JP2013230982A - Splitting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simplified and compact splitting apparatus which splits a workpiece of a long-sized brittle plate by scribing along only a plurality of scribing lines traversing the workpiece in the width direction, where mechanisms for inverting the workpiece upside down and pushing the workpiece are efficiently disposed.SOLUTION: In a splitting apparatus 1, an inversion device 20 inverts a workpiece 9 upside down at an inversion position P2 on a main path P1, where in the workpiece 9, a plurality of scribing lines Ls traversing in the width direction intersecting in a main path R1 direction. A second support table transverse moving mechanism 34 and a second support table longitudinal moving mechanism 35 move the second support table 33, on which the workpiece 9 after inverted is fixed, from the inversion position P2 to a sub-path R2, and further move along the sub-path R2. A brake device 30 pushes the workpiece 9 along the scribing line Ls on the way of movement of the second support table 33 along the sub-path R2.

Description

  The present invention relates to a cutting apparatus that forms a scribe line on a brittle plate material and breaks the brittle plate material into a plurality of element plate materials by brittle fracture along the scribe line.

  A brittle plate such as a glass substrate constituting a semiconductor wafer or a flat display panel can be divided into a plurality of element plates by a cutting device that performs a scribe process. The brittle plate material is a plate-like member made of a brittle material, and the brittle material includes semiconductor, glass, quartz, ceramic, and the like. The flat display panel is, for example, a liquid crystal display panel or an organic EL (electroluminescence) panel.

  Conventional cutting apparatuses that perform scribing are disclosed in, for example, Patent Document 1 and Patent Document 2. The scribe process is realized by a scribe process and a break process.

  A scribe process is a process of forming a scribe line along the boundary line of a some element board | plate material with respect to the surface of a brittle board | plate material. The scribe line is a crack formed in a straight line or a curved line from one edge to the other edge in the brittle plate material. The scribe line is formed by a high-hardness cutting edge such as diamond sliding or rolling on the surface of the brittle plate, or by laser light.

  Hereinafter, an action point for forming a scribe line on a brittle plate material, such as a cutting edge or a laser beam emitting portion, is referred to as a scribe end. The cutting blade is formed, for example, by an annular diamond blade formed on the outer peripheral portion of a disc-shaped rotating body, and slidably rolls on the surface of the brittle plate or slides on the surface of the brittle plate. Diamond points.

  The breaking process is a process in which the brittle plate material is brittlely broken along the scribe line by pressing the break bar along the scribe line against the surface opposite to the surface on which the scribe line is formed in the brittle plate material. is there. The break bar used in the breaking step is a member whose tip forms a ridge line along the scribe line. A brittle plate breaks along a scribe line, that is, a scribe line (linear crack) formed on one surface propagates to the opposite surface, thereby causing a plurality of elements along the scribe line. Divided into plate material.

  In addition, a glass substrate serving as a base material of a liquid crystal display panel has a structure in which two glass plates are stacked with a liquid crystal layer interposed therebetween. As shown in Patent Document 1, such a brittle plate having a double structure is divided into a plurality of element plates by subjecting each of the two glass plates to a scribe process and a break process.

  Moreover, in the scribe process shown by patent document 1 and patent document 2, the scribe line which crosses a brittle board | plate material and the scribe line which cuts a brittle board | plate material vertically are formed in the state which mutually cross | intersects.

  By the way, in a manufacturing process of a relatively small panel component such as a small flat display panel provided in a mobile phone or a smart phone, a narrow and long brittle plate material is divided only at a scribe line that traverses in the width direction. Sometimes. In this case, in the scribing process, only a scribe line that crosses the long brittle plate member in the width direction is formed. Hereinafter, the scribing process including such a scribing process is referred to as a transverse scribing process.

  8 and 9 show an example in which the conventional cutting device shown in Patent Document 1 and Patent Document 2 is applied to a transverse scribe process for a brittle plate material, and a cutting process according to a first conventional example and a second conventional example. It is a mimetic diagram of each parting process concerning. In the cutting process shown in FIGS. 8 and 9, the work 9 that is a brittle plate material to be processed is transferred along a linear main path R <b> 1 over a plurality of processes including a scribe process and a break process.

  8 and 9, the X-axis direction is a linear direction along the main path R1, the Y-axis direction is a width direction orthogonal to the direction of the main path R1, and the Z-axis direction is This is a height direction orthogonal to the direction and the width direction of the main route R1.

  FIGS. 8A and 8B are views showing a state before and after execution of the scribe process in the dividing process according to the first conventional example, respectively. In the scribing process in the first conventional example, a scribing apparatus 100A including a scribing end 101 that reciprocates in the width direction (Y-axis direction) is used.

  In the scribing process in the first conventional example, the workpiece 9 is conveyed by a certain distance along the main route R1 with the longitudinal direction thereof being along the direction of the main route R1. Furthermore, the scriber end 101 moves along the width direction each time the workpiece 9 is conveyed by a certain distance, so that a plurality of parallel scribe lines Ls crossing the workpiece 9 with respect to one surface of the workpiece 9. Form.

  In the first conventional example, the reversing process is performed after the scribing process. FIG. 8C is a diagram showing the inversion process. In the reversing process, the reversing mechanism 200 vertically flips the workpiece 9 on which the plurality of scribe lines Ls are formed.

  Furthermore, in the first conventional example, a break process is performed after the reversing process. FIG. 8D is a diagram showing a state after the break process is executed. In the breaking process in the first conventional example, a breaking device 300 including a breaking bar 301 that is supported along the width direction (Y-axis direction) and reciprocates in the height direction (Z-axis direction) is used.

  In the scribing process in the first conventional example, the workpiece 9 is conveyed by a certain distance along the main route R1 with the longitudinal direction thereof being along the direction of the main route R1. Further, the break bar 301 pushes the other surface of the work 9 along the scribe line Ls by moving in the height direction every time the work 9 is conveyed by a certain distance. Thereby, the workpiece 9 is brittlely broken along each of the plurality of scribe lines Ls and divided into a plurality of element plate members 91.

  Note that the other surface of the work 9 is a surface opposite to the surface of the work 9 on which the scribe line Ls is formed.

  Next, a second conventional example will be described. FIGS. 9A and 9B are views showing a state before and after execution of the scribing process in the dividing process according to the second conventional example, respectively. In the scribing process in the second conventional example, a scribing apparatus 100B including a plurality of scribing ends 101 arranged at intervals along the width direction (Y-axis direction) is used.

  In the scribing process in the second conventional example, the workpiece 9 is conveyed along the main path R1 in a state where the longitudinal direction thereof is along the direction (Y-axis direction) perpendicular to the direction of the main path R1. Further, the plurality of scribing ends 101 form a plurality of parallel scribe lines Ls crossing the workpiece 9 with respect to one surface of the workpiece 9 moving along the main path R1.

  In the second conventional example, the direction changing step is executed after the scribing step. FIG.9 (c) is a figure which shows a direction change process. In the direction changing process, the direction changing mechanism 400 rotates the work 9 on which the plurality of scribe lines Ls are formed, and changes the direction of the work 9 by 90 °.

  In the second conventional example, after the direction changing process, the reversing process and the breaking process are executed as in the first conventional example. FIG. 9D is a diagram illustrating the inversion process, and FIG. 9E is a diagram illustrating a state after the break process is performed. The contents of the inversion process and the breaking process in the second conventional example are the same as the contents of the inversion process and the breaking process in the first conventional example.

JP 2006-315901 A JP 2003-292333 A

  However, in both the first conventional example and the second conventional example, the reversing step and the breaking step are executed at the upstream position and the downstream position on one main path R1. In this case, the reversing device 200 and the breaking device 300 must be arranged with a sufficient interval in the direction of the main route R1 in order to avoid mutual interference and secure a maintenance space for each device.

  Therefore, the first conventional example and the second conventional example have a problem that the dimensions of the entire reversing device 200 and the breaking device 30 in the main path direction, that is, the size in the longitudinal direction are increased.

  Furthermore, the second conventional example also has a problem that as the length of the brittle plate material is longer, the size of the cutting device in the width direction (Y-axis direction) perpendicular to the direction of the main path R1 becomes larger. In addition, when the 1st prior art example shown by FIG. 8 is employ | adopted, the dimension of the parting apparatus in the width direction can be made small.

  In addition, the second conventional example also has a problem that the cutting device becomes larger and complicated as much as the mechanism and the process for changing the direction of the brittle plate material are required, and the time required for the cutting process becomes longer.

  Further, the first conventional example also has a problem that the time required for the scribing process becomes longer as the number of divisions of the brittle plate material (work 9) is larger, that is, as the number of scribe lines Ls is larger.

  It is an object of the present invention to provide a mechanism for vertically flipping a brittle plate and a brittle plate along the scribe line when a long brittle plate is divided along only a plurality of scribe lines traversing in the width direction by scribing. Each mechanism including the pushing mechanism can be arranged efficiently, and the cutting device can be simplified and miniaturized.

The cutting device according to the first aspect of the present invention includes forming a scribe line on a brittle plate that is sequentially transferred to a plurality of positions in the main path along the first direction, and causing the brittle plate to brittlely break along the scribe line. It is an apparatus which divides | segments into a board | plate material, and is provided with each component shown below.
(1) The first component is a predetermined reversal in the main path, the brittle plate material having a plurality of the scribe lines crossing in the second direction intersecting the first direction formed on the first surface. This is a reversing mechanism for reversing the position vertically.
(2) The second component is a support base that supports and fixes the brittle plate material reversed by the reversing mechanism.
(3) The third component moves the support base from the reverse position to a sub path start position in a sub path parallel to the main path, and further starts the sub path along the sub path. This is a support moving mechanism that moves from the position to the end position of the sub route.
(4) The fourth component includes a second surface opposite to the first surface in the brittle plate material fixed to the support base in the middle of the movement of the support base along the sub path. It is a pressing mechanism for dividing the brittle plate material into a plurality of the element plate materials by pressing along the scribe line.

  The cutting apparatus according to the second aspect of the present invention further includes the following structure in addition to the structure of the cutting apparatus according to the first aspect of the invention. That is, in the cutting device according to the second aspect of the invention, the reversing mechanism and the pressing mechanism are arranged at positions where at least a part thereof overlaps when viewed from a direction orthogonal to the first direction.

The cutting apparatus according to the third invention further includes a characteristic structure for forming a plurality of scribe lines on the brittle plate material in addition to the structure of the cutting apparatus according to the first invention. That is, the cutting device according to the third aspect of the invention includes the following constituent elements.
(1) A 1st component is a 1st support stand which supports and fixes the said brittle board | plate material.
(2) The second component is a first support base moving mechanism that reciprocates the first support base in a second direction intersecting the first direction from a predetermined processing reference position in the main path.
(3) The third component is a plurality of scribing ends that form the scribe lines with respect to the brittle plate material.
(4) The fourth component supports each of the plurality of scribing ends at an interval along the first direction and is moved by the first support moving mechanism. A processing end support mechanism that holds the brittle plate material fixed at a processing position where the scribe line can be formed.
(5) A fifth component is the processing standard in the main path, the brittle plate material having a plurality of the scribe lines crossing in the second direction intersecting the first direction formed on the first surface. This is a reversing mechanism that reverses vertically at a reversing position downstream of the position in the transfer direction.
(6) A sixth component is a second support base that supports and fixes the brittle plate material reversed by the reversing mechanism.
(7) The seventh component moves the second support base from the reverse position to a sub path start position in a sub path parallel to the main path, and further moves the support base along the sub path. This is a second support moving mechanism that moves from the path start position to the sub path end position.
(8) The eighth component is the second component opposite to the first surface of the brittle plate fixed to the second support base while the second support base moves along the sub-path. It is a pressing mechanism that divides the brittle plate into a plurality of the element plates by pressing a second surface along the scribe line.

  In the first invention, the pressing mechanism is a mechanism that executes a breaking step of dividing the brittle plate material into a plurality of element plate materials along the scribe line. The reversing mechanism is a mechanism that executes a reversing process for reversing the upper limit of the brittle plate on which the scribe line is formed. The main path is a transfer path of the brittle plate material from the pre-process to the post-process of the reversing process and the break process.

  In the first invention, the reversing step by the reversing mechanism is executed at the reversing position on the main route, and the breaking step by the pressing mechanism is executed on the sub route parallel to the main route. In other words, the reversing mechanism and the pressing mechanism in the first invention are arranged with their positions shifted in a direction (width direction) orthogonal to the direction of the main path. Therefore, according to the first aspect of the invention, the dimensions of the reversing mechanism and the pressing mechanism in the main path direction, that is, avoiding mutual interference of the reversing mechanism and the pressing mechanism constituting the breaking device and ensuring the maintenance space of each mechanism, that is, The dimension in the longitudinal direction can be reduced.

  In general, a long brittle plate in which only scribe lines that cross in the width direction are formed is relatively small and lightweight, unlike a brittle plate in which lattice-like scribe lines are formed. Therefore, the support base moving mechanism in the first invention can be realized by a relatively small and simple mechanism.

  Moreover, in 1st invention, when a brittle board | plate material is a long board | plate material, the brittle board | plate material is conveyed in the state where a longitudinal direction follows a 1st direction (direction of a main path | route). The support table moving mechanism moves the support table, to which the brittle plate material is fixed, from the predetermined position on the main path by a short distance slightly longer than the small width of the brittle plate material in the width direction of the brittle plate material. Good. Therefore, according to 1st invention, the dimension of the cutting device in the width direction orthogonal to a transfer direction is restrained comparatively small irrespective of the length of a brittle board | plate material.

  Further, according to the second invention, the overall dimensions of the reversing mechanism and the pressing mechanism in the main path direction can be further reduced.

  As described above, according to the first invention, the cutting device can be simplified and miniaturized when the long brittle plate is cut only at the scribe line along the width direction by the scribe process.

  In the third invention, the brittle plate is moved in the second direction (width) intersecting the first direction which is the transfer direction by the support moving mechanism with the plurality of scribing ends held at the processing position. Direction). Therefore, according to the first invention, a plurality of scribe lines that cross the brittle plate in the second direction are simultaneously formed on the surface of the moving brittle plate. As a result, the time required for the scribing process is significantly shortened compared to the first conventional example (see FIG. 8) in which one scribing end is reciprocated by the number corresponding to the number of scribing lines.

  Further, according to the third invention, since the scribe line is formed while the longitudinal direction of the brittle plate material is in the state along the first direction (the direction of the main path), as in the second conventional example shown in FIG. A mechanism and process for changing the direction of the brittle plate are not required. Therefore, there is no problem that the cutting device becomes large and complicated due to the change of direction of the brittle plate, and the time required for the cutting process becomes long.

1 is a plan view of a cutting apparatus 1 according to an embodiment of the present invention. 1 is a perspective view of a scribing device 10 included in a cutting device 1. FIG. It is a perspective view of the inversion apparatus 20 with which the cutting device 1 is provided. It is a perspective view of the breaking device 30 with which the cutting device 1 is provided. It is a perspective view of the transfer apparatus 40 with which the cutting device 1 is provided. It is a schematic diagram showing the acceptance process and scribing process by the cutting device 1. It is a schematic diagram showing the inversion process and break process by the cutting device 1. It is a schematic diagram of the cutting process which concerns on a 1st prior art example. It is a schematic diagram of the cutting process which concerns on a 2nd prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and is not an example of limiting the technical scope of the present invention.

<Embodiment>
First, the configuration of the cutting apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 5. The dividing apparatus 1 is an apparatus that divides the work 9 into a plurality of element plate materials 91 by performing a scribing process on the work 9 that is a brittle plate material to be processed. More specifically, the cutting apparatus 1 forms a scribe line Ls on the work 9 that is sequentially transferred to a plurality of positions on a predetermined main route R1, and makes the work 9 brittle fracture along the scribe line Ls. The element plate material 91 is divided.

  In the present embodiment, the workpiece 9 is a long and narrow rectangular brittle plate. In addition, the long workpiece 9 is formed by the cutting device 1 to form a plurality of scribe lines Ls traversing in the width direction, and is divided only at the plurality of scribe lines Ls. The brittle plate material is a plate-like member made of a brittle material, and the brittle material includes semiconductor, glass, quartz, ceramic, and the like.

  As shown in FIG. 1, the cutting device 1 includes a scribe device 10, a reversing device 20, a break device 30, and a transfer device 40.

<Transfer device>
The transfer device 40 is a device that sequentially transfers the workpiece 9 to a plurality of positions on the main route R1 along a predetermined linear direction. More specifically, the transfer device 40 transfers the workpiece 9 from the receiving position P0 on the main path R1 to the machining reference position P1, and further transfers the workpiece 9 from the machining reference position P1 to the reverse position P2. Further, the transfer device 40 transfers the workpiece 9 moved from the reverse position P2 to the delivery position P3 by the break device 30 described later from the delivery position P3 to a further downstream position.

  That is, in the main path R1, the positions are arranged in the order of the receiving position P0, the processing reference position P1, the reverse position P2, and the sending position P3 from the upstream side to the downstream side in the transfer direction of the workpiece 9.

  In the following description, a linear direction along the main route R1 in the horizontal plane is referred to as a main route direction. A direction orthogonal to the main path direction in the horizontal plane is referred to as a device width direction. A direction perpendicular to the main path direction and the apparatus width direction is referred to as a height direction. In the coordinate axes shown in each figure, the X-axis direction is the main path direction, the Y-axis direction is the apparatus width direction, and the Z-axis direction is the height direction.

  As shown in FIGS. 1 and 5, the transfer device 40 includes a series of frames 41 and a movement support mechanism 42. The series of frames 41 is a series of members formed along the main path direction on one side of the left and right sides of the main path R1. The series of frames 41 are formed in a series over a range from the receiving position P0 in the main path direction to the post-process side further than the sending position P3.

  In the present embodiment, the range that the series of frames 41 occupies in the main path direction is an example of a range extending to both sides of the processing reference position P1, and a range extending to both sides of the range from the reversal position P2 to the delivery position P3. It is also an example.

  On the other hand, the movement support mechanism 42 is a mechanism supported by the series of frames 41 so as to be movable along the main path direction. The moving support mechanism 42 is selectively switched between a state in which the workpiece 9 is supported by vacuum suction and a state in which the support of the workpiece 9 by vacuum suction is released. The movement support mechanism 42 moves to the target position along the series of frames 41 in a state where the workpiece 9 is sucked and supported, and releases the suction support of the workpiece 9 at the target position. Thereby, the movement support mechanism 42 sequentially transfers the workpiece 9 to a plurality of positions in the main path R1.

  More specifically, as illustrated in FIG. 5, the movement support mechanism 42 includes a work holding unit 421, an elevating mechanism 422, and a traveling mechanism 423. The traveling mechanism 423 moves the workpiece holding unit 421 and the lifting mechanism 422 along the series of frames 41 from the transfer start position to the target position. The raising / lowering mechanism 422 raises the work holding unit 421 once lowered at the transfer start position and the target position.

  The elevating mechanism 422 is configured by, for example, a servo motor or an air cylinder. The traveling mechanism 423 is configured by a servo motor or the like.

  The work holding unit 421 sucks and holds the work 9 when it is lowered to the height of the work 9 by the lifting mechanism 422 at the receiving position P0. Furthermore, the work holding unit 421 releases the suction of the work 9 when the work holding unit 421 is lowered to the target height by the lifting mechanism 422 at the target position.

  The surface in contact with the work 9 in the work holding part 421 has a dimension in the main path direction (X-axis direction) larger than a dimension in the apparatus width direction (Y-axis direction) so that the long work 9 can be efficiently supported without waste. Is also formed large. And the transfer apparatus 40 transfers the elongate workpiece | work 9 along the main path | route R1 in the state in which the longitudinal direction follows a main path | route direction.

  In addition, the workpiece 9 is not turned to a state in which the longitudinal direction of the workpiece 9 is in a direction intersecting the main path direction while being transferred from the processing reference position P1 to the delivery position P3.

  In the example shown in FIG. 5, the movement support mechanism 42 includes two movement support mechanisms 42 for the series of frames 41. However, it is also conceivable that the movement support mechanism 42 includes one movement support mechanism 42 for the series of frames 41 or three or more movement support mechanisms 42 for the series of frames 41.

<Scribe device>
The scribe device 10 is a device that forms a scribe line Ls on one surface of the workpiece 9 that has been transferred to the processing reference position P1 by the transfer device 40. In the following description, the surface of the workpiece 9 on the side where the scribe line Ls is formed is referred to as a first surface. The surface on the opposite side of the surface on which the scribe line Ls is formed in the work 9 is referred to as a second surface.

  As shown in FIGS. 1 and 2, the scribing apparatus 10 includes a plurality of cutting blades 11, a beam 12, a first support base 13, a first support base moving mechanism 14, an elevating mechanism 15, and a position adjusting mechanism 16.

  The first support table 13 is a table that supports the work 9 from below and fixes the work 9 by vacuum suction. Since the workpiece 9 to be processed has a long rectangular shape, the first support base 13 has dimensions in the main path direction (X-axis direction) so that the long workpiece 9 can be efficiently supported without waste. It is formed larger than the dimension in the apparatus width direction (Y-axis direction). The workpiece 9 is placed on the first support 13 by the transfer device 40.

  The first support base moving mechanism 14 is a mechanism for reciprocating the first support base 13 in a direction intersecting the main path direction (X-axis direction) from the processing reference position P1 in the main path R1. In the present embodiment, the first support table moving mechanism 14 reciprocates the first support table 13 from the processing reference position P1 in the apparatus width direction (Y-axis direction). The device width direction is an example of the second direction.

  More specifically, the first support base moving mechanism 14 includes a pair of rails 141 that support the first support base 13 so as to be movable in the apparatus width direction, and a first support base 13 supported by the pair of rails 141. A ball screw 142 that is a mechanism that linearly moves along the pair of rails 141 and a driving device 143 that drives the ball screw 142 are provided.

  The first support base moving mechanism 14 may be another mechanism constituted by a servo motor or the like.

  The cutting edge 11 is a cutting tool that cuts the scribe line Ls in contact with the workpiece 9, and is an example of a scribing end that forms the scribe line Ls with respect to the workpiece 9. The cutting blade 11 is, for example, a scribing wheel in which an annular diamond blade is formed on the outer peripheral portion of a disk-shaped rotating body and rolls in contact with the surface of the work 9 or a diamond that slides on the surface of the work 9. Such as points.

  In the example shown in FIG. 1 and FIG. 2, the scribing device 10 includes three cutting blades 11, but the scribing device 10 may include two cutting blades 11 or four or more cutting blades 11. It is done.

  The beam 12 is a member that supports each of the plurality of cutting blades 11 along the main path direction, that is, in parallel to the main path R1 with a space therebetween. The beam 12 is, for example, a rod-shaped metal member supported by a support column in a state where the longitudinal direction is along the main path direction.

  Further, the elevating mechanism 15 is a process in which each of the plurality of cutting blades 11 is brought into contact with the workpiece 9 fixed to the first support base 13 that is moving on one of the forward path and the return path by the first support base moving mechanism 14. It is a mechanism that selectively holds the position and the retracted position separated from the workpiece 9. The elevating mechanism 15 is constituted by, for example, a servo motor or an air cylinder.

  The position adjusting mechanism 16 is a mechanism that adjusts the position of each of the plurality of cutting blades 11 in the main path direction (X-axis direction). The position adjusting mechanism 16 adjusts the position of each of the plurality of cutting blades 11 in the main path direction according to the position of each of the plurality of scribe lines Ls to be formed on the workpiece 9. The beam 12, the elevating mechanism 15, and the position adjusting mechanism 16 are examples of a processing end support mechanism.

  By the way, the beam 12 that supports the plurality of cutting blades 11 and the column that supports the beam 12 are thick and heavy members because high rigidity is required. Accordingly, it is not practical to provide a mechanism for moving such a heavy member in the apparatus width direction together with the plurality of cutting blades 11 because the apparatus is increased in size.

<Reversing device>
The reversing device 20 is a device provided with a mechanism for vertically reversing the workpiece 9 on which the scribe line Ls crossing in the device width direction is formed on the first surface at the reversing position P2 in the main path R1. More specifically, as shown in FIGS. 1 and 3, the reversing device 20 includes a reversing table 21, a rotation driving unit 22, a movable support member 23, and an elevating mechanism 24.

  The inversion table 21 is a table for holding the workpiece 9 transferred by the transfer device 40 by vacuum suction at the inversion position P2. Moreover, the raising / lowering mechanism 24 raises the movable support part 23 after once lowering from the predetermined receiving height in the inversion position P2 to the delivery height below it in the inversion position P2.

  The movable support member 23 is a member that supports the rotation drive unit 22. The rotation drive unit 22 rotates the reversing table 21 180 degrees around the rotation axis along the main path direction when the movable support unit 23 is positioned at the receiving height, thereby reversing the reversing table 21 up and down. As a result, the work 9 held on the reversing table 21 together with the reversing table 21 is also turned upside down. Further, the rotation drive unit 22 returns the reversing table 21 to the original state when the movable support unit 23 is raised from the delivery height position to the reception height position or when it returns to the reception height position. .

  Further, the reversing table 21 sucks and holds the workpiece 9 that has been transferred to the reversing position P2 by the transfer device 40 when the movable support portion 23 is positioned at the receiving height. Further, the reversing table 21 releases the suction of the work 9 when the movable support portion 23 is positioned at the delivery height.

  The reversing table 21 is formed so that the dimension in the main path direction (X-axis direction) is larger than the dimension in the apparatus width direction (Y-axis direction) so that the long work 9 can be efficiently supported without waste.

  In addition, in the state where the movable support part 23 is located at the delivery height, the reversing table 21 is in a state of being close to the second support table 33 described later. Accordingly, the workpiece 9 released from being held by the reversing table 21 is placed on the second support table 33.

  The rotation drive unit 22 is configured by, for example, a servo motor. Moreover, the raising / lowering mechanism 24 is comprised by an air cylinder or a servomotor, for example.

<Break device>
The breaking device 30 is a device that divides the workpiece 9 into a plurality of element plate members 91 by causing the workpiece 9 on which the plurality of scribe lines Ls are formed in the previous process to be brittlely broken along each scribe line Ls.

  As shown in FIGS. 1 and 4, the break device 30 includes a break bar 31, an elevating mechanism 32, a second support base 33, a second support base lateral movement mechanism 34, and a second support base vertical movement mechanism 35.

  The second support table 33 is a table that supports the work 9 reversed by the reversing device 20 from below and fixes the work 9 by vacuum suction. Since the workpiece 9 to be processed has a long rectangular shape, the second support 33 has a dimension in the main path direction (X-axis direction) so that the long workpiece 9 can be efficiently supported without waste. It is formed larger than the dimension in the apparatus width direction (Y-axis direction). The workpiece 9 is placed on the second support base 33 by the reversing device 20.

  The second support base lateral movement mechanism 34 is a mechanism for moving the second support base 33 in the apparatus width direction between a position on the main path R1 and a position on the sub-path R2 parallel to the main path R1. The sub route R2 is parallel to the main route R1 and is shorter than the main route R1. On the other hand, the second support stand vertical movement mechanism 35 is a mechanism for moving the second support stand 33 along the sub route R2.

  More specifically, the second support base lateral movement mechanism 34 includes a pair of rails 341 that support the second support base 33 so as to be movable in the apparatus width direction, and a second support base 33 supported by the pair of rails 341. Is provided with a ball screw 342 that is a mechanism for linearly moving the screw along a pair of rails 341, and a drive device 343 that drives the ball screw 342. The second support base lateral movement mechanism 34 is supported by the base part 344.

  On the other hand, the second support base vertical movement mechanism 35 includes a pair of rails 351 that support the base part 344 of the second support base horizontal movement mechanism 34 so as to be movable in the transfer direction, and a base supported by the pair of rails 351. A ball screw 352 that is a mechanism for linearly moving the portion 344 along the pair of rails 351 and a driving device 353 that drives the ball screw 352 are provided.

  When the work 9 reversed by the reversing device 20 is fixed to the second support base 33, the second support base lateral movement mechanism 34 moves the second support base 33 from the reverse position P2 to the sub path start position in the sub path R2. Move to P4. In FIG. 1, the second support base lateral movement mechanism 34 when the second support base 33 is located at the sub route start position P <b> 4 is drawn by a virtual line (two-dot chain line).

  Subsequently, the second support stand vertical movement mechanism 35 moves the second support stand 33 along the sub route R2 from the sub route start position P4 to the sub route end position P5. Subsequently, the second support table lateral movement mechanism 34 moves the second support table 33 from the sub-path end position P5 to the delivery position P3 in the main path R1.

  In addition, after the 2nd support stand 33 is moved to the sending position P3, it is returned by the 2nd support stand vertical movement mechanism 35 to the inversion position P2 in the main path | route R1.

  The break bar 31 is a member whose tip forms a ridge line along the scribe line Ls. In the present embodiment, since the linear scribe line Ls is formed on the workpiece 9, the tip of the break bar 31 forms a linear ridge line.

  The break bar 31 is supported by the elevating mechanism 32 in such a direction that the ridgeline formed by the tip crosses the sub route R2. The break bar 31 is supported so as to be movable up and down in a state where a ridgeline formed by the tip is along a direction intersecting the main path direction.

  In the sub-path R2, the elevating mechanism 32 selectively selects a pressure position where the break bar 31 is in contact with the second surface (upper surface) of the work 9 on the second support base 33 and a retracted position separated from the work 9. It is a mechanism to hold. The elevating mechanism 32 is constituted by, for example, a servo motor or an air cylinder.

  More specifically, the lifting mechanism 32 moves the break bar 31 against the second surface of the work 9 fixed to the second support base 33 while the second support base 33 moves along the sub route R2. And sequentially pressing along each of the plurality of scribe lines Ls. That is, the lifting mechanism 32 lowers the break bar 31 from the retracted position to the pressurizing position and then raises it to the retracted position every time each of the plurality of scribe lines Ls in the work 9 arrives immediately below the break bar 31.

  When the elevating mechanism 32 presses the tip of the break bar 31 against the second surface of the work 9 with an appropriate pressure along the scribe line Ls, the work 9 is brittlely broken along the scribe line Ls, and a plurality of element plate materials Divided into 91.

  As described above, the break bar 31 and the lifting mechanism 32 scribe the second surface of the work 9 fixed to the second support base 33 while the second support base 33 moves along the sub route R2. A pressing mechanism that divides the workpiece 9 into a plurality of element plate members 91 by pressing along the line Ls is configured.

  Further, as shown in FIG. 1, the reversing device 20, the lifting mechanism 32 and the break bar 31 that constitute the pressing mechanism are arranged at positions that partially overlap when viewed from the device width direction (Y-axis direction). Yes.

<Division process>
Next, with reference to FIGS. 6 and 7, the cutting process by the cutting apparatus 1 will be described focusing on the movement process of the workpiece 9 in the cutting apparatus 1. The dividing process includes an acceptance process, a scribe process, a reversing process, and a breaking process.

  FIG. 6 is a schematic diagram showing an acceptance process and a scribing process by the cutting apparatus 1. FIG. 7 is a schematic diagram showing a reversing process and a breaking process by the cutting apparatus 1. FIG. 6A is a view showing a receiving process, FIG. 6B is a view showing a scribe process, and FIG. 6C is a view showing a state of transition from the scribe process to the inversion process. FIG. 7A is a diagram showing the inversion process, FIG. 7B is a diagram showing the breaking process, and FIG. 7C is a diagram showing the state after the breaking process is completed.

<Acceptance process>
In the dividing step, first, as shown in FIG. 6A, the work 9 placed at the receiving position P0 is first moved from the receiving position P0 to the processing reference position P1 in the main path R1 by the transfer device 40. It is transferred onto the support base 13. Furthermore, the workpiece 9 placed on the first support table 13 by the transfer device 40 is fixed to the first support table 13 by vacuum suction.

<Scribe process>
Next, as shown in FIG. 6B, the first support table 13 to which the workpiece 9 is fixed is moved by the first support table moving mechanism 14 on one side of the main path R1 to the processing reference position P1. Are reciprocated along the apparatus width direction (Y-axis direction). The movement distances of the forward path and the return path in the apparatus width direction by the first support base moving mechanism 14 are distances greater than the width of the workpiece 9.

  The lifting mechanism 15 of the scribing device 10 includes a plurality of cutting blades while the work 9 fixed to the first support base 13 is moving in one of the forward path and the return path along the apparatus width direction (Y-axis direction). 11 is held at a machining position in contact with the workpiece 9, and each of the plurality of cutting blades 11 is held at a retracted position at other times. Thereby, a plurality of parallel scribe lines Ls along the moving direction of the workpiece 9, that is, along the apparatus width direction are formed on the first surface of the workpiece 9.

  The example shown in FIG. 6B is an example in which a plurality of cutting blades 11 are held at the machining position while the workpiece 9 fixed to the first support base 13 is moving along the device width direction. is there. Note that the plurality of cutting edges 11 may be held at the machining position while the workpiece 9 is moving along the return path along the apparatus width direction.

<Inversion process>
When the scribe process is completed, as shown in FIG. 6C, the work 9 on which the plurality of scribe lines Ls are formed is reversed from the first support base 13 located at the processing reference position P1 by the transfer device 40. It is transferred to the turntable 21 located at the position P2. Furthermore, the workpiece 9 placed on the reversing table 21 by the transfer device 40 is fixed to the reversing table 21 by vacuum suction.

  Next, as shown in FIG. 7A, the work 9 is turned upside down by the reversing device 20 and placed on the second support base 33. Furthermore, the workpiece 9 is fixed to the second support 33 by vacuum suction with the second surface facing upward.

<Breaking process>
When the reversing step is completed, as shown in FIGS. 7B and 7C, the work 9 fixed to the second support base 33 is moved to the second support base lateral movement mechanism 34 and the second support base vertical. The moving mechanism 35 moves from the reverse position P2 of the main route R1 to the sending position P3 of the main route R1 via the sub route start position P4 and the sub route end position P5 in the sub route R2 parallel to the main route R1.

  In addition, the lifting mechanism 32 of the breaking device 30 moves the break bar 31 to a plurality of scribes with respect to the second surface of the work 9 while the work 9 fixed to the second support base 33 moves along the sub route R2. Press sequentially along each line Ls. As a result, the workpiece 9 is brittlely broken along the scribe line Ls, divided into a plurality of element plate members 91, and conveyed to the delivery position P3.

<Effect>
In the dividing device 1, the reversing process by the reversing device 20 is performed at the reversing position P2 on the main route R1, and the breaking process by the breaking device 30 is performed on the sub route R2 parallel to the main route R1. Therefore, the reversing device 20 and the break device 30 are arranged with their positions shifted in the device width direction (Y-axis direction).

  Therefore, in the cutting apparatus 1, the dimensions of the entire reversing device 20 and the break device 30 in the main path direction, that is, the longitudinal direction, while avoiding mutual interference between the reversing device 20 and the breaking device 30 and securing a maintenance space for each device. The direction dimension can be reduced.

  Further, in the cutting device 1, the reversing device 20 and the breaking device 30 (pressing mechanism) are arranged at positions where at least a part thereof overlaps when viewed from the device width direction (Y-axis direction). Therefore, the dimensions of the entire reversing device 20 and the breaking device 30 in the main path direction can be further reduced.

  In general, the long workpiece 9 on which only the scribe lines Ls that cross in the width direction are formed is relatively small and lightweight, unlike the workpiece on which the lattice-like scribe lines are formed. Therefore, the 1st support stand moving mechanism 14, the 2nd support stand horizontal moving mechanism 34, and the 2nd support stand vertical moving mechanism 35 are realizable by a comparatively small and simple mechanism.

  Moreover, the workpiece | work 9 which is a long brittle board | plate material is conveyed in the state in which a longitudinal direction follows a main path | route direction. And the 1st support stand moving mechanism 14 and the 2nd support stand lateral movement mechanism 34 move the 1st support stand 13 to which the workpiece | work 9 was fixed from the process reference position P1 on the main path | route in the width direction of the workpiece | work 9. It is only necessary to reciprocate a short distance slightly longer than the small width of 9. Therefore, the dimension of the cutting device 1 in the device width direction can be kept relatively small regardless of the length of the workpiece 9.

  Further, in the transfer device 40 that transfers the workpiece 9 along the main path R1, the frame 41 that movably supports the movement support mechanism 42 that supports the workpiece 9 is located upstream from the reverse position P2 in the main path direction. It is formed in a series over a wide range extending downstream from the delivery position P3. As a result, the configuration of the transfer device 40 is simplified.

  In the cutting apparatus 1, the transfer device 40 (transfer mechanism) that transfers the workpiece 9 along the main path R1 and the mechanisms (such as the beam 12 and the lifting mechanism 15) that support the cutting blade 11 are arranged on the left and right sides of the main path R1. Arranged separately on both sides. Therefore, in the transfer device 40, the long frame that supports the movement support mechanism 42 is arranged separately on the upstream side and the downstream side of the processing reference position P1 in order to avoid interference with the mechanism that supports the cutting blade 11. There is no need to

  In the cutting apparatus 1, the scribe line Ls is formed while the longitudinal direction of the work 9 is in a state along the main path direction. Therefore, the mechanism and process for changing the direction of the workpiece 9 as in the second conventional example shown in FIG. 9 are not required. Therefore, there is no problem that the apparatus becomes larger and more complicated for changing the direction of the work 9 and that the time required for the cutting process becomes longer.

  In the cutting apparatus 1, the work 9 is moved by the first support base moving mechanism 14 with respect to the main path direction (X-axis direction) which is the transfer direction in a state where the plurality of cutting blades 11 are held at the processing position. Move in the device width direction (Y-axis direction) intersecting. Accordingly, a plurality of scribe lines Ls crossing the work 9 in the apparatus width direction are simultaneously formed on the first surface of the moving work 9. As a result, the time required for the scribing process is greatly reduced compared to the first conventional example (see FIG. 8) in which one cutting blade 11 reciprocates a number of times corresponding to the number of scribe lines Ls.

  As described above, by adopting the cutting device 1, the time required for the scribe process can be shortened when the long work 9 is cut only at the scribe line Ls along the width direction by the scribe process. In addition, the apparatus can be simplified and downsized.

<Others>
In the cutting apparatus 1, it is conceivable that the first support base moving mechanism 14 is a mechanism that moves the first support base 13 in a direction that intersects the main path direction at an angle other than 90 °. For example, when it is required to divide the rectangular workpiece 9 into a plurality of parallelogram-shaped element plate members 91, the first support base moving mechanism 14 is inclined with respect to the main path direction (X-axis direction). What is necessary is just to reciprocate the 1st support stand 13 in the direction which cross | intersects.

  In the cutting apparatus 1, the first support base moving mechanism 14 may be a mechanism that moves the first support base 13 along a curved path in a direction crossing the main path direction. As a result, a curved scribe line Ls that crosses the workpiece 9 in the width direction is formed. However, in this case, the break bar 31 is a member that forms a curved ridge line whose tip is along the curved scribe line Ls.

  Moreover, in the cutting device 1, it is also conceivable that the entire pressing mechanism including the break bar 31 and the lifting mechanism 32 in the breaking device 30 is disposed at a position overlapping the reversing device 20 when viewed from the device width direction (Y-axis direction). . Thereby, the dimension in the main path | route direction (X-axis direction) of the cutting device 1 becomes smaller.

  For example, the position of the reversing device 20 overlapping with the reversing device 20 when the entire pressing mechanism is viewed from the device width direction, for example, by using the strut of the reversing device 20 as one of the two struts supporting the lifting mechanism 32 in the pressing mechanism. It becomes possible to arrange in.

  By the way, the work 9 may have a structure in which two brittle plate materials are stacked like a glass substrate which is a base material of a liquid crystal display panel. Such a double-structured work 9 needs to execute a dividing step for each of the two brittle plate members.

  Therefore, when the workpiece 9 to be processed has a double structure, the two cutting devices 1 may be arranged side by side in the main path direction (X-axis direction). In this case, the sending position P3 in the dividing device 1 arranged in the preceding stage becomes the receiving position P0 in the dividing device 1 arranged in the succeeding stage.

  In addition, when the workpiece 9 to be processed has a double structure, the entire two cutting devices 1 arranged side by side in the direction of the main path are formed of a plurality of elements each having a double structure. This is a cutting system that divides the plate material 91.

  Further, when the two cutting devices 1 are arranged side by side in the main path direction (X-axis direction), a series of frames 41 in the transfer device 40 are formed in a series over both of the two cutting devices 1. Is also possible.

  Further, as described above, the cutting device 1 is a device having a very small size in the width direction with respect to the size in the longitudinal direction. Therefore, it is also conceivable that a plurality of cutting devices 1 are arranged side by side in the device width direction. For example, it is conceivable that the two cutting devices 1 are arranged symmetrically with respect to the center line along the main path direction. In this case, it is conceivable that the two frames 41 constituting the two transfer devices 40 are arranged on both outer sides in the device width direction.

  Moreover, when the workpiece 9 to be processed has a double structure, a plurality of cutting systems each including two cutting devices 1 arranged in the main path direction may be arranged side by side in the device width direction. . For example, it is conceivable that two sets of cutting device systems are arranged symmetrically with respect to the center line along the main path direction.

  In the cutting apparatus 1, the plurality of cutting blades 11 that form the scribe line Ls on the work 9 may be a plurality of laser beam emitting portions that form the scribe line Ls on the work 9. The laser beam emitting portion is an example of a scribing end.

1 Cutting device R1 Main route R2 Sub route P1 Machining reference position P2 Reverse position P3 Delivery position P4 Sub route start position P5 Sub route end position 9 Work 10 Scribing device 11 Cutting blade 12 Beam 13 First support stand 14 First support stand movement Mechanism 15 Elevating mechanism of scribing device 16 Position adjusting mechanism 20 Reversing device 21 Reversing table 22 Rotating drive unit 23 Movable support member 24 Elevating mechanism of reversing device 30 Break device 31 Break bar 32 Elevating mechanism of break device 33 Second support table 34 First Two support base lateral movement mechanisms 35 Second support base vertical movement mechanism 40 Transfer device 41 Frame 42 Movement support mechanism 91 Element plate material 141, 341, 351 Rail 142, 342, 352 Ball screw 143, 342, 353 Drive device 344 Base 421 Work holding unit 422 Lifting device of transfer device 423 Traveling mechanism of transfer device

Claims (3)

A cutting device that forms a scribe line on a brittle plate that is sequentially transferred to a plurality of positions in a main path along the first direction, and breaks the brittle plate along the scribe line into a plurality of element plates. There,
A reversing mechanism for reversing the brittle plate material formed on the first surface by a plurality of the scribe lines intersecting in the second direction intersecting the first direction at a predetermined reversing position in the main path;
A support base for supporting and fixing the brittle plate reversed by the reversing mechanism;
Support for moving the support base from the reverse position to a sub path start position in a sub path parallel to the main path, and further moving the support base from the sub path start position to the sub path end position along the sub path A table moving mechanism;
In the middle of the movement of the support base along the sub path, the second surface opposite to the first surface of the brittle plate fixed to the support base is pushed along the scribe line. And a pressing mechanism that divides the brittle plate into a plurality of the element plate members.   The cutting device according to claim 1, wherein the reversing mechanism and the pressing mechanism are arranged at a position where at least a part thereof overlaps when viewed from a direction orthogonal to the first direction. A cutting device that forms a scribe line on a brittle plate that is sequentially transferred to a plurality of positions in a main path along the first direction, and breaks the brittle plate along the scribe line into a plurality of element plates. There,
A first support for supporting and fixing the brittle plate;
A first support base moving mechanism for reciprocating the first support base in a second direction intersecting the first direction from a predetermined processing reference position in the main path;
A plurality of scribing ends that form the scribe lines with respect to the brittle plate material;
Supporting each of the plurality of scribing ends with an interval along the first direction, and with respect to the brittle plate material fixed to the first support table being moved by the first support table moving mechanism A processing end support mechanism for holding the scribe line at a processing position where it can be formed;
The brittle plate having a plurality of the scribe lines crossing in the second direction intersecting the first direction formed on the first surface, the reversal position downstream of the processing reference position in the main path in the transport direction A reversing mechanism for vertically reversing in
A second support base for supporting and fixing the brittle plate reversed by the reversing mechanism;
The second support base is moved from the reverse position to a sub path start position in a sub path parallel to the main path, and the support base is moved along the sub path from the sub path start position to the sub path end position. A second support moving mechanism,
In the middle of the movement of the second support base along the secondary path, the second surface opposite to the first surface of the brittle plate fixed to the second support base is along the scribe line. And a pressing mechanism that divides the brittle plate material into a plurality of the element plate materials by pressing.

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