JP2013229449A - 窒化物系半導体素子 - Google Patents
窒化物系半導体素子 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 140
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000010432 diamond Substances 0.000 claims abstract description 8
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 108
- 230000004888 barrier function Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910002704 AlGaN Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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Abstract
【解決手段】窒化物系半導体素子10は、基板12のカソード電極24とアノード電極26との間の領域に対応する領域を部分的に除去し、除去した部分に熱伝導率が高いp型半導体14を埋め込んでいる。p型半導体14は、ダイヤモンドや、WBG酸化物半導体を用いる。より効果的には、p型半導体14は、GaNと同程度のバンドギャップ(ΔEg=3〜4eV)以上とすることが好ましい。
【選択図】図1a
Description
12 基板
14 p型半導体
16 バッファ層
18 高抵抗層
20 チャネル層
22 バリア層
24 カソード電極
26 アノード電極
28 絶縁膜
Claims (10)
- 導電性の基板と、
前記導電性の基板の一部の領域に設けられた、p型電気伝導材料と、
前記基板及び前記p型電気伝導材料の上に形成された、電子走行層及び電子供給層を有する窒化物系半導体層と、
前記窒化物系半導体層上に形成された第1電極と、
前記窒化物系半導体層上に前記第1電極と離間して形成された第2電極と、
を備え、前記p型電気伝導材料は、前記窒化物系半導体層上の前記第1電極の前記第2電極側の端部と前記第2電極の前記第1電極側の端部との間の領域に対応する前記基板の領域内に設けられている、窒化物系半導体素子。 - 前記p型電気伝導材料は、前記窒化物系半導体層の最下層との間に反転層が形成されない材料からなる、請求項1に記載の窒化物系半導体素子。
- 前記p型電気伝導材料は、該p型電気伝導材料の伝導帯端のエネルギーが前記窒化物系半導体層の最下層のフェルミエネルギーから0.1eV以上高い準位である、請求項1または請求項2に記載の窒化物系半導体素子。
- 前記p型電気伝導材料のバンドギャップが2eV以上である、請求項1から請求項3のいずれか1項に記載の窒化物系半導体素子。
- 前記p型電気伝導材料は、p型ダイヤモンドからなる、請求項1から請求項4のいずれか1項に記載の窒化物系半導体素子。
- 前記p型電気伝導材料は、p型酸化物半導体からなる、請求項1から請求項4のいずれか1項に記載の窒化物系半導体素子。
- 前記p型酸化物半導体は、Cu2O、CuAlO2、ZnRh2O4、及びNiOx、GaNのいずれかからなる、請求項6に記載の窒化物系半導体素子。
- 前記基板は、Si基板、SiC基板、及びi型またはn型導電性酸化物基板のいずれかである、請求項1から請求項7のいずれか1項に記載の窒化物系半導体素子。
- 前記窒化物系半導体素子は、ダイオードである、請求項1から請求項8のいずれか1項に記載の窒化物系半導体素子。
- 前記窒化物系半導体素子は、トランジスタである、請求項1から請求項8のいずれか1項に記載の窒化物系半導体素子。
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JP2012100385A JP2013229449A (ja) | 2012-04-25 | 2012-04-25 | 窒化物系半導体素子 |
PCT/JP2013/058598 WO2013161478A1 (ja) | 2012-04-25 | 2013-03-25 | 窒化物系半導体素子 |
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Cited By (1)
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WO2018043503A1 (ja) * | 2016-08-31 | 2018-03-08 | 株式会社Flosfia | p型酸化物半導体及びその製造方法 |
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US9583607B2 (en) * | 2015-07-17 | 2017-02-28 | Mitsubishi Electric Research Laboratories, Inc. | Semiconductor device with multiple-functional barrier layer |
CN109643729B (zh) * | 2016-09-01 | 2022-03-29 | 美国亚德诺半导体公司 | 用于pga或pgia的低电容开关 |
US10560061B2 (en) | 2016-09-01 | 2020-02-11 | Analog Devices, Inc. | Low capacitance switch for programmable gain amplifier or programable gain instrumentation amplifier |
US10200029B2 (en) | 2016-09-01 | 2019-02-05 | Analog Devices, Inc. | Low capacitance analog switch or transmission gate |
US9780181B1 (en) * | 2016-12-07 | 2017-10-03 | Mitsubishi Electric Research Laboratories, Inc. | Semiconductor device with multi-function P-type diamond gate |
CN110223918B (zh) * | 2019-04-23 | 2021-01-15 | 西安电子科技大学 | 一种孔径式复合衬底氮化镓器件及其制备方法 |
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JP2008117885A (ja) * | 2006-11-02 | 2008-05-22 | Matsushita Electric Ind Co Ltd | 電界効果トランジスタおよびその製造方法 |
JP2009206142A (ja) * | 2008-02-26 | 2009-09-10 | Rohm Co Ltd | 電界効果トランジスタ |
JP2010067662A (ja) * | 2008-09-09 | 2010-03-25 | Nec Corp | 半導体装置及びその製造方法 |
WO2011024440A1 (ja) * | 2009-08-27 | 2011-03-03 | パナソニック株式会社 | 窒化物半導体装置 |
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JPH01246867A (ja) * | 1988-03-28 | 1989-10-02 | Sumitomo Electric Ind Ltd | ショットキー接合 |
JP2004510329A (ja) * | 2000-09-21 | 2004-04-02 | ケンブリッジ セミコンダクター リミテッド | 半導体デバイスおよび半導体デバイスを形成する方法 |
JP2006261474A (ja) * | 2005-03-18 | 2006-09-28 | Furukawa Electric Co Ltd:The | 窒化物系半導体デバイス |
JP2008117885A (ja) * | 2006-11-02 | 2008-05-22 | Matsushita Electric Ind Co Ltd | 電界効果トランジスタおよびその製造方法 |
JP2009206142A (ja) * | 2008-02-26 | 2009-09-10 | Rohm Co Ltd | 電界効果トランジスタ |
JP2010067662A (ja) * | 2008-09-09 | 2010-03-25 | Nec Corp | 半導体装置及びその製造方法 |
WO2011024440A1 (ja) * | 2009-08-27 | 2011-03-03 | パナソニック株式会社 | 窒化物半導体装置 |
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WO2018043503A1 (ja) * | 2016-08-31 | 2018-03-08 | 株式会社Flosfia | p型酸化物半導体及びその製造方法 |
JPWO2018043503A1 (ja) * | 2016-08-31 | 2019-07-04 | 株式会社Flosfia | p型酸化物半導体及びその製造方法 |
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