JP2013223124A - Heat dissipation structure of semiconductor element mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an imaging element mounting substrate, which is capable of improving heat dissipation efficiency while preventing an increase in size and weight.SOLUTION: The heat dissipation structure of a wiring board (30) on which an imaging element (20) is mounted includes: recesses (31, 32) formed on that surface of the wiring board (30) which is opposite to a mounting surface of the imaging element (20); a heat dissipation member (40) provided on at least part of the recesses (31, 32); and through holes (TH1-TH3) which are provided in the wiring board (30), connect the mounting surface of the imaging element (20) and the heat dissipation member (40), and have higher thermal conductivity than the wiring board (30).

Description

  The present invention relates to a heat dissipation structure for a semiconductor element mounting substrate including, for example, an image sensor that can output an electrical signal after photoelectric conversion from a plurality of pixels for imaging as image information.

  2. Description of the Related Art In recent years, high-definition and high frame rates have been advanced in moving image shooting in an imaging apparatus such as a video camera. The imaging device mounting substrate included in the imaging device has, for example, a plurality of pixels for imaging, an imaging device that receives an electrical signal that is received through a lens and photoelectrically converted by the pixels, and outputs an image signal. And a wiring board on which the element is mounted.

  By the way, in recent years, an image pickup device also includes an A / D converter that performs A / D conversion processing on a signal, and a digital signal processing unit that performs processing on a signal digitally converted by the A / D converter. Accordingly, the amount of heat generated by the image sensor is increasing as the degree of integration increases. Since the noise increases due to the heat noise caused by the heat generation and the image quality of the acquired image decreases, higher heat dissipation performance is required from the viewpoint of suppressing the noise.

  On the other hand, for efficiently dissipating the heat generated in the image sensor, for example, a heat dissipation fin is provided on the wiring board, and the heat generation fin is generated in the image sensor from the image sensor through the wiring board. A technique for dissipating heat is disclosed (see, for example, Patent Document 1).

  In addition, a technique for dissipating heat generated by an image sensor by forming a groove on the surface of a wiring board and increasing the surface area of the heat radiation target surface is disclosed (for example, see Patent Document 2).

Japanese Patent No. 3918517 JP 2002-270803 A

  However, in the technique disclosed in Patent Document 1, the imaging element mounting substrate is increased in size and weight due to the radiating fins to be attached, so that it is difficult to introduce the apparatus into a small device such as a portable device.

  Further, although the technology disclosed in Patent Document 2 can suppress the increase in size and weight of the image sensor mounting substrate, the glass wiring substrate exemplified in Patent Document 2 has low heat dissipation characteristics. Even when the surface area of the heat radiation target surface was increased, sufficient heat radiation efficiency could not be obtained.

  The present invention has been made in view of the above, and an object of the present invention is to provide a heat dissipation structure for an image sensor mounting substrate that can increase the efficiency of heat dissipation while preventing an increase in size and weight. .

  In order to solve the above-described problems and achieve the object, a heat dissipation structure for an imaging element mounting substrate according to the present invention is a heat dissipation structure for a substrate on which a semiconductor element is mounted. A recess formed on the back surface located on the back side of the mounting surface, a heat conductive layer provided at least in a part of the recess, and provided on the substrate to connect the mounting surface of the semiconductor element and the heat conductive layer And a thermal coupling part having a higher thermal conductivity than the substrate.

  In the heat dissipation structure for an image pickup device mounting board according to the present invention, in the above invention, the thermal connection portion is disposed in a thin portion of the substrate formed by the mounting surface and a bottom surface of the recess. It is characterized by.

  In the heat dissipation structure for an image pickup device mounting board according to the present invention, the thermal connection part is disposed at a position close to a side wall of the recess of the board.

  Further, in the heat dissipation structure for an imaging element mounting substrate according to the present invention, in the above invention, the substrate is provided with a plurality of the recesses, and the plurality of the recesses of the semiconductor element mounted on the substrate. It is characterized by being arranged using the heat distribution expected based on the arrangement.

  Further, the heat dissipation structure of the imaging element mounting substrate according to the present invention is the above invention, wherein the concave portion at the position on the substrate corresponding to the central portion of the semiconductor element and the substrate corresponding to the peripheral portion of the semiconductor element are provided. The width is different from that of the recess at the position.

  Further, the heat dissipation structure of the imaging element mounting substrate according to the present invention is the above invention, wherein the concave portion at the position on the substrate corresponding to the central portion of the semiconductor element and the substrate corresponding to the peripheral portion of the semiconductor element are provided. It is characterized in that the depth is different from that of the recess at the position.

  Further, the heat dissipation structure of the imaging element mounting substrate according to the present invention is the above invention, wherein the concave portion at the position on the substrate corresponding to the central portion of the semiconductor element and the substrate corresponding to the peripheral portion of the semiconductor element are provided. It is characterized in that the interval between the adjacent recesses is different from that of the recess at the position.

  Further, in the heat dissipation structure for an image sensor mounting substrate according to the present invention, in the above invention, a plurality of the thermal coupling portions are provided on the substrate, and thermal coupling at positions on the substrate corresponding to the mounting portion of the semiconductor element is performed. The heat dissipation characteristic of the part is higher than the heat dissipation characteristic of the thermal connection part at a position on the substrate corresponding to the peripheral part of the semiconductor element.

  Moreover, the heat dissipation structure of the imaging element mounting substrate according to the present invention is the above invention, wherein the volume of the thermal connection portion at a position on the substrate corresponding to the mounting portion of the semiconductor element is in the peripheral portion of the semiconductor element. It is larger than the volume of the said thermal connection part of the position on the said board | substrate corresponding.

  In the heat dissipation structure for an imaging element mounting substrate according to the present invention, in the above invention, a plurality of the thermal connection portions are provided on the substrate, and the thermal connection portions correspond to the mounting portion of the semiconductor element. The thermal coupling part at the upper position and the thermal coupling part at the position on the substrate corresponding to the peripheral part of the semiconductor element are configured such that the interval between adjacent thermal coupling parts is different, The pitch of the thermal connection portion in the mounting region is narrower than the pitch of the thermal connection portion in the region other than the mounting region.

  In addition, in the above-described invention, the heat dissipation structure for the imaging element mounting substrate according to the present invention is a multilayer substrate in which a plurality of partial substrates are stacked, and the bottom surface of the concave portion is formed of the plurality of partial substrates. It is a part of any surface.

  In the heat dissipation structure for an image sensor mounting substrate according to the present invention, the heat conductive layer is a power supply layer or an earth layer.

  In the heat dissipation structure for an image sensor mounting substrate according to the present invention as set forth in the invention described above, the heat conductive layer is provided on a bottom surface and a side surface of the recess.

  The heat dissipation structure for an image sensor mounting substrate according to the present invention is characterized in that, in the above invention, the heat conductive layer is made of a metal material.

  According to the present invention, a plurality of recesses are formed on the surface of the wiring board opposite to the mounting surface of the semiconductor element, and the heat dissipation member is disposed in the recess, and a part between the semiconductor element and the heat dissipation member is provided. As a result, the heat radiation efficiency can be increased while preventing an increase in size and weight.

FIG. 1 is a schematic diagram illustrating a schematic configuration of the image sensor mounting substrate according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line BB shown in FIG. FIG. 3 is a diagram for explaining a configuration of a main part of the image sensor mounting substrate according to the first embodiment of the present invention. FIG. 4 is a diagram for explaining a configuration of a main part of the image sensor mounting substrate according to the first embodiment of the present invention. FIG. 5 is a schematic diagram illustrating the configuration of the main part of the imaging element mounting substrate according to Modification 1-1 of Embodiment 1 of the present invention. FIG. 6 is a schematic diagram illustrating a configuration of a main part of the imaging element mounting substrate according to Modification 1-2 of Embodiment 1 of the present invention. FIG. 7 is a schematic diagram illustrating a schematic configuration of the imaging element mounting substrate according to the second embodiment of the present invention.

  Hereinafter, as an embodiment for carrying out the present invention (hereinafter referred to as an “embodiment”), an imaging device including an imaging device capable of outputting an electrical signal after photoelectric conversion from a plurality of pixels for imaging as image information The mounting substrate will be described. Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

(Embodiment 1)
FIG. 1 is a schematic diagram illustrating a schematic configuration of an image sensor mounting substrate 1 according to a first embodiment of the present invention. FIG. 1A is a partial cross-sectional view of the image sensor mounting substrate 1. b) is a bottom view of the image sensor mounting substrate 1. FIG. 1A is a partial cross-sectional view corresponding to the line AA in FIG. FIG. 2 is a cross-sectional view taken along line BB shown in FIG. As shown in FIG. 1, the image pickup device mounting substrate 1 has a plurality of pixels for image pickup, and the image pickup device 20 that outputs a signal after each pixel is subjected to photoelectric conversion processing as a video signal, and the image pickup device 20 includes A wiring board 30 that is mounted and electrically connects between the image pickup device 20 and an external circuit, and a heat dissipation member 40 (heat conduction layer) having at least high thermal conductivity as compared with a material used for the wiring board 30. And comprising. The imaging element mounting substrate 1 having these configurations has a heat dissipation structure that radiates heat generated in the imaging element 20 by the heat dissipation member 40 to the outside.

  The imaging element 20 has a substantially plate shape, photoelectrically converts light from the optical system, and outputs a signal as a video signal. Specifically, the imaging device 20 includes a light receiving unit in which a plurality of pixels each having a photodiode that accumulates electric charge according to the amount of light and an amplifier that amplifies the electric charge accumulated by the photodiode are arranged in a two-dimensional matrix, A photoelectric conversion unit having a vertical scanning circuit and a digital signal processing unit that performs analog / digital conversion (A / D conversion circuit) on a signal output from the photoelectric conversion unit and performs predetermined signal processing. An input / output pattern IP for inputting / outputting signals to / from the wiring board 30 is provided on the surface of the image pickup device 20.

  The wiring board 30 has a substantially plate shape and is mounted with the above-described imaging element 20. In addition, a foot pattern FP for inputting / outputting signals to / from the image sensor 20 is provided on the surface of the wiring board 30. Further, the wiring board 30 may be provided with an I / F connector which is an interface for performing communication with the outside of the imaging element mounting board 1. At this time, the wiring board 30 is electrically connected to the input / output pattern IP of the image sensor 20 by the wire W connected to the above-described foot pattern FP.

  In addition, the wiring board 30 has recesses 31 and 32 that are notched in a predetermined direction and have a concave shape in a side view on the back surface located on the back side of the mounting surface on which the imaging element 20 is mounted. The recesses 31 and 32 are respectively provided according to the mounting position of the image sensor 20, and a plurality of the recesses 31 are arranged at positions on the wiring board 30 corresponding to the center side of the image sensor 20 (this embodiment) In form 1, two). A plurality of recesses 32 are disposed at positions on the wiring board 30 corresponding to the outer edge side (peripheral part) of the image sensor 20 (two in the first embodiment). At this time, the notch width and depth of the recess 31 are larger than the notch width and depth of the recess 32. Note that the notch width and depth of the recess to be formed may be different in both the notch width and depth, or one may be different.

  Here, in the first embodiment, the description will be made assuming that the recesses 31 and 32 are provided one on each side with the center line of the imaging element 20 as a boundary, but a plurality of recesses 31 and 32 may be provided. In this case, an arrangement interval between the recesses 31 provided on one side (an interval between adjacent recesses) is different from an arrangement interval between the recesses 32 provided on one side. At this time, it is preferable that the arrangement interval of the concave portions 31 is narrower than the arrangement interval of the concave portions 32.

  The wiring board 30 is formed with through holes TH1 to TH3 (thermal connection portions) that penetrate in the thickness direction and connect the mounting surface side of the image sensor 20 and the heat dissipation member 40 side. The through hole TH1 is provided between the recesses 31. The through holes TH2 are respectively provided at the bottom of the recess 31. Here, the wiring board 30 is formed by the mounting surface and the bottom surfaces of the recesses 31 and 32, and has a thin portion that is thinner than other portions, and the through hole TH2 is provided in the thin portion. ing. The through hole TH3 is provided between the recess 31 and the recess 32, respectively. The through holes TH <b> 1 to TH <b> 3 are covered with a conductive material such as metal, and have a higher thermal conductivity than the material forming the wiring substrate 30. The through holes TH1 to TH3 electrically connect each substrate when the wiring substrate 30 is formed of a multilayer substrate, and the inner peripheral surface is made of a conductive material such as a metal even when the substrate is a single layer substrate. The thermal conductivity as a through hole is improved by being covered.

  FIG. 3 is a diagram illustrating a configuration of a main part of the image sensor mounting substrate 1 according to the first embodiment. In the first embodiment, it is preferable that a large number of through holes TH to be disposed are formed in order to improve heat transfer efficiency. At this time, the through holes TH are formed so that the distance d1 between the through holes TH is the formation limit distance. Here, the formation limit distance is determined according to the diameter of the through hole TH, the thickness of the wiring board 30, and the required rigidity. In the case where one through hole TH is formed in the same through hole forming region and in the case where three through holes TH are formed, the case where three through holes TH are formed increases the thermal efficiency approximately three times. Can be realized.

  FIG. 4 is a diagram for explaining a configuration of a main part of the image sensor mounting substrate 1 according to the first embodiment. FIGS. 4A and 4B are through-holes at different positions. It is sectional drawing which shows the hole TH. In the first embodiment, it is preferable that the through hole TH to be disposed has a small thermal resistance in order to improve the efficiency of heat transfer. At this time, when the plate thickness of the portion where each through hole TH is formed is the thickness d2, d3 (d2> d3), the through hole TH is formed in the thinner plate thickness (thickness d3, thin portion). This is preferable because the thermal resistance is small. For example, when the thickness d2 is three times thicker than the thickness d3, the thermal resistance of the through hole TH formed at the location of the thickness d3 is the thermal resistance of the through hole TH formed at the location of the thickness d2. Compared to 1/3.

  As shown in FIG. 1B, the through hole TH1 is provided on the side wall surface side of the recess 31 (position close to the side wall of the recess 31) and extends along the side wall surface. By providing the through hole TH1 on the side wall surface side of the recess 31, the distance between the through hole TH1 and the heat radiating member 40 is narrowed, and heat transfer can be performed more efficiently.

  The heat dissipating member 40 is a plate-like or film-like member made of a metal material such as copper, aluminum, or an alloy thereof, and is provided on the surface of the wiring board 30 on the side where the recesses 31 and 32 are formed. The heat dissipating member 40 is fixed along the surface of the wiring board 30 and dissipates the heat generated in the imaging element 20 to the outside through the wiring board 30a. At this time, the through holes TH1 to TH3 may be sealed by the heat radiating member 40, or holes may be formed in the heat radiating member 40 so that the through holes TH1 to TH3 communicate with the outside. Good. As the metal material, a material having a high thermal conductivity, such as copper, can be used as compared with the material constituting the wiring board 30b.

  In addition, it is preferable that a heat conductive paste is disposed between the wiring board 30 and the heat dissipation member 40 and the both are fixed by the heat conductive paste. The heat conductive paste can be applied as long as it is a metal or resin having a large thermal conductivity compared to the material constituting the wiring substrate 30, or a resin or adhesive containing a metal powder having a large thermal conductivity. Note that a diamond filler may be added to the heat conductive paste to improve the heat conductivity. Further, the heat radiation member 40 may be formed by performing a plating process on the wiring board 30.

  As described above, the imaging element mounting substrate 1 according to the first embodiment is formed in a side view by forming the plurality of recesses 31 and 32 on the surface of the wiring board 30 opposite to the mounting surface of the imaging element 20. Since it has a comb shape, the imaging element mounting substrate 1 can be prevented from being enlarged and the surface area can be increased. Further, by disposing the heat radiating member 40 having thermal conductivity on the surface on the comb-shaped side, efficient heat radiation can be realized. At this time, since the heat radiating member 40 has a plate shape or a film shape and is provided along the surface of the wiring substrate 30, it is possible to improve the heat radiating efficiency without greatly increasing the weight.

  Further, by forming a plurality of through holes TH penetrating in the plate thickness direction of the wiring board 30, heat transfer from the imaging element 20 to the heat radiating member 40 (external) is compared with a case where only the wiring board 30 is passed. And efficient.

  According to the first embodiment described above, a plurality of recesses are formed on the surface of the wiring board opposite to the mounting surface of the image sensor, and a heat dissipation member is disposed in the recess, and the image sensor and the heat dissipation member are arranged. Since a part between them is connected by a through hole, the efficiency of heat dissipation can be improved while preventing an increase in size and weight. Further, by efficiently radiating heat, it is possible to reduce noise in the obtained image and obtain a high-quality image.

  In the first embodiment, the heat radiating member 40 is described as being provided on a part of the bottom surface and side surface of the recesses 31 and 32. However, the present invention can be applied if it is formed at least in the recesses 31 and 32. It may be provided integrally with the formation region.

  FIG. 5 is a schematic diagram illustrating a configuration of a main part (wiring board 30a) of the imaging element mounting board according to the modified example 1-1 of the first embodiment. In the first embodiment described above, the through holes TH1 to TH3 are provided according to the recesses 31 and 32. However, the through hole formation position is not limited to the above-described position, for example, at the mounting position of the imaging element 20. Accordingly, the through holes may have different diameters. In the modified example 1-1, the recesses 31 and 32 are respectively arranged using a heat distribution expected based on the arrangement of the imaging element 20 mounted on the wiring board 30a.

  In the wiring board 30a shown in FIG. 5, a through hole THi1 and a through hole THo1 (thermal connection portion) are formed which penetrate in the plate thickness direction and have different diameters in the direction orthogonal to the through direction. The through hole THi1 is provided in a mounting region (mounting portion) of the image sensor 20 with respect to the wiring board 30a. In addition, the through hole THo1 is provided outside the mounting area of the image sensor 20 with respect to the wiring board 30a. Here, the diameter in the direction orthogonal to the through direction of the through hole THi1 is larger than the diameter in the direction orthogonal to the through direction of the through hole THo1. That is, the volume of the through hole THi1 at the position on the wiring board 30a corresponding to the mounting area of the imaging element 20 is larger than the volume of the through hole THo1 at the position on the wiring board 30a corresponding to the peripheral part of the imaging element 20.

  Here, when processing such as filling the inside of the through hole with metal instead of a hollow structure, the entire volume of the through hole has high thermal conductivity, so the imaging element 20 is mounted on the wiring board 30a. The heat transfer (heat radiation characteristic) in the area where the image sensor 20 is mounted can be made more efficient than the heat transfer outside the area where the image sensor 20 is mounted.

  FIG. 6 is a schematic diagram illustrating a configuration of a main part (wiring board 30b) of the imaging element mounting substrate 1 according to Modification 1-2 of the first embodiment. In Modification 1-1 described above, the diameter of the through hole is different depending on the mounting position of the imaging element 20, but the through hole formation density (adjacent through holes) is assumed with the same through hole diameter. The spacing between holes) may be different.

  In the wiring board 30b shown in FIG. 6, through-holes THi2 and through-holes THo2 (thermal connection portions) that penetrate in the plate thickness direction and have the same diameter in the direction orthogonal to the penetration direction are formed. The through hole THi2 is provided in a mounting region of the image sensor 20 with respect to the wiring board 30a. The through hole THo2 is provided outside the mounting area of the image sensor 20 with respect to the wiring board 30a. Here, the formation density (pitch) of the through holes THi2 is higher (narrower) than the formation density of the through holes THo2.

  Thereby, heat transfer (heat dissipation characteristics) in the area where the image pickup device 20 is mounted on the wiring board 30b can be made more efficient than heat transfer outside the area where the image pickup element 20 is mounted.

  Here, in recent years, the degree of circuit integration on the image pickup device 20 has increased due to the market demand for downsizing of devices in which the image pickup device mounting substrate 1 is incorporated and the advancement of semiconductor miniaturization. A digital signal processing unit including an A / D conversion circuit for converting an analog signal from the digital signal is formed on the same chip. For this reason, in a digital signal processing unit or the like that generates a large amount of heat in the image sensor 20, it is necessary to transfer heat more preferentially.

  With respect to this problem, in the configuration of the first embodiment and the modified examples 1-1 and 1-2 described above, the thickness of the wiring board 30 closer to the digital signal processing unit of the image sensor 20 is reduced, or the heat radiating member. It is possible to cope with this problem by increasing the thickness of 40 or adjusting the diameter and formation density of the through holes.

(Embodiment 2)
FIG. 7 is a schematic diagram illustrating a schematic configuration of the imaging element mounting substrate 2 according to the second embodiment. In addition, the same code | symbol is attached | subjected to the component same as the structure demonstrated in FIG. In the first embodiment described above, the heat dissipation member 40 is formed on the formed recesses 31 and 32. However, in the imaging element mounting substrate 2 according to the second embodiment, a resin substrate made of glass epoxy resin is used. In the wiring substrate 30c, which is a multilayer substrate in which G1 to G3 (partial substrates) and metal substrates C1 and C2 (partial substrates) made of copper are alternately stacked, the metal substrates C1 and C2 are used as heat dissipation members.

  The wiring board 30c has a substantially plate shape, and mounts the above-described imaging element 20. At this time, the substrate on the mounting surface side of the imaging device 20 is the resin substrate G1, and the metal substrate C1, the resin substrate G2, the metal substrate C2, and the resin substrate G3 are disposed on the surface of the resin substrate G1 opposite to the mounting surface of the imaging device 20. Are sequentially stacked. The metal substrates C1 and C2 are used as a power supply layer or an earth layer.

  In addition, the wiring board 30c has recesses 31a and 32a that are notched in a predetermined direction on the surface opposite to the surface on which the image sensor 20 is mounted and have a concave shape in a side view. The recesses 31a and 32a are respectively provided according to the mounting position of the image sensor 20, and a plurality (two in the second embodiment) of the recesses 31a are arranged according to the central portion side of the image sensor 20. . Further, the recesses 32a are arranged according to the outer edge side of the image sensor 20 (two in the second embodiment).

  At this time, a part of the surface of the metal substrate C1 is exposed at the bottom of the recess 31a. That is, the exposed surface of the metal substrate C1 forms the bottom of the recess 31a. A part of the surface of the metal substrate C2 is exposed at the bottom of the recess 32a. The notch width and depth of the recess 31a are larger than the notch width and depth of the recess 32a.

  Further, through holes TH4 and TH5 (thermal connection portions) penetrating in the plate thickness direction are formed in the wiring board 30c. The through hole TH4 is provided so that the bottom of the recess 31a communicates with the outside, and penetrates in the thickness direction in the resin substrate G1 and the metal substrate C1. The through hole TH5 (via) is provided so that the bottom of the recess 32a communicates with the outside, and penetrates in the thickness direction in the resin substrate G2 and the metal substrate C2. That is, a part of the metal substrate C1 is exposed to the outside through the through hole TH5. The through holes TH4 and TH5 are covered with a conductive material such as metal, as in the above-described through holes TH1 to TH3, and are electrically connected to each other by being laminated.

  The heat generated in the image pickup device 20 by the wiring board 30c having the above-described configuration is radiated to the outside through the through hole TH4, and is radiated from the through hole TH5 to the outside through the metal board C1. Is done. Further, heat can be radiated by the exposed portion of the recess 31a of the metal substrate C2, and the heat radiation characteristics of the wiring substrate 30c can be improved.

  According to the second embodiment described above, a plurality of recesses are formed on the surface of the wiring board opposite to the mounting surface of the image pickup device, and the heat dissipation member is exposed at the bottom of the recesses, and the through holes are used for externally. Therefore, it is possible to increase the efficiency of heat dissipation while preventing an increase in size and weight. Further, by efficiently radiating heat, it is possible to reduce noise in the obtained image and obtain a high-quality image.

  In the first embodiment described above, the recess is formed in accordance with the power supply layer or the earth layer disposed inside, so that the power supply layer or the earth layer is formed at the bottom of the recess as in the second embodiment. It can be.

  In the first and second embodiments described above, the image pickup element has been described. However, these configurations are not limited to the image pickup element, and the electronic circuit is used for a semiconductor element used in an electronic apparatus such as an information processing apparatus. It can be applied to dissipate heat generated from the heat. That is, the present invention is not limited to Embodiments 1 to 3 described above, but can be applied to any semiconductor element having a heat generating portion as long as the generated heat is dissipated.

1, 2 Imaging device mounting substrate 20 Imaging device 30, 30a, 30b, 30c Wiring substrate 40 Heat radiation member C1, C2 Metal substrate G1-G3 Resin substrate TH1-TH5, THi1, THi2, THo1, THo2 Through hole

Claims (14)

A heat dissipation structure for a substrate on which a semiconductor element is mounted,
Of the surface of the substrate, a recess formed on the back surface located on the back side of the mounting surface of the semiconductor element,
A heat conductive layer provided at least in a part of the recess;
A thermal connection part provided on the substrate, connecting the mounting surface of the semiconductor element and the thermal conductive layer, and having a higher thermal conductivity than the substrate;
A heat dissipation structure for a semiconductor device mounting board, comprising:   2. The heat dissipation structure for a semiconductor element mounting substrate according to claim 1, wherein the thermal connection portion is disposed in a thin portion of the substrate formed by the mounting surface and a bottom surface of the recess.   2. The heat dissipation structure for a semiconductor device mounting substrate according to claim 1, wherein the thermal connection portion is disposed at a position close to a side wall of the concave portion of the substrate. The substrate is provided with a plurality of the recesses,
2. The heat dissipation of a semiconductor element mounting substrate according to claim 1, wherein the plurality of recesses are respectively arranged using a heat distribution expected based on an arrangement of the semiconductor elements mounted on the substrate. Construction.   5. The width of a concave portion at a position on the substrate corresponding to a central portion of the semiconductor element and a concave portion at a position on the substrate corresponding to a peripheral portion of the semiconductor element are different from each other. Heat dissipation structure for semiconductor device mounting board.   5. The depth is different between a concave portion at a position on the substrate corresponding to a central portion of the semiconductor element and a concave portion at a position on the substrate corresponding to a peripheral portion of the semiconductor element. The heat dissipation structure of the described semiconductor element mounting substrate.   An interval between adjacent concave portions is different between a concave portion at a position on the substrate corresponding to a central portion of the semiconductor element and a concave portion at a position on the substrate corresponding to a peripheral portion of the semiconductor element. The heat dissipation structure for a semiconductor element mounting substrate according to claim 4. A plurality of the thermal connection portions are provided on the substrate,
The heat dissipating characteristic of the heat connecting part at the position on the substrate corresponding to the mounting part of the semiconductor element is higher than the heat dissipating characteristic of the heat connecting part at the position on the substrate corresponding to the peripheral part of the semiconductor element. The heat dissipation structure for a semiconductor device mounting board according to claim 1.   The volume of the thermal coupling portion at a position on the substrate corresponding to the mounting portion of the semiconductor element is larger than the volume of the thermal coupling portion at a position on the substrate corresponding to the peripheral portion of the semiconductor element. The heat dissipation structure for a semiconductor element mounting substrate according to claim 8. A plurality of the thermal connection portions are provided on the substrate,
The thermal coupling portion is adjacent to the thermal coupling portion at a position on the substrate corresponding to the mounting portion of the semiconductor element and the thermal coupling portion at a position on the substrate corresponding to a peripheral portion of the semiconductor element. Configured so that the interval between the thermal connecting parts to be different,
2. The heat dissipation of the semiconductor element mounting substrate according to claim 1, wherein a pitch of the thermal connection portion in the mounting region of the semiconductor element is narrower than a pitch of the thermal connection portion in a region other than the mounting region. Construction. The substrate is a multilayer substrate formed by laminating a plurality of partial substrates,
2. The heat dissipation structure for a semiconductor element mounting substrate according to claim 1, wherein a bottom surface of the recess is a part of a surface of any of the plurality of partial substrates.   The heat dissipation structure for a semiconductor device mounting substrate according to claim 1, wherein the heat conductive layer is a power supply layer or an earth layer.   2. The heat dissipation structure for a semiconductor device mounting substrate according to claim 1, wherein the heat conductive layer is provided on a bottom surface and a side surface of the recess.   The heat dissipation structure for a semiconductor element mounting substrate according to claim 1, wherein the heat conductive layer is made of a metal material.

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