JP2013220652A - 遮熱シート - Google Patents

遮熱シート Download PDF

Info

Publication number
JP2013220652A
JP2013220652A JP2012095741A JP2012095741A JP2013220652A JP 2013220652 A JP2013220652 A JP 2013220652A JP 2012095741 A JP2012095741 A JP 2012095741A JP 2012095741 A JP2012095741 A JP 2012095741A JP 2013220652 A JP2013220652 A JP 2013220652A
Authority
JP
Japan
Prior art keywords
porous layer
layer
heat
less
heat shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012095741A
Other languages
English (en)
Japanese (ja)
Inventor
Kentaro Tamura
健太郎 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2012095741A priority Critical patent/JP2013220652A/ja
Priority to PCT/US2013/037339 priority patent/WO2013158976A1/en
Priority to JP2015507214A priority patent/JP2015516687A/ja
Priority to KR20147031839A priority patent/KR20150011351A/ko
Priority to TW102114075A priority patent/TW201350008A/zh
Priority to US14/391,207 priority patent/US20150090433A1/en
Priority to CN201380020705.3A priority patent/CN104541593A/zh
Publication of JP2013220652A publication Critical patent/JP2013220652A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0223—Vinyl resin fibres
    • B32B2262/0238—Vinyl halide, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012095741A 2012-04-19 2012-04-19 遮熱シート Pending JP2013220652A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012095741A JP2013220652A (ja) 2012-04-19 2012-04-19 遮熱シート
PCT/US2013/037339 WO2013158976A1 (en) 2012-04-19 2013-04-19 Heat reduction sheet
JP2015507214A JP2015516687A (ja) 2012-04-19 2013-04-19 熱低減シート
KR20147031839A KR20150011351A (ko) 2012-04-19 2013-04-19 열 저감 시트
TW102114075A TW201350008A (zh) 2012-04-19 2013-04-19 降熱片
US14/391,207 US20150090433A1 (en) 2012-04-19 2013-04-19 Thermal shield sheet
CN201380020705.3A CN104541593A (zh) 2012-04-19 2013-04-19 减热片材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012095741A JP2013220652A (ja) 2012-04-19 2012-04-19 遮熱シート

Publications (1)

Publication Number Publication Date
JP2013220652A true JP2013220652A (ja) 2013-10-28

Family

ID=49384099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012095741A Pending JP2013220652A (ja) 2012-04-19 2012-04-19 遮熱シート
JP2015507214A Pending JP2015516687A (ja) 2012-04-19 2013-04-19 熱低減シート

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015507214A Pending JP2015516687A (ja) 2012-04-19 2013-04-19 熱低減シート

Country Status (6)

Country Link
US (1) US20150090433A1 (enExample)
JP (2) JP2013220652A (enExample)
KR (1) KR20150011351A (enExample)
CN (1) CN104541593A (enExample)
TW (1) TW201350008A (enExample)
WO (1) WO2013158976A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015088575A (ja) * 2013-10-30 2015-05-07 パナソニックＩｐマネジメント株式会社 熱対策シートおよびこれを用いた熱対策構造
KR102471272B1 (ko) 2019-01-25 2022-11-29 삼성전자주식회사 방사율 조절층을 포함하는 전자장치
KR102744248B1 (ko) * 2022-06-17 2024-12-18 (주)테라시스 방열시트 및 이의 제조방법
TWI897328B (zh) * 2024-01-09 2025-09-11 伍隆國際有限公司 擋抵裝置及其擋抵方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09501016A (ja) * 1993-07-14 1997-01-28 コメリクス・インコーポレーテッド 馴染み性の良好な伝熱性界面材料
US6264044B1 (en) * 1997-04-11 2001-07-24 Cuno, Inc. Reinforced, three zone microporous membrane
JP4104887B2 (ja) * 2002-03-25 2008-06-18 北川工業株式会社 電気電子器具の内部構造
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム
JP4479840B2 (ja) * 2007-12-11 2010-06-09 株式会社デンソー 電子制御機器及び電子制御機器の製造方法
US8105456B2 (en) * 2009-02-10 2012-01-31 Keng-Hsien Lin Method of making a breathable film laminate and a breathable film laminate produced therefrom
US8529808B2 (en) * 2010-05-21 2013-09-10 Basf Se Nanoporous polymer foams
JP5749985B2 (ja) * 2010-08-23 2015-07-15 日東電工株式会社 複合シート

Also Published As

Publication number Publication date
CN104541593A (zh) 2015-04-22
KR20150011351A (ko) 2015-01-30
US20150090433A1 (en) 2015-04-02
TW201350008A (zh) 2013-12-01
WO2013158976A1 (en) 2013-10-24
JP2015516687A (ja) 2015-06-11

Similar Documents

Publication Publication Date Title
JP6183728B2 (ja) 伝導性粘着テープおよびその製造方法
TWI300009B (en) Support substrate of separation membrane
US20150118482A1 (en) Heat-dissipating film, and its production method and apparatus
CN105536384B (zh) 空气过滤器用滤材、空气过滤器单元及多孔膜的制造方法
US11472992B2 (en) Polymer matrix composites comprising thermally conductive particles and methods of making the same
US11456230B2 (en) Heat radiation sheet and method of manufacturing same
JP2012513547A (ja) パターン付きスパンボンド繊維ウェブ及びこれを作製する方法
CN104999745A (zh) 多孔膜叠层体及其制造方法
JP2013220652A (ja) 遮熱シート
KR102094925B1 (ko) 전자파 차폐능 및 열전도도가 우수한 다층 그라파이트 시트 및 이의 제조방법
US10357949B2 (en) Meltblown-spunbonded-meltblown laminated fabric
CN105188896B (zh) 液体过滤器用基材
CN105385183A (zh) 包含单向连续纤维和热塑性树脂的复合材料
US11515810B2 (en) Energy conversion film and energy conversion element using same
JP2013072148A (ja) 繊維シートおよびその製造方法
EP3730285A1 (en) Multilayer sound absorbing material
TW200423465A (en) Continuous process for producing polymer electrolyte membrane and apparatus thereof
KR102658323B1 (ko) 멜트블로운 섬유 및 나노 섬유가 랜덤하게 혼합된 단일층의 하이브리드 흡음패드를 포함하는 가청주파수 대역의 노이즈 저감용 흡음재 제조장치 및 이에 의해 제조된 흡음재
KR101812786B1 (ko) 방수성 통기 시트 및 이의 제조 방법
JPWO2015005420A1 (ja) 圧電性シート、該シートの製造方法および圧電積層体
KR101746066B1 (ko) 방열시트, 그 제조방법 및 그를 구비한 휴대용 단말기
KR101812789B1 (ko) 방수성 통기 시트 및 이의 제조 방법
KR102658315B1 (ko) 멜트블로운 섬유 및 나노 섬유가 랜덤하게 혼합된 단일층의 하이브리드 흡음패드를 포함하는 가청주파수 대역의 노이즈 저감용 흡음재의 제조방법 및 이에 의해 제조된 흡음재
JP2016072355A (ja) 圧電素子及びその製造方法
JP2016186620A (ja) 光拡散シート用基材、及び光拡散シート