JP2013200396A - Semiconductor element unit, flexible substrate, semiconductor element module, and camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the phenomenon that the center part of an FPC substrate is swollen.SOLUTION: A semiconductor element unit includes a base substrate 6 on one face of which an image sensor 1 is installed, a PAD6b connected to the image sensor 1 and exposing on a side of an opposite face of the base substrate 6, and a resist 6a formed to cover the side of the opposite face of the base substrate 6 excluding at least the exposed portion of the PAD6b. A ventilation groove 61 is formed in the resist 6a at least inwards from one end of the base substrate 6.

Description

  The present invention provides a semiconductor element unit including at least a base substrate on which a semiconductor element is installed and an electrode terminal electrically connected to the semiconductor element, and an electrode terminal electrically connected to the semiconductor element of the semiconductor element unit. The present invention relates to a flexible substrate provided, a semiconductor element module in which a semiconductor element unit is mounted on the flexible substrate, and a camera module.

  In recent years, with the increase in functionality and performance of integrated circuit packages as semiconductor element units, the materials used as components of the packages are electrically high-performance and optically high-performance materials. Has come to be used. A typical example of such an integrated circuit package is a package of a camera module built in a mobile phone or the like.

  The camera module is a semiconductor element module in which a semiconductor image sensor such as a charge coupled device (CCD) sensor and a complementary metal-oxide semiconductor (CMOS) sensor and an optical lens for connecting an image to a light receiving region of the semiconductor image sensor are combined. It is.

  An integrated circuit package used in this camera module includes an optical lens as a component of the package in order to realize a camera function.

  As an example of a technique related to such an integrated circuit package, there is a method for manufacturing a semiconductor device disclosed in Patent Document 1.

In this semiconductor device manufacturing method,
(Step a) A step of preliminarily fixing solder on a wiring pattern on a flexible printed circuit board (hereinafter simply referred to as “flexible substrate” or “FPC substrate”) to be connected to the electrodes of the integrated circuit package;
(Step b) heating the FPC board to bring the solder into a molten state;
(Step c) including a step of pressing the integrated circuit package against the FPC board to electrically connect the FPC board and the integrated circuit package via solder.

JP 2010-256495 A (published November 11, 2010)

  However, the semiconductor device manufacturing method disclosed in Patent Document 1 has the following problems.

  For example, FIG. 9A shows the state of the integrated circuit package 100, the FPC board 200, and the heater tool 300 in the above (step c).

  As shown in the figure, in the above (step c), the pressure (the direction of the pressure is the pressure) that the resist 106a of the base substrate 106 on the integrated circuit package 100 side and the cover lay 200a of the FPC substrate 200 hold down the integrated circuit package 100. The direction of the arrow shown in the figure) and the pressure by the heater tool 300 pressed against the FPC board are heated in a joined state (so-called hot plate connection).

  At this time, in the region A shown in the figure, the resist 106a of the integrated circuit package 100 and the cover lay 200a of the FPC board 200 are in close contact with each other, but the pressure of the heater tool 300 is not transmitted to the region B. There is a slight gap (not shown). Therefore, in the region B, there is a slight layer of air 400 (not shown; see FIG. 9B) between the base substrate 106 and the FPC substrate 200.

  In this state, when heating by the heater tool 300 continues, the air 400 starts to expand. As described above, the resist 106a of the base substrate 106 on the integrated circuit package 100 side and the coverlay 200a of the FPC substrate 200 are provided. Is in close contact with the area A where the heater tool 300 is pressed, and the expanded air 400 cannot move out of the area B.

  Therefore, the portion of the region B between the integrated circuit package 100 and the FPC board 200 is sealed in a state where the air 400 cannot escape.

  For this reason, the sealed air 400 continues to expand due to the heat generated by the heater tool 300, and as shown in FIG. 9B, the vicinity of the center portion of the FPC board 200 is expanded in the direction of pushing downward with respect to the paper surface. Result.

  As described above, the inventor of the present invention newly explained that the presence of the slight air 400 layer in the gap in the region B described above may contribute to the phenomenon that the central portion of the FPC board 200 swells. I found it.

  The present invention has been made in view of the above-described conventional problems, and an object thereof is to provide a semiconductor element unit or the like that can suppress deformation of an FPC board when hot plate connection is performed.

  In order to solve the above problems, a semiconductor element unit of the present invention includes a base substrate having a semiconductor element installed on one surface side, and the one surface of the base substrate that is electrically connected to the semiconductor element. A semiconductor element unit comprising: an electrode terminal exposed on the side of the opposing surface facing the substrate; and a resist formed so as to cover the side of the opposing surface of the base substrate except at least a portion where the electrode terminal is exposed. In the in-plane direction of the base substrate, at least one ventilation groove for allowing gas to pass from at least one end of the base substrate to the inside of the base substrate is formed in the resist. And

  According to the above configuration, at least one ventilation groove for allowing gas to pass from at least one end of the base substrate toward the inside of the base substrate is formed in the resist along the in-plane direction of the base substrate. For this reason, when hot plate connection with the flexible substrate described later is performed, even if air accumulated between the resist and the cover lay of the flexible substrate described later is thermally expanded in the vicinity of the center portion of the base substrate, the outside is passed through the ventilation groove. Therefore, the phenomenon that the vicinity of the center portion of the FPC board swells can be suppressed. Therefore, deformation of the flexible substrate can be suppressed. One ventilation groove may be formed or a plurality of ventilation grooves may be formed.

When the shape of the base substrate is a rectangle,
(1) The ventilation groove may be formed along at least one side of the rectangle,
(2) Moreover, the said ventilation groove | channel may be formed along the diagonal of the said rectangle.

In the case of (1) or (2) above,
The ventilation groove may be formed from the one end of the base substrate toward the center of the base substrate.

On the other hand, in the case (1) or (2) above,
The ventilation groove may be formed so as to pass through the resist from the one end of the base substrate toward the other end of the base substrate.

  In addition, the flexible substrate of the present invention includes a wiring substrate, an electrode terminal exposed on one surface side of the wiring substrate, and at least one portion where the electrode terminal is exposed. A flexible printed circuit board comprising a cover lay formed so as to cover, for passing gas from at least one end of the wiring board toward the inside of the wiring board along an in-plane direction of the wiring board. At least one ventilation groove is formed in the coverlay.

  According to the above configuration, at least one ventilation groove for allowing gas to pass from at least one end of the wiring board to the inside of the wiring board is formed in the cover lay along the in-plane direction of the wiring board. Therefore, when the semiconductor element unit is connected to the hot plate, even if the air accumulated between the resist of the semiconductor element unit and the cover lay near the center of the wiring board is thermally expanded, it escapes to the outside through the ventilation groove. Therefore, deformation of the flexible substrate can be suppressed. One ventilation groove may be formed or a plurality of ventilation grooves may be formed.

In addition, when the shape of the wiring board is a rectangle,
(3) The ventilation groove may be formed along at least one side of the rectangle,
(4) Moreover, the said ventilation groove | channel may be formed along the diagonal of the said rectangle.

In the case of (3) or (4) above,
The ventilation groove may be formed from the one end of the wiring board toward the center of the wiring board.

On the other hand, in the case of (3) or (4) above,
The ventilation groove may be formed so as to pass through the resist from the one end of the wiring board toward the other end of the wiring board.

  Further, the semiconductor element module of the present invention, except for any one of the above semiconductor element units, a wiring board, an electrode terminal exposed on one surface side of the wiring board, and at least a portion where the electrode terminal is exposed, A flexible substrate having a cover lay formed to cover one surface side of the wiring board, and a resist formed on the base substrate and formed on the wiring board A coverlay may be joined, and the electrode terminal of the base substrate in the semiconductor element unit and the electrode terminal of the wiring board in the flexible substrate may be electrically connected via a bonding agent.

  According to the said structure, the semiconductor element module in which the deformation | transformation of the flexible substrate was suppressed is realizable.

  According to another aspect of the present invention, there is provided a semiconductor element module comprising: the flexible substrate according to any one of the above items; a base substrate in which a semiconductor element is disposed on one surface side; and the base substrate electrically connected to the semiconductor element. An electrode terminal exposed on the facing surface facing the one surface of the substrate, and a resist formed so as to cover the facing surface side of the base substrate except at least a portion where the electrode terminal is exposed. A semiconductor device comprising: a semiconductor device comprising: a resist formed on the base substrate and a cover lay formed on the wiring substrate are bonded together, and the base substrate in the semiconductor element unit is The electrode terminal and the electrode terminal of the wiring board in the flexible substrate may be electrically connected via a bonding agent.

  According to the said structure, the semiconductor element module in which the deformation | transformation of the flexible substrate was suppressed is realizable.

  The camera module of the present invention is a camera module as one of the semiconductor element modules described above, wherein the semiconductor element is a semiconductor image sensor, and an image is formed on a light receiving region of the semiconductor image sensor as the semiconductor element. An optical lens for tying may be provided.

  According to the said structure, the camera module in which the deformation | transformation of the flexible substrate was suppressed is realizable.

  As described above, in the semiconductor element unit of the present invention, at least one ventilation groove for allowing gas to pass from at least one end of the base substrate toward the inside of the base substrate is formed in the resist along the in-plane direction of the base substrate. It is what has been.

  In addition, as described above, the flexible substrate of the present invention has at least one ventilation groove for passing gas from at least one end of the wiring substrate toward the inside of the wiring substrate along the in-plane direction of the wiring substrate. Is formed.

  Therefore, there is an effect that deformation of the flexible substrate can be suppressed.

It is a longitudinal cross-sectional view which shows the structure of one Embodiment of the semiconductor element unit (integrated circuit package) in this invention. It is a figure which shows the structure of the base substrate before forming a ventilation groove. It is a figure for demonstrating the connection process (hotplate connection) with a semiconductor element unit and an FPC board (wiring board), (a) shows the mode before a connection with a semiconductor element unit and an FPC board, (B) shows a state in which the electrode terminal of the semiconductor element unit and the solder applied to the electrode terminal of the FPC board are in contact with each other, and (c) shows a state when pressure is applied in the state of (b). (D) schematically shows a state in which the resist of the semiconductor element unit and the coverlay of the FPC board are in contact with each other by the pressurization of (c). It is a figure which shows the structure of a heater tool, (a) shows the structure of the side in which the hollow of the heater tool is formed, (b) shows the aa 'cross section of the heater tool shown to (a). It is sectional drawing. It is a figure which shows the example of the ventilation groove formed in the base substrate regarding the said semiconductor element unit, (a) shows an example of the said ventilation groove, (b) shows another example of the said ventilation groove, (C) shows still another example of the vent groove, (d) shows still another example of the vent groove, and (e) shows still another example of the vent groove. It is a figure which shows a mode when the semiconductor element unit in which the ventilation groove | channel shown to Fig.5 (a) was formed was hotplate-connected to the FPC board | substrate. It is a figure which shows the example of the ventilation groove | channel formed in the FPC board regarding the said FPC board, (a) shows an example of the said ventilation groove, (b) shows another example of the said ventilation groove, c) shows still another example of the ventilation groove, (d) still another example of the ventilation groove, and (e) yet another example of the ventilation groove. It is a figure which shows a mode when a semiconductor element unit is hotplate-connected to the FPC board in which the ventilation groove | channel shown to Fig.7 (a) was formed. It is a figure for demonstrating the subject of a prior art, (a) shows a mode when a semiconductor element unit is hotplate-connected to an FPC board, (b) shows the phenomenon that the center part vicinity of an FPC board swells. Shows what happened.

  An embodiment of the present invention will be described below with reference to FIGS. In addition, although description may be abbreviate | omitted as needed about structures other than the structure demonstrated by the following specific items, when it demonstrates by another item, it is the same as that structure. For convenience of explanation, members having the same functions as those shown in each item are given the same reference numerals, and the explanation thereof is omitted as appropriate. In addition, the shape and size of each component described in each drawing do not reflect the actual shape and size, but are changed as appropriate for clarity and simplification of the drawing.

[1. Regarding Integrated Circuit Package 10]
An integrated circuit package (semiconductor element unit) 10 according to an embodiment of the present invention will be described with reference to FIG. In the present embodiment, an integrated circuit package of a so-called camera module (semiconductor element module) will be described as an embodiment of the semiconductor element unit of the present invention.

  However, the form to which the present invention can be applied is not limited to the camera module as in the present embodiment. That is, as long as it is an integrated circuit package (semiconductor element unit) of a semiconductor element module mounted on a flexible printed circuit board (hereinafter simply referred to as “FPC board”) by so-called hot plate connection, any form is possible. good.

(Integrated circuit package 10)
As shown in FIG. 1, an integrated circuit package 10 of this embodiment includes an image sensor (semiconductor element, semiconductor image sensor) 1, an imaging lens (optical lens) 2, a lens holder 3, a module housing 4, an infrared cut filter 5, At least a base substrate 6 is provided.

  In addition, the integrated circuit package 10 may include, for example, a DSP (Digital Signal Processor), not shown, as various components that are normally provided in the integrated circuit package.

  In the integrated circuit package 10, light is focused on the light receiving region of the image sensor 1 through the imaging lens 2. As a result, image data is output from the image sensor 1 and sent to the DSP. In the DSP, the unprocessed image data obtained from the image sensor 1 is processed into image data required by the user such as color correction, and the integrated circuit package 10 outputs the processed image data to the outside.

  Next, each component of the integrated circuit package 10 will be described below.

(Image sensor 1)
The image sensor 1 is a semiconductor image sensor (semiconductor element), and examples thereof include a solid-state imaging element such as a CCD (Charge Coupled Device) image sensor and a CMOS (complementary metal-oxide semiconductor) sensor. The semiconductor element is not limited to the solid-state imaging element, and may be any semiconductor element or semiconductor integrated circuit selected according to the function of the integrated circuit package 10.

(Imaging lens 2)
The imaging lens (optical lens) 2 is an optical lens for forming an image on a light receiving region (not shown) of the image sensor 1. Examples of the material of the imaging lens 2 include a plastic material made of a polymer resin such as acrylic resin, polycarbonate resin, and cycloolefin resin. The heat resistance temperature of these plastic materials is generally about 120 ° C., and the heat resistance temperature of these resins is lower than the melting temperature of solder (bonding agent) 20d described later. In addition, as a material of the imaging lens 2, a high heat resistant resin or a glass material may be used.

(Lens holder 3)
The lens holder 3 holds the imaging lens 2, and the material can be exemplified by the plastic material.

(Module housing 4)
The module housing 4 is a housing for housing the image sensor 1, the imaging lens 2, the lens holder 3, an infrared cut filter 5 to be described later, and the like, and examples of the material include the plastic material described above. .

(Infrared cut filter 5)
The infrared cut filter 5 is a filter that blocks light in the infrared region, and examples of the material thereof include the plastic materials described above.

(Base substrate 6)
The base substrate 6 of the present embodiment is made of ceramic, but the material of the base substrate is not limited to this, and may be a glass epoxy substrate, a phenol substrate, or the like.

  As shown in FIG. 1, the image sensor 1 is installed on one surface (upper side of the paper surface) of the base substrate 6 and is electrically connected to a wiring pattern formed on the base substrate 6 by bonding.

  Here, based on FIG. 2, the structure of the opposing surface (surface below the paper surface of FIG. 1) facing the one surface of the base substrate 6 in a state where a ventilation groove to be described later is not formed will be described. . FIG. 2 shows the structure of the base substrate 6 when viewed from the side of the facing surface of the base substrate 6 (downward with respect to the paper surface of FIG. 1).

  As shown in the figure, a resist 6 a made of an insulator is formed on the facing surface of the base substrate 6 so as to cover the facing surface of the base substrate 6. However, the resist 6a does not cover the entire opposite surface of the base substrate 6, and grooves 6c (or openings) that are not covered with the resist 6a are formed at a plurality of locations.

  In each of the grooves 6c (or openings), a PAD (electrode terminal) 6b is exposed, and the PAD 6b is electrically connected to a wiring pattern formed on the base substrate 6. In other words, there is a step between the exposed surface of the PAD (electrode terminal) 6a (the surface below the paper surface of FIG. 1) and the surface of the resist 6a of the base substrate 6 (that is, the resist surface). The PAD 6b is made of a conductive material, and is a metal such as copper, for example.

(About hot plate connection)
Next, hot plate connection will be described with reference to FIG. FIG. 3 is a diagram for explaining a connection process (hot plate connection) between the integrated circuit package 10 and an FPC board 20 described later.

  FIG. 3A shows a state before the integrated circuit package 10 and the FPC board 20 are connected. 3B shows a state in which the PAD 6b of the integrated circuit package 10 and the solder 20d applied to the PAD (electrode terminal) 20b of the FPC board 20 are in contact with each other.

  Next, FIG.3 (c) shows a mode when it pressurizes in the state of FIG.3 (b). Finally, FIG. 3D schematically shows a state where the resist 6a of the integrated circuit package 10 and the cover lay 20a of the FPC board 20 are in contact with each other by the pressurization of FIG.

  As shown in the figure, hot plate connection is performed by applying solder 20d to a PAD 20b of an FPC board (wiring board) 20 described later in advance and superimposing it on the integrated circuit package 10 so that the heater tool 30 is attached from the FPC board 20 side. In this technique, the solder 20d is melted by being pressed and is connected to the integrated circuit package 10.

  Each process of this hot plate connection is as follows.

  (1) First, as shown in FIG. 3A, solder 20d is applied in advance to the PAD 20b of the FPC board 20 or the PAD 6b of the base board 6 on the integrated circuit package 10 side. 3A shows an example in which the solder 20d is applied to the PAD 20b of the FPC board 20. FIG. In this embodiment, the solder 20d is fixed to the PAD 20b by a method of applying cream solder. However, other methods for fixing the solder 20d may include a solder plating method and a method of arranging solder balls. The melting point of the solder 20d is 183 ° C. for eutectic solder, about 220 ° C. for general lead-free solder, and 140 ° C. for low-melting lead-free solder.

  (2) Next, as shown in FIG. 3B, the integrated circuit package 10 and the FPC board 20 are placed so that the PAD 6b of the base board 6 and the PAD 20b of the FPC board 20 face each other (so as to face each other). Overlapping. At this time, the PAD 6b of the base substrate 6 and the solder 20d applied to the PAD 20b of the FPC substrate 20 are kept in contact with each other.

  (3) Next, as shown in FIG. 3C, the heater tool 30 is pressed against the back surface (the lower surface relative to the paper surface) of the FPC board 20, and at the same time, the integrated circuit package 10 is pressurized from the top surface side. Add In this state, the temperature of the heater tool 30 is raised and heated until the solder 20d is melted.

  (4) Then, as shown in FIG. 3D, the solder 20d is crushed by melting, and the resist 6a of the base substrate 6 and the cover lay 20a of the FPC substrate 20 are brought into close contact with each other. In other words, the groove 6c and the groove 20c facing each other are the overlapping of the recesses, and become a sealed space.

  As a result, the molten solder 20d is prevented from protruding from this space, and the integrated circuit package 10 and the FPC board 20 can be connected without short-circuiting the adjacent PAD 6b and PAD 20b. Thereafter, when the heater tool 30 is overheated and cooled, the solder 20d is solidified, and the connection between the integrated circuit package 10 and the FPC board 20 is completed.

  In order to achieve the initial object of the present invention, in the above hot plate connection, a single or plural ventilation grooves are provided in at least one of the resist 6a of the base substrate 6 and the cover lay 20a of the FPC substrate 20. Just do it.

  Moreover, as an example of the ventilation groove provided in the resist 6a of the base substrate 6, the forms shown in FIGS. 5A to 5E which will be described later can be listed, but the present invention is not limited to this. Any ventilation groove may be used as long as it can suppress the phenomenon of swelling in the vicinity.

  Similarly, as an example of the ventilation groove provided in the cover lay 20a of the FPC board 20, the forms shown in FIGS. 7A to 7E which will be described later can be listed, but the present invention is not limited thereto. Any form that can suppress the phenomenon in which the vicinity of the central portion swells may be used.

(Heater tool 30)
Next, the structure of the heater tool 30 described above will be described with reference to FIG. FIG. 4A shows the structure on the side where the recess 30b of the heater tool 30 is formed. On the other hand, FIG.4 (b) is sectional drawing which shows the aa 'cross section of the heater tool 30 shown to Fig.4 (a).

  As shown in the figure, the heater tool 30 mainly includes a heat source 30a, and a recess 30b is formed on one surface side of the heat source 30a (side to be brought into contact with the FPC board 20). That is, the central portion of the heat source 30a is cut out, and a step is provided on one surface side of the heat source 30a (between the surface of the heat source 30a and the bottom surface of the groove of the recess 30b).

(Heat source 30a)
The heat source 30a is made of a material having good thermal conductivity. For example, metals such as aluminum and copper can be listed.

(Dent 30b)
The depression 30b is formed so that only the portion of the FPC board 20 where the PAD 20b is disposed can be heated.

  That is, the shape of the heater tool 30 shown in FIG. 4 is formed in consideration of the case where the arrangement of the PAD 20b of the FPC board 20 is the same arrangement as the PAD 6b of the base board 6 as shown in FIG.

  In addition, when hot plate connection is performed using the heater tool 30 in which the central portion is hollowed out as described above, a phenomenon in which the vicinity of the central portion of the FPC board 20 swells occurs and the FPC board 20 is deformed. There is a problem that this may occur (see FIG. 9).

[2. About the characteristic structure of the base substrate 6]
Next, a characteristic structure of the base substrate 6 newly found by the inventors of the present invention in order to solve the above problems will be described with reference to FIGS.

  FIG. 5 is a diagram showing an example of ventilation grooves formed in the base substrate 6 with respect to the integrated circuit package 10. FIG. 6 is a diagram showing a state when the integrated circuit package 10 in which the ventilation groove 61 shown in FIG. 5A is formed is connected to the FPC board 20 by hot plate.

  As shown in FIG. 5A to FIG. 5E, in the base substrate 6, gas is supplied from at least one end of the base substrate 6 toward the inside of the base substrate 6 along the in-plane direction of the base substrate 6. A characteristic structure is that at least one ventilation groove 61 to 65 for passage is formed in the resist 6a. It is preferable that the groove 6c and the ventilation grooves 61 to 65 do not overlap with each other, but there may be a portion that partially overlaps.

  The number of ventilation grooves may be plural as shown in FIG. In the example shown in FIG. 5C, in the vicinity of each of the two sides of the base substrate 6, two ventilation grooves 63 are formed along these sides.

The forms of the ventilation grooves 61 to 65 of the base substrate 6 shown in FIGS. 5A to 5E are classified as follows.
(1) As shown in FIGS. 5A to 5C, the ventilation groove may be formed along at least one side of the base substrate 6 (rectangular shape) (see the ventilation grooves 61 to 63).
(2) Moreover, the ventilation groove | channel may be formed along the diagonal of the said rectangle, as shown to FIG.5 (d) and FIG.5 (e) (refer ventilation grooves 64 and 65).

  Further, in the case (1) or (2), the ventilation groove may be formed from one end of the base substrate 6 toward the center as shown in FIGS. 5 (a) and 5 (d). (See ventilation grooves 61 and 64).

  On the other hand, in the above case (1) or (2), as shown in FIGS. 5B and 5E, the ventilation groove passes through the resist 6a from one end of the base substrate 6 toward the other end. It may be formed (to cut through or to be divided).

  As described above, when the hot plate connection is made with the FPC board 20 (the ventilation groove may be formed as shown in FIG. 7 or the ventilation groove may not be formed), the vicinity of the center portion of the base substrate 6 In FIG. 6, even if the air accumulated between the resist 6a and the cover lay 20a of the FPC board 20 (near the region B) is thermally expanded, as shown in FIG. 6, the ventilation groove 61 (or the ventilation grooves 62 to 65 or the FPC) Since it escapes to the outside through the ventilation grooves formed in the substrate 20, it is possible to suppress the phenomenon that the vicinity of the center portion of the FPC substrate 20 swells. Therefore, deformation of the FPC board 20 can be suppressed.

[3. About the characteristic structure of the FPC board 20]
(FPC board 20)
The FPC board 20 of the present embodiment uses a flexible board mainly composed of polyimide. However, the FPC board 20 is not limited to such a board, and may be, for example, a glass epoxy board or a phenol board.

  As shown in FIG. 7A, a cover lay 20a made of an insulator is formed on one surface of the FPC board 20 (upper side of the paper shown in FIG. 8) so as to cover one surface of the FPC board 20. Has been. However, the cover lay 20a does not cover the entire surface of one surface of the FPC board 20, and grooves 20c (or openings) that are not covered by the cover lay 20a are formed at a plurality of locations.

  In each of the grooves 20c (or openings), the PAD 20b is exposed, and the PAD 20b is electrically connected to the wiring pattern formed on the FPC board 20. That is, there is a step between the surface of the PAD 20b (the upper surface with respect to the paper surface of FIG. 8) and the surface of the cover lay 20a of the FPC board 20 (that is, the cover lay surface). Note that the PAD 20b is made of a conductive material, and is, for example, a metal such as copper.

  Next, a characteristic structure of the FPC board 20 newly found by the inventor of the present invention will be described with reference to FIGS.

  FIG. 7 is a diagram illustrating an example of a ventilation groove formed in the FPC board 20. FIG. 8 is a diagram showing a state when the integrated circuit package 10 is hot-plate connected to the FPC board 20 in which the ventilation grooves 21 shown in FIG. 7A are formed.

  As shown in FIG. 7A to FIG. 7E, in the FPC board 20, along the in-plane direction of the FPC board 20, gas is directed from at least one end of the FPC board 20 toward the inside of the FPC board 20. A characteristic structure is that at least one ventilation groove 21 to 25 is formed in the cover lay 20a. It is preferable that the groove 20c and the ventilation grooves 21 to 25 do not overlap with each other, but there may be a portion that partially overlaps.

  Note that the number of ventilation grooves may be plural as shown in FIG. In the example shown in FIG. 7C, in the vicinity of each of the two sides of the FPC board 20, two ventilation grooves 23 are formed along these sides.

The forms of the ventilation grooves 21 to 25 of the FPC board 20 shown in FIGS. 7A to 7E are classified as follows.
(3) The ventilation groove may be formed along at least one side of the FPC board 20 (rectangular shape) as shown in FIGS. 7A to 7C (see the ventilation grooves 21 to 23).
(4) Moreover, the ventilation groove | channel may be formed along the diagonal line of the said rectangle, as shown to FIG.7 (d) and FIG.7 (e) (refer ventilation groove | channels 24 and 25).

  In the case (3) or (4), the ventilation groove is formed from one end of the FPC board 20 toward the center of the FPC board 20, as shown in FIGS. 7 (a) and 7 (d). May be provided (ventilation grooves 61 and 64).

  On the other hand, in the case (3) or (4), the ventilation groove covers from one end of the FPC board 20 to the other end of the FPC board 20 as shown in FIGS. It may be formed so as to pass through the lay 20a (so as to cut through or divide).

  As described above, when the hot plate connection is made to the integrated circuit package 10 (the ventilation groove may be formed in the base substrate 6 as shown in FIG. 5 or the ventilation groove may not be formed), As shown in FIG. 8, even if the air accumulated between the cover lay 20a and the resist 6a of the integrated circuit package 10 (near the region B) is thermally expanded in the vicinity of the central portion of the airflow 20, as shown in FIG. Since the grooves 22 to 25 or the ventilation grooves formed in the base substrate 6 of the integrated circuit package 10) escape to the outside, it is possible to suppress the phenomenon that the vicinity of the central portion of the FPC substrate 20 swells. Therefore, deformation of the FPC board 20 can be suppressed.

[Another expression of the present invention]
The present invention can also be expressed as follows.

  That is, the camera module of the present invention is a camera module in which a camera lens unit including a lens and an image sensor on a wiring board is mounted on a flexible board, and includes an opening that exposes the electrode terminal of the wiring board. In the region where the resist and the camera lens unit are mounted, a coverlay having an opening exposing the electrode terminal of the flexible substrate is in contact with each other, and the electrode terminal of the wiring substrate and the flexible substrate The electrode terminals may be connected via a bonding member (solder), and at least one slit (vent hole, vent groove) may be formed in the resist.

In the camera module of the present invention, the slit may be formed from the vicinity of the center toward the outer periphery.
In the camera module of the present invention, the slit may be formed so as to divide the resist.

  In the camera module of the present invention, the slit may be formed toward the opposing outer periphery.

  According to the above camera module, when the hot plate is connected, even if the air accumulated between the wiring board and the flexible board thermally expands, it escapes to the outside through the slits (vents and vents), so the flexible board is deformed. Can be suppressed.

[Additional Notes]
Note that the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims, and can be obtained by appropriately combining technical means disclosed in different embodiments. Embodiments are also included in the technical scope of the present invention.

  The present invention can be widely applied to a semiconductor element unit (or a semiconductor integrated circuit package) in which semiconductor elements are installed, an FPC board, and a semiconductor element module in which these are mounted by hot plate connection. For example, the present invention can be applied to an imaging lens unit in which a semiconductor image sensor is installed, an FPC board, and a camera module in which these are mounted by hot plate connection.

1 Image sensor (semiconductor element, semiconductor image sensor)
2 Imaging lens (optical lens)
6 Base substrate 6a Resist 6b PAD (electrode terminal)
6c Groove (or opening)
10 Integrated circuit package (semiconductor element unit)
20 FPC board (flexible board, wiring board)
20a Coverlay 20b PAD (electrode terminal)
20c groove (or opening)
20d Solder (bonding agent)
21-25 Ventilation groove 30b Recess 61-65 Ventilation groove

Claims (13)

A base substrate on which a semiconductor element is installed on one surface side;
An electrode terminal electrically connected to the semiconductor element and exposed on a side of the facing surface facing the one surface of the base substrate;
A semiconductor element unit comprising a resist formed so as to cover the opposite surface side of the base substrate except at least a portion where the electrode terminal is exposed,
At least one ventilation groove for allowing gas to pass from at least one end of the base substrate toward the inside of the base substrate along the in-plane direction of the base substrate is formed in the resist. Element unit. The base substrate has a rectangular shape,
The ventilation groove is
The semiconductor element unit according to claim 1, wherein the semiconductor element unit is formed along at least one side of the rectangle. The base substrate has a rectangular shape,
The ventilation groove is
The semiconductor element unit according to claim 1, wherein the semiconductor element unit is formed along a diagonal line of the rectangle. The ventilation groove is
4. The semiconductor element unit according to claim 2, wherein the semiconductor element unit is formed from the one end of the base substrate toward the center of the base substrate. The ventilation groove is
4. The semiconductor element unit according to claim 2, wherein the semiconductor element unit is formed so as to pass through the resist from the one end of the base substrate toward the other end of the base substrate. A wiring board;
An electrode terminal exposed on one surface side of the wiring board;
A flexible substrate comprising: a cover lay formed so as to cover at least one surface side of the wiring substrate except for a portion where the electrode terminal is exposed;
At least one ventilation groove for allowing gas to pass from at least one end of the wiring board to the inside of the wiring board along the in-plane direction of the wiring board is formed in the coverlay. Flexible substrate. The shape of the wiring board is rectangular,
The ventilation groove is
The flexible substrate according to claim 6, wherein the flexible substrate is formed along at least one side of the rectangle. The shape of the wiring board is rectangular,
The ventilation groove is
The flexible substrate according to claim 6, wherein the flexible substrate is formed along a diagonal line of the rectangle. The ventilation groove is
The flexible substrate according to claim 7, wherein the flexible substrate is formed from the one end of the wiring substrate toward a center of the wiring substrate. The ventilation groove is
9. The flexible substrate according to claim 7, wherein the flexible substrate is formed so as to pass through the cover lay from the one end of the wiring substrate toward the other end of the wiring substrate. The semiconductor element unit according to any one of claims 1 to 5,
Except for the wiring board, the electrode terminal exposed on one surface side of the wiring board, and at least the portion where the electrode terminal is exposed, a coverlay formed to cover the one surface side of the wiring board A semiconductor device comprising: a flexible substrate comprising:
The resist formed on the base substrate and the cover lay formed on the wiring substrate are joined,
The semiconductor element module, wherein the electrode terminal of the base substrate in the semiconductor element unit and the electrode terminal of the wiring board in the flexible substrate are electrically connected via a bonding agent. A flexible substrate according to any one of claims 6 to 10,
A base substrate having a semiconductor element disposed on one surface side, an electrode terminal electrically connected to the semiconductor element and exposed on a facing surface facing the one surface of the base substrate, and at least the above A semiconductor device comprising: a semiconductor element unit including a resist formed so as to cover the side of the facing surface of the base substrate except for a portion where the electrode terminal is exposed;
The resist formed on the base substrate and the cover lay formed on the wiring substrate are joined,
The semiconductor element module, wherein the electrode terminal of the base substrate in the semiconductor element unit and the electrode terminal of the wiring board in the flexible substrate are electrically connected via a bonding agent. A camera module as a semiconductor element module according to claim 11 or 12,
The semiconductor element is a semiconductor image sensor,
A camera module comprising an optical lens for forming an image on a light receiving region of the semiconductor image sensor as the semiconductor element.

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