す様に、支持部材20に設けられた溝部22の底部に窪み45を形成して、空気層を設けて寄生容量を調整することもできる。   Further, the first radiating electrode 7 and the second radiating electrode 30 are stacked to form a parasitic capacitance between them. The operating frequency of the receiving antenna device can be lowered by the capacity. The capacitance value can be adjusted by an interval and an area where the first radiation electrode 7 and the second radiation electrode 30 are opposed to each other, or a relative dielectric constant of an interposed resin member. In addition, as shown in FIG. 2, a recess 45 may be formed at the bottom of the groove 22 provided in the support member 20, and an air layer may be provided to adjust the parasitic capacitance.

図9にアンテナ装置を移動体通信機に内蔵した状態を示す。第2放射電極30を移動体通信機の筐体90に近接して配置することで優れた受信性能を得ることが出来る。   FIG. 9 shows a state where the antenna device is built in the mobile communication device. An excellent reception performance can be obtained by arranging the second radiation electrode 30 close to the housing 90 of the mobile communication device.

1 アンテナ装置
5 チップアンテナ
7 第1放射電極
8a、8b コイル端部
10 給電端子
11a,11b 接続部
15 実装端子
20 支持部材
22 溝部
30 第2放射電極
DESCRIPTION OF SYMBOLS 1 Antenna apparatus 5 Chip antenna 7 1st radiation | emission electrode 8a, 8b Coil end part 10 Feed terminal 11a, 11b Connection part 15 Mounting terminal 20 Support member 22 Groove part 30 2nd radiation electrode

Claims (3)

セラミックの基体に第1放射電極が設けられたチップアンテナと、絶縁部材に前記第1放射電極への給電端子と、実装端子と、第2放射電極が設けられた支持部材を備え、前記支持部材に、前記第2放射電極と間隔をもって重なるように前記チップアンテナが搭載され、
前記チップアンテナの第1放射電極はコイル状に構成され、前記支持部材の第2放射電極は線状に構成され、前記第1放射電極の一方端が前記給電端子と接続し、他方端が前記第2放射電極の一方端と接続し、
前記第2放射電極は前記第1放射電極よりも前記支持部材が実装される基板から離れて位置することを特徴とするアンテナ装置。
A chip antenna provided with a first radiation electrode on a ceramic substrate; a power supply terminal for the first radiation electrode on an insulating member; a mounting terminal; and a support member provided with a second radiation electrode. And the chip antenna is mounted so as to overlap the second radiation electrode with a gap,
The first radiating electrode of the chip antenna is configured in a coil shape, the second radiating electrode of the support member is configured in a linear shape, one end of the first radiating electrode is connected to the feeding terminal, and the other end is Connected to one end of the second radiation electrode;
The antenna device, wherein the second radiation electrode is located farther from a substrate on which the support member is mounted than the first radiation electrode.
請求項1に記載のアンテナ装置であって、
前記チップアンテナの第1放射電極の巻軸が前記基板と略平行となることを特徴とするアンテナ装置。
The antenna device according to claim 1,
The antenna device according to claim 1, wherein a winding axis of the first radiation electrode of the chip antenna is substantially parallel to the substrate.
請求項1又は2に記載のアンテナ装置であって、
前記第2放射電極の他方端は自由端であり、前記支持部材の前記第2放射電極の自由端が位置する面内にて、前記第2放射電極が屈曲することを特徴とするアンテナ装置。

The antenna device according to claim 1 or 2,
The antenna device, wherein the other end of the second radiation electrode is a free end, and the second radiation electrode is bent in a plane where the free end of the second radiation electrode of the support member is located.

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JP2005094742A (en) * 2003-08-08 2005-04-07 Hitachi Metals Ltd Antenna device and communication equipment using the same
WO2007020728A1 (en) * 2005-08-12 2007-02-22 Murata Manufacturing Co., Ltd. Antenna structure and wireless communication apparatus provided with same
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JP2005094743A (en) * 2003-08-08 2005-04-07 Hitachi Metals Ltd Antenna system and communications apparatus using the same
JP2005094742A (en) * 2003-08-08 2005-04-07 Hitachi Metals Ltd Antenna device and communication equipment using the same
WO2007020728A1 (en) * 2005-08-12 2007-02-22 Murata Manufacturing Co., Ltd. Antenna structure and wireless communication apparatus provided with same
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Publication number Priority date Publication date Assignee Title
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