JPS5893884A - Production of metallic mesh - Google Patents

Production of metallic mesh

Info

Publication number
JPS5893884A
JPS5893884A JP19053981A JP19053981A JPS5893884A JP S5893884 A JPS5893884 A JP S5893884A JP 19053981 A JP19053981 A JP 19053981A JP 19053981 A JP19053981 A JP 19053981A JP S5893884 A JPS5893884 A JP S5893884A
Authority
JP
Japan
Prior art keywords
mesh
master
metal
metal mesh
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19053981A
Other languages
Japanese (ja)
Inventor
Kiyoto Hamamura
浜村 清人
Koji Nagaoka
長岡 弘二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP19053981A priority Critical patent/JPS5893884A/en
Publication of JPS5893884A publication Critical patent/JPS5893884A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To produce a metallic mesh which is fine and has no deformation by forming a master mesh having a conductive broad part on the outside edge part on an electrically insulating substrate, and depositing a protecting film thereon then forming the metallic mesh by an electroforming method. CONSTITUTION:A projecting master formed of a master mesh 2 of chromium and a broad part 3 of a conductive member in contact with the outside edge part is installed on an electrically insulating substrate 1 made of glass. A protecting film 6 consisting essentially of molybdenum oxide is formed on the mesh wire 5 of the master mesh with an electrodepositing soln. for protection films consisting of a soln. of ammonium molybdate as an electroforming soln. The initial metallic mesh wire 7 in contact with the protecting film are formed by an electroforming method. In succession, the electroforming soln. is infiltrated at the interfaces between the wire 5 and the film 6 and copper is deposited on the rear side of the meshes 7 as well, whereby a metallic mesh 9 consisting of the metallic mesh wire 8 which are held afloat from the wire 5 is manufactured.

Description

【発明の詳細な説明】 発明の技術分野 この発明は撮像管等の様なメツシュ電極を内装する陰極
線管に使用される微細な金属メツシュな電鋳により製造
する金属メツシュの製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method for manufacturing a fine metal mesh by electroforming, which is used in a cathode ray tube with a mesh electrode inside, such as an image pickup tube. .

発明の技術的背景とその問題点 撮像管の様な陰極線管に使用される金属メツシュは一般
に750〜2000 本/インチの格子状メツシュ素線
により構成され、電子ビームを通過させる開孔度は約4
0〜50%となっている。
Technical background of the invention and its problems The metal mesh used in cathode ray tubes such as image pickup tubes is generally composed of 750 to 2000 lattice mesh wires per inch, and the degree of opening for electron beams to pass through is approximately 4
It is 0 to 50%.

この金属メツシュは一般に銅を主とし、パラジウム、銀
、白金等を含む場合もあり、例えば円筒状の支持体に金
属メツシュ?=取り付けられたのち、熱処理により再結
晶化され、緊張状態で陰極線管内に組み込まれることに
なる。
Generally, this metal mesh is mainly made of copper, and may also contain palladium, silver, platinum, etc. For example, if a metal mesh is attached to a cylindrical support? = After being attached, it will be recrystallized by heat treatment and will be incorporated into the cathode ray tube under tension.

従来、この゛金属メツシュの製造方法は一般に電鋳によ
り形成される。そしてその製造方法はガラス等の電気絶
縁性基盤に導電性被膜からなるマスターメツシュを凹溝
自画に形成する溝付きの凹マスター上に電鋳により形成
する方法や平坦面にマスターメツシュのパターンを形成
する凸マスター区電鋳により形成する方法のいずれかが
用いられている。
Conventionally, this metal mesh is generally produced by electroforming. The manufacturing method is to form a master mesh made of a conductive film on an electrically insulating substrate such as glass in the form of a concave groove, or to form it by electroforming on a concave master with grooves, or to form a master mesh pattern on a flat surface. One of the methods of forming a convex master by electroforming is used.

このうち凸マスターに電鋳による形−成する方法として
は、例えば特公昭5’2−3890号公報に示されてい
る。様に直接波めっき導電材料の被膜からなるマスター
メツシュと電気的接続部を形成する工程と、このマスタ
ーメツシュ上に電気めっき(電鋳)により金属メツシュ
を形成する工程と。
Among these methods, a method of forming a convex master by electroforming is disclosed, for example, in Japanese Patent Publication No. 5'2-3890. A step of forming an electrical connection with a master mesh made of a film of a directly wave-plated conductive material, and a step of forming a metal mesh on the master mesh by electroplating (electroforming).

マスタ”−メツシュから金属メツシュを剥がす工程とか
らなる製造方法が起載されている。そしてこの製造方法
によればりaム、タンタル、タングステン、酸化錫及び
酸化インジウムのうちの一種からなるマスターメツシュ
がそのまま電気絶縁性基板上に残るように金属メツシュ
を剥がすことが可能であるので、同一のマスターメツシ
ュにより繰返し数100個の金属メツシュを製造出来る
とされている。
The publication describes a manufacturing method comprising a step of peeling off a metal mesh from a master mesh. According to this manufacturing method, a master mesh made of one of am, tantalum, tungsten, tin oxide, and indium oxide is used. Since it is possible to peel off the metal mesh so that it remains on the electrically insulating substrate, it is said that 100 metal meshes can be manufactured repeatedly using the same master mesh.

然るに発明者らが1500本/インチの格子状の銅から
なる金属メツシュを形成するため前述した凸マスターの
マスターメツシュとしてクロムを使用し、繰返し実験を
重ねた結果、マスターメツシュの材料に選んだクロムが
わずかずつ損傷してマスターメツシュに部分的な欠陥を
生じ、やがて金属メツシュの形成が不可能となる事実を
確認した。
However, the inventors used chromium as the master mesh of the aforementioned convex master to form a metal mesh made of copper in the form of a lattice of 1500 pieces per inch, and as a result of repeated experiments, they selected chromium as the material for the master mesh. It was confirmed that the metal mesh was damaged little by little, causing partial defects in the master mesh, and eventually it became impossible to form a metal mesh.

また出来上った銅からなる金属メツシュの特性として、
酸化変色し易いこと1機械的強度が弱いため取り扱いに
くい問題点があることも判明した。
In addition, the characteristics of the metal mesh made of copper are as follows:
It was also found that there were problems in that it was easy to discolor due to oxidation, and that it was difficult to handle due to its weak mechanical strength.

前述したような問題点はりaムから形成されたマスター
メツシュから金属メツシュを剥がす時にマスターメツシ
ュの−部が金属メツシュと共に引き剥がされて行くこと
が最大の原因であり、このためマスターメツシュの寿命
を著しく短いものにしている。また金属メツシュの変色
防止処理はマスターメツシュから剥がした後でないと金
属メツシュの全面にわたって処理することは出来ず、ま
た剥がし文後では金属メツシュの変形が著しくなる問題
点がある。   ゛ 発明の目的 この発明は前述した従来の諸問題に鑑みなされたもので
あり、−凸マスターを使用して金属メツシュを製造する
場合、マスター メツシュから金属メ □ツνユを剥が
す工程を廃止し、容易に金属メツシュの変色防止処理等
の全面処理が可能であり、更にマスターメツシュが損傷
しに<<、マスターメツシュと金属メツシュの材料の組
合せからくるマスターメツシュの寿命への影響を最少に
することが出来る金属メツシュの製造方法を提供するこ
とを目的としている。
The biggest cause of the above-mentioned problem is that when the metal mesh is peeled off from the master mesh formed from the beam, the negative part of the master mesh is peeled off along with the metal mesh. This significantly shortens the lifespan of Further, the discoloration prevention treatment of the metal mesh cannot be applied to the entire surface of the metal mesh until after it has been peeled off from the master mesh, and there is also the problem that the metal mesh is significantly deformed after being peeled off.゛Purpose of the Invention This invention was made in view of the conventional problems mentioned above. - When manufacturing a metal mesh using a convex master, the process of peeling off the metal mesh from the master mesh is eliminated. , it is possible to easily perform full-scale treatment such as discoloration prevention treatment on the metal mesh, and it also prevents damage to the master mesh and the effect on the life of the master mesh due to the combination of materials of the master mesh and metal mesh. It is an object of the present invention to provide a method for manufacturing metal mesh that can be made to a minimum.

発明の概要 即ち、この発明は電気絶縁性基板上にマスターメツシュ
と、このマスターメツシュの外縁部に接する幅広部を導
電性部材からなる被膜により形成する工程と、マスター
メツシュ上に保護膜な被着形成すること−によりマスタ
ーを作り、幅広部及び保護膜を介したマスターメツシュ
上に電鋳によりそれぞれ幅広金属体及び金属メツシュを
形成する工程と1幅広金属体と金属メツシュを分離する
工程を少な、くとも具備していることを特徴としている
Summary of the Invention That is, the present invention includes a process of forming a master mesh on an electrically insulating substrate, a wide part contacting the outer edge of the master mesh with a coating made of a conductive material, and a process of forming a protective film on the master mesh. A process of forming a wide metal body and a metal mesh by electroforming on the wide part and the master mesh through a protective film, respectively, by forming a master mesh by forming a wide metal body and a protective film. It is characterized by having at least a few processes.

発明の実施例 次に、この発明の実施例を第1図乃至@7図により説明
する。
Embodiments of the Invention Next, embodiments of the invention will be described with reference to FIGS. 1 to 7.

先ず第1図及び第2図に示すような凸マスターを作成す
る。
First, a convex master as shown in FIGS. 1 and 2 is created.

即ち5インチ角のガラスよりなる電気絶縁性基盤<1>
ノー面t=約too wm 角ノ範囲ニ600− xo
ooi ノ厚さのクロム等からなるマスターメツシュ(
2)、iの、外縁部に接する幅広部(3)を形成した凸
マスターを用意する。この場合マスターメツシュは15
00本フインチの格子状の金属メツシュを作成する場合
、@2図に示すマスターメツシュ素線(5)のピッチは
約17μであり、金属メツシュの電鋳形成される厚さは
マスター)ツシュ素線(5)の厚さが厚い程厚く形成さ
れるので約゛7oOλとされ、また金属メツシュの開孔
度を高めるためにはマスターメツシュ素線(5)は細い
方が有理であるため約2声とされている。
That is, an electrically insulating substrate <1> made of 5-inch square glass.
North face t = approx. too wm Angle range 2600- xo
A master mesh made of chrome etc. with a thickness of ooi (
2) Prepare a convex master having a wide part (3) in contact with the outer edge of i. In this case, the master mesh is 15
When creating a grid-like metal mesh with 00 finches, the pitch of the master mesh wires (5) shown in Figure @2 is approximately 17μ, and the thickness of the electroformed metal mesh is the master mesh wire (5) shown in Figure @2. The thicker the wire (5) is, the thicker the wire (5) is, so it is approximately 7oOλ, and in order to increase the degree of opening of the metal mesh, it is rational for the master mesh wire (5) to be thinner, so it is approximately It is said to have two voices.

前述したマスターメツシュ(2)、幅広部(3)を有す
るマスターは一般c超L8I等のマスクパターンを形成
する場合に使用される電子ビーム描IIV装置により描
■、及び光学的に転写するフォトエツチング方法により
作成する。次に第3図に示すようにモツプデン酸アンモ
ニウム2011/lからなる保護膜電着液にて約25℃
0.IA/dt/の電流密度によりマスターメツシュ(
2)のメツシュ素線(5)に酸化モツプデンを主成分と
した保護膜(6)を約1分間の電鋳により形成する。こ
の保護膜(6)を形成する場合、あらかじめ濃硝酸、熱
濃硫酸、または界面活性剤を含む洗浄液で無機物、有機
物からなるマスター上の微細とみな除去しておくことに
より、次に行なわれる電鋳C二より形成される金属メツ
シュの欠陥を少なくすることができる。
The master mesh (2) and the master having the wide portion (3) described above are drawn by an electron beam writing IIV device used for forming mask patterns such as general c-L8I, and are photo-transferred optically. Created by etching method. Next, as shown in FIG.
0. The master mesh (
A protective film (6) containing mopden oxide as a main component is formed on the mesh wire (5) of 2) by electroforming for about 1 minute. When forming this protective film (6), remove fine particles on the master made of inorganic and organic materials in advance using concentrated nitric acid, hot concentrated sulfuric acid, or a cleaning solution containing a surfactant. Defects in metal mesh formed from cast C2 can be reduced.

次に第4図及びIIs図のように金属メツシュな電鋳に
より形成する。まず184図は銅による電鋳開始初期を
示すものであり、保護膜(7) t:密着した初期金属
メツシュ素線(7)が形成される。次に第5図に示すよ
うに電鋳液の電流密賓を途中で約3)y41alから約
0.5人/dm と低くすることにより析出応力を変化
させながら、メツシュ素線(5)と保護膜(6)との界
面に電鋳液を浸入させることによ見初期金属メツシュ(
7)の裏面にも銅を析出させマスターメツシュ素線(5
)から浮いた状態の金属メツシュ緊線(8)からなる金
属メツシュ(9)を作成することが出来る。
Next, as shown in FIGS. 4 and IIs, a metal mesh is formed by electroforming. First, FIG. 184 shows the initial stage of electroforming with copper, in which a protective film (7) t: An initial metal mesh strand (7) in close contact is formed. Next, as shown in Fig. 5, the current density of the electroforming solution is lowered midway from about 3)y41al to about 0.5 people/dm, thereby changing the precipitation stress and forming the mesh wire (5). By infiltrating electroforming liquid into the interface with the protective film (6), the initial metal mesh (
Copper is also deposited on the back side of the master mesh wire (5).
) It is possible to create a metal mesh (9) consisting of floating metal mesh tension wires (8).

この金属メツシュ(9)を作成する電鋳液としては一般
に硫酸銅めっき流が適しており基本的には硫酸銅   
150#/7 硫酸    12011/ 1 の組成よりなり約2−5℃の温度で用いられ、必要なら
ば応力減少剤等を添加するが、金属メツシュ素線(8)
の裏面(8,)側に析出する銅の厚さを制御することに
より金属メツシュ(9)全体のそりなどを少なくするこ
とができる。
Copper sulfate plating flow is generally suitable as the electroforming solution for creating this metal mesh (9), and basically copper sulfate is used as the electroforming solution.
It has a composition of 150#/7 sulfuric acid 12011/1 and is used at a temperature of about 2-5℃, and if necessary, a stress reducer etc. is added, but the metal mesh wire (8)
By controlling the thickness of the copper deposited on the back surface (8,) of the metal mesh (9), warping of the entire metal mesh (9) can be reduced.

即ち前述した条件によりマスターメツシュ(2) C非
密着の金属メツシュ(9)を自動的に形成でき、保護膜
(6)及びマスターメツシュ素線(5)の損傷や異状析
出を発生することなく数10゛0回の繰返し使用が可能
となる。
That is, under the above-mentioned conditions, the master mesh (2) and the metal mesh (9) which are not in close contact with each other can be automatically formed, which may cause damage or abnormal precipitation to the protective film (6) and the master mesh wire (5). It can be used repeatedly several tens of times.

なお、この場合、第6図に示すように幅広部(3)及び
その上に被着形成され主保護膜■上に析出した銅の幅広
金属体a麹は一部の非密着部a2以外は密着して、非密
着の金属メツシュ(9)を支持している。
In this case, as shown in Fig. 6, the wide metal body (a) of copper deposited on the wide part (3) and the main protective film (2) deposited on the wide part (3) and the main protective film (2) is not formed except for some non-adhered parts (a2). It supports a metal mesh (9) that is in close contact with, but not in close contact with.

即ち幅広部(3)は20〜30声幅の非密着部azより
充分に広い幅を有しているので金属メツシュ(9)と共
にマスターから脱落することを防止できる。
That is, since the wide part (3) has a width sufficiently wider than the non-contact part az of 20 to 30 pitches, it can be prevented from falling off from the master together with the metal mesh (9).

また銅等の様に酸化、変色しやすい金属メツシュは一般
に変色防止処理などが必要となるが、本実施例では金属
メツVユ(9)はマスターメツシュ(2)゛に非密着で
保持されているのでマスターごと化学処理または金メッ
キや白金メッキ等の電解処理を金属メツν工の全面に施
すことが可能となる。
Furthermore, metal meshes that are easily oxidized and discolored, such as copper, generally require treatment to prevent discoloration, but in this example, the metal mesh V (9) is held in non-adherent contact with the master mesh (2). Therefore, it is possible to apply chemical treatment or electrolytic treatment such as gold plating or platinum plating to the entire surface of the metal workpiece.

次に金属メツシュ(9)の一部をビンセットなど切り取
ることにより金属メツシュ(9)と幅広金属体部が分離
され、第s@1に示すようなり一ト状の金属メツν工(
9)が得られる。
Next, the metal mesh (9) and the wide metal body are separated by cutting a part of the metal mesh (9) with a bottle set, etc., and the metal mesh (9) is made into a piece of metal mesh (9) as shown in No. s@1.
9) is obtained.

更にこのシート状の金属メツシュ(9)を円形状にプレ
ス等で切り取り第9mに示すように円形の金属メツシュ
シー)a9を支持体as a41間に溶接などで固定し
、約800℃、約10分の熱処理を行い再結晶による緊
張効果を利用し平坦で振動しにくいメツシュ電極を形成
し、撮會管内に組み込む。この場合第1図のマスターメ
ツシュ(2)を円形に形成してもよい。
Further, this sheet-shaped metal mesh (9) is cut into a circular shape using a press or the like, and as shown in No. 9m, the circular metal mesh (9) is fixed between the supports as A41 by welding or the like, and heated at about 800°C for about 10 minutes. A flat, vibration-resistant mesh electrode is formed using the tension effect caused by recrystallization, and then installed in the imaging tube. In this case, the master mesh (2) shown in FIG. 1 may be formed in a circular shape.

前記実施例では保護膜として酸化モリブデンを主成分と
したが、これに限定されるものではなく、例えば一般に
黒色ニッケルめっき液として使用されているめっき液で
ある 硫酸ニッケルアンモニウム6011/1硫酸亜鉛   
     10 fillチオシアン化ナトツナトリウ
ム511/1からなる電解液により約0.IA/dd、
約30秒電着したニッケル、亜鉛の硫化物でもよいし、
また電気絶縁性の酸化クロム、酸化タンタルなどを例え
ば50〜200λ程度の薄い被膜で使用してもよいこと
は勿論であり金属メツシュ形成用の材料と被着しにくい
金属の酸化物や硫化物を主とする保護膜を形成すれば自
動的に非密着の金属メッンユを得ることができるし、更
にまた保護膜の寿命も金属メツシュ形成用の材料との関
係で毎回、数10回毎に保護膜の消耗度を見て被着させ
る必要がある。
In the above embodiments, molybdenum oxide was used as the main component of the protective film, but it is not limited to this. For example, nickel ammonium sulfate 6011/1 zinc sulfate, which is a plating solution generally used as a black nickel plating solution.
The electrolyte solution consisting of 10 fill sodium thiocyanide 511/1 was applied to about 0. IA/dd,
It may be sulfide of nickel and zinc electrodeposited for about 30 seconds,
It goes without saying that electrically insulating chromium oxide, tantalum oxide, etc. may be used in a thin film of, for example, 50 to 200λ, and metal oxides and sulfides that are difficult to adhere to metal mesh forming materials may be used. If the main protective film is formed, a non-adhesive metal mesh can be automatically obtained, and the life of the protective film is also limited depending on the material used to form the metal mesh, so the protective film may need to be formed every few tens of times. It is necessary to cover it by checking the degree of wear.

次に保護膜の被着位置について述べると前の実施例では
マスターメツシュ素線及び幅広部を囲むように被着した
が、保護膜の被着はマスターメツシュ素線のみでもよい
ことは勿論である。また第9図に示すようにメツシュ素
線(5)の頂部のみに保護膜(2)を部分的I:影形成
たり、@10図に示すようにメツシュ素線(5)及び電
気絶縁性基盤(1)の表面(l、)を覆うように保護膜
($6.) (36,)を設けてもよいことも勿論であ
る。更に前記実施例は金属メツVユとして端々使用した
が、これ信二限定されるものではなく例えばニッケル、
または他の金属を芯金とし、その上に銅を被覆した複層
の金属メツシュや他の金属からなる金属メツシュ等や2
000本/インチ程度の緊線を有する微細な金属メツシ
ュの作成にもそのまま適用できることも勿論である。
Next, regarding the position where the protective film is applied, in the previous example, it was applied so as to surround the master mesh wire and the wide part, but it goes without saying that the protective film may be applied only to the master mesh wire. It is. In addition, as shown in Figure 9, the protective film (2) is partially applied only to the top of the mesh wire (5), or as shown in Figure @10, the protective film (2) is applied to the mesh wire (5) and the electrically insulating substrate. Of course, a protective film ($6.) (36,) may be provided to cover the surface (l,) of (1). Further, in the above embodiments, metal parts such as nickel, nickel,
Or a multi-layer metal mesh with a core made of another metal and coated with copper, or a metal mesh made of other metals, etc.
Of course, the present invention can also be applied directly to the production of fine metal meshes having tensions of about 1,000 wires/inch.

発明の効果 上述のように本発明の金属メツシュの製造方法によれば
、高価なマスターメツシュの寿命を著しく長くすること
が可能なため低コストで多量の金属メツシュの製造も可
能となり、また金属メツシュの電鋳工程において、金属
メツシュをマスターメツシュに非密着状態とできるので
金属メツシュの変色防止処理等の全面処理を幅広部とこ
の幅広部上に部分的に密着した幅広金属体で保持して行
なうことが可能となり、従来行なわれていたようなマス
ターメツシュから剥がした後でないと全面処理が不可で
あり剥がした後では金属メツシュの変形が著しくなる問
題点も完全に除去することが可能となるので、その工業
的価値は極めて大である。
Effects of the Invention As described above, according to the method for manufacturing metal mesh of the present invention, it is possible to significantly extend the life of the expensive master mesh, making it possible to manufacture a large amount of metal mesh at low cost. In the mesh electroforming process, the metal mesh can be kept in a non-adherent state with the master mesh, so the entire surface treatment such as discoloration prevention treatment of the metal mesh can be maintained by the wide part and the wide metal body that is partially in contact with the wide part. It is now possible to completely eliminate the problem of the conventional method where the entire surface treatment cannot be performed unless it is peeled off from the master mesh, and the metal mesh is significantly deformed after being peeled off. Therefore, its industrial value is extremely large.

【図面の簡単な説明】[Brief explanation of the drawing]

@1図乃至第7図は本発明の金属メツシュの製造方法を
示す図であり、第1図は電気絶縁性基盤にマスターメツ
シュ及び幅広部を形成した斜視図。 @2図はマスターメツシュの一部拡大斜視図、第3図は
マスターメツシュに保護膜を形成した状態を示す拡大断
面図、纂4図はマスターメツシュ上に保護膜な介して初
期金属メツVユを形成した状態を示す拡大断面図、′@
5図は金属メツVユを完成した状態を示す拡大断面図、
第6図はマスターメツシュ及び幅広部にそれぞれ金属メ
ツVユ及び幅広金属体が形成された状態を示す説明用一
部拡大断面図、第7図は金属メツシュを・幅広金属体か
ら分離した状態を示す平面図、第8図は金属メツシュを
撮像管用のメツV工電極に組立てた状態を示す斜視図、
@9図及び第10図はマスターメツシュと保護膜の関係
のそれぞれ他の例を示す図であり、第9図はマスターメ
ツシュの頂部にのみ保護膜を形成した例を示す一部拡大
断面図、第10図はマスターメツシュ及び電気絶縁性基
盤の表面1二保護膜を形成した例を示す一部拡大断面図
である。 1・−電気絶縁性基板  2・・・マスターメツシュ3
・・・幅広部      5・・・マスターメツシュ素
線 6 、16.26.3!1.3@、−・保護膜フ・・−
初期金属メツシュ素線 8・・・金属メツシュ素線 9・・・金属メツシュ  10・−幅広金属体#冨参拳
俸     12・・・非密着部13.14・・・支持
体   15−・・金属メツシュシート代理人 弁理士
 井 上 −男 第1図 第  2 図 第  3 図 第4図 第5図 第6図
1 to 7 are diagrams showing the method for manufacturing a metal mesh according to the present invention, and FIG. 1 is a perspective view of a master mesh and a wide portion formed on an electrically insulating substrate. @Figure 2 is a partially enlarged perspective view of the master mesh, Figure 3 is an enlarged cross-sectional view showing a state in which a protective film is formed on the master mesh, and Figure 4 is an initial metal layer on the master mesh without a protective film. Enlarged sectional view showing the state in which Metsu V Yu is formed,'@
Figure 5 is an enlarged sectional view showing the completed state of the metal mesh V-yu.
Figure 6 is an explanatory partially enlarged sectional view showing a state in which a metal mesh V-yu and a wide metal body are formed on the master mesh and wide part, respectively, and Figure 7 is a state in which the metal mesh is separated from the wide metal body. FIG. 8 is a perspective view showing a state in which the metal mesh is assembled to a mesh V-shaped electrode for an image pickup tube.
@Figures 9 and 10 are diagrams showing other examples of the relationship between the master mesh and the protective film, and Figure 9 is a partially enlarged cross section showing an example in which the protective film is formed only on the top of the master mesh. 10A and 10B are partially enlarged sectional views showing an example in which a master mesh and a protective film are formed on the surface of the electrically insulating substrate. 1.-Electrically insulating substrate 2...Master mesh 3
...Wide part 5...Master mesh wire 6, 16.26.3!1.3@, -.Protective film...-
Initial metal mesh strand 8...Metal mesh strand 9...Metal mesh 10--Wide metal body #fusanken 12...Non-adhesive portion 13.14...Support body 15--Metal Metsu Sheet Agent Patent Attorney Mr. Inoue Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (2)

【特許請求の範囲】[Claims] (1)  電気絶縁性基板上にマスターメツシュと、こ
のマスターメツシュの外縁部に接する幅広部を導電性部
材からなる被膜により形成する工程と、少くとも前記マ
スターメツシュ上に保護膜を被着形成する工程と、前記
幅広部及び前記保護膜を介したマスターメツシュ上に電
鋳によりそれぞれ幅広金属体及び金属メツシュを形成す
る工程と、前記幅広金属体と前記金属メツシュとを分離
する工程とを少なくとも具備することを特徴とする金属
メツシュの製造方法。
(1) A step of forming a master mesh on an electrically insulating substrate and a wide portion in contact with the outer edge of the master mesh with a coating made of a conductive material, and coating at least the master mesh with a protective film. a step of forming a wide metal body and a metal mesh by electroforming on the wide portion and the master mesh via the protective film, and a step of separating the wide metal body and the metal mesh. A method for producing a metal mesh, comprising at least the following.
(2)保護膜が金属メツシュに付着しない部材からなる
ことを特徴とする特許請求の範囲第1項記載の金属メツ
シュの製造方法。 t3)  金属メツシュに付着しない部材がモリブデン
、ニッケル、クロム、タンタル等の金属の酸化物または
硫化物であることを特徴とする特許請求の範囲@2項記
載の金属メツシュの製造方法0
(2) The method for manufacturing a metal mesh according to claim 1, wherein the protective film is made of a member that does not adhere to the metal mesh. t3) The method for producing a metal mesh according to claim 2, wherein the member that does not adhere to the metal mesh is an oxide or sulfide of a metal such as molybdenum, nickel, chromium, or tantalum.
JP19053981A 1981-11-30 1981-11-30 Production of metallic mesh Pending JPS5893884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19053981A JPS5893884A (en) 1981-11-30 1981-11-30 Production of metallic mesh

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19053981A JPS5893884A (en) 1981-11-30 1981-11-30 Production of metallic mesh

Publications (1)

Publication Number Publication Date
JPS5893884A true JPS5893884A (en) 1983-06-03

Family

ID=16259762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19053981A Pending JPS5893884A (en) 1981-11-30 1981-11-30 Production of metallic mesh

Country Status (1)

Country Link
JP (1) JPS5893884A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013227637A (en) * 2012-04-27 2013-11-07 Seiren Co Ltd Perforated metallic foil with carrier and method for producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113893A (en) * 1979-02-23 1980-09-02 Hitachi Maxell Ltd Production of outer blade of reciprocating electric razor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113893A (en) * 1979-02-23 1980-09-02 Hitachi Maxell Ltd Production of outer blade of reciprocating electric razor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013227637A (en) * 2012-04-27 2013-11-07 Seiren Co Ltd Perforated metallic foil with carrier and method for producing the same

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