JP2013198859A - Protective film coating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a protective film coating apparatus that can easily remove a water soluble resin comprising a protective film from the inside of a housing.SOLUTION: A protective film forming and cleaning means 70 as a protective film coating apparatus applies a protective film onto the upper surface of a wafer. The protective film forming and cleaning means 70 includes: a spinner table 71 that rotatably adsorbs and holds the wafer; a coating nozzle 73 that applies a liquid resin to be a protective film onto the upper surface of the wafer; and a housing 72 that accommodates the spinner table 71 and coating nozzle 73. A laminated sheet is laid on the inner surface of a cylindrical portion 76a of the housing 72, the upper surface of a bottom portion 76b thereof, and the lower surface of a lid 77 thereof. The laminated sheet is laid on the inner surface of the cylindrical portion 76a of the housing 72, the upper surface of a bottom portion 76b thereof, and the lower surface of the lid 77 thereof so that a pressure sensitive adhesive sheet whose entire surface is comprised of an adhesive sheet is laminated by allowing a plurality of the pressure sensitive adhesive sheets to be peeled off each other.

Description

  The present invention relates to a protective film coating apparatus for coating a protective film of a water-soluble resin on the upper surface of a wafer such as a semiconductor wafer.

  The laser beam is applied to the planned division line of semiconductor wafers with devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) and sapphire wafers with devices such as LED (Light Emitting Diode) elements. Irradiation and formation of grooves on the upper surface divide into individual devices, and electronic devices such as mobile phones, PCs (Personal Computers), and LED lights are manufactured.

  In order to perform laser processing on a semiconductor wafer, a laser beam having a wavelength that absorbs the wafer is irradiated with the semiconductor wafer adhered to a dicing tape held on a chuck table (see, for example, Patent Document 1). .

  In addition, the technology for forming a laser processing groove by irradiating a wafer with a laser beam removes a fragile Low-k film that is difficult to cut by a blade using a conventional dicing apparatus, or a very hard material (sapphire, etc.). It has come to be used for the processing of. However, if thermal energy is concentrated in the region irradiated with the laser beam and debris is generated and the debris adheres to the device surface, there arises a problem that the quality of the device is deteriorated. In recent years, therefore, a water-soluble resin such as PVA (polyvinyl alcohol) or PEG (polyethylene glycol) is applied to the upper surface of the wafer in advance to coat a protective film, and a laser beam is applied to the wafer through this protective film. A processing method of irradiation has also been used (see, for example, Patent Document 2 and Patent Document 3).

JP 2006-032419 A JP 2006196664 A1 JP 2004-322168 A

  However, in a coating apparatus that applies a protective film described in Patent Document 3 to an actual wafer, a large amount of liquid adheres to the inside of the housing of the apparatus due to the scattering of the water-soluble resin liquid that immediately forms the protective film. To do. The adhering liquid may flow and flow out smoothly and be discharged from the discharge port. However, particularly when there is relatively quick drying, it solidifies after adhering and is not easy to clean. For example, removal work may be carried out so that it is actually scraped off with a metal spatula. In this case, it takes a lot of man-hours and labor, and the generated dust remains in the equipment when processing is resumed, and the wafer being processed is removed. There is a problem that if it adheres to the surface, it becomes a material that causes harmful effects on the device.

  This invention is made | formed in view of the above, Comprising: It aims at providing the protective film coating apparatus which makes it possible to remove easily the water-soluble resin which comprises a protective film from the inside of a housing | casing.

  In order to solve the above-described problems and achieve the object, the protective film coating apparatus of the present invention is a protective film coating apparatus that coats a protective film on the upper surface of a wafer attached to an opening of an annular frame via an adhesive tape. A rotatable spinner table for sucking and holding the wafer via the adhesive tape, and a protective film coating means for applying a liquid as the protective film on the upper surface of the wafer sucked and held by the spinner table; And a housing for housing the spinner table and the protective film coating means, and a plurality of pressure-sensitive adhesive sheets each having an adhesive surface are peeled from each other at least partially inside the housing. An inner layer of the housing is formed when the protective film is applied to the wafer that is laid on the spinner table and rotated while being sucked and held by the spinner table. Liquid adhering to the laminated sheet to scatter, characterized in that the laminated sheet of the uppermost layer exposed to the inside of the housing can be removed from the housing by being peeled off.

  The laminated sheet has a surface opposite to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet made of a material having water absorption or hydrophilicity, and the surface on the opposite side where the liquid adhered by scattering is exposed to the inside of the casing. It is desirable to prevent peeling or flowing down from the laminated sheet.

  In the protective film coating apparatus of the present invention, since the laminated sheet formed by laminating the adhesive sheet is laid on at least a part of the inside surface of the casing, the uppermost adhesive sheet is scattered in the casing. A liquid of a water-soluble resin constituting the protective film adheres. For this reason, by peeling off the uppermost pressure-sensitive adhesive sheet, it is possible to easily remove the water-soluble resin liquid or the like constituting the protective film scattered in the housing.

  Further, the protective film coating apparatus of the present invention is constructed such that the surface opposite to the adhesive surface of the adhesive sheet of the laminated sheet that is laid and exposed inside the casing is made of a material having water absorption or hydrophilicity. It can suppress that the liquid adhering to a sheet | seat peels. Therefore, there is an effect that the liquid once adhered to the pressure-sensitive adhesive sheet is peeled off and does not re-adhere to the wafer during the application of the liquid.

FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus including a protective film forming and cleaning unit as the protective film coating apparatus according to the embodiment. FIG. 2 is a perspective view of a wafer covered with a protective film by the protective film forming and cleaning means according to the embodiment. FIG. 3 is a cross-sectional view of the pressure-sensitive adhesive sheet constituting the laminated sheet of the protective film forming and cleaning means according to the embodiment. FIG. 4 is a diagram illustrating a configuration example of the protective film forming / cleaning unit according to the embodiment. FIG. 5 is a diagram illustrating a state in which the liquid film is dropped on the upper surface of the wafer by the protective film forming and cleaning unit according to the embodiment. FIG. 6 is a diagram illustrating a state in which the protective film forming and cleaning unit according to the embodiment is rotating a wafer having a liquid resin dropped on the upper surface. FIG. 7 is a view showing a state in which the wafer whose upper surface is covered with the protective film is removed from the protective film forming and cleaning means according to the embodiment. FIG. 8 is a diagram illustrating a state in which the uppermost adhesive sheet or the like of the laminated sheet is peeled from the inner surface of the casing of the protective film forming / cleaning unit according to the embodiment. FIG. 9 is a plan view showing a state in which the uppermost adhesive sheet or the like of the laminated sheet is peeled from the inner surface of the casing of the protective film forming and cleaning unit according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus including a protective film forming and cleaning unit as the protective film coating apparatus according to the embodiment. FIG. 2 is a perspective view of a wafer covered with a protective film by the protective film forming and cleaning means according to the embodiment. FIG. 3 is a cross-sectional view of the pressure-sensitive adhesive sheet constituting the laminated sheet of the protective film forming and cleaning means according to the embodiment. FIG. 4 is a diagram illustrating a configuration example of the protective film forming / cleaning unit according to the embodiment. FIG. 5 is a diagram illustrating a state in which the liquid film is dropped on the upper surface of the wafer by the protective film forming and cleaning unit according to the embodiment. FIG. 6 is a diagram illustrating a state in which the protective film forming and cleaning unit according to the embodiment is rotating a wafer having a liquid resin dropped on the upper surface. FIG. 7 is a view showing a state in which the wafer whose upper surface is covered with the protective film is removed from the protective film forming and cleaning means according to the embodiment. FIG. 8 is a diagram illustrating a state in which the uppermost adhesive sheet or the like of the laminated sheet is peeled from the inner surface of the casing of the protective film forming / cleaning unit according to the embodiment. FIG. 9 is a plan view showing a state in which the uppermost adhesive sheet or the like of the laminated sheet is peeled from the inner surface of the casing of the protective film forming and cleaning unit according to the embodiment.

  The protective film forming and cleaning means 70 as the protective film coating apparatus according to the present embodiment is provided with a protective film P (shown in FIG. 7) on the upper surface WS of the wafer W attached to the opening of the annular frame F via the adhesive tape T. ). The protective film forming / cleaning means 70 constitutes, for example, the laser processing apparatus 1.

  The laser processing apparatus 1 once coats the wafer W with the protective film P, and then relatively moves the chuck table 10 holding the wafer W coated with the protective film P and the laser beam irradiation means 20 to move the wafer W. A laser processing groove is formed on the wafer W by ablation processing.

  As shown in FIG. 1, the laser processing apparatus 1 includes a chuck table 10, a laser beam irradiation means 20, an imaging means 40, and a wafer W before laser processing coated with a protective film P and from the wafer W after laser processing. The protective film forming and cleaning means 70 for removing the protective film P and a control means (not shown) are included. The laser processing apparatus 1 further includes a cassette elevator 50 that accommodates the wafer W before and after laser processing, and temporary placement means 60 that temporarily places the wafer W before and after laser processing. . Further, the laser processing apparatus 1 relatively moves the chuck table 10 and the laser beam irradiation means 20 in the Y-axis direction, and the X-axis movement means (not shown) that relatively moves the chuck table 10 and the laser beam irradiation means 20 in the X-axis direction. A Y-axis moving means (not shown) and a Z-axis moving means (not shown) for relatively moving the chuck table 10 and the laser beam irradiation means 20 in the Z-axis direction are configured.

  The cassette elevator 50 accommodates a plurality of wafers W attached to the annular frame F via the adhesive tape T. The cassette elevator 50 is provided in the apparatus main body 2 of the laser processing apparatus 1 so as to be movable up and down in the Z-axis direction.

  The temporary placing means 60 takes out one wafer W before laser processing from the cassette elevator 50 and accommodates the wafer W after laser processing in the cassette elevator 50. Temporary placement means 60 temporarily loads wafer W before laser processing from cassette elevator 50 and carries in / out means 61 for inserting wafer W after laser processing into cassette elevator 50, and wafer W before and after laser processing. And a pair of rails 62 to be placed.

  The wafer W before laser processing is covered with the protective film P by the protective film forming / cleaning means 70 and placed on the chuck table 10 by the second transport means 82. Further, the wafer W after laser processing is placed on the pair of rails 62 of the temporary placing means 60 by the first conveying means 81 after the protective film P is removed by the protective film forming and cleaning means 70.

  The chuck table 10 holds the wafer W on which the wafer W on which the protective film P before laser processing is formed is placed by the second transport means 82 from the protective film forming and cleaning means 70. The chuck table 10 has a disk shape in which a portion constituting the surface is made of porous ceramic or the like, and is connected to a vacuum suction source (not shown) through a vacuum suction path (not shown) to suck the wafer W placed on the surface. Hold by. The chuck table 10 can be attached to and detached from a table moving base (not shown) provided in the apparatus main body 2 of the laser processing apparatus 1. The table moving base is movably provided in the X-axis direction by the X-axis moving means and is movably provided in the Y-axis direction by the Y-axis moving means, and a center axis ( (It is parallel to the Z-axis). Further, a clamp part 11 is provided around the chuck table 10, and the clamp part 11 is driven by an air actuator (not shown) so that the annular frame F around the wafer W is clamped.

  The laser beam irradiation means 20 irradiates the upper surface WS of the wafer W held on the chuck table 10 with a laser beam and forms a laser processing groove by ablation processing. The laser beam irradiation means 20 is provided so as to be movable in the Z-axis direction with respect to the wafer W held on the chuck table 10 by the Z-axis movement means. The laser beam irradiation means 20 includes a laser beam oscillation means (not shown) and a condenser (not shown) that irradiates the upper surface WS of the wafer W with the laser beam oscillated by the laser beam oscillation means. The laser beam oscillation means can be appropriately selected according to the type of wafer W, the processing form, etc. For example, a YAG laser oscillator, a YVO laser oscillator, or the like can be used. The condenser includes a total reflection mirror that changes the traveling direction of the laser beam oscillated by the laser beam oscillation means, a condenser lens that collects the laser beam, and the like.

  The imaging means 40 images the upper surface WS of the wafer W held on the chuck table 10. The imaging means 40 is provided so as to be movable in the Z-axis direction integrally with the laser beam irradiation means 20 with respect to the wafer W held on the chuck table 10 by the Z-axis moving means. The imaging means 40 includes a CCD camera (not shown). The CCD camera is an apparatus that captures an image of the wafer W held on the chuck table 10 and obtains an image. The imaging means 40 outputs information on the image obtained by the CCD camera to the control means.

  The protective film forming / cleaning means 70 is such that the wafer W before laser processing on the pair of rails 62 is transported by the first transport means 81 and the wafer W before laser processing is coated with the protective film P. is there. Further, the protective film forming / cleaning means 70 removes the protective film P from the laser-processed wafer W after the laser-processed wafer W is transferred by the second transfer means 82. As shown in FIG. 4, the protective film forming / cleaning means 70 includes a casing 72 installed in the apparatus main body 2, a rotatable spinner table 71 that sucks and holds the wafer W via the adhesive tape T, and a spinner table. A coating nozzle 73 (protective film) that forms a protective film P by applying a liquid resin J (shown in FIGS. 5 and 6 and corresponding to the liquid) to be a protective film P on the upper surface WS of the wafer W sucked and held by 71 It corresponds to an application means), a cleaning nozzle 74 (shown in FIG. 9), and a laminated sheet 75.

  The housing 72 accommodates the spinner table 71, the application nozzle 73, and the cleaning nozzle 74. As shown in FIG. 4, the housing 72 includes a main body portion 76 and a lid 77. The main body portion 76 includes a cylindrical tube portion 76a that is open on the upper surface of the apparatus main body 2, and an annular bottom portion 76b that closes the lower end of the tube portion 76a. Further, a discharge port 84 connected to a waste liquid collecting means (not shown) for collecting the liquid resin J and the cleaning liquid is opened in the bottom 76b. The lid 77 is formed in a disk shape capable of closing the opening of the cylinder portion 76a, and is opened and closed in the Z-axis direction by the lid opening / closing means 85, thereby opening and closing the inside of the cylinder portion 76a, that is, the inside of the casing 72.

  The wafer W is placed on the spinner table 71 via the adhesive tape T by the first transport unit 81 or the second transport unit 82. The spinner table 71 has a disk shape in which a portion constituting the surface is made of porous ceramic or the like, and is connected to a vacuum suction source (not shown) through a vacuum suction path (not shown) to suck the wafer W placed on the surface. Hold by. In addition, the spinner table 71 is provided so as to be movable up and down in the Z-axis direction by a plurality of lifting cylinders 86 and is rotatably provided around a central axis (parallel to the Z-axis) by a rotation motor 87. Further, a clamp part 88 is provided around the spinner table 71, and the clamp part 88 is driven by an air actuator (not shown) so that the annular frame F around the wafer W is clamped.

  The application nozzle 73 drops a liquid resin J containing a water-soluble resin such as PVA, PEG or PEO (polyethylene oxide) onto the upper surface WS of the wafer W held by the spinner table 71 before laser processing. is there. The application nozzle 73 is swingably provided by a motor (not shown), and moves between a position facing the spinner table 71 and a position retracting from the spinner table 71. The cleaning nozzle 74 removes the protective film P by dropping a cleaning liquid toward the upper surface WS of the wafer W after laser processing held by the spinner table 71. In addition, the liquid resin J mentioned above which comprises the protective film P and the protective film P is transparent or translucent, and permeate | transmits light.

  The laminated sheet 75 adheres to the liquid resin J scattered on the inside of the housing 72, and the liquid resin J attached by the scattering peels off or flows down by the opposite surface 78b described later exposed on the inside of the housing 72. It is something to prevent. As shown in FIG. 4, the laminated sheet 75 is laid on at least a part of the inside of the housing 72. In the present embodiment, the laminated sheet 75 includes the entire circumference of the inner surface of the cylindrical portion 76a of the body portion 76 of the housing 72, the substantially entire surface excluding the discharge port 84 on the upper surface of the bottom portion 76b, and the substantially entire lower surface of the lid 77. Is provided. The laminated sheet 75 is formed by laminating a plurality of adhesive sheets 78 (shown in FIG. 3) each having an adhesive surface 78a on one side (shown in FIG. 3). The adhesive surface 78a of the adhesive sheet 78 is made of an adhesive resin or the like.

  In the present embodiment, as shown in FIG. 3, the laminated sheet 75 is made of a material in which the pressure-sensitive adhesive sheet 78 and the surface 78 b opposite to the pressure-sensitive adhesive surface 78 a of the pressure-sensitive adhesive sheet 78 have water absorption or hydrophilicity. Has been. Further, the opposite surface 78b is made of a material from which the adhesive surface 78a can be peeled. The laminated sheet 75 has the opposite surface 78b positioned on the inner side of the housing 72 with respect to the adhesive surface 78a, and the adhesive surface 78a is further attached to the opposite surface 78b of the outer laminated sheet 75, so that the A plurality of adhesive sheets 78 are laminated inside 72 so as to be peeled from each other. That is, in the innermost (uppermost layer) pressure-sensitive adhesive sheet 78 of the casing 72 of the laminated sheet 75, the opposite surface 78 b is exposed inside the casing 72.

  The laminated sheet 75 is appropriately provided with a breakable break 75a. The cut 75a is configured by arranging through holes penetrating the laminated sheet 75 on a straight line. In the present embodiment, in the laminated sheet 75 provided on the upper surface of the bottom portion 76b, two linear cuts 75a are provided so as to pass through the center of the bottom portion 76b, and the laminated sheet provided on the inner surface of the cylindrical portion 76a. In 75, two are provided. In addition, the cut 75a of the lamination sheet 75 provided in the upper surface of the bottom part 76b and the cut 75a of the lamination sheet 75 provided in the inner surface of the cylinder part 76a are provided on the same straight line.

  In the present embodiment, the laminated sheet 75 is attached to the housing 72 by reinforcing the adhesive force of the adhesive surface 78a by being sandwiched by the fixing clip 89 indicated by a dotted line in FIG. Yes. In addition, the cut end 75a of the laminated sheet 75 is fixed so as not to peel off. In FIG. 4, only the fixing clip 89 for attaching the laminated sheet 75 to the cylindrical portion 76a is shown, and the others are omitted.

  Here, the wafer W is a processing target to be laser processed by the laser processing apparatus 1, and in this embodiment, is a disk-shaped semiconductor wafer or optical device wafer having a base material of silicon, sapphire, gallium or the like. In the wafer W, as shown in FIG. 2, a plurality of devices D formed on the upper surface WS are partitioned in a lattice pattern by a plurality of streets W1 and W2. As shown in FIG. 2, the wafer W has a back surface on the opposite side of the upper surface WS on which a plurality of devices D are formed attached to the adhesive tape T, and the annular frame F is attached to the adhesive tape T attached to the wafer W. By being affixed, it is fixed to the annular frame F. On the upper surface WS of the wafer W, a so-called low-k film (not shown) made of a low-k material (mainly a porous material) is formed as an interlayer insulating film material. The adhesive tape T is transparent or translucent and transmits light.

  The control means controls the above-described components constituting the laser processing apparatus 1 and the protective film forming / cleaning means 70, respectively. The control means causes the laser processing apparatus 1 to perform a processing operation on the wafer W. In addition, when the laser processing apparatus 1 performs the processing operation on the wafer W, the control unit coats the protective film P on the upper surface WS of the wafer W before laser processing on the protective film forming and cleaning unit 70 and after the laser processing. The protective film P is removed from the upper surface WS of the wafer W. The control means is mainly composed of an arithmetic processing unit constituted by, for example, a CPU or the like and a microprocessor (not shown) provided with a ROM, a RAM, etc. It is connected to an operating means (not shown) used when registering content information and the like.

  Next, a laser processing method for the wafer W using the laser processing apparatus 1 according to the present embodiment and a method for forming the protective film P for the wafer W using the protective film forming and cleaning means 70 will be described. First, the adhesive tape T is attached to the back surface of the wafer W on which the plurality of devices D are formed on the upper surface WS, and the annular frame F is attached to the adhesive tape T. Then, the wafer W adhered to the annular frame F via the adhesive tape T is accommodated in the cassette elevator 50.

  Then, when the operator registers the processing content information in the control means and the operator gives an instruction to start the processing operation, the laser processing apparatus 1 starts the processing operation. In the processing operation, the control means unloads the wafer W before laser processing from the cassette elevator 50 to the temporary placement means 60 by the carry-in / out means 61 and places the wafer W on the pair of rails 62 of the temporary placement means 60. Is transported to the spinner table 71 of the protective film forming and cleaning means 70 and held on the spinner table 71.

  Then, the control means lowers the spinner table 71, lowers the lid 77 to close the inside of the casing 72 and swings the application nozzle 73, and then the liquid resin J is applied from the application nozzle 73 as shown in FIG. It is dropped on the upper surface WS of the wafer W held on the spinner table 71. Thereafter, as shown in FIG. 6, the control means swings the application nozzle 73 and retracts it from the spinner table 71, and then rotates the spinner table 71 around the central axis. Then, the liquid resin J moves to the outer peripheral side of the upper surface WS of the wafer W by centrifugal force, and the liquid resin J is applied to the entire upper surface WS of the wafer W as shown in FIG.

  Then, the liquid resin J scattered from the outer edge of the wafer W to the inside of the housing 72 adheres to the laminated sheet 75 and soaks into the surface 78b on the opposite side of the adhesive sheet 78 and is collected by the waste liquid collecting means through the discharge port 84. The Since the opposite surface 78b is made of a water-absorbing or hydrophilic material, the liquid resin J once infiltrated into the opposite surface 78b is prevented from peeling off or flowing down from the laminated sheet 78. The Then, the liquid resin J adhering to the upper surface WS of the wafer W is cured, so that the upper surface WS of the wafer W is covered with the protective film P made of the liquid resin J. When the covering of the protective film P is completed, the control means raises the lid 77 to the lid opening / closing means 85 and raises the spinner table 71 as shown in FIG. Then, the control means causes the second conveyance means 82 to convey the wafer W coated with the protective film P from the spinner table 71 to the chuck table 10 and hold it on the chuck table 10.

  Next, the control means causes the imaging means 40 to image the wafer W held on the chuck table 10 so as to align the plurality of streets W1, W2 of the wafer W with the condenser of the laser beam irradiation means 20. The image processing such as pattern matching is executed, and the alignment of the laser beam irradiation means 20 is performed.

  Next, the control means moves the chuck table 10 by the X-axis movement means and the Y-axis movement means based on the alignment information and the like, rotates the chuck table 10 around the central axis by the base drive source, and moves the Z-axis. The laser beam irradiation means 20 is moved by the means, and one end of the predetermined streets W1 and W2 is positioned immediately below the condenser. Then, the control means irradiates the chuck table 10 holding the wafer W while irradiating the laser beam from the condenser of the laser beam irradiating means 20 to the predetermined streets W1 and W2 with respect to the laser beam irradiating means 20 by the X-axis moving means. And is moved at a predetermined processing speed.

  Then, on the predetermined streets W1 and W2 irradiated with the laser beam, a part of the wafer W and the protective film P is sublimated to form a laser processing groove. When the other ends of the predetermined streets W1 and W2 reach just below the condenser, the irradiation of the laser beam from the laser beam irradiation means 20 is stopped and the movement of the chuck table 10 by the X-axis movement means is stopped. As described above, the control means irradiates the streets W1 and W2 with laser beams in order, forms laser processing grooves on these streets W1 and W2, and forms laser processing grooves on all the streets W1 and W2 of the wafer W. Form.

  When the laser processing grooves are formed in all the streets W1, W2, the control means moves the chuck table 10 to the vicinity of the protective film forming and cleaning means 70 by the X-axis moving means, and the second conveying means 82 holds the chuck. The wafer W subjected to laser processing on the table 10 is placed on the spinner table 71 of the protective film forming and cleaning means 70 and held on the spinner table 71. Then, the control means lowers the spinner table 71, lowers the lid 77 to close the inside of the housing 72, swings the cleaning nozzle 74, and then rotates the cleaning nozzle 74 while rotating the spinner table 71 around the central axis. Then, the cleaning liquid is dropped onto the wafer W on the spinner table 71. Then, since the protective film P is composed of a water-soluble resin, the protective film P is removed (washed away) from the upper surface WS of the wafer W together with the debris attached during the laser processing by the cleaning liquid and the centrifugal force. At this time, when the upper surface WS of the wafer W sucked and held on the spinner table 71 is applied from the application nozzle 73, the liquid resin J scattered on the inside of the housing 72 and attached to the laminated sheet 75 is absorbed by water or It remains attached to the opposite surface 78b of the adhesive sheet 78 having hydrophilicity. And it is prevented that liquid resin J adhering to the lamination sheet 75 by scattering peels or flows down from the lamination sheet 75 by the surface 78b on the opposite side.

  When the removal of the protective film P is completed, the control means stops the rotation around the central axis of the spinner table 71 and the dripping of the cleaning liquid from the cleaning nozzle 74, and then raises the spinner table 71 to provide the first transport means. 81 to the temporary placement means 60. The control means carries the wafer W that has been subjected to laser processing or the like into the cassette elevator 50 from the temporary placement means 60 by the carry-in / out means 61.

  Further, in the protective film forming and cleaning means 70 of the laser processing apparatus 1 of the present embodiment, when the liquid resin J serving as the protective film P is applied to the rotating wafer W sucked and held by the spinner table 71 by the application nozzle 73. The liquid resin J scattered on the inside of the casing 72 and adhered to the laminated sheet 75 is deposited as shown in FIGS. At this time, as shown in the solid line in FIG. 4 and FIG. 8, after removing the fixing clip 89 once, as shown in FIGS. 8 and 9, the laminated sheet 75 is broken along the cut line 75 a, Of the laminated sheet 75, the uppermost laminated sheet 75b exposed inside the casing 72 is peeled off. By peeling off the uppermost laminated sheet 75 b, the liquid resin J attached and deposited on the laminated sheet 75 is removed from the casing 72. Thus, in the protective film forming / cleaning means 70, when the liquid resin J serving as the protective film P is applied by the coating nozzle 73 to the rotating wafer W sucked and held by the spinner table 71, the protective film forming and cleaning means 70 scatters inside the casing 72. Thus, the liquid resin J adhering to the laminated sheet 75 can be removed from the casing 72 by peeling off the uppermost laminated sheet 75b exposed inside the casing 72 of the laminated sheet 75.

  As described above, according to the protective film forming and cleaning means 70 according to the present embodiment, the laminated sheet 75 formed by laminating the adhesive sheet 78 on at least a part of the inner surface of the casing 72 is laid. Therefore, the water-soluble resin constituting the protective film P scattered in the casing 72 adheres to the uppermost adhesive sheet 78. For this reason, by peeling off the uppermost pressure-sensitive adhesive sheet 78, the liquid resin J or the like constituting the protective film P scattered in the housing 72 can be easily removed. Therefore, the deposited liquid resin J can be easily removed without coating the inside of the casing 72 with the fluororesin, and the increase in cost can be suppressed.

  Further, the protective film forming / cleaning means 70 is formed of a material having water absorption or hydrophilicity on the surface 78b opposite to the adhesive surface 78a of the adhesive sheet 78 of the laminated sheet 75 which is laid and exposed inside the casing 72. Therefore, the liquid resin J attached to the pressure-sensitive adhesive sheet 78 can be further prevented from peeling once compared to the case where the opposite surface 78b is made of a water-repellent material such as a wrap film. Therefore, there is an effect that the problem that the liquid resin J once attached to the pressure-sensitive adhesive sheet 78 is peeled off and is reattached to the wafer W during the application of the liquid resin J is achieved.

  In the above-described embodiment, the protective film forming and cleaning means 70 serving as the protective film coating apparatus constituting the laser processing apparatus 1 has been described. However, the present invention is not limited thereto, and the protective film coating apparatus of the present invention is not limited to laser processing. A processing apparatus that performs various types of processing on the wafer W other than the apparatus 1 may be configured. Moreover, the protective film coating apparatus of this invention may be used independently, without comprising various processing apparatuses, such as the laser processing apparatus 1. FIG. Furthermore, in the above-described embodiment, the protective film forming and cleaning means 70 as the protective film coating apparatus includes the cleaning nozzle 74 that drops the cleaning liquid and has a function of cleaning the upper surface WS of the wafer W. As long as the protective film coating apparatus of the present invention is provided with protective film coating means such as the coating nozzle 73, it is not necessary to include means for realizing other functions such as the cleaning nozzle 74. The protective film coating apparatus of the present invention is not limited to the coating nozzle 73 and may include various types of protective film coating means.

  In the above-described embodiment, the laminated sheet 75 is provided on the inner surface of the cylindrical portion 76a, the upper surface of the bottom portion 76b, and the lower surface of the lid 77. However, in the present invention, the laminated sheet 75 is provided on at least a part of the inside of the casing 72. It only has to be provided.

  In the embodiment described above, the laminated sheet 75 is attached to the housing 72 by the fixing clip 89, but the present invention is not limited to this. For example, the lowermost adhesive sheet 78 may be attached to the casing 72 and the laminated sheet 75 may be attached to the casing 72.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

70 Protective film forming and cleaning means 71 Spinner table 72 Case 73 Application nozzle (Protective film application means)
75 Laminated sheet 78 Adhesive sheet 78a Adhesive surface 78b Opposite surface F Annular frame J Liquid resin (liquid)
P Protective film T Adhesive tape W Wafer WS Top surface

Claims (2)

A protective film coating apparatus for coating a protective film on the upper surface of a wafer attached to an opening of an annular frame via an adhesive tape,
A rotatable spinner table for sucking and holding the wafer via the adhesive tape, a protective film coating means for applying a liquid as the protective film on the upper surface of the wafer sucked and held by the spinner table, and the spinner table And a housing that accommodates the protective film application means,
At least a part of the inside of the housing is laid with a laminated sheet in which a plurality of adhesive sheets each having an adhesive surface are detachably laminated,
When applying a liquid as the protective film by the protective film application means to the wafer that is sucked and held by the spinner table and rotating, the liquid scattered to the inside of the housing and attached to the laminated sheet is A protective film coating apparatus, wherein the uppermost laminated sheet exposed inside the casing can be removed from the casing by peeling.   The laminated sheet has a surface opposite to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet made of a material having water absorption or hydrophilicity, and the surface on the opposite side where the liquid adhered by scattering is exposed to the inside of the casing. 2. The protective film coating apparatus according to claim 1, wherein the protective film coating apparatus prevents peeling or falling off from the laminated sheet.

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