JP2013229514A - Fine air bubble generator, fine air bubble generation method, substrate processing apparatus, and substrate processing method - Google Patents

Fine air bubble generator, fine air bubble generation method, substrate processing apparatus, and substrate processing method Download PDF

Info

Publication number
JP2013229514A
JP2013229514A JP2012101754A JP2012101754A JP2013229514A JP 2013229514 A JP2013229514 A JP 2013229514A JP 2012101754 A JP2012101754 A JP 2012101754A JP 2012101754 A JP2012101754 A JP 2012101754A JP 2013229514 A JP2013229514 A JP 2013229514A
Authority
JP
Japan
Prior art keywords
color
fine bubbles
fine
concentration
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012101754A
Other languages
Japanese (ja)
Other versions
JP2013229514A5 (en
JP6037649B2 (en
Inventor
Hideaki Terakado
秀晃 寺門
Konosuke Hayashi
航之介 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2012101754A priority Critical patent/JP6037649B2/en
Publication of JP2013229514A publication Critical patent/JP2013229514A/en
Publication of JP2013229514A5 publication Critical patent/JP2013229514A5/ja
Application granted granted Critical
Publication of JP6037649B2 publication Critical patent/JP6037649B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a fine air bubble generator equipped with an inexpensive device which checks whether or not the concentration of generated fine bubbles is sufficient for performing better processing in a substrate processing apparatus which processes a substrate using a process liquid including the fine bubbles generated by the fine air bubble generator and a substrate processing method.SOLUTION: A fine air bubble generator is composed of: a storage tank 2 storing a process liquid L including fine bubbles; a color sensor C detecting a color of the process liquid L; and a control part 8 detecting the concentration of the fine bubbles in the process liquid L on the basis of a detection result of the color sensor C.

Description

本発明は、微細気泡発生装置、微細気泡発生方法、基板処理装置、および基板処理方法に関する。   The present invention relates to a fine bubble generating apparatus, a fine bubble generating method, a substrate processing apparatus, and a substrate processing method.

例えば、半導体装置や液晶表示装置などの製造工程において、半導体ウェーハや液晶用ガラス基板などの基板の表面に処理液を供給し、その基板表面を処理する、基板処理装置が用いられる。この基板処理装置としては、例えば、半導体ウェーハの基板表面から不要になったレジスト膜を剥離するレジスト剥離装置や、基板表面に付着したパーティクル等の異物除去を目的とした洗浄装置が挙げられる。   For example, in a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus is used that supplies a processing liquid to the surface of a substrate such as a semiconductor wafer or a glass substrate for liquid crystal and processes the substrate surface. Examples of the substrate processing apparatus include a resist stripping apparatus that strips a resist film that is no longer needed from the substrate surface of a semiconductor wafer, and a cleaning apparatus for removing foreign matters such as particles adhering to the substrate surface.

このような基板処理装置では、微細気泡を多数含む液体が処理液として用いられることがある。   In such a substrate processing apparatus, a liquid containing many fine bubbles may be used as a processing liquid.

また、切削加工等の機械加工を施す機械加工装置において、被加工部に切り込むブレード等の加工具の切削液に微細気泡を含ませることがある。微細気泡を含む切削液を用いることによって、微細気泡がクッションの役割を果たし加工具と被加工物との間の摩擦が低減され、加工具の長寿命化が図れるほか、切削液に含まれる微細気泡によって加工具や被加工物に付着した切削屑が吸着、除去されることにより、チッピング防止等の効果が得られる。   Further, in a machining apparatus that performs machining such as cutting, fine bubbles may be included in the cutting fluid of a processing tool such as a blade that is cut into a workpiece. By using a cutting fluid containing fine bubbles, the fine bubbles act as a cushion, reducing friction between the processing tool and the workpiece, extending the life of the processing tool, and reducing the fineness contained in the cutting fluid. Effects such as chipping prevention can be obtained by adsorbing and removing cutting chips adhering to the processing tool and the workpiece by the bubbles.

ここで、微細気泡とは、マイクロバブルやマイクロナノバブル、ナノバブルなどの概念を含む気泡である。例えば、マイクロバブルは10μm〜数十μmの直径を有する気泡であり、マイクロナノバブルは数百nm〜10μmの直径を有する気泡であり、ナノバブルは数百nm以下の直径を有する気泡である。   Here, the fine bubbles are bubbles including concepts such as micro bubbles, micro nano bubbles, and nano bubbles. For example, microbubbles are bubbles having a diameter of 10 μm to several tens of μm, micronano bubbles are bubbles having a diameter of several hundred nm to 10 μm, and nanobubbles are bubbles having a diameter of several hundred nm or less.

このような微細気泡を含む処理液を用いる処理においては、必要とする量の微細気泡が処理液内に含まれていることが重要となる。このため、処理開始前に、処理液中における微細気泡の含有量を確認しているが、従来、この確認する計測器として濁度計等を用いていた。   In processing using such a processing liquid containing fine bubbles, it is important that the required amount of fine bubbles is contained in the processing liquid. For this reason, the content of fine bubbles in the treatment liquid is confirmed before the start of the treatment. Conventionally, a turbidimeter or the like has been used as a measuring instrument for confirmation.

特開2008−104608号公報JP 2008-104608 A

一般的に濃度計は高価であり、また処理液中における微細気泡の含有量や含有濃度(以下これらを総称して「濃度」ということもある。)を確認する装置は、基板処理装置や、機械加工装置など、処理を行う装置に対してあくまで付属的に設置されるものであることから、できるだけ安価なものが求められる。   In general, a densitometer is expensive, and a device for confirming the content and concentration of fine bubbles in a processing solution (hereinafter, collectively referred to as “concentration”) includes a substrate processing device, Since it is only attached to a processing apparatus such as a machining apparatus, an inexpensive apparatus is required.

微細気泡を含む処理液を貯留する貯留タンクと、前記処理液の色を検出するカラーセンサと、前記カラーセンサの検出結果に基づき、前記処理液中の微細気泡の濃度を検知することができる制御部とを有することを特徴とする。   A storage tank that stores processing liquid containing fine bubbles, a color sensor that detects the color of the processing liquid, and a control that can detect the concentration of the fine bubbles in the processing liquid based on the detection result of the color sensor. Part.

本発明の一実施形態によれば、処理液中における微細気泡の濃度を、安価な装置を用いて計測することができる。   According to one embodiment of the present invention, the concentration of fine bubbles in the processing liquid can be measured using an inexpensive apparatus.

本発明の第1の実施形態に係る基板処理装置の概略図。1 is a schematic view of a substrate processing apparatus according to a first embodiment of the present invention. 微細気泡発生手段への気体供給量とカラー検出手段の検出結果との関係を示したグラフ。The graph which showed the relationship between the gas supply amount to a fine bubble generation means, and the detection result of a color detection means. 本発明の第2の実施形態に係る基板処理装置の概略図。Schematic of the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. 本発明の第3の実施形態に係る基板処理装置の概略図。Schematic of the substrate processing apparatus which concerns on the 3rd Embodiment of this invention. 本発明の第4の実施形態に係る基板処理装置の概略図。Schematic of the substrate processing apparatus which concerns on the 4th Embodiment of this invention.

[第1の実施形態]
本発明の実施形態について図面を参照して説明する。
[First Embodiment]
Embodiments of the present invention will be described with reference to the drawings.

図1に示すように、基板処理装置1は、微細気泡発生装置30と、基板処理部10によって構成されている。   As shown in FIG. 1, the substrate processing apparatus 1 includes a fine bubble generating device 30 and a substrate processing unit 10.

微細気泡発生装置30は、貯留タンク2を有しており、この貯留タンク2には、貯留タンク2内に備えられた微細気泡発生手段3から供給される処理液Lが貯留されている。微細気泡発生手段3は、供給配管4aを介して加圧タンク5に接続されており、加圧タンク5の上流には、液体供給源6、気体供給源7が備えられている。また、貯留タンク2は、戻り配管4bを介して加圧タンク5に接続されている。   The fine bubble generating device 30 has a storage tank 2, and the processing liquid L supplied from the fine bubble generating means 3 provided in the storage tank 2 is stored in the storage tank 2. The fine bubble generating means 3 is connected to a pressurized tank 5 via a supply pipe 4 a, and a liquid supply source 6 and a gas supply source 7 are provided upstream of the pressurized tank 5. The storage tank 2 is connected to the pressurized tank 5 via a return pipe 4b.

なお、液体供給源6および気体供給源7には図示しない流量調整弁が備えられており、それぞれ液体と気体の供給量が制御部8によって制御される。   In addition, the liquid supply source 6 and the gas supply source 7 are provided with a flow rate adjusting valve (not shown), and the supply amounts of the liquid and the gas are controlled by the control unit 8 respectively.

貯留タンク2の側壁面に対向する位置には、図示しない保持手段によって、背景色パネルPが備えられており、この背景色パネルPの色を検出できる位置(本実施形態では、貯留タンク2を挟んで背景色パネルPに対向する位置)にカラー検出手段Cが設置されている。なお、カラー検出手段Cは、前述の制御部8に電気的に接続されている。このカラー検出手段Cおよび背景色パネルPによって、カラーセンサが構成される。なお貯留タンク2において、少なくともカラー検出手段Cの検出光の通過経路は透明部材で形成されている。   A background color panel P is provided at a position facing the side wall surface of the storage tank 2 by holding means (not shown), and a position where the color of the background color panel P can be detected (in this embodiment, the storage tank 2 is Color detecting means C is installed at a position facing the background color panel P across the surface. The color detection means C is electrically connected to the control unit 8 described above. The color detection means C and the background color panel P constitute a color sensor. In the storage tank 2, at least the detection light passing path of the color detection means C is formed of a transparent member.

貯留タンク2は、配管9を介して基板処理部10に接続されている。基板処理部10は、例えば被処理物である半導体ウェーハWを洗浄処理するためのユニットであり、半導体ウェーハWの表面に処理液Lを供給するためのノズル11と、半導体ウェーハWを保持する保持手段12を備えている。なお、配管9には、バルブBが備えられており、この開閉は制御部8によって制御されている。   The storage tank 2 is connected to the substrate processing unit 10 via a pipe 9. The substrate processing unit 10 is a unit for cleaning, for example, a semiconductor wafer W that is an object to be processed, and a nozzle 11 for supplying a processing liquid L to the surface of the semiconductor wafer W and a holding for holding the semiconductor wafer W. Means 12 are provided. The pipe 9 is provided with a valve B, and this opening / closing is controlled by the control unit 8.

次に、基板処理装置1の処理動作について、説明する。   Next, the processing operation of the substrate processing apparatus 1 will be described.

加圧タンク5は、液体供給源6からの液体に気体供給源7からの気体を加圧溶解することによって、気体溶存液体を生成する。本実施形態では、液体として純水、気体として窒素ガスが用いられる。この、純水と窒素ガスの供給量は、制御部8によって制御されている。加圧タンク5で生成された、窒素ガスを溶存した純水は、供給配管4aを通って貯留タンク2内の微細気泡発生手段3へと供給される。   The pressurized tank 5 generates a gas-dissolved liquid by pressurizing and dissolving the gas from the gas supply source 7 into the liquid from the liquid supply source 6. In the present embodiment, pure water is used as the liquid and nitrogen gas is used as the gas. The supply amounts of pure water and nitrogen gas are controlled by the control unit 8. The pure water in which nitrogen gas is dissolved generated in the pressurized tank 5 is supplied to the fine bubble generating means 3 in the storage tank 2 through the supply pipe 4a.

微細気泡発生手段3を通過した液体は、純水中の窒素ガスが微細な気泡として析出され、微細な窒素ガスの気泡を含む純水(処理液L)として貯留タンク2内に供給される(微細気泡発生工程)。貯留タンク2内に貯留された処理液Lは、戻り配管4bを介して再び加圧タンク5に戻すことができるようになっており、貯留タンク2と加圧タンク5との間を循環する。   The liquid that has passed through the fine bubble generating means 3 is supplied with nitrogen gas in pure water as fine bubbles, and is supplied into the storage tank 2 as pure water (treatment liquid L) containing fine nitrogen gas bubbles ( Microbubble generation process). The processing liquid L stored in the storage tank 2 can be returned to the pressurized tank 5 again via the return pipe 4 b and circulates between the storage tank 2 and the pressurized tank 5.

貯留タンク2内の処理液Lは、カラー検出手段Cによって色の検出がなされている(カラー検出工程)。ここでカラーセンサの検出動作について説明する。   The color of the processing liquid L in the storage tank 2 is detected by the color detection means C (color detection process). Here, the detection operation of the color sensor will be described.

カラー検出手段Cは、特定の色を検出したときの測定値を最大測定値として設定することにより、検出した色が予め設定した一定の色に近いか,そうではないかを測定値によって示す機能を有する。測定値が高ければ記憶させた色により近く、測定値が低ければ記憶させた色とは異なる。   The color detection means C is a function that indicates whether a detected color is close to a predetermined color or not by a measured value by setting a measured value when a specific color is detected as a maximum measured value. Have If the measured value is high, it is closer to the stored color, and if the measured value is low, it is different from the stored color.

カラー検出手段Cの測定値は、制御部8へ送られる。制御部8は、カラー検出手段Cの検出結果である測定値を、予め設定した閾値Tより高いか低いかによって微細気泡の濃度を判断する(濃度判断工程)。この閾値Tは、予め実験によって求め、設定される。   The measurement value of the color detection means C is sent to the control unit 8. The control unit 8 determines the density of the fine bubbles based on whether the measurement value, which is the detection result of the color detection means C, is higher or lower than a preset threshold value T (density determination step). This threshold value T is obtained and set in advance by experiments.

なお、本実施形態においては、予め白を検出したときの測定値を最大測定値として設定する。カラー検出手段Cからの測定値より、処理液Lの色が白に近いかどうかが判別でき、測定値が高ければ高いほど、白いということになる。背景色パネルPは、本実施形態においては、赤いパネルを用いる。   In the present embodiment, the measurement value when white is detected in advance is set as the maximum measurement value. From the measurement value from the color detection means C, it can be determined whether or not the color of the treatment liquid L is close to white, and the higher the measurement value, the more white it is. As the background color panel P, a red panel is used in this embodiment.

貯留タンク2内の処理液Lは、微細気泡を多く含めば含むほど、白濁してくる。まず、微細気泡を含まない状態(気体供給量が0)でカラー検出手段Cが貯留タンク2内の処理液の色(この場合は背景色パネルPそのものの色)を検出した場合は、図2に示すとおり、背景色パネルPの赤を検出した結果、測定値は閾値Tに対し、かけ離れた測定値となる。この測定結果は、制御部8に送られ、制御部8は、窒素ガス供給量を増加させる(制御工程)。処理液L中に存在する微細気泡が増え始めると、処理液Lは白濁し、カラー検出手段Cの測定値も徐々に上昇していく。カラー検出手段Cの測定値が予め設定した閾値T以上となるとき、制御部8は、処理液L中の微細気泡の濃度がその後の処理工程において最適な濃度に達したと判断し、次工程である基板処理部10への送液に移る(送液工程)。   The treatment liquid L in the storage tank 2 becomes more cloudy as it contains more fine bubbles. First, when the color detection means C detects the color of the processing liquid in the storage tank 2 (in this case, the color of the background color panel P itself) in a state not containing fine bubbles (the gas supply amount is 0), FIG. As shown in FIG. 5, as a result of detecting red in the background color panel P, the measured value is a measured value far from the threshold value T. The measurement result is sent to the control unit 8, and the control unit 8 increases the supply amount of nitrogen gas (control process). When the fine bubbles existing in the processing liquid L start to increase, the processing liquid L becomes cloudy and the measured value of the color detection means C gradually increases. When the measured value of the color detection means C is equal to or greater than a preset threshold value T, the control unit 8 determines that the concentration of fine bubbles in the processing liquid L has reached an optimal concentration in the subsequent processing step, and the next step It moves to the liquid feeding to the substrate processing part 10 which is (liquid feeding process).

貯留タンク2内の処理液Lが、処理工程に最適な濃度の微細気泡を有する処理液Lとなると、制御部8はバルブBを開状態にし、配管9を介して基板処理部10へ供給する。基板処理部10のノズル11は、保持装置12によって保持された半導体ウェーハWの表面に対して処理液Lを吐出し、半導体ウェーハWを洗浄処理する。   When the processing liquid L in the storage tank 2 becomes the processing liquid L having fine bubbles having a concentration optimum for the processing process, the control unit 8 opens the valve B and supplies the valve B to the substrate processing unit 10 via the pipe 9. . The nozzle 11 of the substrate processing unit 10 discharges the processing liquid L onto the surface of the semiconductor wafer W held by the holding device 12 and cleans the semiconductor wafer W.

このような実施形態によれば、安価で簡易な構成で微細気泡濃度を制御し、処理に対して最適な濃度で発生させた微細気泡を含む処理液を被処理物に供給することができる。
[第2の実施形態]
図3は、本発明の第2の実施形態による基板処理装置100の概略を示す図である。なお、前述の第1の実施形態と同一の部品については、同一の符号を用い、説明を省略する。
According to such an embodiment, the concentration of fine bubbles can be controlled with an inexpensive and simple configuration, and a treatment liquid containing fine bubbles generated at an optimum concentration for processing can be supplied to the object to be processed.
[Second Embodiment]
FIG. 3 is a diagram schematically illustrating the substrate processing apparatus 100 according to the second embodiment of the present invention. Note that the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

第第1の実施形態との違いは、背景色パネルPとカラー検出手段Cが、ノズル11を挟んで対向する位置に備えられている点である。カラー検出手段Cは、ノズル11から吐出された処理液Lに含まれる微細気泡の濃度を吐出された処理液Lの色を検出することによって測定する。この検出結果は、第1の実施形態と同様、制御部8に送られ、制御部8によって、予め実験により求められた最適な閾値Tと比較される。制御部8は、この比較結果に基づき、気体供給源7からの気体供給量について、フィードバック制御する。すなわち、微細気泡の発生濃度が閾値Tより低い場合には、気体供給源6から加圧タンク5へ供給する窒素ガスの供給量を増やす。   The difference from the first embodiment is that the background color panel P and the color detection means C are provided at positions facing each other across the nozzle 11. The color detection means C measures the concentration of fine bubbles contained in the processing liquid L discharged from the nozzle 11 by detecting the color of the discharged processing liquid L. This detection result is sent to the control unit 8 as in the first embodiment, and is compared by the control unit 8 with the optimum threshold value T obtained in advance through experiments. The control unit 8 performs feedback control on the gas supply amount from the gas supply source 7 based on the comparison result. That is, when the generation concentration of fine bubbles is lower than the threshold value T, the supply amount of nitrogen gas supplied from the gas supply source 6 to the pressurized tank 5 is increased.

このような実施形態によれば、第1の実施形態と同様の効果を得ることができる。すなわち、安価で簡易な構成で微細気泡濃度を制御し、処理に対して最適な濃度で発生させた微細気泡を含む処理液を被処理物に供給することができる。
[第3の実施形態]
図4は、本発明の第3の実施形態による微細気泡発生装置30の概略を示す図である。なお、前述の第1の実施形態と同一の部品については、同一の符号を用い、説明を省略する。第一の実施形態との違いは、貯留タンク2の側壁に検出用配管21が、設けられ、検出用配管21を挟んで対向する位置に背景色パネルPとカラー検出手段Cが備えられている点である。
According to such an embodiment, the same effect as that of the first embodiment can be obtained. That is, it is possible to control the concentration of fine bubbles with an inexpensive and simple configuration, and to supply a treatment liquid containing fine bubbles generated at an optimum concentration for processing to the object to be processed.
[Third Embodiment]
FIG. 4 is a diagram showing an outline of a microbubble generator 30 according to the third embodiment of the present invention. Note that the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted. The difference from the first embodiment is that a detection pipe 21 is provided on the side wall of the storage tank 2, and a background color panel P and a color detection means C are provided at positions facing each other with the detection pipe 21 interposed therebetween. Is a point.

検出用配管21は、貯留タンク2の側壁の上下部2箇所を開口させた状態で接続させた配管である。検出用配管21の配管内には、貯留タンク2に貯留されている処理液と同じ処理液が貯留されている。検出用配管21は透明部材から構成される。   The detection pipe 21 is a pipe that is connected in a state where the upper and lower portions of the side wall of the storage tank 2 are opened. In the pipe of the detection pipe 21, the same processing liquid as that stored in the storage tank 2 is stored. The detection pipe 21 is made of a transparent member.

カラー検出手段Cは、検出用配管21内の処理液Lの色を検出する。第一の実施形態と同様、処理液Lに微細気泡が含まれていないときは、検出用配管21を挟んで対向して配置される背景色パネルPの赤色を検出するため、測定値0となる。処理液L中の微細気泡が増加すると検出用配管21内の処理液は白濁し、カラー検出手段Cの測定値が上昇する。第一の実施形態と同様、閾値T以上となると、制御部8は、次工程である基板処理部10へ送液するため、バルブBを開状態とする。   The color detection means C detects the color of the processing liquid L in the detection pipe 21. As in the first embodiment, when the processing liquid L does not contain fine bubbles, the red color of the background color panel P arranged opposite to the detection pipe 21 is detected. Become. When the fine bubbles in the processing liquid L increase, the processing liquid in the detection pipe 21 becomes cloudy and the measured value of the color detection means C increases. Similarly to the first embodiment, when the threshold value T is equal to or greater than the threshold value T, the control unit 8 opens the valve B in order to send the solution to the substrate processing unit 10 as the next process.

このような実施形態によれば、第1の実施形態と同様の効果を得ることができる。すなわち、安価で簡易な構成で微細気泡濃度を制御し、処理に対して最適な濃度で発生させた微細気泡を含む処理液を被処理物に供給することができる。
[第4の実施形態]
図5は、本発明の第4の実施形態による基板処理装置200の概略を示す図である。なお、前述の第1の実施形態と同一の部品については、同一の符号を用い、説明を省略する。第1の実施形態との違いは、供給配管4aが分岐し、分岐供給配管41aを形成している点と、ノズル11の代わりに、微細気泡発生手段を備えたノズル31を有している点である。分岐供給配管41aは、ノズル31に接続されている。供給配管4aが分岐供給配管41aに分岐する分岐点には、バルブB1(三方弁)が備えられている。
According to such an embodiment, the same effect as that of the first embodiment can be obtained. That is, it is possible to control the concentration of fine bubbles with an inexpensive and simple configuration, and to supply a treatment liquid containing fine bubbles generated at an optimum concentration for processing to the object to be processed.
[Fourth Embodiment]
FIG. 5 is a diagram schematically showing a substrate processing apparatus 200 according to the fourth embodiment of the present invention. Note that the same components as those in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted. The difference from the first embodiment is that the supply pipe 4a is branched to form a branch supply pipe 41a, and the nozzle 31 is provided with fine bubble generating means instead of the nozzle 11. It is. The branch supply pipe 41 a is connected to the nozzle 31. A valve B1 (three-way valve) is provided at a branch point where the supply pipe 4a branches into the branch supply pipe 41a.

まず、供給配管4aを通して微細気泡発生手段3に供給された処理液Lは、第1の実施形態同様、戻り配管4bによって加圧タンク5と貯留タンク2とを循環しながら、徐々に白濁していく(微細気泡の濃度が高くなる)。このときバルブB1の分岐供給配管41a側は閉状態なっており、この開閉制御は制御部8によって行われる。第1の実施形態同様、カラー検出手段Cの測定値が閾値より高くなると、制御部8は、バルブB1の分岐供給配管41a側を開状態、貯留タンク2に供給する側を閉状態にする。循環を繰り返し、白濁した貯留タンク2内の処理液Lは、微細気泡を多量に含むとともに、多量の気体を溶存した状態になっている。この状態を保ったまま、微細気泡発生手段3を通過することなく、加圧タンク5内の処理液Lを分岐供給配管41aを介して微細気泡発生手段を備えたノズル31に供給することによって、微細気泡発生手段31から吐出される処理液Lには、微細気泡が多量に含まれる。   First, the processing liquid L supplied to the fine bubble generating means 3 through the supply pipe 4a gradually becomes cloudy while circulating between the pressurized tank 5 and the storage tank 2 by the return pipe 4b as in the first embodiment. Go (the concentration of fine bubbles increases). At this time, the branch supply pipe 41a side of the valve B1 is closed, and this opening / closing control is performed by the control unit 8. As in the first embodiment, when the measured value of the color detection means C becomes higher than the threshold value, the control unit 8 opens the branch supply pipe 41a side of the valve B1 and closes the side supplying the storage tank 2 to the storage tank 2. The processing liquid L in the storage tank 2 that is repeatedly circulated and becomes cloudy contains a large amount of fine bubbles and is in a state in which a large amount of gas is dissolved. By supplying the processing liquid L in the pressurized tank 5 to the nozzle 31 provided with the fine bubble generating means via the branch supply pipe 41a without passing through the fine bubble generating means 3 while maintaining this state. The processing liquid L discharged from the fine bubble generating means 31 contains a large amount of fine bubbles.

このような実施形態によれば、第1の実施形態と同様の効果を得られるのみならず、微細気泡発生手段31にて発生させた微細気泡が配管途中で消滅せずに多量に含まれたままの状態で、被処理物に供給される。
[他の実施形態]
なお、上記実施形態においては、液体供給源からの液体を純水、気体供給源からの気体を窒素ガスとして説明したが、これに限らず、アンモニア水、アルカリ水、酸素ガス、など処理に適する液体、気体を使用することができる。
According to such an embodiment, not only the same effect as in the first embodiment can be obtained, but also the fine bubbles generated by the fine bubble generating means 31 are contained in a large amount without disappearing in the middle of the piping. In this state, it is supplied to the workpiece.
[Other Embodiments]
In the above embodiment, the liquid from the liquid supply source is described as pure water, and the gas from the gas supply source is described as nitrogen gas. However, the present invention is not limited to this, and is suitable for processing such as ammonia water, alkaline water, oxygen gas, and the like. Liquid or gas can be used.

また、上記実施形態においては、被処理物を半導体ウェーハWとし、基板処理装置を半導体ウェーハ洗浄工程に用いる洗浄装置としての例を説明したが、これに限らず、被処理物を機械加工する機械加工装置であっても良い。このとき、処理液Lは、被処理物、および加工部材を冷却する冷却液、切削に用いる切削液として機能する。   Moreover, in the said embodiment, although the to-be-processed object was set as the semiconductor wafer W and the example as a washing | cleaning apparatus which uses a substrate processing apparatus for a semiconductor wafer cleaning process was demonstrated, it is not restricted to this, The machine which processes a to-be-processed object It may be a processing device. At this time, the processing liquid L functions as a cooling liquid for cooling the workpiece and the processing member, and a cutting liquid used for cutting.

また、上記実施形態においては、微細気泡の発生方法を、加圧タンク、発生手段を有する加圧溶解方式として記載しているが、これに限らず、旋回方式、ベンチュリ方式、多孔質膜方式等、微細気泡が発生する構成を有していれば良い。   Further, in the above embodiment, the method for generating fine bubbles is described as a pressurized dissolution method having a pressurized tank and generating means, but is not limited to this, a swirling method, a venturi method, a porous membrane method, etc. It is only necessary to have a configuration in which fine bubbles are generated.

また、上記実施形態においては、いずれも貯留タンク2に一度処理液Lを貯留してから基板処理部へ供給する例を挙げて説明したが、第2の実施形態においてはこれに限らず、貯留タンク2を介さずに加圧タンク5から基板処理部10(このときは、第4の実施形態の微細気泡発生手段を備えたノズル31を使用する)へ処理液Lを供給するようにしても良い。   Moreover, in the said embodiment, although all gave and demonstrated the example which stores the process liquid L once in the storage tank 2, and supplies it to a board | substrate process part, in 2nd Embodiment, it does not restrict to this but stores. The processing liquid L may be supplied from the pressurized tank 5 to the substrate processing unit 10 (in this case, the nozzle 31 having the fine bubble generating means of the fourth embodiment is used) without passing through the tank 2. good.

また、上記実施形態においては、背景色パネルPの色を赤としたが、これに限らず、カラー検出手段が処理液の色を検出するときに、微細気泡を含む白濁した処理液の色と区別して検出することができる色であれば良い(従って、白と区別しやすい色の方が好ましい)。   In the above embodiment, the color of the background color panel P is set to red. However, the present invention is not limited to this, and when the color detection unit detects the color of the processing liquid, Any color can be used as long as it can be distinguished and detected (thus, a color that can be easily distinguished from white is preferable).

また、上記実施形態においては、カラー検出手段Cによって検出された測定値を制御手段8が閾値Tより高いか否かで処理液L中の微細気泡の濃度を判断し、その後の制御を行っている。しかし、これに限らず、図2のグラフに示すような気体供給量や、微細気泡の発生量、あるいは濃度に対するカラー検出手段測定値を予め求めておき、これを制御部に記憶させておくことで、カラー検出手段Cからの測定値に基づいて気体供給量を制御し、最終的に処理液中における微細気泡の濃度を制御するようにしても良い。   In the above embodiment, the concentration of fine bubbles in the processing liquid L is determined based on whether or not the control means 8 has a measured value detected by the color detection means C higher than the threshold value T, and the subsequent control is performed. Yes. However, the present invention is not limited to this, and the measured value of the color detection means for the gas supply amount, the amount of fine bubbles generated, or the concentration as shown in the graph of FIG. 2 is obtained in advance and stored in the control unit. Thus, the gas supply amount may be controlled based on the measurement value from the color detection means C, and finally the concentration of fine bubbles in the processing liquid may be controlled.

また、上記第2の実施形態においては、ノズル11から吐出した処理液の色をカラー検出手段Cが検出する例を挙げて説明したが、ノズル11において処理液が通過する部分を透ける素材にし、ノズル11吐出前の処理液を検出するようにしても良い。   In the second embodiment described above, the color detection unit C detects the color of the processing liquid discharged from the nozzle 11, but the material through which the processing liquid passes in the nozzle 11 is made transparent. You may make it detect the process liquid before nozzle 11 discharge.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これらの実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1 基板処理装置
2 貯留タンク
3 微細気泡発生手段
30 微細気泡発生装置
4a 供給配管
4b 戻り配管
5 加圧タンク
6 液体供給源
7 気体供給源
8 制御部
9 配管
10 基板処理部
11 ノズル
12 保持手段
100 基板処理装置
L 処理液
B バルブ
P 背景色パネル
C カラー検出手段
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Storage tank 3 Fine bubble generating means 30 Fine bubble generating apparatus 4a Supply pipe 4b Return pipe 5 Pressure tank 6 Liquid supply source 7 Gas supply source 8 Control part 9 Pipe 10 Substrate processing part 11 Nozzle 12 Holding means 100 Substrate processing apparatus L Processing liquid B Valve P Background color panel C Color detection means

Claims (10)

微細気泡を含む処理液を貯留する貯留タンクと、
前記処理液の色を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき、前記処理液中の微細気泡の濃度を検知することができる制御部と
を有することを特徴とする微細気泡発生装置。
A storage tank for storing a processing liquid containing fine bubbles;
A color sensor for detecting the color of the treatment liquid;
And a control unit capable of detecting the concentration of fine bubbles in the processing liquid based on the detection result of the color sensor.
微細気泡を含む処理液を被処理物に供給するノズルと、
前記ノズルから吐出される前記処理液の色を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき、前記処理液中の微細気泡の濃度を検知することができる制御部と
を有することを特徴とする微細気泡発生装置。
A nozzle for supplying a processing liquid containing fine bubbles to an object to be processed;
A color sensor for detecting the color of the processing liquid discharged from the nozzle;
And a control unit capable of detecting the concentration of fine bubbles in the processing liquid based on the detection result of the color sensor.
微細気泡を含む処理液を被処理物に供給するノズルと、
前記ノズル内を通過する処理液の色を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき、前記処理液中の微細気泡の濃度を検知することができる制御部と
を有することを特徴とする微細気泡発生装置。
A nozzle for supplying a processing liquid containing fine bubbles to an object to be processed;
A color sensor for detecting the color of the processing liquid passing through the nozzle;
And a control unit capable of detecting the concentration of fine bubbles in the processing liquid based on the detection result of the color sensor.
処理液に微細気泡を発生させる微細気泡発生手段と、
前記微細気泡発生手段から供給される微細気泡含む処理液を貯留する貯留タンクと、
前記処理液内の微細気泡の濃度を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき前記微細気泡発生手段に供給する気体の量を制御する制御部と
を有することを特徴とする微細気泡発生装置。
Fine bubble generating means for generating fine bubbles in the treatment liquid;
A storage tank for storing processing liquid containing fine bubbles supplied from the fine bubble generating means;
A color sensor for detecting the concentration of fine bubbles in the processing liquid;
And a control unit that controls the amount of gas supplied to the fine bubble generating means based on the detection result of the color sensor.
処理液に微細気泡を発生させる微細気泡発生手段と、
前記微細気泡発生手段から供給される液体を被処理物に供給するノズルと、
前記ノズルから吐出された処理液に含まれる微細気泡の濃度を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき前記微細気泡発生手段に供給する気体の量を制御する制御部と
を有することを特徴とする微細気泡発生装置。
Fine bubble generating means for generating fine bubbles in the treatment liquid;
A nozzle that supplies liquid to be processed supplied from the fine bubble generating means;
A color sensor for detecting the concentration of fine bubbles contained in the processing liquid discharged from the nozzle;
And a control unit that controls the amount of gas supplied to the fine bubble generating means based on the detection result of the color sensor.
処理液に微細気泡を発生させる微細気泡発生手段と、
前記微細気泡発生手段から供給される液体を被処理物に供給するノズルと、
前記ノズル内を通過する処理液の色を検出するカラーセンサと、
前記カラーセンサの検出結果に基づき前記微細気泡発生手段に供給する気体の量を制御する制御部と
を有することを特徴とする微細気泡発生装置。
Fine bubble generating means for generating fine bubbles in the treatment liquid;
A nozzle that supplies liquid to be processed supplied from the fine bubble generating means;
A color sensor for detecting the color of the processing liquid passing through the nozzle;
And a control unit that controls the amount of gas supplied to the fine bubble generating means based on the detection result of the color sensor.
基板の処理を行う基板処理装置において、請求項1から5に記載の微細気泡発生装置を有することを特徴とする基板処理装置。   A substrate processing apparatus for processing a substrate, comprising the fine bubble generating device according to claim 1. 基板の洗浄処理を行う基板処理装置において、請求項1から5に記載の微細気泡発生装置を有することを特徴とする基板洗浄処理装置。   A substrate processing apparatus for performing a substrate cleaning process, comprising the fine bubble generating apparatus according to claim 1. 処理液中に微細気泡を発生させる微細気泡発生工程と、
前記微細気泡発生工程にて発生した微細気泡を含む処理液中の色をカラー検出手段にて検出するカラー検出工程と、
前記カラー検出工程で検出した検出結果に基づき、前記処理液中に含まれる微細気泡の濃度が処理液使用先にて使用可能な濃度であるか否かを判断する濃度判断工程と、
前記濃度判断工程の判断結果に基づき、前記微細気泡発生工程にて用いる気体の供給量を制御する制御工程と
を有することを特徴とする微細気泡発生方法。
A fine bubble generating step for generating fine bubbles in the treatment liquid;
A color detection step of detecting a color in the processing liquid containing the fine bubbles generated in the fine bubble generation step by color detection means;
Based on the detection result detected in the color detection step, a concentration determination step for determining whether or not the concentration of fine bubbles contained in the processing liquid is a concentration that can be used at a processing liquid use destination;
And a control step of controlling a supply amount of gas used in the fine bubble generation step based on a determination result of the concentration determination step.
処理液中に微細気泡を発生させる微細気泡発生工程と、
前記微細気泡発生工程にて発生した微細気泡を含む処理液中の色をカラー検出手段にて検出するカラー検出工程と、
前記カラー検出工程で検出した検出結果に基づき、前記処理液中に含まれる微細気泡の濃度が基板処理工程にて使用可能な濃度であるか否かを判定する濃度判断工程と、
前記濃度判断工程の判断結果に基づき、前記微細気泡発生工程にて用いる気体の供給量を制御する制御工程と、
前記濃度判定工程にて微細気泡の濃度が基板処理工程にて使用可能であると判定されたときに次工程に送液する送液工程と、
を有することを特徴とする基板処理方法。
A fine bubble generating step for generating fine bubbles in the treatment liquid;
A color detection step of detecting a color in the processing liquid containing the fine bubbles generated in the fine bubble generation step by color detection means;
Based on the detection result detected in the color detection step, a concentration determination step for determining whether the concentration of fine bubbles contained in the processing liquid is a concentration usable in the substrate processing step;
Based on the determination result of the concentration determination step, a control step for controlling the supply amount of gas used in the fine bubble generation step;
A liquid feeding step for feeding the liquid to the next step when it is determined in the concentration judgment step that the concentration of fine bubbles is usable in the substrate processing step;
A substrate processing method comprising:
JP2012101754A 2012-04-26 2012-04-26 Fine bubble generating apparatus, fine bubble generating method, substrate processing apparatus, and substrate processing method Active JP6037649B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012101754A JP6037649B2 (en) 2012-04-26 2012-04-26 Fine bubble generating apparatus, fine bubble generating method, substrate processing apparatus, and substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012101754A JP6037649B2 (en) 2012-04-26 2012-04-26 Fine bubble generating apparatus, fine bubble generating method, substrate processing apparatus, and substrate processing method

Publications (3)

Publication Number Publication Date
JP2013229514A true JP2013229514A (en) 2013-11-07
JP2013229514A5 JP2013229514A5 (en) 2015-06-18
JP6037649B2 JP6037649B2 (en) 2016-12-07

Family

ID=49676847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012101754A Active JP6037649B2 (en) 2012-04-26 2012-04-26 Fine bubble generating apparatus, fine bubble generating method, substrate processing apparatus, and substrate processing method

Country Status (1)

Country Link
JP (1) JP6037649B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108570A (en) * 2020-02-26 2021-09-03 주식회사 이앤에이치 Substrate cleaning apparatus and substrate cleaning method
KR20220015984A (en) * 2020-07-31 2022-02-08 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
KR20220016786A (en) * 2020-08-03 2022-02-10 가부시키가이샤 스크린 홀딩스 Substrate processing method and substrate processing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288134A (en) * 2006-03-22 2007-11-01 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
JP2009285571A (en) * 2008-05-29 2009-12-10 Mitsubishi Electric Corp Cleaning apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288134A (en) * 2006-03-22 2007-11-01 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
JP2009285571A (en) * 2008-05-29 2009-12-10 Mitsubishi Electric Corp Cleaning apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108570A (en) * 2020-02-26 2021-09-03 주식회사 이앤에이치 Substrate cleaning apparatus and substrate cleaning method
KR102382789B1 (en) * 2020-02-26 2022-04-06 주식회사 이앤에이치 Substrate cleaning apparatus and substrate cleaning method
KR20220015984A (en) * 2020-07-31 2022-02-08 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
KR102591178B1 (en) 2020-07-31 2023-10-18 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
KR20220016786A (en) * 2020-08-03 2022-02-10 가부시키가이샤 스크린 홀딩스 Substrate processing method and substrate processing device
KR102516920B1 (en) 2020-08-03 2023-03-31 가부시키가이샤 스크린 홀딩스 Substrate processing method and substrate processing device

Also Published As

Publication number Publication date
JP6037649B2 (en) 2016-12-07

Similar Documents

Publication Publication Date Title
US10186435B2 (en) Chemical liquid preparation method of preparing a chemical liquid for substrate processing, chemical liquid preparation unit preparing a chemical liquid for substrate processing, and substrate processing system
JP6037649B2 (en) Fine bubble generating apparatus, fine bubble generating method, substrate processing apparatus, and substrate processing method
WO2016084927A1 (en) Substrate treatment method and substrate treatment apparatus
JP5243849B2 (en) Substrate processing apparatus and substrate processing method
US9975274B2 (en) Processing apparatus
JP5854668B2 (en) Gas-liquid mixed fluid generating apparatus, gas-liquid mixed fluid generating method, processing apparatus, and processing method
KR102184477B1 (en) Treatment liquid supply device, substrate treatment system, and treatment liquid supply method
JP2008080230A (en) Apparatus and method of treating substrate
JP2006261674A (en) Functional water supply system and functional water supply method
TWI815010B (en) Gas-dissolved liquid supply apparatus and gas-dissolved liquid supply method
KR20190077228A (en) Gas solution manufacturing apparatus
KR20190086348A (en) Treatment liquid supply device and deairing method thereof
TW202220746A (en) Gas dissolved liquid supplying device
JP2018019089A (en) Chemical solution-producing method for processing substrate, chemical solution-producing unit for processing substrate, substrate processing method, and substrate processing system
JP4785549B2 (en) Adsorption device and cutting device
JP2009291681A (en) Device/method of generating micro bubble and device of fabricating substrate
JP2019141813A (en) Gas dissolution liquid manufacturing device
JP2010165825A (en) Substrate treating device and substrate treating method
JP2010089180A (en) Slurry feeder for polishing substrate chemical machine, and polishing system
JP2013229514A5 (en)
JP5490938B2 (en) Substrate processing equipment
JP2013215769A (en) Laser beam machining apparatus
JP2006200942A (en) Defoaming device
JP2016189386A (en) Substrate processing apparatus
JP2008197103A (en) Apparatus and method for detecting metal concentration

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150424

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150424

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160517

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160518

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160715

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160913

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160913

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20160923

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20161101

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161101

R150 Certificate of patent or registration of utility model

Ref document number: 6037649

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150