JP2013201365A - Electronic component mounting device and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method that, in a set up change for model change, can secure accuracy of adsorption position at the start of device operation and reduce working hours required for the set up change for model change.SOLUTION: Position correction data for adsorption positions of tape feeders respectively housed in feeder carts set in a supplying area for supplying electronic components are stored separately in memory means for each feeder cart. When changing a model, if position correction data for a substrate before the model change is stored in mounted data in the electronic component mounting device, the position correction data is stored or updated, as the position correction data for the substrate before the model change, in the memory means. Thereafter, the position correction data for the substrate after the model change is reflected in the mounted data.

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method, and more particularly, to an electronic component mounting apparatus and an electronic component mounting method that reduce model switching work time.

  2. Description of the Related Art Conventionally, an improvement in operating rate has been desired for an electronic component mounting apparatus that mounts electronic components on a substrate to be mounted (hereinafter referred to as a substrate) such as a printed circuit board. One of the measures for this is to complete the setup change at the time of model change in a short time. A plurality of different types of electronic components are mounted on the substrate. For this reason, in general, a large number of tape feeders that supply electronic components for each type are mounted in parallel in the component supply unit of the electronic component mounting apparatus. When changing the board model, the feeder arrangement is changed to change the type and arrangement of these tape feeders according to the type and quantity of electronic components mounted on the board to be changed.

When the feeder is rearranged, not only the tape feeder body is replaced, but also data necessary for the mounting operation such as position correction data unique to each tape feeder is rewritten. In other words, the feeder placement data for a new board to be switched is read into the electronic component mounting apparatus, and the tape feeder is replaced (replaced) based on the feeder placement data. An operation of newly generating position correction data is performed. If the position correction is not normally performed, the position where the electronic component is sucked from the tape feeder is shifted. Therefore, even if the electronic component cannot be reliably picked up and can be taken out, for example, the possibility of the electronic component falling during mounting increases. In addition, even if it can be mounted on the substrate, the possibility of mounting it off the normal position increases.
The new generation of the position correction data is performed by recognizing the electronic component taken out by the transfer head from the image captured by the camera and detecting the positional deviation of the electronic component stored in the tape feeder. The suction position of the transfer head is corrected so as to reduce this. As described above, the position correction data is often generated by learning the so-called suction position.

  Patent Document 1 describes an electronic component mounting (mounting) method in which an electronic component is picked up by a transfer head moved from a tape feeder by a head moving mechanism and mounted on a substrate. In this patent document 1, the position correction data used when the suction nozzle is relatively aligned with the component stop position by the tape feeding mechanism provided in the tape feeder is stored in the correction data storage means for each tape feeder. . Then, at the time of switching the model of the board to be mounted, only position correction data for the tape feeder that is the target of the layout change is newly generated among the position correction data. This describes a technique for reducing the setup change work at the time of model switching and stabilizing the suction position accuracy at the start of operation of the apparatus.

JP 2005-116597 A

However, in Patent Document 1, it is necessary to newly generate position correction data for the tape feeder that is the target of the arrangement change among the position correction data. Therefore, it takes time to change the setup when switching models.
In addition, when the model is changed, the tape feeder is replaced for each feeder cart. In this case, for example, for each electronic component of the tape feeder arranged in the feeder cart, the suction position teaching (alignment) must be automatically performed, and the setup time is long. Although it is possible to perform automatic alignment to some extent by pocket recognition, there is a problem that automatic alignment cannot be performed in the case of an embossed tape.
In view of the above problems, the object of the present invention is to secure the suction position accuracy at the start of operation of the apparatus and replace the feeder cart when changing the model, and to change the model when changing the model. To provide an electronic component mounting apparatus and an electronic component mounting method capable of reducing work time.

  In order to solve the above-described problems, an electronic component mounting apparatus according to the present invention includes at least a feeder cart that is set in a supply area and supplies electronic components, and a tape feeder that is stored in the set feeder cart. A mounting head that sucks and mounts an electronic component on a substrate to be mounted, teaching means that teaches the suction position of the mounting head and generates position correction data, and a memory that stores the position correction data for each feeder cart An electronic control unit that controls the operation of the electronic component mounting apparatus by reading the position correction data from the storage unit stored for each feeder cart at the time of model change and reflecting the position correction data in the mounting data. In the component mounting apparatus, when the model is changed, the position correction data of the board before the model change is included in the mounting data when the model is changed. The position correction data is stored or updated in the storage means as the board position correction data before the model change, and then the board position correction data after the model change is reflected in the mounting data. Is a first feature of the present invention.

  In the electronic component mounting apparatus according to the first feature of the present invention, the second feature of the present invention is that when the model is changed, the feeder cart set from the supply area is replaced for each feeder cart.

  In order to solve the above-described problem, the electronic component mounting method of the present invention includes the position correction data of the suction position of the tape feeder respectively stored in a feeder cart set in a supply area for supplying electronic components. Stored in the storage means for each feeder cart, and when the model is changed, if the mounting data of the electronic component mounting apparatus includes the position correction data of the board before the model change, the position correction data is changed to the position of the board before the change. The third feature of the present invention is that the correction data is stored or updated in the storage means, and then the board position correction data after the model change is reflected in the mounting data.

  In the electronic component mounting method according to the third feature of the present invention, the fourth feature of the present invention is that when the model is changed, the feeder cart set from the supply area is replaced for each feeder cart.

  In the electronic component mounting method according to the third or fourth aspect of the present invention, when the model is changed, the board position correction data read from the storage means is the position correction data of all the tape feeders in the feeder cart. Of these, only the position correction data relating to the position correction data of the substrate after the change is a fifth feature of the present invention.

  According to the present invention, an electronic component mounting apparatus and an electronic component mounting capable of ensuring the suction position accuracy at the start of device operation and reducing the work time required for the setup change at the time of model switching even when the model is switched. A method can be realized.

It is a top view of one Example of the electronic component mounting apparatus of this invention. It is a perspective view of one Example of the feeder cart of the electronic component mounting apparatus of this invention. It is a figure which shows the structure of one Example of the feeder of the electronic component mounting apparatus of this invention. It is a control block diagram of one Example of the electronic component mounting apparatus of this invention. It is a schematic diagram for demonstrating the model change of the electronic component mounting apparatus and electronic component mounting method of this invention, and the switching method of the data content of an offset group. 4 is a flowchart for explaining a procedure executed by a CPU 431 in the electronic component mounting apparatus and the electronic component mounting method of the present invention.

Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings.
In the description of each figure, the same reference numerals are assigned to components having a common function, and the description is omitted to avoid duplication as much as possible.
Moreover, the following description is for describing one embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.

An embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
1 is an electronic component mounting apparatus of the present invention, 80 is a control device for controlling each device in the electronic component mounting apparatus 1, and LU, LD, RU, and RD are blocks of the electronic component mounting apparatus 1, respectively. The apparatus 1 (hereinafter, abbreviated as the main body 1 if necessary) has a total of 4 blocks of 2 blocks LU and LD at the back and front of the left side, and 2 blocks RU and RD at the back and front of the right side, and a control device 80. Yes. In FIG. 1, only the LU block is basically labeled. 6 is a mounting head (transfer head), 11 is a mounting head body for moving the mounting head 6, and 13 is a component basically mounted with one feeder cart (see FIG. 2 described later) provided with a number of feeders. A supply area 19 is a component recognition camera for imaging the electronic component suction holding state of the mounting head 6, 18 is a left / right movement rail, and 16 is a front / rear movement rail. P is a substrate, 5a to 5d are chutes, and 7 is a delivery section.
In FIG. 1, each block is provided with a component supply area 13, a mounting head 6, a mounting head body 11, and a component recognition camera 19. The mounting head body 11 moves in the left-right direction (X direction) on the left-right movement rail 18 constituted by the linear motor, and on the front-rear movement rail 16 constituted by the linear motor in the same direction as the left-right movement rail 18. Move in (Y direction).

With such a configuration, the mounting head 6 fixed to the mounting head body 11 sucks the electronic component from the component supply area 13, monitors the suction holding state of the electronic component by the image captured by the component recognition camera 19, The board moves to a predetermined position on the substrate P, and the sucked electronic component is mounted on the substrate P.
Such an operation is performed in each of the four blocks. For this purpose, the component mounting apparatus 1 of FIG. 1 is provided with four chutes 5a to 5d for transporting the substrate P in the vicinity of the center thereof.
The back two chutes 5c and 5d constitute a substrate transport line U for the upper block, and the lower two chutes 5a and 5b constitute a substrate transport line D for the front block. And the board | substrate P is distributed by the delivery part 7, and is carried in into the board | substrate conveyance line U or D. FIG.
In the following drawings, the conveyance of the substrate P is defined as the X direction, the direction perpendicular to X as the Y direction, and the direction perpendicular to X and Y as the Z direction. The direction in which the feeder cart 50 is mounted on the main body 1 in the block is defined as the Y + direction.

Next, the structure of the feeder cart 50 is demonstrated using the perspective view of the feeder cart 50 in this embodiment of FIG. FIG. 2 is a perspective view of an embodiment of a feeder cart of the electronic component mounting apparatus according to the present invention. FIG. 3 is a diagram showing a configuration of an embodiment of a feeder of the electronic component mounting apparatus according to the present invention.
Reference numeral 50 denotes a feeder cart, 51 denotes a base portion, 52 denotes a feeder fixing portion for fixing the feeder, 53 denotes a handle portion, and 54 denotes a component supply reel storage portion storing a component supply reel 67 (see FIG. 3). The feeder cart 50 is roughly composed of a base portion 51, a feeder fixing portion 52 at the top of the feeder cart 50, a handle portion 53, and a component supply reel storage portion 54.
Moreover, in the base part 51, 51a is a wheel fixing | fixed part and 51b is a lock pin. Further, in the feeder fixing portion 52b, 52a is a feeder base, 52b is a positioning hole, 52c is a feeder fixing portion guide, 52d is a feeder signal connector, and 52e is a feeder guide. Further, in the handle portion 53, 53a is a handle, 53b is a side plate, and 53c is a tip of the side plate 52b.

  The base portion 51 has four wheel fixing portions 51a for fixing a moving wheel (not shown) at four corners, and when the feeder cart 50 is fixed to the main body of the electronic component mounting apparatus 1, the feeder cart 50 Has a lock pin 51b for fixing the to the floor surface. The feeder fixing unit 52 causes the feeder fixing unit guide 52c to guide the feeder fixing unit 35 of the feeder 2, places the feeder 2 on the base 52a, and connects the feeder connector 36 of the feeder 2 to the feeder signal connector 52d. The feeder fixing portion connectors 52c are regularly arranged on the feeder base 52a so that a large number of feeders 2 can be mounted. A supply tape 60 on which electronic components are mounted is supplied to each feeder 2 from the supply reel storage unit 54.

  Further, at both ends of the feeder base 52a, there are feeder guides 52e that play a role of sliding a cart guide plate (not shown) provided on the main body 1 when the feeder cart is inserted into the main body 1. Further, the feeder guide 52 e has a positioning hole 52 b for fixing the feeder cart 50 to the main body 1. Finally, there is a handle portion 53 so that the feeder cart 50 can be moved, and the feeder cart 50 is inserted into the main body by being moved in the Y direction which is the direction of the main body 1 by the handle 53a. At this time, the front end 53c of the side plate 53b of the handle portion 53 serves as a stopper that prevents the feeder cart 50 from being inserted any further.

An embodiment of the feeder 2 will be described with reference to FIG. The feeder 2 roughly includes an insertion gate unit 20, a supply tape insertion unit 30, an electronic component take-out unit 40, a sprocket drive unit 48, a cassette fixing unit 35, an interface 36, and a supply cassette control unit 37.
The insertion gate portion 20 is means for preventing the supply tape 60 from being overlaid, and the supply tape insertion portion 30 is a means for inserting the supply tape. The electronic component take-out unit 40 is a means for moving the electronic component to the take-out (suction) position S of the electronic component by the suction nozzle 17 which is the take-out means. Further, the sprocket driving unit 48 is a means for integrally driving three sprockets, which will be described later, constituting the supply tape inserting unit 30 and the electronic component extracting unit 40, and the cassette fixing unit 35 fixes the feeder to the feeder cart 50. It is means to do. Furthermore, the interface 36 exchanges signals with the main body 1 via a signal exchange cable (not shown). Further, the supply cassette control section 37 receives information from the main body and signals from sensors which will be described later in the feeder 2 and controls each section to exchange signals with the main body 1.
The supply tape 60 includes a carrier tape having an electronic component storage portion and a cover tape that covers the carrier tape. The carrier tape engages with a sprocket, which will be described later, on one end of the carrier tape to move the supply tape. Sprocket holes are provided at regular intervals.

  Hereafter, each part shown in FIG. 3 is demonstrated in order. First, the insertion gate portion 20 as an insertion opening / closing portion is a feeder into which an insertion port 21 into which a supply tape 60 can be inserted, a gate 22 that opens and closes the insertion port, a small motor 23 that moves the gate up and down, and a component supply tape 60 are inserted. It has LED25 which recognizes this. The insertion gate unit 20 opens and closes the gate based on a command from the main body 1 in order to prevent crossover when a new supply tape 60 is set in the feeder 30.

The supply tape insertion portion 30 includes a gate portion tape detection sensor 31 that detects the presence or absence of the supply tape 60 in the insertion gate portion 20 and an insertion sprocket 32 that sends the supply tape 60 to the suction position S side. The gate part tape detection sensor 31 has a V-shaped leaf spring 31a and an optical sensor 31b.
Presence / absence of the supply tape 60 is detected when the optical path blocking plate 31c provided at the center of the leaf spring 31a blocks the optical path of the optical sensor. As a result, the gate part tape detection sensor 31 plays two roles. The first is to detect that the supply tape 60 has been inserted from the insertion gate portion 20. The second is to detect the end of the supply tape by the rear end portion of the supply tape 60 passing through the gate tape detection sensor 31. On the other hand, the sprocket 32 is driven by the sprocket drive unit 48 and meshes with the sprocket hole of the supply tape 60 to move the supply tape 60 in the direction of arrow A.

The electronic component take-out unit 40 includes a drive sprocket 41, a guide mechanism 42, a pushing sprocket 43, a take-out port 44, a drive unit tape detection sensor 45, and a monitoring camera 49.
The drive sprocket 41 is a means for mainly driving the supply tape 60. The guide mechanism 42 has pressing means for pressing the supply tape 60 against the drive sprocket 41 so that the drive sprocket 41 reliably pushes out the sprocket hole 64 (see FIG. 3). The pushing sprocket 43 pushes its tip into the guide mechanism 42 when the supply tape 60 is set. The take-out port 44 is provided between the drive sprocket 41 and the push-in sprocket 43, and the suction nozzle 17 sucks electronic components from the take-out port 44. The drive unit tape detection sensor 45 is provided in front of the pushing sprocket 43 and detects the presence or absence of the supply tape. The monitoring camera 49 is a monitoring unit that monitors the movement of the supply tape 60.
The configuration of the drive unit tape detection sensor 45 is basically the same as that of the gate unit tape detection sensor 31.
The guide mechanism 42 has a configuration that enables the electronic tape to be taken out from the outlet 44 by cutting the cover tape on the insertion side of the supply tape 60.

The sprocket driving unit 48 includes three sprockets, that is, an insertion sprocket 32, a driving sprocket 41, and a pushing sprocket 43. The sprocket drive unit 48 includes worm wheels 32H, 41H, and 43H provided concentrically on the respective sprockets. Furthermore, the sprocket drive unit 48 includes a worm gear 46 that meshes with the worm wheel, and a sprocket drive motor 47 that drives each sprocket simultaneously via the worm gear.
As a result, the sprocket drive mechanism is simplified, and there is an advantage that it is not necessary to take the drive timing of the three sprockets and control is facilitated.

  Now, the control block configuration and the basic operation in the electronic component mounting apparatus as described above will be schematically described with reference to FIG. FIG. 4 is a control block diagram of an embodiment of the electronic component mounting apparatus of the present invention. In FIG. 4, for convenience, only one X-axis motor 412, Y-axis motor 49, θ-axis motor 415, vertical axis motor 414, etc. are shown. Further, in FIG. 1, most of the components shown in the control block diagram of FIG. 4 are omitted, but are connected to each component of the electronic component mounting apparatus 1 by an interface 434. The interface 434 is also coupled to a host control device such as an external host computer, and transmits and receives data and signals.

4, the control device of the electronic component mounting apparatus 1 has a control unit (CPU) 431 that performs overall control of operations related to electronic component mounting by accessing the components of the electronic component mounting apparatus 1 via the interface 434 and the like. (See the control unit 80 in FIG. 1), a RAM (Random Access Memory) 432 as a storage device, a ROM (Read Only Memory) 433 as a nonvolatile memory, and a nonvolatile memory 439 such as a hard disk. In the RAM 432, the mounting data including the X direction, Y direction, and angular position (θ rotation angle) information in the board P, the arrangement number information of each component supply area 13, and the like are stored in the board P for each mounting order of electronic components. Program data for each model such as the position of the mark attached to is stored.
The CPU 431 comprehensively controls operations related to the component mounting operation of the electronic component mounting apparatus 1 in accordance with the operation program stored in the ROM 433. That is, the CPU 431 controls driving of the X-axis motor 412 via the drive control circuit 426 and controls driving of the Y-axis motor 49 via the drive control circuit 427. The CPU 431 controls the driving of the θ-axis motor 415 via the drive control circuit 428, and further controls the driving of the vertical axis motor 414 via the drive control circuit 429.

Further, a nonvolatile memory 439 such as a hard disk is connected to the RAM 432. The CPU 431 outputs the data in the RAM 432 to the nonvolatile memory 439 at a predetermined cycle to prevent data loss. For example, the non-volatile memory 439 stores the model name produced (attached) in the past, the date and time of production, the program name, the number of products produced, and the like. Further, when the model switching operation is performed, the CPU 431 stores the model name, program name, production number, and the like of the model before the model switching in a nonvolatile manner before the data in the RAM 432 is overwritten with the data of the new model. To the memory 439.
As a result, even if the previous storage (data) of the data in the RAM 432 is erased, the data is not lost and remains as data stored in the electronic component mounting apparatus, and the production history is left for each electronic component mounting apparatus. Is possible.
Preferably, the CPU 431 and the non-volatile memory 439 are directly coupled so that the CPU 431 can directly read the data of the non-volatile memory 439.

Further, in the electronic component mounting apparatus, the image recognition processing unit 430 is coupled to the CPU 431 via the interface 434. The CPU 431 has a master station, and the image recognition processing unit 430 has a slave station.
That is, the CPU 431 controls the imaging operations of the board recognition camera 419 and the component recognition camera 420, and outputs a control signal to the image recognition processing unit 430 so as to perform recognition processing (calculation of misalignment amount) on the captured images. , Receive the recognition processing results. Conversely, the image recognition processing unit 430 executes processing instructed by the CPU 431 and outputs the processing result to the CPU 431.

For example, the image recognition processing unit 430 outputs a control signal to the board recognition camera 20 and instructs to image the mark on the board P and the mark on the main body 1 of the electronic component mounting apparatus described above. The board recognition camera 419 takes an image of the mark on the board P and the mark on the main body 1 of the electronic component mounting apparatus described above, and outputs the taken image to the image recognition processing unit 430.
In addition, for example, the image recognition processing unit 430 outputs a control signal to the component recognition camera 420 and instructs to image the electronic component sucked by the mounting head 6. The component recognition camera 420 captures the picked-up electronic component and outputs the captured image to the image recognition processing unit 430.
The image recognition processing unit 430 calculates the positional deviation amount and rotational deviation amount of the substrate P in the X and Y directions from the mark image on the substrate P captured by the substrate recognition camera 419. Further, the image recognition processing unit 430 calculates the relative positional deviation amount of the optical axis of the board recognition camera 419 with respect to the optical axis of the component recognition camera 420 from the mark image on the main body 1.
Further, the image recognition processing unit 430 uses the image recognition processing unit 430 to calculate the positional deviation amount and the rotational deviation amount of the electronic component in the X and Y directions based on the image of the electronic component captured by the component recognition camera 420.

As described above, the recognition processing unit 430 grasps these positional deviation amounts by the recognition processing and outputs the result to the CPU 431. The CPU 431 derives information to be corrected from the input result, and issues an instruction to the corresponding component for mounting the electronic component at the position to be mounted on the actual board P based on the derived correction information.
For example, the CPU 431 outputs a control signal to the drive control circuit 427, and the drive control circuit 427 controls the Y-axis motor 49 based on the control signal to move the mounting head body 11 in the Y direction. As a result, position correction in the Y direction is performed.
Further, for example, the CPU 431 outputs a control signal to the drive control circuit 426, and the drive control circuit 426 controls the X-axis motor 412 based on the control signal to move the mounting head body 11 in the X direction. Thereby, the position correction in the X direction is performed.
Further, for example, the CPU 431 outputs a control signal to the drive control circuit 428, and the drive control circuit 428 controls the θ-axis motor 415 based on the control signal to rotate the mounting head body 11 by θ. As a result, the rotational angle position around the vertical axis is corrected.

Of the above, the board recognition processing operation is executed only before the first electronic component mounting by each block. This is to reflect not only the characteristics of the substrate P but also the characteristics of each block, each mounting head, etc., in the component position correction.
In FIG. 4, an input device 435 is a keyboard, a pointing device, or the like that is input by an operator from the outside of the electronic component mounting device 1, and a monitor 436 is a variety of devices incorporated in the electronic component mounting device 1. The mounting data, the mounting condition data, the input image of the recognition component image, the processing result, or the like is displayed.

  For switching the model of the electronic component mounting apparatus 1, for example, the barcode reader of the board P that has been loaded is read by a barcode reader, and is automatically detected and switched. Further, for example, when the host computer transmits a board switching control signal to the CPU 431 to the electronic component mounting apparatus 1 via the interface 434, the CPU 431 of the electronic component mounting apparatus 1 executes the model change.

In addition to the automatic model switching described above, the operator can change the model directly. That is, when the operator gives an instruction to change the model from the input device 435 using a touch panel switch, a keyboard or the like (or reads the data corresponding to the model name information or the program name of the substrate P using a barcode reader), The CPU 431 activates the model switching program via the interface 434 and displays an operation screen on the monitor 436.
The above-described operation has been described with the CPU 431 and three types of storage means (RAM 432, ROM 433, and nonvolatile memory 439). However, the storage means need not be limited to these types of memories, and it goes without saying that the role of these memories may be executed by other storage means.

In the electronic component mounting apparatus 1 of the present invention, a plurality of feeder carts are prepared, and a feeder offset group data group (offset group) is defined for each feeder cart, and associated with the mounting data. The offset group data (offset data) includes, for each feeder cart, the name of the tape feeder stored, the type and location of the tape feeder, the type of tape, the name of the component stored in the tape, and the teaching of the suction position. Information such as (alignment) data (feeder exchange information) is stored. The offset data includes position correction data unique to each tape feeder.
The offset group and the offset data are associated with the feeder cart name. Therefore, if the feeder cart is associated with the model name of the board on which the component is to be mounted, the tape feeder stored in the feeder cart can be specified by specifying the model name. That is, a feeder cart name to be set in the component supply area 13 is determined from the model name, and a tape feeder stored in the feeder cart can be designated. When the model is changed, the offset data associated with the board name to be changed is reflected as feeder replacement information in the mounting data of the electronic component mounting apparatus.
Now, as described above, each feeder cart has its own offset data associated with the feeder cart. These data are stored in advance in the nonvolatile memory 439.
When one of the tape feeders stored in the tape feeder is replaced with another tape feeder, the suction position teaching is executed at that time, and the offset group data ( Offset data) The contents are updated.

When changing the model, if the feeder cart is replaced, the offset group data saved for each electronic component mounting device is automatically read out, and the feeder replacement information for each tape feeder stored in the feeder cart is read. Reflect in the mounting data.
As a result, the suction position teaching (feeder alignment), which has been performed as a setup operation when the model is changed, becomes unnecessary, and the setup operation time can be shortened.
When the offset group is associated with the mounting data for each board (model), for example, the name of the offset group is added to the end of the production model name or a predetermined location. In addition, the operator may input information regarding the replaced feeder cart using the input device 435, or an ID such as a barcode is attached to each feeder cart and read by a reader so that the CPU 431 recognizes the information. Anyway.

With reference to FIG. 5 and FIG. 6, a method for switching data contents of an offset group in changing the model of the electronic component mounting apparatus and electronic component mounting method of the present invention will be described. FIG. 5 is a schematic diagram for explaining a model change of the electronic component mounting apparatus and the electronic component mounting method of the present invention and a method of switching data contents of the offset group. FIG. 6 is a flowchart for explaining the operation procedure of the method of changing the model of the electronic component mounting apparatus and electronic component mounting method and the method of switching the contents of offset group data (offset data) according to the present invention.
5 and 6, the offset data is switched. However, only the feeder exchange information (teaching position teaching data) in the offset data may be executed.

  In FIG. 5, for example, the attachment data name when the production model name is “Product-2011-1234” and the offset group name is “A” is “Product-2011-1234A”. Further, for example, the name of the installed data when the production model name is “Product-52011-5678” and the offset group name is “B” is “Product-52011-5678B”. Also, for example, the name of the mounted data when the production model name is “Product-2011-0246” and the offset group name is “C” is “Product-2011-0246C”. Here, a feeder cart with an offset group name “A” is cart A, a feeder cart with an offset group name “B” is cart B, and a feeder cart with an offset group name “C” is cart C.

As shown in FIG. 5, when the electronic component mounting apparatus starts operation for the first time,
In step S1, first, it is assumed that the production model name is mounted on a substrate with “Product-2011-1234”. The operator determines that the offset group name is “A” and the feeder cart name “Cart A” from the mounting data name “Product-2011-1234A” of the production model, and the feeder cart of Cart A is the component of the electronic component mounting apparatus. Set (replace) in the supply area 13.
In step S2, the CPU 431 can browse a list of mounting data names and offset group names (referred to as offset group name lists in this document) corresponding to the production model name in the RAM 432 via the nonvolatile memory 439. The offset data of the corresponding model is read out to the RAM 432 via the memory 439, and written and stored as mounting data. The stored mounting data is used for subsequent component mounting. Thereafter, until the model is changed, the electronic component mounting apparatus mounts the electronic component with the stored mounting data. Note that the alignment of each tape feeder in the mounting data is always performed and the position is corrected, so that the position correction data for alignment is constantly updated.

If there is a model change, in step S3, it is assumed that the production model name is first mounted on a substrate with “Product-52011-5678”. The operator determines that the offset group name is “B” and the feeder cart name is “Cart B” from the mounting data name “Product-52011-5678B” of the production model. Then, the feeder cart set in the component supply area 13 of the electronic component mounting apparatus is replaced with a feeder cart used in a model to be changed. For example, the feeder cart of cart A is exchanged for the feeder cart of cart B.
In step S4, first, the CPU 431 stores the attachment data of the model used immediately before being updated and saved (for example, the offset group name of the board of “Product-2011-1234” is “A”) in the nonvolatile memory. 439 is written. In the nonvolatile memory 439, the previously stored offset group name “1234A”) is updated to the content of the new data.
In step S5, since the CPU 431 can browse the list of mounting data names and offset group names corresponding to the production model name in the RAM 432 via the nonvolatile memory 439, the offset of the model is stored in the RAM 432 via the nonvolatile memory 439. Data (for example, offset data whose offset group name is “B”) is read, written as attachment data, and stored. Thereafter, the electronic component mounting apparatus executes component mounting based on the stored mounting data.

Thereafter, the processes of steps S2 to S5 are repeatedly executed.
In step S6, it is assumed that the production model name is “Product-2011-0246”. The operator determines that the offset group name is “C” and the feeder cart name is “Cart C” from the mounting data name “Product-2011-0246C” of the production model. Then, the feeder cart set in the component supply area 13 of the electronic component mounting apparatus is replaced with a feeder cart used in a model to be changed. For example, the feeder cart of cart B is exchanged for the feeder cart of cart C.
In step S7, the CPU 431 first stores the mounting data of the model used immediately before being saved while being updated (for example, the offset group name of the board of “Product-52011-5678” is “B”) in the nonvolatile memory. 439 is written. In the non-volatile memory 439, the previously stored mounting data having the offset group name “5678B”) is updated to the contents of the new data.
In step S8, the CPU 431 can browse the list of the attached data name and offset group name corresponding to the production model name in the RAM 432 via the nonvolatile memory 439. Data (for example, offset data whose offset group name is “C”) is read, written as mounting data, and stored. Thereafter, the electronic component mounting apparatus executes component mounting based on the stored mounting data.
Finally, in step S9, before the production of the electronic component mounting apparatus is completed, the offset group name of the board (for example, “Product-2011-0246”) used immediately before being updated is stored. The mounting data of “C”) is written into the nonvolatile memory 439. In the nonvolatile memory 439, the previously stored offset group name “0246C”) is updated to the new data content.

The operation procedure of the CPU 431 will be described with reference to FIG. FIG. 6 is a flowchart for explaining a procedure executed by the CPU 431 after the electronic component mounting apparatus starts operating in the electronic component mounting apparatus and the electronic component mounting method of the present invention.
In step S51, the model name for starting production is read out from the host device by communication means such as a LAN (Local Area Network). Then, the offset data name corresponding to the read model name is extracted from the offset group name list.
In step S52, in addition to the offset data with the offset data name extracted in step S51, information data necessary for model switching is read from the nonvolatile memory 439.
In step S <b> 53, the read offset data is written in the mounting data in the RAM 432.
In step S54, components are mounted on one board.
In step S55, it is determined whether or not there is a cart exchange. If a cart replacement instruction has been input, the process branches to step S56. On the other hand, if there is no instruction to change the cart, the process returns to step S54 to mount components.

In step S56, the name of the model whose production is to be started is read from the host device by a communication means such as a LAN (Local Area Network). Then, the offset data name corresponding to the read model name is extracted from the offset group name list.
In step S57, in addition to the offset data of the offset data name extracted in step S56, information data necessary for model switching is read from the nonvolatile memory 439.
In step S58, the read offset data is written in the mounting data of the RAM 432.
In step S59, components are mounted on one board.
In step S60, it is determined whether the production is finished. When all production is finished, the operation of the electronic component mounting apparatus is stopped. On the other hand, if the production is not finished, the process returns to step S54 to mount the parts.

  In addition, even if the offset data name is written at the end of the model name when the model name to start production is read in step S51 or S56 in the flowchart of FIG. 6, the offset data exists in the memory. May not. In that case, when the model is switched to the model, new offset data is created and stored. For example, when there is no offset data for the board whose production model name is “Product-2011-0246”, there are no steps S1 and S2 in FIG. Therefore, the component mounting is executed after the suction position is taught. Thereafter, when the model is changed to the next board (step S3), a new board of “Product-2011-0246” is created and stored in step S4.

According to the above-described embodiment, the electronic component mounting apparatus and the electronic device that can secure the suction position accuracy at the start of operation of the apparatus and reduce the work time required for the setup change at the time of the model change even if the model is changed. A component mounting method can be realized.
In the above embodiment, when the model is changed, the position correction data of the board read from the storage means is the position correction data of the changed board among the position correction data of all the tape feeders in the feeder cart. Only the position correction data related to can be used.

  DESCRIPTION OF SYMBOLS 1: Electronic component mounting apparatus, 2: Feeder, 5a-5d: Chute, 6: Mounting head, 7: Delivery part, 11: Mounting head body, 13: Parts supply area, 16: Rail for forward / backward movement, 18: Left / right movement Rail: 19: Component recognition camera, 20: Insert gate part, 21: Insert port, 22: Gate, 23: Small motor, 25: LED, 30: Supply tape insertion part, 31: Gate part tape detection sensor, 31a: Leaf spring, 31b: optical sensor, 31c: optical path blocking plate, 32: insertion sprocket, 32H: worm wheel, 35: cassette fixing part, 36: interface, 37: supply cassette control part, 40: electronic component takeout part, 41: Drive sprocket, 41H: Worm wheel, 42: Guide mechanism, 43: Push-in sprocket, 43H Worm wheel, 44 (S): outlet, 45: drive unit tape detection sensor, 46: worm gear, 47: sprocket drive motor, 48: sprocket drive unit, 49: surveillance camera, 50: feeder cart, 51: base unit, 51a: Wheel fixing part, 51b: Lock pin, 52: Feeder fixing part, 52a: Feeder base, 52: Positioning hole, 52c: Feeder fixing part guide, 52d: Feeder signal connector, 52e: Feeder guide, 53: Handle part, 53a: handle, 53b: side plate, 53c: tip of the side plate 52b, 54: component supply reel storage unit, 60: component supply tape, 67: component supply reel, 80: control device, D, L: substrate transport line, LU, LD, RU, RD: block, P: substrate.

Claims (5)

At least a feeder cart that is set in a supply area and supplies electronic components, a mounting head that sucks and mounts electronic components from a tape feeder stored in the set feeder cart, From teaching means for teaching the suction position of the mounting head and generating position correction data, storage means for storing the position correction data for each feeder cart, and storage means for each feeder cart when changing the model An electronic component mounting apparatus comprising: a control unit that reads the position correction data and reflects it in the mounting data; and a control unit that controls the operation of the electronic component mounting apparatus,
The control means saves the position correction data in the storage means as the position correction data of the board before the model change if the mounting data includes the position correction data of the board before the model change when the model is changed. An electronic component mounting apparatus that updates and then reflects the board position correction data after the model change in the mounting data.   2. The electronic component mounting apparatus according to claim 1, wherein, when the model is changed, the feeder cart set from the supply area is replaced for each feeder cart.   The position correction data of the suction position of the tape feeder stored in the feeder cart set in the supply area for supplying electronic components is stored in the storage means for each feeder cart, and the electronic component mounting device is mounted when the model is changed. When the position correction data of the board before the model change is included in the data, the position correction data is saved or updated in the storage means as the position correction data of the board before the change, and then the board after the model change The electronic component mounting method is characterized in that the position correction data is reflected in the mounting data.   4. The electronic component mounting method according to claim 3, wherein when the model is changed, the feeder cart set from the supply area is replaced for each feeder cart.   5. The electronic component mounting method according to claim 3, wherein when the model is changed, the board position correction data read from the storage unit is the position correction data of all the tape feeders in the feeder cart. An electronic component mounting method comprising only position correction data relating to position correction data of a substrate after change.

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