JP2013227637A - Perforated metallic foil with carrier and method for producing the same - Google Patents
Perforated metallic foil with carrier and method for producing the same Download PDFInfo
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本発明は、二次電池用の負極集電体などに用いられるパターン状の穴開き金属箔であって、キャリア上に積層されて形成された穴開き金属箔に関する。また、その製造方法に関する。 The present invention relates to a perforated metal foil in a pattern shape used for a negative electrode current collector or the like for a secondary battery, and is formed by being laminated on a carrier. Moreover, it is related with the manufacturing method.
リチウムイオン二次電池に代表される二次電池は、ノート型パーソナルコンピュータ、携帯電話、スマートフォンなど携帯型情報端末機の普及に伴い、より小型化、軽量化が求められている。また電池容量増大の観点からも、二次電池に用いられる集電体はより薄いものが要求されるようになってきている。 Secondary batteries typified by lithium ion secondary batteries are required to be smaller and lighter with the spread of portable information terminals such as notebook personal computers, mobile phones, and smartphones. Further, from the viewpoint of increasing the battery capacity, a thinner current collector used for a secondary battery has been required.
二次電池用や電気二重層キャパシタ用の集電体として、金属箔にパターン状の貫通孔が形成されたものが用いられている。このような穴開き金属箔を製造する方法として、機械的に打ち抜きをするパンチング方式が公知である。また、特許文献１や２には、エッチング方式による穴開き集電体の製造方法が開示されている。 As a current collector for a secondary battery or an electric double layer capacitor, a metal foil having a patterned through hole is used. As a method for manufacturing such a perforated metal foil, a punching method in which punching is mechanically performed is known. Patent Documents 1 and 2 disclose a method of manufacturing a perforated current collector by an etching method.
しかしながら、パンチング方式による穴開き金属箔の製造方法においては、貫通孔の周辺に発生するバリが問題となる。集電体とセパレータを多数積層するような二次電池、キャパシタにおいては、わずかなバリによってその厚みが増大してしまう。また、バリのような突起部が存在すると電流集中によるショートを引き起こすという問題があった。更に、微細なパターンの穴を打ち抜くためには、精度の高い金型を作成する必要がある。 However, in the method of manufacturing a perforated metal foil by the punching method, burrs generated around the through hole are a problem. In a secondary battery and capacitor in which a large number of current collectors and separators are stacked, the thickness increases due to slight burrs. In addition, there is a problem that a short-circuit due to current concentration is caused when a protrusion such as a burr exists. Furthermore, in order to punch out holes with a fine pattern, it is necessary to create a highly accurate mold.
一方、エッチング方式においては、レジスト層の形成においてパターンサイズに制限があり、連続したシームレスなパターンを形成するには限界があった。また、製造工程も多く、設備も大掛かりになってしまう。更に、これら従来の方式においては、打ち抜いた部分、エッチングによって除去した部分の金属を無駄にしてしまうという欠点もあった。 On the other hand, in the etching method, the pattern size is limited in forming the resist layer, and there is a limit in forming a continuous seamless pattern. In addition, there are many manufacturing processes and the equipment becomes large. Further, these conventional methods have a disadvantage that the metal in the punched portion and the portion removed by etching is wasted.
そこで本発明は、これら従来の方式における上記欠点を解決し、バリや金属のロスなく、シームレスで微細なパターンの貫通孔が形成された穴開き金属箔を提供することを目的とする。また、そのような穴開き金属箔の製造方法を提供する。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a perforated metal foil in which through holes having a seamless and fine pattern are formed without the loss of burrs and metals. Moreover, the manufacturing method of such a perforated metal foil is provided.
本発明のキャリア付き穴開き金属箔は、支持体の一方の面に形成されたパターン状無電解銅めっき層と、このパターン状無電解銅めっき層上に積層された剥離層と、から成るキャリアと、このキャリアの剥離層上のみに形成された電解金属めっき処理による穴開き金属箔とから成る。 The perforated metal foil with a carrier of the present invention is a carrier comprising a patterned electroless copper plating layer formed on one surface of a support and a release layer laminated on the patterned electroless copper plating layer. And a perforated metal foil formed by electrolytic metal plating formed only on the release layer of the carrier.
また、本発明のキャリア付き穴開き金属箔の製造方法は、支持体の一方の面に無電解めっき触媒を含むインクを印刷法によってパターン状に付与する工程と、次いでこの支持体を無電解銅めっき処理してパターン状無電解銅めっき層を形成する工程と、前記パターン状無電解銅めっき層上に剥離層を形成する工程と、次いで電解金属めっき処理をして穴開き金属箔を前記剥離層に重ねて形成する工程とを含むものである。ここで前記印刷法がグラビア印刷法であることが好ましい。 Further, the method for producing a perforated metal foil with a carrier according to the present invention includes a step of applying an ink containing an electroless plating catalyst to one surface of a support in a pattern by a printing method, and then applying the support to the electroless copper. A step of forming a patterned electroless copper plating layer by plating, a step of forming a release layer on the patterned electroless copper plating layer, and then performing an electrolytic metal plating treatment to release the perforated metal foil And a step of forming the layer over the layer. Here, the printing method is preferably a gravure printing method.
本発明によれば、非常に薄く均一な厚さを有するパターン状の貫通孔を有する穴開き金属箔を得ることができる。この穴開き金属箔は、キャリア上に形成されているので取り扱いが容易である。また、バリの発生もなく、表面が平滑であり、継ぎ目のないシームレスなパターンの貫通孔が金属をロスすることなく形成されている。更に穴開き金属箔を剥離した後のキャリアを再利用して、新たな穴開き金属箔を繰り返し製造することができる。 According to the present invention, it is possible to obtain a perforated metal foil having a patterned through-hole having a very thin and uniform thickness. The perforated metal foil is easy to handle because it is formed on the carrier. Further, there are no burrs, the surface is smooth, and seamless seamless pattern through holes are formed without losing metal. Furthermore, a new perforated metal foil can be repeatedly produced by reusing the carrier after peeling the perforated metal foil.
１ 支持体
２ 無電解めっき用触媒
３ 無電解銅めっき層
４ 剥離層
５ 穴開き金属箔
６ キャリア
DESCRIPTION OF SYMBOLS 1 Support body 2 Electroless plating catalyst 3 Electroless copper plating layer 4 Peeling layer 5 Hole metal foil 6 Carrier
本発明のキャリア付き穴開き金属箔とその製造方法について、図１に示す手順を参照しながら説明する。本発明における支持体は、合成樹脂からなる可撓性のフィルムが好適に用いられる（図１ Ａ）。合成樹脂としては特に限定されないが、例えばポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリエチレン、ポリプロピレン、ポリイミドなどが挙げられ、なかでも強度があり汎用性が高いという理由でポリエチレンテレフタレートが好ましい。 The perforated metal foil with a carrier of the present invention and the manufacturing method thereof will be described with reference to the procedure shown in FIG. As the support in the present invention, a flexible film made of a synthetic resin is preferably used (FIG. 1A). Although it does not specifically limit as a synthetic resin, For example, a polyethylene terephthalate, a polybutylene terephthalate, a polyethylene naphthalate, polyethylene, a polypropylene, a polyimide etc. are mentioned, A polyethylene terephthalate is preferable because it is especially strong and versatile.
支持体上に無電解銅めっき層をパターン状に形成するのに先立ち、無電解めっき用触媒をパターン状に付与する（図１ Ｂ）。具体的な付与方法としては、無電解めっき用触媒を含むインクを用いて所望のパターンに印刷する方法が挙げられる。印刷の方法は特に限定されないが、シームレスなパターンを形成することが可能であり、微細なパターンの印刷に適している点で、グラビア印刷が好ましい。 Prior to forming the electroless copper plating layer in a pattern on the support, an electroless plating catalyst is applied in a pattern (FIG. 1B). A specific application method includes a method of printing in a desired pattern using an ink containing an electroless plating catalyst. The printing method is not particularly limited, but gravure printing is preferable because a seamless pattern can be formed and it is suitable for printing a fine pattern.
無電解めっき用触媒としてはＰｄ、Ａｕ、Ａｇ、Ｐｔ等の貴金属コロイド粒子、Ｎｉ、Ｆｅ、Ｃｏ等の各種金属微粒子、及びこれらの塩化物、硫酸塩、硝酸塩、アンモニア塩などを用いることができる。また、Ｐｄ、Ａｕ、Ａｇ、Ｐｔなどが表面に担持された金属酸化物微粒子などであってもよい。この無電解めっき用触媒とバインダー樹脂、および溶剤とを混合してインクとし、パターン印刷に使用する。 As the electroless plating catalyst, noble metal colloidal particles such as Pd, Au, Ag and Pt, various metal fine particles such as Ni, Fe and Co, and chlorides, sulfates, nitrates and ammonia salts thereof can be used. . Moreover, the metal oxide fine particle etc. with which Pd, Au, Ag, Pt etc. were carry | supported on the surface may be sufficient. This electroless plating catalyst, a binder resin, and a solvent are mixed to form an ink, which is used for pattern printing.
バインダー樹脂は、インクに適度な粘性を与え、無電解めっき用触媒−支持体間の結合力を向上させる目的で配合される。配合量は、少なすぎると無電解めっき用触媒の密着性が低下し、多すぎると無電解銅めっき処理工程における銅めっきの析出性が低下する。バインダー樹脂の種類としては、例えばポリエステル系樹脂、アクリル系樹脂物、酢酸ビニル、塩化ビニル、ＰＶＡ、ＰＶＢ等のビニル系樹脂、ポリウレタン系樹脂、ポリイミド系樹脂、ポリアミド系樹脂、フェノール樹脂、フェノキシ樹脂、アルキッド樹脂等が挙げられる。このうち、好ましいものはポリエステル系樹脂またはポリウレタン系樹脂である。 The binder resin is blended for the purpose of imparting an appropriate viscosity to the ink and improving the bonding force between the electroless plating catalyst and the support. If the blending amount is too small, the adhesion of the electroless plating catalyst is lowered, and if it is too large, the precipitation of copper plating in the electroless copper plating treatment step is lowered. Examples of the binder resin include polyester resins, acrylic resins, vinyl acetate, vinyl chloride, PVA, PVB and other vinyl resins, polyurethane resins, polyimide resins, polyamide resins, phenol resins, phenoxy resins, Examples include alkyd resins. Among these, a polyester resin or a polyurethane resin is preferable.
溶剤は、バインダー樹脂を溶解し、インクに流動性を与える目的で配合される。印刷方法に適した乾燥性を有する溶剤を一種あるいは二種以上適宜組み合わせて使用することができる。用いられる溶剤としては、例えば水、メタノール、エタノール、イソプロピルアルコール等のアルコール類、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン類、トルエン、キシレン等の芳香族炭化水素類、エチレングリコール、エチレングリコールエチルエーテル、エチレングリコールブチルエーテル、ジエチレングリコール、ジエチレングリコールエチルエーテルアセテート、エチレングリコールブチルエーテルアセテート、プロピレングリコール、プロピレングリコールメチルエーテル、プロピレングリコールメチルエーテルアセテート、ジプロピレングリコールメチルエーテル等のポリアルキレングリコール類とその誘導体、酢酸エチル、酢酸ブチル等の酢酸エステル類、γ−ブチロラクトン、Ｎ−メチルピロリドン、イソホロン、ジメチルスルホキシド、ジメチルホルムアミド、ターピネオール、ソルベントナフサ等が挙げられる。 The solvent is blended for the purpose of dissolving the binder resin and imparting fluidity to the ink. One or a combination of two or more solvents having a drying property suitable for the printing method can be used. Examples of the solvent used include alcohols such as water, methanol, ethanol and isopropyl alcohol, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene and xylene, ethylene glycol and ethylene glycol. Polyalkylene glycols and their derivatives such as ethyl ether, ethylene glycol butyl ether, diethylene glycol, diethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, propylene glycol, propylene glycol methyl ether, propylene glycol methyl ether acetate, dipropylene glycol methyl ether, ethyl acetate , Acetate esters such as butyl acetate, γ-butyrolactone N- methylpyrrolidone, isophorone, dimethyl sulfoxide, dimethylformamide, terpineol, solvent naphtha, and the like.
支持体上に、無電解めっき用触媒を含むインクをパターン状に付与した後、これを無電解銅めっき処理に供し、無電解銅めっき層を形成する（図１ Ｃ）。無電解銅めっき処理の方法は特に限定されず、公知の処理方法を採用することができる。ここで、表面の平滑性を更に向上させる目的で、無電解銅めっき層の上に重ねて、電解銅めっき層を形成してもよい。これによれば、本発明の穴開き金属箔の表面をより平滑にすることが可能となる。 An ink containing an electroless plating catalyst is applied to the support in a pattern, and then subjected to an electroless copper plating treatment to form an electroless copper plating layer (FIG. 1C). The method for the electroless copper plating treatment is not particularly limited, and a known treatment method can be employed. Here, for the purpose of further improving the smoothness of the surface, the electrolytic copper plating layer may be formed on the electroless copper plating layer. According to this, the surface of the perforated metal foil of the present invention can be made smoother.
剥離層を構成する化合物は、窒素含有有機化合物、硫黄含有有機化合物およびカルボン酸などが挙げられ、これらのなかから１種または２種以上を混合して用いられる。具体的には、窒素含有有機化合物としては、置換基を有するトリアゾール化合物である１，２，３−ベンゾトリアゾール、カルボキシベンゾトリアゾール、Ｎ’，Ｎ’−ビス（ベンゾトリアゾリルメチル）ユリア、１Ｈ−１，２，４−トリアゾールおよび３−アミノ−１Ｈ−１，２，４−トリアゾール等である。硫黄含有有機化合物には、メルカプトベンゾチアゾール、チオシアヌル酸および２−ベンズイミダゾールチオール等である。カルボン酸は、特にモノカルボン酸を用いることが好ましく、なかでもオレイン酸、リノール酸及びリノレイン酸等を用いることが好ましい。 Examples of the compound constituting the release layer include a nitrogen-containing organic compound, a sulfur-containing organic compound, and a carboxylic acid. Among these, one or a mixture of two or more is used. Specifically, examples of the nitrogen-containing organic compound include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, which are triazole compounds having a substituent, and 1H. -1,2,4-triazole and 3-amino-1H-1,2,4-triazole. Examples of sulfur-containing organic compounds include mercaptobenzothiazole, thiocyanuric acid, and 2-benzimidazolethiol. As the carboxylic acid, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.
上記化合物のなかでもベンゾトリアゾールが好適に用いられる。これら化合物は溶媒に溶解して用いられ、前記支持体をこの溶液に浸漬することで無電解銅めっき層に選択的に吸着し、剥離層が形成される（図１ Ｄ）。溶媒としては水、エタノールなどが挙げられる。 Of these compounds, benzotriazole is preferably used. These compounds are used by being dissolved in a solvent, and by immersing the support in this solution, it is selectively adsorbed on the electroless copper plating layer to form a release layer (FIG. 1D). Examples of the solvent include water and ethanol.
支持体上に形成されたパターン状無電解銅めっき層、更にこのパターン状無電解銅めっき層上に積層された剥離層を合わせて、本発明ではキャリアと呼ぶ。このキャリアに対して電解金属めっき処理を施して、目的のキャリア付き穴開き金属箔が得られる（図１ Ｅ）。電解金属めっき処理は公知の処理方法を採用することができる。穴開き金属箔の金属材料は特に限定されないが、例えば、銅やニッケルが挙げられる。また、二種類以上の金属による合金であってもよい。 The patterned electroless copper plating layer formed on the support and the release layer laminated on the patterned electroless copper plating layer are collectively referred to as a carrier in the present invention. By subjecting this carrier to electrolytic metal plating, the desired perforated metal foil with carrier is obtained (FIG. 1E). For the electrolytic metal plating treatment, a known treatment method can be adopted. The metal material of the perforated metal foil is not particularly limited, and examples thereof include copper and nickel. Moreover, the alloy by two or more types of metals may be sufficient.
また、穴開き金属箔は単層の電解金属めっき層であってもよいし、電解金属めっき層に重ねて、無電解金属めっき層および／または電解金属めっき層を積層した多層構造としてもよい。これによれば、例えば銅層の両面をニッケル−亜鉛合金層でサンドイッチした穴開き金属箔を得ることもできる。 Further, the perforated metal foil may be a single-layer electrolytic metal plating layer or a multilayer structure in which an electroless metal plating layer and / or an electrolytic metal plating layer is laminated on the electrolytic metal plating layer. According to this, for example, a perforated metal foil in which both surfaces of a copper layer are sandwiched by nickel-zinc alloy layers can be obtained.
本発明のキャリア付き穴開き銅箔から穴開き金属箔の部分のみが剥離され、例えば二次電池の負極用集電体として利用される。残ったキャリア部分は再利用することが可能である。剥離層に損傷が無い場合はそのまま電解金属めっき処理を施して、新たに穴開き金属箔を製造するこができる。必要であれば、剥離層の形成工程に遡って再利用してもよい。 Only the portion of the perforated metal foil is peeled off from the perforated copper foil with a carrier of the present invention, and is used, for example, as a current collector for a negative electrode of a secondary battery. The remaining carrier portion can be reused. When the release layer is not damaged, electrolytic metal plating can be performed as it is, and a new perforated metal foil can be produced. If necessary, it may be reused retroactively to the release layer forming step.
［実施例１］
ＰＥＴ（ポリエチレンテレフタレート）フィルムに、無電解めっき用触媒としてパラジウム、バインダー樹脂としてポリエステル樹脂、溶媒としてシクロヘキサノンを７：２３：７０で含む無電解めっき用触媒インクを図２に示す多孔パターンでグラビア印刷した。多孔パターンは、穴径１００μｍ、穴ピッチ２００μｍ、開口率２０％である。印刷後、銅２ｇ／ｌ、ホルムアルデヒド５ｇ／ｌ、水酸化ナトリウム８ｇ／ｌを含む無電解銅めっき液を用いて、液温５０℃で２５分間めっき処理を実施し、膜厚１．５μｍの無電解銅めっき層を形成した。更に、ベンゾトリアゾール５ｇ／ｌの水溶液を用いて、４０℃で３０秒間浸漬処理することで、剥離層としてベンゾトリアゾールのキレート被膜を形成してキャリアとした。このキャリアを、硫酸銅五水和物２５０ｇ／ｌ、硫酸５０ｇ／ｌを含む電解銅めっき液を用いて、液温２５℃、電流密度５Ａ／ｄｍ２で９分間電解銅めっき処理を実施した。その後、剥離層形成時と同様の処理を行うことで電解銅めっき層の表面に防錆皮膜を形成し、キャリア付き穴開き銅箔を得た。
[Example 1]
A PET (polyethylene terephthalate) film was gravure-printed with an electroless plating catalyst ink containing 7:23:70 of palladium as a binder resin, a polyester resin as a binder resin, and cyclohexanone as a solvent in a porous pattern shown in FIG. . The porous pattern has a hole diameter of 100 μm, a hole pitch of 200 μm, and an aperture ratio of 20%. After printing, using an electroless copper plating solution containing 2 g / l of copper, 5 g / l of formaldehyde, and 8 g / l of sodium hydroxide, a plating treatment was performed at a liquid temperature of 50 ° C. for 25 minutes. An electrolytic copper plating layer was formed. Further, the carrier was formed by immersing at 40 ° C. for 30 seconds using an aqueous solution of benzotriazole 5 g / l to form a benzotriazole chelate film as a release layer. This carrier was subjected to an electrolytic copper plating treatment for 9 minutes at a liquid temperature of 25 ° C. and a current density of 5 A / dm 2 using an electrolytic copper plating solution containing 250 g / l of copper sulfate pentahydrate and 50 g / l of sulfuric acid. Then, the process similar to the time of peeling layer formation was performed, the rust prevention film was formed in the surface of an electrolytic copper plating layer, and the perforated copper foil with a carrier was obtained.
［実施例２］
ＰＥＴフィルムをＰＩ（ポリイミド）フィルムに変更した以外は、実施例１と同様にしてキャリア付き穴開き銅箔を得た。
[Example 2]
A perforated copper foil with a carrier was obtained in the same manner as in Example 1 except that the PET film was changed to a PI (polyimide) film.
［実施例３］
ＰＥＴフィルムをＰＥＮ（ポリエチレンナフタレート）フィルムに変更した以外は、実施例１と同様にしてキャリア付き穴開き銅箔を得た。
[Example 3]
A perforated copper foil with a carrier was obtained in the same manner as in Example 1 except that the PET film was changed to a PEN (polyethylene naphthalate) film.
［実施例４］
多孔パターンを図３に示す網目状のメッシュパターン（線幅２０μｍ、ピッチ２７０μｍ、開口率７５％）に変更した以外は実施例１と同様にしてキャリア付き穴開き銅箔を得た。
[Example 4]
A perforated copper foil with a carrier was obtained in the same manner as in Example 1 except that the porous pattern was changed to a mesh-like mesh pattern (line width 20 μm, pitch 270 μm, aperture ratio 75%) shown in FIG.
［実施例５］
剥離層を形成する化合物を、ベンゾトリアゾールに替えてカルボキシベンゾトリアゾールとした以外は、実施例１と同様にしてキャリア付き穴開き銅箔を得た。
[Example 5]
A perforated copper foil with a carrier was obtained in the same manner as in Example 1 except that carboxybenzotriazole was used instead of benzotriazole as the compound for forming the release layer.
［実施例６］
電解銅めっき処理に替えて、硫酸ニッケル５水和物２５０ｇ／ｌ、ホウ酸３０ｇ／ｌを含む電解ニッケルめっき液を用いて、液温２５℃、電流密度５Ａ／ｄｍ２で電解ニッケルめっき処理をおこなった以外は実施例１と同様にしてキャリア付き穴開きニッケル箔を得た。
[Example 6]
In place of electrolytic copper plating treatment, electrolytic nickel plating treatment is performed at a liquid temperature of 25 ° C. and a current density of 5 A / dm 2 using an electrolytic nickel plating solution containing nickel sulfate pentahydrate 250 g / l and boric acid 30 g / l. A holed nickel foil with a carrier was obtained in the same manner as in Example 1 except for the above.
［実施例７］
電解銅めっき処理に替えて、1段階目に硫酸ニッケル五水和物２５０ｇ／ｌ、ホウ酸３０ｇ／ｌを含む電解ニッケルめっき液で、液温２５℃、電流密度５Ａ／ｄｍ２で３０秒めっき処理を行い、２段階目に硫酸銅五水和物２５０ｇ／ｌ、硫酸５０ｇ／ｌを含む電解銅めっき液で、液温２５℃、電流密度５Ａ／ｄｍ２で９分間めっき処理を行い、３段階目に１段階目同様の電解ニッケルめっき処理をおこなった以外は実施例１と同様にしてキャリア付き穴開き多層金属箔を得た。
[Example 7]
Instead of electrolytic copper plating treatment, in the first stage, plating with an electrolytic nickel plating solution containing nickel sulfate pentahydrate 250 g / l and boric acid 30 g / l, at a liquid temperature of 25 ° C. and a current density of 5 A / dm 2 for 30 seconds. In the second stage, an electrolytic copper plating solution containing 250 g / l copper sulfate pentahydrate and 50 g / l sulfuric acid is used for 9 minutes at a liquid temperature of 25 ° C. and a current density of 5 A / dm 2. A perforated multilayer metal foil with a carrier was obtained in the same manner as in Example 1 except that the same electrolytic nickel plating treatment as in the first stage was performed at the stage.
実施例１〜７で得られたキャリア付き穴開き金属箔から穴開き金属箔を剥離して観察したところ、貫通孔部分にバリの発生は認められず良好な金属箔が得られた。また、継ぎ目のないシームレスなパターンの貫通孔を有する金属箔を、製造時に金属をロスすることなく得ることができた。 When the perforated metal foil was peeled off from the perforated metal foil obtained in Examples 1 to 7 and observed, no burr was observed in the through hole portion, and a good metal foil was obtained. Moreover, the metal foil which has a seamless pattern through-hole without a seam was able to be obtained, without losing a metal at the time of manufacture.
実施例１および４で得られたキャリア付き穴開き銅箔から穴開き銅箔を剥離して取り除き、キャリア部分のみとした。このキャリアを酸洗い処理した後、実施例１と同様にして再度剥離層を形成し、電解銅めっき処理をおこなった。得られたキャリア付き穴開き銅箔は亀裂や形状の乱れもなく、十分実用に耐えるものであり、キャリアの繰り返し利用が可能であることを示すものであった。 The perforated copper foil was peeled off from the perforated copper foil with carrier obtained in Examples 1 and 4, and only the carrier portion was obtained. After this carrier was pickled, a release layer was formed again in the same manner as in Example 1, and an electrolytic copper plating process was performed. The obtained perforated copper foil with a carrier was not practically cracked or disturbed in shape and sufficiently withstands practical use, indicating that the carrier can be used repeatedly.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112739069A (en) * | 2020-12-09 | 2021-04-30 | 四会富仕电子科技股份有限公司 | Method for improving incomplete stripping of electroplated copper layer |
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